JP2011218629A - Resin sealing apparatus and resin sealing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stably supply a sealed article of high quality by improving detection accuracy of a contact position between a first metallic die and a second metallic die in a resin sealing apparatus.SOLUTION: The resin sealing apparatus 100 is provided with: a metallic mold position index value-measuring unit 122 for measuring a metallic mold position index value X which changes in relation to a relative position between a first metallic mold 114 and a second metallic mold 115; a closing pressure-measuring unit 124 for measuring closing pressure P actually applied to the first metallic mold 114 and the second metallic mold 115; a calculation unit 126 for estimating and calculating the corresponding metallic mold position index value XO when the closing pressure P is zero from a relation between two or more closing pressure PA, PB obtained after the closing pressure P reaches a predetermined value PA and metallic mold position index values XA, XB; and further, a detecting mechanism 121 of the contact position between the first metallic die 114 and the second metallic die 115, with the corresponding metallic mold position index value XO when the closing pressure P is zero as a contact position between the first metallic die 114 and the second metallic die 115.

Description

  The present invention relates to a resin sealing device and a resin sealing method.

  Patent Document 1 discloses a resin sealing device.

  The resin sealing device applies a closing pressure by bringing the first and second molds facing each other into close contact with each other, and seals the product to be sealed with resin. The resin sealing device appropriately controls the resin sealing by setting the actual contact positions of the first and second molds as reference positions for control. For this reason, the resin sealing device has a detection mechanism for detecting the contact positions of the first and second molds. However, when the closing pressure applied to the first and second molds rises, the measured value (closing pressure) of the detection mechanism is the structural backlash of the resin sealing device, the periphery of the first and second molds. The detection mechanism varies depending on the influence of member error, static friction, etc., and the influence of the accuracy error near zero of the detection mechanism being relatively large with respect to the entire range. Measuring (detecting) the contact positions of the first and second molds by detecting the rise of the closing pressure (near zero) has a problem in reproduction. For this reason, after the first and second molds are brought into contact with each other, the detection mechanism has the “contact position detected” with the contact positions of the first and second molds when the closing pressure rises to some extent. This was used as a reference position for control.

JP 2009-172816 A

  However, there is a deviation between the true contact position of the first and second molds and the “detected contact position (control reference position)”. In the area important for the quality of resin sealing control, it is inferred that "the state that has actually occurred" in the first and second molds and "there will have occurred" obtained by the control equation (calculation). As a deviation from the “state”, the quality of the sealed product may be reduced.

  In the present invention, in order to solve the above problems, the detection accuracy of the contact positions of the first and second molds of the resin sealing device is improved, and a high-quality sealed product is stably supplied. Is an issue.

  The present invention provides a first and second resin sealing apparatus in which first and second molds facing each other are brought into close contact with each other to apply a closing pressure to seal a product to be sealed with resin. Mold position index value measuring means for measuring a mold position index value that changes in relation to the relative position of the mold, and closing pressure measuring means for measuring the closing pressure actually applied to the first and second molds Two or more closing pressures obtained after the closing pressure measured by the closing pressure measuring means becomes a predetermined value or more, and the respective mold position index values corresponding to the two or more closing pressures, Therefore, a calculation means for estimating and calculating a mold position index value corresponding to when the closing pressure is zero, and a mold position index value corresponding to when the closing pressure is zero, 1. A mechanism for detecting the contact position of the first and second molds as the contact position of the second mold is provided. It was solved the above problems by the configuration.

  In the resin sealing device according to the present invention, in determining the contact position as the control reference position, the closing pressure is equal to or greater than 2 when the closing pressure is equal to or greater than a predetermined value (that is, a highly reproducible region with no variation). Measure the closing pressure, and estimate the corresponding mold position index value as the contact position when the closing pressure is zero from the relationship between the measured two or more closing pressures and the mold position index value at that time. Calculate. Since the measured two or more closing pressures and their mold position index values are highly reproducible and reliable values, the corresponding mold position index value when the closing pressure obtained from these is zero is also reliable. Is expensive. As a result, according to the resin sealing device of the present invention, the contact position of the actual mold can be estimated and detected without variation, and the deviation between the actual contact position and the control reference position is reduced. Can be made. As a result, according to the present invention, since the origin (base point) of the resin sealing control can be accurately determined, the quality of the sealed product can be improved accordingly.

