JP2013157420A - Adhesive tape for manufacturing of semiconductor wafer and the like - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive tape for manufacturing of a semiconductor wafer and the like, which can exert a good pickup property even when adhered to a wafer within a few hours after grinding.SOLUTION: An adhesive tape for manufacturing of a semiconductor wafer and the like comprises a base material layer and an adhesive layer. The adhesive layer contains base polymer, isocyanate-based cross-linking agent and urethane acrylate. The urethane acrylate has residual polymerization catalyst which is used in manufacturing of the urethane acrylate and a residual amount of the polymerization catalyst is not less than 70 ppm and not more than 200 ppm.

Description

  The present invention relates to an adhesive tape for processing a semiconductor wafer or the like.

  Conventionally, a semiconductor wafer is made of a compound such as a silicon-based compound, a germanium-based compound, or a gallium-arsenic-based compound. Generally, after being manufactured in a large diameter state, it is ground to a predetermined thickness. Processing (back grinding) is performed. Further, the semiconductor wafer is further subjected to back surface processing (etching processing, polishing processing, etc.) as necessary. The semiconductor wafer thus processed is then cut and separated (diced) into element pieces (semiconductor chips) after a dicing adhesive tape is attached to the back surface thereof.

  The dicing pressure-sensitive adhesive tape has a pressure-sensitive adhesive layer (thickness: about 1 to 50 μm), and the pressure-sensitive adhesive layer usually has a pressure-sensitive adhesive composition such as an acrylic pressure-sensitive adhesive on a substrate such as a plastic film. It is obtained by coating and drying. The adhesive tape for dicing is required to have an adhesive force that does not cause the semiconductor wafer to peel off during dicing. On the other hand, in the pick-up process of a semiconductor chip, it is also required that the adhesive strength is low enough that it can be easily peeled off and does not damage the semiconductor chip. Another important characteristic of the dicing adhesive tape is that it has low contamination, such as no adhesive residue (a phenomenon in which components in the adhesive layer remain on the pasting surface) on the semiconductor chip. Yes.

  In addition, the said pick-up process is normally implemented after performing the expanding process which expands the space | interval between each semiconductor chip. The expanding step is a step of making the semiconductor chip easily peelable from the dicing adhesive tape. Further, the expanding step is performed by, for example, placing the dicing adhesive tape to a certain extent and lifting the dicing adhesive tape below the semiconductor chip to be picked up in a dotted or linear manner. At present, a method of picking up a semiconductor chip from the upper side by vacuum suction (vacuum suction) after making the semiconductor chip in such a state where it can be easily peeled is the mainstream.

  However, in recent years, several hours after the completion of the wafer back-grinding process and the crushing layer removal process after the wafer back-grinding process for the purpose of improving the tact time and preventing damage to the thinned semiconductor wafer. The number of cases in which a semiconductor wafer is attached to an adhesive tape for dicing is increasing. In addition, as a crushing layer removal process process, the process of the crushing layer removal process by a mechanical crushing layer removal process, a chemical crushing layer removal process, or both is mentioned.

  In this way, the dicing adhesive tape is applied to the ground surface (processed surface) of the semiconductor wafer within a few hours after the wafer backside grinding process and the crushed layer removing process after the wafer backside grinding process. When attached, the adhesive strength increases and the pick-up property deteriorates as the time after the attachment elapses.

  Patent Document 1 describes the use of a dicing tape having an adhesive layer having a special composition in order to solve the above problem. However, the addition of an epoxy resin in the pressure-sensitive adhesive affects not only after photocuring but also adhesion before photocuring, and it has been difficult to control to a predetermined adhesion.

JP 2008-192917 A

An object of the present invention is to provide a pressure-sensitive adhesive tape for processing a semiconductor wafer or the like that can exhibit good pick-up properties even if it is attached to a wafer within several hours after grinding.

