JP2013138092A - Electronic circuit module component and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic circuit module component which reduces cracks of a resin having a cavity and contacting with at least a part of an electronic component, and to provide a manufacturing method of the electronic circuit module component.SOLUTION: An electronic circuit module component 1 includes: an electronic component 2; a substrate 3; a first resin 4; and a second resin 9. The electronic component 2 is mounted on the substrate 3. The first resin 4 has a cavity 4H and contacts with at least a part of the electronic component 2. The second resin 9 covers a surface of the first resin 4 and has a void ratio lower than that of the first resin 4. The first resin 4 includes: a stress relaxation layer 42 provided at the second resin 9 side and containing a resin component 9M of the second resin 9; and a porous layer 41 that does not contain the resin component 9M of the second resin 9.

Description

  The present invention relates to an electronic circuit module component that covers an electronic component with an insulating resin, and a method for manufacturing the electronic circuit module component.

  Electronic circuit module parts are a group of electronic parts that have one or more functions by mounting multiple electronic parts, for example, passive elements, active elements, or ICs (Integrated Circuits) on a substrate. It is. For example, Patent Document 1 discloses a metal that is provided on the entire top surface of a multilayer substrate in a state where the entire electronic component is covered with a sealing resin portion made of an insulating material, and the electronic component is embedded, and is formed by plating or the like. A multilayer substrate in which a film is located between the entire surface of the upper surface portion of the sealing resin portion, the entire surface of a pair of side surfaces facing each other of the sealing resin portion, and the ground pattern between the upper surface of the multilayer substrate An electronic circuit unit provided on the entire surface of a pair of side surfaces facing each other is disclosed.

  Patent Document 2 discloses an electronic component, a substrate on which the electronic component is mounted, a first resin that has a gap and is in contact with at least a part of the electronic component, covers the first resin, and A second resin having a lower porosity than the first resin, a metal layer covering the first resin and the second resin and electrically connected to the ground of the substrate, and provided in the metal layer, An electronic circuit module component including an opening that exposes at least part of the first resin to the outside of the metal layer is described.

JP 2006-332255 A JP 2011-216849 A

  The electronic circuit module component covers the electronic component mounted on the substrate with the insulating resin, but depending on the manufacturing process and storage environment of the electronic circuit module component, moisture may enter the insulating resin or the mounted substrate and the electronic module. Sometimes. The moisture evaporates and expands by being heated in a reflow process when the electronic circuit module component is mounted on the electronic device. In the technique disclosed in Patent Document 1, since a metal layer is formed as a shield layer on the entire surface of the insulating resin, it is difficult for gas such as water vapor generated by heating during reflow to escape from the insulating resin. There is a possibility that the substrate may be cracked or the electronic circuit module component may be deformed.

  In addition, the technique disclosed in Patent Document 2 is such that the surface of an insulating resin of an electronic circuit module component is covered with a shield layer, and the electronic circuit module is heated by a reflow process when the electronic circuit module component is mounted on an electronic device. Facilitates the escape of gases such as water vapor generated inside module parts to the outside. In the technique disclosed in Patent Document 2, since the first resin includes voids, further suppression of cracks in the first resin is required.

  The present invention has been made in view of the above, and provides an electronic circuit module component and a method for manufacturing the electronic circuit module component that have a void and reduce the risk of cracking of resin that contacts at least a part of the electronic component. The purpose is to do.

  In order to solve the above-described problems and achieve the object, an electronic circuit module component according to the present invention includes an electronic component, a substrate on which the electronic component is mounted, a gap, and at least a part of the electronic component. A first resin in contact with the first resin, and a second resin that covers the first resin and has a lower porosity than the first resin, the first resin being provided on the second resin side, It includes a stress relaxation layer including a resin component of the second resin and a porous layer not including the resin component of the second resin.

  This electronic circuit module component can relieve the stress of the difference in thermal expansion that occurs between the second resin and the porous layer. For this reason, even if the porous layer of the 1st resin which touches at least one part of an electronic component has a space | gap, the possibility of the crack of a porous layer can be reduced.

  As a desirable aspect of the present invention, a metal layer that covers the first resin and the second resin and is electrically connected to the ground of the substrate, and is provided on the metal layer and is one of the porous layers. It is preferable that the maximum thickness of the stress relaxation layer in the opening is not less than 10 μm and not more than 200 μm.

  In this electronic circuit module component, the stress relaxation layer is in close contact between the second resin and the porous layer, so that the difference in thermal expansion between the second resin and the porous layer is alleviated. Cracks can be suppressed. Moreover, the risk that the stress relaxation layer itself applies stress to the porous layer can be suppressed.

  As a desirable aspect of the present invention, the thickness of the porous layer obtained by subtracting the maximum thickness of the stress relaxation layer from the thickness of the first resin is preferably 10 μm or more and 400 μm or less.

  This electronic circuit module component has an opening that exposes at least a portion of the porous layer to the outside of the metal layer while the porous layer of the first resin having a gap contacts at least a portion of the electronic component. With such a structure, at least a part of the electronic component is connected to the opening through the porous layer, so that a gas such as water vapor generated inside the electronic circuit module component due to heating during reflow flows in the porous layer. It is quickly discharged from the opening to the outside of the electronic circuit module component through the gap. As described above, in the electronic circuit module component, in a reflow process when mounted on an electronic device, a gas such as water vapor generated inside by heating is easily released to the outside. Moreover, even when the electronic circuit module component has a metal layer, an increase in pressure inside the component due to heating at the time of mounting is suppressed, so that the first resin or the second resin is cracked or the electronic circuit module component is deformed. The risk of doing so can be reduced.

  Moreover, the stress relaxation layer containing the resin component of the second resin has a lower porosity than the porous layer. For this reason, the porous layer discharges more gas such as water vapor generated inside the electronic circuit module component by heating during reflow than the stress relaxation layer by setting the thickness of the porous layer to 10 μm or more and 400 μm or less. , Cracks in the porous layer can be suppressed. As a result, since both the stress relaxation layer and the porous layer are present, it is possible to discharge a gas such as water vapor generated inside the electronic circuit module component due to heating during reflow, and the second resin and the porous layer. The stress of the difference in thermal expansion that occurs between the

  As a desirable aspect of the present invention, the porosity of the porous layer is preferably 5% by volume or more and 30% by volume or less, and the porosity of the stress relaxation layer is preferably 1% by volume or more and less than 5% by volume.

  With this configuration, the porous layer can more easily escape the gas generated inside the insulating resin, and can secure the strength of the porous layer. Moreover, the stress relaxation layer has a porosity lower than that of the porous layer by embedding the resin component of the second resin in the voids. When the porosity of the stress relaxation layer is 1% by volume or more and less than 5% by volume, the stress relaxation layer buffers between the thermal expansion of the second resin and the thermal expansion of the porous layer, and the second resin, the porous layer, It is possible to increase the reduction in stress due to the difference in thermal expansion occurring between the two.

  In order to solve the above-described problems and achieve the object, an electronic circuit module component manufacturing method according to the present invention includes a step of mounting an electronic component on a substrate, and the substrate on which the electronic component is mounted. A step of providing a first resin so as to be in contact with at least a part of the electronic component; a covering step of covering the first resin with a second resin; and a curing step of curing the second resin. The minimum dynamic shear viscosity of the resin component of the second resin is 350 Pa · s or more and 40000 Pa · s or less at a heating temperature of

  If the resin component of the second resin is such that the minimum dynamic shear viscosity is obtained by this method of manufacturing an electronic circuit module component, the thickness of the predetermined stress relaxation layer can be obtained. For this reason, an electronic circuit module component having a predetermined stress relaxation layer thickness is formed between the second resin and the porous layer by the stress relaxation layer being in close contact between the second resin and the porous layer. The difference in thermal expansion can be alleviated and cracks in the porous layer can be suppressed. In addition, the electronic circuit module component having a predetermined stress relaxation layer thickness can suppress the risk that the stress relaxation layer itself applies stress to the porous layer.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the electronic circuit module component which has a space | gap and reduces the possibility of the crack of the resin which contacts at least one part of an electronic component, and an electronic circuit module component can be provided.

