JP2013193449A - Method of molding thermoplastic resin product and molding apparatus for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of molding a thermoplastic resin product and a molding apparatus for the same, capable of improving productivity and quality.SOLUTION: A molding apparatus 1 includes a heating device 2, a stamper 3, a cooling member 4, a first die 5 having a structure which movably retains the stamper 3 and allows the stamper 3 and the cooling member 4 to contact with each other and separate from each other, and a second die 6, wherein the stamper 3 is subjected to radiational heating while separated from the cooling member 4.

Description

  The present invention relates to a method for molding a thermoplastic resin product and a molding apparatus therefor, and more particularly to a method for molding a thermoplastic resin product and a molding apparatus therefor that can improve productivity and quality.

  Establishing technology for accurately transferring fine patterns (structures) to plastic molded products in microchemical chips, microfluidic devices, light guide plates, Fresnel lenses, optical discs and optical elements, and technology for improving the transfer productivity Etc., and various technologies have been proposed.

  For example, in Patent Document 1, a base material made of a plastic material having a transfer surface is prepared, the base material is fixed with the transfer surface exposed, and at least part of the stamper is made of an infrared transmitting material. A technique of a plastic molding method is disclosed in which a surface is held in close contact with a transfer surface of a base material, and infrared rays are irradiated in a direction of the base material with respect to a stamper.

Patent Document 2 discloses a technique of a hot press molding method in which a desired pattern is transferred to the surface of a thermoplastic resin plate by hot press molding.
This technology arranges a heating plate with a stamper with a pattern on the side facing the thermoplastic resin plate between the cooling plate and the thermoplastic resin plate attached to the press machine, so that high frequency induction is performed prior to the press operation. The stamper and the heating plate are heated to a first predetermined temperature that exceeds the softening temperature of the thermoplastic resin plate by heating, and then the stamper is pressed against the surface of the thermoplastic resin plate by a pressing operation so that the pattern is applied to the surface of the thermoplastic resin plate. The heating plate and the stamper are cooled to a second predetermined temperature lower than the softening temperature by the cooling plate while the stamper is pressed against the thermoplastic resin plate.

JP 2001-158044 A JP 2006-255900 A

However, the plastic molding method described in Patent Document 1 described above has a poor temperature distribution of the stamper, and requires a long heating time in order to raise the entire molding surface to a moldable temperature. Since cooling time is required, there is a problem that the molding cycle becomes long and productivity cannot be improved.
In the hot press molding method described in Patent Document 2 described above, the stamper and the heating plate are heated by high-frequency induction heating. However, in high-frequency induction heating, the temperature distribution of the stamper is poor and uniform heating is performed. Therefore, a long heating time is required, and heating during molding (pressing) is not possible. Therefore, it is necessary to heat the heating plate, which increases the heating time and the cooling time, thereby improving productivity. There was a problem that I could not.
Furthermore, the techniques of Patent Documents 1 and 2 have a problem in that appearance defects of a molded product occur when cooling after transfer is insufficient.

  The present invention has been proposed to solve the above-described problems, and an object of the present invention is to provide a method for molding a thermoplastic resin product and a molding apparatus thereof that can improve productivity and quality.

  In order to achieve the above object, the method for molding a thermoplastic resin product of the present invention includes a heating step in which infrared rays irradiated from a heating device radiately heat a stamper in a state separated from a cooling member, and the radiantly heated stamper. A transfer step of transferring the structure of the shaping surface to the transfer surface of the thermoplastic resin, and the cooling member in contact with the stamper in a state where the shaping surface is pressed against the transfer surface, cools the stamper, The method includes a cooling step for solidifying or curing the thermoplastic resin, and a releasing step for releasing the molded product by releasing the pressed state.

  The thermoplastic resin product molding apparatus of the present invention includes a heating device that performs infrared radiant heating using a light source, a stamper that is radiantly heated by infrared rays emitted from the light source, and a contact with the radiantly heated stamper. A cooling member that cools the stamper, and a structure that holds the stamper and / or the cooling member in a movable manner so that the stamper and the cooling member can be brought into contact with or separated from each other. And a second mold for holding a thermoplastic resin onto which the structure of the shaping surface of the stamper is transferred, and the stamper radiates at least in a state of being separated from the cooling member. It is configured to be heated.

According to the thermoplastic resin product molding method and molding apparatus of the present invention, in the heating step, the stamper in a state separated from the cooling member is radiantly heated, so that the stamper can be effectively heated and the heating time is shortened. In addition, since the cooling member is separated from the stamper, the temperature rise of the cooling member can be suppressed, and the cooling time can be shortened in the cooling step of cooling the stamper. Thereby, productivity can be improved significantly.
In addition, since the cooling after the transfer can be effectively performed by the cooling member that suppresses the temperature rise, the appearance defect of the molded product can be prevented and the quality can be improved.

FIG. 1 is a schematic view for explaining a molding apparatus for a thermoplastic resin product according to a first embodiment of the present invention, in which (a) shows a cross-sectional view and (b) shows an enlarged cross-section of a main part. ing. 2A and 2B are schematic views for explaining a thermoplastic resin product molding apparatus according to an application example of the present invention. FIG. 2A is a cross-sectional view of the main part, and FIG. Show. FIG. 3: has shown schematic sectional drawing explaining the molding method of the thermoplastic resin product concerning 1st embodiment of this invention. FIG. 4: has shown schematic sectional drawing explaining the shaping | molding apparatus and its shaping | molding method of the thermoplastic resin product concerning 2nd embodiment of this invention. FIG. 5: has shown schematic sectional drawing explaining the shaping | molding apparatus and its shaping | molding method of the thermoplastic resin product concerning 3rd embodiment of this invention. FIG. 6: has shown the schematic expanded sectional view of the principal part explaining the molding apparatus of the thermoplastic resin product concerning 4th embodiment of this invention. FIG. 7: has shown schematic sectional drawing explaining the molding method of the thermoplastic resin product concerning 4th embodiment of this invention. FIG. 8: has shown schematic expanded sectional drawing of the principal part explaining the molding apparatus of the thermoplastic resin product concerning 5th embodiment of this invention. FIG. 9: has shown schematic sectional drawing explaining the molding method of the thermoplastic resin product concerning 5th embodiment of this invention.

[First Embodiment of Thermoplastic Resin Product Molding Apparatus and Molding Method]
FIG. 1 is a schematic view for explaining a molding apparatus for a thermoplastic resin product according to a first embodiment of the present invention, in which (a) shows a cross-sectional view and (b) shows an enlarged cross-section of a main part. ing.
In FIG. 1, a thermoplastic resin product molding apparatus 1 (referred to as molding apparatus 1 as appropriate) of a first embodiment includes a heating apparatus 2, a stamper 3, a cooling member 4, a first mold 5, and a second. The mold 6 is provided. In this molding apparatus 1, the stamper 3 is radiantly heated at least in a state of being separated from the cooling member 4, and the structure of the shaping surface 31 of the radiantly heated stamper 3 is transferred to the transfer surface of the thermoplastic resin.
Here, “the molding apparatus 1 is radiantly heated while the stamper 3 is at least separated from the cooling member 4” means that the stamper 3 is radiantly heated while being separated from the cooling member 4. This is because the stamper 3 may be further radiantly heated in contact with the cooling member 4.