Such an object is achieved by the present invention described in the following (1) to (8).
(1) A pressure-sensitive adhesive tape for processing a semiconductor wafer or the like having a base material layer and a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a base polymer, an isocyanate-based crosslinking agent, and a urethane acrylate, and the urethane acrylate Is a pressure-sensitive adhesive tape for processing semiconductor wafers or the like, wherein the polymerizable catalyst used in producing the urethane acrylate remains, and the residual amount is 70 ppm or more and 200 ppm or less.
(2) When the residual amount of the polymerizable catalyst in the urethane acrylate is X% by weight and the residual amount of the crosslinking agent in the pressure-sensitive adhesive layer is Y% by weight, 150 ≦ Y / X ≦ 2000 is satisfied ( A pressure-sensitive adhesive tape for processing a semiconductor wafer or the like as described in 1).
(3) The adhesive tape for processing a semiconductor wafer or the like according to (1) or (2), wherein the polymerizable catalyst is a tertiary amine catalyst or an organometallic catalyst.
(4) The adhesive tape for processing a semiconductor wafer or the like according to (3), wherein the organometallic catalyst is an organotin catalyst.
(5) The adhesive tape for processing a semiconductor wafer or the like according to any one of (1) to (4), wherein the urethane acrylate has two or more polymerizable functional groups.
(6) The pressure-sensitive adhesive tape for processing a semiconductor wafer or the like according to any one of (1) to (5), wherein the urethane acrylate has a weight average molecular weight of 1,000 to 10,000.
(7) The adhesive tape for processing a semiconductor wafer or the like according to any one of (1) to (6), wherein the base polymer is a hydroxyl group- or carboxyl group-containing polymer.
(8) The adhesive tape for processing a semiconductor wafer or the like according to any one of (1) to (7), further including a photopolymerization initiator.

  ADVANTAGE OF THE INVENTION According to this invention, even if it affixes on the wafer within several hours after grinding, the adhesive tape for processing of a semiconductor wafer etc. which can exhibit favorable pick-up property can be provided.

  Hereinafter, the adhesive tape for processing a semiconductor wafer or the like of the present invention will be described in detail.

The pressure-sensitive adhesive tape for processing a semiconductor wafer of the present invention is a pressure-sensitive adhesive tape for processing a semiconductor wafer having a base material layer and an adhesive layer, and the pressure-sensitive adhesive layer comprises a base polymer, an isocyanate-based crosslinking agent, The urethane acrylate contains a polymerizable catalyst used when the urethane acrylate is produced, and the residual amount is 70 ppm or more and 200 ppm or less.

The polymerizable catalyst is a catalyst used when producing the urethane acrylate, for example, a catalyst used when synthesizing and producing urethane acrylate using diisocyanate, polyol, and hydroxy (meth) acrylate as raw materials. Examples of such a polymerizable catalyst include a tertiary amine catalyst or an organometallic catalyst. Examples of tertiary amine catalysts include triethylamine, tripropylamine, triethylenediamine (TEDA), and diazabicycloundecene (DBU). Examples of organometallic catalysts include organic bismuth catalysts and organic tin catalysts. It is done. Among these, it is preferable to use an organotin catalyst because of its high safety.
Examples of the organotin catalyst include tin octylate, dibutyltin diacetate, and dibutyltin dilaurate. Examples of the bismuth catalyst include bismuth octylate and bismuth decanoate.

  Since the polymerizable catalyst is partially incorporated into the urethane acrylate during synthesis, the produced urethane acrylate remains the polymerizable catalyst. When such a polymerizable catalyst is included in the pressure-sensitive adhesive layer, the polymerizable catalyst serves to promote the reaction between the cross-linking agent and the base polymer.

  The residual amount of the polymerizable catalyst in the urethane acrylate is 70 ppm or more and 200 ppm or less. More preferably, it is 90 ppm or more and 180 ppm or less, More preferably, it is 110 ppm or more and 150 ppm. When the residual amount of the polymerizable catalyst exceeds the upper limit, the reaction between the isocyanate-based crosslinking agent and the base polymer proceeds more than necessary, thereby increasing the viscosity of the pressure-sensitive adhesive layer and reducing the productivity. That is, the pot life property may deteriorate. In addition, when the residual amount of the polymerizable catalyst is less than the lower limit, there are a large number of unreacted hydroxyl groups or carboxyl groups, so that after the wafer back grinding step and the crushed layer removal treatment step after the grinding step, several Within the time, the adhesiveness with the semiconductor wafer increases, and the pick-up property may deteriorate. This is because the natural oxide film is entirely formed on the ground surface of the semiconductor wafer within a few hours (for example, within 0-3 hours) after the wafer back grinding process or the crushing layer removal treatment process after the grinding process. In addition, the ground surface of the semiconductor wafer is an active surface in which unoxidized active atoms are present. When a dicing adhesive tape is bonded to such an active surface, the unoxidized active atoms ( This is presumed to be because a silicon atom or the like) reacts with a hydroxyl group or carboxyl group component of the pressure-sensitive adhesive layer, and a chemical bond is generated therebetween. Therefore, when the remaining amount of the catalyst is within the above range, an adhesive tape for processing a semiconductor wafer or the like excellent in pot life property and pick-up property can be obtained.

