JP2013157553A - Imprint device, control method of imprint device, and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imprint device which improves the accuracy of the mark measurement conducted by a scope without making contact between a mold and a substrate, and to provide a control method of the imprint device and a device manufacturing method.SOLUTION: An imprint device of this invention uses a mold where a pattern is formed and forms the pattern at an imprint material supplied to a substrate. The imprint device includes: a substrate stage holding a substrate; a reference mark provided at the substrate stage; and a first scope observing the reference mark through the mold. The first scope observes the mark formed in the mold and the reference mark in a state where the substrate is not mounted on the substrate stage.

Description

  The present invention relates to an imprint apparatus that transfers a pattern of a mold onto an imprint material supplied to a substrate, a control method for the imprint apparatus, and a device manufacturing method.

  In the imprint technique, a fine pattern is formed on a substrate such as a silicon wafer or a glass plate by using a mold (mold) on which a fine pattern is formed using an apparatus such as an electron beam drawing apparatus as an original plate. Technology. The imprint apparatus supplies (applies) an imprint material (resin) onto the substrate, and presses the imprint material and the pattern of the mold. A fine pattern can be formed (transferred) by curing the imprint material in the pressed state.

  The imprint apparatus includes a substrate stage for holding a substrate, an imprint material supply mechanism for supplying an imprint material onto the substrate, an imprint head for holding a mold, a light irradiation system, and a positioning mark detection mechanism. Have Such an imprint apparatus is disclosed in Patent Document 1.

  In such an imprint apparatus, the substrate stage and the mold may be aligned with each other in a predetermined relationship. In some cases, a reference mark provided on the substrate stage is observed with a scope, and a reference of the position of the substrate stage is measured using an interferometer or the like. At this time, the reference mark is observed through the mold.

  For example, when performing alignment measurement by the global alignment method, the relative position (so-called baseline amount) between the detection system for observing the substrate and the mold is measured. At this time, the reference mark is observed through the mold in order to measure the relative position of the mold. From the measurement of the baseline amount, the substrate is fed under the mold to form a pattern.

JP 2007-281072 A

  However, when detecting the reference mark formed on the stage reference member and the mark formed on the mold, the error included in the measurement value increases as the distance between the mold and the stage reference member increases. Therefore, it is necessary to measure the distance between the mold and the stage reference member close to each other.

  However, if the distance between the mold and the stage reference member is too close, the substrate and the mold may interfere and contact each other. Contact with each other may damage the substrate and mold. Therefore, the distance between the mold and the stage reference member needs to be set so that there is no risk of the substrate and the mold coming into contact with each other.

  Therefore, an object of the present invention is to provide an imprint apparatus, an imprint apparatus control method, and a device manufacturing method in which the accuracy of mark measurement is improved without contact between a substrate and a mold.

  An imprint apparatus according to the present invention is an imprint apparatus that forms a pattern on an imprint material supplied to a substrate using a mold on which a pattern is formed. The imprint apparatus includes a substrate stage that holds a substrate, and a substrate stage. And a first scope for observing the reference mark through the mold. The first scope includes a mark and a reference mark formed on the mold in a state where the substrate is not mounted on the substrate stage. It is characterized by observing.

  It is possible to provide an imprint apparatus, an imprint apparatus control method, and a device manufacturing method that improve the accuracy of mark measurement without contact between the mold and the substrate.

It is the figure which showed the imprint apparatus of 1st Embodiment. FIG. 6 is a diagram for explaining an error included in a measurement value generated in a scope 6. (A) is a figure explaining interference with a board | substrate and a type | mold. (B) is a figure explaining interference with a type | mold and a reference mark. It is the schematic diagram which showed the motion of the substrate stage of 1st Embodiment. It is a flowchart of the sequence of 1st Embodiment. It is the schematic diagram which showed the motion of the substrate stage of 2nd Embodiment. It is a flowchart of the sequence of 2nd Embodiment. It is the schematic diagram which showed arrangement | positioning of the stage reference board and type | mold of 3rd Embodiment.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[First Embodiment]
FIG. 1 explains the imprint apparatus IMP of the present invention. An imprint technique for forming a pattern on a substrate using the imprint apparatus IMP will be described.

