JP2013165182A - Led light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED light-emitting device provided with an LED package having omnidirectionally uniform light distribution characteristics similar to incandescent lamps and enabling high luminance illumination excellent in heat radiation characteristics.SOLUTION: A plurality of LED elements is mounted in a proximity state by making a cylindrical surface of a cylindrical base substance into an element mounting part, a terminal formation part is provided at at least one end part of the cylindrical base substance, a terminal part connected with the plurality of LED elements is connected to a wiring electrode provided at the terminal formation part, and an element mounting part mounted with the plurality of LED elements is coated with a fluorescent resin.

Description

  The present invention relates to a light emitting diode (LED) light emitting device having uniform directional characteristics with respect to all directions, and more particularly, to an LED light emitting device capable of high-intensity illumination without unevenness in all directions and having excellent heat dissipation characteristics.

  In recent years, an LED element as a semiconductor light emitting element is a semiconductor element, and thus has a long life and excellent driving characteristics, is small in size, has high luminous efficiency, and has a bright emission color. Widely used in lighting devices and the like.

  In particular, in recent years, there has been a proposal for an LED light-emitting device that can cool a hollow portion inside a cylindrical substrate and mount a plurality of LED elements with the outside as an element mounting portion, can be illuminated with high brightness, and has excellent heat dissipation characteristics. There is (for example, Patent Document 1).

  A conventional LED light emitting device will be described below. For ease of understanding, the drawings are partially simplified within the scope not departing from the spirit of the invention, and the part names are aligned with the present invention. Patent Document 1 describes an LED light emitting device with improved heat dissipation. Fig.7 (a) is a perspective view of the LED light-emitting device 100 described in patent document 1, FIG.7 (b) is sectional drawing of the LED light-emitting device 100 shown to Fig.7 (a). The LED light emitting device 100 described in FIGS. 7A and 7B includes a cylindrical base body 102 that supports a mounting substrate 107 on which the LED element 101 is mounted, and a globe 108 that stores the mounting substrate 107. Configured. Since the cylindrical base 102 is made of a material such as aluminum and is formed in a cylindrical shape, the base end portion 102 a is connected to the base 103.

  In the vicinity of the power supply unit 104 of the cylindrical base body 102, a plurality of heat radiation holes 102c through which air flowing in from the front end part 102b of the cylindrical base body 102 flows out are provided. The globe 108 accommodates the mounting substrate 107, is formed in a substantially spherical shape from a resin material, has a pair of holes 108a facing the globe wall, and the cylindrical base body 102 passes through the pair of holes 108a. .

  The holder 106 holds a mounting substrate 107 on which a plurality of LED elements 101 are mounted. The holder 106 is made of a material having high thermal conductivity, has a hole through which the cylindrical substrate 102 passes, and is formed in a substantially hexagonal column shape. ing. A substantially rectangular mounting substrate 107 is disposed on each of the six rectangular surfaces positioned parallel to the axis of the cylindrical base 102 of the holder 106. The mounting substrate 107 is substantially rectangular, and a plurality of LED elements 101 are arranged and mounted along the axis of the cylindrical substrate 102.

  Next, the heat radiation action of the LED light emitting device 100 will be described. When the LED lamp 100 is connected to a commercial power supply, the power supply unit 104 converts an AC voltage into a DC voltage and supplies power to each LED element 101, whereby each LED element 101 emits light. The heat generated by the LED element 101 flows to the cylindrical substrate 102 via the mounting substrate 107 and the holder 106. And the air which exists in the cylindrical base | substrate 102 is heated by the heat which flowed to the cylindrical base | substrate 102, a buoyancy arises, and the flow of the air which goes to the nozzle | cap | die 103 direction generate | occur | produces.

  The air flow is discharged to the outside of the LED lamp 100 through the heat radiation hole 102c. Thereby, the heat generated by the LED element 101 is released to the outside of the LED lamp 100, and even if the LED element 101 is covered with the globe 108, the temperature rise of the LED element 101 can be suppressed.

JP 2004-296245 A

  However, in the conventional LED lamp described in Patent Document 1, a plurality of mounting boards 107 are attached to each surface of a polygonal holder 106 attached around the cylindrical base 102, and a plurality of LEDs are attached to each mounting board 107. Since the element 101 is mounted, if the number of the mounting boards 107 is reduced, the directivity characteristics as the light emitting device are uneven. If the number of the mounting boards 107 is increased, the directivity characteristics are improved, but the mounting board 107 is improved. There is a problem that the attachment and connection of the holder 106 to the holder 106 are made minute, workability is deteriorated, and the manufacturing price is increased.

