JP2013139111A - Processing device for processing resin molding and method for manufacturing processed product - Google Patents

Processing device for processing resin molding and method for manufacturing processed product Download PDF

Info

Publication number
JP2013139111A
JP2013139111A JP2012000344A JP2012000344A JP2013139111A JP 2013139111 A JP2013139111 A JP 2013139111A JP 2012000344 A JP2012000344 A JP 2012000344A JP 2012000344 A JP2012000344 A JP 2012000344A JP 2013139111 A JP2013139111 A JP 2013139111A
Authority
JP
Japan
Prior art keywords
pressing
processing
processing target
melting
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012000344A
Other languages
Japanese (ja)
Inventor
Seiya Harayama
静也 原山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2012000344A priority Critical patent/JP2013139111A/en
Publication of JP2013139111A publication Critical patent/JP2013139111A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a technology which can increase the processing accuracy of a processing target of resin molding.SOLUTION: A processing device includes: a pressing part that is heated and presses the processing target region of the resin molding to melt the part; a drive unit for moving the pressing part toward the processing target region; and a control unit for controlling the processing device. The control unit calculates a melting starting point at which the processing target region starts to be melted based on a displacement rate of displacement caused in the pressing part, presses the pressing part ahead by a predetermined amount with respect to the processing target region based on a reference position where the pressing part is positioned at the time of melting starting point and then stops the movement of the pressing part moving toward the processing target region.

Description

本発明は、樹脂成型品を加工する加工装置、及び、樹脂成型品の加工品の製造方法に関する。   The present invention relates to a processing apparatus for processing a resin molded product, and a method for manufacturing a processed product of a resin molded product.

従来から、樹脂成型品の加工対象部位に対して加熱した押圧部を押し当てて加工する技術が知られている(例えば、特許文献1、2)。例えば、特許文献1の技術では、熱可塑性樹脂製の部品に設けられた突起部に対して加熱した押圧部を押し当てることで、突起部を溶融させて熱変形させている。   2. Description of the Related Art Conventionally, techniques for processing by pressing a heated pressing portion against a processing target portion of a resin molded product are known (for example, Patent Documents 1 and 2). For example, in the technique of Patent Document 1, the protrusion is melted and thermally deformed by pressing a heated pressing portion against a protrusion provided on a thermoplastic resin component.

特開2008−155487号公報JP 2008-155487 A 特開2008−168437号公報JP 2008-168437 A

ここで、従来、樹脂成型品の加工対象部位を加熱溶融する際に、目標とする溶融高さに精度良く加工することが困難な場合があった。ここで、溶融高さとは、溶融前の加工対象部位の高さ(長さ)から溶融後の加工対象部位の高さ(長さ)を指し引いた値であり、実際に加工対象部位が溶けた高さ(長さ)を表す。   Here, conventionally, when a part to be processed of a resin molded product is heated and melted, it may be difficult to accurately process the target melt height. Here, the melting height is a value obtained by subtracting the height (length) of the processing target part after melting from the height (length) of the processing target part before melting, and the processing target part actually melts. Represents the height (length).

加工対象部位を目標とする溶融高さに精度良く加工できない場合、加工品の品質に影響を与える恐れがある。例えば、突起部の先端部を溶融させることで先端部の径を大きくし、突起部に他の部品を取り付ける場合、実際の加工品の高さが目標とする溶融高さよりも小さいと、他の部品が突起部から抜けてしまう恐れがある。   If it is not possible to accurately process the melt height targeted for the part to be processed, the quality of the processed product may be affected. For example, when the diameter of the tip is increased by melting the tip of the protrusion and other parts are attached to the protrusion, if the actual height of the processed product is smaller than the target melt height, There is a risk that the part may come off the protrusion.

本発明者らは、加工対象部位を押圧して溶融する際に、加工対象部位に弾性変形が生じることが、目標とする溶融高さに加工できない原因の1つであることを見出した。すなわち、押圧部が加工対象部位を押圧した直後の段階では、押圧部の変位量は主に加工対象部位が弾性変形したことに起因し、その後に生じる押圧部の変位量は主に加工対象部位が溶融したことに起因することを見出した。よって、加工対象部位を押圧してからの押圧部の変位量を溶融高さとした場合、目標とする溶融高さに精度良く加工できない可能性がある。   The inventors of the present invention have found that elastic deformation at the processing target part when pressing the processing target part is one of the reasons that the target melting height cannot be processed. That is, at the stage immediately after the pressing part presses the processing target part, the displacement amount of the pressing part is mainly caused by the elastic deformation of the processing target part, and the displacement amount of the pressing part generated thereafter is mainly the processing target part. Was found to be caused by melting. Therefore, when the displacement amount of the pressing part after pressing the part to be processed is the melt height, there is a possibility that the target melt height cannot be processed with high accuracy.

上記に挙げたような問題は、突起部を加熱溶融して熱カシメするための加工装置に限らず、樹脂成型品の加工対象部位に対して加熱された押圧部を押圧することで溶融させて加工する加工装置に共通する問題であった。   The above-mentioned problems are not limited to the processing apparatus for heating and melting the protrusions and crimping them, but are melted by pressing the heated pressing part against the processing target part of the resin molded product. This was a problem common to the processing equipment to be processed.

従って、本発明は、樹脂成型品の加工対象部位の加工精度を向上できる技術を提供することを目的とする。   Therefore, an object of this invention is to provide the technique which can improve the processing precision of the process target site | part of a resin molded product.

本発明は、上記の課題の少なくとも一部を解決するためになされたものであり、以下の形態または適用例として実現することができる。   SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[適用例1]樹脂成型品を加工する加工装置であって、
加熱され、前記樹脂成型品の加工対象部位を押圧することで溶融させる押圧部と、
前記押圧部を前記加工対象部位に向かって移動させる駆動部と、
前記加工装置を制御する制御部と、を備え、
前記制御部は、
前記押圧部が変位する変位割合に基づいて、前記加工対象部位の溶融が開始した時点である溶融開始点を算出し、
前記溶融開始点における前記押圧部の位置である基準位置に基づいて、前記押圧部を前記加工対象部位に対して所定量押し進めた後に、前記加工対象部位に向かう前記押圧部の移動を停止する、加工装置。
適用例1に記載の加工装置によれば、溶融開始点を算出し、溶融開始点における押圧部の位置である基準位置に基づいて押圧部を所定量押し進めている。これにより、所定量を溶融高さとして扱うことで、加工対象部位の加工精度を向上できる。すなわち、加工装置は、加工対象部位の弾性変形によって生じる押圧部の変位量を考慮した加工を加工対象部位に施すことができる。
[Application Example 1] A processing apparatus for processing a resin molded product,
A pressing portion that is heated and melted by pressing a portion to be processed of the resin molded product;
A drive unit for moving the pressing unit toward the processing target site;
A control unit for controlling the processing apparatus,
The controller is
Based on the displacement rate at which the pressing portion is displaced, calculate a melting start point that is a point in time when melting of the processing target site is started,
Based on a reference position that is the position of the pressing portion at the melting start point, after the pressing portion has been pushed a predetermined amount against the processing target portion, the movement of the pressing portion toward the processing target portion is stopped. Processing equipment.
According to the processing apparatus described in Application Example 1, the melting start point is calculated, and the pressing portion is pushed by a predetermined amount based on the reference position that is the position of the pressing portion at the melting start point. Thereby, the processing precision of a process target site | part can be improved by handling predetermined amount as melt | dissolution height. That is, the processing apparatus can perform processing on the processing target portion in consideration of the displacement amount of the pressing portion caused by elastic deformation of the processing target portion.

