JP2013161997A - Manufacturing method of aggregation of minute structure patterns and manufacturing apparatus thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance uniformity and continuity of a large scale aggregation of minute structure patterns.SOLUTION: A large scale aggregation of minute structure patterns is obtained by repeating a basic step to form a basic minute structure pattern in which a photocurable resin 108 dripped on a base material 107 is pressed by a minute structure mold 105, subjected to an exposure and the mold is released to thereby dispose basic minute structure patterns having three-way arrangement. A part of the basic minute structures which are formed second or later is overlapped with a foregoing basic minute structure, and the minute structure mold 105 is pressed thereon while being inclined to thereby form an inclined basic minute structure pattern; thus an aggregation with a high uniformity can be manufactured in a constant direction. By using an anaerobic photocurable resin, the resin which is positioned in an undesired region can be washed away in an uncured state. Thus, plural basic minute structure patterns can be precisely joined with each other.

Description

  The present invention mainly relates to a technique for manufacturing various optical elements such as optoelectronics, optical communication, and lighting devices.

  Conventionally, a photolithography technique and an electron beam drawing method generally used in a semiconductor manufacturing process have been applied to fine processing of a structure. The photolithographic method, which is one of the pattern transfer technologies for realizing fine processing, is approaching the limit of the lithography technology because the processing dimension has approached the wavelength of the light source of light exposure as the pattern is miniaturized.

  Therefore, an electron beam drawing (EB drawing) apparatus, which is a kind of charged particle beam apparatus, has come to be used in order to achieve further miniaturization and higher precision. However, while miniaturizing the pattern and increasing the number of drawing, there is a drawback that the manufacturing cost of the apparatus becomes high, such as an increase in size of the apparatus and a highly accurate control mechanism.

  On the other hand, Patent Documents 1 and 2 disclose techniques for forming a fine uneven pattern at a low cost.

  In Patent Document 1, a predetermined concavo-convex pattern is transferred by embossing a mold having an inverted concavo-convex pattern obtained by inverting a concavo-convex pattern to be formed on a substrate against a resist film layer formed on the surface of the substrate. To do.

  Further, according to the nanoimprint technique described in Patent Document 2, it is possible to form a fine uneven pattern of 25 nm or less on the resist film layer by means of die transfer using a silicon wafer as a mold.

  By the way, in recent years, for example, a large area and high performance of an optical component are desired as represented by a liquid crystal display. As a structure for viewing an image on a liquid crystal display, a structure in which a light guide plate and a retardation film for adjusting the refractive index of light are incorporated is known. These light guide plates, retardation films, and the like need to have a fine structure in which a fine uneven pattern is transferred to the surface. For example, in a liquid crystal display, if this fine structure is to be realized, a large-sized fine structure having a single piece and no seam is required.

  However, since there is no device that can produce a large-sized fine structure as a single object, for example, by arranging a plurality of individual basic fine structures side by side on a base material, a microscopic structure with little influence of seams can be obtained. A visual structure is used (see, for example, Patent Document 3).

  In Patent Document 3, as shown in FIG. 8, basic microstructures 1502 whose ends are undercut are arranged side by side on a base material 1503 and bonded via an adhesive layer 1504. A plurality of the basic fine structures 1502 are arranged on a base material 1503 with a gap therebetween to form a multi-face structure 1501. A fine concavo-convex pattern is transferred using the microstructure 1501 configured in this manner.

US Pat. No. 5,259,926 US Pat. No. 5,772,905 JP 2010-80670 A

  However, in the conventional technique, by repeating the nanoimprint technique, the fine structure can be enlarged, but a portion where no pattern is formed is generated between the transferred patterns. There is a problem that a portion where the pattern is not formed is generated, becomes a joint, and does not satisfy the performance.

  In view of the above, the present invention takes into consideration the problems of the conventional fine structure manufacturing method, and provides a fine structure pattern assembly manufacturing method and a manufacturing apparatus thereof capable of arranging and connecting a plurality of basic fine structure patterns with high accuracy. The purpose is to provide.