FIG. 1 is a cross-sectional view of an electronic circuit module component according to this embodiment. FIG. 2 is a front view of the electronic circuit module component according to the present embodiment as viewed from the direction of arrow A in FIG. FIG. 3 is a conceptual diagram of the first resin included in the electronic circuit module component according to the present embodiment. FIG. 4 is a conceptual diagram for explaining a state in which the surface of the first resin shown in FIG. 3 is covered with the second resin. FIG. 5 is a cross-sectional view of an electronic circuit module component according to a modification of the present embodiment. FIG. 6 is a front view of the electronic circuit module component according to the modification of the present embodiment from the direction of arrow A in FIG. FIG. 7 is a side view showing a state where the electronic circuit module component according to the present embodiment and its modification is attached to a substrate. FIG. 8 is a plan view showing a state in which the electronic circuit module component according to the present embodiment and its modification is cut along a plane parallel to the substrate. FIG. 9 is a perspective view of an electronic circuit module component according to the present embodiment and its modification. FIG. 10 is a diagram illustrating a relationship between the first resin and the electronic component. FIG. 11 is a plan view showing an arrangement example of openings included in the electronic circuit module component according to the present embodiment and its modification. FIG. 12 is a plan view illustrating an arrangement example of openings included in the electronic circuit module component according to the present embodiment and the modification thereof. FIG. 13 is a side view illustrating an example of another opening included in the electronic circuit module component according to the present embodiment and the modification thereof. FIG. 14 is a flowchart showing a method for manufacturing the electronic circuit module component according to the present embodiment. FIG. 15A is an explanatory diagram of the method for manufacturing the electronic circuit module component according to the present embodiment. 15-2 is explanatory drawing of the manufacturing method of the electronic circuit module component which concerns on this embodiment. 15-3 is explanatory drawing of the manufacturing method of the electronic circuit module component which concerns on this embodiment. 15-4 is explanatory drawing of the manufacturing method of the electronic circuit module component which concerns on this embodiment. 15-5 is explanatory drawing of the manufacturing method of the electronic circuit module component which concerns on this embodiment. 15-6 is explanatory drawing of the manufacturing method of the electronic circuit module component which concerns on this embodiment. 15-7 is explanatory drawing of the manufacturing method of the electronic circuit module component which concerns on this embodiment. FIG. 16 is an explanatory view illustrating the viscoelastic characteristics of the resin component of the second resin. FIG. 17 is a plan view showing a cutting position after the substrate on which the electronic component is mounted is covered with the first resin and the second resin. 18-1 is explanatory drawing of the manufacturing method of the electronic circuit module component which concerns on the modification of this embodiment. 18-2 is explanatory drawing of the manufacturing method of the electronic circuit module component which concerns on the modification of this embodiment. 18-3 is explanatory drawing of the manufacturing method of the electronic circuit module component which concerns on the modification of this embodiment. FIG. 19 is an explanatory diagram showing the relationship between the dynamic shear viscosity of the resin component of the second resin and the thickness of the stress relaxation layer.

  DESCRIPTION OF EMBODIMENTS Hereinafter, modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The following embodiments do not limit the present invention. In addition, constituent elements disclosed in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be appropriately combined.

(Electronic circuit module parts)
FIG. 1 is a cross-sectional view of an electronic circuit module component according to this embodiment. FIG. 2 is a front view of the electronic circuit module component according to the present embodiment as viewed from the direction of arrow A in FIG. FIG. 3 is a conceptual diagram of the first resin included in the electronic circuit module component according to the present embodiment. FIG. 4 is a conceptual diagram for explaining a state in which the first resin shown in FIG. 3 is covered with the second resin. As shown in FIG. 1, an electronic circuit module component 1 is a component in which a plurality of electronic components 2 are mounted on a substrate 3 to have one or a plurality of functions and have a single function.

  The electronic component 2 is mounted on the surface of the substrate 3 or mounted inside the substrate 3. In the present embodiment, the electronic component 2 constituting the electronic circuit module component 1 includes, for example, a passive element such as a coil, a capacitor, or a resistor, and an active element such as a diode or a transistor. The electronic component 2 is not limited to these.

  As shown in FIG. 1, the electronic circuit module component 1 includes an electronic component 2, a substrate 3, a first resin 4, a second resin 9, a metal layer 5, and an opening 5H. The substrate 3 has the electronic component 2 mounted thereon. The electronic component 2 is mounted on the mounting surface of the substrate 3 (surface on which the electronic component 2 is mounted) with the solder 6.

  The substrate 3 includes a ground 8 between the first substrate 3A and the second substrate 3B. The ground 8 is a good electrical conductor such as Cu, and is electrically connected to a terminal connected to the terminal of the electronic component 2 provided on the mounting surface of the substrate 3 by a via hole or the like. When the mounting surface has a ground terminal, the ground 8 is electrically connected to the ground terminal by a via hole or the like.

  The substrate 3 has terminal electrodes (module terminal electrodes) 7 on the opposite side of the mounting surface. The module terminal electrode 7 is electrically connected to the electronic component 2 included in the electronic circuit module component 1. Further, when a ground terminal is provided on the opposite side of the mounting surface, the ground terminal and the ground 8 are electrically connected. Further, the substrate 3 has a circuit pattern on at least the surface, and may include a circuit pattern also inside the substrate 3 (for example, between the first substrate 3A and the second substrate 3B) as necessary. .

  The first resin 4 is in contact with at least a part of the electronic component 2. The first resin 4 and the second resin 9 are insulating resins having electrical insulation, and have a function of sealing the electronic component 2 on the substrate 3. The first resin 4 and the second resin 9 are, for example, fillers by adding a filler (for example, silica or alumina) to a thermosetting resin (for example, but not limited to an epoxy resin) and curing it. The said thermosetting resin is mix | blended with a part of clearance gap between them, and a space | gap is formed.

  The first resin 4 is a part of the first resin 4 on the second resin 9 side and includes the stress relaxation layer 42 including the resin component 9M of the second resin 9 and the resin component 9M of the second resin 9. Porous layer 41 not included. As shown in FIG. 3, as will be described later, the stress relaxation layer 42 and the porous layer 41 are originally formed in the same manner as the first resin 4 with a void 4H in the resin 4M. As shown in FIG. 4, the second resin 9 covers the surface of the first resin 4, and the resin component 9 </ b> M of the second resin 9 enters the void 4 </ b> H of the stress relaxation layer 42. The second resin 9 has a lower porosity than the porous layer 41 of the first resin 4. Further, the stress relaxation layer 42 has a lower porosity than the porous layer 41 of the first resin 4 because the resin component 9M is embedded in the void 4H. The porosity is a volume ratio (volume%) of the void 4H existing per unit volume.

  By making the porosity of the second resin 9 lower than that of the porous layer 41 of the first resin 4, the second resin 9 becomes stronger than the first resin 4. Such a second resin 9 seals the electronic component 2 together with the first resin 4 to the substrate 3 to ensure sufficient strength of the electronic circuit module component 1. The porosity of the second resin 9 may be 0% by volume.

  The stress relaxation layer 42 receives the resin component of the second resin 9 in the gap 4H. In the stress relaxation layer 42, the resin component of the second resin 9 permeates from the gap 4 </ b> H on the second resin 9 side, so that the unit of the resin component of the second resin 9 contained in the stress relaxation layer 42 is per unit volume. The proportion of the second resin 9 tends to be larger than that of the porous layer 41. Thus, the stress relaxation layer 42 gradually increases the ratio of the resin component of the second resin 9 contained in the stress relaxation layer 42 per unit volume in the direction from the second resin 9 side to the porous layer 41 side. By reducing the stress, the stress difference due to the thermal expansion difference can be relaxed.