  First, an imprint material (resin) is supplied from a resin supply mechanism (not shown) onto the processing surface of the substrate 1 including a silicon wafer, a glass plate, and the like. At least one of the supplied imprint material and the mold 2 on which the pattern is formed is pressed against the other. The imprint material is cured by irradiating light from a light source with the substrate 1 and the mold 2 pressed.

  In the present embodiment, a case where a curable resin that is cured by irradiation with light is used as the imprint material will be described. As the imprint material, a resin that is cured by applying heat may be used. What is necessary is just to determine the wavelength of the light to irradiate according to the kind of curable resin. Further, in order to irradiate light with the mold pressed, the mold 2 is made of a material that transmits light such as quartz.

  After irradiation with light, the mold is pulled away from the cured curable resin, whereby the pattern of the mold 2 is formed (transferred) on the imprint material on the substrate 1 in an inverted state. Thus, an imprint method in which the imprint material is cured using light is called a photocuring method.

  As shown in FIG. 1, the imprint apparatus IMP of the first embodiment includes a support 3 for supporting a mold 2 on which a pattern is formed. The substrate stage 7 holds the substrate 1. The substrate stage 7 includes a stage reference member 8 on which a reference mark 10 is formed. The reference mark 10 is a mark that serves as a positioning reference for the substrate stage 7.

  Further, a scope 6 (first scope) is provided in the support 3. The scope 6 optically observes the mark 4 formed on the mold 2 and the reference mark 10. The scope 6 only needs to observe the mark 4 and the reference mark 10 at the same time and measure the relative positional relationship between them. Therefore, the scope 6 has an imaging optical system inside, and can be a scope for observing the mark with an image. Further, it may be a scope for detecting a signal due to a synergistic effect such as an interference signal, moire, or beat generated when the mark 4 and the reference mark 10 overlap.

  The relative positional relationship between the mark 4 and the reference mark 10 may be measured by observing the position of the mark 4 or the reference mark 10 with respect to a reference position (such as a mark or a sensor surface) provided in the scope 6. In this case, it is not necessary to observe the mark 4 and the reference mark 10 simultaneously.

  An off-axis alignment scope (hereinafter referred to as OA scope 9) is provided outside the center of the pattern 2 pattern. Since the OA scope 9 (second scope) is not limited in the place where it is placed compared to the scope 6, an optical system having a large NA can be used. Therefore, the resolution of the OA scope 9 is generally higher than that of the scope 6 provided on the support 3.

  The closer the OA scope 9 is to the center of the pattern surface of the mold 2, the smaller the baseline amount BL and the smaller the error component. Here, the baseline amount BL is the distance between the axis passing through the center of the pattern surface of the mold 2 and orthogonal to the pattern surface and the optical axis of the optical system constituting the OA scope 9. The position of the axis passing through the center of the pattern surface of the mold 2 and orthogonal to the pattern surface can be measured using the result of detecting the mark 4 by the scope 6.

  The imprint apparatus IMP includes a control unit C. The controller C processes the observation results of the marks 5 formed on several representative shots of the substrate 1 by the OA scope 9. Then, global alignment processing is performed to determine the positions of all shots on the substrate 1 from the positions of several representative shots.

  The above-described baseline amount BL corresponds to an offset amount for reflecting the result of the global alignment processing obtained by the control unit C to the imprint apparatus IMP. As the baseline amount BL fluctuates, the result of global alignment is not correctly reflected in the imprint apparatus IPM. This leads to a decrease in overlay accuracy between the shot position and the pattern to be transferred. Therefore, it is common to periodically measure the baseline amount BL.

