JP2013197107A - Imprint device and article production method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique that is advantageous in achieving accuracy of a pattern imprinted onto a substrate and maintaining continuity in a plane of the substrate.SOLUTION: An imprint device includes: a plurality of detection parts 5a to 5h for detecting a first mark formed for a mold and a second mark formed on a substrate 1 so as to correspond to the first mark; and a control part for controlling imprint processing, wherein the control part positions the plurality of detection parts 5a to 5h so that the plurality of detection parts 5a to 5h each detect the first mark and the second mark, aligns the mold and the substrate 1 on the basis of results of the detection of the first mark and the second mark by the plurality of detection parts 5a to 5h, drives, prior to irradiation of a resin with light, a first detection part, out of the plurality of detection parts 5a to 5h, which is positioned on an optical path of the light so that the first detection part is retracted from the optical path of the light, and aligns the mold and the substrate 1 on the basis of the result of the detection of the first mark and the second mark by a second detection part, out of the plurality of detection parts 5a to 5h, which is other than the first detection part.

Description

  The present invention relates to an imprint apparatus and an article manufacturing method.

  The imprint technique is a technique that enables transfer of a nanoscale fine pattern, and is known as a nanolithography technique for mass production of semiconductor devices and magnetic storage media. An imprint apparatus using an imprint technique transfers a pattern onto a substrate by curing the resin while pressing a mold (mold) on which the pattern is formed on the resin (imprint material) on the substrate.

  The photo-curing method, which is one of the methods for curing the resin on the substrate, irradiates the ultraviolet light in a state where the ultraviolet light-curing resin and the transparent mold are in contact with each other, and then cures the resin. Peel (release). The photocuring method is suitable for manufacturing a semiconductor device and a magnetic storage medium because the temperature can be controlled relatively easily and an alignment mark formed on the substrate can be detected through a transparent mold.

  In the imprint apparatus, a die-by-die alignment method is employed as an alignment (positioning) method between the mold and the substrate. The die-by-die alignment method is an alignment method in which, for each of a plurality of shot regions on a substrate, an alignment mark formed in the shot region is optically detected to correct a positional deviation between the mold and the substrate. . In the die-by-die alignment method, several techniques related to a detection device (scope) for optically detecting an alignment mark formed in a shot region have been proposed (see Patent Documents 1 and 2). Such a scope is disposed at an angle with respect to the substrate in order to avoid interference with light (for example, ultraviolet light) for curing the resin on the substrate.

  In the imprint apparatus, from the viewpoint of the continuity in the substrate surface for the yield and the subsequent process even for the shot area near the edge of the substrate, that is, the missing shot area where the entire pattern of the mold cannot be transferred. It is necessary to perform imprint processing. The alignment marks are generally formed at the four corners around each of a plurality of chip areas included in the shot area. Of these alignment marks, the scope detects alignment marks located at the four corners around the shot area. However, in the missing shot area, the alignment marks are not always present at all the four corners around the missing shot area. Therefore, when imprint processing is performed on the missing shot area, it is necessary to drive the scope so that alignment marks formed on the chip area included in the missing shot area can be detected.

US Patent Application Publication No. 2007/0231421 US Patent Application Publication No. 2010/0110434

  In the imprint apparatus, during the imprint process, the positional relationship between the mold and the substrate may be shifted until the resin on the substrate is cured. Need to continue. Therefore, in the chipped shot area, the scope driven according to the chip area interferes with the light for curing the resin, and the resin on the chipped shot area is not irradiated with light, and the resin is not cured. . As a result, it becomes difficult to perform uniform processing on the substrate in a process (for example, etching) after pattern transfer, which causes a decrease in yield of the entire substrate.

  The present invention has been made in view of such problems of the prior art, and an exemplary object thereof is to provide an advantageous technique for maintaining the accuracy of a pattern transferred onto a substrate and the continuity within the substrate surface. To do.

  In order to achieve the above object, an imprint apparatus according to one aspect of the present invention cures the resin by irradiating the resin with light in a state where the resin on the substrate is in contact with the mold. An imprint apparatus that performs an imprint process for transferring a pattern to the substrate, the first mark formed on the mold, and the second mark formed on the substrate corresponding to the first mark; And a control unit that controls the imprint process, wherein the control unit detects the first mark and the second mark, respectively. And positioning the mold and the substrate on the basis of the detection results of detecting the first mark and the second mark by the plurality of detection units. Before irradiating light, among the plurality of detection units, the first detection unit is driven so as to retract a first detection unit located on the optical path of the light from the optical path of the light, and the plurality Among the detection units, the mold and the substrate are aligned based on a detection result obtained by detecting the first mark and the second mark by the second detection unit excluding the first detection unit. And

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, a technique advantageous in maintaining the accuracy of a pattern transferred onto a substrate and the continuity within the substrate surface is provided.

