JP2013197218A - Electronic component manufacturing method and electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component manufacturing method which excels in workability when pasted to a body and an electronic component.SOLUTION: The electronic component manufacturing method includes in the order mentioned: an adhesive layer lamination step in which an adhesive layer fitted with a heat resistant separator is laminated on a second metal layer in a wiring board material having a first metal layer for circuit formation, an insulation layer and the second metal layer laminated thereon in that order, or a wiring board having a metal circuit layer with a circuit formed from the first metal layer, an insulation layer and the second metal layer laminated thereon in that order; a step in which, if the wiring board material was used in the adhesive layer lamination step, a circuit is formed from the first metal layer for circuit formation to fabricate a metal circuit layer after the adhesive layer lamination step and thereby turns the wiring board material into a wiring board; a semiconductor component mounting step in which semiconductor components are mounted in place on the metal circuit layer; and a pasting step in which the heat resistant separator is separated from the adhesive layer at a boundary therewith and a body is pasted onto the adhesive layer.

Description

  The present invention relates to an electronic component manufacturing method and an electronic component.

  A wiring board on which an LED (light emitting diode) is mounted as a light emitting element is widely used in applications such as a backlight of a liquid crystal display. Since such a wiring board is required to efficiently release the heat generated by the LED to the outside, a metal plate such as aluminum or copper is provided on the surface opposite to the circuit layer (hereinafter also referred to as “back surface”). A so-called metal base wiring board arranged on one side is often used. Usually, in order to conduct and remove heat without delay, the metal base wiring board is affixed to a casing made of metal or the like via a double-sided adhesive tape.

  The metal plate used for the metal base wiring board is relatively expensive as a member of the wiring board. When the thickness of the metal plate is increased, the material cost increases, and there are problems such as an increase in weight and an increase in thermal resistance. It tends to increase. Therefore, it is preferable to use a thin metal plate in terms of weight reduction, thermal resistance reduction, and cost reduction. However, if the metal plate is thin, it becomes too flexible, so that the workability during circuit processing and assembly tends to deteriorate. For this reason, the use of a metal plate of 300 μm or less is hardly performed.

  In such a thin wiring board, a resist, a protective film, etc. may be installed to protect the metal foil on the back side during circuit processing. However, when these are peeled after circuit processing, the wiring board is deformed. There were problems such as. In order to prevent such deformation, a support such as a stiffener or a backing material may be attached, which has been a cause of cost increase.

  Further, the metal base wiring board is attached to the housing via a double-sided adhesive tape or the like after component mounting. However, since the component is mounted on the surface of the substrate on which the component is mounted, there is a possibility that the component will be destroyed if the component is strongly pressed. Therefore, when a metal base wiring board is affixed to a housing, a portion where no parts are arranged is lightly pressed and affixed, and it is difficult to obtain sufficient adhesion. Also, poor adhesion increases thermal resistance. Here, in order to maintain adhesiveness, a method using a thick double-sided pressure-sensitive adhesive tape can be considered, but this tends to deteriorate the thermal resistance.

In relation to the above, a technique for disposing a pressure-sensitive adhesive layer and a metal foil separator in which a metal foil or a polymer material is laminated on the side opposite to the wiring board in the metal base wiring board is disclosed. It is said that it is excellent in washing | cleaning resistance (for example, refer patent document 1).
Similarly, a technique using paper coated with a vinylidene chloride copolymer film as a separator (see, for example, Patent Document 2) and a technique using a composite material made of ceramics and paper (see, for example, Patent Document 3) are disclosed. It is said to be excellent in reflow resistance, cleaning resistance, and punchability.
Furthermore, a technique using glass or ceramics as a separator is disclosed, and is excellent in heat resistance and etching resistance (see, for example, Patent Document 4).

JP-A-8-64919 JP-A-8-222818 Japanese Patent No. 4480814 Japanese Patent No. 4178869

However, in the techniques described in Patent Documents 1 to 4, there are cases where the workability at the time of attaching to the housing is not sufficient.
This invention is made | formed in view of the above, and makes it a subject to provide the manufacturing method of an electronic component excellent in workability | operativity at the time of affixing on a housing | casing, and an electronic component.

The present invention is as follows.
<1> A pressure-sensitive adhesive layer with a heat-resistant separator is laminated on the second metal layer in the wiring board material in which the first metal layer for circuit formation, the insulating layer, and the second metal layer are laminated in this order. Or the pressure-sensitive adhesive layer laminating step of laminating the heat-resistant separator after laminating the pressure-sensitive adhesive layer,
After the pressure-sensitive adhesive layer laminating step, forming a circuit from the first metal layer for forming the circuit to produce a metal circuit layer, and using the wiring board material as a wiring board;
A semiconductor component mounting step of mounting a semiconductor component on the metal circuit layer;
An affixing step of peeling the heat-resistant separator and affixing a housing on the adhesive layer;
Of electronic parts including

<2> After laminating the pressure-sensitive adhesive layer with a heat-resistant separator on the second metal layer in the wiring board in which the metal circuit, the insulating layer, and the second metal layer are laminated in this order, or after laminating the pressure-sensitive adhesive layer A pressure-sensitive adhesive layer laminating step for laminating a heat-resistant separator;
A semiconductor component mounting step of mounting a semiconductor component on the metal circuit layer;
An affixing step of peeling the heat-resistant separator and affixing a housing on the adhesive layer;
Of electronic parts including

<3> In the affixing step, the adhesive layer attached to the wiring board and the casing are opposed to each other, and one end in the longitudinal direction of the wiring board is attached to the casing. The other end is separated from the casing, and while the other end is gradually approaching the casing, pressure is applied from the one end toward the other end, and the adhesive layer and the casing are The method for producing an electronic component according to <1> or <2> to be attached.

<4> The method for manufacturing an electronic component according to any one of <1> to <3>, wherein the heat resistant separator further includes a heat resistant resin layer.

<5> The method for manufacturing an electronic component according to any one of <1> to <4>, wherein the heat-resistant separator includes paper as a base material.

<6> The method for producing an electronic component according to any one of <1> to <4>, wherein the heat-resistant separator has at least one metal foil selected from an aluminum foil and a copper foil as a base material. .

<7> The method for manufacturing an electronic component according to any one of <1> to <6>, wherein an average thickness of the wiring board is 50 μm or more and 500 μm or less.

<8> An electronic component manufactured using the method for manufacturing an electronic component according to any one of <1> to <7>.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of an electronic component excellent in workability | operativity at the time of affixing on a housing | casing, and an electronic component can be provided.

It is an example of a sectional view of wiring board material. It is an example of a sectional view of a wiring board. It is an example of a sectional view of a circuit board. It is an example of the process of the manufacturing method of the electronic component of this invention. It is a figure explaining a mode that the adhesive layer with a heat resistant separator in this invention is laminated | stacked. (A) Wiring board material laminated body, (B) Component mounting wiring board laminated body, (C) It is an example of sectional drawing of an electronic component. It is an example of a top view of a wiring board material laminated body. It is an example of a sectional view of a wiring board material laminate. It is an example of a sectional view of a wiring board laminated body. It is an example of a sectional view of a component mounting wiring board laminate. It is an example of a sectional view of electronic parts. It is a figure explaining the mode of lamination of the conventional adhesive layer.

In this specification, the term “process” is not limited to an independent process, and is included in the term if the intended action of the process is achieved even when it cannot be clearly distinguished from other processes. .
In the present specification, numerical ranges indicated using “to” indicate ranges including the numerical values described before and after “to” as the minimum value and the maximum value, respectively.

  In addition, as shown in FIG. 1, the wiring board material 30 in the present invention is a laminate in which a first metal layer 10 for circuit formation, an insulating layer 12, and a second metal layer 14 are laminated in this order. Say. Moreover, the wiring board 31 means the laminated body by which the metal circuit layer 11, the insulating layer 12, and the 2nd metal layer 14 were laminated | stacked in this order, as shown in FIG. The metal circuit layer 11 is obtained by forming a circuit from the first metal layer 10. Furthermore, the circuit board 32 refers to a laminated body in which the semiconductor component 40, the metal circuit layer 11, the insulating layer 12, and the second metal layer 14 are laminated in this order, as shown in FIG.