  The baseline amount BL is first measured by using the scope 6 to measure the relative position (first relative position) between the mark 4 and the reference mark 10 formed on the stage reference member 8. At this time, the position of the substrate stage 7 is measured by an interferometer (not shown). Then, the stage reference member 8 is placed under the OA scope 9 while monitoring the driving amount of the substrate stage 7 with an interferometer or the like. The reference mark 10 formed on the stage reference member 8 is observed using the OA scope 9, and the relative position (second relative position) to the OA scope 9 is measured from the observation result. At this time, the position of the substrate stage 7 is measured with an interferometer or the like. The distance between the position of the stage when the reference mark 10 is detected using the scope 6 from the driving amount of the substrate stage measured by an interferometer or the like and the position of the stage when the reference mark 10 is detected using the OA scope 9 Can be requested. The control unit C obtains this distance, and can determine the relative positional relationship between the mold 2 and the OA scope 9 from the relative position between the mark 4 and the reference mark 10 and the relative position between the OA scope 9 and the reference mark 10. The so-called baseline amount BL of the mold 2 and the OA scope 9 can be obtained. Here, the baseline amount BL can include not only the distance but also information regarding the direction. The relative positional relationship is such that the position A for moving the stage 7 from the position A, which is positioned by observing the reference mark 10 with the OA scope 9, to the position B, where the mark 4 of the mold 2 and the reference mark 10 are positioned. B is information on the relative positional relationship of B, and the baseline amount BL is an example.

  The reference mark 10 may be different from the one observed with the scope 6 and the one observed with the OA scope 9. If it is different, it is necessary to know the positional relationship between the reference marks in advance.

  Among the measurement of the baseline amount BL in the above-described imprint apparatus IMP, when measuring the mark 4 and the reference mark 10 with the scope 6, it is necessary to measure both sufficiently close. As described above, the smaller the distance between the two, the smaller the error included in the measurement value. Therefore, when detecting the mark 4 and the reference mark 10 with the scope 6, the mold 2 is brought close to the substrate 1. Since the distance between the mark 4 and the reference mark 10 only needs to be close, the substrate 1 may be close to the mold 2 or close to each other. For example, the mold 2 and the stage reference member 8 when the scope 6 detects the mark 4 and the reference mark 10 rather than the distance between the mold 2 and the stage reference member 8 when the substrate stage 7 is moving under the mold 2. Reduce the interval of. The mark 4 and the reference mark 10 may be brought close to an interval where the scope 6 can detect the mark 4 and the reference mark 10.

  FIG. 2 shows a state in which the scope 6 measures the relative position of the mark 4 formed on the mold 2 and the reference mark 10 formed on the stage reference member 8. At this time, if the mold 2 and the stage reference member 8 come into contact with each other, the mold 2 and the stage reference member 8 may be damaged. However, although it is sufficient if the scope 6 can be arranged with no inclination in the measurement direction, there is a possibility that the inclination in the measurement direction is caused as shown in FIG.

  If the distance between the mold 2 and the stage reference member 8 is too large, if the scope 6 is tilted in the measurement direction as shown in FIG. 2, the error included in the measurement value increases due to a decrease in the telecentricity.

When the tilt of the scope 6 in the measurement direction is θ, and the gap between the mark 4 and the reference mark 10 is gap, the error x included in the measurement value is x = gap × tan θ.
It appears. For example, if gap = 200 μm and θ = 5 ′, the error included in the measurement value is x = 2.9 nm. In order to reduce this error, the gap between the mark 4 and the reference mark 10 may be narrowed to reduce the gap value.