It is the schematic which shows the structure of the imprint apparatus as 1 side surface of this invention. It is a figure for demonstrating the detection principle of the relative position of two marks using a moire pattern. It is the schematic which shows the structure of the correction | amendment mechanism of the imprint apparatus shown in FIG. It is a figure which shows the positional relationship of a board | substrate (substrate side alignment mark), a mold (mold side alignment mark), and a some detection part. 3 is a flowchart for explaining imprint processing in the imprint apparatus shown in FIG. 1.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.

  FIG. 1 is a schematic diagram illustrating a configuration of an imprint apparatus 100 according to one aspect of the present invention. The imprint apparatus 100 is a lithographic apparatus used in the manufacturing process of semiconductor devices and magnetic storage media. The imprint apparatus 100 cures the resin in a state where the resin (imprint material) on the substrate and the mold (mold) are in contact with each other, and peels (releases) the mold from the cured resin. An imprint process is performed to transfer the pattern. The imprint apparatus 100 employs a photocuring method in which resin (ultraviolet light curable resin in the present embodiment) is irradiated with light (ultraviolet light in the present embodiment) to cure the resin.

  The imprint apparatus 100 includes a substrate stage 2 that moves while holding the substrate 1, a head 4 that moves while holding the mold 3, a plurality of detection units 5, a correction mechanism 8, a light source 9, and a control unit 10. And have. The imprint apparatus 100 also includes a dispenser for supplying (coating) an ultraviolet light curable resin onto the substrate 1, a bridge surface plate for supporting the head 4, and a base surface for supporting the substrate stage 2. It also has a board.

  In the present embodiment, a dispenser is configured in the imprint apparatus assuming a highly volatile resin that is currently generally used in imprint. However, if the resin has low volatility, the resin can be applied to the entire surface of the substrate by spin coating or the like in advance, so that it is not necessary to configure a dispenser in the imprint apparatus.

  The substrate 1 is a substrate onto which the pattern of the mold 3 is transferred, and includes, for example, a single crystal silicon wafer, an SOI (Silicon on Insulator) wafer, or the like. Resin is supplied to the substrate 1. In addition, an alignment mark (second mark) 6 on the substrate side is formed in each of a plurality of shot regions on the substrate 1, specifically, in each of a plurality of chip regions included in each of the shot regions. .

  The substrate stage 2 includes a drive system such as a substrate chuck or an actuator that vacuum-adsorbs or electrostatically attracts the substrate 1, and at least the X-axis direction and the Y-axis direction (imprinting when the mold 3 is imprinted on the resin on the substrate 1 In a direction perpendicular to the direction). Further, the substrate stage 2 may move not only in the X-axis direction and the Y-axis direction but also in the Z-axis direction and the θ (rotation around the Z-axis) direction.

  The mold 3 has a pattern surface 3a on which a pattern to be transferred to the substrate 1 (resin on it) is formed in a three-dimensional shape. The mold 3 is made of a material (for example, quartz) that transmits light (ultraviolet light) from the light source 9. Further, on the mold 3, specifically, on the pattern surface 3 a, a mold side alignment mark (first mark) 7 is formed corresponding to the substrate side alignment mark 6.

  The head 4 includes a drive system such as a mold chuck or an actuator for vacuum-adsorbing or electrostatically adsorbing the mold 3 and moves at least in the Z-axis direction (imprinting direction of the mold 3). Further, the head 4 may move not only in the Z-axis direction but also in the X-axis direction, the Y-axis direction, and the θ (rotation around the Z-axis) direction.

  The detection unit 5 detects a relative position between the alignment mark 6 on the substrate side and the alignment mark 7 on the mold side and a shape difference between the substrate 1 (on the upper shot region) and the mold 3 (the pattern surface 3a thereof). It has a function.

