JP2012129410A - Manufacturing method of electronic component - Google Patents
Manufacturing method of electronic component Download PDFInfo
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本発明は、電子部品の製造方法に関する。 The present invention relates to a method for manufacturing an electronic component.
ＬＥＤ（発光ダイオード）を実装する配線板は液晶ディスプレイのバックライトなどの用途で、広く用いられている。この配線板はＬＥＤの発する熱を効率的に外部に逃がすことが必要であるので、アルミ、銅などの金属板を片面に配したいわゆる金属ベース配線板が使用されることが多い（例えば特許文献１参照）。これらは、部品実装後に金属筐体に両面粘着テープを介して貼り付けられる。しかし、部品実装した基板は表面に凹凸があり、また、部品を強く押すと破壊されるため、これを貼り付ける際には部品がない部分を軽く押して貼り付けるため、十分な密着性を得ることが難しく、また、密着性の不良は熱抵抗を増大させるため、大きな問題になっていた。
密着性を保つためには、厚い両面粘着テープを使用することが挙げられるが、熱抵抗を悪化させるとの問題があった。
Wiring boards on which LEDs (light emitting diodes) are mounted are widely used for applications such as backlights for liquid crystal displays. Since this wiring board needs to efficiently release the heat generated by the LED to the outside, a so-called metal base wiring board in which a metal plate such as aluminum or copper is arranged on one side is often used (for example, Patent Documents). 1). These are affixed to a metal housing via a double-sided adhesive tape after component mounting. However, since the board on which the component is mounted has irregularities on the surface and it is destroyed when the part is pressed hard, the part without the part is attached by lightly pressing it to obtain sufficient adhesion. In addition, poor adhesion has been a major problem because it increases thermal resistance.
In order to maintain the adhesion, it is possible to use a thick double-sided adhesive tape, but there is a problem that the thermal resistance is deteriorated.
部品が発する熱を効率よく、金属筐体に逃がすために、部品実装した配線板を金属筐体に確実に貼り付けることができるような技術が求められている。
本発明の目的は、部品実装した配線板を筐体に確実に貼り付けでき、熱抵抗を低減することが可能な、電子部品の製造方法を提供することである。
In order to efficiently release the heat generated by the components to the metal casing, a technique is required that can reliably paste the wiring board mounted with the components to the metal casing.
The objective of this invention is providing the manufacturing method of an electronic component which can affix the wiring board which mounted components on the housing | casing reliably, and can reduce thermal resistance.
本発明は以下の通りである。
（１） 配線板と、筐体とを備えた電子部品の製造方法であって、配線板の片面を、粘着層を介して、筐体に接着する工程において、前記配線板の一方の端部を筐体から離した状態で、かつ、前記一方の端部を徐々に筐体に近づけながら、前記配線板のもう一方の端部から、前記配線板の一方の端部に向けて加圧し、接着することを特徴とする電子部品の製造方法。
（２） 配線板が、片面に部品実装した配線板であり、部品実装されていない面を、筐体に接着する、前記（１）に記載の電子部品の製造方法。
The present invention is as follows.
(1) An electronic component manufacturing method including a wiring board and a housing, wherein one end of the wiring board is bonded to the housing via an adhesive layer on one side of the wiring board. In a state separated from the casing, and while gradually bringing the one end close to the casing, pressurizing from the other end of the wiring board toward the one end of the wiring board, A method for manufacturing an electronic component, comprising bonding.
(2) The method for manufacturing an electronic component according to (1), wherein the wiring board is a wiring board in which a component is mounted on one side, and a surface on which the component is not mounted is bonded to a housing.
本発明により、部品実装した配線板を金属筐体に確実に貼り付けでき、熱抵抗を低減することができるため、部品が発する熱を効率よく、筐体に逃がすことができ、その結果、部品の上昇温度を低減でき、部品の寿命を改善できる電子部品の製造方法を提供することが可能となった。 According to the present invention, a wiring board mounted with a component can be reliably attached to a metal casing, and heat resistance can be reduced, so that heat generated by the component can be efficiently released to the casing. It has become possible to provide a method for manufacturing an electronic component that can reduce the temperature rise and improve the life of the component.