The first aspect of the present invention is
A first step of supplying a photocurable resin dropwise onto a flat substrate;
A second step of pressing and spreading a microstructure type on the photocurable resin;
A third step of forming a circular basic microstructure pattern by irradiating the photocurable resin with light, exposing and hardening the resin;
A microstructure pattern aggregate is manufactured by repeating a basic microstructure pattern forming unit step a plurality of times, which is composed of a fourth step of mold release that releases the microstructure from the basic microstructure pattern and raises it. A way to
In forming a new basic microstructure pattern adjacent to the already formed basic microstructure pattern,
A method for producing a microstructure pattern aggregate, wherein the outer peripheral portion of the new basic microstructure pattern is partially overlapped with the outer periphery of the basic microstructure pattern already formed It is.

The second aspect of the present invention
The newly formed basic fine structure pattern is formed so as to overlap partly, and from the overlapping position toward the center position of the newly formed basic fine structure pattern with respect to the base material. It is a manufacturing method of the fine structure pattern aggregate of the 1st present invention characterized by being inclined.

The third aspect of the present invention provides
A column forming unit step for forming a column of the basic fine structure pattern by repeating the basic fine structure pattern forming unit step continuously in a linear direction includes a step of repeating a plurality of times.
When forming a new column of the basic microstructure pattern so as to be parallel to and adjacent to the column of the basic microstructure pattern already formed,
The column of the basic microstructure pattern already formed and the column of the new basic microstructure pattern are out of phase in the linear direction, and the column of the basic microstructure pattern already formed The basic fine structure pattern forming the new basic fine structure pattern and the basic fine structure pattern forming the new row of the basic fine structure pattern are formed so that their outer peripheral portions overlap each other. 2 is a method for producing the fine structure pattern assembly of the present invention.

The fourth invention relates to
The linear phase shift is 180 degrees,
In the central portion excluding the periphery of the fine structure pattern aggregate, the new basic fine structure is formed with respect to one of the basic fine structure patterns constituting the row of the already formed basic fine structure patterns. Two of the basic fine structure patterns constituting the pattern row overlap, and conversely, one of the basic fine structure patterns constituting the new basic fine structure pattern row is already formed. It is a manufacturing method of the fine structure pattern aggregate | assembly of 3rd this invention which two of the said basic fine structure patterns which comprise the row | line | column of the said basic fine structure pattern overlap, and form a three-way arrangement | sequence.

The fifth aspect of the present invention relates to
The area of the range in which two adjacent basic microstructure patterns overlap each other is 25% or less of the area of one basic microstructure pattern,
The area of the range in which the three adjacent basic microstructure patterns overlap each other is 25% or less of the overlapping range of the two basic microstructure patterns among the three basic microstructure patterns. It is a manufacturing method of the fine structure pattern aggregate of the 4th present invention.

The sixth invention relates to
The three basic microstructure patterns constituting the three-way array are arranged such that the center positions of the circular basic microstructure patterns form an equilateral triangle,
(One side of equilateral triangle) = (diameter of the circular basic microstructure pattern) − (superposition distance between center positions of the circular basic microstructure pattern)
The remaining two sides are arranged at positions rotated 60 ° clockwise and counterclockwise from one side of the equilateral triangle, according to the fourth aspect of the method for producing a fine structure pattern assembly of the present invention.

The seventh invention relates to
The photocurable resin has an anaerobic property, and maintains a liquid state even when irradiated with light when in contact with the atmosphere. It is a manufacturing method of an aggregate.

The eighth invention relates to
A head installed in the drive unit;
An ultraviolet exposure unit attached to the head;
A quartz base fixed to the ultraviolet exposure unit via an elastic body;
A microstructure type attached to the quartz base;
A roll stage for mounting with the roll substrate stretched;
A feed roll that is a drive source for sequentially moving the roll base;
A coating unit for sequentially supplying a photocurable resin onto the roll base,
By moving the head up and down, pressing the photocurable resin supplied on the roll base to the fine structure mold, while sequentially forming the basic fine structure pattern, overlapping, fine structure pattern It is a manufacturing apparatus which manufactures an aggregate.

