JP2013143058A - Touch panel sensor and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a touch panel sensor with excellent hardness and adhesive property, having an overcoat layer capable of suppressing migration on an outermost surface.SOLUTION: A touch panel sensor comprises: a transparent film; a transparent electrode formed in a pattern on each side of the transparent film; electric wiring formed in a pattern on each side of the transparent film and coupled to the transparent electrode; and an overcoat layer formed on each side of the transparent film so as to cover the transparent electrode and the electric wiring. The overcoat layer has: an adhesion layer formed on the transparent film so as to cover the transparent electrode and the electric wiring, including an adhesion layer resin and having a migration suppression function; and a hardness layer formed on the adhesion layer, including a hardness layer resin.

Description

  The present invention relates to a touch panel sensor having an overcoat layer on the outermost surface.

  Today, touch panels are widely used as input means. In many cases, a touch panel is used together with a display device as an input means for various devices in which a display device such as a liquid crystal display or a plasma display is incorporated (for example, a ticket vending machine, an ATM device, a mobile phone, a game machine). Yes. In such a device, the touch panel is arranged on the display surface of the display device, which allows the touch panel to make a very direct input to the display device.

In a touch panel sensor constituting a touch panel, an overcoat layer containing a resin is generally formed on the outermost surface for surface protection (see, for example, Patent Document 1). Since the overcoat layer in a touch panel sensor is usually provided on a transparent substrate in contact with a transparent electrode, wiring, or the like, adhesion with the transparent substrate, transparent electrode, wiring, or the like is required. Further, since ion migration occurs due to the metal contained in the wiring and a short circuit may occur between the wirings, the overcoat layer is required to have a migration suppressing function. Furthermore, the overcoat layer is also required to have high hardness in order to prevent damage to the touch panel sensor. For this reason, the overcoat layer is required to satisfy all of hardness, adhesion, and migration suppressing function.
However, it is very difficult to prepare a material satisfying all of hardness, adhesion, and migration suppressing function.

JP 2011-150550 A

Recently, studies have been made on forming transparent electrodes and wiring on both sides of a transparent substrate. Since the transparent substrate is light transmissive, when forming transparent electrodes on both sides of the transparent substrate in a pattern, both sides can be patterned simultaneously by the photolithography method, and the position accuracy of the pattern of the transparent electrodes on both sides is increased. Is possible.
In such a case, since the overcoat layer is also formed on both surfaces of the transparent substrate, the overcoat layer formed on the surface of the transparent substrate is formed by applying an overcoat layer on the back surface of the transparent substrate by attaching a protective film or the like. It needs to be protected when forming. Here, when forming an overcoat layer, it is common to apply the resin composition for overcoat layers on a transparent substrate, and to heat-dry. When the resin composition for the overcoat layer is applied to the back surface of the transparent substrate, the overcoat layer formed on the surface of the transparent substrate can be protected by the protective film. In some cases, curling may occur, and the protective film may be peeled off and dried by heating. In this case, since the overcoat layer formed on the surface of the transparent substrate comes into contact with the apparatus jig, if the hardness of the overcoat layer is low, the overcoat layer is damaged.
Therefore, when forming a transparent electrode, wiring, and an overcoat layer on both surfaces of the transparent substrate, the hardness of the overcoat layer is particularly important.

  The present invention has been made in view of the above circumstances, and a main object of the present invention is to provide a touch panel sensor having an overcoat layer on the outermost surface, which is excellent in hardness and adhesion and can suppress migration.

  In order to solve the above problems, the present invention is formed in a pattern on a transparent film, a first transparent electrode formed in a pattern on one surface of the transparent film, and on one surface of the transparent film, A first wiring connected to the first transparent electrode, a first overcoat layer formed on one surface of the transparent film so as to cover the first transparent electrode and the first wiring, and the transparent film. A second transparent electrode formed in a pattern on the other surface, a second wiring formed in a pattern on the other surface of the transparent film and connected to the second transparent electrode, and the other of the transparent film A touch panel sensor having a second overcoat layer formed on a surface so as to cover the second transparent electrode and the second wiring, wherein the first overcoat layer is one of the transparent films. Formed on the first adhesive layer, covering the first transparent electrode and the first wiring, containing a first adhesive layer resin and having a migration suppressing function, A first hardness layer containing a resin for one hardness layer, and the second overcoat layer is formed on the other surface of the transparent film so as to cover the second transparent electrode and the second wiring, A second adhesion layer containing a second adhesion layer resin and having a migration suppressing function, and a second hardness layer formed on the second adhesion layer and containing a second hardness layer resin. A touch panel sensor is provided.

  According to the present invention, the first overcoat layer is a laminate of the first adhesion layer and the first hardness layer, and the second overcoat layer is the laminate of the second adhesion layer and the second hardness layer. Therefore, the first adhesion layer and the second adhesion layer can be made of materials having excellent adhesion and capable of suppressing migration, and the first hardness layer and the second hardness layer can be made of materials having excellent hardness. The first overcoat layer and the second overcoat layer can be excellent in hardness and adhesion and can suppress migration. Therefore, it is possible to obtain a touch panel sensor capable of preventing the occurrence of scratches, peeling, short circuits and the like and capable of stable operation.

  In the above invention, the first adhesion layer resin and the second adhesion layer resin are thermosetting resins, and the first hardness layer resin and the second hardness layer resin are ultraviolet curable resins. It is preferable. This is because the adhesion of the first adhesion layer and the second adhesion layer can be improved, and the hardness of the first hardness layer and the second hardness layer can be increased.

  Moreover, this invention is a manufacturing method of the above-mentioned touchscreen sensor, Comprising: The coating film of a 1st thermosetting resin composition so that the said 1st transparent electrode and said 1st wiring may be covered on one surface of the said transparent film. A first adhesion layer forming step for forming a first adhesion layer, and a coating film of the first ultraviolet curable resin composition on the first adhesion layer after the first adhesion layer formation step. A first hardness layer forming step of forming a first hardness layer, and after the first hardness layer forming step, the second transparent electrode and the second wiring on the other surface of the transparent film A second adhesion layer forming step of forming a second adhesion layer, forming a second adhesion layer, and forming a second adhesion layer after the second adhesion layer formation step, 2 A second UV curable resin composition film is formed on the adhesive layer, photocured, and second hardness Having a second hardness layer forming step of forming a to provide a method for manufacturing a touch panel sensor characterized by.

  According to the present invention, the first adhesion layer and the first hardness layer are sequentially laminated to form the first overcoat layer, and the second adhesion layer and the second hardness layer are sequentially laminated to form the second overcoat layer. Therefore, a material suitable for each layer can be used, and a first overcoat layer and a second overcoat layer that are excellent in hardness and adhesion and can suppress migration can be obtained. According to the invention, the thermosetting resin composition is used for the first adhesion layer and the second adhesion layer, and the first adhesion layer forming step, the first hardness layer forming step, the second adhesion layer forming step, and the second hardness. Since the layers are formed in this order, the number of times of exposure for curing the first adhesion layer, the first hardness layer, and the second adhesion layer can be reduced, and the first adhesion layer, the first hardness layer, and the second adhesion by ultraviolet rays. It is possible to suppress yellowing of the layer, deterioration of adhesion, curling, and the like. Therefore, it is possible to prevent the occurrence of scratches, peeling, short circuits, etc., and to obtain a touch panel sensor that can operate stably and has good optical characteristics.

  Furthermore, this invention is a manufacturing method of the above-mentioned touch panel sensor, Comprising: The ultraviolet curable resin composition for 1st contact | adherence layers so that the said 1st transparent electrode and said 1st wiring may be covered on one surface of the said transparent film. A first curing step in which the coating film of the UV curable resin composition for the first adhesion layer is exposed and semi-cured, and the first adhesion that is semi-cured after the first curing step. Forming a coating film of the UV curable resin composition for the first hardness layer on the coating film of the UV curable resin composition for the layer, and semi-curing the coating film of the UV curable resin composition for the first hardness layer; A second curing step of exposing and curing the coating film of the first adhesive layer ultraviolet curable resin composition; and after the second curing step, the second transparent electrode and the second transparent electrode on the other surface of the transparent film. UV curable resin group for the second adhesion layer so as to cover the second wiring A third curing step of forming a coating film of the product and exposing and semi-curing the coating film of the UV curable resin composition for the second adhesion layer, and the second curing step of semi-curing after the third curing step A coating film of the UV curable resin composition for the second hardness layer is formed on the coating film of the UV curable resin composition for the adhesion layer, and the coating film and the semi-curing of the UV curable resin composition for the second hardness layer are formed. A fourth curing step of exposing and curing the coated film of the ultraviolet curable resin composition for the second adhesion layer, the first curing step, the second curing step, the third curing step, and The exposure amount in the fourth curing step is the total amount of exposure in the first curing step, the second curing step, the third curing step, and the fourth curing step. More than the complete curing exposure amount of the coating film of the product, the second curing step, the third curing step and The total exposure amount of the fourth curing step is equal to or greater than the complete curing exposure amount of the coating film of the ultraviolet curable resin composition for the first hardness layer, and the total exposure amount of the third curing step and the fourth curing step is the above. Complete curing exposure of the coating film of the UV curable resin composition for the second hardness layer, the exposure amount of the UV curing resin composition for the second hardness layer is equal to or greater than the complete curing exposure amount of the coating film of the UV curable resin composition for the second adhesion layer. Provided is a method for manufacturing a touch panel sensor, which is adjusted so as to be equal to or greater than the amount.

  According to the present invention, the first adhesion layer and the first hardness layer are sequentially laminated to form the first overcoat layer, and the second adhesion layer and the second hardness layer are sequentially laminated to form the second overcoat layer. Therefore, a material suitable for each layer can be used, and a first overcoat layer and a second overcoat layer that are excellent in hardness and adhesion and can suppress migration can be obtained. Further, according to the present invention, since the transparent film has light transparency, when the exposure is performed from one side of the transparent film, the layer formed on the surface opposite to the exposure surface of the transparent film is also exposed. However, since the exposure amounts in the first curing step, the second curing step, the third curing step, and the fourth curing step are adjusted as described above, the first adhesion layer, the first hardness layer, and the second adhesion layer using ultraviolet rays are adjusted. It is possible to suppress yellowing of the layer, deterioration of adhesion, curling, and the like. Therefore, it is possible to prevent the occurrence of scratches, peeling, short circuits, etc., and to obtain a touch panel sensor that can operate stably and has good optical characteristics.

  The present invention has an effect that it can provide a touch panel sensor having an overcoat layer that is excellent in hardness and adhesion on the outermost surface and can suppress migration.