In this embodiment, the thermoplastic resin is the base material 7 molded in advance, and the structure of the shaping surface 31 is transferred to the transfer surface 71 of the base material 7.
Here, the preformed base material 7 is a circular or rectangular plastic substrate such as a disc for CD, a rectangular sheet for color filter, or a sheet wound in a roll shape, soy sauce, sauce, Substrates (base materials that are at room temperature after each step) such as three-dimensional molded products such as cap mouthpieces for dressing bottles, PET bottle mouthpieces for coffee, etc. Say.
In addition, the thermoplastic resin in the present embodiment is not limited to the preformed base material 7 described above, and is, for example, a base material (not shown) that has been heated in an injection molding process or a compression molding process. There may be.
Here, the base material heated in the injection molding process or the compression molding process is a base material that has not completely finished the injection molding process or the compression molding process (for example, melted or softened in the middle of the process). A base material or a base material that has undergone each step but has not been cooled to room temperature and has been heated.

(Heating device)
The heating device 2 includes a light pipe 21 having a polygonal cross section, a light box 22 having a polygonal cross section, a light source 23 accommodated in the light box 22, and a light pipe 21. The shutter 24 etc. which shield the infrared rays irradiated from the irradiation port of this are provided. Moreover, the cross-sectional shape of the light pipe 21 may be a triangle, a quadrangle, a regular hexagon, or a parallel hexagon, and the cross-sectional shape of the light box 22 may be a triangle, a quadrangle, a regular hexagon, or a parallel hexagon. If it does in this way, the heating apparatus 2 can implement | achieve the irradiance distribution uniformized by the very high level.
The heating device 2 has substantially the same configuration as the heating device disclosed by the inventors of the present invention in Japanese Patent Application No. 2011-151395, and uniformly applies light from the light source 23 to the irradiated surface (upper surface of the stamper 3). Irradiation can be performed to uniformly heat the irradiated surface.
The heating device 2 is not limited to the above-described configuration. For example, although not shown, the heating device 2 has a configuration different from the above-described configuration and can perform infrared radiation heating using a light source. An apparatus, a carbon dioxide laser, a semiconductor laser, and a scanning laser in which a scanner is combined with these lasers may be used.

(Stamper)
The stamper 3 is a plate-like member whose material is usually Ni or Si, and is radiantly heated by infrared rays emitted from the light source 23. The stamper 3 of the present embodiment has a thickness of usually several hundred μm, but is not limited to this as will be described later. The stamper 3 has a shaping surface 31 on the lower surface, and a concave portion and a convex portion are formed on the shaping surface 31.
Although not shown, a black film may be formed on the upper surface of the stamper 3, and in this way, infrared rays are efficiently absorbed. Thereby, the shaping surface 31 of the stamper 3 is uniformly and rapidly heated by infrared radiation heating. Further, instead of forming the black film, for example, the stamper 3 may be configured to have a plating film. Examples of the black film include a silicone black paint, and examples of the plating film include black Cr plating and black Ni plating.

(Cooling member)
The cooling member 4 is usually a plate-like member made of an infrared transmitting material, and cools the stamper 3 in contact with the radiantly heated stamper 3. In the present embodiment, sapphire is used as the infrared transmitting member, but the sapphire is not limited to this. For example, Si, Ge, MgO, ZnSe, quartz glass, heat resistant glass, or the like may be used. In this way, since the cooling member 4 transmits the infrared rays irradiated from the heating device 2, the stamper 3 can be efficiently radiatively heated, and the infrared rays irradiated from the heating device 2 can be transmitted and cooled. Since the temperature rise of the member 4 is suppressed, the stamper 3 can be effectively cooled when the stamper 3 is cooled in contact with the radiantly heated stamper 3.
Since the stamper 3 of this embodiment has a thickness of several hundreds μm as described above, the cooling member 4 is a reinforcing member that prevents the stamper 3 from being deformed in the transfer process, or the stamper 3 is deformed. It functions as a support member that supports it so that it does not.

(First mold)
The first mold 5 includes a base 51, a holder 52, and the like, and has a structure that holds the stamper 3 so as to be movable and allows the stamper 3 and the cooling member 4 to be brought into contact with or separated from each other. Have. In this embodiment, the stamper 3 is movably held and the cooling member 4 is fixed. However, the present invention is not limited to this. For example, although not shown, the stamper 3 is fixed, The cooling member 4 may be held movably, or the stamper 3 and the cooling member 4 may be held movably.

  The base 51 is a plate-like member having an opening 511 formed substantially at the center, the upper surface is connected to the lower end of the light pipe 21, and the cooling member 4 is fixed to the lower surface. The opening 511 is formed at a position substantially corresponding to the light pipe 21, is substantially the same shape as the cross-sectional shape of the light pipe 21, and the side surface is the same as the inner surface of the light pipe 21 and the light box 22. It has a mirror surface such as silver plating. Thereby, the opening 511 functions in substantially the same manner as the light pipe 21, and can uniformly irradiate the irradiated surface (the upper surface of the stamper 3) with light from the light source 23 and uniformly heat the irradiated surface. .

Here, it is preferable that the molding apparatus 1 includes a cooling unit and the cooling member 4 is forcibly cooled. That is, in the present embodiment, the base 51 has a flow path 512 through which the coolant flows near the periphery of the cooling member 4, and the cooling member 4 is forcibly cooled by flowing the coolant through the flow path 512. . In this way, since the temperature rise of the cooling member 4 is suppressed, the stamper 3 can be effectively cooled when the stamper 3 is cooled in contact with the radiantly heated stamper 3.
The cooling means is not limited to the above configuration, and various configurations of cooling means can be used.

The holder 52 is a plate-like member that is attached to the lower surface of the base portion 51, and a first concave portion that accommodates the cooling member 4 is formed on the upper surface, and a second portion that accommodates the stamper 3 movably in the vertical direction is formed below the holder 52. A recess for exposing the shaping surface 31 of the stamper 3 is formed below the recess. When the holder 52 is attached to the base 51, the cooling member 4 is fixed at a position corresponding to the light pipe 21, and the stamper 3 is located at a position corresponding to the light pipe 21 and below the cooling member 4. It is attached to be movable in the vertical direction.
The side surface of the second recess is a guide surface 522 that guides the movement of the stamper 3, and there is a gap between the stamper 3 supported by the stepped surface of the second recess by gravity and the cooling member 4. 521 is formed.
In addition, the thickness (distance in the vertical direction) of the gap 521 is usually 0. Although it is several mm, it is not limited to this.
The guide surface 522 functions as guide means for guiding the movement of the stamper 3, but the guide means is not limited to the guide surface 522.

(Second mold)
The second mold 6 is a plate-like member, and holds the base material 7 onto which the structure of the shaping surface 31 of the stamper 3 is transferred. That is, the second mold 6 is formed with a concave portion corresponding to the base material 7 on the upper surface, and the base material 7 is positioned in the concave portion.
In addition, although the 1st metal mold | die 5 and the 2nd metal mold | die 6 are not shown in figure, it is attached to the press machine (for example, low pressure press machine (press pressure: 1.0MPa)), for example, it is 2nd The mold 6 moves up and down.
Moreover, the structure which hold | maintains the stamper 3 and the cooling member 4 so that a movement is not specifically limited, It has various application examples.
Next, one of the application examples will be described with reference to the drawings.

