JP2013157844A - Substrate, element substrate, electronic device, oscillator and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an element which allows formation of a small-sized electronic device and in which a break-off part is formed such that a breaking part of the break-off part lies inside a contour of an element piece that restricts a gap between the element piece and an element piece housing part of a package.SOLUTION: A substrate 10 comprises: a plurality of individual pieces 1; a pair of coupling parts 3a, 3b extending from each of the individual pieces 1; and a holding part 2 to which extension ends of the coupling parts are connected. Each of the coupling parts includes a constricted part between an individual-piece connection part to which the individual piece is connected and a holding-part connection part to which the holding part is connected. Each of the individual piece includes a salient 1d which extends from an end of the individual-piece connection part of the individual piece between the pair of coupling parts in an extension direction of the coupling parts. The constricted part is provided a position closer the individual-piece connection part than an end in the extension direction of the salient.

Description

  The present invention relates to a substrate, an element substrate, an electronic device, an oscillator, and an electronic apparatus.

  Conventionally, as a method of manufacturing a semiconductor element (IC) or a piezoelectric vibration element, a plurality of elements are formed on a substrate generally called a wafer by an etching method, and wirings and electrodes are formed in the form of the substrate. Thereafter, a method is known in which each element is separated from the substrate by dicing, etching, or breaking to obtain a single element. In particular, the method of dividing into pieces by folding is not widely required as a method of manufacturing at low cost without requiring a special device or process.

  In the individualization by this folding, there is a problem that the variation in the breaking position in the broken portion is large, which also affects the variation in the dimensions of the element pieces. In order to solve this problem, there has been proposed a crystal piece assembly in which a narrow portion is formed in an arm portion connecting a crystal piece and a frame portion, and the narrow piece is broken and the crystal piece is broken off (Patent Document 1). ).

JP 2006-186847 A

  However, even in the above-mentioned Patent Document 1, even if the narrow width portion is minute, the fracture surface has irregularities, and in recent years, even with minute irregularities due to ultra-miniaturization of elements, for example, elements In the case of housing the package in a package, there has been a problem that the housing size has to be increased in consideration of the unevenness of the fracture surface.

  Therefore, from the outer shape of the element piece that regulates the gap between the element piece and the element piece housing part of the package, the folding part is formed so that the broken part of the folding part is on the inside, and can be formed into a small electronic device. An element capable of being provided is provided.

  The present invention can be realized as the following forms or application examples so as to solve at least one of the above-described problems.

  [Application Example 1] The substrate of this application example includes a plurality of pieces, a pair of connecting portions extending from the pieces, and a holding portion to which an extended end portion of the connecting portion is connected, The connecting portion is provided with a constriction between the piece connecting portion to which the piece is connected and the holding connecting portion to which the holding portion is connected, and the piece is the pair Including a convex portion extending in the extending direction of the connecting portion from the end portion of the individual piece connecting portion between the connecting portions, and the constricted portion extends in the extending direction of the convex portion. It is provided in the said piece connection part side rather than an edge part, It is characterized by the above-mentioned.

  According to the substrate of this application example, when the piece formed on the substrate is separated from the substrate, the constricted portion provided in the connecting portion is broken. The fracture portion generated in the constricted portion is formed in an uncontrolled shape, for example, a sawtooth shape, and the size of the individual piece in a state in which the individual piece is separated from the substrate may vary. Therefore, by forming the convex portion in advance and forming it at a position where the constricted portion where the fracture portion is generated is not exceeded than the end portion in the extending direction of the convex portion, an individual piece having an accurate outer dimension can be obtained. . Therefore, when the electronic device is assembled, the package for storing the individual pieces can be made small, and a small electronic device can be obtained.

Application Example 2 In the application example described above, the gap between the end in the extending direction of the convex portion and the holding portion is δ, the thickness of the substrate is t, and the relationship between δ and the t is ,
δ> t
It is characterized by satisfying.