  FIG. 3 shows a schematic diagram when measurement is performed with the mark 4 and the stage reference member 8 close to each other and the gap is reduced. For example, when measuring the relative position of the mark 4 and the reference mark 10 using the scope 6, if the mold 2 and the stage reference member 8 are too close as shown in FIG. And the substrate 1 may come into contact. Further, when imprinting an edge shot (peripheral shot) of the substrate as shown in FIG. 3B, the mold 2 and the stage reference member 8 may come into contact with each other due to the inclination of the substrate stage 7. If the mold 2 and the substrate 1 are in contact with each other, the substrate or the mold may be damaged.

  In order to avoid the above situation, the sequence of this embodiment will be described with reference to FIGS. 4 and 5. FIG. 4 is a schematic diagram showing the movement of the substrate stage 7 when the imprint apparatus is viewed from above. The movement of the substrate stage 7 will be described together with the flowchart shown in FIG.

  In step S5-1 in FIG. 5, a transfer process (imprint) is performed. The pattern of the mold 2 is transferred to the substrate 1 held by the substrate stage 7 (FIG. 4A). In FIG. 4, the position of the mold is indicated by a dotted circle, but the shape is not limited to a circle and may be a rectangle. The pattern is formed near the center of the mold 2. By repeating the transfer process for the shots of the substrate 1, the pattern can be transferred to all the shots. The substrate 1 after the transfer process is carried out of the apparatus. Therefore, the substrate stage 7 moves to the substrate carry-out position.

  In step S5-2 in FIG. 5, the substrate is carried out. When the substrate stage 7 is moved to the substrate unloading position, the substrate 1 is unloaded from the substrate stage 7 by an unillustrated unloading hand (FIG. 4B). At this time, the distance between the mold 2 and the substrate 1 is sufficiently wide to eliminate the possibility of interference with each other.

  In step S5-3 in FIG. 5, the relative position of the mold 2 is measured. The relative position of the mark 4 formed on the mold 2 and the reference mark 10 formed on the stage reference member 8 is measured. After unloading the substrate from the imprint apparatus in step S5-2, the substrate stage 7 is moved so that the stage reference member 8 is positioned under the mold 2. The substrate stage 7 from which the substrate 1 has been unloaded moves so that the stage reference member 8 is positioned under the mold 2 without mounting the substrate. When the stage reference member 8 moves below the mold 2, the mold 2 is moved closer to the stage reference member 8 to reduce the distance between the mark 4 and the reference mark 10. In this embodiment, the interval here is the interval in the height direction (gravity direction), the interval between the mark 4 and the reference mark 10, or the interval between the two surfaces on which they are formed. It may be taken as. After the predetermined interval, the relative position is measured by detecting the mark 4 and the reference mark 10 using the scope 6. At this time, if the substrate is mounted on the substrate stage 7, the mold 2 and the substrate 1 may come into contact (interference). Therefore, in this embodiment, relative position measurement is performed without mounting a substrate (FIG. 4C).

  In step S5-4 in FIG. 5, the relative position of the OA scope 9 is measured. The relative position of the reference of the OA scope 9 and the reference mark 10 formed on the stage reference member 8 is measured. When the relative position measurement in step S5-3 is completed, the substrate stage 7 is moved so that the stage reference member 8 is positioned below the OA scope 9. At this time, the driving amount of the substrate stage 7 is measured with an interferometer or the like. When the stage reference member 8 is positioned below the OA scope 9, the reference mark 10 is measured with the OA scope 9 (FIG. 4D). At this time, the distance between the mold 2 and the stage reference member 8 is sufficiently wide to eliminate the possibility of interference with each other. In addition, the distance between the mold 2 and the substrate stage 7 is widened to eliminate the possibility of interference between the mold 2 and the substrate stage 7 when the substrate stage 7 moves.

  Here, the reference of the OA scope may be a reference mark provided in the OA scope 9 or a light receiving element of the OA scope 9 may be used as a reference. Further, a reference mark detected using the scope 6 and a reference mark detected using the OA scope 9 may be different. When different reference marks are used, it is necessary to know the design positions of the different reference marks.