  Further, the heat dissipation path from the LED element 101 becomes complicated with the LED element 101, the LED package, the mounting substrate 107, the holder 106, and the cylindrical base 102, and there is a problem that sufficient heat dissipation cannot be performed.

Next, a reference example of the directivity of LED elements arranged in a hexagonal column shape by six mounting boards 107 will be described with reference to the graph of FIG.
In FIG. 8, the angle in the circumferential direction indicates directivity, and the scale in the radial direction indicates the maximum value of the light intensity obtained by combining the light emitted from the six LED elements as 100. A circle drawn with a solid line 111 indicates the light intensity of each LED element arranged on the six surfaces of the holder 106 (see FIG. 7), and a curve 110 drawn with a thick solid line indicates the LED element on each surface. The light emission intensity of the light emitted from is synthesized. The light intensity of the combined curve 110 clearly has a strong portion 110a and a weak portion 110b, resulting in a non-uniform directional characteristic with a feeling of crushing, and omnidirectional illumination is difficult.

  Accordingly, an object of the present invention is to provide a uniform surface without any crushing feeling in all directions by mounting a plurality of LED elements in a close state using a cylindrical surface of a cylindrical base body as an element mounting portion and collectively sealing with a fluorescent resin. An LED light-emitting device having directivity characteristics is provided, and an LED light-emitting device capable of dissipating a large amount of heat generated by LED elements due to the arrangement of a large number of LED elements is provided.

  In order to achieve the above object, the present invention has a configuration in which a cylindrical surface of a cylindrical substrate is used as an element mounting portion, a plurality of LED elements are mounted in proximity, and a terminal forming portion is provided at at least one end of the cylindrical substrate. The terminal portion provided with the plurality of LED elements is connected to the wiring electrode provided in the terminal forming portion, and the element mounting portion on which the plurality of LED elements are mounted is covered with a fluorescent resin.

  With the configuration described above, the cylindrical surface of the cylindrical substrate is used as an element mounting portion, and a plurality of LED elements are mounted in close proximity, and the upper surface thereof is coated with a fluorescent resin, so that there is no crushing feeling in all directions. An LED light-emitting device having characteristics can be provided.

  The plurality of LED elements are preferably mounted with a pair of electrodes aligned in the central axis direction of the cylindrical substrate.

  With the above configuration, the LED element can be flip-chip mounted on the element mounting portion on the cylindrical surface of the cylindrical substrate, and the manufacture of the LED light emitting device is facilitated.

  The cylindrical base body is preferably formed by covering the cylindrical surface of a metal cylindrical member with an insulating film and forming a wiring pattern on the insulating film to form the first element mounting portion.

  A terminal forming portion is provided at one end of the cylindrical base, a flat portion is formed by closing the other end, the flat portion is covered with an insulating film, and a wiring pattern is formed on the insulating film to form a second While forming an element mounting part, it is good to mount a some LED element in a 2nd element mounting part, and to coat | cover with fluorescent resin.

  It is preferable to have a drive control circuit for independently lighting the first LED group mounted on the first element mounting portion of the cylindrical base and the second LED group mounted on the second element mounting portion.

  With the above configuration, the first element mounting portion of the cylindrical base and the second element mounting portion of the flat surface portion can be used for various purposes by properly using independent driving and simultaneous driving.

  The cylindrical substrate is preferably a heat pipe.

  The cylindrical base body is a heat pipe bent into a U-shape, and it is preferable that the element mounting portion is formed in the middle straight portion of the U-shape and the bent portions at both ends are connected to the heat sink.

  With the above configuration, heat can be transferred directly from the cylindrical substrate of the mounting substrate to the heat pipe, and the heat generated by a large number of LED elements can be radiated more strongly than the cylindrical substrate, and the heat sink that radiates heat from the light emitting part of the heat source. With the heat pipe connecting the two, the position of the light emitting part can be freely selected, and the degree of freedom in layout is increased.

  As described above, according to the present invention, the cylindrical surface of the cylindrical base body is used as an element mounting portion, a plurality of LED elements are mounted in a close state, and the upper surface thereof is collectively sealed with a fluorescent resin, so that all directions can be obtained. It has uniform directivity without crushing, and by integrating the cylindrical base and heat pipe, the heat generated by the LED element of the light emitting part can be radiated strongly, so the position of the light emitting part is the same as that of an incandescent light bulb. An LED light-emitting device that can be set and has a wide light distribution characteristic similar to an incandescent bulb can be provided.