  In the present embodiment, the detection unit 5 is configured by a scope that detects a moire pattern (moire fringes) formed by bringing the alignment mark 6 and the alignment mark 7 close to each other. In order to avoid interference with light from the light source 9, the detection unit 5 is disposed on the head 4 with an angle (that is, inclined) with respect to the substrate 1. Note that the configuration for avoiding interference with light from the light source 9 is not limited to this. For example, it is possible to avoid interference with light from the light source 9 by arranging a mirror at the tip of the scope. The detection unit 5 is configured to be drivable by a drive system such as an actuator.

  With reference to FIG. 2, the principle of detecting the relative positions of two marks (alignment marks 6 and 7) using a moire pattern will be described. FIGS. 2A and 2B show two types of lattice marks with different pitches. In this embodiment, these lattice marks are used as alignment marks 6 and 7. When the lattice mark shown in FIG. 2A and the lattice mark shown in FIG. 2B are overlapped, a bright and dark stripe pattern, that is, a moire pattern is formed as shown in FIG. In the moire pattern, the position of the bright and dark stripes changes depending on the relative positional relationship between the two types of lattice marks. For example, when one of the two types of lattice marks is slightly shifted to the right, the moire pattern shown in FIG. 2C changes to the moire pattern shown in FIG. Since the moiré pattern is a bright and dark stripe in which the actual amount of deviation between the two types of grid marks is enlarged, even if the resolution of the detection unit 5 (the scope that constitutes it) is low, the relative relationship between the two types of grid marks The positional relationship can be detected with high accuracy.

  In the present embodiment, the detection unit 5 detects the relative positions of the alignment mark 6 and the alignment mark 7 from the moire pattern, but is not limited to this, and the alignment mark 6 and the alignment mark 7 It is only necessary that the relative position of can be detected. For example, the detection unit 5 detects the relative positions of the alignment marks 6 and 7 by detecting the images of the alignment marks 6 and 7 simultaneously in the same field of view or by separately detecting the images of the alignment marks 6 and 7. You may ask for it.

  The correction mechanism 8 applies a force to the mold 3 in a direction parallel to the pattern surface 3a to deform the pattern surface 3a (its shape). For example, as shown in FIG. 3, the correction mechanism 8 drives the suction portion 8a that sucks the side surface of the pattern surface 3a, and the direction toward the side surface of the pattern surface 3a and the direction away from the side surface of the pattern surface 3a. And an actuator 8b. However, the correction mechanism 8 may change the pattern surface 3a or the substrate-side shot shape by applying heat to the mold 3 or the substrate 1 (that is, by changing the temperature of the mold 3 or the substrate 1).

  Here, the correction mechanism 8 has been described in which the side surface of the mold 3 is adsorbed by the adsorbing portion 8 a, but the adsorbing portion 8 a may not adsorb the mold 3. For example, the suction part 8a may be brought into contact with the mold 3 and function as a supporting member. In this case, the pattern surface 3a is made larger and the side surface of the mold 3 is pressed by the correction mechanism 8 to deform the pattern surface 3a.

  The light source 9 is a light source that generates light for curing the resin on the substrate 1, in the present embodiment, ultraviolet light. The ultraviolet light generated by the light source 9 is irradiated to the resin through the mold 3 in a state where the resin on the substrate 1 and the mold 3 are in contact with each other.

  The control unit 10 includes a CPU, a memory, and the like, and controls the entire imprint apparatus 100 (each part of the imprint apparatus 100). In the present embodiment, the control unit 10 controls imprint processing and related processing. For example, when the imprint process is performed, the control unit 10 drives the substrate stage 2 or the head 4 in the XY directions based on the detection result of the detection unit 5 to align the mold 3 and the substrate 1 (alignment). )I do. Further, the control unit 10 controls the deformation amount of the pattern surface 3a of the mold 3 by the correction mechanism 8 when performing the imprint process. Specifically, the control unit 10 determines the deformation amount necessary for the pattern surface 3a according to the relationship between the drive amount of the actuator 8b acquired in advance and the deformation amount of the pattern surface 3a, and the detection result of the detection unit 5. The actuator 8b is driven based on the deformation amount. Thereby, it is possible to correct a shape such as a magnification, a trapezoidal deformation, a twist, or the like (a positional deviation caused by the shape of the mold 3), which is a typical shape difference between the substrate 1 and the mold 3.

  The detection of the substrate-side alignment mark 6 and the mold-side alignment mark 7 by the detection unit 5 will be described. FIG. 4 is a diagram illustrating a positional relationship between the substrate 1 (substrate-side alignment mark 6), the mold 3 (mold-side alignment mark 7), and the plurality of detection units 5a to 5h.