(Application examples)
2A and 2B are schematic views for explaining a thermoplastic resin product molding apparatus according to an application example of the present invention. FIG. 2A is a cross-sectional view of the main part, and FIG. Show.
In FIG. 2, the molding apparatus according to this application example is different from the molding apparatus 1 in that it includes a claw 53, a guide pin 531, and a retainer 532. Note that other configurations of this application example are substantially the same as those of the molding apparatus 1.
Therefore, in FIG. 2, the same components as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

The first mold 5a includes a base 51a, a holder 52a, a claw 53, and the like. The base 51a is different from the above-described base 51 in that it includes a flow path 512 having a large flow area. Other configurations are substantially the same as those of the base 51.
The holder 52a is an annular member in which a concave portion for accommodating the peripheral edge of the cooling member 4 is formed, and the cooling member 4 is fixed to the lower surface of the base 51a by being attached to the base 51a.
Further, the claw 53 has a substantially rectangular outer shape when viewed from above, and is a member in which a concave portion for accommodating the edge of the stamper 3a is formed at the tip. By attaching the claws 53 to the four positions of the holder 52a, the stamper 3 is attached at a position corresponding to the light pipe 21 and below the cooling member 4 so as to be movable in the vertical direction. In this way, the holder 52 of the first embodiment described above comes into contact with the entire peripheral portion of the stamper 3, and the entire peripheral portion of the stamper 3 is cooled by heat conduction, which adversely affects uniform heating. The claws 53 are in contact with each other at four locations on the peripheral edge of the stamper 3a, and the entire peripheral edge of the stamper 3a is not cooled by heat conduction, so that it is possible to reduce the problem of adversely affecting uniform heating.

  Here, it is preferable that the stamper 3a is held by the first mold 5a via a heat insulating member. That is, in this application example, an annular retainer 532 made of polyetheretherketone, fluororesin, ceramic, or the like as a heat insulating member is engaged with the recess of the claw 53, and the stamper 3a is mounted on the upper surface of the retainer 532. Is placed. If it does in this way, it can control that the peripheral part of stamper 3a is cooled by heat conduction, and it can reduce effectively the fault of having a bad influence on uniform heating. In addition, if it is not heated uniformly, it takes a long heating time to raise the temperature of the unheated part, and the part is overheated. In order to cool this part, the cooling time Falls into a vicious circle that takes a long time.

Preferably, the movement of the stamper 3a is guided by guide pins 531 as guide means. That is, in the first mold 5a, a guide pin 531 is erected at the tip of the claw 53, and a hole through which the guide pin 531 passes is formed in the retainer 532 and the stamper 3a. In this way, the stamper 3a can move smoothly in the vertical direction, and since the stamper 3a is locked to the guide pin 531, it is possible to reliably prevent the problem that the stamper 3a is detached.
In this application example, the stamper 3a moves upward away from the retainer 532. However, the present invention is not limited to this. For example, the stamper 3a and the retainer 532 are joined together. The retainer 532 may be configured to move in the vertical direction. In this way, even when the stamper 3a is large (for example, when the stamper 3a is larger than A4 size), the retainer 532 can reinforce the stamper 3a, and the durability of the stamper 3a can be improved.

  Although the upper surface of the second mold 6a is flat and not shown, a plurality of suction holes are formed on the upper surface, and the substrate 7 placed in a positioned state is vacuum-sucked. is there. If it does in this way, the 2nd metal mold | die 6a can hold | maintain the base material 7 in a predetermined position similarly to the 2nd metal mold | die 6 of the said embodiment.

Next, operation | movement of the shaping | molding apparatus 1 of the said structure and 1st embodiment of the shaping | molding method of a thermoplastic resin product are demonstrated with reference to drawings.
FIG. 3: has shown schematic sectional drawing explaining the molding method of the thermoplastic resin product concerning 1st embodiment of this invention.
In FIG. 3, the molding method of the thermoplastic resin product of the present embodiment is a molding method in which compression molding is performed on the base material 7 using the molding apparatus 1, and a heating step, a transfer step, a cooling step, and a release step. have.
In the present embodiment, the base material 7 is made of a crystalline thermoplastic resin such as polyethylene terephthalate, but is not limited to this, and may be, for example, polypropylene, polyethylene, or nylon. Further, the amorphous thermoplastic resin may be polystyrene, polymethyl acrylate, or cyclic olefin copolymer. In addition, the crystalline thermoplastic resin is solidified when cooled, and the amorphous thermoplastic resin is cured when cooled.

(Heating process)
First, as shown in FIG. 3A, the molding apparatus 1 opens the shutter 24, and the infrared rays irradiated from the heating apparatus 2 radiately heats the stamper 3 in a state where it is separated from the cooling member 4 (heating process). . That is, in this heating step, the irradiated infrared rays are transmitted through the cooling member 4 made of an infrared transmitting material and radiately heat the stamper 3.
In this way, by heat-radiating the stamper 3 away from the cooling member 4, heat conduction from the stamper 3 to the cooling member 4 is not performed, so that the stamper 3 can be effectively heated, and the cooling member Since 4 transmits infrared rays, it can be heated efficiently and the heating time can be shortened. Furthermore, in the present embodiment, heating is also performed in a transfer process described later. In this case, the stamper 3 is heated in advance, and the heating time in the transfer process can be shortened.
Further, the cooling member 4 does not substantially increase in temperature when irradiated with infrared rays, and is separated from the stamper 3, so that it does not increase in temperature due to heat conduction from the radiantly heated stamper 3. The temperature is effectively suppressed. Thereby, when the cooling member 4 cools the stamper 3 in the cooling step described later, the cooling time can be shortened.

  In addition, when the infrared ray irradiated from the heating apparatus 2 starts radiant heating with respect to the stamper 3 in a state away from the cooling member 4, the base material 7 is usually held in the second mold 6. It is not limited to this timing. For example, the substrate 7 may be held on the second mold 6 during radiant heating, and in this way, the molding cycle time can be shortened in the automated continuous molding.

(Transfer process)
Next, as shown in FIG. 3B, the molding apparatus 1 transfers the structure of the shaping surface 31 of the stamper 3 that has been radiantly heated to the transfer surface 71 of the base material 7 (transfer process). That is, in this transfer step, the second mold 6 is raised as mold clamping, the transfer surface 71 of the base material 7 is in contact with the shaping surface 31 of the stamper 3, and then the stamper 3 is pushed up. The transfer surface 71 is pressed against the shaping surface 31 in a state where the stamper 3 is in contact with the cooling member 4 and the structure of the shaping surface 31 is transferred to the transfer surface 71 of the substrate 7.
In FIG. 3B, the melted or softened portion of the base material 7 is indicated by hatching with a narrow pitch.

Here, in the present embodiment, the stamper 3 has a thickness of several hundreds μm and has a low mechanical strength. Therefore, the transfer is performed in a state where the cooling member 4 is in contact with the stamper 3. As a result, it is possible to prevent problems such as deformation of the stamper 3 and improve transfer accuracy and the like.
In the present embodiment, the stamper 3 is radiantly heated in the transfer process. That is, as shown in FIG. 3B, the molding apparatus 1 has the shutter 24 opened, and the infrared rays irradiated from the heating apparatus 2 radiately heats the stamper 3 in a state where it contacts the cooling member 4. Thereby, since the stamper 3 is also radiantly heated in the transfer step, the transfer surface 71 of the base material 7 and the thermoplastic resin in the vicinity thereof can be melted or softened, and the structure of the shaping surface 31 of the stamper 3 can be improved. Transferred to the transfer surface 71 of the substrate 7.
In the transfer step, radiant heating is performed. However, the present invention is not limited to this. For example, by increasing the heat capacity of the stamper 3 or by preheating the transfer surface 71 of the substrate 7, In the transfer process, radiation heating may not be performed.

