JP5907472B2 - Adhesive tape for semiconductor wafer processing - Google Patents

Description

  The present invention relates to an adhesive tape for processing a semiconductor wafer.

  Conventionally, various pressure-sensitive adhesive tapes for processing semiconductor wafers (hereinafter referred to as “dicing tapes”) used for dicing processing of semiconductor wafers have been proposed (for example, JP 2009-245989 A).

  In general, in a dicing tape, an adhesive layer is formed on a film substrate, and a semiconductor wafer is fixed by the adhesive layer. In addition, a photocurable resin, a photopolymerization initiator, a crosslinking agent, and the like are usually added to the adhesive layer so that the semiconductor chip can be easily picked up after the dicing of the semiconductor wafer. That is, when light is irradiated to the adhesive layer after dicing, these components are cured, the adhesiveness of the adhesive layer is lowered, and the semiconductor chip can be easily picked up.

JP 2009-245989 A

  By the way, a semiconductor wafer or a semiconductor chip fixed to a dicing tape may be stored before being irradiated with light. The adhesive strength of the dicing tape tends to increase with time. Therefore, if the dicing tape is stored for a long period of time, for example, 14 days, after the semiconductor wafer has been attached to the dicing tape, the adhesive strength of the adhesive layer tends not to decrease even when the adhesive layer is irradiated with light. Therefore, when picking up a semiconductor wafer, the semiconductor wafer may not come off the dicing tape or the semiconductor wafer may be broken.

  An object of the present invention is to provide an adhesive tape for processing a semiconductor wafer, which can pick up the semiconductor wafer satisfactorily even if it is stored for a long time after the semiconductor wafer is attached.

(1)
In the adhesive tape for processing a semiconductor wafer according to the present invention, the adhesive strength when the semiconductor wafer is irradiated with light after being left on the back-ground surface for 14 days after being attached within 1 minute after the back-grinding. Is less than 20 cN / 25 mm. Note that the 14-day standing is performed under conditions of a temperature of 23 ° C. and a humidity of 50% RH.

  In this adhesive tape for processing a semiconductor wafer, the adhesive strength when the semiconductor wafer is left on the back-grinded surface and left for 14 days and then irradiated with light is a predetermined value. Therefore, the semiconductor wafer processing adhesive tape can satisfactorily pick up the semiconductor wafer even if it is stored for a long time after the semiconductor wafer is attached.

(2)
In the adhesive tape for processing a semiconductor wafer described in (1) above, the adhesive strength when the semiconductor wafer is left on the back-grinded surface within 20 minutes after being back-ground is 200 cN / 25 mm. The above is preferable. Note that the standing for 20 minutes is performed under conditions of a temperature of 23 ° C. and a humidity of 50% RH.

  In this adhesive tape for processing a semiconductor wafer, the adhesive force after the semiconductor wafer is attached on the back-ground surface has a predetermined value. Therefore, in this adhesive tape for processing a semiconductor wafer, chip skipping hardly occurs during dicing.

(3)
In the above-mentioned adhesive tape for processing a semiconductor wafer according to (1) or (2), the adhesive strength when the semiconductor wafer is left for 20 minutes after being attached on a mirror surface is preferably 90 cN / 25 mm or more. The “mirror surface” refers to a surface having a surface roughness Rz (measured according to JIS B0601) of 10 nm or less. Further, the standing for 20 minutes is performed under conditions of a temperature of 23 ° C. and a humidity of 50% RH.

  In this adhesive tape for processing a semiconductor wafer, the adhesive force after the semiconductor wafer is attached with a mirror surface has a predetermined value. Therefore, in this adhesive tape for processing a semiconductor wafer, chip skipping hardly occurs during dicing.

(4)
The adhesive tape for processing a semiconductor wafer according to any one of the above (1) to (3) preferably includes a base layer and an adhesive layer. The adhesive layer is formed on the base layer. Moreover, the adhesion layer contains an oligomer having 15 or more functional groups.

  With this adhesive tape for processing a semiconductor wafer, the semiconductor wafer can be well picked up even if it is stored for a long time after the semiconductor wafer is attached.