  4A shows a shot region SRa located near the center of the substrate 1, that is, the substrate in the shot region SRa to which the entire pattern of the mold 3 can be transferred, the mold 3, and a plurality of detection units 5a to 5h. It is a figure which shows these positional relationships. The shot region SRa includes six chip regions CRa to CRf, and an alignment mark 6 on the substrate side is formed around each of the chip regions CRa to CRf. Further, as described above, the mold 3 has the mold-side alignment marks 7 corresponding to the substrate-side alignment marks 6 formed around the chip regions CRa to CRf. In FIG. 4A, black marks indicate alignment marks 6 and 7 whose relative positions are detectable.

  In order to obtain the shape difference between the substrate 1 (the upper shot region SRa) and the mold 3 (the pattern surface 3a), the detection unit 5 needs to detect the relative positions of the plurality of alignment marks. . In order to obtain a shape difference between the substrate 1 and the mold 3 with high accuracy, it is better to measure a plurality of marks arranged as far as possible. Therefore, the detection unit 5 may detect an alignment mark formed on the edge side of the substrate 1 (the outermost peripheral side of the shot region). In the present embodiment, as shown in FIG. 4A, in the X-axis direction, relative positions at four points (relative positions between the alignment mark 6 and the alignment mark 7) are detected units 5a and 5b. 5e and 5f shall be detected. In the Y-axis direction, the relative positions at the four points are detected by the detection units 5c, 5d, 5g, and 5h. For example, when the relative positions at 8 points (4 points in the X-axis direction and 4 points in the Y-axis direction) are shifted toward the outside of the shot region SRa, between the substrate 1 and the mold 3 Is a difference in magnification.

  FIG. 4B is a diagram illustrating a positional relationship between the substrate, the mold 3, and the plurality of detection units 5a to 5h in the chipped shot region SRb located in the vicinity of the edge of the substrate 1. The missing shot region SRb is a shot region in which the entire pattern of the mold 3 cannot be transferred (only a part of the pattern of the mold 3 can be transferred). Considering the yield of the entire substrate, if even one chip shot area includes a chip area, it is necessary to perform imprint processing on the chip shot area in order to improve the yield. In addition, if imprint processing is not performed on the missing shot area, the continuity of the pattern (cured resin) is lost in the process after pattern transfer such as etching, which affects other shot areas. End up. For this reason, it is necessary to perform imprint processing even if all the chips in the shot area cannot be obtained.

  The chipped shot region SRb shown in FIG. 4B includes only one chip region CRe as an effective chip region, and the other chip regions CRa, CRb, CRc, CRd, and CRf are not effective chip regions. In FIG. 4B, the white mark indicates the mold-side alignment mark 7 whose relative position cannot be detected (that is, only the mold-side alignment mark 7 exists). Show. In such a case, the detection units 5a, 5b, 5c, 5d, 5e, and 5h detect the relative positions of the alignment marks formed on the outermost periphery of the shot area, as shown in FIG. Is impossible to do. Therefore, as shown in FIG. 4C, the detection units 5a, 5b, 5c, 5d, 5e, and 5h detect the relative positions of the alignment marks (marks shown in black). 5b, 5c, 5d, 5e and 5h need to be driven (positioned). Here, each of the detection units 5a, 5b, 5c, 5d, 5e, and 5h may detect an alignment mark inside the shot area closest to the outermost periphery of the shot area.

  Since the alignment mark that can be measured changes depending on the relationship between the position of each shot area and the edge of the substrate 1 over the shot area, the scope drive amount to be driven differs for each missing shot (edge shot) area.

  Here, in the state shown in FIG. 4C, a case is considered in which the pattern of the mold 3 is transferred by irradiating the ultraviolet light from the light source 9 to the chipped shot region SRb (resin on top) to cure the resin. At this time, the detection units 5 a, 5 b, 5 c, and 5 d are located on the optical path of the ultraviolet light from the light source 9. Since the detectors 5a, 5b, 5c, and 5d located on the optical path of the ultraviolet light interfere with the ultraviolet light, it becomes an obstacle to the curing of the resin due to the irradiation of the ultraviolet light. Therefore, if ultraviolet light is irradiated as it is, the resin located under the four detection units 5a, 5b, 5c, and 5d is not sufficiently irradiated with ultraviolet light, and the resin is not cured. As a result, when the mold 3 is peeled from the resin on the substrate 1, there is a concern that uncured resin (uncured resin) remains in the mold 3 and contaminates the substrate 1 and the apparatus. In addition, since the continuity of the pattern (cured resin) is lost, there is a concern that other shot areas may be affected in the process after pattern transfer.