  From the measurement in step S5-3, the substrate stage drive amount measurement, and the measurement in step S5-4, the control unit C can obtain the baseline amount BL. A baseline amount is obtained using a drive amount of the substrate stage 7 measured using an interferometer (not shown).

  In step S5-5 in FIG. 5, substrate mounting is performed. Next, a substrate to which the pattern is transferred (untransferred substrate) is mounted on the substrate stage 7. When the relative position measurement in step S5-4 is finished, the substrate stage 7 moves to the substrate mounting position. At this time, the distance between the mold 2 and the substrate stage 7 is sufficiently wide to eliminate the possibility of interference with the mold 2 while the substrate stage 7 moves. A substrate on which a pattern is transferred next is mounted on the substrate stage 7 moved to the substrate mounting position by using a loading hand (not shown) (FIG. 4E).

  Note that the substrate onto which the pattern is transferred next may stand by in the transport system while the baseline amount is being measured. During standby, foreign matter inspection and removal of the substrate surface, substrate temperature adjustment, alignment measurement for mounting on the substrate stage with high accuracy, and the like can be performed in the transport system.

  In step S5-6 in FIG. 5, global alignment measurement is performed. When the substrate 1 is mounted on the substrate stage 7, the substrate stage 7 moves so that the substrate 1 is positioned below the OA scope 9. At this time, the distance between the mold 2 and the substrate 1 is sufficiently wide to eliminate the possibility of interference with each other. When the substrate 1 moves below the OA scope 9, a plurality of shot alignment marks formed on the substrate 1 are detected using the OA scope 9. Using the detected result, the control unit C performs statistical processing to obtain the shot arrangement on the substrate. A so-called global alignment measurement is performed.

  In step S5-7 in FIG. 5, the transfer process is started. The shot position on the substrate 1 is obtained from the global alignment measurement in step S5-6. The substrate stage 7 moves so that the substrate 1 is positioned below the mold 2 according to the shot position obtained in step S5-6. When the substrate 1 is positioned, imprinting is started (FIG. 4F). Then, the pattern is transferred onto the substrate again by repeating the transfer of the pattern as in step S5-1.

  As described above, the baseline amount BL can be measured before the substrate 1 is mounted on the substrate stage 7. Since the substrate 1 is not mounted on the substrate stage 7, the distance (GAP) between the mold 2 and the stage reference member 8 can be reduced. The mark 4 formed on the mold 2 and the reference mark 10 formed on the stage reference member 8 can be brought close to each other. Therefore, the mark measurement accuracy by the scope 6 is improved.

  Further, the distance between the mold 2 and the substrate 1 or the substrate stage 7 is sufficient except when the reference mark 10 is measured using the scope 6 in step S5-3 and when the pattern is transferred to the shot of the substrate 1. Leave an interval. By doing so, it is possible to eliminate the possibility of interference with the mold 2 when the substrate stage 7 is moved.

  When the baseline amount is measured without mounting the substrate on the substrate stage 7, the measurement by the scope 6 in step S5-3 may be performed first, or the measurement by the OA scope 9 in step S5-4 may be performed first. .

[Second Embodiment]
In this embodiment, when measuring the relative position of the mark 4 and the reference mark 10 using the scope 6, the mark is detected without mounting the substrate on the substrate stage, and the substrate is detected when the mark is detected using the OA scope 9. An example of mounting will be described.

  The sequence of this embodiment will be described with reference to FIGS. FIG. 6 is a schematic diagram showing the movement of the substrate stage 7 when the imprint apparatus is viewed from above. The imprint method of the second embodiment will be described based on the flowchart shown in FIG. The configuration of the apparatus is the same as that of the first embodiment. The description of the same reference numerals as in the first embodiment is omitted.

  In step S6-1 in FIG. 7, a transfer process is performed (FIG. 6A). This corresponds to step S5-1 described in the first embodiment.

  In step S6-2, the substrate is carried out (FIG. 6B). This corresponds to step S5-2 described in the first embodiment.

