JP2013149873A - Gas supply head and substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a gas supply head which achieves high uniformity of gas supply and inhibits unnecessary deposits from occurring in an unintentional area.SOLUTION: A gas supply head includes: a first gas hole line 102a formed by multiple gas discharge holes; a second gas hole line 102b which is arranged in parallel with the first gas hole line 102a on the same surface as the first gas hole line 102a and is formed by other multiple gas holes; one or more gas diffusion chambers 101a communicating only with the gas discharge holes forming the first gas hole line 102a through gas passages; one or more gas diffusion chambers 101b communicating only with the gas discharge holes forming the second gas hole line 102b through gas passages. Different kinds of gases are respectively supplied to the first gas diffusion chamber 101a and the second gas diffusion chamber 101b.

Description

  The present invention relates to a gas supply head and a substrate processing apparatus.

  In recent years, as higher functions are required for FPD (Flat Panel Display) such as LCD (Liquid Crystal Display) and organic EL (Organic Electro-Luminescence), semiconductors, solar cells, etc., they are used for manufacturing them. Higher accuracy is also required for process technologies such as film formation and etching on a substrate. In particular, in the film forming process, attention has been paid to a film forming technique based on ALD (Atomic layer deposition) which can control film formation with high accuracy at the atomic layer level along with MO-CVD.

  In a film forming apparatus such as ALD or MO-CVD, for example, a precursor gas and an oxidant gas are separately introduced into a processing space and reacted in the processing space. Thus, depending on the film formation process, it is necessary to individually introduce a plurality of types of gases that contribute to the film formation process into the processing space.

  Known examples in which a plurality of types of gases are individually introduced into the processing space as described above are described in Patent Documents 1 and 2, for example.

JP 2001-77109 A JP-A-62-149881

  However, when a plurality of types of gases are individually introduced into the processing space, unnecessary deposits may be deposited in an unintended region, for example, in the vicinity of a gas supply head (gas nozzle). In particular, when there is a gap in the gas supply head, gas stays easily in the gap, and there is a possibility that the gas is mixed and reacts to generate deposits.

  In order to suppress the accumulation of such unnecessary deposits, if the positions of the gas discharge holes of the gas supply heads corresponding to different gas types are separated from each other, the gap between the gas discharge holes becomes wider, so that the gas supply in the processing space There was a situation that the uniformity deteriorated.

  The present invention provides a gas supply head and a substrate processing apparatus using the gas supply head that can suppress the occurrence of unnecessary deposits in unintended regions while suppressing deterioration in uniformity of gas supply.

  A gas supply head according to a first aspect of the present invention is a gas supply head that supplies a plurality of types of gases to a processing space for processing a substrate with a plurality of types of gases, and includes a plurality of gas discharge holes. First gas hole array, and a second gas hole array which is arranged in parallel with the first gas hole array on the same plane as the first gas hole array and is composed of a plurality of other gas discharge holes. A first gas diffusion means constituted by one or two or more gas diffusion chambers in which only gas discharge holes constituting the first gas hole row communicate with each other through a gas flow path; Second gas diffusing means composed of one or two or more gas diffusion chambers, in which only the gas discharge holes constituting the gas hole row communicate with each other via the gas flow path, and the first gas diffusion And different gas types are supplied to the second gas diffusion means. It is.

  A gas supply head according to a second aspect of the present invention is a gas supply head that supplies a plurality of types of gases to a processing space for processing a substrate with a plurality of types of gases, and includes a plurality of gas discharge holes. First gas hole array, and a second gas hole array which is arranged in parallel with the first gas hole array on the same plane as the first gas hole array and is composed of a plurality of other gas discharge holes. A first gas diffusion means constituted by one or two or more gas diffusion chambers in which only gas discharge holes constituting the first gas hole row communicate with each other through a gas flow path; A second gas diffusion means configured by one or more gas diffusion chambers in which only the gas discharge holes constituting the gas hole array communicate with each other through the gas flow path; the first gas hole array; In the surface different from the surface on which the two gas hole arrays are arranged, the first And a gas supply pipe for supplying gas to each of the one or more gas diffusion chamber which constitutes one or more gas diffusion chamber and the second gas diffusion means constituting the gas diffusion means.