[適用例2]適用例1に記載の加工装置であって、
前記制御部は、前記加工対象部位の溶融高さであって、前記押圧部の移動方向に沿った長さである溶融高さを前記所定量として利用者から受け付け可能であり、
前記所定量は、前記基準位置から前記押圧部が前記加工対象部位に対して押し込まれる位置までの長さである、加工装置。
適用例2に記載の加工装置によれば、基準位置から押し込まれる位置までの長さを所定量とすることで、目標とする溶融高さに精度良く加工対象部位を加工することができる。
[Application Example 2] The processing apparatus according to Application Example 1,
The control unit is capable of receiving from the user the melt height that is the melt height of the processing target portion and that is the length along the moving direction of the pressing portion as the predetermined amount,
The said predetermined amount is a processing apparatus which is the length from the said reference position to the position where the said press part is pushed with respect to the said process target site | part.
According to the processing apparatus described in the application example 2, by setting the length from the reference position to the pushed-in position to a predetermined amount, it is possible to accurately process the processing target portion to the target melt height.

[適用例3]適用例1又は適用例2に記載の加工装置であって、
前記制御部は、
前記押圧部を押し進めるための第1の推力を条件として含む第1の条件を用いて前記加工対象部位を前記押圧部によって押圧すると共に、前記変位割合を算出し、
前記第1の条件下での前記変位割合が第1の閾値以下となった時点に基づいて、前記溶融開始点を算出する、加工装置。
適用例3に記載の加工装置によれば、変位割合に基づいて溶融開始点を容易に算出することができる。
[Application Example 3] The processing apparatus according to Application Example 1 or Application Example 2,
The controller is
While pressing the processing object part by the pressing part using a first condition including a first thrust for pushing the pressing part as a condition, the displacement ratio is calculated,
A processing apparatus that calculates the melting start point based on a point in time when the displacement ratio under the first condition becomes equal to or less than a first threshold value.
According to the processing apparatus described in Application Example 3, the melting start point can be easily calculated based on the displacement ratio.

[適用例4]適用例3に記載に記載の加工装置であって、
前記制御部は、
前記押圧部を押し進めるための第2の推力であって前記第1の推力よりも低い第2の推力を条件として含む第2の条件を用いて、離れて配置された前記加工対象部位に対し前記押圧部を前記加工対象部位に向かって押し進めつつ、前記変位割合を算出し、
前記第2の条件下での前記変位割合が第2の閾値以下となった時点に基づいて、前記押圧部が前記加工対象部位に接触した接触点を算出し、
前記接触点を算出した後に、前記第1の条件を用いて前記加工対象部位を前記押圧部によって押圧する、加工装置。
適用例4に記載の加工装置によれば、第1の条件を用いて加工対象部位を押圧する前に接触点を算出している。これにより、樹脂成型品ごとに押圧部が加工対象部位に接触した時点を基準として、加工対象部位を溶融するための第1の条件を用いた加工を施すことができる。また、接触点における押圧部の位置を算出することで、複数製造される樹脂成型品ごとの加工対象部位の形状のばらつきを把握することができる。
[Application Example 4] The processing apparatus according to Application Example 3,
The controller is
The second thrust for pushing the pressing portion forward and including a second thrust that is lower than the first thrust as a condition, the processing target portion arranged at a distance from the second thrust While pushing the pressing part toward the part to be processed, the displacement ratio is calculated,
Based on the time point when the displacement ratio under the second condition is equal to or less than a second threshold value, the contact point where the pressing portion is in contact with the processing target site is calculated,
The processing apparatus which presses the said process target site | part by the said press part using the said 1st condition after calculating the said contact point.
According to the processing apparatus described in the application example 4, the contact point is calculated before the processing target portion is pressed using the first condition. Thereby, the process using the 1st conditions for melting a processing object part on the basis of the time when the press part contacted the process object part for every resin molded product can be given. In addition, by calculating the position of the pressing portion at the contact point, it is possible to grasp the variation in the shape of the part to be processed for each of a plurality of resin molded products manufactured.

[適用例5]樹脂成型品の加工対象部位を、加工装置が備える押圧部であって加熱した押圧部によって押圧することで溶融させて前記樹脂成型品の加工品を製造する製造方法であって、
前記加工対象部位を前記押圧部によって押圧し、前記押圧部が変位する変位割合に基づいて、前記加工対象部位の溶融が開始した時点である溶融開始点を算出する溶融点算出工程と、
前記溶融点算出工程の後に、前記溶融開始点における前記押圧部の位置である基準位置に基づいて、前記押圧部を前記加工対象部位に対して所定量押し進めた後に、前記加工対象部位に向かう前記押圧部の移動を停止する溶融工程と、を備える、製造方法。
適用例5に記載の製造方法によれば、溶融開始点を算出し、溶融開始点における押圧部の位置である基準位置に基づいて押圧部を所定量押し進めている。これにより、所定量を溶融高さとして扱うことで、加工対象部位の加工精度を向上できる。すなわち、加工装置は、加工対象部位の弾性変形によって生じる押圧部の変位量を考慮した加工を加工対象部位に施すことができる。
Application Example 5 A manufacturing method for manufacturing a processed product of a resin molded product by melting a processing target portion of a resin molded product by pressing it with a heated pressing unit provided in a processing apparatus. ,
A melting point calculating step of calculating a melting start point, which is a time point at which melting of the processing target portion starts, based on a displacement ratio in which the processing target portion is pressed by the pressing portion and the pressing portion is displaced;
After the melting point calculation step, based on a reference position that is the position of the pressing portion at the melting start point, the pressing portion is pushed forward by a predetermined amount with respect to the processing target portion, and then heads toward the processing target portion. And a melting step for stopping the movement of the pressing portion.
According to the manufacturing method described in Application Example 5, the melting start point is calculated, and the pressing portion is pushed by a predetermined amount based on the reference position that is the position of the pressing portion at the melting start point. Thereby, the processing precision of a process target site | part can be improved by handling predetermined amount as melt | dissolution height. That is, the processing apparatus can perform processing on the processing target portion in consideration of the displacement amount of the pressing portion caused by elastic deformation of the processing target portion.