(5)
In the adhesive tape for processing a semiconductor wafer described in (4) above, the oligomer is preferably urethane acrylate.

  With this adhesive tape for processing a semiconductor wafer, the semiconductor wafer can be well picked up even if it is stored for a long time after the semiconductor wafer is attached.

  The pressure-sensitive adhesive tape for processing a semiconductor wafer according to the present invention can satisfactorily pick up a semiconductor wafer even if it is stored for a long time after the semiconductor wafer is attached.

It is sectional drawing of the dicing tape which concerns on one Embodiment of this invention.

  As shown in FIG. 1, a semiconductor wafer processing pressure-sensitive adhesive tape (hereinafter referred to as “dicing tape”) 100 according to an embodiment of the present invention mainly includes a base layer 200 and a pressure-sensitive adhesive layer 300. Hereinafter, the base layer 200 and the adhesive layer 300 will be described in detail.

<Base layer>
The base layer 200 is mainly made of a material resin and plays a role of supporting the adhesive layer 300. The material resin is formed into a film by a normal film forming method. The material resin is not particularly limited as long as it transmits light (visible light, near infrared light, ultraviolet light), X-ray, electron beam, etc. For example, polyvinyl chloride, polyethylene, polypropylene, polybutene, polybutadiene, polymethyl Polyolefin resins such as pentene, ethylene / vinyl acetate copolymers, ionomers, olefin copolymers such as ethylene / (meth) acrylic acid copolymers, ethylene / (meth) acrylic acid ester copolymers, polyethylene terephthalate, Polyalkylene terephthalate resins such as polybutylene terephthalate, styrene thermoplastic elastomers, olefin thermoplastic elastomers, thermoplastic resins such as polyvinyl isoprene and polycarbonate, and mixtures of these thermoplastic resins are used.

  In particular, it is preferable to use a mixture of polypropylene and an elastomer or a mixture of polyethylene and an elastomer as the material resin. The elastomer is preferably a block copolymer comprising a polystyrene segment represented by the general formula (1) and a vinyl polyisoprene segment represented by the general formula (2).

（式（１）中、ｎは２以上の整数）

(In formula (1), n is an integer of 2 or more)

（式（２）中、ｎは２以上の整数）

(In formula (2), n is an integer of 2 or more)

  The thickness of the base layer 200 is not particularly limited, but is preferably 50 μm or more and 300 μm or less, and more preferably 80 μm or more and 200 μm or less. It is because the workability | operativity in a dicing process is excellent in the thickness of the base layer 200 in this range.

  Although it does not specifically limit as a manufacturing method of the base layer 200, General shaping | molding methods, such as a calendar method and an extrusion molding method, are used. The surface of the base layer 200 is preferably exposed with a functional group that reacts with the material constituting the adhesive layer 300, such as a hydroxyl group or an amino group. In order to improve the adhesion between the base layer 200 and the adhesive layer 300, the surface of the base layer 200 is preferably surface-treated with a corona treatment or an anchor coat.

<Adhesive layer>
The adhesive layer 300 serves to adhere and support a semiconductor wafer or the like in the dicing process. When the adhesive layer 300 is irradiated with light after the dicing process, the adhesive layer 300 can easily peel off a cut piece such as a semiconductor wafer. In addition, in the dicing tape 100 before use, the adhesive layer 300 is usually protected with a release film.

  The adhesive layer 300 is formed on one surface of the base layer 200 (see FIG. 1). The resin solution that is the material of the adhesive layer 300 is usually applied to the base layer 200 by an application method such as die coating, curtain die coating, gravure coating, comma coating, bar coating, or lip coating. Although the thickness of the adhesion layer 300 after drying is not specifically limited, It is preferable that they are 5 micrometers or more and 30 micrometers or less, and it is more preferable that they are 10 micrometers or more and 20 micrometers or less. When the thickness of the pressure-sensitive adhesive layer 300 after drying is 5 μm or more and 30 μm or less, the pressure-sensitive adhesive layer 300 has a good pressure-sensitive adhesive force and has a good peelability after being irradiated with ultraviolet rays or an electron beam. .