  A substrate processing apparatus according to a third aspect of the present invention is a substrate processing apparatus including a gas supply mechanism that supplies the plurality of types of gas to a processing space for processing the substrate with a plurality of types of gas, The gas supply mechanism includes a first gas hole array composed of a plurality of gas discharge holes, and is arranged in parallel with the first gas hole array on the same plane as the first gas hole array, Only the second gas hole array composed of the gas discharge holes and the gas discharge holes constituting the first gas hole array are each composed of one or two or more gas diffusion chambers communicating with each other through the gas flow path. A first gas diffusion means and a second gas diffusion composed of one or more gas diffusion chambers in which only the gas discharge holes constituting the second gas hole row communicate with each other through a gas flow path. Means, the first gas diffusing means and the second gas diffusing means. Different types of gases, each having a gas supply pipe for supplying.

  According to the present invention, it is possible to provide a gas supply head capable of suppressing the occurrence of unnecessary deposits in unintended regions while suppressing deterioration in uniformity of gas supply, and a substrate processing apparatus using the gas supply head.

Horizontal sectional view showing an example of a substrate processing apparatus according to an embodiment of the present invention Sectional view along the line II-II in FIG. (A) A figure is a horizontal sectional view showing an example of a gas supply head with which a substrate processing apparatus concerning one embodiment is provided, (B) A figure is a sectional view which meets a BB line in (A) figure. The perspective view which showed through the inside of an example of the gas supply head with which the substrate processing apparatus which concerns on one Embodiment is provided A longitudinal sectional view showing a modification of a substrate processing apparatus according to an embodiment of the present invention (A) The figure is sectional drawing which shows the 1st modification of a gas supply head, (B) A figure is the side view seen from the arrow 6B in (A) figure, (C) A figure is one of arrangement | positioning of a gas hole row | line | column. Side view showing a modification Horizontal sectional view showing a second modification of the gas supply head (A) The figure is sectional drawing which shows the 3rd modification of a gas supply head, (B) A figure is the side view seen from the arrow 8B in (A) figure The perspective view of the gas supply head which concerns on a 3rd modification (A) The figure-(D) figure is a side view which shows the mode of the gas discharge from the gas supply head shown to FIG. 3 (A), FIG. 3 (B), and FIG. Sectional drawing which shows the mode of the gas discharge from the gas supply head shown to FIG. 3 (A), FIG.3 (B), and FIG. (A) The figure-(D) figure are side views which show the mode of the gas discharge from the gas supply head which concerns on a 3rd modification. Sectional drawing which shows the mode of the gas discharge from the gas supply head which concerns on a 3rd modification FIGS. 4A to 4D are cross-sectional views showing further modifications of the gas supply head according to the third modification.

  Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. In this description, the same parts are denoted by the same reference symbols throughout the drawings to be referred to.

  FIG. 1 is a horizontal sectional view showing an example of a substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along line II-II in FIG. In one embodiment, a film forming apparatus that performs a film forming process on a glass substrate is illustrated as an example of a substrate processing apparatus using a glass substrate used for manufacturing an FPD or a solar cell module as an example of an object to be processed.

  As shown in FIGS. 1 and 2, the substrate processing apparatus 1 includes a processing chamber 3 that forms a processing space 2 for processing an object G to be processed. The processing chamber 3 includes a stage 4 on which the object to be processed G is placed, and a cover 5 that covers the object to be processed G placed on the stage 4. The stage 4 and the cover 5 are configured to be movable relative to the height direction. When the stage 4 and the cover 5 are shifted in the height direction, for example, the cover 5 is lifted and the cover 5 is separated from the stage 4, the placement surface on which the workpiece G provided on the stage 4 is placed is exposed to the outside. Exposed. Thereby, the to-be-processed object G can be carried in, placed on, and carried out on the placement surface. In FIG. 1 and FIG. 2, a lifter that raises and lowers the object G to be processed is omitted from the placement surface.

  On the other hand, when the cover 5 is lowered while the object G is placed on the placement surface and the cover 5 is brought into close contact with the stage 4, the processing space 2 sealed from the outside is formed between the stage 4 and the cover 5. Formed between. Thereby, the process to the to-be-processed object G in the processing space 2 is attained. In this example, an example in which the cover 5 is raised and lowered with respect to the stage 4 is described. However, the stage 4 can be configured to be raised and lowered with respect to the cover 5. It is of course possible to configure both of them to rise and fall.