  Here, the residual amount of the polymerizable catalyst in the urethane acrylate is determined by using ICP emission spectroscopic analysis when the catalyst is an organotin catalyst or bismuth catalyst, and by a gas chromatograph mass spectrometer when the catalyst is a tertiary amine catalyst. Can be measured. The measurement method is, for example, as follows. First, 0.5 g of a sample is weighed into a 100 ml Kjeldahl flask, and after removing the solvents with a vacuum dryer, carbonized with 5 ml of sulfuric acid. Next, 5 ml of nitric acid is added and the organic matter is wet-decomposed. Further, 2 ml of distilled water and 3 ml of hydrogen peroxide water are added to cause wet decomposition. Further, 5 ml of hydrogen peroxide solution is added to completely decompose. After cooling, the test solution was made up to 50 ml with distilled water. The measurement wavelengths of ICP are 189.9 nm and 283.9 nm.

  When the residual amount of the polymerizable catalyst in the urethane acrylate is X wt% and the residual amount of the isocyanate-based crosslinking agent in the pressure-sensitive adhesive layer is Y wt%, it is not particularly limited, but 150 ≦ Y / X ≦ 2000 It is preferable that 300 ≦ Y / X ≦ 1500, and more preferably 400 ≦ Y / X ≦ 1100. When Y / X is equal to or higher than the lower limit value, good pick-up property can be exhibited due to a decrease in adhesion to the grinding surface, and when Y / X is equal to or lower than the upper limit value, an adhesive is applied during coating. Gelation can be suppressed.

In the urethane acrylate, the polymerizable catalyst used in producing the urethane acrylate remains. This is because urethane acrylate is a compound produced by synthesizing, for example, diisocyanate, polyol, and hydroxy (meth) acrylate in the presence of a polymerizable catalyst. As such a urethane acrylate, a urethane acrylate having two acryloyl groups is preferably used. Examples of the diisocyanate include toluene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, phenylene diisocyanate, dicyclohexylmethane diisocyanate, xylene diisocyanate, tetramethylxylene diisocyanate, and naphthalene diisocyanate. Examples of the polyol include ethylene glycol, propylene glycol, butanediol, hexanediol and the like. Examples of the hydroxy (meth) acrylate include 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate.

  The urethane acrylate is not particularly limited as long as it is used as a curing component and causes a curing reaction by ultraviolet rays and / or electron beams, but preferably has two or more polymerizable functional groups. By having the two or more polymerizable functional groups, three-dimensional crosslinking can be performed at the time of ultraviolet curing, the degree of curing becomes high, and the pick-up property after UV irradiation becomes good.

Although the weight average molecular weight of the said urethane acrylate is not specifically limited, 1000 or more and 10,000 or less are preferable, 2000 or more and 8000 or less are more preferable, More preferably, it is 3000 or more and 6000 or less. Since the weight average molecular weight of the urethane acrylate is within the above range, the adhesive strength is sufficient for the semiconductor wafer before the curing reaction, and the adhesive strength is reduced after the curing reaction, and the pickup property is good. .

  Examples of the method for measuring the weight average molecular weight of the urethane acrylate include gel chromatography. GPC measurement was performed using Waters Alliance (2695 Separations Module, 2414 Refractive Index Detector, TSK Gel GMHHR-Lx2 + TSK Guard Column HHR-Lx1, mobile phase: THF, 1.0 ml / min), column temperature 40.0 ° C. The measurement was performed under the conditions of a differential refractometer internal temperature of 40.0 ° C. and a sample injection amount of 100 μl.

The content of the urethane acrylate in the pressure-sensitive adhesive layer is not particularly limited, but is preferably 35% by weight to 60% by weight, more preferably 40% by weight to 55% by weight, and still more preferably. It is 45 to 50 weight%. When the content of the urethane acrylate is within the above range, both pick-up properties and chipping properties can be achieved.