本発明の電子部品の製造方法で使用される配線板は、少なくとも最外層に金属層を有するフレキシブルな基板であれば特に制限されないが、熱伝導性及び絶縁性の観点から、金属層、絶縁層、金属層の３層を有するものであることが好ましく、配線板の厚さを薄くすることで密着性の向上を図る観点から、金属箔、絶縁樹脂シート、金属箔の３層を有するものが好ましい。金属箔としては、銅、アルミ、鉄、金、銀、ニッケル、パラジウム、クロム、モリブデン又はこれらの合金の箔が好適に用いられる。これらの中でも回路形成が容易な観点から、銅箔が好ましい。絶縁層との接着力を高めるために、金属箔の表面には、化学的粗化、コロナ放電、サンディング及びめっきや、アルミニウムアルコラート、アルミニウムキレート、シランカップリング剤等によって機械的又は化学的な処理が施されていてもよい。
絶縁層としては、ポリイミド、ポリエステル等の高分子量樹脂、エポキシ樹脂、シリコーン樹脂、アクリル樹脂及びこれらの混合物等からなる樹脂シートを挙げることができる。これらの絶縁層は、各種フィラーを含んでいてもよい。
また、本発明の電子部品の製造方法で使用される配線板は、通常、片面に部品が実装されており、前記部品とは、コンデンサ、抵抗体、半導体、ＬＥＤチップなどの各種の電子部品である。
The wiring board used in the method for producing an electronic component of the present invention is not particularly limited as long as it is a flexible substrate having a metal layer as at least the outermost layer, but from the viewpoint of thermal conductivity and insulation, the metal layer and the insulating layer From the viewpoint of improving the adhesion by reducing the thickness of the wiring board, those having three layers of metal foil, insulating resin sheet, and metal foil are preferable. preferable. As the metal foil, a foil of copper, aluminum, iron, gold, silver, nickel, palladium, chromium, molybdenum or an alloy thereof is preferably used. Among these, copper foil is preferable from the viewpoint of easy circuit formation. In order to increase the adhesion with the insulating layer, the surface of the metal foil is mechanically or chemically treated by chemical roughening, corona discharge, sanding and plating, aluminum alcoholate, aluminum chelate, silane coupling agent, etc. May be given.
Examples of the insulating layer include resin sheets made of high molecular weight resins such as polyimide and polyester, epoxy resins, silicone resins, acrylic resins, and mixtures thereof. These insulating layers may contain various fillers.
In addition, the wiring board used in the method for manufacturing an electronic component of the present invention usually has components mounted on one side, and the components are various electronic components such as capacitors, resistors, semiconductors, and LED chips. is there.
さらに配線板としては、従来の芳香族ポリイミドのような非熱可塑性ポリイミドのフィルムを高分子絶縁フィルムとして用いた金属箔付フレキシブル基板、ポリイミドフィルム上に銅などの金属を蒸着やスパッタで成膜した配線板、熱成形可能な液晶ポリマーを使用した配線板などがあるが、特に、耐熱性に優れる点で、特開２００７−２７３８２９号公報、国際公開第０７／４９５０２号パンフレット、特開２００７−１６８１２３号公報に記載されている、エポキシ樹脂やアクリル樹脂等を用いた接着剤を用いないフレキシブル基板、あるいはフレキシブルプリント配線板が好ましい。 In addition, as a wiring board, a flexible substrate with a metal foil using a non-thermoplastic polyimide film such as a conventional aromatic polyimide as a polymer insulating film, a metal such as copper was deposited on the polyimide film by vapor deposition or sputtering. There are a wiring board, a wiring board using a thermoformable liquid crystal polymer, and the like. In particular, in terms of excellent heat resistance, JP 2007-273829 A, WO 07/49502 pamphlet, JP 2007-168123 A. The flexible substrate or the flexible printed wiring board which does not use the adhesive agent using an epoxy resin, an acrylic resin, etc. described in gazette gazette is preferable.