It is a schematic plan view which shows an example of the touch panel sensor of this invention. It is the sectional view on the AA line of FIG. It is process drawing which shows an example of the manufacturing method of the touch panel sensor of this invention. It is process drawing which shows the other example of the manufacturing method of the touchscreen sensor of this invention.

  Hereinafter, the touch panel sensor of the present invention and the manufacturing method thereof will be described in detail.

A. Touch Panel Sensor The touch panel sensor of the present invention is formed in a pattern on the transparent film, the first transparent electrode formed in a pattern on one surface of the transparent film, and the first film on the one surface of the transparent film. A first wiring connected to the transparent electrode; a first overcoat layer formed on one surface of the transparent film so as to cover the first transparent electrode and the first wiring; and the other surface of the transparent film. The second transparent electrode formed in a pattern, the second wiring formed in a pattern on the other surface of the transparent film and connected to the second transparent electrode, and the other surface of the transparent film A touch panel sensor having a second transparent electrode and a second overcoat layer formed so as to cover the second wiring, wherein the first overcoat layer includes the transparent film. A first adhesive layer formed on one surface of the rum so as to cover the first transparent electrode and the first wiring, containing a first adhesive layer resin, and having a migration suppressing function; and on the first adhesive layer And the first overcoat layer covers the second transparent electrode and the second wiring on the other surface of the transparent film. A second adhesion layer containing a second adhesion layer resin and having a migration suppressing function, and a second hardness layer formed on the second adhesion layer and containing a second hardness layer resin; It is characterized by having.

First, the touch panel sensor of the present invention will be described with reference to the drawings.
1A and 1B are schematic plan views showing an example of a touch panel sensor of the present invention. FIG. 1A is a plan view seen from one surface side of a transparent film, and FIG. 1B is transparent. The top view seen from the other surface side of the film, FIG. 2 is the sectional view on the AA line of FIG. 1 (a), (b).
As illustrated in FIGS. 1A and 2, in the touch panel sensor 1, the first transparent electrode 3 a is formed in a stripe shape on one surface of the transparent film 2, and one end of the first transparent electrode 3 a is formed. A first overcoat layer 5a is formed so as to cover the first transparent electrode 3a and the first wiring 4a. The first overcoat layer 5a includes a first adhesion layer 6a formed so as to cover the first transparent electrode 3a and the first wiring 4a, and a first hardness layer 7a formed on the first adhesion layer 6a. Have. The first overcoat layer 5a is formed in a pattern on one surface of the transparent film 2 so that the external connection region 14a of the first wiring 4a is exposed.
Similarly, as illustrated in FIGS. 1B and 2, the second transparent electrode 3 b is formed in a stripe shape on the other surface of the transparent film 2, and is formed at one end of the second transparent electrode 3 b. A second overcoat layer 5b is formed so as to connect the second wiring 4b and cover the second transparent electrode 3b and the second wiring 4b. The second overcoat layer 5b includes a second adhesion layer 6b formed so as to cover the second transparent electrode 3b and the second wiring 4b, and a second hardness layer 7b formed on the second adhesion layer 6b. Have. The second overcoat layer 5b is formed in a pattern on the other surface of the transparent film 2 so that the external connection region 14b of the second wiring 4b is exposed.
In FIGS. 1A and 1B, the first overcoat layer 5a and the second overcoat layer 5b are indicated by a one-dot chain line for ease of explanation.

In the present specification, for the sake of convenience, the transparent electrode, the wiring, the overcoat layer, the adhesion layer and the hardness layer formed on one surface of the transparent film are respectively the first transparent electrode, the first wiring, the first overcoat layer, The first adhesion layer and the first hardness layer are referred to as the transparent electrode, the wiring, the overcoat layer, the adhesion layer and the hardness layer formed on the other surface of the transparent film, respectively. It is called an overcoat layer, a second adhesion layer, and a second hardness layer.
In the present specification, the first transparent electrode and the second transparent electrode are simply transparent electrodes, the first wiring and the second wiring are simply wirings, the first overcoat layer and the second overcoat layer are simply overcoat layers, In some cases, the first adhesion layer and the second adhesion layer are simply referred to as an adhesion layer, and the first hardness layer and the second hardness layer are simply referred to as a hardness layer.

  According to the present invention, since the overcoat layer is formed by laminating the adhesion layer and the hardness layer, the adhesion layer has excellent adhesion to the transparent film, the transparent electrode, and the wiring, and can suppress migration. A material having excellent hardness can be used for the hardness layer. Therefore, compared to the case where the overcoat layer is a single layer, it is possible to easily form an overcoat layer that is excellent in hardness and adhesion and can suppress migration.

For example, when the overcoat layer is a single layer, if a material having excellent curability is used to increase the hardness, the adhesiveness with the transparent film, the transparent electrode, or the wiring is lowered due to curing shrinkage. On the other hand, when it is going to improve adhesiveness, it will become difficult to obtain sufficient hardness.
On the other hand, in the present invention, as described above, since the overcoat layer is formed by laminating the adhesion layer and the hardness layer, a material suitable for each layer can be used. Therefore, it is possible to provide an overcoat layer that is excellent in hardness and adhesion and can suppress migration.
Moreover, since both the adhesion layer and the hardness layer contain a resin, the adhesion between the adhesion layer and the hardness layer can be sufficiently high.

Here, in the touch panel sensor, ion migration may occur due to the metal contained in the wiring, and a short circuit may occur between the wirings. In addition, since ion migration may occur due to the presence of water vapor, etc., the touch panel sensor is sensitive to humidity, and when metal such as silver is generated in the wiring due to the generation of metal ions due to electric potential, etc., or in a high humidity environment In particular, there is a concern about ion migration in cases where the use of is scheduled.
On the other hand, in the present invention, the ion migration phenomenon can be satisfactorily prevented by covering the wiring with an adhesion layer having a migration suppressing function. Furthermore, by covering the wiring with an overcoat layer in which an adhesion layer and a hardness layer are laminated, the wiring can be protected, and an effect of suppressing deterioration of the wiring or the like is also expected.

  In addition, the touch panel sensor of the present invention has such an overcoat layer, so that, for example, when the touch panel sensor is used or transported, or when an arbitrary member is formed on the touch panel sensor, scratches, peeling, etc. Can be prevented. As a result, it is possible to prevent scratches or the like from being generated on the transparent electrode or the like that constitutes the touch panel sensor, and it is possible to suppress the occurrence of disconnection or poor sensitivity.

  Furthermore, since the adhesion layer and the hardness layer constituting the overcoat layer contain a resin, it becomes easy to form the overcoat layer in a pattern, for example, the overcoat layer so that the external connection region of the wiring is exposed. Can be easily formed in a pattern, and a touch panel sensor can be provided which can be easily connected to an external wiring.

In the present invention, since the transparent film has optical transparency, the first transparent electrode and the second transparent electrode that are formed in a pattern on both surfaces of the transparent film can be simultaneously formed by photolithography. The position accuracy of the patterns of the first transparent electrode and the second transparent electrode is good, and a fine pattern can be formed with high accuracy.
Furthermore, since the transparent electrodes and wiring are formed in a pattern on both sides of the transparent film, the layer structure is simplified compared to the case where the transparent electrode, wiring and insulating layer are laminated on only one side of the transparent film as in the past. And the optical characteristics of the touch panel sensor can be enhanced.
Moreover, since a transparent film is used, flexibility can be imparted to the touch panel sensor, and high productivity by roll-to-roll can be realized.

  Hereinafter, each structure in the touch-panel sensor of this invention is demonstrated.

1. Overcoat layer The overcoat layer used in the present invention is formed so as to cover the transparent electrode and the wiring on both surfaces of the transparent film, and is formed on the transparent film so as to cover the transparent electrode and the wiring. The adhesive layer contains a resin for use and has a migration suppressing function, and the hardness layer is formed on the adhesive layer and contains the resin for the hardness layer.
Hereinafter, the adhesion layer and the hardness layer constituting the overcoat layer will be described separately.

(1) Adhesion layer The adhesion layer used in the present invention is formed on the transparent film so as to cover the transparent electrode and the wiring, contains an adhesion layer resin, and has a migration suppressing function.

  As the adhesion force of the adhesion layer to the transparent film, the transparent electrode and the wiring, the adhesion layer is formed of the transparent film, the transparent electrode, when using the touch panel sensor of the present invention or when transporting, or when forming an arbitrary member on the touch panel sensor. Or, it is not particularly limited as long as it does not peel from the wiring, but a cross-cut tape method defined by ASTM D3359, that is, a method of attaching 100 cross-cuts having a gap of 1 mm with a cutter and performing a peel test with an adhesive tape The evaluation result is preferably 4B or 5B. It is because peeling from a transparent film, a transparent electrode, or wiring can be prevented more reliably when the adhesion strength of the adhesion layer is within the above range.

Although the adhesion layer has a migration suppression function, in this specification, “having a migration suppression function” means that ion migration does not occur.
Here, the presence or absence of the occurrence of ion migration is evaluated by the following test method. That is, (1) a touch panel sensor is connected to an insulation deterioration evaluation system SIR-12 manufactured by Enomoto Kasei Co., Ltd., and a constant temperature and humidity chamber is applied with a voltage applied (constant temperature and humidity tester HIFLEX FH14PH manufactured by Enomoto Kasei Co., Ltd.) In At this time, the temperature and humidity chamber is set to a temperature of 60 ° C. and a relative humidity of 90% RH. (2) In the wiring formed on the display surface side of the touch panel sensor, a direct current is applied so that a potential difference (3.3 V) is generated between adjacent wirings. That is, DC voltages are alternately applied to wirings adjacent to each other in the order of 0 V, 3.3 V, 0 V, 3.3 V,. (3) In this state, the touch panel sensor is left for 240 hours, and the insulation resistance value between the wirings is monitored by the insulation deterioration evaluation system. In principle, the monitoring pattern is that the insulation resistance value is measured once every second. If the insulation resistance value falls below 1.0 × 10 ⁶ Ω (threshold), the insulation resistance value is once every 0.2 seconds. The pattern is such that is measured.
If ion migration occurs, the insulation resistance value between the wirings decreases, so that the occurrence of ion migration can be confirmed by this monitoring.
In the test method described above, when (a) the insulation resistance value is measured as a value lower than 1.0 × 10 ⁶ Ω, it is determined that ion migration has occurred once. (B) When the measurement with an insulation resistance value of 1.0 × 10 ⁶ Ω or less reaches a total of 200 times, stop the measurement. (C) When a current of 327 μA or more (1.0 × 10 ⁴ Ω or less) is measured and a short circuit is observed between the wires, the measurement is stopped.
When none of these (a), (b), and (c) is confirmed, it is determined that ion migration does not occur, that is, the adhesion layer has a migration suppressing function.