The isocyanate-based crosslinking agent includes, for example, a polyisocyanate polyisocyanate compound and a polyisocyanate compound trimer, a trimer of a terminal isocyanate compound obtained by reacting the polyisocyanate compound and a polyol compound, or a terminal isocyanate urethane prepolymer. Examples thereof include blocked polyisocyanate compounds in which a polymer is blocked with phenol, oximes or the like. Among these, by using a polyvalent isocyanate, the speed of crosslinking becomes relatively slow, and coating unevenness due to excessive crosslinking during coating can be suppressed.

Examples of the polyvalent isocyanate include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4-4′-diisocyanate, diphenylmethane- Examples thereof include 2-4′-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4-4′-diisocyanate, dichlorocyclohexylmethane-2-4′-diisocyanate, and lysine isocyanate. Moreover, what added polyhydric alcohol to those isocyanate may be used.

  The content of the isocyanate-based crosslinking agent in the pressure-sensitive adhesive layer is not particularly limited, but is preferably 3% by weight or more and 15% by weight or less, more preferably 5% by weight or more and 12% by weight or less. More preferably, it is 7 wt% or more and 9 wt% or less. When the content of the isocyanate-based crosslinking agent in the pressure-sensitive adhesive layer is within the above range, the coating can be stably performed without gelation during coating, and the aging period can be shortened.

The base polymer is a polymer containing a functional group having reactivity with the cross-linking agent, and examples thereof include an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, and a silicone pressure-sensitive adhesive. Preferably there is. By using a hydroxyl group- or carboxyl group-containing polymer, the molecular weight increases due to the reaction between the polymer and the isocyanate cross-linking agent, and the adhesion and adhesion to the adherend can be easily controlled. Examples of the acrylic pressure-sensitive adhesive include resins composed of (meth) acrylic acid and esters thereof, (meth) acrylic acid and esters thereof and unsaturated monomers copolymerizable therewith (for example, vinyl acetate, Copolymers with styrene, acrylonitrile, etc.) are used. Two or more of these resins may be mixed. Among these, one or more selected from methyl (meth) acrylate, ethyl hexyl (meth) acrylate and butyl (meth) acrylate, one or more selected from hydroxyethyl (meth) acrylate and vinyl acetate, These copolymers are preferred. Thereby, control of adhesiveness and adhesiveness with an adherend becomes easy.

  The content of the base polymer in the pressure-sensitive adhesive layer is not particularly limited, but is preferably 25% by weight or more and 55% by weight or less, more preferably 30% by weight or more and 50% by weight or less, Preferably they are 35 weight% or more and 45 weight% or less. When the content of the base polymer in the pressure-sensitive adhesive layer is within the above range, there is adhesive force before irradiation with ultraviolet rays and / or electron beams, and there is no jump of peripheral chips during dicing, and after irradiation with ultraviolet rays and / or electron beams. Pickup property is improved.

In addition to the crosslinking agent, the base polymer, and the urethane acrylate, the pressure-sensitive adhesive layer may further contain a photopolymerization initiator as long as the characteristics are not impaired.

The photopolymerization initiator is not particularly limited, but 2,2-dimethoxy-1,2-diphenylethane-1-one, benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldiphenyl sulfide , Tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, β-chloranthraquinone, and the like, which are added to facilitate the initiation of polymerization of urethane acrylate as a curing component.

Examples of the material constituting the base material layer include polyolefin resins such as polyvinyl chloride, polyethylene, polypropylene, polybutene, polybutadiene, and polymethylpentene, ethylene / vinyl acetate copolymer, ionomer, and ethylene / (meth) acrylic acid. Copolymers, Olefin copolymers such as ethylene / (meth) acrylate ester copolymers, Polyethylene terephthalate resins such as polyethylene terephthalate and polybutylene terephthalate, Styrenic thermoplastic elastomers, Olefin thermoplastic elastomers, Vinyl A thermoplastic resin such as isoprene or polycarbonate and a mixture of these thermoplastic resins can be used. Among these, at least one selected from polyvinyl chloride, polyethylene, and polyethylene terephthalate is preferable from the viewpoint of imparting expandability to widen the chip interval. Particularly, an olefin copolymer and a thermoplastic elastomer such as a styrene thermoplastic elastomer, Is preferred.

The base material layer may contain a pigment, an antistatic agent, an antioxidant and the like to such an extent that the physical properties of the base material layer and the chip back surface are not affected.

  Examples of the semiconductor wafer include a semiconductor wafer and a package substrate.