  The adhesive layer 300 is mainly composed of a base resin and a curing component that cures the adhesive layer 300. The adhesive layer 300 may contain an antistatic agent and a tackifier as optional components. Hereinafter, each component will be described in detail.

(1) Base resin As the base resin, a known resin used as an adhesive layer component such as an acrylic resin, a silicon resin, or a urethane resin can be used. From the viewpoint of heat resistance and cost, an acrylic resin is used. It is preferable to use it.

(2) Curing component The curing component cures when irradiated with light, for example. As a result of this curing, the base resin is incorporated into the crosslinked structure of the curing component, and as a result, the adhesive strength of the adhesive layer 300 is reduced. As such a curing component, for example, a low molecular weight compound having at least two polymerizable carbon-carbon double bonds that can be three-dimensionally cross-linked by irradiation with energy rays such as ultraviolet rays and electron beams is used. As the curing component, an oligomer having 15 or more functional groups is preferably included.

  Specifically, the curing component is not particularly limited. For example, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate. 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, commercially available oligoester acrylate and the like, and aromatic and aliphatic urethane acrylates are used. Of these, urethane acrylate is preferred.

  Moreover, although it does not specifically limit to a hardening component, It is preferable that 2 or more hardening components from which a weight average molecular weight differs are mixed. This is because if such a curing component is used, the degree of cross-linking of the resin by light irradiation can be controlled to improve the pickup property. In addition, as such a curing component, for example, a mixture of a first curing component and a second curing component having a weight average molecular weight larger than that of the first curing component may be used.

  Furthermore, the curing component may contain a photopolymerization initiator, a crosslinking agent, and the like. The photopolymerization initiator is added to facilitate the initiation of polymerization of the curing component. Examples of photopolymerization initiators include 2,2-dimethoxy-1,2-diphenylethane-1-one, benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldiphenyl sulfide, and tetramethylthiuram. Examples thereof include monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, β-chloranthraquinone and the like.

  The curing component is preferably blended in an amount of 20 to 200 parts by weight with respect to 100 parts by weight of the base resin. By adjusting the compounding amount of the curing component as described above, the pick-up property of the dicing tape 100 becomes suitable.

  Examples of the crosslinking agent include epoxy crosslinking agents, isocyanate crosslinking agents, methylol crosslinking agents, chelating crosslinking agents, aziridine crosslinking agents, melamine crosslinking agents, and polyvalent metal chelating crosslinking agents. Among these, an isocyanate type crosslinking agent is preferable.

  Although it does not specifically limit as an isocyanate type crosslinking agent, For example, the trimer of the terminal isocyanate compound obtained by making the polyisocyanate compound of polyisocyanate, the trimer of a polyisocyanate compound, the polyisocyanate compound and a polyol compound react, or Examples thereof include blocked polyisocyanate compounds in which a terminal isocyanate urethane prepolymer is blocked with phenol, oximes and the like.

  Examples of the polyvalent isocyanate include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4′-diisocyanate, diphenylmethane-2 4,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate and the like. Among these, at least one polyisocyanate selected from the group consisting of 2,4-tolylene diisocyanate, diphenylmethane-4,4'-diisocyanate and hexamethylene diisocyanate is preferable.

  The crosslinking agent is preferably blended in an amount of 5 to 50 parts by weight with respect to 100 parts by weight of the base resin. By adjusting the blending amount of the crosslinking agent as described above, the pick-up property of the dicing tape 100 becomes suitable.

(3) Antistatic agent Although it does not specifically limit as an antistatic agent, Surfactants, such as anionic surfactant, a cationic surfactant, a nonionic surfactant, an amphoteric surfactant, are used, for example. It is done. In addition, as an antistatic agent that does not exhibit temperature dependence, for example, powders such as carbon black, silver, nickel, antimony-doped tin oxide, and tin-doped indium oxide are used.

(4) Tackifier The tackifier is not particularly limited. For example, rosin resin, terpene resin, coumarone resin, phenol resin, styrene resin, aliphatic petroleum resin, aromatic petroleum resin, aliphatic aromatic copolymer Polymerized petroleum resin or the like is used.