  Inside the processing space 2, a gas supply head 6 that constitutes a part of a gas supply mechanism that supplies gas used for processing to the processing space 2 and an exhaust groove 7 are provided. The exhaust groove 7 is connected to the exhaust device 7a. The exhaust device 7 a exhausts the inside of the processing space 2. The exhaust device 7 a exhausts the inside of the processing space 2, so that the pressure in the processing space 2 is adjusted and the atmosphere in the processing space 2 is replaced (purged).

  In this example, the gas supply head 6 and the exhaust groove 7 are linear, and the linear gas supply head 6 and the exhaust groove 7 are located at positions facing each other, for example, a rectangular stage having four sides. 4 are arranged along two opposite sides. The placement surface described above is provided so as to be sandwiched between the linear gas supply head 6 and the linear exhaust groove 7. The linear gas supply head 6 and the linear exhaust groove 7 are arranged at positions facing each other, and are described above so as to be sandwiched between the linear gas supply head 6 and the linear exhaust groove 7. By providing the mounting surface, a gas flow F that becomes a laminar flow in one direction from the gas supply head 6 toward the exhaust groove 7 above the processing surface of the target object G placed on the mounting surface. Can be formed. In this example, a desired desired process, that is, a uniform film forming process in this example, is performed on the object G to be processed by a gas that is made laminar flow in one direction.

The gas supply head 6 of this example is connected to a gas supply system 9 via a gas supply pipe 8 formed inside the stage 4, for example. In this example, the gas supply head 6 and the gas supply pipe 8 constitute a gas supply mechanism. The gas supply system 9 supplies, for example, a gas used for processing to the gas supply head 6. The gas supply system 9 of this example includes a first gas supply system 9a for supplying a first gas to the gas supply head 6 via a first gas supply pipe 8a, and a second gas supply pipe 8b. And a second gas supply system 9b for supplying a second gas. For example, if a specific example of the first gas and the second gas exemplifies alumina (Al ₂ O ₃ ) film formation, the first gas is trimethylaluminum ((CH ₃ )) as a precursor. ₃ Al: TMA) gas and the second gas are water vapor (H ₂ O) gas which is an oxidant. Of course, the first gas and the second gas are not limited to TMA gas and water vapor gas, and can be changed according to the type of film to be formed. Further, the gas is not limited to two types, and can be changed to three or more types according to the type of film to be formed.

  Control of each unit of the substrate processing apparatus 1 is performed by the control unit 12. The control unit 12 includes a process controller 12a composed of, for example, a microprocessor (computer). Connected to the process controller 12a is a user interface 12b composed of a keyboard for performing command input operations and the like, and a display for visualizing and displaying the operating status of the substrate processing apparatus 1 in order for the operator to manage the substrate processing apparatus 1. Has been. A storage unit 12c is connected to the process controller 12a. The storage unit 12c is used for causing each unit of the substrate processing apparatus 1 to execute processes according to a control program for realizing various processes executed by the substrate processing apparatus 1 under the control of the process controller 12a and processing conditions. Recipe is stored. For example, the recipe is stored in a storage medium in the storage unit 12c. The storage medium may be a hard disk or a semiconductor memory, or a portable medium such as a CD-ROM, DVD, or flash memory. Further, the recipe may be appropriately transmitted from another device via a dedicated line, for example. The recipe is read from the storage unit 12c according to an instruction from the user interface 12b as necessary, and the process controller 12a executes processing according to the read recipe, so that the substrate processing apparatus 1 Under the control of the process controller 12a, desired processing and control are performed.

  Hereinafter, the gas supply head 6 of this example will be described in more detail.

  3A is a horizontal cross-sectional view showing an example of a gas supply head provided in the substrate processing apparatus according to the embodiment, and FIG. 3B is a cross-sectional view taken along line BB in FIG. 3A. 4 is a perspective view illustrating the inside of an example of a gas supply head provided in the substrate processing apparatus according to the embodiment.