(Cooling process)
Next, as shown in FIG. 3C, the molding apparatus 1 is configured such that the cooling member 4 that contacts the stamper 3 cools the stamper 3 in a state where the shaping surface 31 is pressed against the transfer surface 71. 7 is solidified or cured (cooling step). That is, in this cooling process, the shutter 24 is closed, radiation heating is stopped, and the stamper 3 is cooled by heat conduction to the cooling member 4.
Here, the cooling member 4 is in contact with the stamper 3 in the transfer process and increases in temperature by heat conduction. However, as described above, in the heating process, the temperature of the cooling member 4 increases substantially by irradiation of infrared rays. In addition, the temperature is not increased due to heat conduction from the radiantly heated stamper 3 because it is away from the stamper 3, so that the temperature increase is effectively suppressed. Thereby, when the cooling member 4 cools the stamper 3, the cooling time can be shortened.
In addition, since the cooling after the transfer can be effectively performed by the cooling member 4 in which the temperature rise is suppressed, it is possible to prevent the appearance defect (for example, the raised portion) of the molded product from occurring and improve the quality. it can.

(Release process)
Next, as shown in FIG. 3D, the molding apparatus 1 releases the molded product by releasing the state where the shaping surface 31 is pressed against the transfer surface 71 (mold release step). That is, in this mold release step, when the second mold 6 is lowered, the stamper 3 is moved away from the cooling member 4 and subsequently the stamper 3 is locked to the holder 52, the transfer surface 71 is transferred. Is separated from the shaping surface 31, the second mold 6 is lowered to the origin position, and then the base material 7 is conveyed to complete one cycle of molding.

As described above, according to the molding apparatus 1 and the thermoplastic resin product molding method of the present embodiment, the heating time is shortened because the stamper 3 in a state separated from the cooling member 4 is radiantly heated in the heating step. In addition, the temperature rise of the cooling member 4 can be suppressed, and in the cooling process for cooling the stamper 3, the cooling time can be shortened, and the productivity can be greatly improved.
Further, since the cooling after the transfer can be effectively performed by the cooling member 4 in which the temperature rise is suppressed, the appearance defect of the molded product can be prevented and the quality can be improved.

[Second Embodiment of Thermoplastic Product Molding Apparatus and Method]
FIG. 4: has shown schematic sectional drawing explaining the shaping | molding apparatus and its shaping | molding method of the thermoplastic resin product concerning 2nd embodiment of this invention.
In FIG. 4, the molding apparatus 1b of the present embodiment has a thicker stamper 3b than the molding apparatus 1 of the first embodiment described above, and the stamper 3b is not radiantly heated in the transfer process. The only difference is that the transfer is performed using only the heat stored in the stamper 3b. Note that other configurations of the present embodiment are substantially the same as those of the molding apparatus 1.
Therefore, in FIG. 4, the same components as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

(Stamper)
The stamper 3b has a thickness of 1. as compared with the stamper 3 of the first embodiment described above. It differs in that it is set to several mm to several mm, and the other structure is almost the same as that of the stamper 3. This stamper 3b can have a larger heat capacity than the stamper 3, and when it is radiantly heated in the heating process, the structure of the shaping surface 31 of the stamper 3b is transferred to the substrate 7 without being radiantly heated in the transfer process. It can be transferred to the surface 71.

Next, operation | movement of the shaping | molding apparatus 1b of the said structure, 2nd embodiment of the shaping | molding method of a thermoplastic resin product, etc. are demonstrated.
In FIG. 4, the molding method of the thermoplastic resin product of the present embodiment is a molding method in which compression molding is performed on the base material 7 using the molding apparatus 1b, and a heating step, a transfer step, a cooling step, and a release step. have.

(Heating process)
First, as shown in FIG. 4A, the molding apparatus 1b opens the shutter 24 and radiates heat to the stamper 3b in a state where the infrared rays irradiated from the heating apparatus 2 are separated from the cooling member 4. Radiant heating to a temperature that does not need to be performed (heating step).
If it does in this way, the effect similar to 1st embodiment can be acquired by radiatively heating the stamper 3b in the state away from the cooling member 4. FIG. Furthermore, after the stamper 3 of the first embodiment is radiantly heated in the heating process, the stamper 3 is radiantly heated in a state where it is in contact with the cooling member 4 in the transfer process, that is, in a state where heat is taken away by the cooling member 4. On the other hand, in the present embodiment, the stamper 3b is radiantly heated only in the heating step, away from the cooling member 4, that is, in a state where heat is not deprived by the cooling member 4, so that the stamper is more efficient. 3b can be heated.

(Transfer process)
Next, as shown in FIG. 4B, the molding apparatus 1b transfers the structure of the shaping surface 31 of the stamper 3b that is radiantly heated to the transfer surface 71 of the substrate 7 (transfer process). That is, in this transfer process, the shutter 24 is closed, the second mold 6 is raised, the transfer surface 71 of the base 7 is brought into contact with the shaping surface 31 of the stamper 3b, and then the stamper 3b is pushed up. The transfer surface 71 is pressed against the shaping surface 31 in a state where the stamper 3 b is in contact with the cooling member 4, and the structure of the shaping surface 31 is transferred to the transfer surface 71 of the substrate 7.

In this embodiment, unlike the first embodiment, the stamper 3b is not radiantly heated in the transfer process. That is, the stamper 3 b is radiantly heated in the heating process, and the structure of the shaping surface 31 is transferred to the transfer surface 71 of the substrate 7 using only the heat stored by the stamper 3 b by this radiant heating.
In this way, the cooling member 4 is in contact with the stamper 3b that has already been radiantly heated in the transfer process, but unlike the first embodiment, it does not contact the stamper 3b that is being radiantly heated. Therefore, the temperature rise of the cooling member 4 can be further suppressed, and the cooling time can be further shortened.
Preferably, when raising the second mold 6, the raising is stopped in a state where the transfer surface 71 of the base material 7 is in contact with the shaping surface 31 and the stamper 3 b is not in contact with the cooling member 4. Then, the transfer surface 71 may be preheated by the heat of the stamper 3 b and then further raised to transfer the structure of the shaping surface 31 to the transfer surface 71 of the substrate 7. If it does in this way, the heat of stamper 3b can be used effectively.

(Cooling process)
Next, as shown in FIG. 4C, the molding apparatus 1b is configured such that the cooling member 4 that contacts the stamper 3b cools the stamper 3b in a state where the shaping surface 31 is pressed against the transfer surface 71. 7 is solidified or cured (cooling step). That is, in the present embodiment, when the stamper 3b comes into contact with the cooling member 4 in the transfer step, cooling is started. Therefore, in the transfer process and the cooling process of the present embodiment, when the transfer surface 71 comes into contact with the shaping surface 31, the transfer starts, and when the stamper 3b comes into contact with the cooling member 4, the cooling starts and the transfer ends. Later, the cooling ends.
Here, although the cooling member 4 is in contact with the stamper 3b in the transfer process and is heated by heat conduction, as described above, compared with the first embodiment, the cooling member 4 is irradiated with infrared rays in the transfer process. Therefore, there is no temperature rise by infrared rays, and the temperature rise is effectively suppressed. Thereby, when the cooling member 4 cools the stamper 3b, the cooling time can be shortened.
In addition, since the cooling after the transfer can be effectively performed by the cooling member 4 in which the temperature rise is suppressed, it is possible to prevent the appearance defect (for example, the raised portion) of the molded product from occurring and improve the quality. it can.