It is a perspective view which shows the structure of the LED light-emitting device in Example 1 of this invention. It is the perspective view and partial enlarged view for demonstrating the LED package of the LED light-emitting device in Example 1 of this invention. It is a graph for demonstrating the directional characteristic of the LED package of the LED light-emitting device in Example 1 of this invention. It is a perspective view which shows the structure of the LED light-emitting device in Example 2 of this invention. It is a perspective view for demonstrating the LED package of the LED light-emitting device in Example 2 of this invention. It is a typical figure of the LED light-emitting device in Example 3 of this invention. It is the perspective view and sectional drawing for demonstrating the conventional LED light-emitting device shown to patent document 1. FIG. It is a graph of the reference example for demonstrating the directional characteristic of the conventional LED light-emitting device shown in patent document 1. FIG.

Embodiments of the present invention will be specifically described below with reference to the drawings.
In the embodiment described below, an LED light-emitting device that emits white light by flip-chip mounting surface-mounted blue light LED elements and encapsulating the blue light with a fluorescent resin that converts the wavelength of the light into yellow light. This will be explained with an example.

[Example 1]
FIG. 1A is a perspective view showing a configuration of an LED light emitting device according to Embodiment 1 of the present invention, and FIG. 1B illustrates light distribution characteristics of the LED light emitting device according to Embodiment 1 of the present invention. FIG.

[Overall configuration of LED light emitting device: FIG. 1]
First, the whole structure of the LED light-emitting device in Example 1 of this invention is demonstrated using Fig.1 (a).
As shown in FIG. 1A, the LED light emitting device 1 is a light bulb type lamp, and an external appearance is formed by a base 11, a heat sink 12, and a globe 13, and there are many LED elements inside the heat sink 12 and the globe 13. A single-sided dual-terminal LED package 4, a U-shaped heat pipe 6, and a lighting circuit (not shown) are provided.

  The double-terminal LED package 4 (details will be described later) is formed of a cylindrical base, has terminals at both ends thereof electrically connected to the LED elements mounted on the circumferential surface thereof, and the core of the heat pipe 6. The cylindrical hollow part is penetrated by the linear part 61 of the character-shaped middle, and is arrange | positioned. The bent portions 62 at both ends of the U-shape of the heat pipe 6 are embedded in the heat sink 12. And the heat pipe 6 forms the structure which transfers the heat | fever which the both-terminal LED package 4 generate | occur | produced to the heat sink 12, and radiates it with high efficiency.

  The heat sink 12 has a lighting circuit (not shown) inside, converts the AC voltage supplied from the base 11 into a DC voltage, and supplies power to the two-terminal LED package 4 via the lead wires 14. As described above, the heat generated by the two-terminal LED package 4 is transferred by the heat pipe 6 and radiated by the multiple fins 121 formed on the heat sink 12.

FIG.1 (b) is a side view for demonstrating the directivity of light emission of the LED light-emitting device 1 in Example 1 of this invention.
As shown in FIG. 1 (b), the two-terminal LED package 4 of the light emitting source maintains high heat transfer characteristics to the heat sink 12 by the heat pipe 6, so even if it is disposed at a position away from the heat sink 12, Sufficient heat dissipation characteristics can be maintained, and the light emitted from the two-terminal LED package 4 is emitted not only upward and laterally but also obliquely downward as indicated by an arrow E. It is possible to have similar light distribution characteristics.

[Configuration of Dual-Terminal LED Package: FIGS. 2 and 3]
FIG. 2A is a perspective view for explaining the configuration of the two-terminal LED package 4. FIG. 2B is a partially enlarged perspective view for explaining the arrangement of the LED elements. FIG.2 (c) is a partial expanded sectional view for demonstrating a joining state with the electrode of an LED element in the FIG.2 (b) AA cross section. FIG. 3 is a graph for explaining the directivity characteristics in the radial direction of the two-terminal LED package 4.

  As shown in FIG. 2A, the two-terminal LED package 4 includes a large number of LED elements 40, a cylindrical base 41, and a fluorescent resin 42. That is, a large number of blue light emitting LED elements 40 are flip-chip mounted on a wiring pattern 412 formed on the cylindrical surface of the cylindrical base body 41, and the YAG system converts the wavelength of the blue light of the LED elements 40 into yellow light. It is covered and sealed with a fluorescent resin 42 of a resin containing the above phosphor.