  As shown in FIGS. 3A, 3B, and 4, the gas supply head 6 includes a main body 100, a gas diffusion chamber 101 that is formed inside the main body 100 and includes a linear space, A gas hole array 102 is provided corresponding to the gas diffusion chamber 101, and includes a plurality of gas discharge holes. In this example, the gas diffusion chamber 101 is provided with a first gas diffusion chamber 101a to which a first gas is supplied and a second gas diffusion chamber 101b to which a second gas is supplied. The first gas and the second gas are supplied and diffused through the first gas supply pipe 8a and the second gas supply pipe 8b. The first gas diffused into the first gas diffusion chamber 101a is from the first gas hole row 102a, and the second gas diffused into the second gas diffusion chamber 101b is the second gas hole row 102b. Are discharged toward the processing space 2, respectively. The first gas diffusion chamber 101a and the second gas diffusion chamber 101b are integrally formed with each other inside the main body 100. Similarly, the first gas hole row 102a and the second gas hole row 102b are also formed as follows. The main body 100 is integrally formed with each other.

  In this manner, by forming the first gas diffusion chamber 101a, the second gas diffusion chamber 101b, the first gas hole row 102a, and the second gas hole row 102b integrally in the main body 100, The situation that unnecessary deposits accumulate on the gas supply head 6 can be solved. For example, the first gas diffusion chamber 101a and the first gas hole row 102a are formed of a first member, the second gas diffusion chamber 101b and the second gas hole row 102b are formed of a second member, When the gas supply head is configured by stacking the first and second members together, there is a possibility that deposits are deposited in a minute gap between the first member and the second member. However, as in this example, the first gas diffusion chamber 101a, the second gas diffusion chamber 101b, the first gas hole row 102a, and the second gas hole row 102b are integrally formed inside the main body 100. By doing so, there can be obtained an advantage that a minute gap can be eliminated from the gas supply head 6 and the possibility of deposits being deposited in the minute gap can be eliminated.

  Further, the first gas hole row 102 a and the second gas hole row 102 b are arranged in the main body 100 so as to be close to the height direction Z. In this example, the first gas hole row 102a is arranged in the upper stage, and the second gas hole row 102b is arranged in the lower stage. The first gas hole row 102a and the second gas hole row 102b extend in the plane direction X from the first gas diffusion chamber 101a and the second gas diffusion chamber 101b, respectively, and pass through the gas discharge surface 103 of the main body 100. It is exposed to the processing space 2 side. Thereby, the opening of the first gas hole row 102a and the opening of the second gas hole row 102b are, for example, in a plane direction Y orthogonal to the plane direction X on one gas discharge surface 103 of the main body 100. Are arranged in parallel with each other.

  As described above, according to the gas supply head 6 of the present example, the first gas hole row 102a and the second gas hole row 102b are integrally formed inside the main body 100 in the gas supply head 6, thereby The first gas hole row 102a and the second gas hole row 102b can be arranged close to each other in the height direction Z. The first gas hole row 102a and the second gas hole row 102b can be arranged close to each other in the height direction Z, so that the first gas hole row 102a and the second gas hole row 102b can be arranged at a narrow pitch with respect to the processing space 2 as compared with the case where they are arranged apart from each other. Since the gas discharge holes can be arranged, it is possible to supply a uniform gas, thereby obtaining an advantage that a highly uniform film can be formed.

  Furthermore, the arrangement pitch P1 of the first gas hole row 102a and the arrangement pitch P2 of the second gas hole row 102b in this example are the same pitch P (P1 = P2 = P). And they are arranged offset by “P / 2” from each other. When the arrangement pitch P1 of the first gas hole row 102a and the arrangement pitch P2 of the second gas hole row 102b are set to the same pitch P as described above, for example, in the horizontal direction X at each part in the horizontal direction Y, for example. The gas discharge flow rates of the first gas hole row 102a and the second gas hole row 102b can be made equal to each other, and more uniform gas discharge into the processing space 2 can be performed. Further, the first gas hole row 102a and the second gas hole row 102b are arranged so as to be offset from each other by “P / 2”, whereby the first gas and the second gas are supplied to the gas supply head. It is possible to avoid mixing and reacting immediately after discharge from 6 and to mix the first gas and the second gas evenly in the processing space 2.