  According to the above application example, when the individual pieces are folded from the substrate, interference between the convex portion and the holding portion does not occur, so that the individual pieces are easily separated (broken), and the reduction in productivity and yield is suppressed. can do.

  Application Example 3 In the application example described above, the substrate is quartz, and the crystal axis of the quartz is an X axis as an electrical axis, a Y axis as a mechanical axis, and a Z axis as an optical axis. An axis obtained by inclining the Z axis in the −Y direction of the Y axis around the X axis of the Cartesian coordinate system comprising the Z ′ axis, and an axis inclining the Y axis in the + Z direction of the Z axis is Y In the case of the 'axis', the main surface of the substrate is parallel to the X axis and the Z 'axis, the thickness is a direction parallel to the Y' axis, and the connecting portion extends along the X axis. It is characterized by.

  According to the application example described above, it is possible to form a substrate with a cut angle more suitable for the required specification, and it is possible to obtain a high-frequency vibration element having a frequency temperature characteristic according to the specification and a small CI value.

  Application Example 4 In the application example described above, the crystal is an AT cut crystal.

  According to the application example described above, it is possible to obtain a small high-frequency vibration element having excellent frequency temperature characteristics.

  Application Example 5 In the application example described above, an electrode is provided on the piece.

  According to the application example described above, since the substrate has integrally formed pieces, it can be reliably held in the apparatus during electrode formation, and a substrate with high handleability and productivity can be obtained. be able to.

  Application Example 6 An electronic device according to this application example includes an element obtained by breaking the connecting portion from the substrate and separating the pieces, and a package in which the element is accommodated. It is characterized by that.

  The electronic device according to this application example has an accurate external dimension by forming a convex portion on each piece in advance and forming it at a position where the constricted portion where the fracture portion is generated is not exceeded than the end portion in the extending direction of the convex portion. It is possible to obtain an individual piece having Therefore, when the electronic device is assembled, the package for storing the individual pieces can be made small, and a small electronic device can be obtained.

  Application Example 7 The oscillator according to this application example includes an element obtained by breaking the connecting portion from the substrate and separating the pieces, and an oscillation circuit that drives the element. It is characterized by.

  In the oscillator of this application example, the convex portion is formed in advance on the individual piece, and an accurate outer dimension is obtained by forming it at a position where the constricted portion where the fractured portion is generated does not exceed the end portion in the extending direction of the convex portion. Individual pieces can be obtained. Therefore, when assembling the oscillator, the package for storing the individual pieces can be made small, and a small oscillator can be obtained.

  Application Example 8 An electronic apparatus according to this application example includes the above-described electronic device.

  The electronic apparatus according to this application example can be downsized in an electronic circuit by including a downsized electronic device.

The board | substrate which concerns on 1st Embodiment is shown, (a) is a top view, (b) is an enlarged plan view of the A section shown to (a), (c) is sectional drawing of the BB 'part shown to (b). (D) is sectional drawing of CC 'part shown to (b), (e) is sectional drawing of DD' part shown to (b). The perspective view explaining the relationship between an AT cut crystal substrate and a crystal axis. The partial enlarged plan view of the board | substrate which concerns on 1st Embodiment. The element substrate which concerns on 2nd Embodiment is shown, (a) is the top view which expanded the one piece part, (b) is sectional drawing of the EE 'part shown to (a), (c) is ( Sectional drawing of the FF 'part shown to a). The expanded sectional view explaining the structure of the electrode of the element piece which concerns on 2nd Embodiment. The top view which shows the vibration element separated from the element substrate which concerns on 2nd Embodiment. The vibrator which concerns on 3rd Embodiment is shown, (a) is a top view, (b) is sectional drawing of the GG 'part shown to (a). The oscillator which concerns on 4th Embodiment is shown, (a) is a top view, (b) is sectional drawing of the HH 'part shown to (a). The schematic diagram of the electronic device which concerns on 5th Embodiment.

  Embodiments according to the present invention will be described below with reference to the drawings.