配線板を構成している絶縁層としては、例えば、機械特性や電気特性の観点から少なくとも１種がポリイミド樹脂またはポリイミド前駆体であることが好ましい。ポリイミド前駆体であるポリアミック酸は製造過程でポリイミドに変換される。また、樹脂フィルム前駆体を含む樹脂組成物としてエポキシ化合物、アクリル化合物、ジイソシアネート化合物、フェノール化合物等の硬化成分、フィラー、粒子、色材、レベリング剤、カップリング剤等の添加成分を任意に混合することも可能であるが、ポリイミド樹脂の含有量より多くの硬化成分、添加成分を加えることは特性を低下させる傾向にある。 As the insulating layer constituting the wiring board, for example, at least one kind is preferably a polyimide resin or a polyimide precursor from the viewpoint of mechanical characteristics and electrical characteristics. Polyamic acid, which is a polyimide precursor, is converted to polyimide during the production process. Also, as a resin composition containing a resin film precursor, additive components such as epoxy compounds, acrylic compounds, diisocyanate compounds, phenol compounds and other curing components, fillers, particles, coloring materials, leveling agents, coupling agents and the like are arbitrarily mixed. Although it is also possible, adding more curing components and additive components than the content of the polyimide resin tends to lower the properties.
通常、配線板の最外層には金属層が存在するが、その片面は回路を形成し、残る片面は熱伝達の向上のため、金属層を全面に残すことが好ましい。配線板の厚さは熱抵抗が小さく、軽量な点で、０．５ｍｍ以下が好ましい。
本発明で使用する、粘着層としては、配線板を筐体に強固に固定できるものであれば、特に制限はないが、膜厚が均一な点で両面粘着テープを使用することが好ましい。このような両面テープは粘着剤だけでも、基材を含んでいてもよいが、熱抵抗が低い点で基材を含まないほうが良い。粘着層としては、アクリルゴム、ウレタン樹脂、シリコーン樹脂等を主成分とする粘着剤からなる粘着剤層とが積層されたテープが挙げられる。
Usually, a metal layer is present in the outermost layer of the wiring board. However, it is preferable to leave a metal layer on the entire surface of one side to form a circuit and to improve heat transfer on the other side. The thickness of the wiring board is preferably 0.5 mm or less from the viewpoint of low thermal resistance and light weight.
The pressure-sensitive adhesive layer used in the present invention is not particularly limited as long as the wiring board can be firmly fixed to the housing, but it is preferable to use a double-sided pressure-sensitive adhesive tape in terms of uniform film thickness. Such a double-sided tape may contain only a pressure-sensitive adhesive or a substrate, but it is better not to include a substrate in terms of low thermal resistance. Examples of the adhesive layer include a tape in which an adhesive layer made of an adhesive mainly composed of acrylic rubber, urethane resin, silicone resin or the like is laminated.
本発明で使用する粘着層を形成する粘着剤（粘着剤層）は、一般的に、高分子量成分と、タッキファイヤ（粘着付与剤）と、その他添加物とからなる。
具体的には、高分子量成分として、ポリイミド、ポリスチレン、ポリエチレン、ポリエステル、ポリアミド、ブタジエンゴム、アクリルゴム、（メタ）アクリル樹脂、ウレタン樹脂、ポリフェニレンエーテル樹脂、ポリエーテルイミド樹脂、フェノキシ樹脂、変性ポリフェニレンエーテル樹脂、フェノキシ樹脂、ポリカーボネート及びそれらの混合物等が挙げられる。特に、官能性モノマを含む重量平均分子量が１０万以上である高分子量成分として、例えば、グリシジルアクリレート又はグリシジルメタクリレート等の官能性モノマを含有し、かつ重量平均分子量が１０万以上であるエポキシ基含有（メタ）アクリル共重合体等が好ましい。エポキシ基含有（メタ）アクリル共重合体としては、例えば、（メタ）アクリルエステル共重合体、アクリルゴム等を使用することができ、アクリルゴムがより好ましい。アクリルゴムは、アクリル酸エステルを主成分とし、主として、ブチルアクリレートとアクリロニトリル等の共重合体や、エチルアクリレートとアクリロニトリル等の共重合体等からなるゴムである。
粘着層の膜厚は、通常、５０μｍ以下であり、１〜５０μｍであることが好ましい。１μｍより薄いと粘着性が乏しくなる傾向があり、５０μｍより厚いと経済的でなくなる点で好ましくない。粘着層の厚さは柔軟性の観点から３〜４０μｍがより好ましく、特に好ましくは５〜２０μｍである。
The pressure-sensitive adhesive (pressure-sensitive adhesive layer) that forms the pressure-sensitive adhesive layer used in the present invention generally comprises a high molecular weight component, a tackifier (tackifier), and other additives.
