JP2013166218A - Machining device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a machining device capable of suppressing dispersion of a machining fluid.SOLUTION: A machining device 100 includes a pair of supports 10 for stretching a wire 20 to be orthogonal to a predetermined axial direction, and a drive part 40 for changing a relative position between the pair of supports 10 and an ingot 200 toward the predetermined axial direction and a direction orthogonal to the wire 20. The pair of supports 10 has a power supply for supplying electric power to the wire 20 and an injection nozzle for injecting a machining fluid along the wire 20. The drive part 40 changes a relative position between the pair of supports 10 and the ingot so that a distance between a workpiece at least including the ingot 200 and the supports 10 is kept constant.

Description

  The present invention relates to a processing apparatus for cutting a wafer from an ingot.

  Conventionally, electric discharge machining using a wire has been proposed as a method of cutting a wafer from an ingot. Specifically, the wafer is cut out from the ingot by causing a discharge between the wire and the ingot using the wire as an electrode (for example, Patent Document 1).

JP 2010-46792 A

  By the way, when the temperature of a wire rises, a wire may be cut. Further, when the cut material is deposited, efficient discharge is not sustained, and the wafer cutting efficiency is lowered. Therefore, it is conceivable to cool the wire with a working fluid such as water and remove the accumulated cut material.

  However, in general, the ingot has a cylindrical shape, and the distance between the spray nozzle for injecting the processing liquid and the side surface of the ingot changes in the process of cutting the wafer from the ingot. In other words, in a portion where the distance between the spray nozzle and the side surface of the ingot is long, the machining liquid diffuses, the wire may not be sufficiently cooled, and the accumulated cut material may not be sufficiently removed.

  Therefore, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a processing apparatus that can suppress the diffusion of the processing liquid.

  The processing apparatus according to the first feature cuts a plate-shaped wafer centered on the predetermined axis direction from a columnar ingot extending in the predetermined axis direction. The processing apparatus includes: a pair of supports that stretch the wire so as to be orthogonal to the predetermined axis direction; and the pair of supports and the ingot in the direction orthogonal to the predetermined axis direction and the wire. And a drive unit that changes the relative position. The pair of supports includes a power source that supplies electric power to the wires and an injection nozzle that injects a working fluid along the wires. The drive unit changes the relative positions of the pair of supports and the ingot so that the distance between the workpiece including at least the ingot and the support is kept constant.

  1st characteristic WHEREIN: The accommodation jig | tool which accommodates the said ingot from the side surface of the said ingot is provided. The housing jig includes a pair of side end surfaces extending along the predetermined axis direction and a direction orthogonal to the wire, and a slit constituting a surface orthogonal to the predetermined axis direction. The drive unit changes the relative positions of the pair of support bodies and the ingot along the pair of side end surfaces. The wire moves in the slit as the relative position of the pair of supports and the ingot changes. The workpiece is the receiving jig and the ingot.

  In the first feature, the width of the slit is larger than the cut-out width of the wafer.

  In the first feature, the housing jig is formed of a conductive member.

  In the first feature, the ingot has a circular shape in a cross section orthogonal to the predetermined axis direction.

  In the first special feature, the ingot has a ring shape in a cross section perpendicular to the predetermined axial direction.

  ADVANTAGE OF THE INVENTION According to this invention, the processing apparatus which makes it possible to suppress spreading | diffusion of a process liquid can be provided.

FIG. 1 is a diagram illustrating a processing apparatus 100 according to the first embodiment. FIG. 2 is a diagram illustrating the processing apparatus 100 according to the first embodiment. FIG. 3 is a diagram illustrating the processing apparatus 100 according to the first embodiment. FIG. 4 is a diagram illustrating the processing apparatus 100 according to the first embodiment. FIG. 5 is a diagram illustrating the processing apparatus 100 according to the first embodiment. FIG. 6 is a diagram illustrating a processing apparatus 100 according to the first modification.

  Hereinafter, a processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals.

  However, it should be noted that the drawings are schematic and ratios of dimensions and the like are different from actual ones. Therefore, specific dimensions and the like should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

[Outline of Embodiment]
The processing apparatus according to the embodiment cuts a plate-shaped wafer centered on the predetermined axial direction from a columnar ingot extending in the predetermined axial direction. The processing apparatus includes a pair of supports that stretch the wire so as to be orthogonal to the predetermined axis direction, and the pair of supports and the ingot toward the direction orthogonal to the predetermined axis direction and the wire And a drive unit that changes the relative position. The pair of supports includes a power source that supplies electric power to the wires and an injection nozzle that injects a working fluid along the wires. The drive unit changes the relative positions of the pair of supports and the ingot so that the distance between the workpiece including at least the ingot and the support is kept constant.