[適用例6]適用例5に記載の製造方法であって、
前記加工装置は、前記加工対象部位の溶融高さであって、前記押圧部の移動方向に沿った長さである溶融高さを前記所定量として受け付け可能であり、
前記所定量は、前記溶融開始点における前記押圧部の位置から前記押圧部が前記加工対象部位に押し込まれる位置までの長さである、製造方法。
適用例6に記載の製造方法によれば、基準位置から前記押し込まれる位置までの長さを所定量とすることで、目標とする溶融高さに精度良く加工対象部位を加工することができる。
[Application Example 6] The manufacturing method according to Application Example 5,
The processing device is capable of receiving the melt height as the predetermined amount, which is the melt height of the part to be processed and is a length along the moving direction of the pressing portion,
The predetermined amount is a length from a position of the pressing portion at the melting start point to a position where the pressing portion is pressed into the processing target portion.
According to the manufacturing method described in Application Example 6, by setting the length from the reference position to the pushed-in position as a predetermined amount, it is possible to process the processing target portion with high accuracy to the target melt height.

[適用例7]適用例5又は適用例6に記載の製造方法であって、
前記溶融点算出工程は、
前記押圧部を押し進めるための第1の推力を条件として含む第1の条件を用いて前記加工対象部位を前記押圧部によって押圧すると共に、前記変位割合を算出し、
前記第1の条件下での前記変位割合が第1の閾値以下となった時点に基づいて、前記溶融開始点を算出する、製造方法。
適用例7に記載の製造方法によれば、変位割合に基づいて溶融開始点を容易に算出できる。
[Application Example 7] The manufacturing method according to Application Example 5 or Application Example 6,
The melting point calculation step includes
While pressing the processing object part by the pressing part using a first condition including a first thrust for pushing the pressing part as a condition, the displacement ratio is calculated,
The manufacturing method of calculating the melting start point based on a time point when the displacement ratio under the first condition becomes equal to or less than a first threshold value.
According to the manufacturing method described in Application Example 7, the melting start point can be easily calculated based on the displacement ratio.

[適用例8]適用例7に記載の製造方法であって、さらに、
前記溶融点算出工程の前に、前記押圧部と離れて配置された前記加工対象部位に向かって前記押圧部を移動させて、前記押圧部が前記加工対象部位に接触した時点である接触点を算出する接触点算出工程を含み、
前記接触点算出工程は、
前記押圧部を押し進めるための第2の推力であって前記第1の推力よりも低い第2の推力を条件として含む第2の条件を用いて前記押圧部を前記加工対象部位に向かって押し進めると共に、前記変位割合を算出し、
前記第2の条件下での前記変位割合が第2の閾値以下となった時点に基づいて前記接触点を算出する、製造方法。
適用例8に記載の製造方法によれば、溶融点算出工程の前に接触点算出工程を行っている。これにより、樹脂成型品ごとに押圧部が加工対象部位に接触した時点を基準として、加工対象部位を溶融するための第1の条件を用いた溶融点算出工程を行うことができる。また、接触点における押圧部の位置を算出することで、複数製造される樹脂成型品ごとの加工対象部位の形状のばらつきを把握することができる。
[Application Example 8] The manufacturing method according to Application Example 7, further comprising:
Before the melting point calculating step, the contact point that is the point in time when the pressing unit is moved toward the processing target site that is arranged away from the pressing unit and the pressing unit contacts the processing target site. Including a contact point calculation step to calculate,
The contact point calculation step includes:
While pushing the pressing part toward the part to be processed using a second condition that is a second thrust for pushing the pressing part and includes a second thrust lower than the first thrust as a condition, Calculating the displacement ratio,
The manufacturing method which calculates the said contact point based on the time when the said displacement ratio under the said 2nd condition became below a 2nd threshold value.
According to the manufacturing method described in Application Example 8, the contact point calculation step is performed before the melting point calculation step. Thereby, the melting point calculation process using the 1st conditions for melting a processing object part can be performed on the basis of the time when the press part contacted the processing object part for every resin molded product. In addition, by calculating the position of the pressing portion at the contact point, it is possible to grasp the variation in the shape of the part to be processed for each of a plurality of resin molded products manufactured.

なお、本発明は、種々の形態で実現することが可能であり、上述した加工装置、加工品の製造方法の他、樹脂成型品を加工する方法、上記製造方法により製造される加工品、加工装置を制御するためのコンピュータープログラム等の態様で実現できる。コンピュータープログラムは、コンピューターが読取可能な記録媒体に記録されていてもよい。   The present invention can be realized in various forms. In addition to the above-described processing apparatus and method for manufacturing a processed product, a method for processing a resin molded product, a processed product manufactured by the above-described manufacturing method, and processing The present invention can be realized in the form of a computer program for controlling the apparatus. The computer program may be recorded on a computer-readable recording medium.

本発明の一実施例としての加工装置1を説明するための図である。It is a figure for demonstrating the processing apparatus 1 as one Example of this invention. 加工装置1による加工処理の制御フローである。It is a control flow of the processing by the processing apparatus 1. 押圧部50の変位位置と時刻の関係を示すグラフである。It is a graph which shows the relationship between the displacement position of the press part 50, and time.

次に、本発明の実施の形態を以下の順序で説明する。
A.実施例:
B.変形例:
Next, embodiments of the present invention will be described in the following order.
A. Example:
B. Variations:

A.実施例:
A−1.加工装置の全体構成:
図1は、本発明の一実施例としての加工装置1を説明するための図である。加工装置1は、熱可塑性の樹脂成型品を溶融させて加工する装置である。なお、図1の上下方向が鉛直方向となり。下方向が鉛直下方向となる。
A. Example:
A-1. Overall configuration of processing equipment:
FIG. 1 is a view for explaining a processing apparatus 1 as an embodiment of the present invention. The processing apparatus 1 is an apparatus that melts and processes a thermoplastic resin molded product. Note that the vertical direction in FIG. 1 is the vertical direction. The downward direction is the vertical downward direction.

加工装置1は、押圧部50と、駆動部10と、制御部30と、筐体20とを備える。押圧部50は、電気的に接続された制御部30によって電流が与えられることで加熱可能に構成されている。例えば、押圧部50の内部に電熱線を配置して、電熱線と電気的に接続された制御部30から電熱線に電流を流して押圧部50を加熱する。熱可塑性の樹脂成型品90は筐体20内の載置台22に配置される。加熱された押圧部50は、樹脂成型品90の加工対象部位92に当接して加熱することで加工対象部位92を溶融させる。押圧部50は、加工対象部位92の融点以上の温度に加熱される。   The processing apparatus 1 includes a pressing unit 50, a driving unit 10, a control unit 30, and a housing 20. The pressing unit 50 is configured to be able to be heated by being supplied with an electric current by the control unit 30 that is electrically connected. For example, a heating wire is arranged inside the pressing unit 50, and the pressing unit 50 is heated by flowing current from the control unit 30 electrically connected to the heating wire to the heating wire. The thermoplastic resin molded product 90 is disposed on the mounting table 22 in the housing 20. The heated pressing portion 50 melts the processing target portion 92 by contacting and heating the processing target portion 92 of the resin molded product 90. The pressing unit 50 is heated to a temperature equal to or higher than the melting point of the processing target portion 92.