(Release process)
Next, as shown in FIG. 4D, the molding apparatus 1b releases the molded product by releasing the state where the shaping surface 31 is pressed against the transfer surface 71 (mold release step). That is, in this mold release step, when the second mold 6 is lowered, the stamper 3b moves away from the cooling member 4 and then the stamper 3b is locked to the holder 52, the transfer surface 71 is transferred. Is separated from the shaping surface 31, the second mold 6 is lowered to the origin position, and then the base material 7 is conveyed to complete one cycle of molding.

  As described above, according to the molding apparatus 1b of the present embodiment, the effect similar to that of the molding apparatus 1 of the first embodiment is obtained, and the stamper 3b is radiatively heated only in the heating process. The stamper 3b can be efficiently heated, and the temperature rise of the cooling member 4 can be further suppressed in the transfer step, so that the heating time and the cooling time can be further shortened.

[Third Embodiment of Thermoplastic Product Molding Apparatus and Molding Method]
FIG. 5: has shown schematic sectional drawing explaining the shaping | molding apparatus and its shaping | molding method of the thermoplastic resin product concerning 3rd embodiment of this invention.
In FIG. 5, the molding apparatus 1c of this embodiment has a plurality of locking pins 523 that lock the stamper 3b so as not to move upward as compared with the molding apparatus 1b of the second embodiment described above. The difference is that transfer is performed by the stamper 3b held away from the cooling member 4 in the transfer step. In addition, the other structure of this embodiment is as substantially the same as the shaping | molding apparatus 1b.
Therefore, in FIG. 5, the same components as those in FIG. 4 are denoted by the same reference numerals, and detailed description thereof is omitted.
As described above, the stamper 3b has a thickness of 1. Since the mechanical strength is high, the stamper 3b is deformed even if the transfer is performed with the edge being locked to the locking pin 523 instead of coming into contact with the cooling member 4 because the mechanical strength is high. Inconveniences such as transfer can be prevented, and transfer accuracy and the like are not reduced.
In the present embodiment, the stamper 3b is held by the locking pin 523 and the second mold 6 in a state of being separated from the cooling member 4. However, the present invention is not limited to this. Although not shown, the stamper 3b may be fixed and the cooling member 4 may be moved up and down.

(Locking pin)
The locking pin 523 is embedded in the holder 52c so as to be able to reciprocate, and locks the rising stamper 3b when the tip protrudes into the gap 521c by an air cylinder or the like.
The holder 52c has a shape in which the thickness (distance in the vertical direction) of the gap 521c is several mm, and other configurations are substantially the same as the holder 52.

Next, the operation of the molding apparatus 1c having the above configuration and the third embodiment of the molding method for the thermoplastic resin product will be described.
In FIG. 5, the molding method of the thermoplastic resin product of the present embodiment is a molding method in which compression molding is performed on the base material 7 using the molding apparatus 1c, and a heating process, a transfer process, a cooling process, and a release process. have.

(Heating process)
First, as shown in FIG. 5A, the molding apparatus 1c opens the shutter 24 and radiates heat to the stamper 3b in a state where the infrared rays irradiated from the heating apparatus 2 are separated from the cooling member 4. Radiant heating to a temperature that does not need to be performed (heating step). If it does in this way, the effect similar to 2nd embodiment can be acquired.
Note that the locking pin 523 has an end surface at a position corresponding to the inner surface of the gap 521c, and has almost no adverse effect on uniform infrared irradiation.

(Transfer process)
Next, as illustrated in FIG. 5B, the molding apparatus 1 c transfers the structure of the shaping surface 31 of the stamper 3 b that is radiantly heated to the transfer surface 71 of the base material 7 (transfer process). That is, in this transfer step, the shutter 24 is closed, the tip of the locking pin 523 protrudes into the gap 521c, the second mold 6 is raised, and the transfer surface 71 of the base material 7 is the shaping surface 31 of the stamper 3b. Then, the stamper 3b is moved upward so that the stamper 3b is pushed up (normally, this movement is a minute distance). When the stamper 3b is locked by the locking pin 523, the stamper 3b is In this state, the transfer surface 71 is pressed against the shaping surface 31, and the structure of the shaping surface 31 is transferred to the transfer surface 71 of the substrate 7.

Here, in the present embodiment, the structure of the shaping surface 31 is transferred to the transfer surface 71 of the base material 7 using only the heat stored in the stamper 3b in the heating step, as in the second embodiment. Further, the temperature rise of the cooling member 4 can be further suppressed, and the cooling time can be further shortened. Compared with the second embodiment, in the transfer process, the stamper 3b is not in contact with the cooling member 4, so that the amount of heat flowing from the stamper 3b to the cooling member 4 is small, and the amount of heat stored in the stamper 3b in the heating process. The time required for heating is shortened because of the reduced amount of heat.
In this embodiment, the stamper 3b is not radiantly heated in the transfer process. However, the present invention is not limited to this. For example, although not shown, the stamper 3b may be radiantly heated.

(Cooling process)
Next, as shown in FIG. 5C, the molding apparatus 1 c is configured such that the cooling member 4 that contacts the stamper 3 b cools the stamper 3 b while pressing the shaping surface 31 against the transfer surface 71. 7 is solidified or cured (cooling step). In other words, in this embodiment, the locking pin 523 returns to a position where the end surface corresponds to the inner surface of the gap 521c, the second mold 6 is raised, and the stamper 3b is pushed upward to move upward. 3b contacts the cooling member 4, and the stamper 3b is cooled.
Here, since the cooling member 4 does not come into contact with the stamper 3b in the transfer step, the temperature rise is effectively suppressed, and the cooling time can be shortened.

(Release process)
Next, as shown in FIG. 5D, the molding apparatus 1c releases the molded product by releasing the state in which the shaping surface 31 is pressed against the transfer surface 71 (mold release step). That is, in this mold release process, when the second mold 6 is lowered, the stamper 3b moves away from the cooling member 4 and then the stamper 3b is locked to the holder 52c, the transfer surface 71 is transferred. Is separated from the shaping surface 31, the second mold 6 is lowered to the origin position, and then the base material 7 is conveyed to complete one cycle of molding.

As described above, according to the molding apparatus 1c of the present embodiment, there are substantially the same effects as the molding apparatus 1b of the second embodiment, and in the transfer process, the cooling member 4 does not contact the stamper 3b. The temperature rise of the cooling member 4 is effectively suppressed, and the cooling time can be shortened. Further, since the amount of heat stored in the stamper 3b is small, the heating time is shortened.
This embodiment can also be applied to the first and second embodiments.