Specifically, as a high molecular weight component, polyimide, polystyrene, polyethylene, polyester, polyamide, butadiene rubber, acrylic rubber, (meth) acrylic resin, urethane resin, polyphenylene ether resin, polyetherimide resin, phenoxy resin, modified polyphenylene ether Examples thereof include resins, phenoxy resins, polycarbonates, and mixtures thereof. In particular, as a high molecular weight component having a functional monomer and a weight average molecular weight of 100,000 or more, for example, containing a functional monomer such as glycidyl acrylate or glycidyl methacrylate and having an epoxy group having a weight average molecular weight of 100,000 or more A (meth) acrylic copolymer or the like is preferable. As the epoxy group-containing (meth) acrylic copolymer, for example, (meth) acrylic ester copolymer, acrylic rubber and the like can be used, and acrylic rubber is more preferable. The acrylic rubber is a rubber mainly composed of an acrylate ester and mainly composed of a copolymer such as butyl acrylate and acrylonitrile, a copolymer such as ethyl acrylate and acrylonitrile, or the like.
The thickness of the adhesive layer is usually 50 μm or less, and preferably 1 to 50 μm. If it is thinner than 1 μm, the tackiness tends to be poor, and if it is thicker than 50 μm, it is not preferable in that it is not economical. The thickness of the adhesive layer is more preferably from 3 to 40 μm, particularly preferably from 5 to 20 μm, from the viewpoint of flexibility.
前記粘着剤は、アクリル酸エステル共重合体を主成分とし、架橋剤により架橋されたものであることが好ましい。用いられる架橋剤としては、イソシアネート化合物、エポキシ樹脂、金属キレートなどが挙げられる。また、粘着剤中には粘着付与樹脂、老化防止剤、充填剤など各種添加剤を加えてもよい。
特に、アクリル酸エステル共重合体が耐熱性に優れる点で好ましい。これは、（メタ）アクリル酸エステル共重合体とこれと共重合可能な不飽和モノマを材料としてなる。
ここで、（メタ）アクリル酸エステル共重合体の（メタ）アクリル酸は、メタアクリル酸、アクリル酸およびそれらの混合物を意味する（（メタ）アクリレートも同様）。
（メタ）アクリル酸エステルの例としては、ｎ−ブチル（メタ）アクリレート、イソブチル（メタ）アクリレート、ｓｅｃ−ブチル（メタ）アクリレート、ｔｅｒｔ−ブチル（メタ）アクリレート、ペンチル（メタ）アクリレートなどが挙げられる。用いられるアクリル酸エステル共重合体の重量平均分子量は、特に制限されるものではないが、好ましくは３０万〜１２０万である。アクリル酸エステル共重合体の重量平均分子量が３０万未満では、通常の架橋剤配合量を添加した場合、粘着剤の凝集力が不足し実用に適さない場合が多い。架橋剤量を増量した場合は、接着特性が損なわれる。また、アクリル酸エステル共重合体の重量平均分子量が１２０万を超えて大きい場合も接着特性が損なわれる。より好ましくは、４０〜８０万である。アクリル酸エステル共重合体の重量平均分子量は、ゲルパーミエーションクロマトグラフィー法により測定し、標準ポリスチレン検量線より換算して得た値である。
The pressure-sensitive adhesive is preferably one having an acrylic ester copolymer as a main component and crosslinked with a crosslinking agent. Examples of the crosslinking agent used include isocyanate compounds, epoxy resins, and metal chelates. Moreover, you may add various additives, such as tackifying resin, anti-aging agent, a filler, in an adhesive.