ここで、樹脂成型品90は、熱可塑性樹脂から成る樹脂成型品である。この加工装置1は、例えば、樹脂成型品90に設けられた突起部を金属板に設けた孔に挿入し、突起部の先端部を溶融させて先端部の径を大きくすることで金属板を取り付ける際に用いることができる。この場合、突起部が加工対象部位92となる。また、例えば、樹脂成型品90に設けた開口を塞ぐために樹脂フィルムを貼り付ける際にも、この加工装置1を用いることができる。この場合、加工対象部位92は樹脂成型品90と樹脂フィルムとが接触する部位となる。   Here, the resin molded product 90 is a resin molded product made of a thermoplastic resin. For example, the processing apparatus 1 inserts a protrusion provided on the resin molded product 90 into a hole provided in a metal plate, melts the tip of the protrusion, and increases the diameter of the tip, thereby increasing the diameter of the metal plate. It can be used when attaching. In this case, the protrusion becomes the processing target portion 92. Further, for example, the processing apparatus 1 can also be used when a resin film is attached to close an opening provided in the resin molded product 90. In this case, the processing target portion 92 is a portion where the resin molded product 90 and the resin film are in contact.

駆動部10は、モーター駆動のリニアアクチュエータである。駆動部10は、出力軸としての軸部12を移動させる。これにより、軸部12に取り付けられた押圧部50が移動する。すなわち、駆動部10は、押圧部50を樹脂成型品90の加工対象部位92に向かって移動させる。本実施例では、軸部12が鉛直方向Yrに移動する。なお、駆動部10は、モーター駆動のリニアアクチュエータに限定されるものではなく、各種アクチュエータが利用できる。   The drive unit 10 is a motor-driven linear actuator. The drive unit 10 moves the shaft unit 12 as an output shaft. Thereby, the press part 50 attached to the axial part 12 moves. That is, the drive unit 10 moves the pressing unit 50 toward the processing target portion 92 of the resin molded product 90. In the present embodiment, the shaft portion 12 moves in the vertical direction Yr. The drive unit 10 is not limited to a motor-driven linear actuator, and various actuators can be used.

また、加工装置1は、押圧部50の変位を検出するために利用される変位検出部(図示せず)を備える。押圧部50の変位位置は、変位検出部が変位センサー内の例えばエンコーダー等により直接に検出する構成でも良い。また、例えば、押圧部50の変位位置は、軸部12のホームポジション(加工処理開始位置)からの移動距離を外部に設けた変位センサーを用いて間接的に検出する構成でも良い。すなわち、軸部12の移動距離を押圧部50の変位量として取り扱う構成でも良い。さらに、加工装置1は、押圧部50の温度を検出するための温度センサー(図示せず)や押圧部50が樹脂成型品90に対して加える荷重を検出するための荷重センサー(図示せず)を備える。さらに、加工装置1は、時間を計測する時間計測器(図示せず)を備える。   Moreover, the processing apparatus 1 is provided with the displacement detection part (not shown) utilized in order to detect the displacement of the press part 50. FIG. The displacement position of the pressing unit 50 may be directly detected by the displacement detection unit using, for example, an encoder in the displacement sensor. Further, for example, the displacement position of the pressing portion 50 may be configured to indirectly detect the movement distance from the home position (processing start position) of the shaft portion 12 using a displacement sensor provided outside. That is, a configuration in which the moving distance of the shaft portion 12 is handled as the displacement amount of the pressing portion 50 may be used. Furthermore, the processing apparatus 1 includes a temperature sensor (not shown) for detecting the temperature of the pressing portion 50 and a load sensor (not shown) for detecting the load applied to the resin molded product 90 by the pressing portion 50. Is provided. Furthermore, the processing apparatus 1 includes a time measuring device (not shown) that measures time.

制御部30は、加工装置1を制御する。詳細には、制御部30は、加熱制御部32と、駆動制御部34と、変位割合算出部38と、操作表示部31とを備える。   The control unit 30 controls the processing apparatus 1. Specifically, the control unit 30 includes a heating control unit 32, a drive control unit 34, a displacement ratio calculation unit 38, and an operation display unit 31.

加熱制御部32は、押圧部50の加熱温度を制御する。駆動制御部34は、押圧部50の移動を制御する。すなわち、駆動制御部34は、駆動部10が押圧部50に与える推力(「押付力」ともいう。)を制御する。変位割合算出部38は、接触点Pcと溶融開始点Prを算出する。接触点Pcは、押圧部50が加工対象部位92に接触した時点を表す指標である。また、溶融開始点Prは、加工対象部位92が溶融を開始した時点を表す指標である。変位割合算出部38は、押圧部50が所定時間に変位する割合である変位割合を算出する。詳細には、変位割合算出部38は、時間計測器と変位センサーのデータに基づき変位割合を算出する。ここで、変位割合算出部38は、押圧部50の変位割合を直接に算出しても良いし、押圧部50が取り付けられた軸部12の変位割合(移動割合)を押圧部50の変位割合として算出しても良い。操作表示部31は、加工装置1が備えるモニター(図示せず)を制御する。利用者はモニターを介して加工装置1に対して押圧部50の加熱温度や、加工対象部位92の溶融高さ等の加工条件を入力する。但し、モニターを介さずに入力してもよい。入力された加工条件は、制御部30により記憶される。ここで、溶融高さとは、溶融前の加工対象部位92の高さ(長さ)から溶融後の加工対象部位92の高さ(長さ)を差し引いた値である。すなわち、溶融高さとは、実際に加工対象部位92が溶融した高さ(長さ)を表す。   The heating control unit 32 controls the heating temperature of the pressing unit 50. The drive control unit 34 controls the movement of the pressing unit 50. That is, the drive control unit 34 controls the thrust (also referred to as “pressing force”) applied to the pressing unit 50 by the driving unit 10. The displacement ratio calculation unit 38 calculates the contact point Pc and the melting start point Pr. The contact point Pc is an index that represents a point in time when the pressing unit 50 contacts the processing target portion 92. In addition, the melting start point Pr is an index that represents a point in time when the processing target portion 92 has started melting. The displacement rate calculation unit 38 calculates a displacement rate that is a rate at which the pressing unit 50 is displaced in a predetermined time. Specifically, the displacement ratio calculation unit 38 calculates the displacement ratio based on the data of the time measuring device and the displacement sensor. Here, the displacement ratio calculation unit 38 may directly calculate the displacement ratio of the pressing part 50, or the displacement ratio (movement ratio) of the shaft part 12 to which the pressing part 50 is attached is the displacement ratio of the pressing part 50. May be calculated as The operation display unit 31 controls a monitor (not shown) provided in the processing apparatus 1. The user inputs the processing conditions such as the heating temperature of the pressing unit 50 and the melt height of the processing target portion 92 to the processing apparatus 1 via the monitor. However, it may be input without going through a monitor. The input machining conditions are stored by the control unit 30. Here, the melting height is a value obtained by subtracting the height (length) of the processing target portion 92 after melting from the height (length) of the processing target portion 92 before melting. That is, the melt height represents a height (length) at which the processing target portion 92 is actually melted.