The adhesion layer is light transmissive. The transmittance in the visible light region of the adhesion layer is not particularly limited as long as an overcoat layer having a desired light transmittance can be formed. Specifically, it is preferably 80% or more. 90% or more is more preferable. This is because, when the transmittance is within the above range, an overcoat layer excellent in light transmittance can be formed.
Here, let the transmittance | permeability of a contact | adherence layer be the total light transmittance which measured the contact | adherence layer formed on glass by the method prescribed | regulated by JISK7105.

  The resin for the adhesion layer used for the adhesion layer is not particularly limited as long as the adhesion layer having desired adhesion and light transmittance can be formed in a pattern, and is not limited to heat, ultraviolet rays, electron beams, etc. Examples thereof include curable resins that are cured by irradiation with radiation.

  Examples of the curable resin include those containing an unsaturated double bond such as an acryloyl group, a methacryloyl group or a vinyl group, or a polymerizable functional group such as an epoxy group in a molecule or a single structure.

  Examples of the curable resin include (1) an addition product of an epoxy acrylate resin having a fluorene skeleton and a polybasic acid anhydride, (2) a polyfunctional acrylate monomer, (3) a polymerization initiator, and (4) ) A cardo resin (also called a cardo polymer) containing an epoxy resin having two or more epoxy groups in one molecule as an essential component can be given. An adhesion layer made of a cardo polymer is produced when formed by sputtering, ion plating, chemical vapor deposition, or the like, for example, when an inorganic layer made of silicon oxide or the like is formed on the surface of a transparent film. The effect of covering the defects such as fine pinholes in the inorganic layer and maintaining a desirable water vapor transmission rate is expected. The cardo polymer preferably contains a resin having a fluorene skeleton derived from a bisphenol compound. Details regarding the structure of the cardo polymer are described in JP-A-2005-324406, and a description thereof is omitted here.

Among them, the adhesive layer resin is preferably a thermosetting resin or an ultraviolet curable resin.
Examples of the thermosetting resin include urethane resins, epoxy resins, melamine resins, polyester resins, and the like.
As an ultraviolet curable resin, acrylic resin etc. are mentioned, for example.
Urethane resins and epoxy resins have the advantage that migration can be effectively suppressed. Urethane resins and acrylic resins have the advantage that they are difficult to yellow.

  The adhesion layer containing a thermosetting resin can be formed by thermosetting using a thermosetting resin composition. The thermosetting resin composition can contain a curing agent. As the curing agent, known curing agents can be used, and examples thereof include amine-based, polyaminoamide-based, acid and acid anhydrides, imidazole, mercaptan, and phenol resin. Among these, from the viewpoints of solvent resistance, optical properties, thermal properties, and the like, polymers containing acid anhydrides and acid anhydride structures or aliphatic amines are widely used. Further, an appropriate amount of a curing catalyst such as a known tertiary amine or imidazole may be added.

  On the other hand, the adhesion layer containing an ultraviolet curable resin can be formed by photocuring using an ultraviolet curable resin composition. The ultraviolet curable resin composition generally contains an appropriate amount of a known additive such as a photoreaction initiator.

  The curable resin composition used for the adhesion layer may further contain an alkoxysilane hydrolyzate or a silane coupling agent in order to further enhance the interaction with the polymer molecules. As a silane coupling agent, one having a hydrolyzable reactive group such as methoxy group, ethoxy group or acetoxy group at one end of the molecule and an epoxy group, vinyl group, amino group, halogen group or mercapto group at the other end Is preferably involved in the resin curing reaction. Specifically, Shin-Etsu Chemical Co., Ltd. KBM-503, KBM-803, Nippon Unicar Co., Ltd. A-187, etc. are used preferably.

  Among these, the adhesive layer resin is preferably a thermosetting resin. This is because a decrease in adhesion and curling due to curing shrinkage can be suppressed, and the adhesion can be improved. In addition, by using a thermosetting resin for the adhesion layer, the number of times of exposure for curing when forming the adhesion layer and the hardness layer can be reduced, and yellowing and adhesion of the adhesion layer and the hardness layer due to ultraviolet irradiation can be reduced. This is because it is possible to suppress the decrease in the thickness and the occurrence of curling.

  In particular, the adhesive layer resin is preferably a urethane resin. This is because, when the adhesion layer contains a urethane-based resin, migration can be effectively suppressed and the adhesion layer can be made difficult to yellow.

  Further, the first adhesion layer and the second adhesion layer may be made of the same kind of curable resin, or different kinds of curable resins may be used.

  The arrangement of the adhesion layer is not particularly limited as long as it can stably detect the contact position in the touch panel sensor of the present invention and can stably protect the transparent film, the transparent electrode, and the wiring. From the viewpoint of facilitating the implementation of the process, it is preferable that the adhesion layer is formed in a pattern on the transparent film so that the external connection region of the wiring is exposed. This is because, with such a configuration, it is easy to stably protect the transparent film, the transparent electrode, and the wiring, and to stably operate the touch panel sensor of the present invention.

The thickness of the adhesion layer is not particularly limited as long as desired adhesion can be exhibited, and can be, for example, about 0.5 μm to 20 μm.
The thickness of the adhesion layer refers to the distance from the surface of the transparent electrode to the surface of the adhesion layer.

  The method for forming the adhesion layer is not particularly limited as long as the adhesion layer can be formed in a pattern. For example, the adhesion layer resin composition containing the adhesion layer resin is patterned on a transparent film. The method of apply | coating to a shape and hardening can be applied. Examples of the method for applying the resin composition for the adhesion layer in a pattern include a screen printing method, a method in which a region where the adhesion layer is not formed is masked, and a coating method using a spray method, a microgravure method, or the like. When the adhesive layer resin composition has photosensitivity, the adhesive layer resin composition containing the adhesive layer resin is applied to substantially the entire surface of the transparent film, and then patterned by a photolithography method. it can. Examples of the method of applying the adhesive layer resin composition on substantially the entire surface include a spin coating method.

(2) Hardness layer The hardness layer used for this invention is formed on the said contact | adherence layer, and contains resin for hardness layers.

The pencil hardness of the hardness layer is particularly limited as long as the touch panel sensor can be less scratched and peeled when the touch panel sensor of the present invention is used or transported, or when an arbitrary member is formed on the touch panel sensor. However, it is preferably HB or higher, and more preferably 2H or higher. This is because when the pencil hardness is in the above range, the hardness can be improved, and the touch panel sensor of the present invention can be less scratched and peeled. In addition, although it does not specifically limit as an upper limit of the pencil hardness of a hardness layer, Usually, it is 6H or less.
Here, as a method for measuring the pencil hardness, a method for measuring a resist formed on glass in accordance with the standard of JIS K 5600-5-4 can be applied.

The hardness layer is light transmissive. The transmittance in the visible light region of the hardness layer is not particularly limited as long as an overcoat layer having a desired light transmittance can be formed. Specifically, it is preferably 80% or more. 90% or more is more preferable. This is because when the transmittance is in the above range, an overcoat layer having excellent light transmittance can be formed.
The method for measuring the transmittance of the hardness layer can be the same as the method for measuring the transmittance of the adhesion layer.

The resin for the hardness layer used for the hardness layer is not particularly limited as long as it can form a hardness layer having desired hardness and light transmittance in a pattern, and heat, radiation such as ultraviolet rays and electron beams, etc. A curable resin that is cured by irradiation of the above.
The curable resin can be the same as that described in the section of the adhesion layer.

  Especially, it is preferable that resin for hardness layers is an ultraviolet curable resin. This is because a hardness layer having higher hardness can be formed. Moreover, it is because a pattern-like hardness layer can be formed easily.

  In particular, the hardness layer resin is preferably an acrylic resin. It is because a hardness layer can make it hard to yellowing because a hardness layer contains acrylic resin. An acrylic resin containing an acryloyl group is excellent in curing reaction and is preferable.

  Further, the first hardness layer and the second hardness layer may be made of the same kind of curable resin, or different kinds of curable resins may be used.

  The arrangement of the hardness layer is not particularly limited as long as the contact position can be stably detected in the touch panel sensor of the present invention and the transparent film, the transparent electrode and the wiring can be stably protected. Similar to the adhesion layer, the hardness layer is preferably formed in a pattern so that the external connection region of the wiring is exposed.

The thickness of the hardness layer is not particularly limited as long as a desired hardness can be exhibited, and can be, for example, about 0.5 μm to 20 μm.
The thickness of the hardness layer refers to the distance from the surface of the adhesion layer to the surface of the hardness layer.

  The method for forming the hardness layer is not particularly limited as long as the hardness layer can be formed in a pattern, and can be the same as the method for forming the adhesion layer.

(3) Overcoat layer As an arrangement of the overcoat layer used in the present invention, it is possible to stably detect the contact position in the touch panel sensor of the present invention and to stably protect the transparent film, the transparent electrode and the wiring. However, as described above, it is preferable that the overcoat layer is formed in a pattern so that the external connection region of the wiring is exposed.

2. Transparent film The transparent film used for this invention supports a transparent electrode, wiring, and an overcoat layer.

  As a transparent film, it can be made to be the same as that of the transparent film generally used for a touchscreen, for example, a resin film is mentioned. With the resin film, the weight can be reduced, and flexibility can be imparted to the touch panel sensor of the present invention. Examples of the resin film include polyethylene films such as polyethylene terephthalate film (PET film), polyester films such as polyethersulfone film (PES film), acrylics such as polymethyl methacrylate, polyamide, polyacetal, and polybutylene terephthalate. , Polyethylene naphthalate, triacetyl cellulose, syndiotactic polystyrene, etc., polyphenylene sulfide, polyether ketone, polyether ether ketone, fluororesin, polyether nitrile, etc., polycarbonate, modified polyphenylene ether, polycyclohexene, or polynorbornene Resin, polysulfone, polysulfone, polyarylate, polyamide Bromide, polyetherimide, or can be given a film made of a thermoplastic polyimide. Further, a TAC film or a COP film may be used.

  Further, the transparent film may be formed by forming an undercoat layer made of an organic layer, a refractive index adjusting layer made of silicon oxide, niobium oxide, or the like on the surface of the resin film.

The light transmittance of the transparent film can be appropriately determined.
Although the thickness of a transparent film will not be specifically limited if a transparent electrode, wiring, and an overcoat layer can be supported, Generally it is about 20 micrometers-about 1500 micrometers.

3. Transparent electrode The transparent electrode used for this invention is formed in a pattern form on both surfaces of a transparent film.

The transparent electrode is generally formed in an active area visually recognized by a user of the touch panel sensor. Therefore, the transparent electrode is formed of a light transmissive conductive material. Examples of the light-transmitting conductive material include indium oxide-based materials such as indium tin oxide (ITO), indium oxide, and indium zinc oxide (IZO), or tin oxide (SnO ₂ ) and zinc oxide (ZnO). Conductive polymer materials such as metal oxides, polyaniline, and polyacetylene can be used. The first transparent electrode and the second transparent electrode may be made of the same type of conductive material, or different types of conductive materials may be used.

