JP2013186971A - Film forming device and film forming method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film forming device and a film forming method, capable of continuously manufacturing laminated films having a high barrier property in which an inorganic film and an organic film are laminated.SOLUTION: A film forming device comprises: a vacuum chamber 11; an evacuating unit 12 which evacuates the inside of the vacuum chamber 11; gas introduction units 14to 14which introduce a gas into the vacuum chamber 11; a control unit 15 which can increase pressure in the vacuum chamber 11 to 10Pa or higher by increasing an amount of the gases introduced by the gas introduction units 14to 14; organic film formation units 20aand 20awhich form an inorganic film on a surface of a film-formed object 50 arranged in the vacuum chamber 11 under pressure of 10Pa or higher; and an organic film formation unit 30 which forms an organic film. The organic film formation unit 30 includes: a material container 31 which is arranged in the vacuum chamber 11 and in which a liquid organic film material 35 is stored; a material coating unit 32 which coats the organic film material 35 in the material container 31 on a surface of the film-formed object 50; and a material hardening unit 36 which hardens the organic film material coated on the surface of the film-formed object 50.

Description

  The present invention relates to a film forming apparatus and a film forming method, and more particularly to a technique for forming a laminated film of an inorganic film and an organic film.

At present, organic EL elements have high luminous efficiency and can be assembled into thin light emitting devices, and thus are attracting attention for applications such as display devices and lighting equipment. Since the organic layer of the organic EL element is easily deteriorated by reacting with moisture or oxygen in the atmosphere, the organic EL element needs a barrier film having a high barrier property.
As the barrier film, a configuration including a laminated film in which an inorganic film and an organic film are alternately laminated is known (see, for example, paragraph 0172 of Patent Document 1 below).

Conventionally, however, the inorganic film is formed by vacuum film formation, while the organic film is formed by printing the resin in the air using a dispenser and then curing the resin. Therefore, in order to laminate the inorganic film and the organic film, it is necessary to repeatedly put in and out the object to be formed in the air / vacuum atmosphere, which takes time and labor. Further, in the atmosphere, there is a risk that moisture may adhere to the surface of the film formation target.
Accordingly, a method has been devised in which an organic film material is formed by heating and evaporating an organic film material in a vacuum atmosphere by allowing the vapor to reach the surface of the film formation target by vacuum deposition.

  However, the vacuum deposition method has the disadvantage that the film formation speed is slow, and also a member other than the film formation target is deposited to generate dust, which necessitates a cleaning device and is expensive. It was.

In addition, since the vacuum deposition method needs to be performed at a pressure of 10 ⁻⁴ Pa or less, when the inorganic film is formed by the CVD method or the sputtering method, the inorganic film and the organic film are formed in different vacuum chambers. There was a need. If it is formed in the same vacuum chamber, it is necessary to reduce the pressure in the vacuum chamber after the inorganic film is formed and before the organic film is formed, and the laminated film cannot be produced continuously. .

  In order to continuously form an inorganic film and an organic film in the same vacuum chamber, it is necessary to form the inorganic film by a vacuum deposition method. However, an inorganic film formed by the vacuum deposition method can be formed by a CVD method or a sputtering method. There was an inconvenience that the barrier property was inferior to that of the formed inorganic film.

JP 2010-198957 A

  The present invention was created to solve the above-described disadvantages of the prior art, and its purpose is to form a film forming apparatus and a film forming apparatus capable of continuously producing a laminated film having a high barrier property in which an inorganic film and an organic film are laminated. It is to provide a membrane method.