  From this point of view, the present invention provides the resin sealing method in which the first and second molds facing each other are approached and brought into contact with each other to apply a closing pressure and the product to be sealed is sealed with resin. Prior to sealing, after detecting that the closing pressure applied to the first and second molds has become a predetermined value or more, and after detecting that the closing pressure has become a predetermined value or more Measuring two or more closing pressures currently applied to the first and second molds in correspondence with mold position index values that change in relation to the relative positions of the first and second molds; From the relationship between the two or more measured closing pressures and the respective mold position index values corresponding to the two or more closing pressures, the corresponding mold position index value when the closing pressure is zero is And a procedure for estimating and calculating the contact position of the first and second molds. It can be regarded as invention to verify the work of contacting position.

  In addition, the present invention is a resin sealing device that closes the first and second molds facing each other and applies a closing pressure to seal a product to be sealed with resin. A mold position index value measuring means for measuring a mold position index value that changes in relation to the relative positions of the first and second molds, and a closing pressure actually applied to the first and second molds. From the closing pressure measuring means to measure, the closing pressure obtained after the closing pressure measured by the closing pressure measuring means becomes a predetermined value or more, and the mold position index value corresponding to the closing pressure, Calculation means for estimating and calculating a corresponding mold position index value when the closing pressure is zero, using a correction coefficient obtained in advance in the resin sealing device, and the closing pressure is zero The mold position index value corresponding to the time is defined as the contact position of the first and second molds. That the first, can be regarded as the invention is provided with a detecting mechanism of the abutting position of the second mold.

  For example, if a correction coefficient that relates the closing pressure and the mold position index value (a change mode thereof) in advance can be obtained between a plurality of resin sealing devices or by a plurality of preliminary measurements in a specific resin sealing device. By using this correction coefficient, it is possible to estimate and calculate the mold position index value corresponding to when the closing pressure is zero (that is, the control reference position). Thereby, although the number of measurement points of the closing pressure and the mold position index value is one, the accuracy of detection of the control reference position can be improved as compared with the conventional method by the amount corrected by the estimation / calculation.

  The present invention improves the detection accuracy of the contact positions of the first and second molds of the resin sealing device, and can stably supply a high-quality sealed product.

The schematic side view of the resin sealing apparatus provided with the detection mechanism of the contact position of the metal mold | die concerning an example of embodiment of this invention. The flowchart which showed the detection process of the contact position of a metal mold | die by the detection mechanism of the contact position of a metal mold | die A graph showing changes over time in mold closing pressure and mold position index value associated with mold contact by the mold contact position detection mechanism

  Hereinafter, a resin sealing device 100 including an upper end detection mechanism 121 according to an embodiment of the present invention and a contact position of lower molds 114 and 115 will be described in detail with reference to the drawings.

  FIG. 1 shows a schematic side view of the resin sealing device 100.

  The resin sealing device 100 applies a closing pressure P by bringing the upper mold (first mold) 114 and the lower mold (second mold) 115 facing each other into close contact with each other, thereby applying a sealing pressure P. Sealed with resin (both not shown). The upper mold 114 is suspended from a fixed platen 110 that is supported and fixed to the main body of the resin sealing device 100. On the other hand, the lower mold 115 is placed on the movable platen 113. A toggle link mechanism (toggle link type press mechanism) 130 is attached to the lower mold 115 (more specifically, the movable platen 113 on which the lower mold 115 is placed). Then, the lower mold 115 is brought close to and in contact with the upper mold 114. Specifically, a ball screw 120 is connected to the toggle link mechanism 130, and the ball screw 120 is connected to a motor 116 via a timing belt 118. As a result, the rotation of the motor 116 is transmitted to the ball screw 120 via the timing belt 118, and when the ball screw 120 moves linearly, the toggle link mechanism 130 bends and moves the lower die 115 up and down. .

  The resin sealing device 100 includes a detection mechanism 121 for the contact position X0 of the upper and lower molds 114 and 115. The detection mechanism 121 for the contact position X0 of the upper and lower molds 114 and 115 includes an encoder (mold position index value measuring means) 122, a load cell (closing pressure measuring means) 124, and a calculation unit (calculation means) 126. ing.

  Each component of the contact position detection mechanism 121 will be described in detail below.

  The load cell 124 is disposed on the movable platen 113, and can measure the closing pressure P of the lower mold 115 (with respect to the upper mold 114) that is actually applied.