<Method for manufacturing electronic parts>
In the method of manufacturing an electronic component according to the present invention, a circuit is formed from a wiring board material in which a first metal layer for circuit formation, an insulating layer, and a second metal layer are laminated in this order, or the first metal layer. After laminating the pressure-sensitive adhesive layer with a heat-resistant separator on the second metal layer in the wiring board in which the metal circuit layer, the insulating layer, and the second metal layer are laminated in this order, or after laminating the pressure-sensitive adhesive layer When a wiring board material is used in the pressure-sensitive adhesive layer laminating step for laminating the heat-resistant separator and the pressure-sensitive adhesive layer laminating step, the first metal for circuit formation is formed after the pressure-sensitive adhesive layer laminating step. Forming a circuit from a layer to produce a metal circuit layer and using the wiring board material as a wiring board; mounting a semiconductor component on the metal circuit layer; and mounting the heat-resistant separator to the adhesive The adhesive layer peels off at the interface with the layer Including, a bonding step for affixing the housing in this order. An example of this series of manufacturing steps is shown in FIG.
The pressure-sensitive adhesive layer with a heat-resistant separator refers to a layer in which a pressure-sensitive adhesive layer is previously laminated on a heat-resistant separator, and the heat-resistant separator in this case is also referred to as a substrate. In this invention, even if it uses an adhesive layer with a heat resistant separator, you may prepare and use a heat resistant separator and an adhesive layer separately.

  In the method for manufacturing an electronic component of the present invention, the adhesive layer 18 with a heat-resistant separator is laminated on the wiring board material 30 or the wiring board 31 before the semiconductor component is mounted, or the wiring board material 30 or the wiring board 31 has an adhesive. After the layer 16 is laminated, the heat-resistant separator 22 is laminated. Therefore, the adhesive layer 16 can be laminated on the flat wiring board material 30 or the wiring board 31 before mounting the semiconductor component. As a result, when the adhesive layer 16 is laminated, (1) deformation of the wiring board material 30 or the wiring board 31 can be suppressed, and (2) a device such as a laminator can be used. When an apparatus such as a laminator is used, the pressure-sensitive adhesive layer 16 can be applied while being sufficiently pressurized, so that bubbles are formed between the second metal layer 14 and the pressure-sensitive adhesive layer 16 in the wiring board material 30 or the wiring board 31. Entrainment is suppressed. In addition, since the pressure-sensitive adhesive layer 18 and the wiring board 31 are sufficiently fixed, it is possible to prevent the mutual lamination positions from being shifted. Further, it is not necessary to stack the layers while carefully aligning them manually, etc., and workability is improved.

  As described above, in the electronic component manufacturing method of the present invention, the adhesive layer 16 is provided on the wiring board material 30 or the wiring board 31 prior to the mounting of the semiconductor component 40, so It is possible to manufacture an electronic component that is excellent in the adhesion between the second metal layer 14 and the pressure-sensitive adhesive layer 16 and that is excellent in thermal conductivity between the wiring board 31 (and the circuit board 32) and the housing 70 with good workability.

Furthermore, since the heat-resistant separator 22 is used in the method for manufacturing an electronic component of the present invention, the handleability of the wiring board material 30 or the wiring board 31 is excellent. In the present invention, since the heat-resistant separator 22 has heat resistance, deformation of the wiring board 31 when the semiconductor component 40 is mounted on the metal circuit layer 11 by heating such as reflow treatment can be suppressed.
Moreover, the wiring board 31 which is excellent in thermal conductivity can be comprised because the wiring board material 30 or the wiring board 31 has the 2nd metal layer 14. FIG. Further, since the second metal layer 14 is covered with the heat-resistant separator 22, the second metal layer 14 is suppressed from being oxidized when the semiconductor component 40 is mounted on the wiring board 31. It can suppress that property falls.

  Hereinafter, the manufacturing method of the electronic component of the present invention will be compared with the conventional manufacturing method with reference to the drawings.

First, a conventional method for manufacturing an electronic component will be described with reference to FIG.
In the conventional electronic component manufacturing method, as shown in FIG. 12A, first, a circuit board 32 having a semiconductor component 40 mounted on a wiring board 31 is prepared. Although not shown, the wiring board 31 has a metal circuit layer, an insulating layer, and a second metal layer stacked in this order from the side where the semiconductor component 40 is provided. Since the semiconductor component 40 is mounted on the circuit board 32, the semiconductor component 40 is protruded and installed.
Then, as shown in FIG. 12B, the circuit board 32 is disposed on the base 50 with the semiconductor component 40 side facing downward and the second metal layer side of the wiring board 31 facing upward, and then FIG. As shown to C), the adhesive layer 19 with a separator is laminated | stacked on a 2nd metal layer. As for the adhesive layer 19 with a separator, the adhesive layer 16 and the separator 23 are laminated | stacked.

  Since the pressure-sensitive adhesive layer 19 with a separator is laminated according to the above procedure, as shown in FIG. 12D, when the second metal layer is a metal foil, the pressure-sensitive adhesive layer 19 with a separator is laminated. In some cases, the wiring board 31 may be deformed by the above stress (stress due to the finger 60 in FIG. 12D). Moreover, the connection part of the semiconductor component 40 or the semiconductor component 40 and the wiring board 31 may be damaged by the stress for laminating | stacking the adhesive layer 19 with a separator.

  Therefore, in the conventional method, the pressure-sensitive adhesive layer 19 with a separator may be laminated by a low stress, and the pressure-sensitive adhesive layer 16 may not be partially adhered. Since the heat of the semiconductor component 40 is released to the housing via the pressure-sensitive adhesive layer 16, if the contact area of the pressure-sensitive adhesive layer 16 with respect to the second metal layer is reduced, the heat dissipation is also reduced. That is, due to poor adhesion between the pressure-sensitive adhesive layer 16 and the circuit board 32, the heat dissipation may be reduced. Moreover, since it is necessary to laminate | stack carefully, adjusting a press finely with the finger | toe 60 etc., workability | operativity falls.

  Further, since the pressure-sensitive adhesive layer 19 with a separator is laminated with a low stress and further manually laminated with a finger 60 or the like, the pressure-sensitive adhesive layer 16 may be laminated in a state where air bubbles are involved. In some cases, the heat radiation performance may be further reduced due to the formation of the layer. On the other hand, if the lamination is carefully performed so as not to entrain air bubbles in the pressure-sensitive adhesive layer 16, the speed of the lamination may be reduced, and workability may be reduced.

In addition, since the adhesive layer 19 with a separator is aligned and stacked on the circuit board 32 by hand 80, the adhesive layer 19 with a separator is shifted from the circuit board 32 and stacked as shown in FIG. was there. FIG. 12E is a plan view of the component-mounted wiring board laminate in which the heat-resistant separator-attached adhesive layer 19 is provided on the circuit board 32 when observed from the separator 23 side. When the components are mounted so as to be shifted as in the component-mounted wiring board laminate of FIG. 12E, the contact area of the adhesive layer 16 with the circuit board 32 is reduced, and the heat dissipation is also reduced. That is, the heat dissipation is reduced due to the positional deviation between the adhesive layer 16 and the circuit board 32.
Note that misalignment of the pressure-sensitive adhesive layer 16 and entrainment of bubbles in the pressure-sensitive adhesive layer 16 require the removal and re-lamination of the pressure-sensitive adhesive layer 16, which may further reduce workability.

  On the other hand, in the present invention, as shown in FIG. 5A, the adhesive layer 18 with a heat-resistant separator is laminated on the wiring board material 30 or the wiring board 31 before the semiconductor component mounting step, or After the pressure-sensitive adhesive layer 16 is laminated on the wiring board material 30 or the wiring board 31, the heat-resistant separator 22 is laminated. Therefore, even if it is the wiring board material 30 or the wiring board 31 which used metal foil as a 2nd metal layer, with the stress for laminating | stacking the adhesive layer 19 with a separator, or the adhesive layer 16 and the heat resistant separator 22 The deformation of the wiring board material 30 or the wiring board 31 is suppressed.

  In addition, since the pressure-sensitive adhesive layer 18 with a heat-resistant separator, or the pressure-sensitive adhesive layer 16 and the heat-resistant separator 22 are laminated on the wiring board material 30 or the wiring board 31 before the mounting process of the semiconductor component 40, FIG. As shown in FIG. 2, the pressure-sensitive adhesive layer 18 with a heat-resistant separator, or the pressure-sensitive adhesive layer 16 and the heat-resistant separator 22 can be laminated using a laminator device such as a laminator roll. If the laminator device is used, the pressure-sensitive adhesive layer 18 with a heat-resistant separator wound around a reel or the like, or the pressure-sensitive adhesive layer 16 and the heat-resistant separator 22 can be fixed to a part of the laminator device. As a result, as shown in FIG. 5 (C), the pressure-sensitive adhesive layer 18 with a heat-resistant separator, or the positional deviation between the pressure-sensitive adhesive layer 16 and the heat-resistant separator 22 and the wiring board material 30 or the wiring board 31 (particularly in the width direction) ) Can be suppressed. 5C shows a laminate in which the pressure-sensitive adhesive layer 18 with a heat-resistant separator or the pressure-sensitive adhesive layer 16 and the heat-resistant separator 22 are provided on the wiring board material 30 or the wiring board 31 from the heat-resistant separator side 22. It is a top view when observed.