  As the pattern shape of the transparent electrode, a pattern shape of the transparent electrode that can function as a touch panel sensor can be appropriately selected, and for example, an arbitrary pattern shape such as a stripe shape or a rhombus shape can be used.

  The arrangement of the transparent electrode can be the same as the transparent electrode used in a general touch panel sensor, and the transparent electrode is formed in the active area as described above. Further, the arrangement of the first transparent electrode and the second transparent electrode may be any arrangement that can function as a touch panel sensor. For example, the extending direction of the first transparent electrode and the extending direction of the second transparent electrode are substantially the same. Transparent electrodes can be formed on both sides of the transparent film so as to be vertical.

  The thickness of the transparent electrode is not particularly limited, and is appropriately selected according to the method for forming the transparent electrode. For example, when the transparent electrode is patterned by photolithography, the thickness can be about 10 nm to 500 nm.

  The method for forming the transparent electrode can be the same as the transparent electrode used in a general touch panel sensor. In the present invention, since the transparent film has light transmittance, when the transparent electrodes are formed in a pattern on both surfaces of the transparent film, both surfaces can be patterned simultaneously by a photolithography method. Therefore, the positional accuracy of the patterns of the first transparent electrode and the second transparent electrode is good, and a fine pattern can be formed with high accuracy.

4). Wiring The wiring used for this invention is formed in a pattern form on both surfaces of a transparent film, and is connected to a transparent electrode.
The wiring is a wiring that enables electrical distribution between the transparent electrode and the external circuit, and is usually a wiring for taking out the current from the transparent electrode to the outside. Is included.

The wiring is generally formed outside an active area that is visually recognized by a user of the touch panel sensor. Therefore, the material constituting the wiring may be a conductive material, and may or may not be light transmissive. Specifically, a metal material such as silver or copper having high conductivity is preferably used. More specifically, examples of the metal material constituting the wiring include a simple metal, a composite of metal, a composite of metal and metal compound, and a metal alloy. Examples of the simple metal include silver, copper, gold, chromium, platinum, and aluminum. Examples of the metal composite include MAM (Mo—Al—Mo, that is, a three-layer structure of molybdenum, aluminum, and molybdenum). Examples of the composite of metal and metal compound include a chromium oxide / chromium laminate. As the metal alloy, a silver alloy or a copper alloy is generally used. Moreover, APC (Au * Pd * Cu, ie, silver * palladium * copper) etc. can be illustrated as a metal alloy.
In addition, a resin composition may be appropriately mixed in the metal material constituting the wiring.
In addition, when wiring is formed by a printing method such as screen printing, it contains metal particles such as silver or copper having a particle diameter of several tens of nanometers to several μm and a resin binder as a wiring forming material, and a solvent is used. A metal particle-containing paste appropriately prepared by use is widely used. As the resin binder, for example, a single substance or a mixture of acrylic resin, epoxy resin, polyester resin, polyvinyl chloride, polyvinyl alcohol, polyvinyl acetate, polystyrene, or the like is used.

  Note that when the wiring includes a material that is easily affected by humidity and is likely to undergo migration due to potential generation of metal ions, such as copper, silver, aluminum, molybdenum, tantalum, titanium, tungsten, etc. As described above, ion migration may occur due to the presence of water vapor or the like, but in the present invention, since the adhesion layer has a migration suppressing function, the occurrence of migration can be effectively suppressed.

  The wiring may have a surface that has been subjected to surface treatment such as UV ozone or oxygen plasma, but as described above, the adhesion layer in the present invention exhibits high adhesion to the wiring. These processes can be made unnecessary.

  The arrangement of the wiring can be the same as that used for a general touch panel sensor, and the wiring is formed outside the active area as described above.

  The thickness and width dimension of the wiring are not particularly limited, and are appropriately adjusted depending on the wiring forming method and the like. For example, when the wiring is patterned by photolithography, the thickness can be about 10 nm to 500 nm, and the width can be about 5 μm to 200 μm. When the wiring is formed in a pattern by a printing method such as screen printing, the thickness can be about 5 μm to 20 μm and the width can be about 20 μm to 300 μm.

  The wiring formation method can be the same as the wiring used for a general touch panel sensor. For example, first, a resist layer is formed on a laminate in which a transparent electrode conductive layer and a wiring conductive layer are sequentially stacked on a transparent film, and after pattern exposure and development, a wiring conductive layer and a transparent electrode conductive layer are formed. Are etched at once, the resist layer is removed, a resist layer is further formed in a region other than the active area, and the conductive layer for wiring remaining on the transparent electrode conductive layer in the active area is etched. It is done.

5. Uses Examples of the use of the touch panel sensor of the present invention include display devices such as liquid crystal display devices and organic electroluminescence display devices.

B. Manufacturing method of touch panel sensor The manufacturing method of the touch panel sensor of the present invention has two embodiments according to the formation process of an overcoat layer. In the following, each embodiment will be described separately.

1. 1st embodiment The manufacturing method of the touch-panel sensor of this embodiment is a manufacturing method of the above-mentioned touch-panel sensor, Comprising: 1st surface of the said transparent film is covered so that the said 1st transparent electrode and the said 1st wiring may be covered. A first adhesive layer forming step of forming a first adhesive layer by forming a coating film of 1 thermosetting resin composition, thermosetting, and after the first adhesive layer forming step, the first adhesive layer is formed on the first adhesive layer; (1) A first hardness layer forming step of forming a coating film of an ultraviolet curable resin composition, photocuring and forming a first hardness layer; and after the first hardness layer forming step, on the other surface of the transparent film A second adhesion layer forming step of forming a second adhesion layer by forming a coating film of the second thermosetting resin composition so as to cover the second transparent electrode and the second wiring, and thermosetting the coating film; After the second adhesion layer forming step, the second ultraviolet curable resin is formed on the second adhesion layer. And a second hardness layer forming step of forming a second hardness layer by forming a coating film of the composition and photocuring the coating film.

The manufacturing method of the touch panel sensor of this embodiment will be described with reference to the drawings. 3A to 3E are process diagrams showing an example of a method for manufacturing a touch panel sensor according to the present embodiment.
First, as shown in FIG. 3A, the first transparent electrode 3a and the first wiring 4a are formed in a pattern on one surface, and the second transparent electrode 3b and the second wiring (not shown) are formed on the other surface. Prepare a transparent film 2 formed in a pattern.
Next, although not shown in the drawing, a coating film of the first thermosetting resin composition is formed on one surface of the transparent film 2 so as to cover the first transparent electrode 3a and the first wiring 4a, and is thermally cured. As shown in 3 (b), the first adhesion layer 6a is formed (first adhesion layer forming step). Next, as shown in FIG. 3 (c), a coating film 17A of the first ultraviolet curable resin composition is formed on the first adhesion layer 6a, photocured by irradiating with ultraviolet rays 21, and the first hardness layer is formed. Form (first hardness layer forming step). Thereby, as shown in FIG. 3D, the first overcoat layer 5a in which the first adhesion layer 6a and the first hardness layer 7a are sequentially laminated on one surface of the transparent film 2 is formed.
Next, although not shown, a coating film of the second thermosetting resin composition is formed on the other surface of the transparent film 2 so as to cover the second transparent electrode 3b and the second wiring (not shown), and thermosetting is performed. Then, as shown in FIG. 3D, the second adhesion layer 6b is formed (second adhesion layer forming step). Next, as shown in FIG. 3 (e), a coating film 17B of the second ultraviolet curable resin composition is formed on the second adhesion layer 6b, photocured by irradiating with ultraviolet rays 21, and the second hardness layer is formed. Form (second hardness layer forming step). Thereby, as illustrated in FIG. 2, the second overcoat layer 5 b in which the second adhesion layer 6 b and the second hardness layer 7 b are sequentially laminated on the other surface of the transparent film 2 is formed.

  In this embodiment, the first adhesion layer and the second adhesion layer are formed using the thermosetting resin composition, and the first adhesion layer forming step, the first hardness layer forming step, the second adhesion layer forming step, and the first Since it performs in order of 2 hardness layer formation process, the frequency | count of exposure for hardening with respect to a 1st adhesion layer, a 1st hardness layer, and a 2nd adhesion layer can be reduced. Therefore, yellowing of the first adhesion layer, the first hardness layer, and the second adhesion layer due to ultraviolet irradiation, a decrease in adhesion, and the occurrence of curling can be suppressed.

Here, if not only the first hardness layer and the second hardness layer but also the first adhesion layer and the second adhesion layer are formed using the ultraviolet curable resin composition, the first adhesion layer, the first adhesion layer, When the hardness layer, the second adhesion layer, and the second hardness layer are formed, exposure for curing is performed. At this time, since the transparent film has light transmittance, when the exposure is performed from one side of the transparent film, the layer formed on the surface opposite to the exposure surface of the transparent film is also exposed. Therefore, in such a case, the first adhesion layer is exposed four times, and depending on the order of formation of the first hardness layer and the second adhesion layer, the first hardness layer is exposed twice or three times, The second adhesion layer is exposed twice or three times. Therefore, there is a concern about deterioration of the first adhesion layer, the first hardness layer, and the second adhesion layer due to ultraviolet irradiation.
On the other hand, in this embodiment, since the adhesion layer is formed using the thermosetting resin composition, the number of exposures when forming the adhesion layer and the hardness layer can be reduced, and exposure to the first adhesion layer is performed. Is twice, the exposure to the first hardness layer is twice, and the second adhesion layer is only exposed once, and it is possible to suppress yellowing, decrease in adhesion and curling due to ultraviolet irradiation. .

Also, if the first adhesion layer forming step, the second adhesion layer forming step, the first hardness layer forming step, and the second hardness layer forming step are performed in this order, the second adhesion layer is exposed for curing. It will be done twice.
On the other hand, in this embodiment, since the first adhesion layer forming step, the first hardness layer forming step, the second adhesion layer forming step, and the second hardness layer forming step are performed in this order, the second adhesion layer is cured. This exposure is performed only once, and it is possible to further suppress the yellowing of the second adhesion layer, the decrease in adhesion, and the occurrence of curling due to ultraviolet irradiation.

  Moreover, in this embodiment, since a thermosetting resin composition is used for the adhesion layer, it is possible to suppress adhesion degradation and curling due to curing shrinkage, and to improve adhesion. Furthermore, since the ultraviolet curable resin composition is used for the hardness layer, the hardness can be increased.