また、本実施例では、制御部30は、加工を開始して接触点Pcが算出されるまでは第2の条件で加工装置1を制御する。また、本実施例では、制御部は、接触点Pcが算出されてから設定された溶融高さに加工対象部位92が加工されるまでは第1の条件で加工装置1を制御する。第1の条件と第2の条件とは利用者により予め制御部30に設定されている。   In the present embodiment, the control unit 30 controls the machining apparatus 1 under the second condition until machining is started and the contact point Pc is calculated. Further, in this embodiment, the control unit controls the processing apparatus 1 under the first condition until the processing target portion 92 is processed to the set melt height after the contact point Pc is calculated. The first condition and the second condition are preset in the control unit 30 by the user.

ここで、第1の条件は、押圧部50を駆動部10によって加工対象部位92に押し進めるための第1の推力を条件として含む。また、第1の条件は、押圧部50の加熱温度を条件として含む。第2の条件は、押圧部50を駆動部10によって加工対象部位92に向かって押し進めるための第2の推力を条件として含む。また、第2の条件は、押圧部50の加熱温度を条件として含む。第1の条件と第2の条件とは、押圧部50を押し進めるための推力の大きさが条件として異なる。すなわち、本実施例では、第1の条件と第2の条件とは、推力に関する条件以外の他の条件は同一条件である。第2の推力は、第1の推力よりも低く設定されている。よって、第1の推力を「高推力」とも呼び、第2の推力を「低推力」とも呼ぶ。例えば、第2の推力は、押圧部50が加工対象部位92に加える荷重によって、加工対象部位92が大きな弾性変形を生じない程度の値に設定される。また例えば、第1の推力は、押圧部50によって押圧することで加工対象部位92が十分な溶融を生じることができる程度の値に設定される。本実施例では、第1の推力は250Nに設定され、第2の推力は50Nに設定されている。また、本実施例では、加工装置1の最大推力は500Nである。   Here, the first condition includes, as a condition, a first thrust for pushing the pressing portion 50 toward the processing target portion 92 by the driving portion 10. The first condition includes the heating temperature of the pressing unit 50 as a condition. The second condition includes, as a condition, a second thrust for pushing the pressing portion 50 toward the processing target portion 92 by the driving portion 10. Further, the second condition includes the heating temperature of the pressing unit 50 as a condition. The first condition and the second condition are different in terms of the magnitude of thrust for pushing the pressing portion 50 forward. That is, in the present embodiment, the first condition and the second condition are the same except for the condition related to the thrust. The second thrust is set lower than the first thrust. Therefore, the first thrust is also called “high thrust”, and the second thrust is also called “low thrust”. For example, the second thrust is set to a value that does not cause the elastic deformation of the processing target portion 92 due to the load applied by the pressing unit 50 to the processing target portion 92. Further, for example, the first thrust is set to a value that allows the processing target portion 92 to be sufficiently melted by being pressed by the pressing portion 50. In this embodiment, the first thrust is set to 250N, and the second thrust is set to 50N. In the present embodiment, the maximum thrust of the processing apparatus 1 is 500N.

A−2.加工処理の詳細説明:
図2は、加工装置1による加工処理の制御フローである。図3は、押圧部50の変位位置と時刻の関係を示すグラフである。図3の横軸は押圧部50を樹脂成型品90に向けて押し進めてからの時刻を表し、縦軸は押圧部50のホームポジション(加工処理開始位置)からの変位位置を表している。図2及び図3を用いて加工処理の詳細について説明する。
A-2. Detailed explanation of processing:
FIG. 2 is a control flow of processing performed by the processing apparatus 1. FIG. 3 is a graph showing the relationship between the displacement position of the pressing portion 50 and time. The horizontal axis in FIG. 3 represents the time since the pressing portion 50 is pushed toward the resin molded product 90, and the vertical axis represents the displacement position of the pressing portion 50 from the home position (processing start position). The details of the processing will be described with reference to FIGS.

図2に示すように、加工装置1による樹脂成型品90の加工処理が開始されると、加熱制御部32は押圧部50を加工対象部位92の融点以上の所定の温度に加熱する(ステップS10)。なお、後述するステップS60が完了するまでは、加熱制御部32は押圧部50が所定の温度を維持するように温度制御を行う。押圧部50が所定の温度に到達した後に、駆動制御部34が駆動部10を用いて押圧部50を低推力で加工対象部位92に向かって押し進める(ステップS20)。次いで、低推力で押圧部50を押し進めつつ、変位割合算出部38は押圧部50の変位割合に基づいて接触点Pcを算出する(ステップS30)。詳細には、変位割合算出部38は、変位割合が第2の閾値以下となった時点に基づいて接触点Pcを算出する。例えば、時間Tpの間の押圧部50の変位量がLp以下となった時点を押圧部50が加工対象部位92に接触した時点(接触点Pc)として算出する。図3に示すように、本実施例では、変位割合算出部38は時刻t1、変位位置L1の時点を接触点Pcとして算出する。   As shown in FIG. 2, when the processing of the resin molded product 90 by the processing apparatus 1 is started, the heating control unit 32 heats the pressing unit 50 to a predetermined temperature equal to or higher than the melting point of the processing target portion 92 (step S10). ). Note that, until step S60 described later is completed, the heating control unit 32 performs temperature control so that the pressing unit 50 maintains a predetermined temperature. After the pressing unit 50 reaches a predetermined temperature, the drive control unit 34 uses the driving unit 10 to push the pressing unit 50 toward the processing target region 92 with a low thrust (step S20). Next, the displacement rate calculation unit 38 calculates the contact point Pc based on the displacement rate of the pressing unit 50 while pushing the pressing unit 50 with a low thrust (step S30). Specifically, the displacement ratio calculation unit 38 calculates the contact point Pc based on the time when the displacement ratio becomes equal to or less than the second threshold value. For example, the time when the displacement of the pressing portion 50 during the time Tp becomes equal to or less than Lp is calculated as the time when the pressing portion 50 contacts the processing target portion 92 (contact point Pc). As shown in FIG. 3, in this embodiment, the displacement ratio calculation unit 38 calculates the time t1 and the time point of the displacement position L1 as the contact point Pc.

図2に示すように、接触点Pcが算出されるまでは低推力で押圧部50を加工対象部位92に向かって下降させる。変位割合算出部38が接触点Pcを算出すると(ステップS30:YES)、次いで駆動制御部34が駆動部10を用いて押圧部50を高推力で加工対象部位92に対して押し進めると共に(ステップS40)、変位割合算出部38が押圧部50の変位割合に基づいて溶融開始点Prを算出する(ステップS50)。詳細には、変位割合算出部38は、変位割合が第1の閾値以下となった時点に基づいて溶融開始点Prを算出する。例えば、時間Trの間の押圧部50の変位量がLr以下となった時点を溶融開始点Prとして算出する。図3に示すように、本実施例では時刻t3、変位位置L3の時点を溶融開始点Prとして算出する。なお変位割合が第1の閾値以下となる開始点(時刻t2、変位位置L2)を溶融開始点Prとして算出しても良い。   As shown in FIG. 2, until the contact point Pc is calculated, the pressing portion 50 is lowered toward the processing target portion 92 with low thrust. When the displacement ratio calculation unit 38 calculates the contact point Pc (step S30: YES), the drive control unit 34 then uses the drive unit 10 to push the pressing unit 50 against the processing target portion 92 with high thrust (step S40). ), The displacement rate calculation unit 38 calculates the melting start point Pr based on the displacement rate of the pressing unit 50 (step S50). Specifically, the displacement ratio calculation unit 38 calculates the melting start point Pr based on the time when the displacement ratio becomes equal to or less than the first threshold value. For example, the time when the displacement amount of the pressing portion 50 during the time Tr becomes Lr or less is calculated as the melting start point Pr. As shown in FIG. 3, in this embodiment, the time t3 and the time point of the displacement position L3 are calculated as the melting start point Pr. Note that the start point (time t2, displacement position L2) at which the displacement ratio is equal to or less than the first threshold value may be calculated as the melting start point Pr.