  As described above, according to the gas supply head 6 provided in the substrate processing apparatus 1 according to the embodiment, a minute gap can be eliminated from the gas supply head 6, and thus unnecessary deposits are deposited in the minute gap. Can be solved.

  Further, in the gas supply head 6, the first gas hole row 102 a and the second gas hole row 102 b are integrally formed inside the main body 100, whereby the first gas hole row 102 a and the second gas hole row 102 b are formed. 102b can be arranged close to each other in the height direction Z, and the gas discharge holes can be arranged at a narrow pitch with respect to the processing space 2, so that uniform gas supply is possible, thereby achieving high uniformity. The advantage that a film becomes possible can be obtained.

  Furthermore, by setting the arrangement pitch of the first gas hole row 102a and the second gas hole row 102b to the same pitch P, it is possible to discharge gas more uniformly into the processing space 2. Further, the first gas hole row 102a and the second gas hole row 102b adjacent to each other in the upper and lower directions are arranged alternately and evenly by “P / 2”, so that the interior of the processing space 2 can be obtained. In this case, the first gas and the second gas can be prevented from being mixed and reacted immediately after being discharged from the gas supply head 6, and the first gas and the second gas can be mixed evenly. be able to.

  Next, a modification of the substrate processing apparatus according to the embodiment and the gas supply head included in the substrate processing apparatus according to the embodiment will be described.

(Substrate processing equipment: a variation)
FIG. 5 is a longitudinal sectional view showing a modification of the substrate processing apparatus according to one embodiment of the present invention.

  The substrate processing apparatus 1a according to the modification shown in FIG. 5 is different from the substrate processing apparatus 1 shown in FIG. 1 in that a plurality of processing chambers 3 are provided. Thus, the processing chamber 3 may be single or plural as in the present modification.

  Moreover, in this modification, the external chamber 20 which accommodates the some process chamber 3 is provided. The external chamber 20 is provided with an opening 21 that communicates the inside and the outside of the external chamber 20, and a gate valve 22 is connected to the opening 21. By opening the gate valve 22, the inside and outside of the external chamber 20 are communicated with each other, and the workpiece G can be loaded and unloaded. Further, an exhaust port 23 is provided at the bottom of the external chamber 20, for example, and an exhaust device 24 is connected to the exhaust port 23. When the exhaust device 24 is operated in a state where the gate valve 22 is closed and the inside of the external chamber 20 is hermetically sealed from the outside, the pressure inside the external chamber 20 can be lowered to a predetermined degree of vacuum. Thereby, for example, when the film forming process is performed in a reduced pressure state inside the plurality of processing chambers 3, the difference between the pressure inside the external chamber 20 and the pressure inside the plurality of processing chambers 3 is reduced or equal. For example, a large pressure is not applied to the stage 4 or the cover 5, and deformation such as minute bending or distortion of the stage 4 or the cover 5 can be suppressed. The advantage that a highly accurate film forming process can be performed can be obtained.

  Further, since it is possible to suppress a large pressure from being applied to the stage 4 and the cover 5, the strength of the stage 4 and the cover 5 can be suppressed to a certain extent. For this reason, in the substrate processing apparatus 1a, the advantage that the manufacturing cost per to-be-processed object G can also be suppressed low can also be acquired.

  When providing a plurality of processing chambers 3, the gas supply head 6 is preferably provided in each of the plurality of processing chambers 3.

(Gas supply head: first modification)
FIG. 6A is a cross-sectional view showing a first modification of the gas supply head, and FIG. 6B is a side view seen from the arrow 6B in FIG. 6A. FIG. 6C is a side view showing a modification of the arrangement of the gas hole arrays.

  The gas supply head 6a according to the first modification shown in FIGS. 6A and 6B is different from the gas supply head 6 shown in FIGS. 3A, 3B, and 4. However, the third gas diffusion chamber 101c and the third gas hole row 102c are further provided. As described in the above embodiment, the gas is not limited to two types, and can be changed to three or more types according to the type of film to be formed. In this example, a film is formed using three types of gases.

As an example of forming a film using three kinds of gases, for example, a silicon oxynitride film can be given. In this case, the first gas is dichlorosilane (SiH ₂ Cl ₂ : DCS) gas as the silicon source gas that is the precursor, the second gas is water vapor (H ₂ O) gas that is the oxidant, the third gas Examples of the gas include ammonia (NH ₃ ) gas which is a nitriding agent.