The cylindrical substrate 41 is made of an insulating material having high thermal conductivity such as alumina (Al ₂ O ₃ ), and a wiring pattern is formed on the surface thereof. Accordingly, the cylindrical base body 41 is a cylinder-type substrate in which the mounting substrate, the support portion, and the holder are integrated, and the hollow portion inside the cylinder enables the formation of a heat dissipation path.

  Accordingly, as shown in FIG. 1 (a), it is possible to form a structure in which the heat pipe 6 penetrates through the hollow portion inside the cylinder of the cylindrical base body 41 and dissipates heat generated by a large number of mounted LED elements. . In order to further improve the heat dissipation characteristics, it is preferable that the cylindrical base body 41 has an insulating layer formed on the surface of a conductive material having a high thermal conductivity such as Al or Cu, and a wiring pattern is formed thereon. Furthermore, without using a cylindrical base body, an insulating layer is directly formed on the surface of the central straight portion of the U-shape of the heat pipe 6, and a wiring pattern is formed thereon to mount the LED element 40. Then, since the heat dissipation effect is enhanced most, it is preferable.

  The wiring pattern 412 is formed so as to be connectable to a large number of flip-chip mounted LED elements 40, and terminal portions thereof are connected to terminal forming portions 411 formed at both ends of the cylindrical substrate 41. And the terminal formation part 411 is made into the wiring electrode 413, and supply of a direct current constant current from the lighting circuit part (not shown) to many LED elements 40 is enabled.

The arrangement of the flip-chip mounted LED elements will be described with reference to a partially enlarged perspective view of FIG. 2B and an AA partially enlarged sectional view of FIG.
As shown in FIG. 2B, the long side of the LED element 40 is arranged along the central axis X direction of the cylindrical base body 41 (see FIG. 2A), and a pair of electrodes 401 of the LED element 40 is formed. Each of the wiring patterns 412 is flip-chip mounted.

  Therefore, as shown in FIG. 2C, the short side of the LED element 40 is arranged in the circumferential diameter direction of the cylindrical base body 41. That is, although there is a gap δ between the short sides of the pair of electrodes 401 of the LED element due to the curvature of the wiring pattern 412 of the cylindrical base body 41, the short sides are short and can be mounted without problems in electrical connection. is there.

  Thus, by arranging the short sides of the LED elements 40 along the circumferential direction of the cylindrical base body 41, the LED elements 40 can be arranged close to each other, and the mounting density of the LED elements 40 is greatly increased. As a result, a large number of LED elements 40 can be arranged in the circumferential direction of the cylindrical base body 41.

  The heat generated by arranging a large amount of LED elements 40 in close proximity can be suppressed by dissipating heat to the heat sink 12 through the heat pipe 6 having excellent heat conduction characteristics, and light emission due to temperature rise. There is no reduction in efficiency or deterioration of the components.

In FIG. 3, a graph of the directivity characteristics in the circumferential direction of the multiple LED elements 40 mounted on the cylindrical base body 41 will be described.
In FIG. 3, as in FIG. 8, the angle in the circumferential direction indicates directivity, and the scale in the radial direction indicates, for example, the maximum value of the light intensity of light emitted from the 18 LED elements 40 as 100. Is. A circle drawn with a solid line 31 indicates the light intensity of each of the 18 LED elements 40, and a curve 30 drawn with a thick solid line is a combination of the light emission intensities of the 18 LED elements 40. As apparent from the graph, the light intensity of the synthesized curve 30 is almost the same as the synthesized curve 110 of FIG. 8 and is uniform with little intensity, so that the dual-terminal LED package 4 having uniform directional characteristics in all directions is provided. It shows that it is possible.

  As described above, in Example 1 of the present invention, the LED element 40 is mounted on the cylindrical base body 41 so that the long side of the LED element 40 is aligned with the central axis X direction of the cylindrical base body 41. Can be arranged in the circumferential direction of the cylindrical base body 41, and a high-power dual-terminal LED package 4 having uniform directional characteristics in all directions can be provided. Even if a large number of them are arranged and have high output, by passing through the heat pipe 6 having excellent thermal conductivity through the cylindrical base body 41 and dissipating heat to the heat sink 12, a decrease in luminous efficiency of the LED element 40 due to temperature rise, It is possible to arrange the light emitting portion and the heat radiating portion of the heat sink 12 separately by the heat pipe 6 without causing deterioration of the constituent members. Providing a LED lighting device 1 having a sex becomes possible.