  The encoder 122 is attached to the motor 116 and measures a mold position index value X that changes in relation to the relative positions of the upper and lower molds 114 and 115. Specifically, the encoder 122 counts pulse data generated with the rotation of the motor 116, calculates the total number of revolutions of the motor 116, and based on the total number of revolutions of the motor 116, the mold position index value X Measure. After the upper and lower molds 114 and 115 abut, the actual relative positions of the upper and lower molds 114 and 115 (actual positions of the abutment surfaces of the upper and lower molds 114 and 115) hardly change. However, as long as the motor 116 continues to rotate, the mold position index value X measured by the encoder 122 also continues to change. As the rotation of the motor 116 continues, the closing pressure P starts to rise, and the load cell 124 measures the rising closing pressure P. When the upper and lower molds 114 and 115 are completely separated from each other, the measured value of the load cell 124 is constant (zero) and stable. However, when the upper and lower molds 114 and 115 come into contact with each other and the closing pressure P starts to increase from a zero state, the measured value of the load cell 124 (actual closing pressure P) varies depending on various factors. It tends to be unstable until the pressure P rises to some extent.

  The calculation unit 126 includes a control unit 127, a parameter setting unit 128, and a storage unit 129. Further, the calculation unit 126 is connected to the load cell 124 and the encoder 122, and can grasp the closing pressure P of the load cell 124 and the mold position index value X by the encoder 122 when the closing pressure P is obtained.

  When the closing pressure P output from the load cell 124 reaches a predetermined value PA (first closing pressure PA), the control unit 127 sends a first mold position index (corresponding to the first closing pressure PA) from the encoder 122. Get the value XA. When the closing pressure P output from the load cell 124 becomes the second closing pressure PB, the control unit 127 receives the second mold position index value XB (corresponding to the second closing pressure PB) from the encoder 122. To get. From the relationship between the first and second closing pressures PA and PB and the first and second mold position index values XA and XB, the control unit 127 determines the mold position index value X0 corresponding to when the closing pressure P is zero. (That is, the contact position X0 of the lower molds 114 and 115 obtained in the present embodiment is estimated and calculated, and the mold position index value X0 is detected as the contact position.

  The predetermined value in the present invention is set to a value larger than at least 10 kN by the parameter setting unit 128. This is because when the closing pressure P detected by the load cell 124 is 10 kN or more, the measured value (closing pressure P) becomes stable and has a certain reproducibility. In the present embodiment, the predetermined value (= first closing pressure) PA is set to 20 kN.

  The parameter setting unit 128 sets (or changes) the first and second closing pressures PA and PB that are the threshold values of the closing pressure P acquired by the control unit 127 from the load cell 124 and inputs the first and second closing pressures PA and PB to the control unit 127. The second closing pressure PB is set larger than the first closing pressure PA (PA <PB).

  Next, the operation of the detection mechanism 121 for the contact position X0 of the upper and lower molds 114 and 115 in the resin sealing device 100 will be described with reference to FIGS.

  FIG. 2 is a flowchart showing a process of detecting the contact position X0 of the upper and lower molds 114 and 115 by the detection mechanism 121. FIG. 3 is a graph showing changes over time in the closing pressure P and the mold position index value X accompanying the contact of the upper and lower molds 114 and 115 by the detection mechanism 121.

  The detection of a series of contact positions X0 of the detection mechanism 121 is performed as follows. If a sample of resin as a sealing material and a sample to be sealed (work) are put between the upper mold 114 and the lower mold 115 which are separated from each other, the contact position X0 can be set more accurately. It can be detected.

  Referring to FIG. 2, first, motor 116 is rotated to start a contact operation (step S201). This rotation is transmitted as the operation of the toggle link mechanism 130 and the movable platen 113 by operating the ball screw 120 at the speed V (step S202).

  In step S203, it is determined whether or not the first mold position index value XA has already been acquired. If it has not been acquired, the first closing pressure PA has not yet been reached (NO determination in step S203). Proceeding to S204, it is determined whether or not the closing pressure P measured by the load cell 124 is equal to or higher than the first closing pressure PA. Until the closing pressure P becomes the first closing pressure PA (when NO is determined in step S204), the operation of the ball screw 120 is advanced (the lower die 115 is raised), and the closing pressure P is increased. While continuing, the operation of comparing the closing pressure P and the first closing pressure PA is repeated (repetition of steps S202 to S204).