  When three or more gas hole rows 102a to 102c are provided as described above, all of the three or more gas hole rows 102a to 102c can discharge different gases.

  In this case, as the arrangement of the gas hole arrays 102a to 102c, as shown in FIG. 6B, the arrangement pitches P1 to P3 of the gas hole arrays 102a to 102c are set to “P1 = P2 = P3 = P”, P / 3 ”may be offset and arranged, and as shown in FIG. 6C, the arrangement pitches P1 to P3 of the gas hole arrays 102a to 102c are set to“ P1 = P2 = P3 = P ”. Alternatively, they may be offset by “P / 2” from each other.

(Gas supply head: second modification)
FIG. 7 is a horizontal sectional view showing a second modification of the gas supply head.

  The gas supply head 6b according to the second modification shown in FIG. 7 differs from the gas supply head 6 shown in FIGS. 3A, 3B, and 4 in the first gas diffusion chamber. 101a and the second gas diffusion chamber 101b are divided into a plurality of first gas diffusion chambers 101a1 to 101a4 and a plurality of second gas diffusion chambers 101b1 to 101b4. In this example, along the horizontal direction Y, the first gas diffusion chamber 101a and the second gas diffusion chamber 101b include a plurality of first gas diffusion chambers 101a1 to 101a4 and a plurality of second gas diffusion chambers 101b1 to 101b1. 101b4.

  A first gas supply pipe 8a is connected to each of the plurality of first gas diffusion chambers 101a1 to 101a4, and the first gas is supplied from the first gas supply system 9a. Similarly, a second gas supply pipe 8b is connected to each of the plurality of second gas diffusion chambers 101b1 to 101b4, and the second gas is supplied from the second gas supply system 9b.

  From each of the plurality of first gas diffusion chambers 101a1 to 101a4, the first gas is discharged into the processing space 2 via the first gas hole array 102a, and each of the plurality of second gas diffusion chambers 101b1 to 101b4. The second gas is discharged into the processing space 2 through the second gas hole row 102b.

  In the gas supply head 6b according to the second modification as described above, the first gas diffusion chamber 101a and the second gas diffusion chamber 101b along the horizontal direction Y include a plurality of first gas diffusion chambers. 101a1 to 101a4 and a plurality of second gas diffusion chambers 101b1 to 101b4 are divided to suppress the length along the horizontal direction Y. By providing this configuration, for example, when the length La along the horizontal direction Y of the first gas diffusion chamber 101a and the length Lb along the horizontal direction Y of the second gas diffusion chamber 101b are increased. For example, when the gas diffusion chamber becomes longer than 1 m, the first gas diffusion chamber 101a and the second gas diffusion chamber 101b are respectively divided, and the length along the horizontal direction Y is suppressed. The pressure gradient generated in the length direction along the horizontal direction Y can be reduced, the non-uniformity of the discharge gas flow rate caused by the different locations in the gas diffusion chamber can be improved, and the gas can be sufficiently diffused. The discharge gas flow rate from the gas hole row 102a and the second gas hole row 102b can be made uniform. For this reason, it is possible to obtain an advantage that one side of the object to be processed G is advantageous for application to a film forming process of a large substrate of 1 m or more, for example.

  Further, even when the first gas diffusion chamber 101a and the second gas diffusion chamber 101b are respectively divided, the plurality of first gas diffusion chambers 101a1 to 101a4, the plurality of second gas diffusion chambers 101b1 to 101b4, By offsetting each other, the arrangement pitch of the first gas hole row 102a and the arrangement pitch of the second gas hole row 102b can be kept constant. For this reason, it is possible to obtain an advantage that a uniform gas can be discharged into the processing space 2. Similarly to the above-described embodiment, the arrangement pitch P1 of the first gas hole row 102a and the arrangement pitch P2 of the second gas hole row 102b are set to “P1 = P2 = P”, so that the one side However, for example, gas can be supplied uniformly from the upper and lower stages to a large substrate of 1 m or more.