<How to use dicing tape>
A known method can be used as a method of using the dicing tape 100. For example, the dicing tape 100 is attached to the back-grinded surface or mirror surface of the semiconductor wafer. The “mirror surface” refers to a surface having a surface roughness Rz (measured according to JIS B0601) of 10 nm or less.

  The semiconductor wafer is fixed with a dicing tape 100 and stored in this state. After storage, the semiconductor device is cut into element pieces with a rotating round blade. After cutting, ultraviolet light or an electron beam is irradiated from the base layer 200 side of the dicing tape 100. After irradiating ultraviolet rays or an electron beam, the dicing tape 100 is radially expanded using a dedicated jig to widen the distance between chips, and then the semiconductor device is pushed up with a needle or the like. The semiconductor device thus pushed up is picked up by suction by a vacuum collet or air tweezers, and then mounted or stored in a tray.

<Effect in this embodiment>
In this dicing tape 100, the adhesive strength when irradiated with light after the semiconductor wafer is pasted on the back-ground surface and left for 14 days is less than 20 cN / 25 mm. Therefore, the dicing tape 100 can satisfactorily pick up the semiconductor wafer even if it is stored for a long time after the semiconductor wafer is attached.

  In the dicing tape 100, the adhesive strength after the semiconductor wafer is bonded on the back-ground surface is 200 cN / 25 mm or more. Therefore, with this dicing tape 100, chip jumping is less likely to occur during dicing.

  In the dicing tape 100, the adhesive strength after the semiconductor wafer is bonded with a mirror surface is 90 cN / 25 mm or more. Therefore, with this dicing tape 100, chip jumping is less likely to occur during dicing.

  With this dicing tape 100, the semiconductor wafer can be picked up satisfactorily even if it is stored for a long time after the semiconductor wafer is attached.

  With this dicing tape 100, the semiconductor wafer can be picked up satisfactorily even if it is stored for a long time after the semiconductor wafer is attached.

  Next, an example according to the dicing tape 100 of the present invention and a comparative example will be described. In addition, this invention is not limited at all by the Example.

(Example 1)
<Production of dicing tape>
As a material resin constituting the base layer 200, 60 parts by weight of polypropylene and 40 parts by weight of a block copolymer composed of a polystyrene segment represented by the general formula (1) and a vinyl polyisoprene segment represented by the general formula (2) Got ready.

（式（１）中、ｎは２以上の整数）

(In formula (1), n is an integer of 2 or more)

（式（２）中、ｎは２以上の整数）

(In formula (2), n is an integer of 2 or more)

  After the materials constituting the base layer 200 were kneaded with a biaxial kneader, the kneaded material was extruded with an extruder to produce a base layer 200 with a thickness of 100 μm.

  As the base resin of the adhesive layer 300, a resin (hereinafter referred to as “base resin A”) comprising 10 parts by weight of the first copolymer and 90 parts by weight of the second copolymer was prepared. As a first copolymer, a copolymer having a weight average molecular weight of 500,000 obtained by copolymerizing 70 parts by weight of butyl acrylate, 25 parts by weight of 2-ethylhexyl acrylate, and 5 parts by weight of vinyl acetate is obtained. Using. The second copolymer is obtained by copolymerizing 50 parts by weight of 2-ethylhexyl acrylate, 10 parts by weight of butyl acrylate, 37 parts by weight of vinyl acetate, and 3 parts by weight of 2-hydroxyethyl methacrylate. A copolymer having a weight average molecular weight of 300,000 was used.

  As a curing component of the adhesive layer 300, 15 functional oligomer urethane acrylate (manufactured by Miwon Specialty Chemical, product number: Miramer SC2152) was prepared in an amount of 140 parts by weight based on 100 parts by weight of the base resin. As a crosslinking agent for the adhesive layer 300, 5 parts by weight of polyisocyanate (manufactured by Nippon Polyurethane Industry Co., Ltd., product number: Coronate L) was prepared with respect to 100 parts by weight of the base resin. As a photopolymerization initiator for the adhesive layer 300, 3 parts by weight of benzyldimethyl ketal (manufactured by Ciba Specialty Chemicals, product number: Irgacure 651) was prepared with respect to 100 parts by weight of the base resin.