  As described above, in the conventional method, the separator-attached adhesive layer 19 or the adhesive layer 16 and the heat-resistant separator 23 are stacked on the circuit board 32 on which the semiconductor component 40 is mounted. In the present invention, the pressure-sensitive adhesive layer 18 with a heat-resistant separator, or the pressure-sensitive adhesive layer 16 and the heat-resistant separator 22 is a flat wiring board material 30 or a wiring board. Therefore, the wiring board material 30 or the wiring board 31 can be easily fixed. Therefore, the laminator device fixes the position of the wiring board material 30 or the wiring board 31 in the width direction, the position of the laminated part in the width direction, the pressure-sensitive adhesive layer 18 with a heat-resistant separator, or the pressure-sensitive adhesive layer 16 and the heat-resistant separator. Position fixing of the width direction of 22 is implement | achieved and position shift can be suppressed.

  In this way, the wiring board material 30 or the wiring board 31 in which the pressure-sensitive adhesive layer 18 with a heat-resistant separator or the pressure-sensitive adhesive layer 16 and the heat-resistant separator 22 are laminated as shown in FIG. 6A can be obtained. . When the pressure-sensitive adhesive layer 18 with a heat-resistant separator, or the pressure-sensitive adhesive layer 16 and the heat-resistant separator 22 are laminated on the wiring board material 30, a circuit is formed on the first metal layer 10 in the wiring board material 30 after that. The metal circuit layer 11 is used. Furthermore, by mounting the semiconductor component 40 on the metal circuit layer 11, a circuit board provided with the pressure-sensitive adhesive layer 18 with a heat-resistant separator, or the pressure-sensitive adhesive layer 16 and the heat-resistant separator 22, as shown in FIG. (Component mounting wiring board laminated body) can be obtained.

  Further, the heat-resistant separator 22 is peeled off from the pressure-sensitive adhesive layer 18 with a heat-resistant separator, or a circuit board (component-mounted wiring board laminate) provided with the pressure-sensitive adhesive layer 16 and the heat-resistant separator 22, and the exposed pressure-sensitive adhesive layer 16 is exposed. Is attached to the housing 70 to obtain an electronic component as shown in FIG.

FIG. 7 is a plan view of the wiring board material laminate in which the adhesive layer 16 and the heat resistant separator 22 are provided on the wiring board material 30 when observed from the heat resistant separator 22 side. When the pressure-sensitive adhesive layer 16 is laminated on the wiring board material 30 as shown in FIG. 7, since the pressure-sensitive adhesive layer 16 is then processed with the wiring board material 30, the adhesive layer 16 and the wiring board material 30 Misalignment does not occur, and problems such as deterioration of heat dissipation associated therewith do not occur. Furthermore, since the wiring board material 30 has a larger area than the wiring board 31 that has been subjected to external processing, the number of lamination steps can be reduced as compared with the lamination to the wiring board 31 that has been separated into pieces.
Below, the member used for the manufacturing method of the electronic component of this invention is demonstrated.

(Wiring board material)
As shown in FIG. 1, the wiring board material 30 includes a first metal layer 10 for circuit formation, an insulating layer 12, and a second metal layer 14 stacked in this order. Further comprising a layer.

The first metal layer 10 in the present invention is not particularly limited as long as it is made of a metal capable of forming a circuit, but is generally configured using a metal foil.
As the metal foil, a foil of copper, aluminum, iron, gold, silver, nickel, palladium, chromium, molybdenum or an alloy thereof is preferably used. Among these, copper foil is preferable.
The thickness of the first metal layer 10 is not particularly limited as long as a circuit can be formed. For example, from the viewpoint of thermal conductivity, workability, and weight reduction, the average thickness is preferably 5 μm to 500 μm, and more preferably 30 μm to 200 μm.

The surface of the metal foil in contact with the insulating layer 12 is mechanically roughened, corona discharged, sanded, plated, aluminum alcoholate, aluminum chelate, silane coupling agent, etc. Or chemical treatment may be applied.
The first metal layer 10 may be provided on the entire surface of the insulating layer 12 or may be provided only in a partial region.

The second metal layer 14 in the present invention is provided on the surface of the insulating layer 12 opposite to the surface on which the first metal layer 10 is provided (hereinafter also referred to as “back surface”). Since the wiring board material 30 includes the second metal layer 14, the wiring board 31 having excellent thermal conductivity and workability can be configured.
The second metal layer 14 is generally configured using a metal foil. As a 2nd metal foil, the thing similar to the metal foil in the 1st metal layer 10 can be mentioned, A copper foil is used suitably. From the viewpoint of workability and weight reduction, aluminum is preferably used.

  The thickness of the second metal layer 14 is not particularly limited, but the average thickness is preferably 17 μm to 2 mm from the viewpoint of rigidity, and more preferably 35 μm to 1.5 mm from the viewpoint of flowability. From a viewpoint, it is more preferable that it is 35 micrometers-1 mm. Moreover, from a viewpoint of heat conductivity, workability, and weight reduction, it is preferable that they are 50 micrometers-500 micrometers, and it is more preferable that they are 70 micrometers-200 micrometers.

On the surface of the metal foil constituting the second metal layer 14 in contact with the insulating layer 12, chemical roughening, corona discharge, sanding and plating, aluminum alcoholate, aluminum are used in order to increase the adhesive strength with the insulating layer 12. Mechanical or chemical treatment may be performed by a chelate, a silane coupling agent or the like.
The second metal layer 14 may be provided on the entire surface of the insulating layer 12 or may be provided only on a part of the region, but it is provided on the entire surface of the insulating layer 12 from the viewpoint of thermal conductivity and workability. It is preferable that

  The insulating layer 12 in the present invention is preferably composed of an insulating resin sheet. The resin constituting the insulating layer 12 is not particularly limited. Examples of the resin include high molecular weight resins such as polyimide and polyester, epoxy resins, silicone resins, acrylic resins, and mixtures thereof.

  Among the resins, at least one kind is preferably a polyimide resin or a polyimide precursor from the viewpoint of mechanical properties and electrical properties. Polyamic acid, which is a polyimide precursor, is converted to polyimide during the production process.

  In addition, as a resin composition containing the polyimide precursor, additive components such as curing components such as epoxy compounds, acrylic compounds, diisocyanate compounds, and phenol compounds, fillers, particles, coloring materials, leveling agents, and coupling agents are arbitrarily mixed. It is also possible to do.

  Examples of the filler include alumina, boron nitride, aluminum nitride, and silica. Among these, alumina is preferable.

  The content of these curing components and additive components is preferably less than the content of the polyimide resin from the viewpoint of not reducing the mechanical properties and electrical properties that are the effects of using the polyimide resin.

  The thickness of the insulating layer 12 is not particularly limited. For example, from the viewpoint of heat dissipation, the average thickness can be 3 μm to 200 μm, preferably 3 μm to 150 μm, more preferably 5 μm to 130 μm, still more preferably 9 μm to 110 μm, and more preferably 9 μm to More preferably, it is 40 μm.

  The number of stacked layers in the insulating layer 12 is not particularly limited, and may be one layer or a multilayer structure including two or more layers. For example, in a two-layer structure, the required function may be different, for example, the first layer is a layer showing a high dielectric breakdown voltage, and the second layer is a layer showing a high adhesive force.

The thickness of the wiring board material 30 is not particularly limited, but from the viewpoint of thermal conductivity and weight reduction, the average thickness is preferably 50 μm to 700 μm, more preferably 25 μm to 600 μm, and more preferably 50 μm to 500 μm. Or less, more preferably 55 μm or more and 440 μm or less, and further preferably 70 μm or more and 200 μm or less.
The average thickness of the wiring board material 30 is given as an arithmetic average value obtained by measuring five thicknesses.

  Specifically, the wiring board material 30 is a flexible substrate with a metal foil using a non-thermoplastic polyimide film such as a conventional aromatic polyimide as a polymer insulating film, and a metal such as copper is deposited or sputtered on the polyimide film. And a wiring board material using a thermoformable liquid crystal polymer. In particular, an adhesive using an epoxy resin, an acrylic resin, or the like described in Japanese Patent Application Laid-Open Nos. 2007-274329, 2007-049502, 2007-168123, etc. is not used because of excellent heat resistance. A flexible substrate or a flexible printed wiring board can be preferably used.

(Wiring board)
As shown in FIG. 2, the wiring board 31 includes a metal circuit layer 11, an insulating layer 12, and a second metal layer 14 stacked in this order, and further includes other layers as necessary. The

  The metal circuit layer 11 in the present invention can be obtained by forming a circuit from the first metal layer 10 for circuit formation. The step of forming a circuit on the first metal layer 10 can be performed by appropriately selecting from methods usually used for processing a metal layer of a wiring board material. For example, a step of forming a circuit forming resist in a desired shape on the first metal layer 10 using printing, a photoresist film, and the like, and a region where the resist of the first metal layer 10 is not formed The circuit can be formed by a method including a step of removing by etching with a corrosive liquid.