  In the embodiment, the drive unit changes the relative positions of the pair of supports and the ingot so that the distance between the workpiece including at least the ingot and the support is kept constant. Therefore, the diffusion of the machining fluid sprayed from the spray nozzle is suppressed, the wire can be sufficiently cooled, and the accumulated cut material is sufficiently removed.

[First Embodiment]
(Configuration of processing equipment)
Hereinafter, the processing apparatus according to the first embodiment will be described. 1-5 is a figure which shows the processing apparatus 100 which concerns on 1st Embodiment. Here, the processing apparatus 100 is an apparatus that cuts a plate-shaped wafer from the ingot 200. The ingot 200 has a columnar shape extending in a predetermined axial direction (X direction).

  As shown in FIG. 1, the processing apparatus 100 includes a support body 10, a wire 20, and an accommodation jig 30. Moreover, although not shown in FIG. 1, the processing apparatus 100 has the drive part 40 (refer FIGS. 2-5). In the first embodiment, the workpiece to be cut by the wire 20 includes the ingot 200 and the accommodation jig 30.

  The support body 10 includes a support body 10A and a support body 10B. The support 10A and the support 10B stretch the wire 20 so as to be orthogonal to the predetermined axial direction. Specifically, the support 10A and the support 10B stretch the wire 20 with a predetermined tension along the Y direction.

  The support body 10 </ b> A and the support body 10 </ b> B include a power source that supplies power to the wire 20 and an injection nozzle that injects the processing liquid along the wire 20. The processing liquid is, for example, water. However, the power supply provided on the support 10 may be considered as a power supply board that supplies power supplied from an external power supply to the wires 20.

  The wire 20 is configured by a conductive member. When power is supplied to the wire 20, a discharge is generated between the wire 20 and the ingot 200, and a wafer is cut out from the ingot 200 by the wire 20 (electric discharge machining).

  The accommodation jig 30 accommodates the ingot 200 from the side surface of the ingot 200. The housing jig 30 is preferably composed of a conductive member.

  Specifically, the accommodation jig 30 includes a pair of side end surfaces 31 (a side end surface 31 </ b> A and a side end surface 31 </ b> B) and a plurality of slits 32. The side end surface 31A and the side end surface 31B are side end surfaces that extend along a direction (Z-axis direction) orthogonal to a predetermined axial direction (X-axis direction) and the wire 20 (Y-axis direction). The side end face 31A and the side end face 31B are substantially parallel to each other.

  The slit 32 forms a surface orthogonal to the predetermined axial direction (X-axis direction). The slit 32 constitutes a passage route through which the wire 20 passes. Specifically, the slit 32 communicates with the side end surface 31A and the side end surface 31B, and is configured such that the wire 20 can move between both ends of the ingot 200 in the Z-axis direction. Here, the width of the slit 32 is larger than the cut-out width of the wafer cut out from the ingot 200. In other words, the width of the slit 32 is larger than the diameter of the wire 20. For example, when the diameter of the wire 20 is 0.2 mm or 0.25 mm, the width of the slit 32 is about 0.4 to 0.5 mm.

  In the first embodiment, the accommodation jig 30 includes a first jig 30A and a second jig 30B as shown in FIG. The first jig 30 </ b> A and the second jig 30 </ b> B are connected by a rotation shaft 33. For example, the first jig 30A can be opened with respect to the second jig 30B by rotating the first jig 30A about the rotation shaft 33. Further, after the ingot 200 is housed in the housing jig 30, the first jig 30 </ b> A is closed with respect to the second jig 30 </ b> B, and the first jig 30 </ b> A and the second jig 30 </ b> B are fixed by screws 34. Is done.

  The drive part 40 is comprised by the drive part 40A and the drive part 40B, as shown in FIGS. The drive unit 40A moves the support 10A along the side end surface 31A. Similarly, the drive unit 40B moves the support 10A along the support 10B.

(Cutout method)
In the following, the clipping method according to the first embodiment will be described. 2-5 is a figure for demonstrating the cutting-out method which concerns on 1st Embodiment.

  First, as shown in FIG. 2, the first jig 30A is opened with respect to the second jig 30B by rotating the first jig 30A about the rotation shaft 33. Subsequently, the ingot 200 is housed in the housing jig 30.

  Secondly, as shown in FIG. 3, the first jig 30A is closed with respect to the second jig 30B by rotating the first jig 30A about the rotation shaft 33. Subsequently, the first jig 30 </ b> A and the second jig 30 </ b> B are fixed with screws 34.

  Third, as shown in FIGS. 4 and 5, the drive unit 40 moves the support 10 along the side end surface 31. In other words, the drive unit 40 moves the wire 20 in the Z-axis direction by the movement of the support 10. Here, the support 10 supplies power to the wire 20 and sprays the machining liquid P along the wire 20.