  When it is determined in step S204 that the closing pressure P has become the first closing pressure PA, the control unit 127 acquires the first mold position index value XA (corresponding to the first closing pressure PA) from the encoder 122. (Step S205). When the first mold position index value XA is acquired, a determination of YES is made when the process returns to step S203 next. Therefore, the flow proceeds to step S206, and whether the closing pressure P is equal to or higher than the second closing pressure PB. Whether it is determined. Similar to Step S204 and Step S205, when the closing pressure P becomes the second closing pressure PB, the control unit 127 sends the second mold position index value XB from the encoder 122 (corresponding to the second closing pressure PB). Is acquired (step S207). Thereafter, the operation of the motor 116 and the ball screw 120 is stopped (step S208).

  Subsequently, the control unit 127 estimates the contact position X0 of the upper and lower molds 114 and 115 (step S209). That is, from the relationship between the measured first and second closing pressures PA and PB and the first and second mold position index values XA and XB, the corresponding mold position index value X0 when the closing pressure P is zero. Is estimated and calculated. Specifically, the estimation / calculation is performed as shown in FIG. The control unit 127 connects the two points of the first and second closing pressures PA and PB at times t1 and t2, and obtains a straight line LP indicating the change in the closing pressure P (vertical axis) along the time t (horizontal axis). . Further, the control unit 127 connects the first and second mold position index values XA and XB at the same time t1 and t2, and changes the mold position index value X (vertical axis) at the time t (horizontal axis). ) To obtain a straight line LX shown along. Then, when an intersection point (time t0) where the straight line LP intersects the extended line of the straight line L0 where the closing pressure P is zero is obtained, and a coordinate X on the straight line LX corresponding to the time t0 is obtained, the closing pressure P is obtained. This is the mold position index value X0 corresponding to zero. When the mold position index value X0 is detected as the contact position between the upper and lower molds 114 and 115 in this way, the resin seal apparatus 100 detects the contact position (X0). As a starting point for control, the subsequent sealing work can be performed satisfactorily.

  Since both the first and second closing pressures PA and PB are measured at a predetermined value PA of 20 kN (which is 10 kN or more), the control unit 127 performs the first and second reproducible operations. The closing pressures PA and PB can be measured, and the contact position X0 of the upper and lower molds 114 and 115 can be obtained with high reproducibility and high accuracy. In addition, the parameter setting unit 128 can change the first and second closing pressures PA and PB when the upper and lower molds 114 and 115 are changed. It is possible to flexibly cope with changes due to thermal expansion of each member accompanying long-time operation of the sealing device 100.

  Further, since the lower mold 115 is moved by the toggle link mechanism 130, for example, the lower mold 115 can be quickly moved by a ball screw or the like, so that the first and second molds 114 can be moved in a shorter time. , 115 can be detected.

  As the last step, the motor 116 is driven, the lower mold 115 is separated from the upper mold 114, and the contact detection operation of the upper and lower molds 114, 115 is completed (step S210).

  As another embodiment, with respect to the closing pressure measured by the closing pressure measuring means at a predetermined value or more and the mold position index value corresponding to the closing pressure measured by the mold position index value measuring means, The first and second mold contact positions where the calculation means estimates and calculates the corresponding mold position index value when the closing pressure is zero, using a correction coefficient obtained in advance in the resin sealing device. The detection mechanism can be configured.

  According to this configuration, for example, the closing pressure and the mold position index value (change modes thereof) are related in advance by a plurality of preliminary measurements between a plurality of resin sealing devices or in a specific resin sealing device. Obtain a correction coefficient, and use this correction coefficient to estimate and calculate the corresponding mold position index value when the closing pressure is zero (that is, the contact position of the molds of the first and second molds). To do. As a result, although there are only one measurement point for the closing pressure and the mold position index value, the detection accuracy of the contact positions of the first and second molds is at least as much as the correction by estimation and calculation. It can be improved further.

  In the above embodiment, an encoder is used as the mold position index value measuring means, but various mold position index value measuring means can be adopted as long as the mold position index value can be measured. For example, a resolver may be employed as the mold position index value measuring means. Unlike an encoder, a resolver has a simple structure and does not use electronic components. Therefore, it has little influence on performance due to dust, vibration, etc., and has excellent environmental resistance and reliability.

  In the above embodiment, the upper and lower mold contact positions are estimated by connecting the measured closing pressure and the mold position index value with straight lines and using these straight lines. Not only the work but from the relationship between the closing pressure and the mold position index value, if the corresponding mold position index value (contact position of the first and second molds) when the closing pressure is zero can be estimated. Other estimation work may be used. For example, the vertical axis and the horizontal axis of the coordinate axis are set to the mold position index value and the closing pressure, respectively, and the corresponding mold position index value is estimated when the closing pressure is zero in the graph excluding the concept of time t. You may do it. In addition, the number of measurement points of the closing pressure is increased to 3 or more, and from the relationship between the obtained closing pressure and the respective mold position index values corresponding to the closing pressure, the corresponding die is set when the closing pressure is zero. The mold position index value (the contact position of the first and second molds) may be estimated and calculated. As a result, the detection mechanism for the contact position of the mold can determine the relationship between the closing pressure and the mold position index value more precisely as the number of measurement points increases. The contact position of the second mold can be estimated with higher accuracy.