In order to solve the above-described problems, the present invention provides a vacuum chamber, a vacuum exhaust portion that evacuates the vacuum chamber, a gas introduction portion that introduces gas into the vacuum chamber, and the gas in the gas introduction portion. introduction amount increases, and a control unit capable of pressure in the vacuum chamber than 10 ^-2 Pa, the surface of the object to be film disposed in said vacuum chamber, the pressure of an inorganic film over 10 ^-2 Pa A material container that contains an inorganic film forming part formed in step (b) and an organic film forming part that forms an organic film. The organic film forming part is disposed in the vacuum chamber and contains a liquid organic film material. A material application unit that applies the organic film material in the material container to the surface of the film formation target; a material curing unit that cures the organic film material applied to the surface of the film formation target; Is a film forming apparatus.
The present invention is a film forming apparatus, wherein the inorganic film forming unit is a CVD apparatus, and the gas is a raw material gas for the inorganic film.
The present invention is a film forming apparatus, wherein the inorganic film forming unit is a sputtering apparatus, and the gas is a sputtering gas.
The present invention is a film forming apparatus, wherein the material application unit is arranged in parallel to each other, and a plurality of material transmission rollers whose outer peripheral side surfaces are in contact with each other, and each of the material transmission rollers is rotated about a central axis. A rotating device that rotates two adjacent material transmission rollers in opposite directions, and an outer peripheral side surface of one of the material transmission rollers is immersed in the organic film material in the material container, and the other The outer peripheral side surface of one of the material transmission rollers is in contact with the surface of the film formation target, and when each of the material transmission rollers is rotated by the rotating device, the organic film material in the material container is It is the film-forming apparatus apply | coated to the surface of the said film-forming target object along the outer peripheral side surface of a material transmission roller.
This invention is a film-forming apparatus, Comprising: The said material hardening part is an irradiation apparatus which irradiates any one of an electron beam or an ultraviolet-ray on the surface of the said film-forming target object, The said organic film material is a photocurable resin. A film forming apparatus.
This invention is a film-forming apparatus, Comprising: The said material hardening part is a heating apparatus which heats the surface of the said film-forming target object, The said organic film material is a film-forming apparatus which is a thermosetting resin.
The present invention is a film forming apparatus, wherein the organic film material is a silicone resin.
The present invention is a film forming apparatus, wherein the organic film material is an acrylic resin.
This invention is a film-forming apparatus, Comprising: The said film-forming target object is a film-forming apparatus which is a strip | belt-shaped flexible substrate.
This invention is a film-forming apparatus, Comprising: A film-forming apparatus provided with the winding-up apparatus which winds up the said film-forming target object.
This invention is a film-forming apparatus, Comprising: The said inorganic film formation part and the said organic film formation part are film-forming apparatuses provided by arranging along the longitudinal direction of the said film-forming target alternately.
The present invention introduces gas into the evacuated vacuum chamber and maintains the pressure in the vacuum chamber at 10 ⁻² Pa or more, while maintaining the surface of the film formation target disposed in the vacuum chamber. An inorganic film forming step for forming an inorganic film; a material applying step for applying a liquid organic film material to the surface of a film forming object disposed in the vacuum chamber; and the applied organic film material is cured. A material curing step for forming an organic film.
The present invention is a film forming method, wherein the gas is a raw material gas for the inorganic film, and in the inorganic film forming step, the inorganic film is formed by a CVD method.
The present invention is a film forming method, wherein the gas is a sputtering gas, and in the inorganic film forming step, the inorganic film is formed by a sputtering method.
The present invention is a film forming method, wherein in the material application step, a material transmission roller having the organic film material adhered to an outer peripheral side surface is brought into contact with the surface of the film formation target, and the material transmission is performed while maintaining a contact state. In this film forming method, the organic film material is applied by rotating a roller.
The present invention is a film forming method, wherein the organic film material is a photocurable resin, and in the material curing step, the surface of the film forming object is irradiated with an electron beam or ultraviolet light.
The present invention is a film forming method, wherein the organic film material is a thermosetting resin, and the surface of the film formation target is heated when the organic film material is cured.
The present invention is a film forming method, wherein the organic film material is a silicone resin.
The present invention is a film forming method, wherein the organic film material is an acrylic resin.
This invention is a film-forming method, Comprising: The said film-forming target object is a film-forming method which is a strip | belt-shaped flexible substrate.
This invention is a film-forming method, Comprising: The film-forming method which performs the said inorganic film formation process, the said material application | coating process, and the said material hardening process, winding up the said film-forming target object.
This invention is a film-forming method, Comprising: The film-forming method which repeats the said inorganic film formation process, the said material application | coating process, and the said material hardening process in this order.

Since the inorganic film can be formed in a vacuum atmosphere at a pressure of 10 ⁻² Pa or higher, the barrier property of the inorganic film can be improved.
Since the inorganic film and the organic film are formed in the same vacuum atmosphere, the inorganic film and the organic film can be formed continuously, and the production time of the laminated film can be shortened.

FIG. 1 is an internal configuration diagram of a film forming apparatus according to a first example of the present invention. (A)-(e): The figure for demonstrating the film-forming method of this invention The internal block diagram of the film-forming apparatus of the 2nd example of this invention

<Structure of film forming apparatus of first example>
The structure of the film forming apparatus of the first example of the present invention will be described.
FIG. 1 is an internal configuration diagram of the film forming apparatus 10a of the first example.