  The metal layer 5 covers the first resin 4 and the second resin 9 and is electrically connected to the ground 8 of the substrate 3. In the present embodiment, the metal layer 5 is a thin film of a conductive material (a material having conductivity, which is a metal in the present embodiment). In the present embodiment, the metal layer 5 may be composed of a single conductive material or a layer of a plurality of conductive materials. The metal layer 5 is formed by plating, for example.

  The metal layer 5 covers the surfaces of the first resin 4 and the second resin 9 so that the electronic component 2 enclosed in the first resin 4 and the second resin 9 is made to be a high frequency from the outside of the electronic circuit module component 1. Noise, electromagnetic noise, etc. are shielded, and high frequency noise, electromagnetic noise, etc. radiated from the electronic component 2 are shielded. Thus, the metal layer 5 functions as an electromagnetic shield. By using the metal layer 5 as an electromagnetic shield, the outer shape of the electronic circuit module component 1 can be made smaller than when the sheet metal member is an electromagnetic shield.

  The opening 5H is provided in the metal layer 5 and exposes a part of the first resin 4 to at least the outside of the metal layer 5, that is, the outside of the electronic circuit module component 1. As shown in FIGS. 1 and 2, in the present embodiment, the opening 5 </ b> H exposes a part of the first resin 4 and a part of the second resin 9 to the outside of the metal layer 5. As will be described later, the opening 5 </ b> H may expose only a part of the first resin 4 to the outside of the metal layer 5.

  The opening 5H has a rectangular shape in plan view, and is open over the entire side of the electronic circuit module component 1 whose plan view is a rectangle or a quadrangle such as a square. The plan view of the electronic circuit module component 1 means a case where the electronic circuit module component 1 is viewed from a direction orthogonal to the plate surface of the substrate 3 of the electronic circuit module component 1. In addition, the shape of the electronic circuit module component 1 in plan view may be a quadrangle, and is not limited to a rectangle or a square. For example, a trapezoid or a rhombus may be used (the same applies hereinafter). The shape of the opening 5H is not limited to a rectangle.

  As shown in FIG. 2, the thickness of the metal layer 5 is t, the length of one side of the electronic circuit module component 1 provided with the opening 5H is L1, and the length of the long side of the opening 5H is L2. Then, L1 = L2 + 2 × t. The height of the opening 5H (the dimension of the opening 5H in the direction orthogonal to the substrate 3) is h, and is set according to the ability of the metal layer 5 to shield electromagnetic waves. The height of the first resin 4 exposed at the opening 5H (the dimension of the first resin 4 in the direction orthogonal to the substrate 3) is D. The height exposed at the opening 5H of the porous layer 41 (the dimension of the porous layer 41 in the direction perpendicular to the substrate 3) is d1, and the height exposed at the opening 5H of the stress relaxation layer 42 (with the substrate 3). The dimension of the stress relaxation layer 42 in the orthogonal direction is d2.

  As described above, the electronic circuit module component 1 includes the electronic component 2, the substrate 3, the first resin 4, and the second resin 9. The substrate 3 has the electronic component 2 mounted thereon. The first resin 4 has a gap 4H and is in contact with at least a part of the electronic component 2. The second resin 9 covers the surface of the first resin 4 and has a lower porosity than the first resin 4. The first resin 4 includes a stress relaxation layer 42 that includes the resin component 9M of the second resin 9 and a porous layer 41 that does not include the resin component 9M of the second resin 9 provided on the second resin 9 side. .

  The electronic circuit module component 1 can relieve the stress of the difference in thermal expansion that occurs between the first resin 4 and the second resin 9. For this reason, even if the porous layer 41 of the 1st resin 4 which contact | connects at least one part of the electronic component 2 has the space | gap 4H, the possibility of the crack of the porous layer 41 can be reduced.

  The electronic circuit module component 1 includes a metal layer 5 that covers the first resin 4 and the second resin 9 and is electrically connected to the ground 8 of the substrate 3, is provided on the metal layer 5, and is porous. An opening 5H that exposes at least a part of the layer 41 to the outside of the metal layer 8. The maximum thickness d2 of the stress relaxation layer 42 in the opening 5H is preferably 10 μm or more and 200 μm or less.

  In the electronic circuit module component 1, when d2 is 10 μm or more and 200 μm or less, the stress relaxation layer 42 can be in close contact between the second resin 9 and the porous layer 41. For this reason, the electronic circuit module component 1 can relieve the difference in thermal expansion generated between the second resin 9 and the porous layer 41 and suppress cracks in the porous layer 41. In addition, since the electronic circuit module component 1 has d2 of 10 μm or more and 200 μm or less, the stress relaxation layer 42 becomes too thick to suppress the possibility that the stress relaxation layer 42 itself applies stress to the porous layer 41. it can.

  In the electronic circuit module component 1, the thickness d1 of the porous layer obtained by subtracting the maximum thickness d2 of the stress relaxation layer 42 from the thickness D of the first resin 4 is preferably 10 μm or more and 400 μm or less.

  Further, the stress relaxation layer 42 including the resin component 9M of the second resin 9 has a lower porosity than the porous layer 41. Therefore, the porous layer 41 has a thickness d1 of the porous layer of not less than 10 μm and not more than 400 μm, so that gas such as water vapor generated inside the electronic circuit module component 1 due to heating during reflow is generated from the stress relaxation layer 42. Can be discharged, and cracks in the porous layer 41 can be suppressed. As a result, since both the stress relaxation layer 42 and the porous layer 41 are present, a gas such as water vapor generated inside the electronic circuit module component 1 due to heating during reflow can be discharged, and the second resin 9 And the stress of the difference in thermal expansion generated between the porous layer 41 and the porous layer 41 can be relaxed.

  FIG. 5 is a cross-sectional view of an electronic circuit module component according to a modification of the present embodiment. FIG. 6 is a front view of the electronic circuit module component according to the modification of the present embodiment from the direction of arrow A in FIG. The electronic circuit module component 1a is substantially the same as the electronic circuit module component 1 described above, except that the opening 5Ha exposes only a part of the first resin 4 to the outside of the metal layer 5a. Other configurations are the same as those of the electronic circuit module component 1.

  As shown in FIG. 5, the opening 5Ha of the electronic circuit module component 1a partially overlaps the first resin 4 in the height direction of the electronic circuit module component 1a. With such a structure, the opening 5Ha exposes only a part of the first resin 4 to the outside of the metal layer 5a. The height h of the opening 5Ha is smaller than the opening 5H of the electronic circuit module component 1 shown in FIG. For this reason, the electronic circuit module component 1a can make the area which the metal layer 5a covers the 1st resin 4 and the 2nd resin 9 larger than the electronic circuit module component 1 mentioned above. That is, the electronic circuit module component 1a can make the size of the opening 5Ha smaller than the electronic circuit module component 1 described above. As a result, the electronic circuit module component 1a can easily improve the shielding function of the metal layer 5a.

  FIG. 6 is a side view showing a state in which the electronic circuit module component according to the present embodiment and its modification is attached to a substrate. The electronic circuit module component 1, 1 a is formed by a terminal electrode (mounting substrate terminal electrode) 11 and a solder 6 on a substrate (a substrate included in an electronic device, hereinafter referred to as a mounting substrate) 10 to which the electronic circuit module component 1, 1 a is attached Be joined. In addition, the material which joins the electronic circuit module components 1 and 1a and the mounting substrate terminal electrode 11 is not limited to solder. For example, the electronic circuit module components 1, 1 a and the mounting board terminal electrode 11 may be joined using a conductive paste, a conductive adhesive, or the like. With such a structure, the electronic circuit module components 1, 1 a are attached to the mounting substrate 10. And an electric signal and electric power are exchanged between the electronic component 2 and the mounting substrate 10.