  In the above embodiment, the setting means sets the predetermined value (first closing pressure) PA to 20 kN which is a value larger than 10 kN, but the predetermined value is not necessarily limited to the above example. Note that, as described above, it is preferable to be able to change.

  In the above embodiment, the toggle link mechanism is attached to the second mold, and the toggle link mechanism also causes the first and second molds to approach and contact each other. The mechanism for approaching is not limited to the toggle link mechanism.

DESCRIPTION OF SYMBOLS 100 ... Resin sealing apparatus 114 ... Upper metal mold | die (1st metal mold | die)
115 ... Lower mold (second mold)
122. Encoder (mold position index value measuring means)
124 ... Load cell (closing pressure measuring means)
126. Calculation unit (calculation means)
P: Closing pressure PA ... Predetermined value (first closing pressure)
PB ... second closing pressure X ... mold position index value X0 ... corresponding mold position index value when the closing pressure is zero XA, XB ... first and second mold position index values

Claims (7)

In the resin sealing device that closes and contacts the first and second molds facing each other to apply a closing pressure, and seals the article to be sealed with resin,
Mold position index value measuring means for measuring a mold position index value that changes in relation to the relative positions of the first and second molds;
A closing pressure measuring means for measuring a closing pressure actually applied to the first and second molds;
Relationship between two or more closing pressures obtained after the closing pressure measured by the closing pressure measuring means becomes a predetermined value or more and the respective mold position index values corresponding to the two or more closing pressures From the calculation means for estimating and calculating the corresponding mold position index value when the closing pressure is zero,
Have
A mechanism for detecting the contact positions of the first and second molds, wherein the corresponding mold position index value when the closing pressure is zero is used as the contact position of the first and second molds; A resin sealing device. In claim 1,
The calculation means includes setting means for setting the predetermined value of the closing pressure,
The setting means sets the predetermined value of the pressure measuring means to a value larger than at least 10 kN. In claim 1 or 2,
From the relationship between three or more obtained closing pressures and the respective mold position index values corresponding to the closing pressures, a corresponding mold position index value is estimated and calculated when the closing pressure is zero. A resin sealing device. In claim 1,
The resin sealing device, wherein the calculating means includes setting means for setting the predetermined value of the closing pressure, and the setting means can change the predetermined value. In claim 1,
A resin-sealing device, wherein a toggle link mechanism is attached, and the toggle link mechanism causes the first and second molds to approach and contact. In a resin sealing device that closes and contacts the first and second molds facing each other to apply a closing pressure, and seals a sealed product with resin,
Mold position index value measuring means for measuring a mold position index value that changes in relation to the relative positions of the first and second molds;
A closing pressure measuring means for measuring a closing pressure actually applied to the first and second molds;
Obtained in advance in the resin sealing device from the closing pressure obtained after the closing pressure measured by the closing pressure measuring means becomes equal to or higher than a predetermined value and the mold position index value corresponding to the closing pressure. Calculating means for estimating and calculating a corresponding mold position index value when the closing pressure is zero,
Have
A mechanism for detecting the contact positions of the first and second molds, wherein the corresponding mold position index value when the closing pressure is zero is used as the contact position of the first and second molds; A resin sealing device. In the resin sealing method in which the first and second molds facing each other are approached and brought into contact with each other to apply a closing pressure, and the sealed product is sealed with a resin,
Prior to the resin sealing,
A procedure for detecting that the closing pressure applied to the first and second molds is equal to or higher than a predetermined value;
The first and second molds are associated with mold position index values that change in relation to the relative positions of the first and second molds after it is detected that the closing pressure has reached a predetermined value or more. A procedure for measuring two or more closing pressures currently applied to the mold,
From the relationship between the two or more measured closing pressures and the respective mold position index values corresponding to the two or more closing pressures, the corresponding mold position index value when the closing pressure is zero 1. Estimating / calculating the contact position of the second mold,
A method for confirming the contact positions of the first and second molds including the following: a resin sealing method.

Images