  According to the present invention, a plurality of basic fine structure patterns can be arranged and connected with high accuracy, and a continuous fine structure pattern aggregate without discontinuity can be formed at the visual level.

Schematic of the fine structure pattern manufacturing apparatus in Embodiment 1 of the present invention Schematic of the first half of the microstructure pattern process flow in Embodiment 1 of the present invention Schematic of the second half of the fine structure pattern process flow in the first embodiment of the present invention Schematic of microstructure type in embodiment 1 of the present invention Schematic cross-sectional view showing a state of superposition of basic fine structure patterns in Embodiment 1 of the present invention Schematic plan view (three-way array) showing a state of basic fine structure pattern superposition in Embodiment 1 of the present invention Schematic of the manufacturing apparatus for roll base material in Embodiment 2 of the present invention Sectional drawing which shows the conventional fine structure pattern described in patent document 3

  Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1)
FIG. 1 is a schematic diagram of a manufacturing apparatus according to Embodiment 1 of the present invention. 2 and 3 are schematic views of the process flow, FIG. 4 is a schematic view of a fine structure type, FIG. 5 is a schematic cross-sectional view of superposition, and FIG. 6 is a schematic plan view of superposition.

  In FIG. 1, a head 101 and an ultraviolet exposure unit 102 are fastened to a drive unit (not shown) of the manufacturing apparatus. The ultra-violet exposure unit 102 is made by attaching a fine structure mold 105 typified by ultraviolet light on the surface, for example, quartz glass, to the surface of the quartz base 104 having an elastic body 103 attached to the back surface. The base 104 is attached by being held by a fixed claw (not shown).

  The fine structure mold 105 is washed with a piranha solution and then subjected to a fluorine-based mold release treatment, and Daikin HD-1100TH is used as the mold release agent.

  The fine structure mold 105 is attached to the quartz base 104 by attaching a transparent adhesive sheet (not shown) having a light transmittance of 90% or more to the entire back surface of the fine structure mold 105. Moreover, the elastic body 103 is affixed with a general double-sided tape.

  On the other hand, the base material 107 is fixed to the flat stage 106 on the receiving side, and the photocurable resin 108 is dropped onto the base material 107 by a coating unit (not shown). Hereinafter, the description accompanying the operation and the description accompanying the basic fine structure pattern formation will be described with reference to FIGS.

  In FIG. 2A, a very small amount of the photocurable resin 108 is dropped on the base material 107, and the microstructure 105 is lowered in the -Z direction (first step). For driving the microstructure 105, the head 101 is connected to a three-dimensional stage (not shown), and 10 nm in each of X / Y / Z directions by a controller (not shown) of the three-dimensional stage. Can be driven with high feed accuracy.

  As the base material 107, a PET film having a thickness of 250 μm and subjected to an easy adhesion treatment on the surface is used, but a metal plate such as SUS may be subjected to a silane coupling treatment. The dripping amount of the photocurable resin 108 was set to 0.2 μL so as not to protrude from the pattern 10 (see FIG. 4) of the fine structure range of 24 mm of the fine structure mold 105 at the time of exposure described later.

  In FIG. 2B, the microstructured mold 105 that has been lowered contacts the photocurable resin 108, and further descends in the −Z direction while being spread out in a circular shape (second step). In order to spread the resin while maintaining a circular shape, the head feed speed is 3 mm / min or less, preferably 1 mm / min or less.

  In FIG. 2 (c), the microstructure mold 105 is lowered until a predetermined pressure is applied, and after reaching the predetermined pressure, the ultraviolet light that sufficiently hardens the photocurable resin 108 is exposed (third step). As a method of monitoring the applied pressure, a method of indirectly monitoring the reaction force received by the microstructure 105 according to the amount of pressing of the head 101 using a load cell (not shown) attached to the head 101 is adopted. To do. The position in the height direction where the fine structure mold 105 and the base material 107 are in contact with each other without the photo-curable resin 108 on the base material 107 is set to ± 0 mm = 0N, and thereafter increases by 13N for every 20 μm drop. Then, the three-dimensional stage was driven to the position where 450N was displayed (450N ÷ 13N × 20 μm≈0.69 mm).