  Therefore, in the present embodiment, as shown in FIG. 4D, before the missing shot region SRb is irradiated with ultraviolet light, the detection units 5a to 5d located on the optical path of the ultraviolet light are moved from the optical path of the ultraviolet light. The detection units 5a to 5d are driven so as to be retracted (removed). Moreover, detection of the relative position of the alignment mark by the detection units 5e to 5h except for the detection units 5a to 5d among the detection units 5a to 5h is continued, and the mold 3 and the substrate 1 are detected based on the detection result. Continue alignment. As a result, it is possible to prevent the occurrence of uncured resin in the chipped shot region while suppressing a decrease in alignment accuracy between the mold 3 and the substrate 1.

  The imprint process in the imprint apparatus 100 will be described with reference to FIG. As described above, the imprint process is performed by the control unit 10 controlling the respective units of the imprint apparatus 100 in an integrated manner. Here, an imprint process for a missing shot area will be described as an example. Whether or not the shot area to be imprinted is a missing shot area can be recognized from the position of the substrate 1 (substrate stage 2), layout information indicating the arrangement of shot areas on the substrate 1, and the like.

  In step S <b> 502, the substrate stage 2 is driven so that the missing shot area that has not been subjected to the imprint process is disposed at a position facing the pattern surface 3 a of the mold 3 (an imprint position of the mold 3). Note that an ultraviolet light curable resin is applied to the chipped shot region.

  In step S <b> 504, the detection unit 5 is driven according to the positional relationship between the substrate side alignment mark 6 and the mold side alignment mark 7, and each of the plurality of detection units 5 has a relative relationship between the alignment mark 6 and the alignment mark 7. The detection unit 5 is positioned so as to detect the position. Specifically, as shown in FIG. 4C, the plurality of detection units 5 are positioned. As described above, in order to obtain a shape difference between the substrate 1 and the mold 3 with high accuracy, it is preferable to detect an alignment mark formed on the outer peripheral side of the shot region. However, in S504, the plurality of detection units 5 may be positioned so as to detect the alignment marks 6 and 7 whose relative positions are detectable.

  In S506, the relative positions of the substrate-side alignment mark 6 and the mold-side alignment mark 7 are detected by each of the plurality of detection units 5 positioned in S504 (detection of alignment marks by the plurality of detection units 5). To start).

  In S508, the shape difference between the mold 3 and the substrate 1 is reduced or aligned based on the relative position between the alignment mark 6 on the substrate side detected in S506 and the alignment mark 7 on the mold side. Specifically, the results of detection by the plurality of detection units 5 are processed to determine the shape difference between the substrate 1 and the mold 3, and the correction mechanism 8 reduces the pattern surface 3a of the mold 3 so that the shape difference is reduced. Deform. In addition, the relative position is adjusted by shifting the substrate 1 or the mold 3.

  The plurality of detection units 5 positioned in S504 include a first detection unit (detection units 5a to 5d in FIG. 4C) positioned on the optical path of the ultraviolet light that irradiates the resin, and an ultraviolet light that irradiates the resin. 2nd detection part (detection parts 5e-5h in Drawing 4 (c)) located outside an optical path. In the present embodiment, the process of S510 is performed for the first detection unit, and the process of S512 is performed for the second detection unit.

  In S510, the first detection unit is driven so that the first detection unit located on the optical path of the ultraviolet light that irradiates the resin is retracted from the optical path of the ultraviolet light. At this time, the detection of the alignment mark by the first detection unit is stopped. In S512, detection of the relative position between the alignment mark 6 on the substrate side and the alignment mark 7 on the mold side is continued by the second detection unit located outside the optical path of the ultraviolet light applied to the resin.

  In S514, the resin applied to the chipped shot region on the substrate 1 is brought into contact with the pattern surface 3a of the mold 3, and in this state, the resin is irradiated with ultraviolet light from the light source 9.