  A resin solution in which the base resin, the curing component, the crosslinking agent, and the photopolymerization initiator of the adhesive layer 300 were blended was prepared. This resin solution was bar-coated on the base layer 200 so that the thickness of the pressure-sensitive adhesive layer 300 after drying was 10 μm, and then dried at 80 ° C. for 5 minutes to obtain a desired dicing tape 100.

<Measurement and evaluation of adhesive strength>
Dicing tape 100 was affixed to the mirror surface of the semiconductor wafer. After adhering the semiconductor wafer, the adhesive strength (hereinafter referred to as “adhesive strength A”) of the dicing tape 100 left for 20 minutes at room temperature was measured by a 180 ° peel test.

  Further, the dicing tape 100 was attached to the back-ground surface of the semiconductor wafer within 1 minute after the back-grinding. After the semiconductor wafer was attached, the adhesive strength of the dicing tape 100 to the semiconductor wafer (hereinafter referred to as “adhesive strength B”) when irradiated with light after being left for 14 days was measured by a 180 ° peel test. Further, the adhesive strength of the dicing tape 100 left to stand at room temperature for 20 minutes after the semiconductor wafer was adhered (hereinafter referred to as “adhesive strength C”) was measured by a 180 ° peel test. Note that the standing for 20 minutes and 14 days relating to adhesive strength A, adhesive strength B, and adhesive strength C was performed under conditions of a temperature of 23 ° C. and a humidity of 50% RH.

  The 180 ° peel test is performed using a universal testing machine (manufactured by A & D Co., Ltd., product name: Tensilon) under the conditions of environmental temperature: 23 ° C., environmental pressure: normal pressure, and tensile speed: 300 mm / min. It was broken. And the average value of the obtained adhesive force chart was made into the adhesive force (cN / 25mm) of the adhesion layer 300. FIG.

  As for the adhesive strength A, those having 90 cN / 25 mm or more were evaluated as “◯”, and those having less than 90 cN / 25 mm were evaluated as “X”. Regarding the adhesive strength B, those with less than 20 cN / 25 mm were evaluated as ◯, and those with 20 cN / 25 mm or more were evaluated with ×. Regarding the adhesive strength C, those having 200 cN / 25 mm or more were evaluated as “◯”, and those having less than 200 cN / 25 mm were evaluated as “×”.

  As a result of performing said measurement and evaluation, adhesive force A was 100 cN / 25mm and was evaluation of (circle). The adhesive strength B was 14 cN / 25 mm, and the evaluation was good. The adhesive strength C was 220 cN / 25 mm, and the evaluation was good (see Table 1 below).

<Chip skip test>
The dicing tape 100 was affixed to the mirror surface of a circular semiconductor wafer having a diameter of 5 inches and a thickness of 600 μm. After the dicing tape 100 is attached to the semiconductor wafer, it is allowed to stand at room temperature for 20 minutes, and the semiconductor wafer is diced into a size of 2 mm × 2 mm under the conditions of a blade rotation speed of 40000 rpm, a cutting speed of 70 mm / sec, and a blade height of 90 μm. Was made. After dicing, the number of chips skipped was counted.

  The evaluation was evaluated with ◯ when the number of square chips with 0 chip jumps was 0, and with x when the number of square chips with chip jumps was 1 or more. A triangular chip is produced when the end of the circular semiconductor wafer is diced, but the triangular chip is not counted.

  As a result of the above test, the number of chips skipped was 0, which was evaluated as “Good” (see Table 1 below).

<Pickup test>
The dicing tape 100 was affixed to the back-ground surface of the semiconductor wafer within 1 minute after the back-grinding. After the dicing tape 100 is attached to the semiconductor wafer, it is allowed to stand at room temperature for 20 minutes, and the semiconductor wafer is diced to a size of 10 mm × 10 mm under the conditions of a blade rotation speed of 40000 rpm, a cutting speed of 70 mm / sec, and a blade height of 90 μm. Was made. After dicing, chips were picked up under the conditions of 4 needles and a needle interval of 8 mm, and the success rate of picking up was measured.

  A case where the pickup success rate was 98% or more was evaluated as ◯, and a case where the pickup success rate was less than 98% was evaluated as ×.