図2に示すように、溶融開始点Prが算出された場合(ステップS50:YES)、溶融開始点Prにおける押圧部50の変位位置である基準位置を算出し、押圧部50を加工対象部位92に対して基準位置から所定量押し進める(ステップS60)。ここで、所定量とは、予め利用者等により加工装置1に入力された溶融高さである。例えば、溶融高さを値Lgとして加工したい場合、加工装置1は押圧部50を溶融開始点Prから所定量である値Lgだけ加工対象部位92に対して押し込む(図3)。   As shown in FIG. 2, when the melting start point Pr is calculated (step S50: YES), a reference position, which is a displacement position of the pressing portion 50 at the melting start point Pr, is calculated, and the pressing portion 50 is moved to the portion 92 to be processed. Is pushed from the reference position by a predetermined amount (step S60). Here, the predetermined amount is the melt height previously input to the processing apparatus 1 by a user or the like. For example, when processing the melt height as the value Lg, the processing apparatus 1 pushes the pressing portion 50 into the processing target portion 92 by a value Lg that is a predetermined amount from the melting start point Pr (FIG. 3).

図2に示すように、ステップS60の後に、加工対象部位92に向かう押圧部50の移動を停止する。詳細には、制御部30は押圧部50の加熱を停止すると共に、軸部12を上昇させ押圧部50をホームポジションに移動させることで加工処理が終了する(ステップS70)。   As shown in FIG. 2, after step S <b> 60, the movement of the pressing unit 50 toward the processing target portion 92 is stopped. Specifically, the control unit 30 stops the heating of the pressing unit 50 and raises the shaft unit 12 to move the pressing unit 50 to the home position, thereby finishing the processing (step S70).

A−3.効果:
図3に示すように、押圧部50が加工対象部位92に接触してから高推力によって押圧部50を押し進めた場合、変位割合が大きく異なる時点(図3では、時点Ps)が存在する。この時点Psを変化点Psとも呼ぶ。発明者らは、押圧部50が加工対象部位92に接触してからの押圧部50の変位量は、主に加工対象部位92が弾性変形したことに起因し、変化点Ps以降の押圧部50の変位量は加工対象部位92が溶融したことに起因することを見出した。すなわち、変位位置L1から変位位置L2までの変位量Leは、主に加工対象部位92が弾性変形したことに起因して押圧部50が移動した量となる。
A-3. effect:
As shown in FIG. 3, when the pressing portion 50 is pushed forward with high thrust after the pressing portion 50 comes into contact with the processing target portion 92, there is a time point (time point Ps in FIG. 3) where the displacement ratio is greatly different. This time Ps is also referred to as a change point Ps. The inventors found that the amount of displacement of the pressing portion 50 after the pressing portion 50 contacts the processing target portion 92 is mainly due to the elastic deformation of the processing target portion 92, and the pressing portion 50 after the change point Ps. It has been found that the displacement amount is caused by the fact that the processing target portion 92 is melted. That is, the displacement amount Le from the displacement position L1 to the displacement position L2 is an amount that the pressing portion 50 has moved mainly due to the elastic deformation of the processing target portion 92.

上記のように、本実施例の加工処理では、押圧部50の変位割合に基づいて溶融開始点Prを算出し、溶融開始点Prにおける押圧部50の位置から、予め設定された溶融高さ分だけ押圧部50を加工対象部位92に対して押し進めた後に、押圧部50の下降を停止している(ステップS50〜ステップS60)。これにより、加工対象部位92が弾性変形した分を考慮して溶融高さを算出できる。よって、加工対象部位92の加工精度を向上できる。また、溶融開始点Prにおける押圧部50の変位位置(基準位置)から押圧部50が押し込まれる位置までの長さを所定量(溶融高さ)とすることで、目標とする溶融高さに精度良く加工対象部位92を加工できる。また、加工装置1は、押圧部50の変位割合に基づいて溶融開始点Prを容易に算出できる。   As described above, in the processing of the present embodiment, the melting start point Pr is calculated based on the displacement ratio of the pressing portion 50, and a preset melt height is calculated from the position of the pressing portion 50 at the melting start point Pr. After the pressing portion 50 is pushed forward with respect to the processing target portion 92, the lowering of the pressing portion 50 is stopped (steps S50 to S60). Thereby, the melt height can be calculated in consideration of the elastic deformation of the processing target portion 92. Therefore, the processing accuracy of the processing target portion 92 can be improved. In addition, the length from the displacement position (reference position) of the pressing portion 50 at the melting start point Pr to the position where the pressing portion 50 is pressed is set to a predetermined amount (melting height), so that the target melting height is accurately obtained. The part 92 to be processed can be processed well. Further, the processing device 1 can easily calculate the melting start point Pr based on the displacement ratio of the pressing portion 50.

また、加工装置1は、高推力によって押圧部50を押し進めて加工対象部位92を押圧する前に、低推力によって押圧部50を加工対象部位92に向かって押し進めることで接触点Pcを算出している(ステップS20,30)。これにより、押圧部50が加工対象部位92に接触した時点を基準として、加工対象部位を溶融するための高推力を条件として含む第1の条件を用いた加工を施すことができる。すなわち、仕様が異なる樹脂成型品に対して、接触点Pcを基準として第1の条件を用いた溶融加工を施すことができる。また、接触点Pcを算出することで、樹脂成型品90が複数製造される場合において、樹脂成型品90ごとの形状のばらつきを把握することができる。また、加工装置1は、加工対象部位92を溶融させるために用いる高推力よりも低い低推力を用いて接触点Pcを算出している(ステップS20,30)。これにより、押圧部50が実際に加工対象部位92に接触した後の押圧部50の変位割合をゼロに近づけることができる。すなわち、押圧部50が加工対象部位92に接触する前後で変位割合を急激に変化させることができ、変位割合に基づいて容易に接触点Pcを算出できる。   Further, the processing apparatus 1 calculates the contact point Pc by pushing the pressing portion 50 toward the processing target portion 92 with a low thrust before pressing the pressing portion 50 with a high thrust to press the processing target portion 92. (Steps S20 and S30). Thereby, it is possible to perform processing using the first condition including, as a condition, high thrust for melting the processing target portion, with the time point when the pressing unit 50 contacts the processing target portion 92 as a reference. That is, it is possible to perform melt processing using the first condition with respect to the contact point Pc for resin molded products having different specifications. In addition, by calculating the contact point Pc, when a plurality of resin molded products 90 are manufactured, it is possible to grasp the variation in shape for each resin molded product 90. Further, the processing apparatus 1 calculates the contact point Pc using a low thrust lower than the high thrust used to melt the processing target portion 92 (steps S20 and S30). Thereby, the displacement ratio of the press part 50 after the press part 50 actually contacts the process target site | part 92 can be brought close to zero. In other words, the displacement rate can be changed abruptly before and after the pressing unit 50 contacts the processing target portion 92, and the contact point Pc can be easily calculated based on the displacement rate.