In the present invention, since the second metal layer 14 is protected by the heat-resistant separator 22, a circuit can be formed in the first metal layer 10 without the second metal layer 14 being damaged by etching. it can. In particular, by reducing the thickness of the first metal layer 10 and the second metal layer 14 (for example, 30 μm or more and 100 μm or less), a protective material is used on the outer peripheral portion of the wiring board material 30 provided with the heat resistant separator 22. This eliminates the need to perform circuit processing and makes circuit processing easier.
Since other configurations are the same as those of the wiring board material 30, the description thereof is omitted.

  The wiring board 31 preferably has a solder resist formed on the surface thereof except for a pad portion for mounting the semiconductor component 40, a wiring connector, and the like. It is preferable that the wiring board 31 is externally processed to a size for use as the circuit board 32 or a size in which several wiring boards 31 of that size are connected after circuit formation and solder resist formation. The semiconductor component 40 is mounted on the wiring board 31 having the outer shape processed, and the circuit board 32 is obtained. Further, after the semiconductor component 40 is mounted, the circuit board 32 may be processed in outline.

  In the present invention, prior to mounting the semiconductor component 40 on the wiring board 31, the pressure-sensitive adhesive layer 18 with a heat-resistant separator, or the pressure-sensitive adhesive layer 16 and the heat-resistant separator 22 are laminated on the wiring board material 30 or the wiring board 31. .

(Heat resistant separator)
In the heat-resistant separator 22, heat resistance means that the shrinkage rate after heat treatment for 1 minute in an atmosphere at 250 ° C. is 3% or less based on the length. Specifically, the shrinkage rate is calculated as follows.
A resin sheet for evaluation processed into a sheet having a length of 10 cm × 10 cm and a thickness of 20 μm to 100 μm is prepared. The length of the diagonal line is measured at 25 ° C. for the resin sheet for evaluation. Next, the length of the diagonal line was measured at 25 ° C. for the evaluation resin sheet that was heat-treated at 250 ° C. for 1 minute and then allowed to cool at room temperature. The length of the diagonal line after the heat treatment was the length of the diagonal line before the heat treatment. Divide by to calculate the shrinkage rate.

  The material of the heat-resistant separator 22 is not particularly limited, but a material having heat resistance that does not cause significant deformation or alteration in the solder reflow process is preferable. Specific examples include paper, non-woven fabric, and metal foil. Among these, paper or metal foil is preferable from the viewpoint of heat resistance, and metal foil is more preferable from the viewpoint of acid resistance, alkali resistance, and water resistance.

  More preferably, the metal foil is at least one metal foil selected from aluminum foil and copper foil.

  The thickness of the heat-resistant separator 22 is not particularly limited, but the average thickness is preferably 5 μm to 200 μm, more preferably 9 μm to 110 μm, and further preferably 17 μm to 80 μm from the viewpoints of workability and handleability. Preferably, it is 20 micrometers-60 micrometers. When the average thickness of the heat-resistant separator 22 is 5 μm or more, the handleability is excellent, and when it is 200 μm or less, the processability and the cost of the auxiliary material are excellent.

[Adhesive layer]
The pressure-sensitive adhesive layer 16 used in the present invention is not particularly limited as long as the circuit board 32 can be fixed to the housing 70, but is preferably used in the form of a double-sided pressure-sensitive adhesive tape in terms of uniform film thickness. . Such a double-sided tape may be formed only with an adhesive, or the adhesive layer 16 may be formed including a base material. From the viewpoint of low thermal resistance, the pressure-sensitive adhesive layer 16 preferably does not contain a substrate. The pressure-sensitive adhesive layer 16 includes at least one pressure-sensitive adhesive.

  An adhesive is comprised including a high molecular weight component, a tackifier, and other additives as needed, for example. Specific examples of the high molecular weight component constituting the adhesive include polyimide, polystyrene, polyethylene, polyester, polyamide, butadiene rubber, acrylic rubber, (meth) acrylic resin, urethane resin, polyphenylene ether resin, polyetherimide resin, and phenoxy resin. , Modified polyphenylene ether resin, phenoxy resin, polycarbonate, and mixtures thereof.

Among these, from the viewpoint of heat resistance, a pressure-sensitive adhesive mainly composed of a (meth) acrylic acid ester copolymer and crosslinked with a crosslinking agent is preferable.
The (meth) acrylic acid ester copolymer is composed of at least one (meth) acrylic acid ester and an unsaturated monomer copolymerizable therewith. Examples of (meth) acrylic acid esters include n-butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, ethyl (meth ) Acrylate, methyl (meth) acrylate, and the like.
Here, (meth) acrylic acid ester means methacrylic acid ester, acrylic acid ester and a mixture thereof.

  Examples of unsaturated monomers copolymerizable with (meth) acrylic acid esters include 2-ethylhexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, hydroxyethyl (meth) acrylate, and (meth) acrylic. Examples thereof include glycidyl acid, (meth) acrylic acid, acrylonitrile, and styrene.

  From the viewpoint of increasing the adhesive force, it is preferable that the pressure-sensitive adhesive layer 16 contains 70% by volume or more of (meth) acrylic acid ester copolymer, more preferably 80% by volume or more, and more preferably 90% by volume or more. Further preferred. In the case of 70% by volume or more, the adhesive strength is sufficient.

The weight average molecular weight of the (meth) acrylic acid ester copolymer suitably used in the present invention is not particularly limited, but is preferably 200,000 to 1,500,000, more preferably from the viewpoint of increasing the adhesive force. It is 300,000 to 1,200,000, more preferably 400,000 to 1,000,000, and more preferably 400,000 to 800,000.
When the weight average molecular weight of the (meth) acrylic acid ester copolymer is 200,000 or more, the cohesive force of the pressure-sensitive adhesive can be sufficiently obtained even when the usual amount of the crosslinking agent is added, and good pressure-sensitive adhesive properties are obtained. can get. Further, when the weight average molecular weight is 1.5 million or less, good adhesive properties can be obtained.
The weight average molecular weight of the acrylic ester copolymer is a value obtained by measuring by a gel permeation chromatography method and converting from a standard polystyrene calibration curve.

  The functional group of the acrylic ester copolymer is not limited as long as it is a functional group effective for improving the adhesive force, and examples thereof include a carboxy group, a hydroxyl group, an epoxy group, and a nitrile group. Especially, since it has high heat resistance of adhesive force, it preferably has a carboxy group, a hydroxyl group or an epoxy group, and more preferably has a carboxy group. Having a carboxy group, a hydroxyl group, or an epoxy group is preferable in that a decrease in the adhesive strength of the acrylate copolymer during high-temperature heating such as during component mounting can be suppressed.

  In addition, it is preferable to include a crosslinked structure within a range that does not impair flexibility, from the viewpoint of long-term adhesion retention and film strength. A crosslinking agent having two or more functional groups that bind to the functional group of the acrylate copolymer may be reacted with the acrylate copolymer. For example, by reacting an acrylic ester copolymer having a polar group such as -OH group with a compound having a functional group that binds to the polar group such as an isocyanate group or an epoxy group, the acrylic ester copolymer The coalescence can include a cross-linked structure. The crosslinking agent is not particularly limited. For example, an isocyanate compound, an epoxy resin, a metal chelate, etc. are mentioned.

  As content of the said crosslinking agent, it is preferable that it is 0.01 mass%-10 mass% with respect to a (meth) acrylic acid ester copolymer, and it is 0.02 mass%-5 mass%. More preferably, it is 1 mass%-10 mass%, More preferably, it is 2 mass%-5 mass%. When the amount of the crosslinking agent is 0.01% or more, the long-term adhesion retention is excellent. Moreover, when the amount of the crosslinking agent is 10% or less, good adhesive properties can be obtained.

The film thickness of the adhesive layer 16 is not particularly limited. For example, it can be set to 100 μm or less. From the viewpoint of thermal conductivity, it is preferably 1 μm to 100 μm, more preferably 3 μm to 80 μm, and even more preferably 5 μm to 70 μm.
When the film thickness of the pressure-sensitive adhesive layer 16 is 1 μm or more, sufficient adhesiveness tends to be obtained, and the second metal layer 14 can be appropriately protected in an etching process during circuit processing. Moreover, there exists a tendency for favorable heat conductivity to be acquired as it is 100 micrometers or less, and also it is excellent in productivity.

The thermal resistance of the pressure-sensitive adhesive layer 16 is not particularly limited, but is preferably 6 ° C. · cm ² / W or less from the viewpoint of heat dissipation, and is preferably 4 ° C. · cm ² / W or less from the viewpoint of high heat dissipation. More preferably, it is more preferably 3 ° C. · cm ² / W or less from the viewpoint of application to a high-temperature drive element. When the thermal resistance of the adhesive layer 16 is 6 ° C. · cm ² / W or less, the temperature drop of the semiconductor component 40 is sufficient.