In the present invention, in order to produce an adhesive tape for processing a semiconductor wafer, the adhesive layer is formed on the base material layer, and the components constituting the adhesive layer are dissolved as they are or with an appropriate organic solvent, and then a comma is used. A coater, a gravure coater, a die coater, a reverse coater, etc. are coated on the base material layer by coating or spraying in an appropriate thickness according to a generally known method, for example, at 80 to 100 ° C. for about 30 seconds to 10 minutes, etc. It can be obtained by drying.

  Although the thickness after drying of the said adhesion layer is not specifically limited, It is preferable that they are 3 micrometers or more and 30 micrometers or less, and it is more preferable that they are 5 micrometers or more and 20 micrometers or less. When the thickness of the pressure-sensitive adhesive layer after drying is within the above range, it is excellent in the holding power of the adherend, and in terms of cost and the problem of preventing the problem that the dust scraps adhere to the chip during dicing.

The thickness of the base material layer is not particularly limited, but is preferably 50 μm or more and 150 μm or less, and more preferably 80 μm or more and 120 μm or less. When the thickness of the base material layer is within the above range, workability is excellent.

  The thickness of the semiconductor wafer processing adhesive tape is not particularly limited, but is preferably 55 μm or more and 150 μm or less, and more preferably 80 μm or more and 120 μm or less. If the total thickness of the tape is thick, the expandability is insufficient, and if the total thickness is thin, tarmi when the wafer is placed is generated.

In order to use the semiconductor wafer processing adhesive tape of the present invention, a known method can be used. For example, after adhering the semiconductor wafer processing adhesive tape to the semiconductor wafer and fixing it, the semiconductor wafer is formed into a chip with a rotating round blade. Disconnect. Then, after irradiating ultraviolet rays and / or an electron beam from the substrate side of the processing adhesive tape, and then expanding the wafer processing adhesive tape radially using a dedicated jig to spread the chips at regular intervals. Is picked up by a method such as suction with a vacuum collet, air tweezers, etc.

EXAMPLES Hereinafter, although this invention is demonstrated in detail based on an Example and a comparative example, this invention is not limited to this.

Example 1
<Production of dicing tape>
As a material constituting the substrate, 60 parts by weight of polypropylene, 40 parts by weight of a block copolymer composed of a polystyrene segment represented by the general formula (1) and a vinyl polyisoprene segment represented by the general formula (2) were prepared.

  After the materials constituting the base material were kneaded with a biaxial kneader, the kneaded material was extruded with an extruder to prepare a base material with a thickness of 100 μm.

  As a base polymer for the adhesive layer, a copolymer (weight average molecular weight) obtained by copolymerizing 30 parts by weight of 2-ethylhexyl acrylate, 70 parts by weight of vinyl acetate, and 3 parts by weight of 2-hydroxyethyl methacrylate. Was 300,000).

  As a curing component of the adhesive layer, 47% by weight of urethane acrylate having a weight average molecular weight of 5000 and a polymerizable functional group of 4 was prepared. As a photopolymerization initiator for the adhesive layer, 3 wt% of 2,2-dimethoxy-1,2-diphenylethane-1-one (trade name “Irgacure 651”) was prepared. As an isocyanate-based crosslinking agent for the adhesive layer, 8% by weight of a polyisocyanate compound (trade name “Coronate L”) was prepared.

In the urethane acrylate, dibutyltin dilaurate remained as a polymerizable catalyst at a ratio of 130 ppm.

  A resin solution was prepared by mixing the polymer of the above-mentioned adhesive layer, a curing component, a photopolymerization initiator, a crosslinking agent, and ethyl acetate in an amount twice as much as the total thereof. This resin solution was bar-coated on the substrate so that the thickness of the pressure-sensitive adhesive layer after drying was 10 μm, and then dried at 80 ° C. for 1 minute to obtain a desired dicing tape.

(Example 2)
A dicing tape was prepared in the same manner as in Example 1 except that dibutyltin dilaurate remained in the urethane acrylate as a polymerizable catalyst at a ratio of 170 ppm.

(Example 3)
A dicing tape was prepared in the same manner as in Example 1 except that dibutyltin dilaurate remained in the urethane acrylate at a ratio of 75 ppm as a polymerizable catalyst.

Example 4
A dicing tape was prepared in the same manner as in Example 1 except that bismuth octylate as a polymerizable catalyst remained in the urethane acrylate at a ratio of 130 ppm.