  Thus, the distance between the pair of side end surfaces 31 and the pair of support bodies 10 by moving the pair of support bodies 10 along the pair of side end surfaces 31 substantially parallel along the Z-axis direction. Is constant. Accordingly, diffusion of the machining liquid P sprayed from the support 10 is suppressed.

(Function and effect)
In the first embodiment, the drive unit 40 moves the pair of supports 10 so that the distance between the work piece constituted by the ingot 200 and the storage jig 30 and the support 10 is kept constant. . Therefore, the diffusion of the machining fluid sprayed from the spray nozzle of the support 10 is suppressed, the wire 20 can be sufficiently cooled, and the accumulated cut material is sufficiently removed.

  Specifically, the drive unit 40 moves the pair of support bodies 10 along the pair of side end surfaces 31 provided in the housing jig 30. The pair of side end surfaces 31 are substantially parallel along the Z-axis direction. That is, the distance between the pair of side end surfaces 31 and the pair of supports 10 is constant. Accordingly, diffusion of the machining liquid P sprayed from the support 10 is suppressed.

[Modification 1]
Hereinafter, Modification Example 1 of the first embodiment will be described. In the following, differences from the first embodiment will be mainly described.

  In the first embodiment, the workpiece is configured by the ingot 200 and the accommodation jig 30. On the other hand, in the first modification, the workpiece is configured only by the ingot 200.

  In the first modification, as illustrated in FIG. 6, the drive unit 40 moves the pair of support bodies 10 along the outer periphery of the ingot 200. In such a case, the pair of supports 10 is configured to wind the wire 20 in conjunction with the movement of the support 10 or the support 10 so that the tension of the wire 20 is maintained at a predetermined tension. It should be noted that a mechanism for feeding the wire 20 in conjunction with the movement is provided.

[Other Embodiments]
Although the present invention has been described with reference to the above-described embodiments, it should not be understood that the descriptions and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  In the embodiment, the ingot 200 is fixed, and the drive unit 40 moves the pair of supports 10. However, the embodiment is not limited to this. The drive part 40 should just change the relative position of a pair of support body 10 and the ingot 200. FIG. Accordingly, the pair of supports 10 may be fixed, and the drive unit 40 may move the workpiece.

  In the embodiment, the ingot 200 exemplifies a case having a circular shape in a cross section (YZ cross section) orthogonal to a predetermined axial direction (X-axis direction). However, the embodiment is not limited to this. The ingot 200 may have a ring shape in a cross section (YZ cross section) orthogonal to a predetermined axial direction (X-axis direction). The ingot 200 may have a polygonal shape in a cross section (YZ cross section) orthogonal to a predetermined axial direction (X-axis direction).

  DESCRIPTION OF SYMBOLS 10 ... Support body, 20 ... Wire, 30 ... Housing jig, 31 ... Side end surface, 32 ... Slit, 33 ... Rotating shaft, 34 ... Screw, 40 ... Drive part, 100 ... Processing apparatus, 200 ... Ingot

Claims (6)

A processing apparatus for cutting out a plate-shaped wafer centering on the predetermined axial direction from a columnar ingot extending in a predetermined axial direction,
A pair of supports that stretch the wire so as to be orthogonal to the predetermined axial direction;
A drive unit that changes a relative position of the pair of support bodies and the ingot toward the predetermined axis direction and a direction orthogonal to the wire;
The pair of supports includes a power source that supplies electric power to the wire, and an injection nozzle that injects a working fluid along the wire.
The drive unit is configured to change a relative position between the pair of support bodies and the ingot so that a distance between a workpiece including at least the ingot and the support body is kept constant. Processing equipment. A housing jig for housing the ingot from a side surface of the ingot;
The housing jig has a pair of side end surfaces extending along the predetermined axis direction and a direction orthogonal to the wire, and a slit constituting a surface orthogonal to the predetermined axis direction,
The drive unit changes a relative position of the pair of support bodies and the ingot along the pair of side end surfaces,
The wire moves in the slit with a change in the relative position of the pair of supports and the ingot,
The processing apparatus according to claim 1, wherein the workpiece is the storage jig and the ingot.   The processing apparatus according to claim 2, wherein a width of the slit is larger than a cutting width of the wafer.   The processing apparatus according to claim 2, wherein the housing jig is formed of a conductive member.   The processing apparatus according to claim 1, wherein the ingot has a circular shape in a cross section orthogonal to the predetermined axis direction.   The processing apparatus according to claim 1, wherein the ingot has a ring shape in a cross section orthogonal to the predetermined axis direction.

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