In the present invention, the thermal resistance is measured as follows. In a sample in which the pressure-sensitive adhesive layer 16 is sandwiched between two 10 mmφ metal discs, the thermal conductivity of the pressure-sensitive adhesive layer 16 is measured by a laser flash method or a Xe flash method, and then the thickness [mm] of the pressure-sensitive adhesive layer 16 Is multiplied by 10 and divided by the thermal conductivity [W / mK], the thermal resistance [° C. · cm ² / W] of the pressure-sensitive adhesive layer 16 can be evaluated.

  The peel strength of the pressure-sensitive adhesive layer 16 is not particularly limited, but the peel strength of the pressure-sensitive adhesive layer 16 after heat treatment in air at 260 ° C. for 2 minutes is 30% or more compared to the peel strength of the pressure-sensitive adhesive layer 16 before heat treatment. It is preferably 50% or more, more preferably 60% or more, and even more preferably 70% or more.

  Since the pressure-sensitive adhesive layer 16 is heated together with the wiring board 31 for mounting the semiconductor component 40 (during reflow), it is preferable that the peel strength of the pressure-sensitive adhesive layer 16 is less reduced by heating. If even a part of the heat-resistant separator 22 is peeled off from the wiring board 31 before mounting, the pressure-sensitive adhesive layer 16 is exposed to heat at the time of mounting in the air, and the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer 16 is more likely to decrease. Therefore, the pressure-sensitive adhesive layer 16 having high adhesive strength at high temperature is desirable.

The peel strength of the pressure-sensitive adhesive layer 16 is measured by the following method.
A pressure-sensitive adhesive layer 16 is attached to a copper foil having a thickness of 100 mm × 25 mm and a thickness of 105 μm as a supporting metal layer. Further, a 1 mm-thick aluminum substrate (A5052) is placed on the pressure-sensitive adhesive layer 16 by using a rubber roll. A peeling sample is prepared by applying with stress.
After leaving the sample for peeling, it was allowed to stand at room temperature for 72 hours, and then measured with a tensile tester (Tensilon universal testing machine RTA-100, manufactured by Orientec Co., Ltd.) at a measurement temperature of 25 ° C., a peeling angle of 90 °, and a peeling speed of 0.2 m / min Measure peel strength.
The peel strength after high-temperature heating was determined by allowing the adhesive layer 16 to be exposed to the air in a state where the pressure-sensitive adhesive layer 16 was exposed in the air for 2 minutes, and then allowing to cool at room temperature. The measurement is performed in the same manner as in the above method except that an aluminum substrate is attached.

The pressure-sensitive adhesive may further contain various additives such as a tackifier resin, an anti-aging agent, a filler, a flame retardant, an organic filler, an inorganic filler, and the like.
The volume ratio of the inorganic filler contained in the pressure-sensitive adhesive is not particularly limited, but is preferably 20% by volume or less, more preferably 15% by volume or less, and further preferably 10% by volume or less. A volume% or less is more preferable. Since the adhesive strength of the pressure-sensitive adhesive layer 16 is likely to be reduced by heating at the mounting temperature in the air, the content of the inorganic filler that does not contribute to the adhesive strength is preferably not too high, and in the case of 20% by volume or less A decrease in the adhesive strength of the pressure-sensitive adhesive layer 16 is suppressed by heating at the mounting temperature.

(Adhesive layer with heat-resistant separator)
The pressure-sensitive adhesive layer 18 with a heat-resistant separator in the present invention includes a heat-resistant separator 22 and a pressure-sensitive adhesive layer 16. The pressure-sensitive adhesive layer 18 with a heat-resistant separator may further have a resin layer 20 having heat resistance and chemical resistance on one surface or both surfaces of the heat-resistant separator 22. When the pressure-sensitive adhesive layer 18 with a heat-resistant separator includes the resin layer 20, it is preferable to have at least the resin layer 20 on the surface opposite to the surface facing the pressure-sensitive adhesive layer 16 in the heat-resistant separator 22. It is more preferable to have the resin layer 20 on both surfaces of 22.

  As a process of providing the pressure-sensitive adhesive layer 16 on the heat-resistant separator 22, a method usually used for forming the pressure-sensitive adhesive layer 16 can be applied without particular limitation. For example, the method etc. which apply | coat or laminate the composition for adhesive layers containing an adhesive on the heat resistant separator 22 can be mentioned. Further, after the pressure-sensitive adhesive layer 16 is formed on another substrate, the formed pressure-sensitive adhesive layer 16 may be transferred onto the heat-resistant separator 22. As another substrate, for example, a polyethylene terephthalate film subjected to a release treatment is used.

The surface of the heat-resistant separator 22 facing the pressure-sensitive adhesive layer 16 preferably has peelability from the pressure-sensitive adhesive layer 16. Thereby, it becomes easy to peel the heat-resistant separator 22 from the pressure-sensitive adhesive layer 16, and the process of attaching the circuit board 32 to the housing 70 can be performed more efficiently.
The method for imparting peelability to the surface of the heat-resistant separator 22 facing the pressure-sensitive adhesive layer 16 is not particularly limited. For example, surface treatment with a release agent such as a silicone release agent, a fluorine release agent, a long-chain alkyl acrylate release agent, a release agent such as a fluororesin, or a resin containing these release agents. Can do.

  The pressure-sensitive adhesive layer 18 with a heat-resistant separator in the present invention desirably has chemical resistance in addition to heat resistance. By having chemical resistance, resistance to acidic and alkaline chemicals used to form a circuit from the first metal layer 10 in the wiring board material 30 is increased. Therefore, the pressure-sensitive adhesive layer 18 with a heat-resistant separator may have a resin layer 20 having acid resistance and alkali resistance in addition to the heat-resistant separator 22 and the pressure-sensitive adhesive layer 16. The method for forming the resin layer 20 is not particularly limited.

  Specific examples of the resin having heat resistance and chemical resistance include polyethylene naphthalate resin, polyimide resin, epoxy resin, and polyamide resin. Among these, from the viewpoint of low shrinkage, at least one selected from polyimide resins, epoxy resins, and polyamideimides is preferable, and at least one selected from polyimide resins and polyamideimides is more preferable.

  As a polyimide resin, it can select from the polyimide resin normally used as a heat resistant resin, and can use it suitably. Moreover, as an epoxy resin, it can select from the epoxy resin normally used as a heat resistant resin, and can use it suitably.

  The average thickness of the resin layer 20 is preferably 0.1 μm to 10 μm, and more preferably 0.3 μm to 7 μm, from the viewpoints of heat resistance, acid resistance, alkali resistance, water resistance, and processability.

  When the pressure-sensitive adhesive layer 18 with a heat-resistant separator is composed of the heat-resistant separator 22, the pressure-sensitive adhesive layer 16, and the resin layer 20, the resin layer 20 has at least a surface facing the pressure-sensitive adhesive layer 16 of the substrate 22. May be provided on the opposite surface, and the resin layer 20 may be provided on both surfaces of the heat-resistant separator 22.

[Adhesive layer lamination process]
In the pressure-sensitive adhesive layer laminating step in the present invention, the pressure-sensitive adhesive layer 18 with a heat-resistant separator is laminated on the second metal layer 14 in the wiring board material 30 or the wiring board 31. Alternatively, the pressure-sensitive adhesive layer 16 is laminated on the second metal layer 14 in the wiring board material 30 or the wiring board 31, and then the heat-resistant separator 22 is laminated. Prior to mounting the semiconductor component 40, the pressure-sensitive adhesive layer 18 with a heat-resistant separator, or the pressure-sensitive adhesive layer 16 and the heat-resistant separator 22 are laminated, so that there is no need to provide a sticking / peeling process such as a protective film. Will improve. Moreover, since the 2nd metal layer 14 is protected by the heat resistant separator 22 at the time of a reflow process, the raise of the thermal resistance of the 2nd metal layer 14 can be suppressed, and the outstanding heat dissipation can be achieved.

  FIG. 8 shows an example of a cross-sectional view of a wiring board material laminate 90 in which the pressure-sensitive adhesive layer 18 with a heat-resistant separator or the pressure-sensitive adhesive layer 16 and the heat-resistant separator 22 are laminated on the wiring board material 30. FIG. 9 shows an example of a cross-sectional view of a wiring board laminate 92 in which the pressure-sensitive adhesive layer 18 with a heat-resistant separator or the pressure-sensitive adhesive layer 16 and the heat-resistant separator 22 are laminated on the wiring board 31. 8 and 9, the resin layer 20 is provided, but the resin layer 20 can be installed arbitrarily.

A step of laminating the pressure-sensitive adhesive layer 18 with a heat-resistant separator on the wiring board material 30 or the wiring board 31 so that the second metal layer 14 and the pressure-sensitive adhesive layer 16 in the wiring board material 30 or the wiring board 31 are in contact with each other; As a process of laminating the pressure-sensitive adhesive layer 16 and the heat-resistant separator 22 on the wiring board material 30 or the wiring board 31, a laminating method that is usually used can be applied without any particular limitation. For example, a pressing method and a laminating method can be mentioned, and the laminating method is preferable from the viewpoint of continuous production and good efficiency.
The pressing and laminating method can be appropriately selected from methods usually performed in the technical field. For example, as a laminating method, it can carry out on the conditions of 20 to 50 degreeC using the laminator provided with the silicone rubber coating roll.