(First embodiment)
1A and 1B show a substrate according to a first embodiment, FIG. 1A is a plan view, FIG. 1B is an enlarged plan view of an A portion shown in FIG. 1A, and FIG. 1C is a BB ′ portion shown in FIG. (D) is sectional drawing of CC 'part shown to (b), (e) is sectional drawing of DD' part shown to (b). As shown in FIG. 1A, a plurality of pieces 1 and a holding portion 2 that connects and holds the pieces 1 to the substrate 10 are formed on the substrate 10. The substrate 10 according to the present embodiment is a substrate 10 (hereinafter referred to as a quartz substrate 10) formed from quartz that is a piezoelectric material, and the piece 1 is formed as an element piece (the piece 1 is referred to as an element hereinafter). Called piece 1).

  As shown in FIG. 2, the quartz substrate 10 is formed using a quartz crystal belonging to a trigonal piezoelectric material, and has crystal axes X, Y, and Z orthogonal to each other. The X-axis is called the electrical axis, the Y-axis is called the mechanical axis, and the Z-axis is called the optical axis, and the cut plate is a quartz crystal along a plane that rotates the XZ plane about the X axis by a predetermined angle θ. Used as the substrate 10. For example, in the case of an AT-cut quartz substrate, the angle θ is 35.25 ° (35 ° 15 ′). Here, when the Y-axis and the Z-axis are rotated by an angle θ around the X-axis to make the Y′-axis and the Z′-axis, the AT-cut quartz substrate has crystal axes X, Y ′, and Z ′ that are orthogonal to each other. Accordingly, the AT-cut quartz substrate has a Y ′ axis in the thickness direction, a surface including the X axis and the Z ′ axis orthogonal to the Y ′ axis is a main surface, and thickness shear vibration is excited as a main vibration on the main surface. . The quartz crystal substrate 10 is formed from the AT cut quartz crystal substrate thus formed. Note that the quartz substrate 10 according to the present embodiment is not limited to the AT cut having an angle θ of 35.25 ° illustrated in FIG. 2, and may be a piezoelectric substrate such as a BT cut that excites thickness shear vibration, for example. .

  As shown in FIGS. 1B to 1E, the element piece 1 formed on the quartz substrate 10 is a rectangular vibrating portion 1b that is thinned by forming a recess 1a on one main surface side of the substrate 10. Then, support portions 1c that support the vibrating portion 1b are formed on the three sides of the vibrating portion 1b with the thickness of the quartz substrate 10. A pair of connecting portions 3 a and 3 b are extended from the support portion 1 c facing the holding portion 2 and connected to the holding portion 2. The element piece 1 and the holding part 2 are integrally formed by the connecting portions 3a and 3b, and as shown in FIG. 1A, a crystal substrate 10 in which a plurality of element pieces 1 are assembled is formed.

  Details of the connecting portions 3a and 3b will be described with reference to a partially enlarged view shown in FIG. In addition, since the connection part 3a and the connection part 3b are the same structures, it demonstrates with the connection part 3a. The connecting portion 3 a extends between the element piece 1 and the holding portion 2. And the notch part 3c is formed between the connection part 1f of the element piece 1 and the connection part 3a, and the connection part 2a of the holding | maintenance part 2 and the connection part 3a. In other words, the constricted portion 3d is formed by the cutout portion 3c. When the constricted part 3d formed thinly in the connecting part 3a is folded from the holding part 2, the constricted part 3d becomes a weak part in the connecting part 3a and is selectively broken. Also in the connecting portion 3b, the constricted portion 3e formed between the connecting portion 1g and the connecting portion 2b serves as a broken portion when the element piece 1 is broken.