In particular, an acrylate copolymer is preferable in terms of excellent heat resistance. This is made from a (meth) acrylic acid ester copolymer and an unsaturated monomer copolymerizable therewith.
Here, (meth) acrylic acid in the (meth) acrylic acid ester copolymer means methacrylic acid, acrylic acid and a mixture thereof (the same applies to (meth) acrylate).
Examples of (meth) acrylic acid esters include n-butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, and the like. . The weight average molecular weight of the acrylate copolymer used is not particularly limited, but is preferably 300,000 to 1,200,000. When the weight average molecular weight of the acrylate copolymer is less than 300,000, the addition of a normal crosslinking agent content often is not suitable for practical use because the cohesive force of the adhesive is insufficient. When the amount of the crosslinking agent is increased, the adhesive properties are impaired. Also, the adhesive properties are impaired when the weight average molecular weight of the acrylate copolymer exceeds 1.2 million. More preferably, it is 400,000 to 800,000. The weight average molecular weight of the acrylic ester copolymer is a value obtained by measuring by a gel permeation chromatography method and converting from a standard polystyrene calibration curve.
以下に、本発明に使用される配線板を製造する工程、及び、電子部品の製造方法の１例について述べる。
まず、配線板の片方の金属層を回路加工する。これには、印刷、フォトレジストフィルム等を使用し、金属箔（金属層）をエッチングすれば良い。
Hereinafter, an example of a process for producing a wiring board used in the present invention and a method for producing an electronic component will be described.
First, circuit processing is performed on one metal layer of the wiring board. For this, printing, a photoresist film or the like is used, and the metal foil (metal layer) may be etched.
次に、ソルダーレジストを回路面に形成し、さらに、配線板を必要な大きさに外形加工する。その後、部品を回路面に実装する。最後に、粘着層を介して、配線板を金属の筐体などに貼り付ける。 Next, a solder resist is formed on the circuit surface, and the outer shape of the wiring board is further processed to a required size. Thereafter, the component is mounted on the circuit surface. Finally, the wiring board is attached to a metal housing or the like via the adhesive layer.
配線板と筐体を貼り合せる粘着層は配線板側あるいは筐体側に予め貼り付けておくことが作業しやすい点で好ましい。部品などの凹凸がない点で、粘着層は筐体側に貼り付けるほうが容易であり、好ましい。なお、配線板側に粘着層を予め貼り付ける場合は、通常、部品が実装されていない面に貼り付ける。 The adhesive layer for bonding the wiring board and the housing is preferably pasted on the wiring board side or the housing side in terms of easy work. The adhesive layer is easier to attach to the housing side in terms of having no irregularities such as parts, which is preferable. In addition, when affixing an adhesive layer on the wiring board side in advance, it is usually affixed to a surface on which no components are mounted.