[Fourth Embodiment of Thermoplastic Product Molding Apparatus and Molding Method]
FIG. 6: has shown the schematic expanded sectional view of the principal part explaining the molding apparatus of the thermoplastic resin product concerning 4th embodiment of this invention.
In FIG. 6, the molding apparatus 1 d of the present embodiment, compared with the molding apparatus 1 of the first embodiment described above, applies pressure to the gap 521 d between the cooling member 4 and the stamper 3 d in the transfer process. The stamper 3d is held away from the cooling member 4, and the stamper 3d is different in that transfer is performed. Note that other configurations of the present embodiment are substantially the same as those of the molding apparatus 1.
Therefore, in FIG. 6, the same components as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

(Stamper)
The stamper 3d of the present embodiment is different from the stamper 3 of the first embodiment in that it has an annular portion formed with an O-ring groove for accommodating the O-ring 32 below the peripheral portion. The other structure of the stamper 3d is substantially the same as that of the stamper 3.
As a result, the stamper 3d seals the lower space where the second mold 6 is located and the gap 521d between the cooling member 4 and the stamper 3d by the O-ring 32, and reduces the pressure in the gap 521d. The pressure in the lower space can be made higher. Further, the stamper 3d can move in the vertical direction along the guide surface 522 in a sealed state.
The annular portion is usually formed integrally with the plate-like portion of the stamper 3d (the plate-like portion mainly means a portion closer to the center than the peripheral portion). For example, a structure in which an annular member made of a material excellent in heat insulation is joined to the plate-like portion may be used.

(First mold)
The first mold 5d is different from the first mold 5 of the first embodiment in that a pressure control channel 525 and an O-ring 524 are provided in the holder 52d. The other structure of the mold 5d is almost the same as that of the first mold 5.
The holder 52d is formed with a pressure control flow path 525 for controlling the pressure in the gap 521d. Although not shown, the pressure control flow path 525 is connected via a pipe and a valve. It communicates with a pressure source such as factory air and outside air to release atmospheric pressure. Further, the holder 52d has an O-ring groove for accommodating the O-ring 524 formed on the surface on which the cooling member 4 is placed, and the upper portion of the gap 521d is sealed by the O-ring 524.
In addition, the thickness (distance in the vertical direction) of the gap 521d is usually a shape that is several mm.

Next, an operation of the molding apparatus 1d having the above-described configuration and a fourth embodiment of a method for molding a thermoplastic resin product will be described.
FIG. 7: has shown schematic sectional drawing explaining the molding method of the thermoplastic resin product concerning 4th embodiment of this invention.
In FIG. 7, the thermoplastic resin product molding method of the present embodiment is a molding method in which compression molding is performed on the base material 7 using the molding apparatus 1d, and includes a heating step, a transfer step, a cooling step, and a release step. have.

(Heating process)
First, in the molding apparatus 1d, the shutter 24 is opened and irradiated from the heating apparatus 2 as shown in FIG. 7A from the state shown in FIG. 6, that is, the pressure in the gap 521d is released to the atmosphere. The infrared rays radiantly heat the stamper 3d in a state away from the cooling member 4 (heating process).
As described above, the radiant heating of the stamper 3d away from the cooling member 4 prevents heat transfer from the stamper 3d to the cooling member 4 in substantially the same manner as in the first embodiment. Can be heated automatically, and the heating time can be shortened. Further, in the present embodiment, heating is also performed in a transfer process described later. In this case, the stamper 3d is heated in advance, and the heating time in the transfer process can be shortened.

(Transfer process)
Next, as illustrated in FIG. 7B, the molding apparatus 1 d transfers the structure of the shaping surface 31 of the stamper 3 d that is radiantly heated to the transfer surface 71 of the base material 7 (transfer process). That is, in this transfer process, in a state where the stamper 3d separated from the cooling member 4 is radiantly heated, the second mold 6 is raised as mold clamping, and the transfer surface 71 of the base material 7 is shaped by the stamper 3d. Contact surface 31.
At this time, the molding apparatus 1d allows the fluid such as factory air to be pressured at the same time, just before or just after the transfer surface 71 of the substrate 7 contacts the shaping surface 31 of the stamper 3d. It is supplied to the gap 521d through the control channel 525. As a result, a pressure higher than atmospheric pressure is applied to the gap 521d between the cooling member 4 and the stamper 3d, and the stamper 3d is held away from the cooling member 4. In this state, the transfer surface 71 is shaped. Pressed against the surface 31, the structure of the shaping surface 31 is transferred to the transfer surface 71 of the substrate 7.

Here, in this embodiment, although the stamper 3d has a thickness of several hundreds μm and low mechanical strength, the transfer surface 71 is pressed almost uniformly against the shaping surface 31 by the pressure in the gap 521d. In addition, problems such as deformation of the stamper 3d can be prevented, and transfer accuracy and the like can be improved.
In the present embodiment, the stamper 3d is also radiantly heated in the transfer process, but the stamper 3d is radiated in a state where the stamper 3d is separated from the cooling member 4, that is, in a state where heat is not deprived by the cooling member 4. Since it is heated, the stamper 3d can be heated more efficiently. Furthermore, since the cooling member 4 does not come into contact with the stamper 3d in the middle of radiant heating, the temperature rise is suppressed and the cooling time can be shortened in the cooling step.

In the present embodiment, a pressure higher than the atmospheric pressure is applied to the gap 521d, but the pressure in the gap 521d is higher than the pressure in the lower space where the second mold 6 is located, and the stamper 3d is cooled. The transfer surface 71 may be held substantially uniformly pressed against the shaping surface 31 by being held away from the member 4 and by the pressure in the gap 521d. Therefore, the pressure applied to the gap 521d is not limited to a pressure higher than the atmospheric pressure. For example, when the lower space where the second mold 6 is located is evacuated, the atmospheric pressure, Alternatively, the pressure may be lower than atmospheric pressure.
Alternatively, after applying a pressure higher than the atmospheric pressure to the gap 521d, a valve (not shown) connected to the pressure control channel 525 may be closed to make the gap 521d a sealed space. In this case, the stamper 3d rises according to the thrust set by the press machine, and the stamper 3d stops when the force generated by the pressure in the gap 521d balances with the thrust of the press machine.

(Cooling process)
Next, as shown in FIG. 7C, the molding apparatus 1 d is configured such that the cooling member 4 that contacts the stamper 3 d cools the stamper 3 d in a state where the shaping surface 31 is pressed against the transfer surface 71. 7 is solidified or cured (cooling step). That is, in this embodiment, the shutter 24 is closed, the pressure in the gap 521d is released to the atmosphere, the second mold 6 is raised, the stamper 3d is in contact with the cooling member 4, and the stamper 3d is cooled.

Here, since the cooling member 4 does not come into contact with the stamper 3d in the transfer step, the temperature rise is effectively suppressed and the cooling time can be shortened.
In addition, since the cooling after the transfer can be effectively performed by the cooling member 4 in which the temperature rise is suppressed, it is possible to prevent the appearance defect (for example, the raised portion) of the molded product from occurring and improve the quality. it can.

(Release process)
Next, the molding apparatus 1d releases the molded product by releasing the state where the shaping surface 31 is pressed against the transfer surface 71 as shown in FIG. That is, in this mold release step, the second mold 6 is lowered, the stamper 3d moves away from the cooling member 4, and subsequently, when the stamper 3d is locked to the holder 52d, the transfer surface 71 is transferred. Is separated from the shaping surface 31, the second mold 6 is lowered to the origin position, and then the base material 7 is conveyed to complete one cycle of molding.

As described above, according to the molding apparatus 1d of the present embodiment, substantially the same effects as the molding apparatus 1 of the first embodiment are exhibited, and the stamper 3d is separated from the cooling member 4 in the transfer process. Therefore, it is possible to prevent the heat of the stamper 3d from being taken away by the cooling member 4, thereby shortening the heating time, the transfer time, and the cooling time.
This embodiment can also be applied to the first and second embodiments.