  In step S6-3, the relative position of the mold 2 is measured (FIG. 6C). This corresponds to step S5-3 described in the first embodiment.

  In step S6-4, substrate mounting is performed. After performing the relative position measurement in step S6-3, the substrate stage 7 moves to the substrate mounting position. A substrate on which a pattern is transferred next is mounted on the substrate stage 7 by a loading hand (not shown) on the substrate stage 7 moved to the substrate mounting position (FIG. 6D). This corresponds to step S5-5 described in the first embodiment.

  Thereafter, in step S6-5, the relative position of the OA scope 9 is measured. After mounting the substrate on the substrate stage 7 in step S6-4, the substrate stage 7 moves so that the stage reference member 8 is positioned below the OA scope 9. When the stage reference member 8 is positioned, the relative position between the reference of the OA scope 9 and the reference mark 10 is measured (FIG. 6 (e)). Step S6-5 corresponds to step S5-4 described in the first embodiment.

  In step S6-6, global alignment measurement is performed. Step S6-6 corresponds to step S5-6 described in the first embodiment. The global alignment measurement is performed by detecting the alignment mark on the substrate 1 with the OA scope 9 as described in step S5-6 of the first embodiment. When the relative position measurement of the OA scope 9 in step S6-5 is finished, the stage reference member 8 is positioned under the OA scope 9.

  In step S6-7, the transfer process is started (FIG. 6 (f)). Step S6-7 corresponds to step S5-7 described in the first embodiment.

  In this embodiment, unlike the first embodiment, the substrate on which the pattern is transferred next is mounted on the substrate stage before the relative position measurement by the OA scope 9. This is because the aforementioned interference between the mold 2 and the substrate 1 occurs when the relative position between the mark 4 and the reference mark 10 is measured by the scope 6. If the relative position is measured without mounting the substrate in step S6-3, the substrate may be mounted on the substrate stage in step S6-4 as in this embodiment.

  Since the substrate is not mounted in step S6-3, the mark 4 and the reference mark 10 can be brought close to each other during measurement using the scope 6. Therefore, the mark measurement accuracy by the scope 6 is improved. As described above, the mold 2 and the stage reference member 8 can be brought close to each other at the time of mark measurement using the scope 6 even if the order of carrying the substrates into the substrate stage is changed.

[Third Embodiment]
The present embodiment is characterized by the arrangement of the substrate carry-out position, the substrate mounting position, the stage reference member 8, the scope 6 and the like of the imprint apparatus.

  FIG. 8A shows a case where the imprint apparatus is designed so that the stage reference member 8 is substantially under the mold 2 when the substrate stage 7 is positioned at the substrate carry-out position. A scope 6 (not shown) for detecting a mark via the mold 2 is arranged. Therefore, in the case of FIG. 8A, the reference mark 10 formed on the stage reference member 8 can be detected when the substrate is carried out. In this case, after carrying out the substrate in step S5-2 described in the first embodiment, the mark 4 and the reference mark 10 can be detected using the scope 6 even if the substrate stage 7 does not move significantly. . Since the substrate is carried out, the mold 2 and the stage reference member 8 can be brought close to each other. The mark 4 formed on the mold 2 and the reference mark 10 formed on the stage reference member 8 can be brought close to each other. Therefore, the error included in the measurement value can be reduced.

  FIG. 8B shows a case where the imprint apparatus is designed so that the stage reference member 8 is substantially below the mold 2 when the substrate stage 7 is positioned at the substrate mounting position. Similarly, a scope (not shown) for detecting a mark via the mold 2 is arranged. Therefore, in the case of FIG. 8A, the reference mark 10 formed on the stage reference member 8 can be detected when the substrate is mounted. In this case, the substrate 1 can be mounted on the substrate stage 7 even if the substrate stage 7 does not move significantly after the relative position measurement of the mold 2 in step S6-3 described in the second embodiment. Since the mark is detected before the substrate is carried in, the mold 2 and the stage reference member 8 can be brought close to each other. The mark 4 formed on the mold 2 and the reference mark 10 formed on the stage reference member 8 can be brought close to each other. Therefore, the error included in the measurement value can be reduced.