  Furthermore, in this embodiment, since the adhesion layer and the hardness layer are sequentially laminated, an overcoat layer having excellent hardness and adhesion and capable of suppressing migration can be formed, and stable operation is possible. A touch panel sensor can be obtained.

Hereinafter, each process in the manufacturing method of the touch panel sensor of this embodiment is explained.
Since the transparent film, the transparent electrode and the formation method thereof, and the wiring and the formation method thereof are described in the above section “A. Touch panel sensor”, description thereof is omitted here.

(1) 1st adhesion layer formation process The 1st adhesion layer formation process in this embodiment is the 1st thermosetting resin so that the 1st transparent electrode and the 1st wiring may be covered on one side of the transparent film. In this step, a coating film of the composition is formed and thermally cured to form a first adhesion layer.

  Since the first thermosetting resin composition is the same as the thermosetting resin composition described in the above section “A. Touch panel sensor 1. Overcoat layer”, description thereof is omitted here.

  The method for forming the coating film of the first thermosetting resin composition is not particularly limited as long as it is a method capable of forming the first adhesion layer in a pattern. For example, the first thermosetting property is formed on a transparent film. The method of apply | coating a resin composition in pattern shape is mentioned. As a method of applying the first thermosetting resin composition in a pattern, for example, a screen printing method, a method in which a region where the first adhesion layer is not formed is masked, and a spray method, a microgravure method, or the like is applied. Is mentioned.

  When thermosetting the coating film of the first thermosetting resin composition, for example, an oven, a hot plate, or the like can be used.

  In the first adhesion layer forming step and the first hardness layer forming step described later, in order to protect the second transparent electrode and the second wiring formed on the other surface of the transparent film, a protective film is formed on the other surface of the transparent film. Can be affixed.

(2) First Hardness Layer Formation Step The first hardness layer formation step in this embodiment forms a coating film of the first ultraviolet curable resin composition on the first adhesion layer after the first adhesion layer formation step. And photocuring to form the first hardness layer.

  The first ultraviolet curable resin composition is the same as the ultraviolet curable resin composition described in the above section “A. Touch panel sensor 1. Overcoat layer”, and thus the description thereof is omitted here.

  The method for forming the coating film of the first ultraviolet curable resin composition is not particularly limited as long as it is a method capable of forming the first hardness layer in a pattern, and the coating of the first thermosetting resin composition is not limited. It can be the same as the film formation method.

When the coating film of the first ultraviolet curable resin composition is photocured, it may be semi-cured or fully cured. Especially, it is preferable to make it semi-harden in the 1st hardness layer formation process with respect to the coating film of a 1st ultraviolet curable resin composition, and to harden it completely in the below-mentioned 2nd hardness layer process. This is because yellowing of the first hardness layer, lowering of adhesion, and further curling can be suppressed by ultraviolet irradiation.
The exposure amount is appropriately selected according to the composition of the first ultraviolet curable resin composition, the cured state, and the like.

(3) Second adhesion layer forming step The second adhesion layer forming step in this embodiment covers the second transparent electrode and the second wiring on the other surface of the transparent film after the first hardness layer forming step. Thus, it is the process of forming the coating film of the 2nd thermosetting resin composition, making it thermoset, and forming a 2nd contact | adherence layer.

Since the second thermosetting resin composition is the same as the thermosetting resin composition described in the above section “A. Touch panel sensor 1. Overcoat layer”, description thereof is omitted here.
Moreover, about the formation method and thermosetting of the coating film of the 2nd thermosetting resin composition, it is the same as the forming method and thermosetting of the coating film of the 1st thermosetting resin composition in the said 1st contact | adherence layer formation process. It can be.

  In the second adhesion layer forming step and the second hardness layer forming step described later, in order to protect the first transparent electrode, the first wiring, the first adhesion layer, and the first hardness layer formed on one surface of the transparent film. A protective film can be attached to one side of the transparent film.

(4) Second hardness layer forming step In the second hardness layer forming step in the present embodiment, after the second adhesive layer forming step, a coating film of the second ultraviolet curable resin composition is formed on the second adhesive layer. And photocuring to form a hardness layer.

The second ultraviolet curable resin composition is the same as the ultraviolet curable resin composition described in the above section “A. Touch panel sensor 1. Overcoat layer”, and thus the description thereof is omitted here.
Moreover, about the formation method of the coating film of a 2nd ultraviolet curable resin composition, it can be made to be the same as the formation method of the coating film of the 1st ultraviolet curable resin composition in the said 1st hardness layer formation process.

When the coating film of the second ultraviolet curable resin composition is photocured, the second hardness layer is formed when the coating film of the first ultraviolet curable resin composition is semi-cured in the first hardness layer forming step. In the process, not only the coating film of the second ultraviolet curable resin composition but also the coating film of the first ultraviolet curable resin composition is completely cured.
The amount of exposure is appropriately selected according to the composition and cured state of the first ultraviolet curable resin composition, the composition of the second ultraviolet curable resin composition, and the like.

2. 2nd embodiment The manufacturing method of the touch panel sensor of this embodiment is a manufacturing method of the above-mentioned touch panel sensor, Comprising: 1st surface of the said transparent film is covered so that the said 1st transparent electrode and the said 1st wiring may be covered. 1st hardening process which forms the coating film of the ultraviolet curable resin composition for 1 adhesion layer, exposes the coating film of the said ultraviolet curable resin composition for 1st adhesion layers, and semi-hardens, The said 1st curing process After that, a coating film of the UV curable resin composition for the first hardness layer is formed on the semi-cured coating film of the UV curable resin composition for the first adhesion layer, and the UV curable property for the first hardness layer is formed. A second curing step of exposing and curing the coating film of the resin composition and the semi-cured ultraviolet curable resin composition for the first adhesion layer, and the other of the transparent film after the second curing step Covering the second transparent electrode and the second wiring on the surface of As described above, a third curing step of forming a coating film of the ultraviolet curable resin composition for the second adhesion layer and exposing and semi-curing the coating film of the ultraviolet curable resin composition for the second adhesion layer; After the third curing step, a coating film of the ultraviolet curable resin composition for the second hardness layer is formed on the semi-cured coating film of the ultraviolet curable resin composition for the second adhesion layer, and the second hardness A fourth curing step of exposing and curing the coating film of the ultraviolet curable resin composition for the layer and the semi-cured coating film of the ultraviolet curable resin composition for the second adhesion layer, and the first curing. The exposure amount in the step, the second curing step, the third curing step, and the fourth curing step is the sum of the first curing step, the second curing step, the third curing step, and the fourth curing step. The exposure amount is equal to or greater than the complete curing exposure amount of the coating film of the UV curable resin composition for the first adhesion layer. The total exposure amount of the second curing step, the third curing step, and the fourth curing step is equal to or greater than the complete curing exposure amount of the coating film of the ultraviolet curable resin composition for the first hardness layer, and the third curing step. And the total exposure amount of the fourth curing step is equal to or greater than the complete curing exposure amount of the coating film of the UV curable resin composition for the second adhesion layer, and the exposure amount of the fourth curing step is the UV light for the second hardness layer. It adjusts so that it may become more than the complete curing exposure amount of the coating film of curable resin composition, It is characterized by the above-mentioned.

The manufacturing method of the touch panel sensor of this embodiment will be described with reference to the drawings. 4A to 4E are process diagrams showing an example of a method for manufacturing a touch panel sensor according to the present embodiment.
First, as shown in FIG. 4A, the first transparent electrode 3a and the first wiring 4a are formed in a pattern on one surface, and the second transparent electrode 3b and the second wiring (not shown) are formed on the other surface. Prepare a transparent film 2 formed in a pattern.
Next, as shown in FIG. 4B, the coating film of the first adhesive layer ultraviolet curable resin composition so as to cover the first transparent electrode 3a and the first wiring 4a on one surface of the transparent film 2. 16a is formed, and the ultraviolet-ray 21 is irradiated and semi-cured to the coating film 16a of the ultraviolet curable resin composition for 1st contact | adherence layers (1st hardening process). Next, as shown in FIG. 4C, a coating film 17a of the first hardness layer UV curable resin composition is formed on the semi-cured coating film 16a of the first adhesion layer UV curable resin composition. Then, the ultraviolet ray 22 is irradiated to the coating film 16a of the ultraviolet curable resin composition for the first adhesion layer and the coating film 17a of the ultraviolet curable resin composition for the first hardness layer to be cured (second curing step).
Next, as shown in FIG.4 (d), the thermosetting resin composition for 2nd contact | adherence layers so that the 2nd transparent electrode 3b and 2nd wiring (not shown) may be covered on the other surface of the transparent film 2. FIG. The coating film 16b is formed, and the coating film 16b of the second adhesive layer thermosetting resin composition is irradiated with the ultraviolet ray 23 to be semi-cured (third curing step). Next, as shown in FIG. 4E, a coating film 17b of the second hardness layer UV curable resin composition is formed on the semi-cured coating film 16b of the second adhesive layer thermosetting resin composition. Then, the coating film 16b of the UV curable resin composition for the second adhesion layer and the coating film 17b of the UV curable resin composition for the second hardness layer are irradiated with the ultraviolet rays 24 to be cured (fourth curing step).
In the first curing step, the second curing step, the third curing step, and the fourth curing step, the exposure amount is the total exposure amount of the first curing step, the second curing step, the third curing step, and the fourth curing step. The UV curable resin composition for the first hardness layer is equal to or greater than the complete curing exposure amount of the coating film of the UV curable resin composition for one adhesion layer, and the total exposure amount in the second curing step, the third curing step, and the fourth curing step. The total curing exposure amount of the coating film of the product, and the total exposure amount of the third curing step and the fourth curing step is equal to or more than the complete curing exposure amount of the coating film of the UV curable resin composition for the second adhesion layer. It adjusts so that the exposure amount of a hardening process may become more than the complete hardening exposure amount of the coating film of the ultraviolet curable resin composition for 2nd hardness layers. Thereby, as illustrated in FIG. 2, the first overcoat layer 5 a in which the first adhesion layer 6 a and the first hardness layer 7 a are sequentially laminated on one surface of the transparent film 2 is formed, and the other of the transparent film 2 is formed. A second overcoat layer 5b in which the second adhesion layer 6b and the second hardness layer 7b are sequentially laminated is formed on the surface.

In addition, the “completely cured exposure amount” is a curve showing the relationship between the pencil hardness after the coating of the ultraviolet curable resin composition and the exposure amount, and is necessary for the pencil hardness to be a predetermined value or more. The minimum exposure amount.
About the pencil hardness after hardening of the coating film of an ultraviolet curable resin composition, it is the same as that of the hardness layer described in the above-mentioned item of "A. Touch panel sensor 1. Overcoat layer (2) Hardness layer".