Further, the element piece 1 has a protruding portion 1d formed between the connecting portion 3a and the connecting portion 3b in the extending direction of the connecting portions 3a and 3b toward the holding portion 2. The protruding portion 1d is formed such that the extended end portion 1e of the protruding portion 1d is on the holding portion 2 side with respect to the constricted portions 3d and 3e. That is, when the distance M from the connecting portion 1f between the element piece 1 and the connecting portion 3a to the extended end portion 1e, and the distance N from the connecting portion 1f to the holding side of the constricted portion 3d,
M> N
It is formed to become. By forming the connecting portion 3a in this manner, when the element piece 1 is broken, the fracture portion of the constricted portion 3d can be prevented from jumping out from the extended end portion 1e to the outer side. Similarly, in the connecting portion 3b, the broken portion of the constricted portion 3e can be prevented from jumping out from the extended end portion 1e to the outer shape side.

Further, the gap δ between the extended end portion 1e and the holding portion 2 is given by assuming that the thickness of the quartz substrate 10 is t.
δ> t
It is formed to satisfy. By forming in this way, when the element piece 1 is folded, interference between the extended end portion 1e and the holding portion 2 can be avoided, and the folding can be facilitated.

(Second Embodiment)
FIG. 4: shows the element substrate which concerns on 2nd Embodiment, (a) is the top view which expanded the one piece part, (b) is sectional drawing of the EE 'part shown to (a), (c) is sectional drawing of the FF 'part shown to (a). As shown in FIG. 4A, the element substrate 10 </ b> A is obtained by forming predetermined electrodes on the quartz crystal substrate 10 according to the first embodiment and forming the element piece 1 on the vibration element piece 100. Hereinafter, the element substrate 10A is referred to as a vibration element substrate 10A. In addition, the same code | symbol is attached | subjected to the same structure as the quartz substrate 10 and the element piece 1, and description is abbreviate | omitted.

  In the vibration element piece 100, excitation electrodes 110a and 120a for exciting the vibration part 1b are formed on one main surface 1h and the other main surface 1j of the vibration part 1b. Furthermore, lead electrodes 110b and 120b are formed on one main surface side surface 1k and the other main surface side surface 1m of the support portion 1c in succession to the excitation electrodes 110a and 120a. Furthermore, a connection provided for a package (not shown) in which the vibration element piece 100 is accommodated in succession to the lead electrodes 110b and 120b on the surface 1n on one main surface side and the surface 1p on the other main surface side of the convex portion 1d. Pad electrodes 110c and 120c connected to the electrodes are formed.

  As described above, the vibration element piece 100 includes the first electrode 110 including the excitation electrode 110a, the lead electrode 110b, and the pad electrode 110c on one main surface side, and the excitation electrode 120a and the lead electrode on the other main surface side. 2nd electrode 120 comprised by 120b and the pad electrode 120c is provided. The first electrode 110 and the second electrode 120 are conductive layers including at least one conductive film, and an example of the configuration of the electrodes is shown in FIG. As shown in FIG. 5, the excitation electrode 110a of the first electrode 110 is formed of two electrode layers, a first electrode layer 210a and a second electrode layer 210b. The first electrode layer 210a is formed of Ni (nickel) having excellent adhesion to the crystal forming the element piece 1, and Au (gold) having excellent conductivity as the second electrode layer 210b is formed on the surface layer of the first electrode layer 210a. ) Are stacked. As for the lead electrode 110b and the pad electrode 110c of the first electrode 110, the first electrode layer 210a and the second electrode layer 210b are formed as the excitation electrode 110a and the common electrode layer, and the third electrode layer is formed on the surface layer of the second electrode layer 210b. Au is laminated as 210c.

  Similarly to the first electrode 110, the excitation electrode 120a of the second electrode 120 is formed of two electrode layers of the first electrode layer 220a and the second electrode layer 220b. The first electrode layer 220a is formed of Ni (nickel) having excellent adhesion to the crystal forming the element piece 1, and Au (gold) having excellent conductivity as the second electrode layer 220b is formed on the surface layer of the first electrode layer 220a. ) Are stacked. The lead electrode 120b and the pad electrode 120c of the second electrode 120 have the first electrode layer 220a and the second electrode layer 220b formed as the excitation electrode 120a and the common electrode layer, and the third electrode layer on the surface layer of the second electrode layer 220b. Au is laminated as 220c. Thus, by forming the first electrode 110 and the second electrode 120, the vibration element piece having the lead electrodes 110b and 120c and the pad electrodes 110c and 120c having a layer thickness larger than the layer thickness of the excitation electrodes 110a and 120a. 100 is formed.