The film forming apparatus 10 a of the first example includes a vacuum chamber 11, a vacuum exhaust unit 12 that evacuates the inside of the vacuum chamber 11, gas introduction units 14 _{1 to} 14 ₄ that introduce gas into the vacuum chamber 11, and a gas introduction On the surface of the film forming object 50 arranged in the vacuum chamber 11 and the control unit 15 that can increase the amount of gas introduced into the units 14 _{1 to} 14 ₄ to increase the pressure in the vacuum chamber 11 to 10 ⁻² Pa or more. The first and second inorganic film forming portions 20a ₁₂ and 20a _{34 for} forming the inorganic film at a pressure of 10 ⁻² Pa or more and the organic film forming portion 30 for forming the organic film are provided.
The vacuum exhaust unit 12 is connected to the vacuum chamber 11. When the evacuation unit 12 is operated, the vacuum chamber 11 is evacuated.

In this embodiment, the vacuum chamber 11 is connected to the first and second sub vacuum chambers 60 ₁ and 60 ₂ in an airtight manner. First, the second sub-vacuum chamber 60 _1, 60 ₂ first, ₁ second sub evacuator 68, 68 ₂ are connected respectively, the first and second auxiliary evacuator 68 ₁ , 68 ₂ are operated, the first and second sub vacuum chambers 60 ₁ , 60 ₂ are evacuated.

An unwinding roller 61 and a winding roller 62 are disposed in the first and second sub vacuum chambers 60 ₁ and 60 ₂ , respectively. Further, the first sub-vacuum chamber 60 ₁ is arranged a first auxiliary roller _651, the vacuum chamber 11 the second to ninth auxiliary roller 65 _{2-65 9} is arranged, the second the auxiliary vacuum chamber 60 ₂ is disposed auxiliary rollers 65 ₁₀ tenth.
Each of the rollers 61, 62, 65 _{1 to} 65 ₁₀ has a central axis oriented in parallel to each other, and when it receives a rotational force from the outside, it rotates around its own central axis according to the rotational force.

In the present embodiment, the film formation target 50 is a strip-shaped flexible substrate.
Forming target 50 is disposed on the first sub-vacuum chamber 60 ₁ in a state wound into a roll around a longitudinal end, in the center of the roll is inserted out roller 61 winding.

And after the end of the object to be film 50 drawn from the outer periphery of the roll is passed over the first auxiliary roller 65 ₁ is carried into the vacuum chamber 11, the second to ninth auxiliary roller 65 ₂ to It is passed over in order to 65 _9. Then it is carried into the second sub-vacuum vessel 60 in _2, after being passed over to a tenth auxiliary roller 65 ₁₀ is wound on the winding roller 62.

  A winding device 66 for winding the film formation target 50 is connected to the winding roller 62. The winding device 66 is a motor, and applies a rotational force to the winding roller 62 to rotate the winding roller 62 about its central axis.

Here, the winding device 66 out roller 61 wound with the third, is connected to the eighth auxiliary roller 65 _3, 65 _8, the unwinding roller 61 third, eighth auxiliary roller 65 _3, 65 _A rotational force is applied to each of ₈ and rotated around the central axis in accordance with the rotation of the take-up roller 62.

Take-up roller 62 and the take-out roller 61 and the third and the eighth auxiliary roller 65 _3, 65 ₈ rotates, the film-forming target 50 wound around the take-up roller 62 is pulled, the by the pulling force Third, eighth auxiliary roller 65 _3, 65 ₈ non-rotating each of the auxiliary rollers 65 _1, 65 _2, 65 ₄ to 65 _7, 65 _9, 65 ₁₀ also, the film-forming target 50 is fed out from the roll .

At this time, a force opposite to the rotational force due to the pulling force is generated in the unwinding roller 61, and the film forming object 50 is brought into close contact with the outer peripheral side surfaces of the auxiliary rollers 65 _{1 to} 65 ₁₀ by the two forces. The two adjacent rollers 61, 62, 65 _{1 to} 65 ₁₀ are stretched in a planar shape.

When the take-up roller 62 further rotates, the film-forming target 50 is maintained from the take-out roller 61 to the take-up roller 62 while maintaining the flatness between the two adjacent rollers 61, 62, 65 _{1 to} 65 _10. Is taken up by the take-up roller 62.

In the present embodiment, the first and second inorganic film forming portions 20a ₁₂ and 20a ₃₄ are CVD apparatuses.
The first and second inorganic film forming units 20a ₁₂ and 20a ₃₄ apply voltages to the discharge containers 21 _{1 to} 21 ₄ and the discharge containers 21 _{1 to} 21 ₄ connected to the gas introduction units 14 _{1 to} 14 _4. CVD power sources 24 _{1 to} 24 ₄ are provided.
Each discharge container 21 _{1 to} 21 ₄ has an elongated shape and includes a discharge surface provided with a plurality of discharge ports along the longitudinal direction.

Here, the discharge containers 21 ₁ and 21 ₂ of the first inorganic film forming portion 20a ₁₂ are arranged along the outer periphery of the third auxiliary roller 65 ₃ , and the longitudinal direction is the central axis of the third auxiliary roller 65 _3. are oriented parallel to the emission surface is facing the outer peripheral side surface of the third auxiliary roller _653. Moreover, desorption chamber 21 _3, 21 ₄ of the second inorganic film forming portion 20a ₃₄ are arranged along the outer periphery of the eighth auxiliary roller 65 _8, the central axis of the longitudinal eighth auxiliary roller 65 ₈ are oriented parallel to the emission surface is facing the outer peripheral side surface of the eighth auxiliary roller 65 _8.

The CVD power sources 24 _{1 to} 24 ₄ are electrically connected to the discharge containers 21 _{1 to} 21 ₄ . The third and eighth auxiliary rollers 65 ₃ and 65 ₈ and the vacuum chamber 11 are placed at the ground potential.

In the present embodiment, the gas introduction portions 14 _{1 to} 14 ₄ are connected to the discharge containers 21 _{1 to} 21 ₄ , respectively, and are configured to introduce the raw material gas for the inorganic film into the discharge containers 21 _{1 to} 21 ₄ .
When the raw material gas to the discharge chamber 21 ₁ to 21 ₄ from the gas inlet 14 _{1-14 4} is introduced, the raw material gas introduced is discharged into the vacuum chamber 11 from the discharge port provided in the emitting surface.

The control unit 15 is connected to the gas inlet 14 _{1-14 4} increases the introduction amount of the gas of the gas inlet portion 14 _{1-14 4,} the vacuum chamber 11 10 ^-2 Pa or more pressure, in this embodiment Preferably, the pressure is maintained at 10 ² Pa or higher.

Raw material gas is discharged from the discharge port of the discharge vessel 21 ₁ to 21 _4, when a voltage is applied to the discharge chamber 21 ₁ to 21 ₄ from the CVD power supply 24 _{1-24 4,} the release of desorption chamber 21 ₁ to 21 ₄ face and a third, source gas between the outer side surface of the eighth auxiliary roller 65 _3, 65 ₈ is plasma, the third, eighth auxiliary roller 65 _3, multiplied passed film target 65 ₈ An inorganic film made of a reaction product of the source gas is formed on the surface of the object 50.

  The organic film forming unit 30 is disposed in the vacuum chamber 11 and applies a material container 31 in which a liquid organic film material 35 is accommodated and an organic film material 35 in the material container 31 to the surface of the film formation target 50. The material application part 32 and the material hardening part 36 which hardens the organic film material 35 apply | coated to the surface of the film-forming target 50 are provided.

Material application unit 32, than the first inorganic film forming portion 20a ₁₂ with respect to the conveying direction of the film-forming target 50 is located downstream, a fifth auxiliary roller 65 ₅ and a sixth auxiliary roller 65 ₆ here Are disposed below the film formation target 50 stretched between the two.

In the present embodiment, the material application section 32 is arranged in parallel with each other, and a plurality of material transmission rollers 32 _{1 to} 32 ₃ whose outer peripheral side surfaces are in contact with each other, and each of the material transmission rollers 32 _{1 to} 32 ₃ are respectively connected to their respective central axes. And a rotating device 34 that rotates two adjacent material transmission rollers 32 _{1 to} 32 ₃ in opposite directions.

In the drawing of FIG. 1, the number of material transmission rollers 32 _{1 to} 32 ₃ is three, but may be two or four or more.
Hereinafter, when the three material transmission rollers 32 _{1 to} 32 ₃ are referred to as first to third material transmission rollers, the first to third material transmission rollers 32 _{1 to} 32 ₃ are moved from below to above. are arranged in this order, a part of the third material transfer roller 32 ₃ fifth, is inserted between the sixth auxiliary roller 65 _5, 65 _6, the fifth part of the outer peripheral side surface, the sixth auxiliary It is pressed against and closely adhered to the surface of the film formation target 50 stretched between the rollers 65 ₅ and 65 ₆ .

The material container 31 has a bowl shape and is disposed below the material application unit 32. A part of the first material transmission roller 32 ₁ is inserted into the material container 31, and a part of the outer peripheral side surface is immersed in the organic film material 35.
Here, the rotating device 34 is a motor and is connected to the first to third material transmission rollers 32 _{1 to} 32 ₃ .

When the rotating device 34 is operated to rotate the first to third material transmission rollers 32 _{1 to} 32 ₃ , the organic film material 35 in the material container 31 is placed on the outer peripheral side surface of the first material transmission roller 32 _1. along been transmitted, in the contact portion of the first material transfer roller 32 ₁ and the second material transfer roller 32 ₂ is transferred to the second outer peripheral side surface of the material transfer roller 32 _2. Then, the organic film material 35 is transmitted along a second outer peripheral side surface of the material transfer roller 32 _2, at the contact portion between the second material transfer roller 32 ₂ and the third material transfer roller 32 _3, third It is transferred to the outer peripheral side surface of the material transfer roller 32 _3. Then, the organic film material 35 is transmitted along the outer side surface of the third material transfer roller 32 _3, at the contact portion between the third material transfer roller 32 ₃ and film formation object 50, the film-forming target 50 It is delivered to the surface and applied.

The organic film material 35 in the material container 31 is transmitted to the surface of the film formation target 50 through the outer peripheral side surfaces of the material transmission rollers 32 _{1 to} 32 _{3 while} remaining in a liquid state. Therefore, even if the pressure in the vacuum chamber 11 is 10 ⁻² Pa or more, the organic film material 35 is applied to the surface of the film formation target 50 with a uniform film thickness without being affected by the pressure in the vacuum chamber 11. Is done.

The outer peripheral side surface of the third material transmission roller 32 ₃ is flat, a liquid solid film may be formed on the surface of the film formation target 50, and the pattern shape is formed on the outer peripheral side surface of the third material transmission roller 32 _3. The pattern-shaped liquid film may be formed on the surface of the film formation target 50.

Material curing unit 36 is disposed downstream of the material dispenser 32 with respect to the conveying direction of the forming target 50, where Zhang between the sixth auxiliary roller 65 ₆ and the seventh auxiliary roller 65 ₇ The film formation target 50 is disposed at a position facing the surface of the film formation target 50.

In the present embodiment, the organic film material 35 is a photocurable resin, and the material curing unit 36 is an irradiation device that irradiates the surface of the film formation target 50 with either an electron beam or ultraviolet rays.
When an electron beam or ultraviolet ray is emitted from the material curing unit 36, the emitted electron beam or ultraviolet ray is incident on the liquid film on the surface of the film formation target 50, and the liquid film is cured to form a solid organic film. The

<Usage method of film forming apparatus>
A film forming method using the above-described film forming apparatus 10a will be described.

A liquid organic film material 35 is accommodated in the material container 31 of the organic film forming unit 30.
Here, the organic film material 35 is a photocurable resin, for example, tricyclodecane dimethanol diacrylate.

The organic film material 35 is preferably a silicone resin or an acrylic resin. This is because the use of these resins improves the resistance and transparency of the organic film.
The organic film material 35 preferably does not evaporate in a vacuum atmosphere. For example, the organic film material 35 has a viscosity of 350 Pa · s or less.

The vacuum chamber 11 and the first and second sub vacuum chambers 60 ₁ and 60 ₂ are evacuated to form a vacuum atmosphere. Thereafter, the vacuum evacuation is continued in the vacuum chamber 11 and in the first and second sub vacuum chambers 60 ₁ and 60 ₂ .
Introducing a raw material gas of the inorganic film material discharge chamber 21 ₁ to 21 ₄ of the inorganic film forming portion 20a _12, 20a ₃₄ through the gas inlet 14 _{1-14 4,} the vacuum from the outlet of the discharge vessel 21 ₁ to 21 ₄ Release into the tank 11. Thereafter, the introduction of gas is continued.
The source gas is, for example, a mixed gas of SiH ₄ gas and NH ₃ gas or N ₂ O gas. For example, Ar gas, H ₂ gas, or N ₂ gas may be added as the carrier gas.

The amount of gas introduced into the gas inlets 14 _{1 to} 14 ₄ is increased, and the pressure of the gas in the vacuum chamber 11 is maintained at 10 ⁻² Pa or higher, preferably 10 ² Pa or higher in this embodiment.
By applying a voltage to the discharge chamber 21 ₁ to 21 _4, desorption chamber 21 ₁ to 21 ₄ and the third, to generate plasma between the eighth auxiliary roller 65 _3, 65 _8, thereby chemically reacting the feed gas . Third, the inorganic film made of the reaction product is formed on the surface of the eighth auxiliary roller 65 _3, 65 ₈ looped around the object to be film 50. The inorganic film is preferably a metal oxide film or a metal nitride film, for example, a thin film of SiO _x , SiO _x N _y , or SiN _y .

Further, the first to third material transmission rollers 32 _{1 to} 32 ₃ of the organic film forming unit 30 are rotated. The liquid organic film material 35 in the material container 31 reaches the surface of the film formation target 50 in order through the outer peripheral side surfaces of the material transmission rollers 32 _{1 to} 32 ₃ , and the organic film is formed on the surface of the film formation target 50. A liquid film of material is formed.

Further, ultraviolet rays or electron beams are irradiated from the material curing unit 36 toward the surface of the film formation target 50.
The take-up roller 62 is rotated, and the film formation target 50 is conveyed from the take-out roller 61 toward the take-up roller 62.

When the film formation target 50 passes through a position where the film formation target 50 is in close contact with the third auxiliary roller 65 ₃ , the surface of the film formation target 50 is opposed to the discharge containers 21 ₁ and 21 ₂ of the first inorganic film forming unit 20a _12. Then, referring to FIG. 2A, the first inorganic film 52 ₁ is formed on the surface of the base layer 51 of the film formation target 50 (first inorganic film forming step).

Then, when passing between the film-forming target 50 and fifth auxiliary roller 65 ₅ and a sixth auxiliary roller 65 _6, the third material of the surface of the film-forming target 50 is an organic film forming unit 30 With contact with the transmission roller 32 ₃ , the organic film material 35 is applied to the surface of the first inorganic film 52 ₁ with reference to FIG. 2B (material application process).

Then, when the film-forming target 50 passes between the sixth auxiliary roller 65 ₆ and seventh auxiliary rollers 65 _7, the surface of the film-forming target 50 is facing the material curing unit 36, FIG. 2 Referring to (c), the organic film material 35 on the surface of the first inorganic film 52 ₁ is cured to form the first organic film 53 ₁ (material curing process).

Then, when passing through the position where the film-forming target is in close contact with the eighth auxiliary roller 65 _8, FIG. 2 (d) with reference to the second inorganic film 52 ₂ in the first organic film 53 ₁ on the surface Is formed (second inorganic film forming step).
This way, the surface of the base layer 51, a barrier film composed of a laminated film in which the first inorganic film 52 ₁ and the first organic film 53 ₁ and the second inorganic film 52 ₂ are laminated in this order is formed The

The film formation target 50 on which the barrier film is formed is wound around the winding roller 62.
By performing the inorganic film forming step before the material applying step, particularly when the underlayer 51 is a plastic substrate, gas emission from the underlayer 51 can be suppressed.

  By performing the inorganic film forming step and the material applying step in the same vacuum chamber 11, the cost of the apparatus is reduced. By performing the material application process in a vacuum atmosphere at the same pressure as the inorganic film forming process, there is no need to reduce the pressure in the vacuum chamber 11 after the inorganic film forming process and before the material applying process.

By simultaneously performing the inorganic film forming step and the material applying step in the same vacuum chamber 11, the production time of the barrier film is shortened.
In the inorganic film forming step, by forming the inorganic film by the CVD method, the denseness of the formed inorganic film is increased and the barrier property against gas and moisture is improved.
The stress of the organic film is relieved by forming the organic film by sequentially performing the material application process and the material curing process.

<Structure of film forming apparatus of second example>
The structure of the film forming apparatus of the second example of the present invention will be described.

FIG. 3 is an internal configuration diagram of the film forming apparatus 10b of the second example.
Of the structure of the film forming apparatus 10b of the second example, the same parts as those of the film forming apparatus 10a of the first example are denoted by the same reference numerals and description thereof is omitted.

In the second example of the deposition apparatus 10b, the first and second inorganic film forming unit 20b _12, 20b ₃₄ is a sputtering apparatus, a cathode electrode 27 _1-27 for holding the target 28 _{1-28 4} inorganic film materials _4, and a sputtering power source 29 _{1-29 4} for applying a voltage to the cathode electrode 27 _{1-27 4.}

Here, the cathode electrodes 27 ₁ and 27 ₂ of the first inorganic film forming portion 20b ₁₂ are arranged side by side along the outer periphery of the third auxiliary roller 65 ₃ , and the surfaces of the targets 28 ₁ and 28 ₂ are the third auxiliary rollers. It is the outer circumferential side surface and the opposite roller 65 _3. The cathode electrode 27 _3, 27 ₄ of the second inorganic film forming unit 20b ₃₄ are arranged along the outer periphery of the eighth auxiliary roller 65 _8, the surface of the target 28 _3, 28 ₄ an eighth auxiliary It is the outer circumferential side surface and the opposite roller 65 _8.

Sputtering power source 29 _{1-29 4} is electrically connected to the cathode electrode 27 _{1-27 4.} The third and eighth auxiliary rollers 65 ₃ and 65 ₈ and the vacuum chamber 11 are placed at the ground potential.
The gas introduction units 14 _{1 to} 14 ₄ are connected to the vacuum chamber 11 and are configured to introduce sputtering gas into the vacuum chamber 11.
The control unit 15 is connected to the gas inlet 14 _{1-14 4} increases the introduction amount of the gas of the gas inlet portion 14 _{1-14 4,} so as to maintain the vacuum chamber 11 to a pressure of more than 10 ^-2 Pa It is configured.

It is introduced sputtering gas into the vacuum chamber 11 through the gas inlet 14 _{1-14 4,} when a voltage is applied to the cathode electrode 27 _{1-27 4} from the sputtering power source 29 _{1-29 4,} the target 28 ₁ to 28 ₄ surface and the third, between the outer peripheral side surface of the eighth auxiliary roller 65 _3, 65 ₈ sputtering gas is converted to plasma, ions in the plasma to sputter the surface of the target 28 _{1-28 4,} the target 28 _{1-28 4} from the surface of the inorganic film material particles are released, the third, the inorganic film is formed to reach the surface of the eighth auxiliary roller 65 _3, 65 ₈ looped around the object to be film-formed 50 The

  The method of using the film forming apparatus 10b of the second example is the same as the method of using the film forming apparatus 10a of the first example except that the inorganic film is formed by sputtering, and the description thereof is omitted.

In the first and second film forming apparatuses 10 a and 10 b, the inorganic film forming units 20 a ₁₂ , 20 a ₃₄ or 20 b ₁₂ , 20 b ₃₄ and the organic film forming unit 30 are formed in the same vacuum chamber 11. If provided alternately along the longitudinal direction of the object 50, a configuration in which two inorganic film forming units and one organic film forming unit are arranged in the vacuum chamber 11 as described above. However, one inorganic film forming unit and two organic film forming units may be arranged in the vacuum chamber 11, or one inorganic film forming unit and one in the vacuum chamber 11. The organic film forming part may be arranged.

Further, two or more inorganic film forming parts and two or more organic film forming parts may be arranged in the vacuum chamber 11. In this configuration, referring to FIG. 2 (e), the inorganic film 52 ₁ on the surface of the film-forming target 50, ..., 52 n + ₁ and the organic film 53 _1, ..., and 53 _n are alternately and repeatedly laminated As a result, the barrier property of the barrier film is further improved.

In addition, the material hardening part 36 is not limited to the irradiation apparatus which radiates | emits an ultraviolet-ray or an electron beam as mentioned above, The heating apparatus which heats the film-forming target object 50 may be sufficient.
When the material curing unit 36 is a heating device, a thermosetting resin is used for the organic film material 35.
When infrared rays are emitted from the material curing unit 36, the emitted infrared rays are incident on a liquid film on the surface of the film formation target 50, and the liquid film is cured by heat to form a solid organic film.

10a, 10b ...... deposition apparatus 11 ...... vacuum tank 12 ...... evacuator 14 _{1-14 4} ...... gas inlet 15 ...... controller _{20a 12, 20a 34, 20b 12} , 20b 34 ...... inorganic film forming Section 30 ... Organic film forming section 31 ... Material container 32 ... Material application section 32 _{1 to} 32 ₃ ... Material transmission roller 35 ... Organic film material 36 ... Material curing section 50 ... Film formation target 66 ... ... Rewinder

Claims (22)

A vacuum chamber;
An evacuation unit for evacuating the vacuum chamber;
A gas introduction part for introducing gas into the vacuum chamber;
A control unit capable of increasing the amount of the gas introduced into the gas introduction unit to increase the pressure in the vacuum chamber to 10 ⁻² Pa or more;
An inorganic film forming unit for forming an inorganic film at a pressure of 10 ⁻² Pa or more on the surface of the film formation target disposed in the vacuum chamber; an organic film forming unit for forming an organic film;
Have
The organic film forming part is
A material container disposed in the vacuum chamber and containing a liquid organic film material;
A material application unit for applying the organic film material in the material container to the surface of the film formation target;
A material curing portion that cures the organic film material applied to the surface of the film formation target;
A film forming apparatus. The inorganic film forming part is a CVD apparatus,
The film forming apparatus according to claim 1, wherein the gas is a raw material gas for the inorganic film. The inorganic film forming unit is a sputtering device,
The film forming apparatus according to claim 1, wherein the gas is a sputtering gas. The material application part is
A plurality of material transmission rollers arranged in parallel with each other and whose outer peripheral side surfaces are in contact with each other;
A rotating device that rotates each of the material transmission rollers around a respective center axis, and rotates two adjacent material transmission rollers in opposite directions;
Have
The outer peripheral side surface of one of the material transmission rollers is immersed in the organic film material in the material container, and the outer peripheral side surface of the other one of the material transmission rollers is in contact with the surface of the film formation target, and the rotation The said organic film material in the said material container is apply | coated to the surface of the said film-forming target object along the outer peripheral side surface of each said material transmission roller, when each said material transmission roller is rotated by an apparatus, respectively. 4. The film forming apparatus according to any one of items 3. The material curing unit is an irradiation device that irradiates the surface of the film formation object with either an electron beam or ultraviolet rays,
The film forming apparatus according to claim 1, wherein the organic film material is a photocurable resin. The material curing unit is a heating device that heats the surface of the film formation target,
The film forming apparatus according to claim 1, wherein the organic film material is a thermosetting resin.   The film forming apparatus according to claim 1, wherein the organic film material is a silicone resin.   The film forming apparatus according to claim 1, wherein the organic film material is an acrylic resin.   The film forming apparatus according to claim 1, wherein the film formation target is a strip-shaped flexible substrate.   The film-forming apparatus of Claim 9 provided with the winding-up apparatus which winds up the said film-forming target object.   11. The film forming apparatus according to claim 9, wherein the inorganic film forming unit and the organic film forming unit are provided alternately along the longitudinal direction of the film formation target. A gas is introduced into the evacuated vacuum chamber, and an inorganic film is formed on the surface of the film formation target disposed in the vacuum chamber while maintaining the pressure in the vacuum chamber at 10 ⁻² Pa or higher. An inorganic film forming step to be formed;
A material application step of applying a liquid organic film material to the surface of the film formation target disposed in the vacuum chamber;
A material curing step of curing the applied organic film material to form an organic film;
A film forming method comprising: The gas is a raw material gas for the inorganic film,
The film forming method according to claim 12, wherein in the inorganic film forming step, the inorganic film is formed by a CVD method. The gas is a sputtering gas;
The film forming method according to claim 12, wherein in the inorganic film forming step, the inorganic film is formed by a sputtering method.   In the material application step, a material transmission roller having the organic film material attached to an outer peripheral side surface is brought into contact with the surface of the film formation target object, and the material transmission roller is rotated while maintaining the contact state to thereby form the organic film material. The film forming method according to claim 12, wherein the film forming method is applied. The organic film material is a photocurable resin,
The film forming method according to claim 12, wherein, in the material curing step, the surface of the film forming object is irradiated with an electron beam or an ultraviolet ray. The organic film material is a thermosetting resin,
The film forming method according to claim 12, wherein when the organic film material is cured, a surface of the object to be formed is heated.   The film forming method according to claim 12, wherein the organic film material is a silicone resin.   The film forming method according to claim 12, wherein the organic film material is an acrylic resin.   The film forming method according to claim 12, wherein the film forming target is a strip-shaped flexible substrate.   21. The film forming method according to claim 20, wherein the inorganic film forming step, the material applying step, and the material curing step are performed while winding up the film forming target.   21. The film forming method according to claim 12, wherein the inorganic film forming step, the material applying step, and the material curing step are repeated in this order.

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