B.変形例:
以上、本発明の一実施例について説明したが、本発明はこのような実施例に限定されず、その趣旨を逸脱しない範囲で種々の構成を採ることができる。例えば以下のような変形が可能である。
B. Variations:
As mentioned above, although one Example of this invention was described, this invention is not limited to such an Example, A various structure can be taken in the range which does not deviate from the meaning. For example, the following modifications are possible.

B−1.第1変形例:
上記実施例では、押圧部50の加熱は低推力で押圧部50を下降させる前に行なっていたが(図2、ステップS10)、これに限定されるものではなく、接触点Pcを算出した後に行なっても良い。このようにしても、上記実施例と同様の効果を奏する。また、押圧部50の加熱停止(図2、ステップS70)を行わずに軸部上昇だけを行い、別の樹脂成型品の加工のためにステップS20以降を繰り返してもよい。
B-1. First modification:
In the said Example, although the heating of the press part 50 was performed before lowering the press part 50 with a low thrust (FIG. 2, step S10), it is not limited to this, After calculating the contact point Pc You can do it. Even if it does in this way, there exists an effect similar to the said Example. Alternatively, the heating of the pressing portion 50 may not be stopped (FIG. 2, step S70), and only the shaft portion may be raised, and step S20 and subsequent steps may be repeated for processing another resin molded product.

B−2.第2変形例:
接触点Pc及び溶融開始点Prの算出は、図3に示すグラフの接線の傾きに基づいて行なっても良い。すなわち、変位割合として、押圧部50の変位速度を用いても良い。
B-2. Second modification:
The calculation of the contact point Pc and the melting start point Pr may be performed based on the slope of the tangent line in the graph shown in FIG. That is, the displacement speed of the pressing portion 50 may be used as the displacement ratio.

B−3.第3変形例:
上記実施例では、加工装置1は、インクカートリッジ内に設けられた突起部(樹脂ピン)の加工や、インクカートリッジにフィルムを溶着させる際の加工に用いたが、加工装置1の用途はこれに限定されるものではなく、樹脂成型品の加工対象部位を溶融させて加工する用途に用いることができる。例えば、加工装置1は、熱可塑性の樹脂同士を溶着する際に用いても良い。
B-3. Third modification:
In the above-described embodiment, the processing device 1 is used for processing the protrusions (resin pins) provided in the ink cartridge and for processing when a film is welded to the ink cartridge. It is not limited, It can use for the use which melts and processes the process target site | part of a resin molded product. For example, the processing apparatus 1 may be used when welding thermoplastic resins.

1…加工装置
10…駆動部
12…軸部
20…筐体
22…載置台
30…制御部
31…操作表示部
32…加熱制御部
34…駆動制御部
38…変位割合算出部
50…押圧部
90…樹脂成型品
92…加工対象部位
Ps…変化点
Pc…接触点
Pr…溶融開始点
DESCRIPTION OF SYMBOLS 1 ... Processing apparatus 10 ... Drive part 12 ... Shaft part 20 ... Housing 22 ... Mounting stand 30 ... Control part 31 ... Operation display part 32 ... Heating control part 34 ... Drive control part 38 ... Displacement ratio calculation part 50 ... Pressing part 90 ... resin molded product 92 ... processed part Ps ... change point Pc ... contact point Pr ... melting start point

Claims (8)