It should be noted that by setting the head feed speed to 0.5 mm / min or less, preferably 0.1 mm / min or less from the vicinity of the height position of 10 μm, it is possible to help the capillary phenomenon and improve transferability to the fine structure. For UV exposure, exposure was performed at an illuminance of 3 mW / cm ² for 15 seconds.

  In FIG. 2D, the microstructure mold 105 is raised in the + Z direction and released from the photocurable resin 108 to obtain a first basic microstructure pattern 108-1 shown in FIG. 4 steps). Since the planar shape is pushed in evenly, it becomes a circle. Even after the mold release, the microstructure mold 105 rises in the + Z direction to a height at which the next photocurable resin can be dropped. The first to fourth steps are referred to as basic fine structure pattern forming unit steps.

  In FIG. 2E, when the head is moved in the horizontal direction (X direction) and reaches the next lowering position, the fine structure mold 105 is lowered as in FIG. At this time, the same amount of the photocurable resin 108 has already been dropped at the next lowering position. The next dropping position A is set by forming a basic microstructure pattern under the same conditions as those for forming the first basic microstructure pattern 108-1 in advance, and from the diameter D of the formed basic microstructure pattern. The position obtained by subtracting 2 mm (position where the overlapping amount is 2 mm) was set to A = D−2 mm. Specifically, since D = φ18 mm in the example of the first embodiment, the next descending position A (resin dropping position) is set to 18-2 = 16 mm.

  In FIG. 3 (f), the fine structure mold 105 is brought into contact with the photo-curable resin 108 and lowered while being spread out in a circular shape as in FIG. 2 (b). Thereafter, the head feed speed is set to the same condition as that when the first basic fine structure pattern 108-1 is formed. When the spreading photocurable resin 108 comes into contact with the side surface of the first basic fine structure pattern 108-1, the photocurable resin 108 spreads along the first basic fine structure pattern 108-1 by capillary action, and becomes circular. Will collapse, but it is negligible because it is extremely small.

  In FIG. 3G, when the first basic fine structure pattern 108-1 is lowered until the fine structure mold 105 comes into contact with the first basic fine structure pattern 108-1, the first basic fine structure pattern 108-1 which is a photocurable resin and quartz are used. In a certain microstructure type 105, the latter microstructure type 105 is subjected to a fluorine-based mold release treatment, so that the surface energy of the surface of the microstructure type 105 is lowered, and the first basic microstructure which is the same material is used. The pattern 108-1 is filled with a small amount by capillary action.

  In FIG. 3 (h), when the fine structure mold 105 comes into contact with the first basic fine structure pattern 108-1 and further falls, the fine structure mold 105 that has been kept horizontal until then is placed on the back surface of the quartz base 104. As the elastic body 103 is compressed, the elastic body 103 is further inclined to a predetermined pressure (450 N in the first embodiment) while being inclined. When the descent is completed, UV exposure is performed while the microstructure 105 is tilted. The exposure conditions are the same as described in FIG. The tilted angle is such that the shape height of the used microstructure type 105 is about 0.3 μm (the remaining 0.3 μm reaches 450 N), and the diameter D of the first basic microstructure pattern 108-1 is about 18 mm. For this reason, the tilt angle is very small, less than 0.001 °.

  At this time, ultraviolet rays are also applied to the photocurable resin filled in a small amount along the outer periphery of the first basic fine structure pattern 108-1 and the outer periphery of the first basic fine structure pattern 108-1, but the fine structure mold 105 is Since it is in an inclined state, the surface of the photocurable resin filled in the first basic fine structure pattern 108-1 and along the outer periphery of the pattern is exposed to the atmosphere. Since the photocurable resin 108 used in the first embodiment is an anaerobic material mainly composed of a radically polymerizable acrylate monomer composition, it does not harden even when irradiated with ultraviolet light when exposed to the atmosphere. There are characteristics. Therefore, the photocurable resin filled in the first basic microstructure pattern 108-1 and along the outer periphery of the pattern remains in the first basic microstructure pattern 108-1 and along the outer periphery of the pattern in an uncured state. However, it can be removed in a later cleaning step (FIG. 3 (j)).