  A mounting substrate 10 shown in FIG. 7 is a substrate on which the electronic circuit module components 1 and 1a are mounted. For example, the mounting substrate 10 is mounted on an electronic device (such as an in-vehicle electronic device or a portable electronic device). The electronic circuit module components 1 and 1a are mounted on the mounting board 10 of the electronic device (secondary mounting) and become one of the components that exhibit the function of the electronic device. When mounting the electronic circuit module components 1, 1 a on the mounting substrate 10, for example, a solder paste containing solder 6 is applied to the mounting substrate terminal electrodes 11 by printing or the like, and the electronic circuit module components 1, 1 a are mounted using a mounting device. Mounted on the mounting substrate 10. Then, the mounting substrate 10 on which the electronic circuit module components 1 and 1a are mounted is passed through a reflow furnace, and the module terminal electrode 7 and the mounting substrate terminal electrode 11 are joined. As a result, the electronic circuit module components 1, 1 a are mounted on the mounting substrate 10.

  The electronic circuit module components 1 and 1a include a first resin 4 and a second resin 9 (hereinafter referred to as necessary) when the electronic component 2 is mounted on the substrate 3 and depending on the period and environment in which the electronic circuit module component 1 is stored. Moisture may enter the interior of the insulating resin). For example, when the substrate 3 is a resin substrate, moisture enters from the insulating resin and the surface of the substrate 3 and the contact interface between the insulating resin and the substrate 3, but when an inorganic material such as ceramics is used for the substrate 3, Moisture enters mainly from the insulating resin and the contact interface between the insulating resin and the substrate 3. For this reason, when the electronic circuit module components 1, 1 a are mounted on the mounting substrate 10, the water that has entered the electronic circuit module components 1, 1 a evaporates and water vapor (gas) may be generated.

  In the electronic circuit module components 1 and 1a, the metal layer 5 covers the surface of the insulating resin, so that it is difficult for the evaporated moisture to escape from the insulating resin. For this reason, in the electronic circuit module components 1 and 1a, the internal pressure of the electronic circuit module components 1 and 1a (hereinafter referred to as component internal pressure) increases. As a result, the insulating resin may be cracked or the electronic circuit module components 1 and 1a may be deformed. In order to suppress the possibility of cracking of the insulating resin and the deformation of the electronic circuit module components 1 and 1a, in the present embodiment and its modification, openings 5H and 5Ha are provided in the metal layers 5 and 5a, and heating during reflow is performed. Moisture that has evaporated and expanded due to the water (water vapor and gas) is easily removed from the electronic circuit module components 1 and 1a, and the increase in the internal pressure of the electronic circuit module components 1 and 1a is suppressed.

  FIG. 8 is a plan view showing a state in which the electronic circuit module component according to the present embodiment and its modification is cut along a plane parallel to the substrate. FIG. 9 is a perspective view of an electronic circuit module component according to the present embodiment and its modification. The electronic circuit module component 1, 1 a has a plurality of electronic components 2. The first resin 4 is in contact with at least a part of the plurality of electronic components 2. In the present embodiment and its modification, as shown in FIGS. 1 and 5, the first resin 4 covers all the electronic components 2, and the first resin 4 is in contact with the entire tops of all the electronic components 2. ing. Further, as shown in FIGS. 1, 5, and 8, the first resin 4 is in contact with the entire side portions of all the electronic components 2. Due to such a configuration, in the electronic circuit module components 1 and 1a, the first resin 4 is in contact with the surface of the electronic component 2 except for the substrate facing surface, and the first resin 4 is in contact with all the electronic components 2. Yes. The first resin 4 is at least partially exposed to the outside of the metal layers 5 and 5a at the positions of the openings 5H and 5Ha. For this reason, at least a part of all the electronic components 2 is connected to the openings 5H and 5Ha via the first resin 4.

  Since the 1st resin 4 has a space | gap in the porous layer 41, gas passes easily. For this reason, by adopting the above-described structure, the gas V such as water vapor generated inside the electronic circuit module components 1 and 1a due to the heating during the reflow passes through the gap 4H shown in FIG. 3 and the openings 5H and 5Ha. To the outside of the electronic circuit module component 1, 1a. As a result, even when the electronic circuit module component 1, 1 a has the metal layer 5, an increase in the internal pressure of the component during reflow is suppressed, so that the insulating resin cracks and the electronic circuit module component 1, 1 a is deformed. The fear can be effectively suppressed. Thus, according to this embodiment and its modification, generation | occurrence | production of the defect of the electronic circuit module components 1 and 1a can be suppressed. Moreover, according to this embodiment and its modification, since generation | occurrence | production of the electronic circuit module components 1 and 1a can be suppressed effectively and quality can be maintained, the function of the electronic circuit module components 1 and 1a is fully demonstrated. Can be made.

  The openings 5H and 5Ha of the electronic circuit module components 1 and 1a are opened over the entire side of the electronic circuit module components 1 and 1a that are rectangular or square in plan view. For this reason, the gas V inside the electronic circuit module components 1, 1 a is discharged from the entire side of the electronic circuit module components 1, 1 a to the outside of the electronic circuit module components 1, 1 a. As a result, the openings 5H and 5Ha can efficiently release the gas generated in the electronic circuit module components 1 and 1a to the outside, which may cause cracking of the insulating resin and deformation of the electronic circuit module components 1 and 1a. Can be avoided reliably.

  When the height h of the openings 5H and 5Ha is reduced, the deterioration of the electromagnetic wave noise shielding function by the metal layers 5 and 5a is increased. By providing the openings 5H and 5Ha over the entire side of the electronic circuit module component 1, 1a, it is possible to secure the area of the openings 5H and 5Ha while suppressing an increase in the height h of the openings 5H and 5Ha. it can. Accordingly, if the openings 5H and 5Ha are provided over the entire side of the electronic circuit module component 1, 1a, the height h of the openings 5H and 5Ha can be suppressed, so that the opening of the electromagnetic wave can be secured while ensuring the electromagnetic wave shielding function. The parts 5H and 5Ha can efficiently release the gas.

  Since the porous layer 41 of the first resin 4 has voids, the strength is slightly lower than that of the second resin 9. When both a part of the first resin 4 and a part of the second resin 9 are exposed to the outside of the metal layer 5 like the opening 5H shown in FIG. 2, the electronic circuit module component 1 is exposed as described later. 1a is advantageous in the production process. Further, since the thickness of the first resin 4 (the dimension in the direction orthogonal to the substrate 3) is smaller than the thickness of the second resin 9, only a part of the first resin 4 is formed like the opening 5Ha shown in FIG. Is exposed to the outside of the metal layer 5a, the height h of the opening 5Ha is reduced. As a result, the metal layer 5a can shield electromagnetic waves more effectively. Further, if the lengths of the long sides of the openings 5H and 5Ha are the same, the amount of moisture entering from the first resin 4 can also be suppressed.

  The voids 4H included in the porous layer 41 of the first resin 4 are formed, for example, by adding a filler to the resin serving as the base material of the first resin 4 and curing the resin so that the resin is blended in the gaps between the fillers. The If the porosity is less than 5% by volume, the speed at which the gas generated in the electronic circuit module component 1 or 1a moves through the first resin 4 is reduced, and thus the increase in the component internal pressure may not be efficiently suppressed. . Moreover, when the porosity of the porous layer 41 exceeds 50 volume%, there exists a possibility that the intensity | strength of the porous layer 41 may fall and it may become easy to produce a crack etc. Therefore, the porosity of the porous layer 41 is more preferably 5% by volume or more and 30% by volume or less. In this way, it is possible to reliably suppress an increase in the component internal pressure in the secondary mounting while ensuring the strength of the first resin 4.

  The porosity is calculated as follows. In the present embodiment and its modification, the completed electronic circuit module component 1, 1 a is cut at an appropriate position, and a cut surface without resin sagging is produced by ion milling the cut surface. Then, an image obtained by photographing an arbitrary three places on the cut surface with a scanning electron microscope (SEM, magnification is 3000 times) was binarized so that only the gap 4H was black, and obtained. From the image, the void ratio is calculated as the volume ratio of the voids. In this embodiment and its modification, the ratio of the area of the void to the total area of the image obtained by the photography is regarded as the volume ratio of the void.