  In S514, when the ultraviolet light is irradiated, the first detection unit driven in S510 may be completely retracted to the outside of the ultraviolet light path (for example, outside the shot region) (FIG. 4D). )), It may be kept to the edge position of the missing shot area. When the first detection unit irradiates the ultraviolet light after completely retracting outside the optical path of the ultraviolet light, the ultraviolet light from the light source 9 and the first detection unit do not interfere with each other. There is no need to worry about damage to the detector. However, there is a possibility that the drive time for retracting the first detection unit becomes longer. On the other hand, in the case where the drive of the first detection unit is limited to the retreat to the edge position of the missing shot region, the drive time for retracting the first detection unit can be shortened, but the ultraviolet light from the light source 9 can be reduced. There is a possibility of interference with the first detection unit. In such a case, a coating for reducing (preventing) scattering of ultraviolet light and damage to the detection unit may be applied to the detection unit 5.

  In addition, when the allowable irradiation amount (dose amount) of ultraviolet light applied to the resin on the chipped shot region of the substrate 1 is large, before the driving of the first detection unit is finished, that is, the first detection unit is You may irradiate with ultraviolet light while driving. In this case, a part of the irradiation amount of the ultraviolet light irradiated to the resin on the chipped shot region is caused by the influence of the first detection unit. However, the reason for irradiating the resin on the region other than the chip region (effective chip region) included in the chipped shot region is to maintain the continuity of the pattern (cured resin) as described above. belongs to. Therefore, since the irradiation amount of the ultraviolet light to be applied to the resin on the region other than the chip region may be smaller than the irradiation amount of the ultraviolet light to be applied to the resin on the chip region, the driving of the first detection unit is performed. When starting, it becomes possible to irradiate with ultraviolet light.

  The extent to which the first detection unit is retracted, the irradiation of ultraviolet light after the driving of the first detection unit is completed, the irradiation of ultraviolet light when the driving of the first detection unit is started, and the like are transferred to the substrate 1 What is necessary is just to determine suitably according to the precision, productivity, etc. of the pattern which should be performed.

  In S514, when the ultraviolet light is irradiated, the mold 3 and the substrate 1 are detected based on the detection result of the relative positions of the substrate-side alignment mark 6 and the mold-side alignment mark 7 by the second detection unit. Alignment with is continued. In order to obtain the shape difference between the substrate 1 and the mold 3, it is necessary to detect a number of alignment marks formed around the shot region. However, when only the relative position (shift component) between the substrate 1 and the mold 3 is obtained, it is sufficient to detect a small number of alignment marks. Therefore, even if the first detection unit located on the optical path of the ultraviolet light that irradiates the resin is withdrawn, the detection by the second detection unit is continued to reduce the accuracy of alignment between the mold 3 and the substrate 1. It is possible to prevent.

  In S516, the mold 3 is peeled from the resin cured by the irradiation with ultraviolet light.

  As described above, in the imprint apparatus 100 according to the present embodiment, before irradiating the ultraviolet light, the detection unit located on the optical path of the ultraviolet light is retracted outside the optical path of the ultraviolet light, and is located outside the optical path of the ultraviolet light. The alignment of the mold 3 and the substrate 1 is continued using the detection unit. Accordingly, the imprint apparatus 100 prevents the occurrence of uncured resin in the chipped shot region while maintaining the accuracy in alignment between the mold 3 and the substrate 1 (maintaining the continuity of the pattern (cured resin)). )be able to.

  If the relative positions of the substrate 1 and the mold 3 are not maintained even when the resin is cured and the substrate 1 and the mold 3 are released, the transferred pattern is released while destroying the transferred pattern. Therefore, if it is necessary to measure the relative position at the time of mold release, the measurement may be continued up to that point, and the mold may be released while performing stage control based on the result.

  In this embodiment, the imprint process for the missing shot area has been described as an example. However, the present invention can also be applied to a shot area located near the center of the substrate. For example, in a shot region located near the center of the substrate, an alignment mark (that is, an alignment mark to be detected) formed on the outer periphery of the shot region may not be detected due to a structural defect or the like. In such a case, it is conceivable to detect an alignment mark formed on a scribe line inside the shot area instead of the alignment mark formed on the outer periphery of the shot area. At this time, the plurality of detection units must be positioned (driven) so that each of the plurality of detection units can detect the alignment mark formed on the scribe line inside the shot region. Accordingly, there is a possibility that the detection unit is positioned on the optical path of the ultraviolet light as in the case of performing the imprint process on the missing shot region.