  As a result of the above test, the pickup success rate was 100%, and the evaluation was good (see Table 1 below).

(Example 2)
A dicing tape 100 was obtained in the same manner as in Example 1 except for the following. As the base resin of the adhesive layer 300, an acrylic resin (hereinafter referred to as “base resin B”) containing an amide group and having a glass transition temperature of −15 ° C. was prepared. As a curing component of the adhesive layer 300, 15 functional oligomer urethane acrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., product number: UA-53H) was prepared in an amount of 140 parts by weight based on 100 parts by weight of the base resin. 8 parts by weight of the crosslinking agent for the adhesive layer 300 was prepared with respect to 100 parts by weight of the base resin.

  About this dicing tape 100, it carried out similarly to Example 1, and performed the measurement and evaluation of adhesive force, the chip | tip jump test, and the pick-up test.

  As a result, the adhesive strength A was 125 cN / 25 mm, and the evaluation was good. The adhesive strength B was 15 cN / 25 mm, and the evaluation was good. The adhesive strength C was 240 cN / 25 mm, and the evaluation was good. The number of chips skipped was 0, which was evaluated as “Good”. The pickup success rate was 99%, which was evaluated as “Good” (see Table 1 below).

(Comparative Example 1)
A dicing tape was obtained in the same manner as Example 1 except for the following. 30 parts by weight of a bifunctional urethane acrylate having a weight average molecular weight of 11,000 and a pentafunctional acrylate monomer having a weight average molecular weight of 500 were prepared as a curing component of the adhesive layer 300 with respect to 100 parts by weight of the base resin. 7 parts by weight of the crosslinking agent for the adhesive layer 300 was prepared with respect to 100 parts by weight of the base resin.

  About this dicing tape, it carried out similarly to Example 1, and measured and evaluated adhesive force, the chip | tip jump test, and the pick-up test.

  As a result, the adhesive strength A was 300 cN / 25 mm, and the evaluation was good. The adhesive strength B was 273 cN / 25 mm, and was evaluated as x. The adhesive strength C was 580 cN / 25 mm, and the evaluation was good. The number of chips skipped was 0, which was evaluated as “Good”. The pickup success rate was 0%, which was evaluated as x (see Table 1 below).

(Comparative Example 2)
A dicing tape was obtained in the same manner as Example 1 except for the following. As a curing component of the adhesive layer 300, 120 parts by weight of bifunctional urethane acrylate having a weight average molecular weight of 11000 was prepared with respect to 100 parts by weight of the base resin. 22 parts by weight of the crosslinking agent for the adhesive layer 300 was prepared with respect to 100 parts by weight of the base resin.

  About this dicing tape, it carried out similarly to Example 1, and measured and evaluated adhesive force, the chip | tip jump test, and the pick-up test.

  As a result, the adhesive strength A was 150 cN / 25 mm, and the evaluation was good. The adhesive strength B was 107 cN / 25 mm, which was evaluated as x. The adhesive strength C was 275 cN / 25 mm, and the evaluation was good. The number of chips skipped was 0, which was evaluated as “Good”. The pickup success rate was 4%, which was evaluated as x (see Table 1 below).

(Comparative Example 3)
A dicing tape was obtained in the same manner as Example 1 except for the following. As a curing component of the adhesive layer 300, 120 parts by weight of bifunctional urethane acrylate having a weight average molecular weight of 11000 was prepared with respect to 100 parts by weight of the base resin. 45 parts by weight of the crosslinking agent for the adhesive layer 300 was prepared with respect to 100 parts by weight of the base resin.

  About this dicing tape, it carried out similarly to Example 1, and measured and evaluated adhesive force, the chip | tip jump test, and the pick-up test.

  As a result, the adhesive strength A was 40 cN / 25 mm, which was evaluated as x. The adhesive strength B was 20 cN / 25 mm, and was evaluated as x. The adhesive strength C was 65 cN / 25 mm, which was evaluated as x. The number of chips skipped was 72, which was evaluated as x. The pickup success rate was 98%, which was evaluated as “Good” (see Table 1 below).