  As described above, the stress relaxation layer 42 has a lower porosity than the porous layer 41 of the first resin 4 because the resin component 9M is embedded in the void 4H. When the porosity of the stress relaxation layer 42 is smaller than 1% by volume, the difference in the thermal expansion coefficient of the stress relaxation layer 42 with respect to the thermal expansion coefficient of the second resin 2 is reduced, and the stress reduction effect is reduced. Therefore, the porosity of the stress relaxation layer 42 is more preferably 1% by volume or more and less than 5% by volume.

  In the electronic circuit module component 1, 1 a according to this embodiment, the porosity of the porous layer 41 is 5% by volume or more and 30% by volume or less, and the porosity of the stress relaxation layer 42 is 1% by volume or more and less than 5% by volume. I have to. The stress relaxation layer 42 adjusts the porosity of the stress relaxation layer 42 by embedding the resin component 9M in the void 4H. As another forming method for adjusting the porosity of the stress relaxation layer 42, the electronic circuit module component 1, 1 a according to the present embodiment is configured so that the porosity of the porous layer 41 is 5% by volume or more and 30% by volume or less. The porous layer 41 may be formed, and then the stress relaxation layer 42 may cover the porous layer 41 by reducing the porosity of the stress relaxation layer 42 to 1% by volume or more and less than 5% by volume.

  FIG. 10 is a diagram illustrating a relationship between the first resin and the electronic component. As shown in FIGS. 1 and 5, in the electronic circuit module components 1 and 1a described above, the first resin 4 covers the top of the electronic component 2. However, as shown in FIG. The top 2T of the component 2 may not be covered. In this case, the passage of the gas generated from the vicinity of the electronic component 2 is ensured so that the first resin 4 contacts at least a part of the side portion 2S of the electronic component 2. In this way, the second resin 9 comes into contact with the top 2T of the electronic component 2, and the first resin 4 is not interposed between the top 2T and the second resin 9. As a result, the height of the electronic circuit module components 1 and 1a can be reduced by the amount that the first resin 4 does not exist on the surface of the top 2T of the electronic component 2, which is advantageous for reducing the height of the electronic circuit module components 1 and 1a. It is. In order to prevent the first resin 4 from covering the top part 2T of the electronic component 2, the first resin 4 covers the electronic part 2 and then rolls an absorption roller or the like on the top part 2T. 1 Resin 4 is removed with an absorption roller or the like.

  FIG. 11 and FIG. 12 are plan views showing examples of arrangement of openings included in the electronic circuit module component according to the present embodiment and its modification. In FIG. 8, the electronic circuit module components 1, 1 a having a rectangular shape such as a rectangle or a square in plan view have openings 5 </ b> H, 5 Ha on one side of the four sides. As shown in FIG. 11, the electronic circuit module component 1, 1 a may have openings 5 </ b> H <b> 1, 5 </ b> H <b> 2 on two sides of the four sides, and may have metal layers 5, 5 a on the remaining two sides. The openings 5H1 and 5H2 are arranged to face each other. Moreover, like the electronic circuit module components 1 and 1a shown in FIG. 12, you may have the opening parts 5H1, 5H2, and 5H3 in three sides among four sides, and may have the metal layers 5 and 5a in the remaining one side. . The openings 5H1 and 5H2 are arranged to face each other, and the opening 5H3 is arranged to face the metal layers 5 and 5a. As shown in FIG. 2, the openings 5H1, 5H2, and 5H3 may expose both a part of the first resin 4 and a part of the second resin 9 to the outside of the metal layers 5 and 5a. As shown in FIG. 6, only a part of the first resin 4 may be exposed to the outside of the metal layers 5 and 5a.

  Thus, in this embodiment and its modification, the number of the opening parts which the electronic circuit module components 1 and 1a have is not limited to one. If the number of openings increases, the distance difference between the plurality of electronic components 2 incorporated in the electronic circuit module components 1 and 1a and the openings can be reduced, so that the electronic circuit module components 1 and 1a are generated more efficiently. The released gas can be released to the outside. As a result, it is possible to more reliably avoid the risk of cracking the insulating resin and deformation of the electronic circuit module components 1 and 1a. Note that increasing the number of openings may affect the electromagnetic wave shielding function of the metal layers 5 and 5a. Therefore, it is possible to set the number and area of openings based on the balance between the escape of gas and the shielding function. preferable.

  The electronic circuit module component 1, 1a most preferably has openings 5H, 5Ha only on one side. In this way, the internal pressure of the component can be reliably reduced during reflow in the secondary mounting, and the cracking of the insulating resin and the swelling of the electronic circuit module components 1 and 1a can be reliably suppressed, and further, electromagnetic waves can be applied to the metal layers 5 and 5a. The shielding function can be surely exhibited. However, it does not exclude that the electronic circuit module component 1, 1a has the openings 5H, 5Ha on two sides or three sides. For example, when the electronic circuit module components 1 and 1a are secondarily mounted in a place with high humidity, the electronic circuit module components 1 and 1a are considered to have a large amount of moisture inside. In such a case, the electronic circuit module components 1 and 1a have openings 5H and 5Ha on two or three sides, so that the openings 5H and 5Ha can efficiently supply gas during reflow in secondary mounting. Can be released. As a result, even when a large amount of moisture permeates inside the electronic circuit module components 1 and 1a, it is possible to reliably suppress cracking of the insulating resin and swelling of the electronic circuit module components 1 and 1a.

  FIG. 13 is a side view illustrating an example of another opening included in the electronic circuit module component according to the present embodiment and the modification thereof. The opening 5Hb of the electronic circuit module component 1b has a rectangular shape in plan view, and opens in a part of one side of the electronic circuit module component 1b whose plan view is a rectangle or a square such as a square. When the thickness of the metal layer 5b is t, the length of one side of the electronic circuit module component 1b provided with the opening 5Hb is L1, and the length of the long side of the opening 5Hb is L2, L1> L2 + 2 × t It becomes. With this structure, the electromagnetic wave shielding function of the metal layer 5b can be more effectively exhibited.

  As shown in FIG. 2, the opening 5Hb may expose both a part of the first resin 4 and a part of the second resin 9 to the outside of the metal layer 5b, or as shown in FIG. In addition, only a part of the first resin 4 may be exposed to the outside of the metal layer 5b. Further, the opening 5Hb may be provided on the other side of the electronic circuit module component 1b whose plan view is a rectangle such as a rectangle or a square, or a plurality of openings 5Hb may be provided on the same side. The shape of the opening 5Hb is not limited to a rectangle. The opening 5Hb is formed, for example, by masking a portion of the metal layer 5b where the opening 5Hb is not provided with a resist or the like and etching a portion where the opening 5Hb is provided. Next, a method for manufacturing the electronic circuit module component according to this embodiment will be described.

(Method for manufacturing electronic circuit module parts)
FIG. 14 is a flowchart showing a method for manufacturing the electronic circuit module component according to the present embodiment. 15-1 to 15-7 are explanatory diagrams of the method of manufacturing the electronic circuit module component according to the present embodiment. FIG. 16 is an explanatory diagram showing the relationship between the dynamic shear viscosity of the resin component of the second resin and the thickness of the stress relaxation layer. FIG. 17 is a plan view showing a cutting position after the substrate on which the electronic component is mounted is covered with the first resin and the second resin. First, an example of manufacturing the electronic circuit module component 1 shown in FIGS. 1 and 2 will be described. In step S1, the electronic component 2 is mounted on the substrate 3 shown in FIG. 15-1 (mounting process). A ground 8 is provided inside the substrate 3. The substrate 3 on which the electronic component 2 is mounted is referred to as a module element body 1A.