  In the vibration element piece 100, the excitation electrodes 110a and 120a are formed as thin as possible in order to improve the vibration performance of the vibration part 1b, but in order to reduce the loss due to resistance that increases as the film is made thin, that is, the ohmic cross, By forming the electrodes 110b and 120b to be thick by laminating the third electrode layers 210c and 220c, the ohmic cross can be reduced and the deterioration of the CI value can be suppressed. Further, the first electrode layers 210a and 220a and the second electrode layers 210b and 220b of the excitation electrodes 110a and 120a are configured as a common electrode layer of the lead electrodes 110b and 120b, so that the excitation electrodes 110a and 120a and the lead electrodes are formed. 110b and 120b are securely connected to each other, and the vibration element piece 100 having high reliability can be obtained.

From the vibration element substrate 10A having the vibration element piece 100 formed as described above, an external force is applied to the vibration element piece 100, and the constricted portions 3d and 3e are broken into pieces as shown in FIG. Element 100A is obtained. In this case, the rupture portions P and Q are generated in the constricted portions 3d and 3e which are easily broken. That is, as described with reference to FIG. 3, as shown in FIG. 3, the element piece 1 includes the distance M from the connecting portion 1f between the element piece 1 and the connecting portion 3a to the extended end portion 1e, and the constricted portion 3d from the connecting portion 1f. If the distance N to the holding side of
M> N
It is formed to become. Thereby, the fracture | rupture parts P and Q which arise in the area | region of the constriction parts 3d and 3e by breaking off the vibration element piece 100 can prevent jumping out to the external shape side from the extended end part 1e.

(Third embodiment)
As an embodiment of the electronic device according to the third embodiment, a vibrator including the resonator element 100A according to the second embodiment will be described. 7A and 7B show a vibrator 1000 according to the third embodiment, in which FIG. 7A is a plan view in which a lid member is omitted, and FIG. 7B is a cross-sectional view taken along a line GG ′ shown in FIG. As shown in FIGS. 7A and 7B, the vibrator 1000 is formed by a package body 300 formed in a rectangular box shape and a lid member 400 formed of metal, ceramics, glass, or the like. In the package 500, the vibration element 100A is stored in an airtight manner.

  As shown in FIG. 7B, the package main body 300 is formed by laminating a first substrate 310, a second substrate 320, and a third substrate 330 formed in a frame shape, and hermetically fixing the first substrate 310. A plurality of mounting terminals 350 are formed on the outer surface 310 a of the third substrate 330, and a sealing 340 is formed on the upper end surface 330 a of the third substrate 330. The third substrate 330 and the second substrate 320 form a recess 300a (hereinafter referred to as a cavity 300a) in which the vibration element 100A is accommodated. Further, on the mounting surface 320a on which the vibration element 100A of the second substrate 320 is placed, a mounting pad 370 and an electrode terminal 380 that are electrically connected to pad electrodes 110c and 120c of the vibration element 100A described later are formed. . The mounting pad 370 and the electrode terminal 380 are electrically connected to the mounting terminal 350 by an internal wiring 360 formed inside the package body 300. The mounting pad 370 is formed in a region corresponding to the pad electrode 110c of the first electrode 110 when the vibration element 100A is placed in the cavity 300a.