(Comparative Example 4)
A dicing tape was obtained in the same manner as Example 1 except for the following. Base resin B was prepared as a base resin for the adhesive layer 300. As a curing component of the adhesive layer 300, 115 parts by weight of 9-functional oligomer urethane acrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., product number: UA-32P) was prepared with respect to 100 parts by weight of the base resin. As a crosslinking agent for the adhesive layer 300, 13 parts by weight of an isocyanate-based acryloyl group-containing monomer was prepared with respect to 100 parts by weight of the base resin.

  About this dicing tape, it carried out similarly to Example 1, and measured and evaluated adhesive force, the chip | tip jump test, and the pick-up test.

  As a result, the adhesive strength A was 300 cN / 25 mm, and the evaluation was good. The adhesive strength B was 85 cN / 25 mm, which was evaluated as x. The adhesive strength C was 630 cN / 25 mm, and the evaluation was good. The number of chips skipped was 0, which was evaluated as “Good”. The pickup success rate was 7%, which was evaluated as x (see Table 1 below).

(Comparative Example 5)
A dicing tape was obtained in the same manner as Example 1 except for the following. As a material constituting the base layer 200, 70 parts by weight of a vinyl chloride resin and 30 parts by weight of dioctyl phthalate (DOP) as a plasticizer were prepared. As a curing component of the adhesive layer 300, 95 parts by weight of bifunctional urethane acrylate having a weight average molecular weight of 11000 was prepared with respect to 100 parts by weight of the base resin. 11 parts by weight of the crosslinking agent for the adhesive layer 300 was prepared with respect to 100 parts by weight of the base resin.

  About this dicing tape, it carried out similarly to Example 1, and measured and evaluated adhesive force, the chip | tip jump test, and the pick-up test.

  As a result, the adhesive strength A was 85 cN / 25 mm, which was evaluated as x. The adhesive strength B was 86 cN / 25 mm, which was evaluated as x. The adhesive strength C was 155 cN / 25 mm, which was evaluated as x. The number of chips skipped was 6 and was evaluated as x. The pickup success rate was 9%, which was evaluated as x (see Table 1 below).

  In the dicing tape 100 according to Examples 1 and 2, all evaluations of the adhesive strength evaluation, the chip jump test, and the pickup test were “good”. On the other hand, in the dicing tapes according to Comparative Examples 1 to 5, at least two evaluations among the evaluation of adhesive strength, the chip jump test, and the pickup test were x.

100 Adhesive tape for semiconductor wafer processing (dicing tape)
200 base layer 300 adhesive layer

Claims (4)

Including a base layer and an adhesive layer formed on the base layer,
The adhesive layer is a mixed resin of a copolymer of butyl acrylate, 2-ethylhexyl acrylate and vinyl acetate and a copolymer of butyl acrylate, 2-ethylhexyl acrylate, vinyl acetate and 2-hydroxyethyl methacrylate. Or 100 parts by weight of a base resin, which is an acrylic resin containing an amide group, 5 parts by weight or more and 8 parts by weight or less of a crosslinking agent, and 140 parts by weight or more of a urethane acrylate oligomer having 15 or more functional groups as a curing component. Parts by weight or less ,
Within 1 minute after back grinding, the adhesive strength of the adhesive layer when irradiated with light after being left for 14 days after being attached to the adhesive layer on the back-ground surface is 20 cN / A semiconductor wafer processing adhesive tape that is less than 25 mm.   2. The semiconductor wafer processing according to claim 1, wherein the adhesive strength when the semiconductor wafer is left for 20 minutes after being attached on the back-ground surface within 1 minute after the back-grinding is 200 cN / 25 mm or more. Adhesive tape.   The pressure-sensitive adhesive tape for processing a semiconductor wafer according to claim 1 or 2, wherein the pressure-sensitive adhesive force when the semiconductor wafer is left on the mirror surface for 20 minutes is 90 cN / 25 mm or more. 2,2-dimethoxy-1,2-diphenylethane-1-one, benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyro The pressure-sensitive adhesive tape for semiconductor wafer processing according to any one of claims 1 to 3 , comprising a photopolymerization initiator selected from the group consisting of nitrile, dibenzyl, diacetyl, and β-chloranthraquinone.

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