  In FIG. 3I, the fine structure mold 105 is raised in the + Z direction and released from the photocurable resin 108 to obtain a second basic fine structure pattern 108-2 shown in FIG. After the mold release, the fine structure mold 105 keeps the horizontal again because the elastic body 103 is not loaded. The concept of movement to the next horizontal descent position is the same as that described in FIG.

  FIG. 4 is a schematic view of the microstructure mold 105 used in the first embodiment, in which a concavo-convex basic microstructure pattern 10 is formed in the center of the surface of a □ 32 mm quartz glass 11 within a range of □ 24 mm. Each of the concave and convex basic fine structure patterns has a pitch p which is a distance between the centers of the patterns of 0.4 μm, and the size of one pattern is a cylindrical shape having a diameter d of 0.2 μm and a height of h of 0.3 μm. I used something.

  FIG. 5 is a schematic cross-sectional view of a fine structure in which the basic fine structure patterns 108-1,... Are overlapped, and the first basic fine structure pattern 108-1 formed horizontally with respect to the base material 107. The second basic fine structure pattern 108-2 and the second basic fine structure pattern 108 are formed so as to be inclined with respect to the base material 107 by being superimposed on the first basic fine structure pattern 108-1. 2 shows a cross section of the third basic microstructure pattern 108-3 formed to be inclined with respect to the base material 107 by being superimposed on -2.

  By repeating the manufacturing method so far, it is possible to manufacture the first horizontal row of continuous large-area microstructures (microstructure pattern aggregates). Next, the manufacturing method in the second and subsequent columns will be described.

  FIG. 6 is a schematic plan view of a circular basic fine structure pattern, which is an example in which a pattern is formed by 4 × 4. The numbers in the figure indicate the order of pattern formation, and the arrows in the figure indicate the direction in which the inclined surface is formed by overlapping the basic fine structure pattern (the arrow from the high place to the low place). Is drawn).

  In the case where a plurality of the basic fine structure patterns 108-1 (diameter φ18 mm, film thickness 0.8 to 1 μm), 108-2,... Described in the first embodiment are stacked, a circular basic shape is continuously formed. In view of the number of times of pattern formation (productivity), the three-way arrangement as shown in this figure is preferable, and three adjacent patterns such as 1-2-5 and 6-10-11 are preferable. It is desirable to use a three-way arrangement that forms an equilateral triangle when the center positions (≈dropping positions) of the patterns are connected by a straight line.

  That is, in order to form the first row, patterns are formed at a pitch of 16 mm (at the time of 2 mm overlap), and in the second and subsequent rows, the direction in which the pattern in the previous row is formed (the direction passing between the pattern centers in the previous row) and the pattern in the previous row The pattern may be formed at a point of 16 mm obtained by rotating the angle formed by the center and the direction passing through the newly formed pattern center by 60 °. In other words, the phase of the second column is shifted by 180 degrees with reference to the column direction.

  In this way, it is possible to obtain a large-area fine structure pattern aggregate with the smallest number of pattern formations in a method for manufacturing a large-area fine structure pattern aggregate by joining circular basic fine-structure patterns. Productivity can be realized.

  Further, the area where two circular basic fine structure patterns overlap is set to 25% or less of the area of one basic fine structure pattern, and the area where three circular basic fine structure patterns overlap three is described above. By setting it to 25% or less of the overlapping area of the overlapping circular basic fine structure patterns, it is possible to obtain a large-area fine structure pattern assembly with a smaller number of pattern formations, thereby realizing higher productivity.

  This arrangement method is also effective for in-plane uniformity, and the directions of the seven arrows 6, 7, 10, 11, 12, 14, and 15 in FIG. You can see that The other nine arrows belong to the outside of the pattern array assembly and point in a different direction with respect to the direction of the inner arrow. However, in the case of this example, the ratio in the same direction is small with respect to the whole because of a small number such as 4 × 4 size (16 pieces in total), but if the area is large, the ratio in the same direction is greatly increased. . For example, in the 4 × 4 size, only about 43% is 7/16 in the same direction, and in the 10 × 10 size, 76/100 is 76% in the same direction.