樹脂成型品を加工する加工装置であって、
加熱され、前記樹脂成型品の加工対象部位を押圧することで溶融させる押圧部と、
前記押圧部を前記加工対象部位に向かって移動させる駆動部と、
前記加工装置を制御する制御部と、を備え、
前記制御部は、
前記押圧部が変位する変位割合に基づいて、前記加工対象部位の溶融が開始した時点である溶融開始点を算出し、
前記溶融開始点における前記押圧部の位置である基準位置に基づいて、前記押圧部を前記加工対象部位に対して所定量押し進めた後に、前記加工対象部位に向かう前記押圧部の移動を停止する、加工装置。
A processing device for processing a resin molded product,
A pressing portion that is heated and melted by pressing a portion to be processed of the resin molded product;
A drive unit for moving the pressing unit toward the processing target site;
A control unit for controlling the processing apparatus,
The controller is
Based on the displacement rate at which the pressing portion is displaced, calculate a melting start point that is a point in time when melting of the processing target site is started,
Based on a reference position that is the position of the pressing portion at the melting start point, after the pressing portion has been pushed a predetermined amount against the processing target portion, the movement of the pressing portion toward the processing target portion is stopped. Processing equipment.
請求項1に記載の加工装置であって、
前記制御部は、前記加工対象部位の溶融高さであって、前記押圧部の移動方向に沿った長さである溶融高さを前記所定量として利用者から受け付け可能であり、
前記所定量は、前記基準位置から前記押圧部が前記加工対象部位に対して押し込まれる位置までの長さである、加工装置。
The processing apparatus according to claim 1,
The control unit is capable of receiving from the user the melt height that is the melt height of the processing target portion and that is the length along the moving direction of the pressing portion as the predetermined amount,
The said predetermined amount is a processing apparatus which is the length from the said reference position to the position where the said press part is pushed with respect to the said process target site | part.
請求項1又は請求項2に記載の加工装置であって、
前記制御部は、
前記押圧部を押し進めるための第1の推力を条件として含む第1の条件を用いて前記加工対象部位を前記押圧部によって押圧すると共に、前記変位割合を算出し、
前記第1の条件下での前記変位割合が第1の閾値以下となった時点に基づいて、前記溶融開始点を算出する、加工装置。
The processing apparatus according to claim 1 or 2,
The controller is
While pressing the processing object part by the pressing part using a first condition including a first thrust for pushing the pressing part as a condition, the displacement ratio is calculated,
A processing apparatus that calculates the melting start point based on a point in time when the displacement ratio under the first condition becomes equal to or less than a first threshold value.
請求項3に記載に記載の加工装置であって、
前記制御部は、
前記押圧部を押し進めるための第2の推力であって前記第1の推力よりも低い第2の推力を条件として含む第2の条件を用いて、離れて配置された前記加工対象部位に対し前記押圧部を前記加工対象部位に向かって押し進めつつ、前記変位割合を算出し、
前記第2の条件下での前記変位割合が第2の閾値以下となった時点に基づいて、前記押圧部が前記加工対象部位に接触した接触点を算出し、
前記接触点を算出した後に、前記第1の条件を用いて前記加工対象部位を前記押圧部によって押圧する、加工装置。
The processing apparatus according to claim 3,
The controller is
The second thrust for pushing the pressing portion forward and including a second thrust that is lower than the first thrust as a condition, the processing target portion arranged at a distance from the second thrust While pushing the pressing part toward the part to be processed, the displacement ratio is calculated,
Based on the time point when the displacement ratio under the second condition is equal to or less than a second threshold value, the contact point where the pressing portion is in contact with the processing target site is calculated,
The processing apparatus which presses the said process target site | part by the said press part using the said 1st condition after calculating the said contact point.
樹脂成型品の加工対象部位を、加工装置が備える押圧部であって加熱した押圧部によって押圧することで溶融させて前記樹脂成型品の加工品を製造する製造方法であって、
前記加工対象部位を前記押圧部によって押圧し、前記押圧部が変位する変位割合に基づいて、前記加工対象部位の溶融が開始した時点である溶融開始点を算出する溶融点算出工程と、
前記溶融点算出工程の後に、前記溶融開始点における前記押圧部の位置である基準位置に基づいて、前記押圧部を前記加工対象部位に対して所定量押し進めた後に、前記加工対象部位に向かう前記押圧部の移動を停止する溶融工程と、を備える、製造方法。
A manufacturing method for manufacturing a processed product of the resin molded product by melting the processing target portion of the resin molded product by pressing it with a heated pressing unit, which is a pressing unit provided in the processing apparatus,
A melting point calculating step of calculating a melting start point, which is a time point at which melting of the processing target portion starts, based on a displacement ratio in which the processing target portion is pressed by the pressing portion and the pressing portion is displaced;
After the melting point calculation step, based on a reference position that is the position of the pressing portion at the melting start point, the pressing portion is pushed forward by a predetermined amount with respect to the processing target portion, and then heads toward the processing target portion. And a melting step for stopping the movement of the pressing portion.
請求項5に記載の製造方法であって、
前記加工装置は、前記加工対象部位の溶融高さであって、前記押圧部の移動方向に沿った長さである溶融高さを前記所定量として受け付け可能であり、
前記所定量は、前記溶融開始点における前記押圧部の位置から前記押圧部が前記加工対象部位に押し込まれる位置までの長さである、製造方法。
It is a manufacturing method of Claim 5, Comprising:
The processing device is capable of receiving the melt height as the predetermined amount, which is the melt height of the part to be processed and is a length along the moving direction of the pressing portion,
The predetermined amount is a length from a position of the pressing portion at the melting start point to a position where the pressing portion is pressed into the processing target portion.
請求項5又は請求項6に記載の製造方法であって、
前記溶融点算出工程は、
前記押圧部を押し進めるための第1の推力を条件として含む第1の条件を用いて前記加工対象部位を前記押圧部によって押圧すると共に、前記変位割合を算出し、
前記第1の条件下での前記変位割合が第1の閾値以下となった時点に基づいて、前記溶融開始点を算出する、製造方法。
It is a manufacturing method of Claim 5 or Claim 6,
The melting point calculation step includes
While pressing the processing object part by the pressing part using a first condition including a first thrust for pushing the pressing part as a condition, the displacement ratio is calculated,
The manufacturing method of calculating the melting start point based on a time point when the displacement ratio under the first condition becomes equal to or less than a first threshold value.
請求項7に記載の製造方法であって、さらに、
前記溶融点算出工程の前に、前記押圧部と離れて配置された前記加工対象部位に向かって前記押圧部を移動させて、前記押圧部が前記加工対象部位に接触した時点である接触点を算出する接触点算出工程を含み、
前記接触点算出工程は、
前記押圧部を押し進めるための第2の推力であって前記第1の推力よりも低い第2の推力を条件として含む第2の条件を用いて前記押圧部を前記加工対象部位に向かって押し進めると共に、前記変位割合を算出し、
前記第2の条件下での前記変位割合が第2の閾値以下となった時点に基づいて前記接触点を算出する、製造方法。
The manufacturing method according to claim 7, further comprising:
Before the melting point calculating step, the contact point that is the point in time when the pressing unit is moved toward the processing target site that is arranged away from the pressing unit and the pressing unit contacts the processing target site. Including a contact point calculation step to calculate,
The contact point calculation step includes:
While pushing the pressing part toward the part to be processed using a second condition that is a second thrust for pushing the pressing part and includes a second thrust lower than the first thrust as a condition, Calculating the displacement ratio,
The manufacturing method which calculates the said contact point based on the time when the said displacement ratio under the said 2nd condition became below a 2nd threshold value.
JP2012000344A 2012-01-05 2012-01-05 Processing device for processing resin molding and method for manufacturing processed product Pending JP2013139111A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012000344A JP2013139111A (en) 2012-01-05 2012-01-05 Processing device for processing resin molding and method for manufacturing processed product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012000344A JP2013139111A (en) 2012-01-05 2012-01-05 Processing device for processing resin molding and method for manufacturing processed product

Publications (1)

Publication Number Publication Date
JP2013139111A true JP2013139111A (en) 2013-07-18

Family

ID=49037041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012000344A Pending JP2013139111A (en) 2012-01-05 2012-01-05 Processing device for processing resin molding and method for manufacturing processed product

Country Status (1)

Country Link
JP (1) JP2013139111A (en)

Similar Documents

Publication Publication Date Title
KR101410917B1 (en) Heat welding apparatus
EP1896214B1 (en) Method and system for welding parts together using a resistance upset welding process
JP5334250B2 (en) Reflow soldering method and apparatus
JP2009096120A (en) Mold releasing force measuring device, mold releasing force measuring method, resin molding device and manufacturing method of resin molded article
KR101775448B1 (en) Method and device for joining electronic component
JP2013139111A (en) Processing device for processing resin molding and method for manufacturing processed product
JP5013616B2 (en) Heat caulking device and heat caulking method
JP2014004601A (en) Pinching position detector and pinching position detection method for processing machine
JP5151553B2 (en) Resin injection apparatus, resin injection method, resin injection program, and recording medium
JP5755627B2 (en) Nozzle touch method and touch device for injection molding machine
JP5003590B2 (en) Electronic component manufacturing apparatus and manufacturing method thereof
JP5265219B2 (en) Insert molding method
JP6271940B2 (en) Vibration welding apparatus and article manufacturing method
JP2011218629A (en) Resin sealing apparatus and resin sealing method
JP5847390B2 (en) Mounting apparatus and mounting method
US11696411B2 (en) Sleeve soldering device and method of producing electronic device
JP2020082137A (en) Press molding device, press molding method, and press molding program
JP5625673B2 (en) Injection molding method and apparatus
JP2022129249A (en) Gate residue processing device and gate residue processing method
JP5300804B2 (en) Press-in method
JP4562019B2 (en) Mold protection method for injection molding machine
JP7017368B2 (en) Plunger for resin molding equipment and resin molding equipment
JPWO2019013007A1 (en) Fastening device and method for determining quality of fastener
JP2021171788A (en) Resistance-welding control system and resistance-welding control method
JP2016221709A (en) Industrial machinery