(Third Modification)
8A is a cross-sectional view showing a third modification of the gas supply head, FIG. 8B is a side view seen from the arrow 8B in FIG. 8A, and FIG. 9 is a third modification. It is a perspective view of the gas supply head which concerns.

  The gas supply head 6c according to the third modification shown in FIGS. 8A, 8B, and 9 is replaced with the gas supply head shown in FIGS. 3A, 3B, and 4. 6 is that the gas discharge surface 103 further includes a groove 104a for connecting the first gas hole row 102a to each other and a groove 104b for connecting the second gas hole row 102b to each other. . In this example, the cross section along the horizontal direction X of the groove 104a and the groove 104b is a “V-shape” formed of a straight line.

  10 (A) to 10 (D) are side views showing the state of gas discharge from the gas supply head 6 shown in FIGS. 3 (A), 3 (B), and 4, and FIG. It is sectional drawing which shows the mode of discharge.

  12 (A) to 12 (D) are side views showing the state of gas discharge from the gas supply head 6c shown in FIGS. 8 (A), 8 (B), and 9, and FIG. It is sectional drawing which shows the mode of the gas discharge.

  As shown in FIGS. 10 (A) to 10 (D) and FIG. 11, in the gas supply head 6 shown in FIGS. 3 (A), 3 (B), and 4, the gas hole array 102a (or The gas discharged along the horizontal direction X from 102b) diffuses into the processing space 2 while expanding concentrically, for example.

  On the other hand, as shown in FIGS. 12A to 12D and FIG. 13, in the gas supply head 6c according to the third modification, the gas discharged along the horizontal direction X is a groove. In order to hit the side surface of 104a (or 104b), the inside of the groove 104a (or 104b) is diffused while expanding along the horizontal direction Y. Then, inside the groove 104a (or 104b), it is mixed with the gas discharged from the adjacent gas discharge holes to form a thin plate-like laminar flow from the groove 104a (or 104b) to the processing space 2. It spreads inside.

  As described above, in the third modification, the gas discharge surface 103 is provided with the grooves 104a that connect the first gas hole arrays 102a and the grooves 104b that connect the second gas hole arrays 102b to each other. The gas can be discharged as a thin plate-like laminar flow.

  That is, according to the third modification, a laminar flow having a thin laminar thickness t1 is formed as compared with the gas supply head 6 shown in FIGS. 3 (A), 3 (B), and 4. It becomes easy to do. For this reason, it is possible to further suppress the generation of deposits at unnecessary locations such as the gas discharge surface where the gas hole row is arranged in the gas supply head 6c, and to further improve the uniformity of gas supply. Benefits can be gained.

  Note that the third modification does not deny the gas supply head 6 shown in FIGS. 3A, 3B, and 4, but the reactivity differs depending on the type of gas. The gas supply head 6 shown in (A), FIG. 3 (B), and FIG. 4 may be more suitable. Therefore, whether to select the gas supply head 6c according to the third modification or the gas supply head 6 shown in FIGS. 3A, 3B, and 4 depends on, for example, the gas to be used. What is necessary is just to be decided suitably according to the kind of.

  FIGS. 14A to 14D are cross-sectional views showing further modifications of the gas supply head according to the third modification.

  In FIG. 8, the cross section along the horizontal direction X of the groove 104a and the groove 104b is “V-shaped” configured by a straight line, but as shown in FIG. The section of 104b along the horizontal direction X may be stepped, for example.

  Further, as shown in FIGS. 14B and 14C, the cross section along the horizontal direction X of the groove 104a and the groove 104b may have a curved surface, for example. In the case of having a curved surface, as shown in FIG. 14 (B), the curved surface may have a “convex” shape toward the outside of the grooves 104a and 104b, or as shown in FIG. 14 (C). In addition, the curved surface may have a “convex” shape toward the inside of the grooves 104a and 104b.

  In addition, as shown in FIG. 14D, there is no “surface” between the first gas hole row 102a and the second gas hole row 102b, and the first gas hole row 102a and the second gas hole row. The common groove 104 may be connected to the row 102b.

  As described above, the present invention has been described according to one embodiment. However, the present invention is not limited to the above-described embodiment and can be variously modified. Further, in the embodiment of the present invention, the above-described embodiment is not the only embodiment.