  When these rules are expressed as a mathematical expression where the number of patterns to be superimposed in the horizontal direction is Xn and the number of patterns to be superimposed in the direction orthogonal to the Xn is Yn, the slope pattern ratio (%) in the same direction = [1− {Xn + (Yn −1) + (Yn / 2)} / Xn × Yn] × 100. As the number of arrays is increased (the area is increased), the ratio of the inclined pattern in the same direction (the ratio of in-plane uniformity) increases. The value of (Yn / 2) needs to be rounded to an integer.

  Further, in the manufacturing method of the first embodiment, by setting the dropping application amount of the photocurable resin to 20 μL and the press pressure to 450 N, the outermost circumference □ 24 mm of the fine structure range of the fine structure type is set inside. Since it is spread and photocured to an almost circular size of φ18mm to form an almost circular basic fine structure pattern, there is no need to form an extra area (an area without structure), which is well known in the general imprint field. There is no need for light shielding film processing (for example, processing represented by Japanese Patent Application No. 2011-125227).

  Further, in the first embodiment, the size is limited to about φ18 mm, but the fine pattern pattern aggregate can be formed even when the amount of the photo-curing resin dropped to 30 μL and the basic fine pattern size is about φ22 mm. .

  Finally, when the basic fine structure pattern is formed, the basic fine structure pattern is cleaned as shown in FIG. This cleaning process is a process for removing the uncured photocurable resin 108 filled in the existing basic fine structure pattern by capillary action, and specifically by a known alkaline electrolytic cleaning or solvent cleaning such as ethanol. is there.

  In this way, by arranging three circular basic fine structure patterns in succession, a plurality of basic fine structure patterns can be arranged and connected with high accuracy, and there is no discontinuity at the seam at the visual level. A large-area microstructure can be formed.

(Embodiment 2)
FIG. 7 is a schematic diagram of a production apparatus according to Embodiment 2 of the present invention, which is an apparatus when a roll member is used as a base material.

  7, the description of the same contents as those in FIG. 1 is omitted, and the detailed description of the same contents as in the first embodiment is omitted.

  In order to attach the roll base material 109, main parts such as a roll stage 110, a feed roll 201, an EPC roll 202, and a tension roll 203 are installed, and the roll base material 109 runs in the Y direction using the feed roll 201 as a drive source. It is a mechanism for (rotational feed), and traveling control is controlled by a controller (not shown) of the feed roll 201. In order to make the tension of the roll base material 109 uniform, the tension roll 203 is used to adjust the left-right balance and the overall tension of the roll base material 109. The EPC roll 202 automatically corrects the roll base material 109 to the set position when the roll base material 109 varies in the roll axis direction from the set position by ± 20 μm or more, and the variation is always detected by an edge sensor (not shown). Since the mechanisms in the X direction and the Z direction are the same as those in the first embodiment, description thereof is omitted.

  About supply of the photocurable resin 108, it is dripped at the EPC roll 202 vicinity by the application | coating unit 205 fastened by the single axis | shaft slider 204 adjacent to the same direction as the said EPC roll 202. FIG. The application amount is controlled by a controller (not shown) of the application unit 205, and the application position is controlled by a controller (not shown) of the uniaxial slider 204. The dropped photocurable resin 108 travels directly below the microstructure mold 105 and forms a basic microstructure pattern by the method described in the first embodiment.

  Thus, by combining the manufacturing method of the fine structure pattern described in the first embodiment, the mechanism for moving the roll base material 109 with high accuracy, and the mechanism for dropping the photocurable resin 108 with high accuracy, By operation, a large area fine structure pattern aggregate on the roll base material 109 can be formed with higher productivity.

  The method for producing a fine structure pattern assembly of the present invention can produce a large area fine structure pattern assembly from a small basic fine structure pattern, which can contribute to quality improvement and cost reduction in the nanoimprint field. .