  In the cavity 300 a of the package body 300, the vibration element 100 </ b> A is placed so that the first electrode 110 faces the mounting surface 320 a of the second substrate 320. Then, a conductive adhesive 600 is applied and cured between the pad electrode 110c of the first electrode 110 of the vibration element 100A and the mounting pad 370 formed on the mounting surface 320a of the second substrate 320, thereby curing the package body. The vibration element 100A is fixed to 300, and the pad electrode 120c of the second electrode 120 of the vibration element 100A and the electrode terminal 380 formed on the mounting surface 320a of the second substrate 320 are electrically connected by the bonding wire BW. . In this way, the resonator element 100A is placed and fixed in the cavity 300a, and the lid member 400 is hermetically fixed by the sealing 340 provided on the third substrate 330, whereby the vibrator 1000 is obtained.

  In the vibrator 1000 according to the third embodiment, the part where the vibration element 100A is supported and fixed is one point of the pad electrode 110c part of the first electrode 110, but the part where the pad electrode 110c is formed and the vibration part 1b. By forming through-grooves 1q (see FIG. 1) between them, stress generated in the quartz substrate 10 due to the conductive adhesive 600 can be relieved, so that frequency reproducibility, frequency temperature characteristics, CI The vibrator 1000 having excellent temperature characteristics and frequency aging characteristics can be obtained. Furthermore, since the pad electrode 110c of the first electrode 110 can be formed on the convex portion 1d, the area of the pad electrode 110c can be increased, and the application area of the conductive adhesive 600 can also be increased. Therefore, even if the vibration element 100A is fixed at one place on the pad electrode 110c of the first electrode 110, a vibrator that can secure the fixing force of the vibration element 100A can be obtained.

  Further, the convex portion 1d can be formed with an accurate dimension by a technique such as etching in the manufacturing stage of the quartz crystal substrate 10 according to the first embodiment. That is, the L dimension, which is the outer dimension of the vibration element 100A including the extended end 1e of the protrusion 1d, can also be accurately formed. As a result, the gap α between the inner wall 330b of the third substrate 330 and the vibration element 100A can be minimized, and a small vibrator 1000 can be obtained.

(Fourth embodiment)
As the fourth embodiment, an oscillator including the resonator element 100A according to the second embodiment will be described. 8A and 8B show an oscillator 2000 according to the third embodiment, in which FIG. 8A is a plan view in which a lid member is omitted, and FIG. 8B is a cross-sectional view taken along the line HH ′ shown in FIG. As shown in FIGS. 8A and 8B, the oscillator 2000 includes an oscillation element 100A and an oscillation circuit that excites the oscillation element 100A inside a package 2300 formed by the package body 2100 and the lid member 2200. And a semiconductor device 2410 including a variable capacitance element whose capacitance changes with voltage, or an electronic component 2420 which is at least one of a thermistor and an inductor whose resistance value changes with temperature.

  As shown in FIG. 8B, the package body 2100 is formed by stacking a first substrate 2110, a second substrate 2120, and a third substrate 2130. A plurality of mounting terminals 2150 are formed on the outer surface 2110 b of the first substrate 2110. The second substrate 2120 and the third substrate 2130 are formed in a frame shape with the central portion removed, and the first substrate 2110, the second substrate 2120, and the third substrate 2130 are stacked to form a vibration element. A recess 2100a (hereinafter referred to as a cavity 2100a) for accommodating 100A, the semiconductor device 2410, the electronic component 2420, and the like is formed. Also, on the mounting surface 2120a on which the vibration element 100A of the second substrate 2120 is placed, a mounting pad 2170 and an electrode terminal 2180 that are electrically connected to the pad electrodes 110c and 120c of the vibration element 100A are formed. These mounting pads 2170 and electrode terminals 2180 are electrically connected to the semiconductor device 2410 or the electronic component 2420 through internal wiring formed inside the package body 2100. The mounting pad 2170 is formed in a region corresponding to the pad electrode 110c of the first electrode 110 when the vibration element 100A is placed in the cavity 2100a.