  In this embodiment, since the transparent film has light transparency, when the exposure is performed from one side of the transparent film, the layer formed on the surface opposite to the exposure surface of the transparent film is also exposed. However, since the exposure amounts in the first curing step, the second curing step, the third curing step, and the fourth curing step are adjusted as described above, the first adhesion layer, the first hardness layer, and the second due to excessive exposure are adjusted. It is possible to suppress yellowing of the adhesion layer, deterioration of adhesion, and further curling.

Here, as described above, since the transparent film has light transmittance, when the exposure is performed from one side of the transparent film, the layer formed on the surface opposite to the exposure surface of the transparent film is also exposed. become. Therefore, the coating film of the ultraviolet curable resin composition for the first adhesion layer is exposed not only in the first curing step but also in the second curing step, the third curing step, and the fourth curing step, that is, exposed four times. Will be. Therefore, if the coating film of the UV curable resin composition for the first adhesion layer is completely cured by one exposure, the exposure amount to the coating film of the UV curable resin composition for the first adhesion layer is More than the completely cured exposure amount of the coating film of the ultraviolet curable resin composition for the first adhesion layer, it becomes excessive. Similarly, since the coating film of the ultraviolet curable resin composition for the first hardness layer is exposed not only in the second curing step but also in the third curing step and the fourth curing step, the ultraviolet ray for the first hardness layer is assumed. When the coating film of the curable resin composition is completely cured by one exposure, the amount of exposure to the coating film of the UV curable resin composition for the first hardness layer is the UV curable resin for the first hardness layer. More than the fully cured exposure amount of the coating film of the composition. Similarly, since the coating film of the UV curable resin composition for the second adhesion layer is exposed not only in the third curing process but also in the fourth curing process, the UV curable resin composition for the second adhesion layer is temporarily assumed. When the coating film is completely cured by one exposure, the exposure amount of the UV curable resin composition for the second adhesion layer to the coating film of the UV curable resin composition for the second adhesion layer is More than the fully cured exposure amount. Therefore, there is a concern about deterioration of the first adhesion layer, the first hardness layer, and the second adhesion layer due to excessive exposure.
On the other hand, in this embodiment, since the exposure amount in the first curing step, the second curing step, the third curing step, and the fourth curing step is adjusted as described above, the first adhesion layer, the first hardness layer In addition, excessive exposure to the second adhesion layer can be suppressed, and yellowing of the first adhesion layer, the first hardness layer, and the second adhesion layer, a decrease in adhesion, and the occurrence of curling can be suppressed.

  In this embodiment, since the ultraviolet curable resin composition is used for the first adhesion layer, the first hardness layer, the second adhesion layer, and the second hardness layer, the hardness can be increased.

  Furthermore, in this embodiment, since the adhesion layer and the hardness layer are sequentially laminated, an overcoat layer having excellent hardness and adhesion and capable of suppressing migration can be formed, and stable operation is possible. A touch panel sensor can be obtained.

Hereinafter, each process in the manufacturing method of the touch panel sensor of this embodiment is explained.
Since the transparent film, the transparent electrode and the formation method thereof, and the wiring and the formation method thereof are described in the above section “A. Touch panel sensor”, description thereof is omitted here.

(1) 1st hardening process The 1st hardening process in this embodiment is the application of the ultraviolet curable resin composition for 1st contact | adherence layers so that the 1st transparent electrode and 1st wiring may be covered on one surface of a transparent film. It is a step of forming a film and exposing and semi-curing the coating film of the UV curable resin composition for the first adhesion layer.

  In addition, about the ultraviolet curable resin composition for 1st contact | adherence layers, since it is the same as that of the ultraviolet curable resin composition described in the above-mentioned "A. Touch panel sensor 1. Overcoat layer" section, explanation here Omitted.

  The method for forming the coating film of the ultraviolet curable resin composition for the first adhesion layer is not particularly limited as long as it is a method capable of forming the first adhesion layer in a pattern, and the first of the first embodiment is not limited. This can be the same as the method for forming the coating film of the first thermosetting resin composition in the adhesion layer forming step.

When semi-curing the coating film of the UV curable resin composition for the first adhesion layer, the exposure amount is adjusted to be less than the complete curing exposure amount of the coating film of the UV curable resin composition for the first adhesion layer. To do.
The exposure amount may be less than the complete curing exposure amount of the coating film of the UV curable resin composition for the first adhesion layer, depending on the composition, semi-cured state, etc. of the UV curable resin composition for the first adhesion layer. Are appropriately selected. Specifically, it is preferable to adjust the exposure amount so that the coating film of the UV curable resin composition for the first adhesion layer is in a semi-cured state in which peeling due to curing shrinkage does not occur.

  In the first curing step and the second curing step described later, a protective film is applied to the other surface of the transparent film in order to protect the second transparent electrode and the second wiring formed on the other surface of the transparent film. Can do.

(2) Second curing step The second curing step in this embodiment is for the first hardness layer on the coating film of the first adhesive layer UV-curable resin composition semi-cured after the first curing step. A coating film of the UV curable resin composition is formed, and the coating film of the UV curable resin composition for the first hardness layer and the semi-cured coating film of the UV curable resin composition for the first adhesion layer are exposed. And curing.

  In addition, about the ultraviolet curable resin composition for 1st hardness layers, since it is the same as that of the ultraviolet curable resin composition described in the above-mentioned item of "A. Touch panel sensor 1. Overcoat layer", explanation here Omitted.

  The method for forming the coating film of the ultraviolet curable resin composition for the first hardness layer is not particularly limited as long as it is a method capable of forming the first hardness layer in a pattern, and the ultraviolet curing for the first adhesion layer is not limited. The method can be the same as the method for forming the coating film of the conductive resin composition.

  When curing the coating film of the UV curable resin composition for the first hardness layer and the semi-cured coating film of the UV curable resin composition for the first adhesion layer, the UV curable resin composition for the first hardness layer is cured. The coating film of the product and the coating film of the UV curable resin composition for the first adhesion layer may be semi-cured or may be completely cured. Among them, the coating film of the ultraviolet curable resin composition for the first hardness layer and the coating film of the ultraviolet curable resin composition for the first adhesion layer are semi-cured in the second curing step, and a third curing step described later. It is preferable to completely cure in the fourth curing step. This is because yellowing of the first adhesion layer and the first hardness layer, lowering of adhesion, and curling can be suppressed by ultraviolet irradiation.

  The amount of exposure is appropriately selected according to the state of curing the coating film of the UV curable resin composition for the first hardness layer and the coating film of the UV curable resin composition for the first adhesion layer. Among them, in order to suppress yellowing of the first adhesion layer and the first hardness layer due to ultraviolet irradiation, the exposure amount is less than the complete curing exposure amount of the coating film of the ultraviolet curable resin composition for the first hardness layer, And it is preferable to adjust so that the total exposure amount in a 1st hardening process and a 2nd hardening process may become less than the complete hardening exposure amount of the coating film of the ultraviolet curable resin composition for 1st contact | adherence layers. Specifically, the UV curable resin composition for the first hardness layer is such that the coating film of the UV curable resin composition for the first adhesion layer is in a semi-cured state to the extent that peeling due to curing shrinkage does not occur. It is preferable to adjust the exposure amount so that the coating film of the product is in a semi-cured state that does not have adhesiveness and does not cause peeling due to curing shrinkage.

(3) Third curing step In the third curing step in the present embodiment, after the second curing step, the second adhesion is performed so as to cover the second transparent electrode and the second wiring on the other surface of the transparent film. It is the process of forming the coating film of the ultraviolet curable resin composition for layers and exposing the coating film of the ultraviolet curable resin composition for the second adhesion layer to semi-curing.

  In addition, about the ultraviolet curable resin composition for 2nd contact | adherence layers, since it is the same as that of the ultraviolet curable resin composition described in the above-mentioned "A. Touch panel sensor 1. Overcoat layer" section, explanation here Omitted.

  The method for forming the coating film of the ultraviolet curable resin composition for the second adhesion layer is not particularly limited as long as it is a method capable of forming the second adhesion layer in a pattern, and the ultraviolet curing for the first adhesion layer is performed. The method can be the same as the method for forming the coating film of the conductive resin composition.

When semi-curing the coating film of the UV curable resin composition for the second adhesion layer, the exposure amount is adjusted to be less than the complete curing exposure amount of the coating film of the UV curable resin composition for the second adhesion layer. To do.
At this time, when the coating film of the ultraviolet curable resin composition for the first hardness layer and the coating film of the ultraviolet curable resin composition for the first adhesion layer are in a semi-cured state, the ultraviolet curable resin for the first hardness layer is used. The coating film of the resin composition and the coating film of the UV curable resin composition for the first adhesion layer may be semi-cured or may be completely cured. Among these, the coating film of the ultraviolet curable resin composition for the first hardness layer and the coating film of the ultraviolet curable resin composition for the first adhesion layer are semi-cured in the third curing step, and will be described later as a fourth curing step. It is preferable to completely cure by. This is because yellowing of the first adhesion layer and the first hardness layer, lowering of adhesion, and curling can be suppressed by ultraviolet irradiation.

  The exposure amount may be less than the complete curing exposure amount of the coating film of the UV curable resin composition for the second adhesion layer, and the composition or semi-cured state of the UV curable resin composition for the second adhesion layer, the first It is appropriately selected according to the state of curing the coating film of the ultraviolet curable resin composition for the hardness layer and the coating film of the ultraviolet curable resin composition for the first adhesion layer. Among them, in order to suppress yellowing of the first adhesion layer and the first hardness layer due to ultraviolet irradiation, the exposure amount is less than the complete curing exposure amount of the coating film of the ultraviolet curable resin composition for the second adhesion layer, The total exposure amount in the second curing step and the third curing step is less than the complete curing exposure amount of the coating film of the ultraviolet curable resin composition for the first hardness layer, and the first curing step, the second curing step, and the second curing step. It is preferable to adjust so that the total exposure amount in the 3 curing step is less than the complete curing exposure amount of the coating film of the ultraviolet curable resin composition for the first adhesion layer. Specifically, the UV curable resin composition for the first adhesion layer is formed so that the coating film of the UV curable resin composition for the second adhesion layer is in a semi-cured state to the extent that peeling due to curing shrinkage does not occur. The coating film of the UV curable resin composition for the first hardness layer has no tackiness so that the coating film is in a semi-cured state that does not cause peeling due to curing shrinkage. It is preferable to adjust the exposure amount so that the semi-cured state is such that no generation occurs.

  In the third curing step and the fourth curing step described later, in order to protect the first transparent electrode, the first wiring, the first adhesion layer, and the first hardness layer formed on one surface of the transparent film, A protective film can be attached to one side.