[Example 2]
Next, the LED light-emitting device 2 in Example 2 of this invention is demonstrated using FIG. 4 (a), (b), and FIG. The LED light-emitting device 2 of Example 2 is different from the LED light-emitting device 1 of Example 1 in the shape and configuration of the LED package and the heat pipe, and the others are substantially the same. Therefore, the same number is attached | subjected to the same element, and the overlapping description is abbreviate | omitted.

  FIG. 4A is a perspective view showing a configuration of the LED light-emitting device according to the second embodiment of the present invention, and FIG. 4B illustrates light distribution characteristics of the LED light-emitting device according to the second embodiment of the present invention. FIG. FIG. 5 is a perspective view for explaining the configuration of the single-terminal LED package 5.

[Overall configuration of LED light emitting device: FIG. 4]
First, the whole structure of the LED light-emitting device 2 in Example 2 of this invention is demonstrated using Fig.4 (a).
The appearance of the LED light emitting device 2 is the same as that of the first embodiment. The LED light emitting device 2 is a light bulb type lamp, and the appearance is formed by the base 11, the heat sink 12, and the globe 13, and inside the heat sink 12 and the globe 13. , A single-terminal LED package 5 on which a large number of LED elements are mounted, and a rod-shaped heat pipe 7.

  The single-terminal LED package 5 (details will be described later) is formed of a cylindrical base, and has a terminal at one end thereof that is electrically connected to the LED element mounted on the surface thereof. Instead of the heat pipe 6, one end of a rod-shaped heat pipe 7 is inserted and installed. The other end of the heat pipe 7 is embedded in the heat sink 12, and the heat generated by the one-terminal LED package 5 is transferred to the heat sink 12 with high efficiency to dissipate heat.

FIG.4 (b) is a side view for demonstrating the directivity of light emission of the LED light-emitting device 2 in Example 2 of this invention.
As shown in FIG. 4B, the single-terminal LED package 5 of the light source is arranged at a position away from the heat sink 12 because the high heat transfer characteristic to the heat sink 12 is maintained by the rod-shaped heat pipe 7. However, as shown by the arrow E, the light emitted from the single-terminal LED package 5 is emitted not only upward and laterally but also obliquely downward. It becomes possible to have a light distribution characteristic similar to a light bulb.

[Configuration of single-terminal LED package: FIG. 5]
As shown in FIG. 5, in the single-terminal LED package 5 as well as the dual-terminal LED package 4 of the first embodiment, a large number of LED elements 40 are flip-chip mounted on a cylindrical base body 41 and collectively sealed with a fluorescent resin 42. ing. The difference from the first embodiment is that although the terminal forming portion 411 is formed at one end of the cylindrical base body 41, the other end is formed as a closed flat portion, and the LED element 40 is flip-chiped at the flat portion. It is mounting arrangement.

  That is, the single-terminal LED package 5 includes a first mounting portion 51 of a wiring pattern formed on the cylindrical surface of the cylindrical base body 41 and a second mounting portion of a wiring pattern formed on a flat portion at one end of the cylindrical base body 41. A large number of blue light emitting LED elements 40 are mounted on the first mounting portion 51, the first mounting portion 51 is formed with a first LED group 511, and the second mounting portion 52 is formed with a second LED group 521. The first and second LED groups 511 and 521 are collectively sealed with a resin fluorescent resin 42 containing a YAG-based phosphor that converts the wavelength of blue light into yellow light.

  Further, unlike the first embodiment, the terminal forming portion 411 of the single-terminal LED package 5 is formed at one end of the cylindrical base body 41, and the first LED group 511 and the second LED group 521 can be lit independently. An electrode 413 is formed and connected to a drive control circuit (not shown) so that it can be lit separately.

  As described above, in the present invention, since the LED elements 40 can be arranged not only on the cylindrical surface of the cylindrical base body 41 but also on the end surface, the incandescent light bulb has uniform directivity in all directions. It is possible to provide an LED light emitting device having a light distribution characteristic corresponding to the above. In addition, despite the fact that a large number of LED elements 40 are arranged and the output is high, the heat pipe 7 having excellent thermal conductivity is inserted into the cylindrical base body 41 to dissipate heat to the heat sink 12, thereby increasing the temperature. It is possible to provide an LED light-emitting device that does not cause a decrease in the light emission efficiency of the LED element 40 and deterioration of the constituent members.