[Fourth Embodiment of Thermoplastic Product Molding Apparatus and Molding Method]
FIG. 8: has shown schematic expanded sectional drawing of the principal part explaining the molding apparatus of the thermoplastic resin product concerning 5th embodiment of this invention.
In FIG. 8, the molding apparatus 1 e of this embodiment is different from the molding apparatus 1 of the first embodiment described above in that it includes a forced cooling plate 41 that forcibly cools the cooling member 4. Note that other configurations of the present embodiment are substantially the same as those of the molding apparatus 1.
Therefore, in FIG. 8, the same components as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

(First mold)
Compared with the first mold 5 of the first embodiment, the first mold 5e has a recess formed in the base 51e, and a forced cooling plate 41 described later is movably provided in the recess. However, the other configuration of the first mold 5e is substantially the same as that of the first mold 5.

(Forced cooling plate)
The forced cooling plate 41 is made of a material having excellent thermal conductivity, such as aluminum or copper, and has a rectangular flat plate shape that can cover the cooling member 4, and can be moved horizontally in the recess of the base 51e. Is provided. The forced cooling plate 41 has an opening 412 having substantially the same shape as the cross-sectional shape of the light pipe 21 at substantially the center, and on both sides of the opening 412 (on the left and right sides of the opening 412 in FIG. 8). A flow path 411 for flowing the refrigerant is formed.

The opening 412 has a mirror surface on the side surface. When the opening 412 moves to a position corresponding to the light pipe 21 in the heating process and the transfer process, the opening 412 functions in substantially the same manner as the light pipe 21. It is possible to uniformly irradiate the upper surface of the stamper 3 and to heat the stamper 3 uniformly.
In addition, the portion of the opening 412 in which the flow path 411 on the left side is disposed is brought into contact with the entire upper surface of the cooling member 4 when moved to a position covering the cooling member 4 in the cooling step and the release step. 4 can be efficiently cooled while keeping the temperature distribution of 4 substantially uniform.
In addition, in this embodiment, although it is set as the structure which uses the one forced cooling plate 41, it is not limited to this. For example, a plurality of forced cooling plates 41 may be prepared, and the sufficiently cooled forced cooling plates 41 may be used in order. In this way, effective cooling can be achieved even when continuous molding is performed. It can be done reliably.
The forced cooling plate 41 also functions as the shutter 24 because it blocks the light from the light source 23, and may be used instead of the shutter 24.

Next, the operation of the molding apparatus 1e having the above configuration and the fourth embodiment of the method for molding a thermoplastic resin product will be described.
FIG. 9: has shown schematic sectional drawing explaining the molding method of the thermoplastic resin product concerning 5th embodiment of this invention.
In FIG. 9, the thermoplastic resin product molding method of the present embodiment is a molding method in which compression molding is performed on the base material 7 using the molding apparatus 1e, and includes a heating step, a transfer step, a cooling step, and a release step. have.

(Heating process)
First, the molding apparatus 1e is in the state shown in FIG. 8, that is, from the state where the shutter 24 is closed and the left part of the forced cooling plate 41 is in a position covering the cooling member 4, as shown in FIG. In addition, the forced cooling plate 41 is moved to a position where the opening 412 corresponds to the light pipe 21, the shutter 24 is opened, and the infrared rays irradiated from the heating device 2 pass through the stamper 3 in a state of being separated from the cooling member 4. Radiant heating (heating process).
As described above, the radiant heating of the stamper 3 in a state away from the cooling member 4 prevents heat transfer from the stamper 3 to the cooling member 4 in substantially the same manner as in the first embodiment. In addition, since the infrared ray passes through the opening 412 and the cooling member 4 transmits the infrared ray, it can be heated efficiently and the heating time can be shortened. Furthermore, in the present embodiment, heating is also performed in a transfer process described later. In this case, the stamper 3 is heated in advance, and the heating time in the transfer process can be shortened.

(Transfer process)
Next, as shown in FIG. 9B, the molding apparatus 1e transfers the structure of the shaping surface 31 of the stamper 3 that has been radiantly heated to the transfer surface 71 of the substrate 7 (transfer process). That is, in this transfer step, the second mold 6 is raised as mold clamping, the transfer surface 71 of the base material 7 is in contact with the shaping surface 31 of the stamper 3, and then the stamper 3 is pushed up. The transfer surface 71 is pressed against the shaping surface 31 in a state where the stamper 3 is in contact with the cooling member 4 and the structure of the shaping surface 31 is transferred to the transfer surface 71 of the substrate 7.

Here, in the present embodiment, the stamper 3 has a thickness of several hundreds μm and has a low mechanical strength. Therefore, the transfer is performed in a state where the cooling member 4 is in contact with the stamper 3. As a result, it is possible to prevent problems such as deformation of the stamper 3 and improve transfer accuracy and the like.
In the present embodiment, the stamper 3 is radiantly heated in the transfer process. That is, in the molding apparatus 1, as shown in FIG. 9B, the forced cooling plate 41 is moved to a position where the shutter 24 is opened and the opening 412 corresponds to the light pipe 21. The infrared rays irradiated from the heating device 2 radiately heats the stamper 3 in a state where it contacts the cooling member 4. Thereby, since the stamper 3 is also radiantly heated in the transfer step, the transfer surface 71 of the base material 7 and the thermoplastic resin in the vicinity thereof can be melted or softened, and the structure of the shaping surface 31 of the stamper 3 can be improved. Transferred to the transfer surface 71 of the substrate 7.

(Cooling process)
Next, as shown in FIG. 9C, the molding apparatus 1 e is configured so that the cooling member 4 in contact with the stamper 3 cools the stamper 3 while pressing the shaping surface 31 against the transfer surface 71. 7 is solidified or cured (cooling step). That is, in this embodiment, the shutter 24 is closed, the forced cooling plate 41 is moved to a position where the left side portion of the forced cooling plate 41 covers the cooling member 4, the second mold 6 is raised, and the stamper 3 Comes into contact with the cooling member 4 and the stamper 3 is cooled.

Here, since the cooling member 4 is efficiently cooled by the forced cooling plate 41 while keeping the temperature distribution of the cooling member 4 substantially uniform, the cooling time can be further shortened.
In addition, since the cooling after the transfer can be effectively performed by the cooling member 4 in which the temperature rise is suppressed, it is possible to prevent the appearance defect (for example, the raised portion) of the molded product from occurring and improve the quality. it can.

(Release process)
Next, as shown in FIG. 9D, the molding apparatus 1e releases the molded product by releasing the state in which the shaping surface 31 is pressed against the transfer surface 71 (mold release step). That is, in this mold release step, when the second mold 6 is lowered, the stamper 3 is moved away from the cooling member 4 and subsequently the stamper 3 is locked to the holder 52, the transfer surface 71 is transferred. Is separated from the shaping surface 31, the second mold 6 is lowered to the origin position, and then the base material 7 is conveyed to complete one cycle of molding.

As explained above, according to the molding apparatus 1e of this embodiment, while having the effect substantially the same as the molding apparatus 1 of 1st embodiment, the forced cooling plate 41 makes the temperature distribution of the cooling member 4 substantially uniform. Since the cooling member 4 can be efficiently cooled while maintaining, the cooling time can be further shortened. Further, the cooling member 4 that suppresses the temperature rise can prevent the appearance defect of the molded product (for example, a raised portion) and improve the quality.
In the present embodiment, the cooling member 4 is forcibly cooled by the forced cooling plate 41. However, in each of the above-described embodiments, the forced cooling plate 41 is used instead of the flow path 512 through which the refrigerant flows. You may perform forced cooling.