(4) Fourth curing step The fourth curing step in this embodiment is for the second hardness layer on the coating film of the UV curable resin composition for the second adhesion layer semi-cured after the third curing step. Forming a coating film of the UV curable resin composition, exposing the coating film of the UV curable resin composition for the second hardness layer and the semi-cured coating film of the UV curable resin composition for the second adhesion layer. And curing.

  In addition, about the ultraviolet curable resin composition for 2nd hardness layers, since it is the same as that of the ultraviolet curable resin composition described in the above-mentioned item of "A. Touch panel sensor 1. Overcoat layer", explanation here Omitted.

  The method for forming the coating film of the UV curable resin composition for the second hardness layer is not particularly limited as long as it is a method capable of forming the second hardness layer in a pattern, and the UV curing for the first adhesion layer is not limited. The method can be the same as the method for forming the coating film of the conductive resin composition.

  When the coating film of the UV curable resin composition for the second hardness layer and the coating film of the UV curable resin composition for the second adhesive layer that has been semi-cured are cured, the UV curable resin composition for the first hardness layer When the coating film and the coating film of the UV curable resin composition for the first adhesion layer are in a semi-cured state, the coating film of the UV curable resin composition for the first hardness layer and the UV curable composition for the first adhesion layer The coating film of the resin composition is completely cured.

  As the exposure amount, the total exposure amount of the first curing step, the second curing step, the third curing step, and the fourth curing step is equal to or greater than the complete curing exposure amount of the coating film of the UV curable resin composition for the first adhesion layer. The total exposure amount of the second curing step, the third curing step, and the fourth curing step is equal to or greater than the complete curing exposure amount of the coating film of the ultraviolet curable resin composition for the first hardness layer, and the third curing step and the fourth curing step. The total exposure amount of the process is equal to or greater than the complete curing exposure amount of the coating film of the UV curable resin composition for the second adhesion layer, and the exposure amount of the fourth curing process is the coating film of the UV curable resin composition for the second hardness layer. It may be adjusted so as to be equal to or greater than the complete curing exposure amount. Composition of UV curable resin composition for second hardness layer, UV curable resin composition for first adhesion layer, UV curable resin composition for first hardness layer, and UV curable resin composition for second adhesion layer It is suitably selected according to the composition, the cured state, and the like.

  When adjusting the exposure amount to the coating film of the UV curable resin composition for the first adhesion layer and the coating film of the UV curable resin composition for the first hardness layer, the transparent film, the first transparent electrode, and the second It can be appropriately determined in consideration of the transmittance of the transparent electrode and the like.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

  The following examples illustrate the present invention in more detail.

[Reference Example 1]
(Preparation of transparent film)
A 300 mm × 400 mm, 100 μm thick PET substrate (manufactured by Toray Industries, Inc., Lumirror T60) was prepared as a resin substrate, and washed with water so that the surface was cleaned.

Next, an undercoat layer-forming coating in which 100 parts by weight of an acrylate compound (tetrafunctional acrylate) (Aronix M405, manufactured by Toagosei Co., Ltd.) and 5 parts by weight of Irgacure 184 (manufactured by Ciba Specialty Chemicals) were dissolved in isobutyl alcohol A working solution was prepared. The undercoat layer-forming coating solution is applied onto the resin substrate by the bar coating method (manufactured by Matsuo Sangyo Co., Ltd., K303 Multicoater) to form a coating film, and ultraviolet (wavelength 365 nm, irradiation energy) is applied to the coating film. The undercoat layer (thickness 1 μm) was formed by irradiating 300 mJ / m ² ) and curing the coating film.

Next, silicon dioxide (SiO ₂ ) was sputtered on the undercoat layer (manufactured by ULVAC, Inc., a small sputtering device) to form a silicon dioxide film, which was used as an adhesion improving layer. The thickness of the adhesion improving layer made of the silicon dioxide film was 30 nm.

  Thus, the transparent film in which the undercoat layer and the adhesion improving layer were formed on one side of the resin base material was obtained.

(Formation of transparent electrodes and wiring)
The transparent electrode and the wiring were formed in the pattern shown in FIG.
First, a transparent electrode conductive layer having a thickness of 30 nm was formed on almost the entire surface of the transparent film on the adhesion improving layer side by sputtering using ITO. Subsequently, an APC material containing silver, palladium, and copper was prepared, and a conductive layer for wiring having a thickness of 100 nm was formed on almost the entire surface of the conductive layer for transparent electrode by sputtering.

Next, a positive photosensitive material (manufactured by AZ Materials) was applied to substantially the entire surface of the conductive layer for wiring to form a resist layer having a thickness of 1 μm. And the photomask corresponding to the pattern of a transparent electrode and the pattern of wiring following this was arrange | positioned on the resist layer. Subsequently, ultraviolet rays (wavelength 365 nm, irradiation energy 100 mJ / m ² ) were irradiated to pattern-expose the resist layer. Thereafter, the photomask was removed, the resist layer was developed, the resist layer was patterned with a transparent electrode and wiring formation pattern, and unnecessary resist layers were removed. Subsequently, using the patterned resist layer as a mold, the conductive layer for wiring and the conductive layer for transparent electrode were etched with an acidic solvent. Thereafter, the resist layer was removed.

  Next, a region other than the active area was covered with a resist layer, and the wiring conductive layer was etched to remove the wiring conductive layer remaining on the transparent electrode conductive layer in the active area. In this way, transparent electrodes and wirings were formed.

(Formation of overcoat layer)
(Formation of adhesion layer)
Next, an adhesion layer was formed in a pattern by a screen printing method in a region including the active area other than the external connection region so as to cover the wiring and the transparent electrode. For the adhesion layer, a thermosetting resin composition mainly composed of an epoxy resin which is cured by oven heating and changes its physical properties slightly by UV irradiation but has high adhesion to a transparent film was used. The color change due to UV irradiation was ensured by reducing the thickness of the adhesion layer to 1 μm or less.

(Formation of hardness layer)
Next, a hardness layer was formed on the adhesion layer in the same pattern as the adhesion layer by screen printing. For the hardness layer, a UV curable resin composition which was cured by UV irradiation and was mainly composed of a UV curable acrylic resin having a high surface hardness was used. At the time of curing, the exposure amount was set such that peeling due to curing shrinkage did not occur and the surface hardness was increased.
In this way, a touch panel sensor was produced.

[Comparative Example 1]
In the formation of the overcoat layer, a touch panel sensor was produced in the same manner as in Reference Example 1 except that only the adhesion layer was formed and the hardness layer was not formed.

[Comparative Example 2]
In the formation of the overcoat layer, a touch panel sensor was produced in the same manner as in Reference Example 1 except that only the hardness layer was formed and no adhesion layer was formed.

[Evaluation 1]
(Adhesion)
For the touch panel sensors of Reference Example 1 and Comparative Examples 1 and 2, 100 cross-cuts with a 1 mm gap were attached with a cross-cut tape method specified by ASTM D3359, that is, a cutter, and a peel test was performed using an adhesive tape.

(hardness)
About the touch panel sensor of the reference example 1 and the comparative examples 1 and 2, pencil hardness was measured according to the specification of JISK5600-5-4. The measurement conditions were a load: 750 g and a speed: 1 mm / sec.

(Ion migration)
About the touch panel sensor of the reference example 1 and the comparative examples 1 and 2, the presence or absence of generation | occurrence | production of ion migration was measured and evaluated.
That is, the touch panel sensor is connected to an insulation deterioration evaluation system SIR-12 manufactured by Enomoto Kasei Co., Ltd., and a constant temperature and humidity chamber (constant temperature and humidity tester ETAC Division HIFLEX FH14PH) ). At this time, the temperature and humidity chamber was set to a temperature of 60 ° C. and a relative humidity of 90% RH. A direct current was applied to the touch panel sensor so that a potential difference (3.3 V) was generated between adjacent wirings in the wiring formed on the display surface side. That is, direct-current voltages were alternately applied to wirings adjacent to each other in the order of 0 V, 3.3 V, 0 V, 3.3 V,. In this state, the touch panel sensor was left for 240 hours, and the insulation resistance value between the wirings was monitored by the insulation deterioration evaluation system. In principle, the monitoring pattern is to measure the insulation resistance value once every second. If the insulation resistance value falls below 1.0 × 10 ⁶ (Ω) (threshold), insulation is performed once every 0.2 seconds. The pattern was such that the resistance value was measured.
If ion migration occurs, the insulation resistance value between the wirings decreases, so that the occurrence of ion migration can be confirmed by this monitoring.

In the above test, (1) when the insulation resistance value was measured as a value lower than 1.0 × 10 ⁶ (Ω), it was determined that ion migration occurred once. In addition, (2) when the measurement with an insulation resistance value of 1.0 × 10 ⁶ (Ω) or less reached 200 times in total, the measurement was stopped. (3) When a current of 327 μA or more (1.0 × 10 ⁴ (Ω) or less) was measured and a short circuit was observed between the wires, the measurement was stopped.
A case where none of the above (1), (2) and (3) was confirmed was evaluated as good, and a case where any of the above (1), (2) and (3) was confirmed as poor. evaluated.
The results are shown in Table 1.

  In the touch panel sensor of Reference Example 1 in which the adhesion layer and the hardness layer were laminated, the overcoat layer had good adhesion, high surface hardness, and no occurrence of migration.

[Reference Example 2]
The touch panel sensors of Reference Example 1 and Comparative Examples 1 and 2 were irradiated with ultraviolet rays with different exposure amounts, and evaluated for adhesion, hardness, and yellowness.
In addition, it was set as the method similar to the above about evaluation of adhesiveness and hardness.

(Yellowness)
Using the devices UV3100 and MPC3100 manufactured by Shimadzu Corporation, the spectrum was measured and the yellowness was calculated.
The results are shown in Table 2.

[Example 1]
(Preparation of transparent film)
A 300 mm × 400 mm, 100 μm thick PET substrate (manufactured by Toray Industries, Inc., Lumirror T60) was prepared as a resin substrate, and washed with water so that the surface was cleaned.

Next, an undercoat layer-forming coating in which 100 parts by weight of an acrylate compound (tetrafunctional acrylate) (Aronix M405, manufactured by Toagosei Co., Ltd.) and 5 parts by weight of Irgacure 184 (manufactured by Ciba Specialty Chemicals) were dissolved in isobutyl alcohol A working solution was prepared. The undercoat layer forming coating solution is applied to one surface of the resin base material by a bar coating method (manufactured by Matsuo Sangyo Co., Ltd., K303 Multicoater) to form a coating film, and ultraviolet (wavelength 365 nm) is applied to the coating film. The undercoat layer (thickness 1 μm) was formed by curing the coating film by irradiation with irradiation energy of 300 mJ / m ² . After the undercoat layer was formed on one side of the resin base material, it was formed in the same manner on the opposite side.