  Since the vibration element 100A is fixed to the second substrate 2120 in the same manner as in the third embodiment described above, description thereof is omitted. The semiconductor device 2410 is fixed to a predetermined position of the electronic component mounting surface 2110a of the first substrate 2110 with an adhesive or the like, and is connected to the terminals of the semiconductor device 2410, electrode terminals 2430 provided on the electronic component mounting surface 2110a, and bonding wires BW. Connect electrically. Further, the electronic component 2420 is connected and fixed by a metal bump or the like formed at a predetermined fixing position on the electronic component mounting surface 2110a. The electrode terminal 2430 is connected to a plurality of mounting terminals 2150 formed on the outer surface 2110 b of the first substrate 2110 by the internal wiring 2160 of the first substrate 2110.

  The resonator element 100A, the semiconductor device 2410, and the electronic component 2420 are connected and fixed to the cavity 2100a, and the package body 2100 is hermetically sealed by the lid member 2200, whereby the oscillator 2000 is obtained.

  As described above, the oscillator 2000 including the vibration element 100A, the semiconductor device 2410 including the oscillation circuit, and the electronic component 2420 in the package 2300 has been described as the fourth embodiment. However, the present invention is not limited to this. For example, by applying COB (Chip On Board) technology, a vibration device 100A and a semiconductor device 2410 including an oscillation circuit and an electronic component 2420 are mounted on a printed circuit board of an electronic device in an exposed state, and then a chip The oscillator may be formed by molding or covering with a cap. Alternatively, the vibration element 100 </ b> A may be supported at one point on one side of the printed circuit board via a bonding material and electrically connected to the printed board, and the other electrode may be wire-connected.

(Fifth embodiment)
FIG. 9 is a schematic configuration diagram illustrating an example of an electronic device. The electronic device 3000 includes the vibrator 1000 according to the third embodiment. Examples of the electronic device 3000 include a transmission device. In the electronic device 3000, the vibrator 1000 is used as a reference signal source, a voltage variable oscillator (VCXO), or the like to obtain a small electronic device 3000 having excellent characteristics. be able to.

  DESCRIPTION OF SYMBOLS 1 ... Individual piece (element piece), 2 ... Holding part, 10 ... Substrate (quartz substrate).

Claims (8)

Multiple pieces,
A pair of connecting portions extending from the piece;
And a holding part to which the extended end of the connecting part is connected,
The connecting portion is provided with a constricted portion between the piece connecting portion to which the piece is connected and the holding connecting portion to which the holding portion is connected,
The piece includes a convex portion extending in an extending direction of the connecting portion from an end portion of the piece connecting portion side of the piece between the pair of connecting portions,
The constricted portion is provided closer to the piece connecting portion than the end portion in the extending direction of the convex portion,
A substrate characterized by that. In claim 1,
A gap between the end portion in the extending direction of the convex portion and the holding portion is δ,
The thickness of the substrate is t,
The relationship between δ and t is
δ> t
Are satisfied,
A substrate characterized by that. In claim 1 or 2,
The substrate is quartz;
Centering on the X axis of an orthogonal coordinate system consisting of an X axis as an electrical axis, a Y axis as a mechanical axis, and a Z axis as an optical axis, which is a crystal axis of the quartz crystal, When the axis tilted in the −Y direction of the Y axis is the Z ′ axis and the axis tilted in the + Z direction of the Z axis is the Y ′ axis,
The main surface of the substrate is parallel to the X axis and the Z ′ axis,
The direction parallel to the Y ′ axis is the thickness,
The connecting portion extends along the X axis;
A substrate characterized by that. In claim 3,
A substrate characterized in that the crystal is an AT cut crystal. In any one of Claims 1-4,
An electrode is provided on the piece,
A substrate characterized by that. An element obtained by breaking the connecting portion and separating the individual pieces from the substrate according to claim 5;
An electronic device comprising: a package in which the element is accommodated. An element obtained by breaking the connecting portion and separating the individual pieces from the substrate according to claim 5;
An oscillation circuit for driving the element;
An oscillator comprising:   An electronic apparatus comprising the electronic device according to claim 6.

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