DESCRIPTION OF SYMBOLS 101 Head 102 Exposure unit 103 Elastic body 104 Quartz base 105 Fine structure type 106 Planar stage 107 Base material 108 Photocurable resin 108-1 First basic fine structure pattern 108-2 Second basic fine structure pattern 108-3 Three basic fine structure patterns 109 Roll base 110 Roll stage 201 Feed roll 202 EPC roll 203 Tension roll 204 Single axis slider 205 Coating unit

Claims (8)

A first step of supplying a photocurable resin dropwise onto a flat substrate;
A second step of pressing and spreading a microstructure type on the photocurable resin;
A third step of forming a circular basic microstructure pattern by irradiating the photocurable resin with light, exposing and hardening the resin;
A microstructure pattern aggregate is manufactured by repeating a basic microstructure pattern forming unit step a plurality of times, which is composed of a fourth step of mold release that releases the microstructure from the basic microstructure pattern and raises it. A way to
In forming a new basic microstructure pattern adjacent to the already formed basic microstructure pattern,
A method for producing a microstructure pattern aggregate, wherein the outer peripheral portion of the new basic microstructure pattern is partially overlapped with the outer periphery of the basic microstructure pattern already formed .   The newly formed basic fine structure pattern is formed so as to overlap partly, and from the overlapping position toward the center position of the newly formed basic fine structure pattern with respect to the base material. The method for producing a fine pattern assembly according to claim 1, wherein the fine structure pattern aggregate is inclined. A column forming unit step for forming a column of the basic fine structure pattern by repeating the basic fine structure pattern forming unit step continuously in a linear direction includes a step of repeating a plurality of times.
When forming a new column of the basic microstructure pattern so as to be parallel to and adjacent to the column of the basic microstructure pattern already formed,
The column of the basic microstructure pattern already formed and the column of the new basic microstructure pattern are out of phase in the linear direction, and the column of the basic microstructure pattern already formed The basic fine structure pattern constituting the first basic fine structure pattern and the basic fine structure pattern constituting the new row of the basic fine structure pattern are formed so as to overlap each other. The manufacturing method of the fine structure pattern aggregate | assembly of 2. The linear phase shift is 180 degrees,
In the central portion excluding the periphery of the fine structure pattern aggregate, the new basic fine structure is formed with respect to one of the basic fine structure patterns constituting the row of the already formed basic fine structure patterns. Two of the basic fine structure patterns constituting the pattern row overlap, and conversely, one of the basic fine structure patterns constituting the new basic fine structure pattern row is already formed. The manufacturing method of the fine structure pattern assembly according to claim 3, wherein two of the basic fine structure patterns constituting the row of the basic fine structure patterns overlap to form a three-way array. The area of the range in which two adjacent basic microstructure patterns overlap each other is 25% or less of the area of one basic microstructure pattern,
The area of the range in which the three adjacent basic microstructure patterns overlap is 25% or less of the range in which the two basic microstructure patterns overlap among the three basic microstructure patterns. Or the manufacturing method of the fine structure pattern aggregate | assembly of 4. The three basic microstructure patterns constituting the three-way array are arranged such that the center positions of the circular basic microstructure patterns form an equilateral triangle,
(One side of equilateral triangle) = (diameter of the circular basic microstructure pattern) − (superposition distance between center positions of the circular basic microstructure pattern)
The remaining two sides are arranged at positions rotated by 60 ° clockwise and counterclockwise from one side of the equilateral triangle.   The microstructural pattern assembly according to claim 1, wherein the photocurable resin has anaerobic properties and maintains a liquid state even when irradiated with light when in contact with the atmosphere. Body manufacturing method. A head installed in the drive unit;
An ultraviolet exposure unit attached to the head;
A quartz base fixed to the ultraviolet exposure unit via an elastic body;
A microstructure type attached to the quartz base;
A roll stage for mounting with the roll substrate stretched;
A feed roll that is a drive source for sequentially moving the roll base;
A coating unit for sequentially supplying a photocurable resin onto the roll base,
By moving the head up and down, pressing the photocurable resin supplied on the roll base to the fine structure mold, while sequentially forming the basic fine structure pattern, overlapping, fine structure pattern A manufacturing device for manufacturing assemblies.

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