Next, silicon dioxide (SiO ₂ ) is sputtered on both sides of the resin base material on which the undercoat layer is formed (manufactured by ULVAC, Inc., a small sputtering device) to form a silicon dioxide film, which improves adhesion. Layered. The thickness of the adhesion improving layer made of the silicon dioxide film was 30 nm.

  Thus, the transparent film in which the undercoat layer and the adhesion improving layer were formed on both surfaces of the resin base material was obtained. In addition, in the transparent film, it designed so that a touch panel sensor could take 12 surfaces, and it produced it as follows, and made the arbitrary one of them into the touch panel sensor used for Example 1. FIG.

(Formation of first transparent electrode, second transparent electrode, first wiring and second wiring)
The 1st transparent electrode, the 2nd transparent electrode, the 1st wiring, and the 2nd wiring were formed with the pattern shown in Drawing 1 (a) and (b). Each of the first transparent electrode and the second transparent electrode has a stripe shape, and was patterned so as to extend in a direction substantially orthogonal to each other in plan view.

  First, a transparent electrode conductive layer having a thickness of 30 nm was formed on almost the entire surface of the transparent film by sputtering using ITO. Subsequently, an APC material containing silver, palladium, and copper was prepared, and a conductive layer for wiring having a thickness of 100 nm was formed on almost the entire surface of the conductive layer for transparent electrode by sputtering.

Next, a positive photosensitive material (manufactured by AZ Materials) was applied to substantially the entire surface of the conductive layer for wiring to form a resist layer having a thickness of 1 μm. Then, on one surface side of the transparent film, a photomask corresponding to the pattern of the first transparent electrode and the pattern of the first wiring continuous therewith was disposed on the resist layer. Further, on the other surface side of the transparent film, a photomask corresponding to the pattern of the second transparent electrode and the pattern of the second wiring continuous thereto was disposed on the resist layer. Subsequently, ultraviolet light (wavelength 365 nm, irradiation energy 100 mJ / m ² ) was irradiated from both sides of the transparent film as exposure light, and the resist layer was pattern-exposed simultaneously on both sides of the transparent film. Thereafter, the photomask was removed, the resist layer was developed, the resist layer was patterned with the formation pattern of the first transparent electrode, the second transparent electrode, the first wiring, and the second wiring, and the unnecessary resist layer was removed. Subsequently, using the patterned resist layer as a mold, the conductive layer for wiring and the conductive layer for transparent electrode were etched with an acidic solvent. Thereafter, the resist layer was removed.

Next, a region other than the active area was covered with a resist layer, and the wiring conductive layer was etched to remove the wiring conductive layer remaining on the transparent electrode conductive layer in the active area. Thus, the 1st transparent electrode, the 2nd transparent electrode, the 1st wiring, and the 2nd wiring were formed.
As shown in FIGS. 1A and 1B, the first transparent electrode and the second transparent electrode have a stripe-shaped pattern extending in the X direction and the Y direction. A pattern in which the electrode and the second transparent electrode are substantially orthogonal is used.

(Lamination of second protective film)
Next, a protective film (fixed film manufactured by Fuji Copian) was bonded to substantially the entire surface on the second transparent electrode side using a roller.

(Formation of first overcoat layer)
(Formation of first adhesion layer)
Next, a first adhesion layer was formed in a pattern by a screen printing method in a region including the active area other than the external connection region so as to cover the first wiring and the first transparent electrode. For the first adhesion layer, a thermosetting resin composition mainly composed of an epoxy resin that is cured by oven heating and slightly changes in physical properties by UV irradiation but has high adhesion to a transparent film was used. The color change due to UV irradiation was ensured by reducing the thickness of the first adhesion layer to 1 μm or less.

(Formation of the first hardness layer)
Next, a first hardness layer was formed on the first adhesion layer in the same pattern as the first adhesion layer by screen printing. For the first hardness layer, a UV curable resin composition which was cured by UV irradiation and mainly composed of a UV curable acrylic resin having a high surface hardness was used. The first hardness layer was cured by UV irradiation to such an extent that surface tackiness disappeared, and the surface hardness was low enough to prevent peeling due to curing shrinkage. The exposure amount was determined based on the results shown in Table 2 in Reference Example 2.

(Peeling of the second protective film and bonding of the first protective film)
Subsequently, a protective film was bonded to the first transparent electrode side in the same manner as the bonding of the second protective film. And the transparent film was reversed, the edge part of the 2nd protective film was lifted in the substantially perpendicular direction with respect to the transparent film surface, and the 2nd protective film was peeled. In addition, the 1st protective film was formed in order to prevent the damage in the post process of the 1st overcoat layer formed in the 1st transparent electrode side.

(Formation of second overcoat layer)
The second adhesive layer and the second hardness layer are formed on the second transparent electrode side in the same manner as the first adhesive layer and the first hardness layer on the second transparent electrode side, and the second overcoat layer did. At that time, the exposure amount at the time of forming the second hardness layer was set such that peeling due to curing shrinkage did not occur and the surface hardness was increased. At this time, the previously formed first hardness layer was also irradiated with UV, no peeling due to curing shrinkage occurred, and the surface hardness was high.

(Peeling of the first protective film)
Then, the edge part of the 1st protective film was lifted in the substantially perpendicular direction with respect to the transparent film surface, and the 1st protective film was peeled off.
In this way, a touch panel sensor was produced.

[Evaluation 2]
About the touchscreen sensor of Example 1, adhesiveness, hardness, and yellowness were evaluated by the above-mentioned method.
The results are shown in Table 3.

  In the touch panel sensor of Example 1, the overcoat layer had good adhesion, high surface hardness, and little yellowing.

DESCRIPTION OF SYMBOLS 1 ... Touch panel sensor 2 ... Transparent film 3a ... 1st transparent electrode 3b ... 2nd transparent electrode 4a ... 1st wiring 4b ... 2nd wiring 5a ... 1st overcoat layer 5b ... 2nd overcoat layer 6a ... 1st adhesion layer 6b ... 2nd adhesion layer 7a ... 1st hardness layer 7b ... 2nd hardness layer 16a ... Coating film of the ultraviolet curable resin composition for 1st adhesion layers 16b ... Coating film of the ultraviolet curable resin composition for 2nd adhesion layers 17a: Coating film of UV curable resin composition for first hardness layer 17b: Coating film of UV curable resin composition for second hardness layer 17A: Coating film of first UV curable resin composition 17B: Second UV radiation Coating film of curable resin composition 21, 22, 23, 24 ... UV

Claims (4)

A transparent film,
A first transparent electrode formed in a pattern on one surface of the transparent film;
A first wiring formed in a pattern on one surface of the transparent film and connected to the first transparent electrode;
A first overcoat layer formed on one surface of the transparent film so as to cover the first transparent electrode and the first wiring;
A second transparent electrode formed in a pattern on the other surface of the transparent film;
A second wiring formed in a pattern on the other surface of the transparent film and connected to the second transparent electrode;
A second overcoat layer formed on the other surface of the transparent film so as to cover the second transparent electrode and the second wiring,
The first overcoat layer is formed on one surface of the transparent film so as to cover the first transparent electrode and the first wiring, contains a first adhesion layer resin, and has a migration suppressing function. An adhesion layer, and a first hardness layer formed on the first adhesion layer and containing a first hardness layer resin;
The second overcoat layer is formed on the other surface of the transparent film so as to cover the second transparent electrode and the second wiring, contains a second adhesion layer resin, and has a migration suppressing function. A touch panel sensor comprising: an adhesion layer; and a second hardness layer formed on the second adhesion layer and containing a second hardness layer resin.   The first adhesion layer resin and the second adhesion layer resin are thermosetting resins, and the first hardness layer resin and the second hardness layer resin are ultraviolet curable resins. The touch panel sensor according to claim 1. It is a manufacturing method of the touch panel sensor according to claim 1 or 2,
A first thermosetting resin composition coating film is formed on one surface of the transparent film so as to cover the first transparent electrode and the first wiring, and thermally cured to form a first adhesion layer. 1 adhesion layer forming step;
After the first adhesion layer forming step, a first hardness layer forming step of forming a first hardness layer by forming a coating film of the first ultraviolet curable resin composition on the first adhesion layer, photocuring, and
After the first hardness layer forming step, a coating film of the second thermosetting resin composition is formed on the other surface of the transparent film so as to cover the second transparent electrode and the second wiring, and is thermally cured. A second adhesion layer forming step of forming a second adhesion layer;
After the second adhesion layer forming step, a second hardness layer forming step of forming a second hardness layer by forming a coating film of the second ultraviolet curable resin composition on the second adhesion layer and photocuring it. A method for manufacturing a touch panel sensor, comprising: It is a manufacturing method of the touch panel sensor according to claim 1 or 2,
A coating film of the UV curable resin composition for the first adhesion layer is formed on one surface of the transparent film so as to cover the first transparent electrode and the first wiring, and the UV curable property for the first adhesion layer is formed. A first curing step of exposing and semi-curing the coating film of the resin composition;
After the first curing step, a coating film of the UV curable resin composition for the first hardness layer is formed on the semi-cured coating film of the UV curable resin composition for the first adhesion layer, and the first hardness A second curing step of exposing and curing the coating film of the ultraviolet curable resin composition for layers and the semi-cured coating film of the ultraviolet curable resin composition for the first adhesion layer;
After the second curing step, a coating film of an ultraviolet curable resin composition for a second adhesion layer is formed on the other surface of the transparent film so as to cover the second transparent electrode and the second wiring, A third curing step of exposing and semi-curing the coating film of the ultraviolet curable resin composition for two adhesion layers;
After the third curing step, a coating film of the UV curable resin composition for the second hardness layer is formed on the semi-cured coating film of the UV curable resin composition for the second adhesion layer, and the second hardness And a fourth curing step of exposing and curing the coating film of the ultraviolet curable resin composition for layers and the semi-cured coating film of the ultraviolet curable resin composition for the second adhesion layer, and the first curing The amount of exposure in the process, the second curing process, the third curing process, and the fourth curing process is the sum of the first curing process, the second curing process, the third curing process, and the fourth curing process. The exposure amount is equal to or greater than the complete curing exposure amount of the coating film of the first adhesive layer ultraviolet curable resin composition, and the total exposure amount of the second curing step, the third curing step, and the fourth curing step is the first exposure amount. 1 It is more than the complete curing exposure of UV curable resin composition for hardness layer The total exposure amount of the third curing step and the fourth curing step is equal to or greater than the complete curing exposure amount of the coating film of the UV curable resin composition for the second adhesion layer, and the exposure amount of the fourth curing step is the above A method for producing a touch panel sensor, which is adjusted so as to be equal to or greater than a complete curing exposure amount of the coating film of the ultraviolet curable resin composition for the second hardness layer.

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