[Example 3]
Next, the LED light-emitting device 3 in Example 3 of this invention is demonstrated with FIG. The LED light-emitting device 3 in the third embodiment is an LED light-emitting device using the one-terminal LED package 5 in the second embodiment, and will be described as an example applied to a car headlamp, for example. The same number is attached | subjected to the same element, and the overlapping description is abbreviate | omitted.

  FIG. 6 is a schematic cross-sectional view of the LED light-emitting device 3 having the single-terminal LED package 5.

[Overall configuration of LED light emitting device: FIG. 6]
The single-terminal LED package 5 is inserted into one end of a rod-shaped heat pipe 7 and fixedly installed with an adhesive having good heat conduction. The other end of the heat pipe 7 is fixedly installed on the heat sink 15 with an adhesive having good thermal conductivity like the one-terminal LED package 5. And the reflecting plate 16 supported by the heat sink 15 is installed, and it is formed so as to reflect the light emitted from the one-terminal LED package 5 so that it can be irradiated in the forward direction.

  Electrically, the first LED group 511 (see FIG. 5) of the single-terminal LED package 5 and the low beam drive control circuit 17 are connected, and the second LED group 521 (see FIG. 5) and the high beam drive control circuit 18 are connected. . Accordingly, the light emitted from the LED element 40 disposed on the cylindrical surface of the first LED group 511 driven by the low beam drive control circuit 17 forms the low beam light L by the reflected light from the reflector 16 and the direct light, and the high beam drive control circuit. The light emitted from the LED element 40 formed on the plane portion of the second LED group 521 driven by the direct light 18 is directly emitted to form the high beam light H.

  As described above, in the present invention, two types of low-beam light L and high-beam light H are provided by separately installing two types of drive control circuits for the light emission from the cylindrical surface and the light emission from the end surface of the single-terminal LED package 5. Can be obtained.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to this. For example, a large number of LED elements that are collectively sealed with a fluorescent resin emit red light and green light. Alternatively, the fluorescent resin may be a translucent resin without wavelength conversion.

  In addition, this invention is not limited to the Example of the LED light-emitting device mentioned above, it is not necessary to perform all of them, and various changes and modifications are possible within the scope of the contents described in the claims. Needless to say, it can be omitted.

1, 2 and 3: LED light emitting device 4, 5: LED package 6, 7: Heat pipe 11: Base 12, 15: Heat sink 13: Globe 14: Lead wire 16: Reflector 17: Low beam drive control circuit 18: High beam drive Control circuit 40: LED element 41: cylindrical substrate 42: fluorescent resin 51: first mounting part 52: second mounting part 401: electrode 411: terminal forming part 412: wiring pattern 413: wiring electrode 511: first LED group 512: Second LED group

Claims (7)

  A terminal portion in which a plurality of LED elements are mounted in proximity using the cylindrical surface of the cylindrical substrate as an element mounting portion, a terminal forming portion is provided at at least one end of the cylindrical substrate, and the plurality of LED elements are connected Is connected to a wiring electrode provided in the terminal forming portion, and an element mounting portion on which the plurality of LED elements are mounted is covered with a fluorescent resin.   2. The LED light emitting device according to claim 1, wherein the plurality of LED elements are mounted with a pair of electrodes aligned in a central axis direction of the cylindrical substrate.   The said cylindrical base | substrate has coat | covered the cylindrical surface of the metal cylindrical member with the insulating film, forms the wiring pattern on the said insulating film, and forms the 1st element mounting part. LED light-emitting device of description.   A terminal forming portion is provided at one end of the cylindrical substrate, a flat portion is formed by closing the other end, the flat portion is covered with an insulating film, and a wiring pattern is formed on the insulating film. The LED according to any one of claims 1 to 3, wherein a second element mounting portion is formed and a plurality of LED elements are mounted on the second element mounting portion and covered with a fluorescent resin. Light emitting device.   5. A drive control circuit for independently lighting a first LED group mounted on the first element mounting portion of the cylindrical base and a second LED group mounted on the second element mounting portion. LED light-emitting device of description.   The LED light-emitting device according to claim 1, wherein the cylindrical substrate is a heat pipe. The cylindrical base body is a heat pipe bent into a U-shape, wherein an element mounting portion is formed in a linear portion in the middle of the U-shape, and bent portions at both ends are connected to a heat sink. Item 4. The LED light-emitting device according to any one of Items 1 to 3.

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