  As a specific method of laminating the pressure-sensitive adhesive layer 18 with a heat resistant separator on the wiring board material 30 or the wiring board 31, the second metal layer 14 in the wiring board material 30 or the wiring board 31 and the heat resistant separator are attached. The pressure-sensitive adhesive layer 18 is opposed to the pressure-sensitive adhesive layer 16, one end in the longitudinal direction of the pressure-sensitive adhesive layer 18 with a heat-resistant separator is attached to the second metal layer 14, and the other end is the second. While being separated from the metal layer 14, the other end portion is gradually brought closer to the second metal layer 14, and the pressure is applied from the one end portion toward the other end portion, so that the wiring board material 30 or the wiring board 31 is heat resistant. The method of sticking the adhesive layer 18 with a conductive separator is mentioned.

  The specific method described above is also applied to the step of laminating the pressure-sensitive adhesive layer 16 on the wiring board material 30 or the wiring board 31 and the step of laminating the heat-resistant separator 22 on the pressure-sensitive adhesive layer 16. be able to. Specifically, the second metal layer 14 and the pressure-sensitive adhesive layer 16 in the wiring board material 30 or the wiring board 31 are opposed to each other, and one end in the longitudinal direction of the pressure-sensitive adhesive layer 16 is used as the second metal layer 14. The other end is separated from the second metal layer 14, and the other end is gradually moved closer to the second metal layer 14 while being pressurized from the one end toward the other end. The method of sticking the wiring board material 30 or the wiring board 31 and the adhesive layer 16 is mentioned. The pressure-sensitive adhesive layer 16 and the heat-resistant separator 22 are opposed to each other, one end of the heat-resistant separator 22 in the longitudinal direction is attached to the pressure-sensitive adhesive layer 16, and the other end is separated from the pressure-sensitive adhesive layer 16. There is a method of applying the pressure-sensitive adhesive layer 16 and the heat-resistant separator 22 by applying pressure from the one end to the other end while gradually bringing the other end closer to the pressure-sensitive adhesive layer 16.

  By laminating the adhesive layer 16 and the heat-resistant separator 22 on the wiring board material 30 or the wiring board 31, the thickness of the wiring board material 30 or the wiring board 31 can be increased. Thereby, it is excellent in the handleability of the wiring board material 30 or the wiring board 31, the thickness of the wiring board material 30 or the wiring board 31 can be made thinner, and thermal conductivity improves more. Moreover, when it laminates | stacks on the wiring board material 30, it becomes easy to perform the external shape process performed after that. This can be considered, for example, because the separator functions as a stiffener (reinforcing material). Furthermore, since the second metal layer 14 is covered with the heat-resistant separator 22, a circuit can be formed on the first metal layer 10 by a commonly used etching process, and productivity is improved.

Further, since the separator has heat resistance, it is possible to suppress deformation of the wiring board 31 when the semiconductor component 40 or the like is mounted on the metal circuit layer 11 by reflow processing.
Furthermore, the adhesive layer 16 is provided prior to mounting the semiconductor component 40 and the like, so that the adhesion between the second metal layer 14 and the adhesive layer 16 is excellent, and the thermal conductivity between the circuit board 32 and the housing 70 is improved. Excellent electronic components can be manufactured with high productivity.

  Moreover, the wiring board 31 which is excellent in thermal conductivity can be comprised because the wiring board material 30 or the wiring board 31 has the 2nd metal layer 14 in addition to the 1st metal layer 10 for circuit formation. Further, since the second metal layer 14 is covered with the heat-resistant separator 22, the second metal layer 14 is prevented from being oxidized when the circuit board 32 on which the semiconductor component 40 is mounted is manufactured. It can suppress that heat conductivity falls.

[Semiconductor component mounting process]
In the semiconductor component mounting step, the semiconductor component 40 is mounted on the metal circuit layer 11. FIG. 10 shows an example of a cross-sectional view of the component-mounted wiring board laminate 100 obtained by the semiconductor component mounting process.

  The semiconductor component 40 is, for example, an LED element, a capacitor, an inductance, a resistor, a semiconductor, an LED chip, or the like. The semiconductor component 40 includes a semiconductor element, a terminal that electrically connects the semiconductor element and the outside, and a sealing material that seals and holds the semiconductor element. The terminal is not particularly limited, and for example, a conductor such as copper, solder, or the like is used. The sealing material is not particularly limited, and an epoxy resin or the like is used. The semiconductor component 40 can be obtained according to the method described in Japanese Patent Application Laid-Open No. 2007-110113. A connector 44 may be mounted on the wiring board 31 together with the semiconductor component 40.

  In the process of mounting the semiconductor component 40 on the metal circuit layer 11 by the reflow process, for example, the process of forming a solder resist on the circuit surface, the pressure-sensitive adhesive layer 18 with a heat-resistant separator, or the pressure-sensitive adhesive layer 16 as necessary. Then, after carrying out a process of externally processing the wiring board material 30 provided with the heat-resistant separator 22 to a required size, the semiconductor component 40 is placed on the metal circuit layer 11 and the semiconductor component 40 is removed by reflow processing. 11 is mounted. At this time, other components other than the semiconductor component 40 may be simultaneously mounted. The reflow process is performed under the conditions normally used.

  The mounting method of the semiconductor component 40 can be appropriately selected from commonly used methods. For example, a method of mounting via a conductive connection material 42 such as a metal paste or solder provided on the metal circuit layer is used.

  There is no restriction | limiting in particular as a method of mounting the semiconductor component 40 via a metal paste, A well-known method can be followed. For example, a method of mounting by flip-chip connection and the like can be mentioned, and specifically, the method described in JP-A-2004-039736 can be applied. The conditions for the mounting process are not particularly limited, and depend on the type of the semiconductor component 40 to be mounted, and can conform to a known method.

  When the semiconductor component 40 is connected by solder, the wiring board 31 and the heat-resistant separator 22 are also exposed to a high temperature, for example, by passing through a reflow furnace in order to melt the solder. However, in the present invention, since the heat resistant separator 22 has heat resistance, it is effective that the thermal resistance of the second metal layer 14 is increased even when heated to about 260 ° C. by reflow treatment. Can be suppressed.

[Attaching process]
In the pasting step, after the semiconductor component 40 is mounted on the metal circuit layer 11, the heat-resistant separator 22 is peeled off at the interface with the pressure-sensitive adhesive layer 16 to expose the pressure-sensitive adhesive layer 16. A housing 70 is pasted on the surface to manufacture an electronic component. FIG. 11 shows an example of a cross-sectional view of an electronic component.

The method of peeling the heat-resistant separator 22 at the interface with the pressure-sensitive adhesive layer 16 and the method of sticking the housing 70 on the pressure-sensitive adhesive layer 16 are not particularly limited and can be appropriately selected from commonly performed methods.
The method of attaching the housing 70 on the pressure-sensitive adhesive layer 16 is preferably a method in which the pressure-sensitive adhesive layer 16 and the housing 70 are brought into contact with each other and pressure is applied to a region other than the mounted semiconductor component 40. The pressure to be applied is not particularly limited and is appropriately selected according to the configuration of the pressure-sensitive adhesive layer 16.

  As a specific method of attaching the housing 70 on the adhesive layer 16, for example, the adhesive layer 16 attached to the wiring board 31 and the housing 70 are opposed to each other, and one of the wiring boards 31 in the longitudinal direction is arranged. Is attached to the housing 70, the other end is separated from the housing 70, and the other end is gradually brought closer to the housing 70, from the one end toward the other end. A method of applying pressure and attaching the pressure-sensitive adhesive layer 16 and the housing 70 to each other is exemplified.

In a conventional method for manufacturing an electronic component, generally, a protective film is disposed on one side of a wiring board material having metal layers on both sides and a circuit is processed, and then the protective film is peeled off. Next, after mounting the semiconductor element by reflow treatment, an adhesive layer and a separator are laminated on the side opposite to the mounting surface of the semiconductor element. Next, the separator is peeled off, and the housing is stuck on the adhesive layer.
As described above, the number of steps of stacking and peeling is larger than that of the method for manufacturing an electronic component of the present invention, so that the steps become complicated. In the conventional method, the second metal layer may be oxidized during the reflow process, and the thermal resistance may be deteriorated. However, in the present invention, the second metal layer 14 is protected even during the reflow process. An increase in thermal resistance can be suppressed.

  Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples. Unless otherwise specified, “part” and “%” are based on mass.