The module body 1A is produced, for example, by the following procedure.
(1) A solder paste containing the solder 6 is printed on the terminals provided on the mounting surface of the substrate 3.
(2) The electronic component 2 is mounted on the substrate 3 using a mounting device (mounter).
(3) The substrate 3 on which the electronic component 2 is mounted is placed in a reflow furnace and the solder paste is heated, so that the solder 6 of the solder paste is melted and then cured, whereby the terminals of the electronic component 2 and the substrate 3 The terminal electrode is joined.
(4) The flux adhering to the surface of the electronic component 2 or the substrate 3 is washed.

  When the module element body 1A is completed, the process proceeds to step S2, and as shown in FIG. 15-2, on the substrate 3 on which the electronic component 2 is mounted, that is, to contact at least a part of the electronic component 2 of the module element body 1A. Further, the first resin 4 is provided on the substrate 3. In this example, the first resin 4 covers the electronic component 2 and the substrate 3. The first resin 4 is obtained by adding a filler (for example, silica or alumina) to a thermosetting resin (for example, but not limited to an epoxy resin) and curing the filler. For example, the first resin 4 is obtained by adding a solution of the first resin 4 prepared by adding a filler to a thermosetting resin solution by a dipping method, a nozzle coating method, a curtain coating method, a spin coating method, or the like. It is applied to the surface (application process) and thermally cured. By doing in this way, the electronic component 2 and the board | substrate 3 are coat | covered with the 1st resin 4 by which resin was mix | blended with a part of clearance gap between fillers and the space | gap 4H was formed.

  The filler contained in the first resin 4 is preferably close to a spherical shape. This is because if such a filler is used, the size, shape, and distribution of the voids 4H included in the first resin 4 can be easily controlled. However, the shape of the filler is not limited to this. The filler contained in the first resin 4 preferably has an average diameter (D50) of 1 μm to 10 μm, and more preferably 2 μm to 5 μm. The particle size distribution of all fillers is preferably such that D50 / (D90-D10) is 0.2 or more. If it does in this way, it will become easy to disperse | distribute the filler and the space | gap 4H in the 1st resin 4 equally. The average diameter (D50) is a diameter with an integrated value of 50% (median diameter) when the diameters of a plurality of fillers are measured, D90 is a diameter with an integrated value of 90%, and D10 is a diameter with an integrated value of 10%. It is. The particle size distribution of the filler was defined from the number average value (median diameter) D50 measured by a particle size distribution meter, D10 corresponding to 10% of the cumulative frequency particle size, and D90 corresponding to 90%.

  The type of filler is not particularly limited as long as it does not affect the electrical characteristics of the electronic component 2 and the circuit included in the electronic circuit module component 1, but the filler is not limited to the thermosetting resin used as the first resin 4. On the other hand, it is preferable that the dispersibility is good. For example, if a filler having an average diameter smaller than 1 μm is used, the void size decreases or the filler filling rate into the void increases, and as a result, the void ratio decreases. To reduce. If a filler having an average diameter larger than 5 μm is used, the film thickness when applied to the surface of the module body 1A is increased, and the external height of the electronic circuit modules 1 and 1a may have to be increased. Furthermore, if a filler having an average diameter larger than 10 μm is used, the strength of the formed first resin 4 may be reduced, and cracks may be easily generated.

  The filler contained in the second resin 9 may be a combination of a small average diameter (D50) and a large average diameter (D50). The average diameter (D50) of the large filler is preferably 10 μm or more and 30 μm or less. Moreover, it is preferable that the average diameter (D50) of a small filler is 1 micrometer or more and 5 micrometers or less. Moreover, it is preferable that the particle size distribution of all the fillers sets D50 / (D90-D10) to 0.2 or less. Thus, by mixing fillers having different average diameters, the packing state between the fillers can be adjusted. And it becomes easy to implement | achieve a desired space | gap diameter and space | gap distribution by appropriate resin compounding. When using fillers having different average diameters, the same type of filler may be used, or different types (compositions) of fillers may be used, and there is no particular limitation. In addition, the particle size distribution (D50 / (D90-D10)) of all fillers contained in the second resin 9 is made smaller than the particle size distribution (D50 / (D90-D10)) of all fillers contained in the first resin 4. It is preferable. Thereby, when the 2nd resin 9 contains a filler, the porosity of the 2nd resin 9 can be made lower than the porosity of the 1st resin 4.

  In step S2, when the solution of the first resin 4 is applied to the surface of the module body 1A, the thermosetting resin is cured by heating for a predetermined time. Thus, the first resin 4 is provided on the surface of the module element body 1A, and at least a part of the electronic component 2 and the first resin 4 are in contact with each other. Next, when step S2 ends, the process proceeds to step S3, and the first resin 4 is covered with the second resin 9 as shown in FIG. The second resin 9 is, for example, an epoxy resin.

  In the present embodiment, an epoxy resin sheet material is placed on the surface of the first resin 4 (covering step). When step S3 ends, the process proceeds to step S4, where the second resin 9 is hot-pressed to cure the second resin 9 as shown in FIG. 15-4 (curing step). In this way, the surface of the first resin 4 is sealed with the second resin 9.

  Here, the resin component of the second resin 9 has a different dynamic shear viscosity at the curing temperature, as shown in FIG. Further, as shown in FIG. 16, Resin Example 1 and Resin Example 2 having different resin components differ in the characteristic behavior of the dynamic shear viscosity with respect to the curing temperature. In the characteristic behavior of the dynamic shear viscosity, the lowest value is the lowest dynamic shear viscosity. In FIG. 16, the minimum dynamic shear viscosity of Resin Example 1 is 12000 Pa · s. In FIG. 16, the minimum dynamic shear viscosity of Resin Example 2 is 1000 Pa · s. The dynamic shear viscosity is a value measured according to JIS standard K7244-10.

  In the curing step (step S <b> 4), the heating and pressure of the hot press can permeate the resin component of the second resin 9 into the gap 4 </ b> H of the first resin 4. And the distance which the resin component of the 2nd resin 9 osmose | permeates to the space | gap 4H of the 1st resin 4 changes according to the dynamic shear viscosity in hardening temperature. That is, the thickness of the stress relaxation layer 42 changes according to the dynamic shear viscosity at the curing temperature. As in an evaluation example to be described later, the electronic circuit module component manufacturing method according to the present embodiment has a minimum dynamic shear viscosity of the resin component 9M of the second resin 9 of 350 Pa · s or more and 40000 Pa · at the heating temperature in the curing step. s or less. Thereby, in a hardening process (step S4), the thickness of the maximum value of the stress relaxation layer 42 of the opening part 5H mentioned above can be 10 micrometers or more and 200 micrometers or less. As a result, the electronic component 2 is sealed with the second resin 9 through the first resin 4, and the first resin 4 includes the stress relaxation layer 42 including the resin component of the second resin 9 and the second resin 9. The porous layer 41 does not contain a resin component. The substrate 3 in this state is referred to as a sealing body 1B.

  Next, it progresses to step S5, and as shown to FIGS. 15-5, the board | substrate 3 of the sealing body 1B is cut | disconnected to the middle by the unit (henceforth a module component unit) U of the electronic circuit module component 1 (referring to FIG. Half dicing). In this case, the position of the cutting line C1 is cut to the middle of the substrate 3, and the position of the cutting line C2 is cut to the middle of the second resin 9. The position of the cutting line C2 is a portion where the opening 5H shown in FIGS. 1 and 2 is provided. That is, in step S5, at least a part of the periphery of the part that becomes one electronic circuit module component 1 is cut to the middle of the substrate 3, and the remaining part is cut to the middle of the layer of the second resin 9. In the half dicing, only the middle of the second resin 9 is cut, so the first resin 4 is not cut. Since the strength of the first resin 4 is lower than that of the second resin 9, the first resin 4 can be protected by the second resin 9 by not cutting the first resin 4 in half dicing. As a result, it is possible to avoid opening the first resin 4 unnecessarily and to provide the opening 5H reliably.