本発明では、部品実装した配線板の片面に粘着層を介して、筐体に接着する場合に、配線板の一方の端部を筐体から離した状態で、もう一方の端部から、部品のない部分を加圧し、接着することを特徴とする。片方の端部を離さないで貼り付けると、十分に貼り付けることができないため、貼り付け時に配線板、粘着層（例えば両面粘着テープ）、筐体の間に空隙が発生しやすい。なお、筐体としては、部品が発する熱を逃がす材料であれば、特に限定しない。例えば金属筐体、セラミック製筐体などが挙げられるが、取扱い性や熱を効率よく逃がす点から金属筐体が好ましい。
図１は、本発明の電子部品の製造方法を説明する模式図である。両面粘着テープ（粘着層）３を予め設けた筐体２に、配線板１の一方の端部を取り付け治具５により高さｈだけ筐体２から離した状態で、配線板１のもう一方の端部から、貼り付け治具４により取り付け治具５の配線板１の一方の端部に向けて、配線板１の部品のない部分を加圧し、配線板１の片面に、両面粘着テープ（粘着層）３を介して、筐体２に接着する。
In the present invention, when adhering to the housing via the adhesive layer on one side of the wiring board on which the component is mounted, the component is separated from the other end with one end of the wiring board being separated from the housing. It is characterized by pressurizing and adhering the part without any mark. If it is pasted without separating one end, it cannot be satisfactorily pasted, and a gap is likely to be generated between the wiring board, the adhesive layer (for example, double-sided adhesive tape), and the housing at the time of pasting. The casing is not particularly limited as long as it is a material that releases heat generated by the components. For example, a metal housing, a ceramic housing, and the like can be mentioned, but a metal housing is preferable from the viewpoint of efficient handling and heat release.
FIG. 1 is a schematic view illustrating a method for manufacturing an electronic component according to the present invention. The other side of the wiring board 1 with the double-sided adhesive tape (adhesive layer) 3 provided in advance in a state where one end of the wiring board 1 is separated from the casing 2 by a height h by the mounting jig 5. From one end of the wiring board 1, the part without the parts of the wiring board 1 is pressed toward one end of the wiring board 1 of the mounting jig 5 by the bonding jig 4, and a double-sided adhesive tape is applied to one side of the wiring board 1. (Adhesive layer) 3 is bonded to the housing 2 through the adhesive layer 3.
配線板の一方の端部を持ち上げて貼り付けると、空隙ができないように、また、空隙を押し出すように貼り付けることが可能となるため、貼り付け時に配線板、粘着層（例えば両面粘着テープ）、筐体の間に空隙が発生しにくい。ただし、一方を持ち上げた時の筐体からの高さｈが大きすぎると、貼り付け時に配線板が局部的に曲がり、部品の脱落などが起こる。従って、高さｈは貼り付けの進行と同時に徐々に筐体に近づけながら低減することが好ましい。
高さｈは、初期の持ち上げ高さをｈ０とすると、持ち上げ高さｈが貼り付け長ｘ、全長Ｌの関数としてｈがｘについて、下記式を満足するように行うことが好ましい。
０．５×ｈ０×（Ｌ−ｘ）／Ｌ≦ｈ±１≦１．５×ｈ０×（Ｌ−ｘ）／Ｌ
また、ｈは連続的に徐々に低減することが好ましい。初期の持ち上げ高さｈ０は作業性の観点から、１ｍｍから１０ｍｍが好ましい。また、ｘ＝Ｌのとき、すなわち、貼り付けが完了した時には、ｈはほぼ０になっていることが必要である。装置の誤差から、上述の式には、±１の誤差項を含んでいるが、誤差が小さいほど好ましい。
電子部品の作製工程により、配線板にかかる重力の向きは種々異なるので、配線板を高さｈに保つ治具（取り付け治具）は、図１のように上下左右に動かないように固定なものが好ましい。
When one end of the wiring board is lifted and pasted, it can be pasted so that there is no gap and the gap is pushed out, so the wiring board and adhesive layer (for example, double-sided adhesive tape) can be used when pasting , It is difficult for air gaps to occur between the casings. However, if the height h from the housing when one side is lifted is too large, the wiring board bends locally at the time of attachment, and parts may fall off. Therefore, it is preferable to reduce the height h while gradually approaching the housing as the pasting progresses.
The height h is preferably set so that the lift height h is affixing length x and h is x as a function of the total length L and the following formula is satisfied, where h 0 is the initial lifting height.
0.5 × h 0 × (L−x) /L≦h±1≦1.5×h 0 × (L−x) / L
Moreover, it is preferable that h is gradually reduced gradually. The initial lifting height h 0 is preferably 1 mm to 10 mm from the viewpoint of workability. Further, when x = L, that is, when the pasting is completed, h needs to be substantially zero. From the apparatus error, the above equation includes an error term of ± 1, but the smaller the error, the better.