  Therefore, also when performing imprint processing on such a shot region, as described above, after aligning the mold and the substrate based on the detection results of all the detection units, before irradiating with ultraviolet light. The detection unit located on the ultraviolet light path is retracted outside the ultraviolet light path. However, in this case, since all of the chip areas included in the shot area are effective chip areas, the detection unit located on the ultraviolet light path is completely outside the ultraviolet light path, that is, outside the shot area. It is necessary to irradiate with ultraviolet light after evacuation. The detection by the detection unit located outside the optical path of the ultraviolet light is continued until the irradiation of the ultraviolet light is completed, that is, until the curing of the resin is completed, and the position of the mold and the substrate is determined using the result of the detection. Continue matching.

  As described above, even when the alignment mark formed on the outer periphery of the shot area cannot be detected, the alignment mark formed inside the shot area is detected to prevent the accuracy of alignment between the mold and the substrate from being lowered. be able to. Further, by evacuating the detection unit positioned on the optical path of the ultraviolet light before irradiating the ultraviolet light, it is possible to prevent generation of uncured resin in the shot area.

  As described above, since the imprint apparatus 100 can maintain the continuity of the pattern while suppressing a decrease in alignment accuracy between the mold and the substrate, the high-quality semiconductor device with high throughput and high cost efficiency. Articles such as can be provided. A method for manufacturing a device (semiconductor device, magnetic storage medium, liquid crystal display element, etc.) as an article will be described. Such a manufacturing method includes a step of transferring (forming) a pattern onto a substrate (wafer, glass plate, film-like substrate, etc.) using the imprint apparatus 100. The manufacturing method further includes a step of etching the substrate on which the pattern is transferred. In addition, when manufacturing other articles, such as a pattern dot media (recording medium) and an optical element, this manufacturing method includes the other process step which processes the board | substrate with which the pattern was transferred instead of an etching step. .

  As mentioned above, although preferable embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

Claims (7)

An imprint apparatus that performs an imprint process for transferring a pattern to the substrate by irradiating the resin with light and curing the resin in a state where the resin on the substrate is in contact with the mold,
A plurality of detection units for detecting a first mark formed on the mold and a second mark formed on the substrate corresponding to the first mark;
A control unit for controlling the imprint process,
The controller is
The plurality of detection units are positioned so that each of the plurality of detection units detects the first mark and the second mark, and the plurality of detection units detect the first mark and the second mark. Based on the detected result, the mold and the substrate are aligned,
Before irradiating the resin with the light, the first detection unit is driven so that the first detection unit located on the optical path of the light out of the plurality of detection units is retracted from the optical path of the light. ,
The mold and the substrate are aligned based on a detection result of detecting the first mark and the second mark by a second detection unit other than the first detection unit among the plurality of detection units. An imprint apparatus characterized by the above.   2. The imprint apparatus according to claim 1, wherein the control unit irradiates the resin with the light when driving of the first detection unit is completed.   2. The imprint apparatus according to claim 1, wherein the controller irradiates the resin with the light when driving of the first detection unit is started. An imprint apparatus that performs an imprint process for transferring a pattern to the substrate by irradiating the resin with light and curing the resin in a state where the resin on the substrate is in contact with the mold,
A plurality of detection units for detecting a first mark formed on the mold and a second mark formed on the substrate corresponding to the first mark;
A control unit for controlling the imprint process,
The controller is
Among the plurality of detection units, a first detection unit that cannot detect the first mark on the outermost periphery of the shot region formed on the mold and the second mark corresponding to the first mark on the outermost periphery is provided on the mold. Positioning is performed so as to detect a first mark inside the formed shot region and a second mark corresponding to the first mark inside the shot area, and the plurality of detection units cause the first mark and the second mark to be detected. Based on the detection result detected, the mold and the substrate are aligned,
Stop detecting the mark by the first detection unit;
The mold and the substrate are aligned based on a detection result of detecting the first mark and the second mark by a second detection unit other than the first detection unit among the plurality of detection units. An imprint apparatus characterized by the above.   5. The first detection unit detects a first mark inside the shot area closest to the outermost periphery of the shot area and a second mark corresponding to the first mark inside the shot area. The imprint apparatus described in 1.   The said control part stops detection of the mark by the said 1st detection part, and after evacuating the said 1st detection part from the optical path of the said light, it irradiates the said light to the said resin, It is characterized by the above-mentioned. 5. The imprint apparatus according to 4. Transferring the pattern onto the substrate using the imprint apparatus according to any one of claims 1 to 6;
Processing the substrate to which the pattern is transferred;
A method for producing an article comprising: