JP2013169742A - Liquid discharge head, method for manufacturing the same, and image forming apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a droplet discharge head preventing deterioration of yield by stress in joining external wiring such as an FPC and preventing a joining section of the FPC from peeling off.SOLUTION: In a droplet discharge head 1 including a nozzle substrate 10 including a plurality of nozzles 11, a liquid chamber substrate 20 where pressure chambers 21 with which the respective nozzles 11 communicate are formed, and a frame substrate 50 where at least one dead spaces 51-54 that open to the liquid chamber substrate 20 side are formed, actuators 40 generating pressure in the pressure chambers 21, a drive means 70 driving the actuators 40, and electrodes 71 supplying an external signal to the drive means 70 through a wiring member 72 are provided at a position on the liquid chamber substrate 20 side and equivalent to the inside of the dead spaces, a gap 55 for introducing the wiring member 72 from outside into the dead space is arranged in the frame substrate 50, and the liquid chamber substrate side electrodes 71 and a wiring member side electrode introduced from the gap 55 are electrically joined with each other.

Description

  The present invention relates to a liquid discharge head used in a printer, a copying machine, a facsimile machine, and the like, a manufacturing method thereof, and an image forming apparatus including the same.

In various image forming apparatuses such as printers, facsimiles, copiers, plotters, printer / facsimile / copier multifunction machines, etc., a liquid ejecting apparatus that mounts a liquid ejecting head for ejecting a recording liquid and forms an image on a recording medium is provided. What you have is known.
The liquid discharge device is also called a recording medium (recording medium, transfer paper, paper, etc.) such as paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, ceramics, etc., regardless of the material. Used as a synonym) means a device that ejects liquid, and “recording” not only applies an image having a meaning such as a character or a figure to a recording medium, but also a pattern, etc. This also means that an image having no meaning is given to a recording medium, and image formation, printing, printing, and printing are also used synonymously.
As an ink jet head as a liquid discharge head, a thin film piezoelectric element head in which a piezoelectric body is formed in a thin film shape as a pressure generating means for generating pressure to pressurize ink, which is a liquid in a liquid chamber, and nozzle density is increased It has been known.
The ink jet head using the thin film piezoelectric element has a feature that the density can be increased and the ink selection range is wide.

By the way, in the conventional ink jet head, the substrate may be cracked due to stress on the actuator substrate or the like generated when an external wiring such as FPC is joined to the lead electrode from the driver IC for driving the piezoelectric body. There is a problem that the yield decreases due to the deformation, and the joint portion where the FPC or the like is joined to the extraction electrode is peeled off.
On the other hand, for example, Patent Document 1 proposes a technique for reliably joining a connection terminal of a lead wiring for driving a piezoelectric element and an external wiring cable via a metal melted by laser light.
In Patent Document 2, a drive circuit such as a driver IC, drive wiring, and external wiring terminals are formed on a frame substrate to prevent a flow path forming substrate and the like from being cracked during bonding.

However, in Patent Document 1, the bonding strength is ensured only by solder bonding, and problems such as peeling of the bonded portion occur during handling of the FPC.
Further, even if resin reinforcement is used as reinforcement, there is a problem in that the same part as the joint is reinforced, and stress in the peeling direction is applied to the joint.
Further, in Patent Document 2, since a driver IC or the like is mounted on the frame substrate side, the head size is increased, resulting in an increase in cost.

  The present invention has been made in view of such a problem, and it is possible to prevent a drop in yield due to stress at the time of joining an external wiring such as an FPC and to prevent a joint portion of the FPC from peeling off. An object is to provide a head and an image forming apparatus including the head.

  In order to solve the above-mentioned problem, the invention of claim 1 is characterized in that at least a nozzle substrate having a plurality of nozzles for discharging liquid, and a pressure chamber in which each nozzle communicates individually, which are sequentially stacked on the nozzle substrate. A liquid chamber substrate formed on the liquid chamber substrate side, and a frame substrate formed with at least one cavity opened on the liquid chamber substrate side, the pressure chamber at a position corresponding to the space on the liquid chamber substrate side. An actuator for generating a pressure to pressurize the liquid, a driving means for driving the actuator, and an electrode for supplying an external signal to the driving means via a wiring member, and the wiring board includes the wiring member. A gap is provided for introducing the liquid into the cavity from the outside, and the liquid chamber substrate side electrode and the wiring member side electrode introduced from the gap are electrically joined.

  By configuring as described above, according to the present invention, a gap is formed between the frame substrate and the liquid chamber substrate, and the FPC is mounted on the liquid chamber substrate through the gap. When handling an FPC, there is no structural stress in the peeling direction on the FPC joint, and shear stress on the joint terminal direction prevents damage to the FPC joint and the liquid chamber substrate. I can do it.

FIG. 3 is a diagram illustrating an example of an image forming apparatus including a liquid discharge head. FIG. 3 is a diagram illustrating an example of an image forming apparatus including a liquid discharge head. 1 is a perspective view illustrating an example of an ink jet recording head according to an embodiment. The top view centering on a liquid chamber board | substrate. Sectional drawing centering on a liquid chamber board | substrate. The top view of the FPC junction part with respect to a liquid chamber board | substrate. The top view centering on a liquid chamber board | substrate (the 2).

Embodiments of the present invention will be described below in detail with reference to the drawings.
First, an example of an image forming apparatus provided with a liquid discharge head according to the present invention will be described with reference to FIGS.
In this image forming apparatus, a carriage 103 is slidably held in a main scanning direction by a guide rod 101 and a guide rail 102 that are horizontally mounted on left and right side plates (not shown), and a driving pulley 106A is driven by a main scanning motor 104. And the driven pulley 106B are moved and scanned in the direction indicated by the arrow (main scanning direction) via the timing belt 105.
For example, four independent ink jet recording liquid droplets (ink droplets) of black (K), cyan (C), magenta (M), and yellow (Y) are recorded on the carriage 103. A recording head (droplet discharge head) 1 composed of the liquid discharge heads 1k, 1c, 1m, and 1y is arranged in a direction along the main scanning direction, and is mounted with the droplet discharge direction facing downward. In addition, although the independent liquid discharge head is used here, it is also possible to employ a configuration in which one or a plurality of heads having a plurality of nozzle rows for discharging recording liquid droplets of each color are used. Further, the number of colors and the arrangement order are not limited to this.
The carriage 103 is equipped with a sub tank 108 for each color for supplying each color ink to the recording head 1. Ink is supplied to the sub tank 108 from a main tank (ink cartridge) (not shown) via an ink supply tube 109.

On the other hand, as a sheet feeding unit for feeding a recording medium (sheet) 112 loaded on a sheet stacking unit (pressure plate) 111 such as a sheet feeding cassette 110, the sheets 112 are separated and fed from the sheet stacking unit 111 one by one. Opposite to the half-moon roller (feed roller) 113 and the feed roller 113 to be fed, a separation pad 114 made of a material having a large friction coefficient is provided, and this separation pad 114 is urged toward the feed roller 113 side.
As a transport unit for transporting the paper 112 fed from the paper feed unit on the lower side of the recording head 1, a transport belt 121 for electrostatically attracting and transporting the paper 112, and a paper feed unit A counter roller 122 for transporting the paper 112 fed through the guide 115 while sandwiching it between the transport belt 121 and the paper 112 fed substantially vertically upward is changed by about 90 ° and copied on the transport belt 121. And a pressure roller 125 </ b> A and a tip pressure roller 125 </ b> B urged toward the conveyance belt 121 by the pressing member 124. In addition, a charging roller 126 that is a charging unit for charging the surface of the conveyance belt 121 is provided.

Here, the conveyance belt 121 is an endless belt, and is stretched between the conveyance roller 127 and the tension roller 128, and the conveyance roller 127 rotates from the sub-scanning motor 131 via the timing belt 132 and the timing roller 133. By doing so, it is configured to go around in the belt conveyance direction (sub-scanning direction). A guide member 129 is disposed on the back side of the conveying belt 121 corresponding to the image forming area by the recording head 1.
The charging roller 126 is arranged so as to contact the surface layer of the conveyor belt 121 and rotate following the rotation of the conveyor belt 121, and applies 2.5N to both ends of the shaft as a pressing force.
Further, as a paper discharge unit for discharging the paper 112 recorded by the recording head 1, a separation unit for separating the paper 112 from the conveyance belt 121, a paper discharge roller 152 and a paper discharge roller 153, and paper discharge A paper discharge tray 154 for stocking the paper 112 to be printed.

A double-sided paper feeding unit 155 is detachably mounted on the back. The double-sided paper feeding unit 155 takes in the paper 112 returned by the reverse rotation of the transport belt 121, reverses it, and feeds it again between the counter roller 122 and the transport belt 121.
Further, as shown in FIG. 2, a maintenance / recovery mechanism 156 for maintaining and recovering the state of the nozzles of the recording head 1 is disposed in a non-printing area on one side of the carriage 103 in the scanning direction.
The maintenance / recovery machine 156 includes a cap 157 for capping each nozzle surface of the recording head 1, a wiper blade 158 that is a blade member for wiping the nozzle surface, and a discharge unit for discharging the thickened recording liquid. An empty discharge receiver 159 for receiving droplets when performing empty discharge for discharging droplets that do not contribute to recording is provided.
In the image forming apparatus configured as described above, the sheets 112 are separated and fed one by one from the sheet feeding unit, and the sheet 112 fed substantially vertically upward is guided by the guide 115, and includes the conveyance belt 121 and the counter roller 122. The leading end is guided by the conveying guide 123 and pressed against the conveying belt 121 by the leading end pressure roller 125, and the conveying direction is changed by approximately 90 °.

At this time, a positive voltage output and a negative output are alternately repeated from the AC bias supply unit to the charging roller 126 by a control circuit (not shown), that is, a charging voltage pattern in which an alternating voltage is applied and the conveying belt 121 alternates. That is, plus and minus are alternately charged in a band shape with a predetermined width in the sub-scanning direction which is the circumferential direction. When the paper 112 is fed onto the conveyance belt 121 charged alternately with plus and minus, the paper 112 is attracted to the conveyance belt 121 by electrostatic force, and the paper 112 is conveyed in the sub-scanning direction by the circular movement of the conveyance belt 121. Is done.
Therefore, by driving the recording head 1 according to the image signal while moving the carriage 103 in the forward and backward directions, ink droplets are ejected onto the stopped paper 112 to record one line, and the paper 112 is After transporting a predetermined amount, the next line is recorded. Upon receiving a recording end signal or a signal that the trailing edge of the paper 112 has reached the recording area, the recording operation is finished, and the paper 112 is discharged onto the paper discharge tray 154.

In the case of double-sided printing, when recording on the front surface (surface to be printed first) is completed, the recording belt 112 is fed into the double-sided paper feeding unit 155 by rotating the conveyor belt 121 in the reverse direction. The paper 112 is reversed (with the back surface being the printing surface), and is fed again between the counter roller 122 and the conveyor belt 121. The timing is controlled, and the sheet is conveyed onto the conveyor bell 121 as described above. Then, after recording on the back surface, the paper is discharged onto a paper discharge tray 154.
Further, during printing (recording) standby, the carriage 103 is moved to the maintenance / recovery mechanism 155 side, and the nozzle surface of the recording head 1 is capped by the cap 157, and the nozzles are kept in a wet state, thereby causing ejection failure due to ink drying. To prevent. In addition, the recording liquid is sucked from the nozzle in a state where the recording head 1 is capped with the cap 157 (referred to as “nozzle suction” or “head suction”), and a recovery operation is performed to discharge the thickened recording liquid or bubbles. Wiping is performed by the wiper blade 158 in order to clean and remove ink adhering to the nozzle surface of the recording head 1 by this recovery operation. In addition, an idle ejection operation for ejecting ink not related to recording is performed before the start of recording or during recording. Thereby, the stable ejection performance of the recording head 1 is maintained.

As described above, the image forming apparatus includes the recording head constituted by the liquid ejection head according to the present invention, so that the size and cost can be reduced and the number of ejectable nozzles can be increased with the same ejection head size. Further high-speed printing is possible. In the above embodiment, the present invention has been described with reference to an example in which the present invention is applied to an image forming apparatus having a printer configuration. However, the present invention is not limited to this. For example, the present invention may be applied to an image forming apparatus such as a printer / fax / copier multifunction machine. it can. Further, the present invention can be applied to an image forming apparatus using a recording liquid or a fixing processing liquid that is a liquid other than ink.
By applying the recording head of this embodiment described below, it is possible to provide an image forming apparatus that can realize high image quality and low cost. In addition, a high-speed, high-quality liquid discharge apparatus can be realized by mounting a discharge head using a multilayer piezoelectric element with high density and stable ejection performance as an actuator.

FIG. 3 is a perspective view showing an example of an ink jet recording head as a droplet discharge head according to the present embodiment.
A characteristic configuration of the ink jet recording head according to the present embodiment will be described in detail with reference to FIG. 4 and subsequent figures, and an outline thereof will be described with reference to FIG.
The droplet discharge head according to the present embodiment has a configuration in which a nozzle substrate 10, a liquid chamber substrate (actuator substrate) 20, a frame substrate 50, and a backing plate 60 are sequentially laminated (bonded).
The backing plate 60 includes an ink supply port 61 that supplies liquid (ink) from the sub tank 108 inside the carriage 103, and supplies ink from the ink supply port 61 to a common liquid chamber (not shown) provided in the frame substrate 50. To do.

[Structure of droplet discharge head]
4 is a plan view of the droplet discharge head centered on the liquid chamber substrate 20, and FIG. 5 is a cross-sectional view of the droplet discharge head centered on the liquid chamber substrate 20. As shown in FIG.
The cross-sectional view of FIG. 5 is a cross-sectional view taken along the line AA of FIG. 3, and illustration of the ink supply port and the common liquid chamber is omitted.
As described with reference to FIG. 3, as shown in FIGS. 4 and 5, the droplet discharge head 1 includes a nozzle substrate 10 including a plurality of nozzles 11 that discharge droplets, and a pressure at which each nozzle 11 communicates. A liquid chamber substrate 20, which defines an individual liquid chamber 21 as a generation chamber, a frame substrate 50, and a backing plate 60 are sequentially joined.

Further, a vibration plate 22 is provided on one side of the liquid chamber substrate 20 (on the side opposite to the nozzle substrate 10 and on the frame substrate 50 side), and the vibration is deformed by applying a voltage on the vibration plate 22. A piezoelectric element 40 as an actuator that causes a pressure change in the pressure generating chamber 21 by deforming the plate 30; and a driver IC (hereinafter referred to as DrIC) 70 as a driving means for driving the piezoelectric element 40; And an electrode 71 for electrically connecting to an electrode 72a of an FPC (Flexible Printed Circuits) 72 extending from the main body of the image forming apparatus and supplying a signal to the DrIC 70.
The frame substrate 50 is subjected to penetration processing and stepped groove processing by half-etching, and by joining the frame substrate 50 to the liquid chamber substrate 20, a displacement region of the piezoelectric element 40, an FPC mounting insertion portion, and a mounting region of the DrIC 70 are formed. Is formed.
That is, the piezoelectric element 40, the DrIC 70, and the electrode 71 are accommodated in cavities 51 to 54 formed in the frame substrate 50 so as to penetrate to the liquid chamber substrate 20.

Further, the frame substrate 50 adjacent to the space 54 as the FPC mounting insertion portion in which the electrode 71 is accommodated is processed by half etching, and a gap portion 55 is formed between the electrode chamber 71 and the liquid chamber substrate 20. Has been. The gap 55 communicates with the void 54 and serves as a gap for introducing (inserting) the FPC 72 into the void 54 from the image forming apparatus main body.
Further, as shown in FIG. 5, the FPC 72 is joined to the electrode 71 at the FPC joint 73 in the void 54, and the joint is reinforced by the FPC reinforcement 74 in the gap 55. The FPC reinforcing portion 74 will be described in detail later.

[Manufacturing process of droplet discharge head]
An example of a manufacturing process of a droplet discharge head having such a configuration will be described.
In this embodiment, the liquid chamber substrate 20 is composed of a silicon single crystal substrate having a plane orientation (110), and a substrate having a thickness of about 400 μm is usually used.
A functional film functioning as the diaphragm 22 is formed on the liquid chamber substrate 20 with a thickness of 1 to 2 μm, and a piezoelectric element 40 and upper and lower electrodes are formed thereon.
Here, regarding the electrode formation, it is desirable to perform nickel and gold plating for the purpose of improving the mountability of the DrIC 70.

Next, through holes (voids 51 to 54) are formed in a predetermined pattern by a through process in the silicon single crystal substrate to be a frame substrate, and a step groove process is performed by half etching to form a gap 55. As a processing method, dry etching such as ICP (inductively coupled plasma) or etching using KOH (potassium hydroxide) can be used.
The gap 55 may be formed across the liquid chamber substrate 20. However, the groove chamber processing by half etching is also required for the liquid chamber substrate 20.
Half etching of the frame substrate 50 is formed corresponding to the displacement of the piezoelectric element in the individual liquid chamber 21, and the FPC 72 can pass between the frame substrate 50 and the liquid chamber substrate 20.
Further, the liquid chamber substrate 20 and the frame substrate 50 are bonded and bonded in a wafer state.
After joining the frame substrate 50, the liquid chamber substrate 20 is polished to a thickness corresponding to the liquid chamber height of the individual liquid chamber 21. By anisotropically etching the silicon single crystal substrate, pressure generating chambers partitioned by a plurality of partition walls are arranged in parallel in the width direction.
The outer side in the longitudinal direction of the liquid chamber substrate 20 communicates with a common liquid chamber (not shown) formed on the frame substrate 50 and the like, which communicates with a frame substrate 50 described later and serves as a common ink chamber for each pressure generating chamber.
The individual liquid chamber 21 is etched while leaving the diaphragm layer 22.

As shown in FIG. 5, if the etching process is performed in advance so that the outer shape of the liquid chamber substrate 20 on the FPC 72 insertion side is smaller than the outer shape of the frame substrate 50, the workability of the subsequent FPC insertion process is improved. It is possible to improve quality as well as cost reduction.
After this adhesive bonding, the surface of the DrIC 70 on which the Au stud bump is formed is mounted by a method such as ultrasonic flip chip bonding. By ultrasonic flip chip mounting, the liquid chamber substrate 20 can be heated at a low temperature, and can be mounted at low cost without being damaged by thermal stress.

Further, the flip chip mounting portion is sealed and cured with an underfill resin. By flip-chip mounting the DrIC 70, the liquid chamber substrate 20 can be reduced in size, and the cost of the head module can be reduced.
When the DrIC 70 is sealed with the underfill resin, the frame substrate left between the void 52 and the void 54 is sealed to prevent the underfill resin from flowing toward the void 54. It functions as a material dam 56.
In addition, the liquid chamber substrate 20 on which the DrIC 70 is flip-chip mounted is formed with an electrode 71 for joining with an external wiring (FPC 72).
Thereafter, it is divided into individual head sizes by dicing.

The liquid chamber substrate 20 on the FPC bonding side is etched in advance, so that the end portion of the liquid chamber substrate 20 where the FPC 72 is inserted is drawn by dicing with the frame substrate 50 attached. Due to the structure, the FPC 72 can be easily inserted from the gap portion 55.
Solder plating such as Sn (silicon) / Bi (bismuth) is applied to the junction terminal of the FPC 72 with the electrode 71.
The FPC 72 is passed through the gap 55 provided between the frame substrate 50 / liquid chamber substrate 20, and after aligning the FPC electrode 72a with the external connection terminal (electrode 71) of the liquid chamber substrate 20, pulse heat or laser irradiation, etc. With this heating means, solder bonding is possible (FPC bonding portion 73).
Here, the liquid chamber substrate 20 side was preheated at 100 ° C., and solder bonding was performed by a pulse heat method.
However, this configuration can be applied not only to solder bonding but also to metal diffusion bonding such as Au / Sn eutectic bonding.
According to this configuration, when the FPC 72 is handled after the FPC bonding, structurally, no stress in the peeling direction is applied to the FPC bonding portion 73, and stress in the shearing direction with respect to the bonding terminal direction. Breakage of the joint 73 and the thin liquid chamber substrate 20 can be prevented.

Further, by allowing the adhesive to permeate the interface of the FPC 72 / liquid chamber substrate 20 and the interface of the FPC 72 / frame substrate 50 and to cure and bond them, it is possible to make a structure in which external stress is not applied to the FPC joint 73 ( FPC reinforcement 74).
After the FPC is mounted, the assembly of the individual liquid chambers is completed by adhesively bonding the nozzle substrate 10.
The nozzle substrate bonding can be performed before the FPC bonding.
By doing in this way, even when handling after FPC mounting, it is possible to avoid a cost increase and to make a mounting configuration in which mechanical stress is not applied to the FPC joint 73.
That is, since the reinforcing bonding is performed outside the FPC joint 73, stress is not applied to the FPC joint even during FPC handling, and yield can be improved and stress on the liquid chamber substrate 20 can be reduced.
As described above, by providing a region through which the FPC passes between the frame substrate 50 and the liquid chamber substrate 20 which are the head constituent members, and separating the FPC bonding portion and the adhesion reinforcing portion, it is possible to ensure bonding reliability.

[Description of FPC joint]
FIG. 6 is a plan view of the FPC bonding portion with respect to the liquid chamber substrate.
When joining the Au electrode on the liquid chamber substrate 20 with solder on the FPC electrode, a laser heating means was employed.
The laser uses a 940 nm semiconductor laser, passes through the base polyimide film, and heats the Cu electrode to melt and bond the solder.
However, heat transfer to the liquid chamber substrate 20 is large, and it has been difficult to ensure wet spread of the melted “solder”.
In the present embodiment, it was verified that the solder power spread to the substrate side can be secured by increasing the laser power at the time of soldering, partially melting the base film polyimide, and directly heating the Cu electrode portion with laser.
Although a configuration in which the FPC base is punched out from the beginning is also conceivable, the wiring pattern pitch is narrow and the FPC wiring strength cannot be secured, so that it cannot be adopted.
Since the base film can be melted only in a predetermined region by laser irradiation in the solder joint state, the above problems can be solved and solder wettability can be ensured, so that the joint reliability can be improved.
Also, solder wettability is ensured for the electrode 71 of the liquid chamber substrate 20 having a large heat transfer by partially melting the FPC base film with a laser and enabling the direct heating of the electrode part by the laser. It is possible to improve the bonding reliability.

[Modification of FPC bonding to liquid chamber substrate]
FIG. 7 is a cross-sectional view showing a modification of FPC bonding to the liquid chamber substrate 20.
Since it is the same as that of the said Example until before joining of FPC72, description is abbreviate | omitted.
As the configuration of the electrode 72a of the FPC 72, Ni / Au plating was applied in order to connect by Au wire bonding.
As shown in FIG. 7, the FPC 72 is passed through the frame substrate 50 / liquid chamber substrate 20 by a predetermined length with the electrode (72a) surface of the FPC 72 facing upward.
An adhesive is supplied to the interface between the FPC 72 and the liquid chamber substrate 20, and the osmotic pressure is used to fill the interface portion of the FPC 72 / liquid chamber substrate 20 with the adhesive, followed by heat curing (FPC bonding portion 74A).
Then, the external connection terminal 71 of the liquid chamber substrate 20 and the FPC electrode 72 a were connected by Au wire bonding 75. As bonding conditions, ultrasonic output at the time of bonding can be increased, so bonding at room temperature was also possible.

Further, an epoxy sealant 76 was applied and cured at 70 ° C. for 50 minutes.
As described above, since the wire bonding method can be performed and the electric bonding portion and the FPC bonding portion can be separated from each other, the bonding to the liquid chamber substrate 20 can be greatly reduced. Further, since the FPC reinforcing function can be separated, the reliability can be improved. That is, by separating the electrical connection function and the mechanical adhesion function of the input terminal portion, high reliability can be ensured at low cost.
In addition, since the FPC pasting process can be simplified and a manufacturing process that enables formation with the liquid chamber substrate 20 by a wire bonding method is provided, manufacturing costs can be reduced and bonding at a low temperature becomes possible. The stress on the liquid chamber substrate 20 can be reduced and the reliability can be improved.

  1 droplet discharge head, 10 nozzle substrate, 11 nozzle, 20 liquid chamber substrate, 21 pressure generating chamber, 22 diaphragm, 40 piezoelectric element, 50 frame substrate, 51 void, 52 void, 54 void, 55 gap , 56 Sealing material dam, 60 Backing plate, 61 Ink supply port, 70 DrIC, 71 External connection terminal, 72 FPC, 72a FPC electrode, 73 FPC joint, 74 FPC reinforcing part, 74A FPC bonding part, 75 Au wire Bonding, 76 Sealant

JP 2003-063006 A JP 2003-080703 A

Claims (5)

At least a nozzle substrate having a plurality of nozzles for discharging liquid, a liquid chamber substrate that is sequentially stacked on the nozzle substrate, and that has a pressure chamber in which each nozzle communicates with each other, and an opening on the liquid chamber substrate side A frame substrate having at least one void formed therein,
An actuator for generating a pressure for pressurizing the liquid in the pressure chamber at a position corresponding to the liquid chamber substrate side and in the space, a driving means for driving the actuator, and a driving member via the wiring member. An electrode for supplying an external signal,
The frame board is provided with a gap for introducing the wiring member into the space from the outside,
A liquid droplet ejection head, wherein the liquid chamber substrate side electrode and the wiring member side electrode introduced from the gap are electrically joined. The droplet discharge head according to claim 1,
The liquid chamber substrate side electrode and the wiring member side electrode are soldered or metal diffusion bonded, and the liquid chamber substrate and the wiring member are bonded and reinforced by an adhesive at least in the gap. A droplet discharge head characterized by that.   3. The liquid droplet ejection head according to claim 2, wherein a part of the substrate of the wiring member is melted and the wiring member side electrode is exposed on an upper surface side, and the wiring member side electrode is on the liquid chamber substrate side. A liquid discharge head characterized by being bonded to an electrode.   An image forming apparatus comprising the liquid discharge head according to claim 1. A method for manufacturing a droplet discharge head according to any one of claims 1 to 3,
Mounting the actuator, the driving means, and the liquid chamber substrate side electrode on the upper surface of the liquid chamber substrate;
Forming the pressure chamber on the lower surface of the liquid chamber substrate;
Bonding a nozzle substrate having a nozzle communicating with the pressure chamber to a lower surface of the liquid chamber substrate;
The frame substrate having at least a space capable of accommodating the liquid chamber substrate side electrode and a step portion serving as the gap portion into which the wiring member can be introduced in the space is bonded to the upper surface of the liquid chamber substrate. Steps,
Introducing the wiring member into the space from the gap formed between the liquid chamber substrate and the frame substrate;
Applying and curing an adhesive on the interface between the liquid chamber substrate and the wiring member;
Bonding or connecting the liquid chamber substrate side electrode and the wiring member side electrode;
A method for manufacturing a droplet discharge head, comprising:

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