Since the direction of gravity applied to the wiring board varies depending on the manufacturing process of the electronic component, the jig (mounting jig) for keeping the wiring board at the height h is fixed so as not to move up, down, left and right as shown in FIG. Those are preferred.
以下、実施例を挙げて本発明についてより具体的に説明する。ただし、本発明はこれら実施例に限定されるものではない。 Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples.
（実施例１）
日立化成工業株式会社製のアルミベース基板、ＭＣ−１１３Ｅ（商品名）の銅箔を回路加工し、その後、ソルダーレジストを所定箇所に印刷、硬化した。その後、幅：５ｍｍ、長さ：４００ｍｍに外形加工した後、ＬＥＤチップやコネクタを半田で実装し、配線板を作製した。その後、アルミ筐体に両面粘着テープ（粘着層）を貼り、セパレータを剥離した後、下記のようにして前記配線板を、アルミ筐体に貼り付けした。
貼り付け時に配線板の片方の端部を３ｍｍ浮かせた後、もう一方の端部からＬＥＤチップが実装されていない配線板部分を押しつけ、接着（固定）した。配線板の固定部の長さ（ｘ）ｍｍに対して、配線板の片方の端部を浮かせた高さ（ｈ）ｍｍを初期の３ｍｍから徐々に低減した。
高さ（ｈ）ｍｍは配線板の固定部の長さ（ｘ）ｍｍの関数として概ね下式のように変化させた。
ｈ＝３×（４００−ｘ）／４００
配線板と、筐体との間に空隙が発生しなかった。貼り付け後に、通電時のＬＥＤチップの温度を測定したところ、７５℃であった。
Example 1
Circuit processing was performed on an aluminum base substrate manufactured by Hitachi Chemical Co., Ltd., MC-113E (trade name) copper foil, and then a solder resist was printed and cured at a predetermined location. Thereafter, the outer shape was processed to a width of 5 mm and a length of 400 mm, and then an LED chip and a connector were mounted with solder to produce a wiring board. Thereafter, a double-sided pressure-sensitive adhesive tape (adhesive layer) was applied to the aluminum housing, the separator was peeled off, and the wiring board was attached to the aluminum housing as described below.
One end of the wiring board was lifted by 3 mm at the time of pasting, and then the wiring board portion on which the LED chip was not mounted was pressed and bonded (fixed) from the other end. The height (h) mm at which one end of the wiring board was lifted was gradually reduced from the initial 3 mm with respect to the length (x) mm of the fixed part of the wiring board.
The height (h) mm was changed approximately as the following equation as a function of the length (x) mm of the fixed portion of the wiring board.
h = 3 × (400−x) / 400
No gap was generated between the wiring board and the housing. It was 75 degreeC when the temperature of the LED chip at the time of electricity supply was measured after sticking.
（比較例１）
配線板貼り付け時に片方の端部を浮かせることなく、配線板を、アルミ筐体の両面粘着テープ（粘着層）に載せ、配線板の端部から押しつけて固定した他は、実施例１と同様に接着（固定）作業を行った。配線板と、筐体との間に空隙が発生した。貼り付け後に、通電時のＬＥＤチップの温度を測定したところ、８０℃であった。
(Comparative Example 1)
Example 1 except that the wiring board was placed on the double-sided adhesive tape (adhesive layer) of the aluminum housing and pressed from the end of the wiring board and fixed without lifting one end when the wiring board was attached. Bonding (fixing) work was performed. A gap was generated between the wiring board and the housing. After pasting, the temperature of the LED chip during energization was measured and found to be 80 ° C.