  In addition, a part of the first resin 4 appears at the position of the cutting line C1 by half dicing. However, since the surface area is increased by the gap 4H of the first resin 4, the adhesion between the metal layer 5 and the first resin 4 is improved. improves. As a result, when the metal layer 5 is formed, there is an advantage that the shape retaining effect of the metal layer 5 formed in the portion where the first resin 4 appears is enhanced. The module component unit U is an area defined by the cutting lines C1 and C2 shown in FIGS. 15-5 and 17.

  The height h (see FIG. 2) of the opening 5H of the electronic circuit module component 1 will be described. If the height h of the opening 5H is too small, the first resin 4 may be scraped off in step S5. If the height h of the opening 5H is too large, the opening 5H becomes too large and the metal layer 5 may affect the electromagnetic wave shielding function. From such a viewpoint, the height h of the opening 5H is larger than the thickness of the first resin 4 and is preferably 1 to 5 times the thickness of the first resin 4. More preferably, the height h of the opening 5H is not less than 2 times and not more than 3 times the thickness of the first resin 4. If the height h of the opening 5H is within this range, it is possible to reliably provide the opening 5H by avoiding scraping the first resin 4 in step S5, so that the internal pressure of the component is ensured during reflow in secondary mounting. Can be lowered. In addition, when the height h of the opening 5H is within the above range, the metal layer 5 can sufficiently exhibit the electromagnetic wave shielding function with the opening 5H having an appropriate size.

  When step S5 ends, the process proceeds to step S6. In step S6, as shown to FIGS. 15-6, the metal layer 5 is formed in the surface of the sealing body 1B after half dicing. The state in which the metal layer 5 is formed is referred to as a module assembly 1C. The metal layer 5 is obtained, for example, by forming a first layer of Cu by electroless plating, then forming a second layer of Cu by electrolytic plating, and further forming a Ni layer as an anticorrosive layer by electrolytic plating. It is done. As shown in FIG. 15-5, the ground 8 is exposed on the side surface 3S of the substrate 3 before the metal layer 5 is formed. Therefore, when the metal layer 5 is formed in step S6, the metal layer 5 and the ground 8 are electrically connected as shown in FIG. 15-6. On the side surface 3S of the substrate 3, the ground 8 is exposed to at least one side (three sides in this example) of the module component unit U shown in FIG. For this reason, the connection area between the metal layer 5 and the ground 8 is increased, and conduction between the two is ensured.

  When the metal layer 5 is formed, the process proceeds to step S7, and the module assembly 1C is completely cut up to the substrate 3 by the module component unit U. That is, the substrate 3 is cut along the cutting lines C1 and C2. As a result, the electronic circuit module component 1 shown in FIG. 15-7 is obtained. The electronic circuit module component 1 is inspected in step S8, and a product that passes the inspection becomes a product. The procedure described above is the procedure of the method for manufacturing the electronic circuit module component according to the present embodiment. By these procedures, as shown in FIG. 15-7, at least a part of the electronic component 2 is in contact with the first resin 4, the first resin 4 and the second resin 9 are covered with the metal layer 5, and the opening portion The electronic circuit module component 1 in which a part of the first resin 4 and a part of the second resin 9 are exposed to 5H can be manufactured.

  18A to 18C are explanatory diagrams of a method for manufacturing an electronic circuit module component according to a modification of the present embodiment. The method for manufacturing an electronic circuit module component according to this modification is used when manufacturing the electronic circuit module component 1a shown in FIGS. Steps S1 to S3 are the same as the method for manufacturing the electronic circuit module component 1 described above. In step S5, as shown in FIG. 18A, the substrate 3 of the sealing body 1B is cut halfway by a unit U (hereinafter referred to as a module component unit) U of the electronic circuit module component 1a (half dicing). In this case, the position of the cutting line C1 is cut to the middle of the substrate 3, and the position of the cutting line C2 is cut to the middle of the first resin 4. The position of the cutting line C2 is a position where the opening 5Ha shown in FIGS. 5 and 6 is provided. That is, in step S5, at least a part of the periphery of the part to be one electronic circuit module component 1a is cut to the middle of the substrate 3, and the remaining part is cut to the middle of the layer of the first resin 4. The height h of the opening 5Ha is adjusted by adjusting the amount of cutting the first resin 4 in half dicing. If the first resin 4 is cut to a portion closer to the substrate 3, the height h of the opening 5Ha can be reduced, so that the deterioration of the electromagnetic wave shielding function by the metal layer 5a can be minimized.

  The height h (see FIG. 6) of the opening 5Ha of the electronic circuit module component 1a will be described. If the height h of the opening 5Ha is too small, the substrate 3 is shaved in step S5, and the opening 5Ha may not be provided in the metal layer 5a. If the height h of the opening 5Ha is too large, part of the second resin 9 may be exposed from the opening 5Ha. From this point of view, the height h of the opening 5Ha is smaller than the thickness of the first resin 4 and is preferably 0.1 to 0.9 times the thickness of the first resin 4. More preferably, the height h of the opening 5Ha is not less than 0.3 times and not more than 0.8 times the thickness of the first resin 4. If the height h of the opening 5Ha is within this range, it is possible to reliably provide the opening 5Ha while avoiding scraping the substrate 3 in step S5, so that the internal pressure of the component is reliably reduced during reflow in secondary mounting. Can be made. Further, if the height h of the opening 5Ha is within the above range, only a part of the first resin 4 is exposed from the opening 5Ha, and the metal layer 5a can sufficiently exhibit the electromagnetic wave shielding function.

  When step S5 ends, the process proceeds to step S6. In step S6, as shown in FIG. 18-2, the metal layer 5a is formed on the surface of the sealing body 1B after the half dicing, and the module assembly 1C is manufactured. The method for forming the metal layer 5a is as described above. When the metal layer 5a is formed, the process proceeds to step S7, and the module assembly 1C is completely cut up to the substrate 3 by the module component unit U. As a result, the electronic circuit module component 1a shown in FIG. 18-3 is obtained. The electronic circuit module component 1a is inspected in step S8, and a product that passes the inspection becomes a product. The procedure described above is the procedure of the method for manufacturing the electronic circuit module component according to this modification. By these procedures, as shown in FIG. 18-2, at least a part of the electronic component 2 is in contact with the first resin 4, and the first resin 4 and the second resin 9 are covered with the metal layer 5, and the opening portion An electronic circuit module component 1a in which only a part of the first resin 4 is exposed at 5Ha can be manufactured.

  As described above, in the electronic circuit module component manufacturing method according to the present embodiment, if the resin component 9M of the second resin 9 has the lowest dynamic shear viscosity, the predetermined stress relaxation layer thickness d2 and can do. For this reason, in the electronic circuit module component 1 having the predetermined stress relaxation layer thickness d2, the stress relaxation layer 42 is in close contact between the second resin 9 and the porous layer 41, so that the second resin 9 and the porous layer 41 are porous. The difference in thermal expansion that occurs between the layer 41 and the layer 41 can be reduced, and cracks in the porous layer 41 can be suppressed. Further, in the electronic circuit module component 1 having the predetermined stress relaxation layer thickness d2, it is possible to suppress the possibility that the stress relaxation layer 42 is too thick and the stress relaxation layer 42 itself applies stress to the porous layer 41. it can.

(Evaluation example)
Evaluation examples 1 to 12 of the electronic circuit module component 1 according to the first embodiment described above were manufactured. The size of the substrate 3 used is 150 mm × 150 mm × 0.3 mm. In each of Evaluation Examples 1 to 12, the average diameter (D50) of the filler contained in the first resin 4 was 3 μm, and the particle size distribution of the filler was 0.6. The porosity of the porous layer 41 is 25% by volume. As the second resin, Resin Example 1 showing the dynamic shear viscosity behavior shown in FIG. 16 was used. In Evaluation Examples 1 to 12, the thickness of the first resin layer in the opening 5H was set to 10 μm or more and 500 μm or less.