"Example"
As an example of the first embodiment, an uneven shape was formed on the base material 7 by the above-described forming method.
The base material 7 was made of polystyrene, and the shape was a square (length of one side = 58 mm, plate thickness = 3 mm).
Moreover, the heating device 2 was a rectangular parallelepiped shape in which the irradiation port (irradiance measurement surface) of the light box 22 was square (the length of one side was 70 mm) and the length was 150 mm. The light source 23 was provided with five rod-shaped halogen heaters (one output is 1.5 kW) parallel to the length direction. The total reflectance of the inner surface of the light box 22 was set to 95%.
The material of the cooling member 4 was sapphire.
The stamper 3 is made of Ni (nickel) as a material, and convex patterns having a height of 50 μm, a width of 50 μm, and a length of 2 mm are arranged side by side at an interval of 100 μm as the shaping surface 31.
Furthermore, a low-pressure press (press thrust: 10 kN) was used as the press.

The molding apparatus 1 radiated for 1.0 second in the heating process, radiated for 2.5 seconds in the transfer process, and cooled for 5.0 seconds in the cooling process.
The molded substrate 7 was able to be released almost automatically, had good release properties, and the transfer rate of the concave pattern was 96%. The cycle time was about 8.5 seconds. That is, a fine pattern can be transferred with high accuracy and productivity can be greatly improved.

"Comparative example"
Compared with the above-described embodiment, the comparative example is that the stamper 3 is fixed in contact with the cooling member 4, there is no heating step, and the substrate 7 is in contact with the stamper 3 in the transfer step. The difference was that the heating was performed, and radiant heating was performed for 5.0 seconds in the transfer step, and cooling was performed for 5.0 seconds or 60.0 seconds in the cooling step. The other methods of the comparative examples were almost the same as the examples.
In the case of the molded base material 7 of the comparative example that had been cooled for 5.0 seconds, although it could be released from the mold, a raised portion (poor appearance) was formed at the center, which was not applicable to an actual product. . In addition, for those subjected to cooling for 60.0 seconds, although no appearance defect was observed, it was not applicable to actual production requiring productivity and the like.

As mentioned above, although the preferable embodiment etc. were shown and demonstrated about the molding method of the thermoplastic resin product of the present invention, and its molding device, the molding method of the thermoplastic resin product concerning the present invention and its molding device are the embodiments mentioned above. It is needless to say that various modifications can be made within the scope of the present invention.
For example, the configuration for holding the stamper and / or the cooling member so as to be movable is not limited to the configuration of the above-described embodiment, and may be various configurations.

  Moreover, although the shaping | molding apparatuses 1, 1b, 1c, 1d, and 1e mentioned above use the cooling member 4 and this cooling member 4 is forcibly cooled using the flow path 512 or the forced cooling plate 41, The configuration is not limited. For example, although not shown, instead of providing the cooling member 4 and the flow path 512, or instead of providing the cooling member 4 and the forced cooling plate 41, only the forced cooling plate 41 may be provided. A plurality of forced cooling plates 41 can be used in order, and effective cooling can be performed even when continuous molding is performed.

1, 1b, 1c, 1d, 1e Molding device 2 Heating device
3, 3a, 3b, 3d stamper
4 Cooling member
5, 5a, 5d, 5e First mold
6, 6a Second mold 7 Base material 21 Light pipe
22 Lightbox
23 Light source
24 Shutter
31 Shaped surface 32 O-ring
41 Forced cooling plate 51, 51a, 51e Base 52, 52a, 52c, 52d Holder
53 nails
71 Transfer surface 411 Flow path 412 Opening 511 Opening 512, 512a Flow path 521, 521c, 521d Clearance 522 Guide surface 523 Locking pin 524 O-ring 525 Pressure control flow path 531 Guide pin 532 Retainer

[ Fifth Embodiment of Thermoplastic Product Molding Apparatus and Molding Method]
FIG. 8: has shown schematic expanded sectional drawing of the principal part explaining the molding apparatus of the thermoplastic resin product concerning 5th embodiment of this invention.
In FIG. 8, the molding apparatus 1 e of this embodiment is different from the molding apparatus 1 of the first embodiment described above in that it includes a forced cooling plate 41 that forcibly cools the cooling member 4. Note that other configurations of the present embodiment are substantially the same as those of the molding apparatus 1.
Therefore, in FIG. 8, the same components as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

Claims (13)

A heating step in which the infrared rays irradiated from the heating device radiately heat the stamper in a state separated from the cooling member;
A transfer step of transferring the structure of the shaping surface of the stamper that has been radiantly heated to a transfer surface of a thermoplastic resin;
In the state where the shaping surface is pressed against the transfer surface, the cooling member in contact with the stamper cools the stamper and solidifies or cures the thermoplastic resin,
A mold release step of releasing the molded product by releasing the pressed state. A method for molding a thermoplastic resin product.   2. The method for molding a thermoplastic resin product according to claim 1, wherein in the heating step, the infrared rays are transmitted through the cooling member made of an infrared transmitting material to radiately heat the stamper.   The method for molding a thermoplastic resin product according to claim 1, wherein in the transfer step, transfer is performed in a state where the cooling member is in contact with the stamper.   The method for molding a thermoplastic resin product according to claim 1 or 2, wherein in the transfer step, transfer is performed by the stamper held in a state separated from the cooling member.   5. The heat according to claim 4, wherein, in the transfer step, the stamper is held away from the cooling member by applying pressure to a gap between the cooling member and the stamper. Molding method for plastic resin products.   The method for molding a thermoplastic resin product according to any one of claims 3 to 5, wherein, in the transfer step, the stamper is radiantly heated.   The method for molding a thermoplastic resin product according to any one of claims 3 to 5, wherein in the transfer step, transfer is performed using only heat stored in the stamper in the heating step. . A heating device that performs infrared radiation heating using a light source;
A stamper that is radiantly heated by infrared rays emitted from the light source;
A cooling member that cools the stamper in contact with the radiantly heated stamper;
A first mold having a structure for holding the stamper and / or the cooling member movably, and allowing the stamper and the cooling member to be brought into contact with or separated from each other;
A second mold for holding a thermoplastic resin onto which the structure of the shaping surface of the stamper is transferred,
An apparatus for molding a thermoplastic resin product, wherein the stamper is radiantly heated at least in a state of being separated from the cooling member.   The apparatus for molding a thermoplastic resin product according to claim 8, wherein the cooling member is made of an infrared transmitting material.   The thermoplastic resin product molding apparatus according to claim 8 or 9, wherein the stamper is held in the first mold through a heat insulating member.   The thermoplastic resin product molding apparatus according to any one of claims 8 to 10, wherein the first mold has guide means for guiding movement of the stamper and / or the cooling member. .   The said cooling member is forcedly cooled, The shaping | molding apparatus of the thermoplastic resin product as described in any one of Claims 8-11 characterized by the above-mentioned.   The heating device includes a light pipe having a polygonal cross-sectional shape, a light box connected to the light pipe and having a polygonal cross-sectional shape, and the light source accommodated in the light box. The apparatus for molding a thermoplastic resin product according to any one of claims 8 to 12.

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