(Example 5)
A dicing tape was prepared in the same manner as in Example 1 except that 2% by weight of a polyisocyanate compound was prepared as an isocyanate-based crosslinking agent for the adhesive layer.

(Comparative Example 1)
A dicing tape was prepared in the same manner as in Example 1 except that dibutyltin dilaurate remained in the urethane acrylate at a ratio of 45 ppm as a polymerizable catalyst.

(Comparative Example 2)
A dicing tape was prepared in the same manner as in Example 1 except that dibutyltin dilaurate remained in the urethane acrylate at a ratio of 850 ppm as a polymerizable catalyst.

<Evaluation test>
A wafer (thickness 0.1 mm) that was back-grinded (DAG810 manufactured by Disco Corporation) was attached to the produced dicing tape within several hours, and after dicing under the following conditions, the pickup property was evaluated.

<Dicing conditions>
Dicer “DAD-3350”, DISCO blade “ZH205O 27HEDD”, DISCO blade rotation speed 40000 rpm
Cutting speed 30mm / sec
Cutting depth 30μm from the surface of the adhesive sheet
Cut size 10mm x 10mm
Blade cooler 2L / min

<Pickup Property> The semiconductor wafer was pressed on a dicing tape under a condition of 23 ° C. and left for 20 minutes, and then diced to a size of 10 mm × 10 mm. After dicing, the dicing tape is irradiated with ultraviolet rays, the surface of the semiconductor wafer is adsorbed using a collet that is vacuum-adsorbed, and four needles spaced at 4 mm intervals are pushed up from the bottom of the dicing tape 100 to the respective heights. Was picked up from the dicing tape 100. The evaluation criteria are as follows.
5 out of 5 The pick-up height is 0.2 to 0.3 mm, and 0.3 to 0.4 mm is good (good until now), 0.4 to 0.4 A sample having a thickness of 0.5 mm was evaluated as Δ, and a sample having a size of 0.5 mm or more as ×.

<Pot life property> After making the above-mentioned resin solution, it was left in a sealed container and observed every 30 minutes, and the time until the solution became a gel was measured. The evaluation criteria are as follows.
A pot life of 9 hours or more was rated as ◎, a 6-9 hour one as ◯, a 3-6 hour one as Δ, and a three hour or less as x.

Table 1 shows the evaluation results of the above examples and comparative examples.

  As is clear from the table, Examples 1 to 5 show good pick-up properties and pot life properties, but Comparative Examples 1 and 2 have pick-up properties or pot life properties as compared with Examples 1 to 5. The result was not enough.

  The pressure-sensitive adhesive tape for processing semiconductors of the present invention is a pressure-sensitive adhesive tape for processing semiconductor wafers and the like that can exhibit good pick-up properties even after being affixed to a wafer within several hours after grinding.

Claims (8)

It is an adhesive tape for processing a semiconductor wafer having a base material layer and an adhesive layer,
The pressure-sensitive adhesive layer contains a base polymer, an isocyanate-based crosslinking agent, and a urethane acrylate,
The adhesive tape for processing a semiconductor wafer or the like, wherein the urethane acrylate retains the polymerizable catalyst used in producing the urethane acrylate, and the residual amount is 70 ppm or more and 200 ppm or less. The residual amount of the polymerizable catalyst in the urethane acrylate is X wt%, and the residual amount of the crosslinking agent in the pressure-sensitive adhesive layer is Y wt%, and satisfies 150 ≦ Y / X ≦ 2000. Adhesive tape for processing semiconductor wafers.   The pressure-sensitive adhesive tape for processing a semiconductor wafer according to claim 1, wherein the polymerizable catalyst is a tertiary amine catalyst or an organometallic catalyst. The pressure-sensitive adhesive tape for processing a semiconductor wafer or the like according to claim 3, wherein the organometallic catalyst is an organotin catalyst. The pressure-sensitive adhesive tape for processing a semiconductor wafer or the like according to any one of claims 1 to 4, wherein the urethane acrylate has two or more polymerizable functional groups. The pressure-sensitive molecular tape of the urethane acrylate has a weight average molecular weight of 1000 or more and 10,000 or less. The adhesive tape for processing a semiconductor wafer or the like according to any one of claims 1 to 6, wherein the base polymer is a hydroxyl group- or carboxyl group-containing polymer. The pressure-sensitive adhesive tape for processing a semiconductor wafer according to any one of claims 1 to 7, further comprising a photopolymerization initiator.