  For example, in one embodiment, the arrangement pitch P1 of the first gas hole row 102a and the arrangement pitch P2 of the second gas hole row 102b are set to “P1 = P2”. For example, when it is desired to provide a density distribution, the arrangement pitch P1 and the arrangement pitch P2 may be different from each other.

  The gas supply mechanism in one embodiment includes at least a gas hole array for each gas type, one or a plurality of gas diffusion chambers corresponding to the gas hole arrays, and a gas supply system to each gas diffusion chamber. What is necessary is just to be comprised by the gas piping for supplying gas, and the gas diffusion chamber does not necessarily need to be provided in the gas supply head. Furthermore, the gas supply head may be provided integrally with the stage.

Further, the film to be formed is not limited to the alumina film, and as described in the embodiment, the above-described embodiment can be applied to the formation of various films.
In addition, the present invention can be variously modified without departing from the gist thereof.

  G ... object to be processed, 101 ... gas diffusion chamber, 102 ... gas discharge hole, 103 ... gas discharge surface, 104 ... groove

Claims (7)

A gas supply head for supplying the plurality of types of gases to a processing space for processing a substrate with a plurality of types of gases;
A first gas hole array composed of a plurality of gas discharge holes;
A second gas hole array, which is arranged in parallel with the first gas hole array on the same plane as the first gas hole array, and includes a plurality of other gas discharge holes;
First gas diffusion means configured by one or two or more gas diffusion chambers in which only the gas discharge holes constituting the first gas hole row communicate with each other through a gas flow path;
2nd gas diffusion means constituted by one or two or more gas diffusion chambers in which only the gas discharge holes constituting the second gas hole row communicate with each other through the gas flow path,
A gas supply head, wherein different types of gas are supplied to the first gas diffusion means and the second gas diffusion means. The first gas hole row has a V-shaped groove that connects a plurality of gas discharge holes constituting the first gas hole row,
2. The gas supply head according to claim 1, wherein the second gas hole row includes a V-shaped groove that connects a plurality of gas discharge holes constituting the second gas hole row.   The gas discharge holes constituting the first gas hole row and the gas discharge holes constituting the second gas hole row are offset from positions adjacent to each other. Gas supply head. A gas supply head for supplying the plurality of types of gases to a processing space for processing a substrate with a plurality of types of gases;
A first gas hole array composed of a plurality of gas discharge holes;
A second gas hole array, which is arranged in parallel with the first gas hole array on the same plane as the first gas hole array, and includes a plurality of other gas discharge holes;
First gas diffusion means configured by one or two or more gas diffusion chambers in which only the gas discharge holes constituting the first gas hole row communicate with each other through a gas flow path;
A second gas diffusion means constituted by one or two or more gas diffusion chambers in which only the gas discharge holes constituting the second gas hole row communicate with each other via a gas flow path;
One or more gas diffusion chambers and the second gas constituting the first gas diffusion means on a surface different from the surface on which the first gas hole row and the second gas hole row are arranged A gas supply head comprising: a gas supply pipe for supplying gas to each of one or more gas diffusion chambers constituting the diffusion means. A substrate processing apparatus comprising a gas supply mechanism for supplying the plurality of types of gas to a processing space for processing the substrate with a plurality of types of gas,
The gas supply mechanism
A first gas hole array composed of a plurality of gas discharge holes;
A second gas hole array, which is arranged in parallel with the first gas hole array on the same plane as the first gas hole array, and includes a plurality of other gas discharge holes;
First gas diffusion means configured by one or two or more gas diffusion chambers in which only the gas discharge holes constituting the first gas hole row communicate with each other through a gas flow path;
A second gas diffusion means constituted by one or two or more gas diffusion chambers in which only the gas discharge holes constituting the second gas hole row communicate with each other via a gas flow path;
A substrate processing apparatus comprising gas supply pipes for supplying different types of gas to the first gas diffusion means and the second gas diffusion means, respectively.   6. The substrate processing apparatus according to claim 5, further comprising two or more processing chambers forming the processing space, wherein each of the processing chambers is provided with the gas supply mechanism.   The substrate processing apparatus according to claim 6, further comprising an external chamber that houses the two or more processing chambers and maintains the outside of the processing chamber in a reduced pressure atmosphere.

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