  However, when the substrate is unloaded from the substrate stage 7 or when the substrate is loaded into the substrate stage 7, the space between the mold 2 and the substrate stage 7 is sufficiently spaced to prevent the mold 2 and the substrate 1 from contacting each other.

  Thus, when the substrate stage 7 is arranged at the substrate carry-out position or the substrate mounting position, the imprint apparatus can measure the relative position between the reference mark 10 formed on the stage reference member and the mark 4 formed on the mold. To design. By doing so, the moving distance of the substrate stage 7 can be reduced. In addition, if the relative position between the mark 4 and the reference mark is measured by the scope 6 while the substrate is being carried out or mounted, the time required for measuring the baseline amount can be shortened.

  In any of the embodiments, the above-described measurement of the baseline amount is not necessarily performed for each substrate. It can be arbitrarily determined, for example, for every predetermined number of lots. When the baseline amount is not measured, after the substrate is unloaded, the substrate on which the pattern is transferred next is mounted on the substrate stage 7 at the substrate mounting position.

  Also, when imprinting the edge shot (peripheral shot) of the substrate, if the contact (interference) between the mold 2 and the stage reference member 8 is a concern, the surface of the stage reference member 8 is lower than the surface of the substrate 1. do it. Even when the stage reference member is lowered, the substrate 1 is not mounted when the mark 4 and the reference mark formed on the stage reference member are measured. Therefore, even if the gap in FIG. Without this, the scope 6 can detect the mark.

  If the substrate stage 7 moves without mounting the substrate 1, dust may adhere on the substrate stage. Therefore, when there is no substrate 1 on the substrate stage 7, dust adhesion can be reduced by blowing gas to the substrate stage or blowing gas from the substrate stage 7. Thus, the imprint apparatus may include a supply mechanism that supplies gas to the substrate stage. As the gas to be supplied, a clean gas in which impurities are reduced by passing through a filter can be used. After the baseline measurement, the dust adhering to the surface of the substrate stage may be blown off when coming to the substrate mounting position.

  In addition, there is a difference in the weight of the substrate stage depending on the presence or absence of the substrate 1, and it is considered that the error included in the measurement value is large due to the tilt of the substrate stage or the like. In that case, a weight equivalent to the weight of the substrate may be added to the substrate stage when the substrate 1 is not mounted. For example, a weight (dummy weight) may be mounted instead of the substrate when the substrate is unloaded. By using a weight that is the same as or close to the weight of the substrate, the tilt of the substrate stage can be reduced. Therefore, the error included in the measurement value can be reduced.

  The dummy weight is made of a material having a specific gravity greater than that of the substrate. In this way, even if a dummy weight having the same weight as the substrate is produced, the volume can be reduced. For example, in the case where the substrate 1 is silicon, even if it is iron or gold having a specific gravity heavier than that of silicon, even a disc-shaped weight having the same area is thin. As a result, the distance between the surface of the dummy weight and the mold is increased, and contact with the mold can be reduced. Further, since the same effect as that obtained by mounting the substrate on the substrate stage may be obtained, the shape of the dummy weight does not need to be a disk shape.

  As imprint technologies in practical use at present, there are a thermal cycle method and a photocuring method. In the thermal cycle method, a thermoplastic resin is heated to a temperature equal to or higher than the glass transition temperature, the mold is pressed against the substrate through the resin in a state in which the fluidity of the resin is improved, and after cooling, the pattern is separated from the resin. Is formed. In the photo-curing method, a pattern is formed by using a photo-curing resin, curing the resin by irradiating light with the mold pressed against the substrate through the resin, and then separating the mold from the cured resin. Is done. The thermal cycle method involves an increase in transfer time due to temperature control and a decrease in dimensional accuracy due to a temperature change. However, since the photocuring method does not have such a problem, at present, the photocuring method is nanoscale. This is advantageous in mass production of semiconductor devices. Any method may be used for the imprint apparatus of the present invention.