（比較例２）
貼り付け時に配線板の片方の端部を３ｍｍ浮かせた後、もう一方の端部からＬＥＤチップが実装されていない配線板部分を押しつけ、固定した。配線板の固定部の長さ（ｘ）ｍｍに対して、配線板の片方の端部を浮かせた高さ（ｈ）ｍｍを初期の３ｍｍまま固定した。
配線板は、配線板の固定部の長さが３５０ｍｍまでは良好に貼り付けされたが、３５０〜３９５ｍｍの間で変形し、浮きが残ったままになった。また、ＬＥＤチップの一部が脱落し、点灯試験を行えなかった。
(Comparative Example 2)
One end of the wiring board was lifted by 3 mm at the time of pasting, and then the wiring board portion on which the LED chip was not mounted was pressed and fixed from the other end. With respect to the length (x) mm of the fixing portion of the wiring board, the height (h) mm where one end of the wiring board was lifted was fixed at the initial 3 mm.
The wiring board was satisfactorily pasted up to 350 mm in the length of the fixing portion of the wiring board, but was deformed between 350 and 395 mm, and the floating remained. In addition, a part of the LED chip dropped out and the lighting test could not be performed.
実施例１に示すように、配線板の一方の端部を持ち上げて、貼り付けながら端部を徐々に筐体に近づける貼り付け方法では、空隙を押し出すように貼り付けることが可能となるため、配線板と、筐体との間に空隙が発生せず、ＬＥＤチップ（部品）が発する熱を効率よく、アルミ筐体に逃がすことができ、その結果、ＬＥＤチップ（部品）の上昇温度を低減できた。それに対し、比較例１では、配線板と、筐体との間に空隙が発生し、ＬＥＤチップ（部品）の上昇温度が大きく、また、比較例２では、ＬＥＤチップの一部が脱落するなど、問題があることがわかった。
以上の結果、本発明の電子部品の製造方法では、ＬＥＤチップの温度を大幅に低減できた。
As shown in Example 1, in the pasting method in which one end of the wiring board is lifted and the end is gradually brought closer to the housing while being pasted, it is possible to paste so as to push out the gap. There is no gap between the wiring board and the housing, and the heat generated by the LED chip (component) can be efficiently released to the aluminum housing, resulting in a reduction in the temperature rise of the LED chip (component). did it. On the other hand, in Comparative Example 1, a gap is generated between the wiring board and the housing, and the temperature rise of the LED chip (component) is large. In Comparative Example 2, a part of the LED chip is dropped. I found out there was a problem.
As a result, in the electronic component manufacturing method of the present invention, the temperature of the LED chip could be greatly reduced.
１：配線板、２：筐体、３：両面粘着テープ（粘着層）、４：貼り付け治具、５：取り付け治具、ｈ：持ち上げ高さ、ｘ：貼り付け長、Ｌ：両面粘着テープ（粘着層）の全長 1: Wiring board, 2: Housing, 3: Double-sided adhesive tape (adhesive layer), 4: Attaching jig, 5: Mounting jig, h: Lifting height, x: Attaching length, L: Double-sided adhesive tape Total length of (adhesive layer)
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6167823A (en) * | 1984-09-11 | 1986-04-08 | Sharp Corp | Production of liquid crystal display element |
| JPH0566841U (en) * | 1992-02-12 | 1993-09-03 | 株式会社小糸製作所 | Switch board |
| JPH11112172A (en) * | 1997-08-07 | 1999-04-23 | Robert Bosch Gmbh | Electric device provided with printed circuit board and junction method for the electric device |
| JP2002374062A (en) * | 2001-06-14 | 2002-12-26 | Fuji Photo Film Co Ltd | Fixation method for flexible printed-circuit board |
-
2010
- 2010-12-16 JP JP2010280685A patent/JP2012129410A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6167823A (en) * | 1984-09-11 | 1986-04-08 | Sharp Corp | Production of liquid crystal display element |
| JPH0566841U (en) * | 1992-02-12 | 1993-09-03 | 株式会社小糸製作所 | Switch board |
| JPH11112172A (en) * | 1997-08-07 | 1999-04-23 | Robert Bosch Gmbh | Electric device provided with printed circuit board and junction method for the electric device |
| JP2002374062A (en) * | 2001-06-14 | 2002-12-26 | Fuji Photo Film Co Ltd | Fixation method for flexible printed-circuit board |
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