<Example 1>
A wiring board material (manufactured by Hitachi Chemical Co., Ltd.) in which a 35 μm thick copper foil, a 15 μm thick insulating layer 12 and a 105 μm thick copper foil are laminated in this order as a first metal layer for circuit formation , HT-9000IMC), double-sided pressure-sensitive adhesive tape with a heat-resistant separator on a 105-μm-thick copper foil surface (heat-resistant separator: heat-resistant resin-coated aluminum foil with a 5-μm epoxy resin layer on one side, thickness 35 μm, epoxy resin Shrinkage 0.1%; pressure-sensitive adhesive layer: acrylic pressure-sensitive adhesive, thickness 50 μm) After peeling the separator on the opposite side of the heat-resistant separator, it was attached using a hot roll laminator at a temperature of 25 ° C. A wiring board material laminate was obtained.

  The shrinkage rate of the heat resistant resin constituting the separator was measured as follows. A heat-resistant resin film made of a heat-resistant resin having a thickness of 50 μm was cut into 10 cm × 10 cm, and the length of the diagonal line was measured at 25 ° C. Subsequently, after heat-treating in an oven at 250 ° C. for 1 minute, it was allowed to cool at room temperature. The diagonal length of the heat-resistant resin film after the heat treatment was measured, and this was divided by the length of the diagonal line before the heat treatment to calculate the shrinkage rate.

  Using the obtained wiring board material laminate, an etching resist was provided on a 35 μm thick copper foil surface, and then the copper foil was corroded and dissolved in an aqueous iron chloride solution to process a circuit. Thereafter, a solder resist was printed at a predetermined location and cured at 150 ° C. for 2 hours. Thereafter, the outer shape was processed to a width of 5 mm and a length of 400 mm to obtain a wiring board in which an adhesive layer and a separator were laminated on a surface opposite to the surface on which the circuit was formed.

After arranging the LED chip and the connector on the circuit of the obtained wiring board, the LED chip and the connector were mounted with solder by a reflow process (temperature of 265 ° C.).
Thereafter, the separator was peeled off, and the exposed adhesive layer was attached to an aluminum housing (size 10 mm × 430 mm × 2 mm) to obtain a semiconductor device. At the time of pasting, pressure was applied to the substrate portion on which the LED chip and the connector were not mounted and fixed.
It was 80 degreeC when the surface temperature of the LED chip at the time of electricity supply of the obtained semiconductor device was measured.

<Example 2>
In Example 1, a heat resistant resin-coated aluminum foil provided with a 5 μm polyimide resin layer (polyimide resin shrinkage 0.1%) on one side was used as the heat resistant separator in the same manner as in Example 1. A semiconductor device was obtained.
It was 80 degreeC when the surface temperature of the LED chip at the time of electricity supply of the obtained semiconductor device was measured.

<Example 3>
<Preparation of a copper separator having a heat resistant resin layer>
A wiring board material (MCF-5000IS, manufactured by Hitachi Chemical Co., Ltd.) obtained by laminating a 35 μm thick copper foil and a 15 μm thick polyimide layer was fired at 150 ° C. for 1 hour. Next, a fluorine-containing silicon compound treatment liquid (Sumitomo 3M, EGC-1720) containing a fluorine-containing silicon compound in a solid content concentration of 0.2% by mass is applied to the copper foil surface of the wiring board material, and at room temperature for 6 hours. Dried. Then, the said wiring board material was heat-processed at 100 degreeC for 1 hour, and the copper separator which has a heat resistant resin layer was produced by rubbing a copper foil surface with Kimwipe (trademark) which immersed acetone.

<Production of wiring board>
A circuit board material (manufactured by Hitachi Chemical Co., Ltd.) in which a 35 μm-thick copper foil, a 10 μm-thick insulating layer 12, and a second metal layer of 105 μm-thick copper foil are laminated in this order as a first metal layer for circuit formation , HT-9000IMC), an etching resist was provided on the first metal layer for circuit formation, and then the circuit was processed by dissolving copper in a ferric chloride aqueous solution to obtain a metal circuit layer. Then, the soldering resist was printed in the predetermined location on the metal circuit layer surface, and it hardened | cured by heat processing for 120 minutes at 120 degreeC. Next, the outer shape was processed to a width of 6 mm and a length of 100 mm to manufacture a wiring board.

<Lamination of adhesive layer with heat-resistant separator>
A double-sided adhesive tape (Hitalex DA-3050, 50 μm, manufactured by Hitachi Chemical Co., Ltd.) having the same shape as the wiring board was prepared. The adhesive layer was laminated | stacked by making the 2nd metal layer of a wiring board face upward, peeling the release PET film of one surface of this double-sided adhesive tape, and affixing on the 2nd metal layer of the said wiring board.
The pressure-sensitive adhesive layer had a thermal conductivity of 0.2 W / mK and a thermal resistance of 2.5 ° C. · cm ² / W. The thermal conductivity and thermal resistance of the pressure-sensitive adhesive layer were measured by the following method.

  Next, another release PET film was peeled from the adhesive layer adhered to the wiring board, and then the copper separator was laminated on the adhesive layer to obtain a wiring board laminate. At this time, with one end of the copper separator in the longitudinal direction attached to the wiring board and the other end of the copper separator separated from the wiring board, one end of the copper separator is gradually brought closer to the wiring board. A pressure was applied with a rubber roll from one end to the other end to adhere.

<Evaluation of thermal conductivity and thermal resistance of adhesive layer>
First, the thermal conductivity of the adhesive layer was evaluated by a laser flash method. Using a xenon flash analyzer (Nanoflash LFA447 manufactured by NETZSCH), two copper plates (1 mm thick) with an adhesive layer sandwiched at 0.6 MPa were irradiated with xenon flash light, and the time dependence of the temperature of the back copper plate was measured. The thermal conductivity [W / mK] of the pressure-sensitive adhesive layer was evaluated by analyzing the three-layer model.

Next, the thermal resistance was evaluated from the calculation formula (thermal resistance [° C. · cm ² / W] = 10 × pressure-sensitive adhesive layer thickness [mm] / thermal conductivity [W / mK]). Here, the thickness of the pressure-sensitive adhesive layer was a value obtained by subtracting the thickness of the copper plate from the thickness of the two copper plates sandwiching the heat conductive sheet at 0.6 MPa.

<Component mounting>
Multiple solders (ECO SOLDER PASTE Lead Free, manufactured by Senju Metal Industry Co., Ltd., M705, Sn-3.0Ag-0.5Cu, melting temperature 220 ° C.), LED parts (Philips Lumileds Lighting) Made by LXML-PWC1-0080, 4.6mm length x 3.2mm width x 2.1mm height), connectors, etc., and reflow treatment (maximum 260 ° C), so that the component-mounted wiring board laminate mounted on one side is Obtained well.
The copper separator could be easily peeled from the pressure-sensitive adhesive layer in the obtained component-mounted wiring board laminate. This is because the copper separator has heat resistance and did not melt and adhere to the transporter of the reflow furnace.

<Example 4>
A wiring board material (made by Hitachi Chemical Co., Ltd.), in which a 35 μm thick copper foil, a 100 μm thick insulating layer, and a 1 mm thick aluminum plate are laminated in this order as a first metal layer for circuit formation A component-mounted wiring board laminate was satisfactorily obtained by preparing a wiring board, laminating a pressure-sensitive adhesive layer with a separator, and mounting components in the same manner as in Example 3 except that HT-5100M) was used.
The copper separator could be easily peeled from the pressure-sensitive adhesive layer in the obtained component-mounted wiring board laminate.

<Example 5>
<Preparation of an aluminum separator having a heat resistant resin layer>
Epoxy resin (a mixture of Refinetech Co., Ltd., Epomount main agent 27-771, 100 parts and Epomount curing agent 27-772, 9 parts) was applied to an aluminum foil having a thickness of 35 μm. The aluminum foil coated with the epoxy resin was allowed to stand at room temperature (25 ° C.) for 24 hours and then fired at 150 ° C. for 1 hour to obtain a laminate in which a 5 μm epoxy resin layer and a 35 μm aluminum foil were laminated.

  Next, a treatment liquid of fluorine-containing silicon compound containing 0.2% by mass of a solid content of fluorine-containing silicon compound (EGC-1720, manufactured by Sumitomo 3M Limited) was applied to the aluminum foil surface of the laminate, and room temperature (25 ° C. ) For 6 hours. Thereafter, the wiring board material was heat-treated at 100 ° C. for 1 hour, and the aluminum foil surface was rubbed with Kimwipe (registered trademark) soaked in acetone to produce an aluminum separator having a heat-resistant resin layer.

  Moreover, the sample for measuring the shrinkage | contraction rate of a heat resistant resin layer was produced as follows. Similarly, the aluminum foil was removed by etching from a laminate obtained by laminating a 35 μm-thick aluminum foil and a 50 μm-thick epoxy resin layer to obtain a 50 μm epoxy resin film. The length of the diagonal line of the epoxy resin film cut into 10 cm × 10 cm was measured at 25 ° C. The shrinkage ratio of this epoxy resin film was determined by the same method as described above. The shrinkage ratio of the epoxy resin film was 1.7%.