  In any of the embodiments, the case where there is one substrate stage has been described. However, this system can be used in a system using multiple stages as long as it is a system that periodically measures and manages the positional relationship between the alignment measurement system and the mold as a baseline amount. The invention can be implemented.

[Device manufacturing method]
A device (semiconductor integrated circuit element, liquid crystal display element, etc.) manufacturing method includes a step of forming a pattern on a substrate (wafer, glass plate, film-like substrate) using the above-described imprint apparatus. Further, the device manufacturing method may include a step of etching the substrate on which the pattern is formed. In the case of manufacturing other articles such as patterned media (recording media) and optical elements, the manufacturing method may include other processes for processing a substrate on which a pattern is formed instead of etching. The article manufacturing method of this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various combination, a deformation | transformation, and a change are possible within the range of the summary.

1 substrate 2 mold 4 mark (mark formed on the mold)
6 Scope 7 Substrate stage 8 Stage reference member 9 OA scope 10 Reference mark (reference mark formed on stage reference member)

Claims (10)

An imprint apparatus for forming the pattern on an imprint material supplied to a substrate using a mold on which a pattern is formed,
A substrate stage for holding the substrate;
A reference mark provided on the substrate stage;
A first scope for observing the reference mark through the mold,
An imprint apparatus using the first scope to observe the mark formed on the mold and the reference mark in a state where the substrate is not mounted on the substrate stage. A second scope for observing the reference mark without passing through the mold;
Having a control unit,
The control unit acquires a first relative position between the reference mark and the mark formed on the mold, measured using the first scope,
Obtaining a second relative position of the reference mark measured with the second scope and a reference provided on the second scope;
Obtaining a distance between the position of the substrate stage at which the first relative position is measured and the position of the substrate stage at which the second relative position is measured;
The imprint apparatus according to claim 1, wherein a relative positional relationship between the mold and the second scope is obtained from the first relative position, the second relative position, and the distance. When observing the mark formed on the mold and the reference mark with the first scope in a state where the substrate is not mounted on the substrate stage,
3. The imprint apparatus according to claim 2, wherein the mark formed on the mold is brought closer to the reference mark than when the reference mark is observed with the second scope. A supply mechanism for supplying gas to the substrate stage;
The imprint apparatus according to any one of claims 1 to 3, wherein a gas is supplied from the supply mechanism in a state where the substrate is not mounted, and the reference mark is observed.   The imprint apparatus according to claim 1, wherein the reference mark is observed by adding a weight of the substrate to the substrate stage in a state where the substrate is not mounted. . In order for the substrate held on the substrate stage to be unloaded from the substrate stage, at a position where the substrate stage has moved,
The imprint apparatus according to claim 1, wherein the reference mark is observed with the first scope. In order to carry the substrate into the substrate stage, at a position where the substrate stage has moved,
The imprint apparatus according to claim 1, wherein the reference mark is observed with the first scope.   The imprint apparatus according to claim 1, wherein a height of a surface of the reference mark is lower than a height of a surface of the substrate held on the substrate stage. A method for controlling an imprint apparatus that forms a pattern on an imprint material supplied to a substrate using a mold on which a pattern is formed,
The scope for observing the mark through the mold observes the mark formed on the mold and the reference mark provided on the substrate stage in a state where the substrate is not mounted on the substrate stage holding the substrate. And a method for controlling the imprint apparatus. Forming a pattern on a substrate using the imprint apparatus according to any one of claims 1 to 8,
Processing the substrate on which the pattern is formed in the step;
A device manufacturing method comprising:

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