<Lamination of pressure-sensitive adhesive layer with separator>
As a first metal layer for circuit formation, a 35 μm thick copper foil, a 10 μm thick insulating layer, and a second metal layer of 105 μm thick copper foil layered in this order (made by Hitachi Chemical Co., Ltd., The adhesive layer was laminated | stacked on the 2nd metal layer of HT-9000IMC by affixing the double-sided adhesive tape (The Hitachi Chemical Co., Ltd. make, Hitachilex DA-3050, 50 micrometers) of the same shape as wiring board material. The pressure-sensitive adhesive layer had a thermal conductivity of 0.2 W / mK and a thermal resistance of 2.5 ° C. · cm ² / W.
Next, the PET release film of the double-sided pressure-sensitive adhesive tape was peeled to expose the pressure-sensitive adhesive layer, and an aluminum separator having a heat-resistant resin layer was laminated thereon.

<Production of wiring board>
After providing an etching resist on the first metal layer for circuit formation of the wiring board material laminate in which an aluminum separator having an adhesive layer and a heat-resistant resin layer is laminated in this order on the wiring board material, an aqueous ferric chloride solution is provided. Circuit processing was performed by dissolving copper in the metal circuit layer 11. Then, the soldering resist was printed in the predetermined location on the metal circuit layer surface, and it hardened | cured by heat processing for 120 minutes at 120 degreeC. Next, the outer shape was processed to a width of 6 mm and a length of 100 mm to produce a wiring board laminate.

<Component mounting>
By performing component mounting in the same manner as in Example 3, a component-mounted wiring board laminate was satisfactorily obtained. The separator was easily peeled from the pressure-sensitive adhesive layer in the obtained component-mounted wiring board laminate.

<Comparative Example 1>
A wiring board material (manufactured by Hitachi Chemical Co., Ltd.) in which a 35 μm thick copper foil, a 15 μm thick insulating layer 12 and a 105 μm thick copper foil are laminated in this order as a first metal layer for circuit formation HT-9000IMC) with a protective film (non-heat-resistant polyethylene terephthalate film (thickness 50 μm, shrinkage 20%) with a pressure-sensitive adhesive layer (thickness 50 μm) on one side) In addition, a laminate for forming a wiring board was obtained.

  Thereafter, an etching resist was provided on the surface of the 35 μm thick copper foil, and then the copper foil was corroded and dissolved in an aqueous iron chloride solution to process a circuit. Thereafter, a solder resist was printed at a predetermined location and cured at 150 ° C. for 2 hours. After peeling off the protective film, the outer shape was processed to a width of 5 mm and a length of 400 mm to obtain a wiring board.

After arranging the LED chip and the connector on the circuit of the obtained wiring board, the LED chip and the connector were mounted with solder by a reflow process.
Then, after removing the separator on one side of the adhesive tape with double-sided separator (separator: polyethylene terephthalate film; adhesive layer: acrylic adhesive, thickness 50 μm), it is opposite to the mounting surface of the wiring board on which the LED chip is mounted Adhesive tape was affixed on the side surface. Since the adhesive tape was applied by applying pressure to the substrate portion on which the LED chip was not mounted, a gap was partially generated between the copper foil surface of the wiring board and the adhesive tape.
Next, the polyethylene terephthalate film of the pressure-sensitive adhesive tape was peeled off, and the exposed pressure-sensitive adhesive layer was attached to an aluminum casing to obtain a semiconductor device. In addition, at the time of sticking to a housing | casing, it applied and fixed to the board | substrate part in which the LED chip and the connector are not mounted.
It was 88 degreeC when the surface temperature of the LED chip at the time of electricity supply of the obtained semiconductor device was measured.

<Comparative example 2>
First, the production of the wiring board was performed in the same manner as in Example 3. Next, the second metal layer of the wiring board faces upward, and a double-sided adhesive tape (Hitalex DA-3050, manufactured by Hitachi Chemical Co., Ltd.) having the same shape as the wiring board is attached to the second metal layer to laminate the adhesive layer did. However, the PET release film was used as it was for the separator.

  Next, component mounting was performed in the same manner as in Example 3. As a result, the PET separator contracted and melted, and the separator could not be removed from the transfer line of the reflow furnace. Further, the wiring board was deformed with the shrinkage of the PET separator, and the LED component was displaced from the pad portion. As a result, a good circuit board laminate was not obtained.

[Comparative Example 3]
First, a wiring board was produced in the same manner as in Example 3, and then component mounting was carried out in the same manner as in Example 3. Next, the pressure-sensitive adhesive layer with a heat-resistant separator was laminated in the same manner as in Example 3. At that time, the pressure-sensitive adhesive layer with a separator was strongly pressed with a finger and quickly laminated on the wiring board. As a result, the wiring board was deformed as shown in FIG. 12D due to the stress when the pressure-sensitive adhesive layer with a separator was laminated.

[Comparative Example 4]
First, a wiring board was produced in the same manner as in Example 3, and then component mounting was carried out in the same manner as in Example 3. Next, the pressure-sensitive adhesive layer with a heat-resistant separator was laminated in the same manner as in Example 3. At that time, the pressure-sensitive adhesive layer with a separator was weakly pressed with a finger and quickly laminated on the wiring board. As a result, bubbles were caught between the pressure-sensitive adhesive layer and the wiring board.

[Comparative Example 5]
First, a wiring board was produced in the same manner as in Example 3, and then component mounting was carried out in the same manner as in Example 3. Next, the pressure-sensitive adhesive layer with a heat-resistant separator was laminated in the same manner as in Example 3. At that time, the pressure-sensitive adhesive layer with the separator was weakly pressed with a finger and slowly laminated on the wiring board. As a result, as shown in FIG. 12E, the laminated pressure-sensitive adhesive layer with a separator was displaced from the circuit board.

  From the above results, it can be seen that according to the method of manufacturing an electronic component of the present invention, an electronic component having excellent thermal conductivity can be efficiently manufactured.

DESCRIPTION OF SYMBOLS 10 1st metal layer 11 for circuit formation Metal circuit layer 12 Insulating layer 14 2nd metal layer 16 Adhesive layer 18 Adhesive layer 20 with a heat resistant separator Resin layer 22 Heat resistant separator (base material)
30 Wiring board material 31 Wiring board 40 Semiconductor component 42 Conductive connection material 44 Connector 70 Housing 90 Wiring board material laminated body 92 Wiring board laminated body 100 Component mounting wiring board laminated body

Claims (8)

A pressure-sensitive adhesive layer with a heat-resistant separator is laminated on the second metal layer in the wiring board material in which the first metal layer for circuit formation, the insulating layer, and the second metal layer are laminated in this order, or a pressure-sensitive adhesive An adhesive layer laminating step of laminating a heat-resistant separator after laminating the layers;
After the pressure-sensitive adhesive layer laminating step, forming a circuit from the first metal layer for forming the circuit to produce a metal circuit layer, and using the wiring board material as a wiring board;
A semiconductor component mounting step of mounting a semiconductor component on the metal circuit layer;
An affixing step of peeling the heat-resistant separator and affixing a housing on the adhesive layer;
Of electronic parts including A pressure-sensitive adhesive layer with a heat-resistant separator is laminated on the second metal layer in the wiring board in which the metal circuit, the insulating layer, and the second metal layer are laminated in this order, or the heat-resistant separator after the pressure-sensitive adhesive layer is laminated. A pressure-sensitive adhesive layer laminating step,
A semiconductor component mounting step of mounting a semiconductor component on the metal circuit layer;
An affixing step of peeling the heat-resistant separator and affixing a housing on the adhesive layer;
Of electronic parts including   In the attaching step, the adhesive layer attached to the wiring board and the housing are opposed to each other, and one end portion in the longitudinal direction of the wiring board is attached to the housing, and the other other end portion. Is pressed from the one end to the other end while the other end is gradually brought closer to the case, and the adhesive layer and the case are attached. The manufacturing method of the electronic component of Claim 1 or Claim 2.   The manufacturing method of the electronic component as described in any one of Claims 1-3 in which the said heat resistant separator has a heat resistant resin layer further.   The manufacturing method of the electronic component as described in any one of Claims 1-4 in which the said heat resistant separator has paper as a base material.   The manufacturing method of the electronic component as described in any one of Claims 1-4 in which the said heat resistant separator has at least 1 sort (s) of metal foil selected from aluminum foil and copper foil as a base material.   The manufacturing method of the electronic component as described in any one of Claims 1-6 whose average thickness of the said wiring board is 50 micrometers or more and 500 micrometers or less.   The electronic component produced using the manufacturing method of the electronic component as described in any one of Claims 1-7.