  Hereinafter, “the thickness of the stress relaxation layer” refers to the maximum thickness of the stress relaxation layer 42 in the opening 5H, and “the thickness of the porous layer” refers to the maximum thickness of the porous layer 41 in the opening 5H. Is a thickness obtained by subtracting the maximum thickness of the stress relaxation layer 42 from the thickness of the porous line on the extended line, that is, the thickness of the first resin 4. In Evaluation Example 1, the thickness of the stress relaxation layer was 5 μm, and the thickness of the porous layer was 5 μm. In Evaluation Example 2, the thickness of the stress relaxation layer was 10 μm, and the thickness of the porous layer was 0 μm. That is, in the evaluation example 2, all the first resin layers are stress relaxation layers.

  Similarly, in Evaluation Example 3, the thickness of the stress relaxation layer was 7 μm, and the thickness of the porous layer was 13 μm. In Evaluation Example 4, the thickness of the stress relaxation layer was 10 μm, and the thickness of the porous layer was 10 μm. In Evaluation Example 5, the thickness of the stress relaxation layer was 20 μm, and the thickness of the porous layer was 10 μm. In Evaluation Example 6, the thickness of the stress relaxation layer was 20 μm, and the thickness of the porous layer was 130 μm. In Evaluation Example 7, the thickness of the stress relaxation layer was 20 μm, and the thickness of the porous layer was 300 μm. In Evaluation Example 8, the thickness of the stress relaxation layer was 20 μm, and the thickness of the porous layer was 400 μm. In Evaluation Example 9, the thickness of the stress relaxation layer was 20 μm, and the thickness of the porous layer was 430 μm. In Evaluation Example 10, the thickness of the stress relaxation layer was 200 μm, and the thickness of the porous layer was 250 μm. In Evaluation Example 11, the thickness of the stress relaxation layer was 250 μm, and the thickness of the porous layer was 200 μm. In Evaluation Example 12, the thickness of the stress relaxation layer was 20 μm, and the thickness of the porous layer was 480 μm.

  In the water absorption reflow test, evaluation examples 1 to 12 of the electronic circuit module component 1 in which the moisture-absorbed semiconductor package is mounted on the substrate 3 as the electronic component 2 described above are manufactured, and these evaluation examples 1 to 12 are mounted. This is a test in which the mounted substrate 10 is passed through a reflow furnace and the presence or absence of cracks in the porous layer and electrical continuity are confirmed to confirm solder abnormality.

  In the thermal shock test, Evaluation Example 1 to Evaluation Example 12 are stored in a constant temperature, and with respect to Evaluation Example 1 to Evaluation Example 12, −55 ° C. is a low temperature state for 30 minutes and 125 ° C. is a high temperature state for 30 minutes. This test is repeated 1000 cycles alternately to confirm the presence or absence of cracks in the porous layer.

  The individual product cutting treatment test is a test in which the half dicing in Step S5 described above is performed on Evaluation Example 1 to Evaluation Example 12 to confirm the presence or absence of cracks in the porous layer.

  Evaluation examples 1 to 12 were evaluated by performing a water absorption reflow test, a thermal shock test, and an individual product cutting test, and the evaluation results are shown in Table 1.

  As shown in Table 1, in Evaluation Example 1, cracks in the porous layer were confirmed in the water absorption reflow test and the thermal shock test. In Evaluation Example 2, cracks in the porous layer were confirmed in the water absorption reflow test. Moreover, according to the evaluation results of Evaluation Example 1 and Evaluation Example 2, it can be seen that when a crack in the porous layer is confirmed in the water absorption reflow test, there is a possibility that a solder abnormality may occur. In Evaluation Examples 3 to 12, cracks in the porous layer were not confirmed in the water absorption reflow test. In Evaluation Example 3 and Evaluation Example 11, cracks in the porous layer were confirmed in the thermal shock test.

  From the above evaluation results, it can be seen that when the thickness of the stress relaxation layer is thinner than 10 μm in the thermal shock test, the porous layer may be cracked. This is considered that when the thickness of the stress relaxation layer is small, the stress of the stress relaxation layer is weakly adhered between the second resin and the porous layer, and the stress due to the difference in thermal expansion may not be relaxed. Moreover, when the thickness of a stress relaxation layer is thicker than 200 micrometers in a thermal shock test, it turns out that the crack of a porous layer may arise. This is because there is a difference in thermal expansion coefficient between the stress relaxation layer and the porous layer, and therefore, when the thickness of the stress relaxation layer is large, the stress relaxation layer itself may apply stress to the porous layer. This is probably because of this.

  In Evaluation Example 2, the thickness of the stress relaxation layer was 10 μm, and the stress of the thermal shock by the thermal shock test could be relaxed. However, the stress relaxation layer containing the resin component of the second resin has a lower porosity than the porous layer. For this reason, the stress relaxation layer cannot discharge gas such as water vapor generated inside the electronic circuit module component due to heating during reflow compared to the porous layer, and cracks in the porous layer in the water absorption reflow test. It is thought that occurred. In other words, by having both the stress relaxation layer and the porous layer, it is possible to discharge gas such as water vapor generated inside the electronic circuit module component due to heating during reflow, and relieve the stress of the difference in thermal expansion coefficient can do. Further, according to the evaluation results of Evaluation Examples 1 to 5 in the water absorption reflow test, the thickness of the porous layer is preferably 10 μm or more.

  Moreover, according to Table 1, in the evaluation example 9 and the evaluation example 12, the crack of the porous layer was confirmed in the individual product cutting treatment test. If the thickness of the porous layer exceeds 400 μm, it is considered that cracks of the porous layer may occur due to a load during dicing.

  Next, an additional evaluation example in which the thickness of the first resin layer of the electronic circuit module component 1 according to Embodiment 1 described above is 400 μm and the thickness of the second resin layer is 700 μm was created. A plurality of resin components of the second resin having different dynamic shear viscosities shown in FIG. 16 were prepared, and the relationship between the lowest dynamic shear viscosity, which is the lowest value of the dynamic shear viscosity, and the thickness of the stress relaxation layer was evaluated. The evaluation results are shown in FIG. FIG. 19 is an explanatory diagram showing the relationship between the minimum dynamic shear viscosity of the resin component of the second resin and the thickness of the stress relaxation layer.

  As shown in FIG. 19 and Table 2, the additional evaluation example shows that there is a correlation in the relationship between the minimum dynamic shear viscosity and the thickness of the stress relaxation layer. According to Evaluation Example 1 to Evaluation Example 12 described above, the maximum thickness of the stress relaxation layer 42 in the opening 5H is preferably 10 μm or more and 200 μm or less. In order to obtain such a stress relaxation layer, the minimum dynamic shear viscosity of the resin component of the second resin is 350 Pa · s or more and 40000 Pa · s or less at the heating temperature in the above-described curing step (step S4). . That is, if the manufacturing method of the electronic circuit module component is a resin component of the second resin that has the lowest dynamic shear viscosity, the thickness of the predetermined stress relaxation layer can be obtained.

DESCRIPTION OF SYMBOLS 1, 1a, 1b Electronic circuit module component 1A Module body 1B Sealing body 1C Module assembly 2 Electronic component 2S Side part 2T Top part 3 Substrate 3S Side face 4 1st resin 4H Space | gap 4M Resin 5, 5a, 5b Metal layer 5H, 5H1, 5H2, 5H3, 5Ha, 5Hb Opening 8 Ground 9 Second resin 41 Porous layer 42 Stress relaxation layer

Claims (5)

An electronic component, a substrate on which the electronic component is mounted, a first resin that has a gap and is in contact with at least a part of the electronic component, covers the first resin, and has a porosity higher than that of the first resin. A low second resin,
The first resin is
A stress relaxation layer including a resin component of the second resin provided on the second resin side; a porous layer not including a resin component of the second resin;
An electronic circuit module component comprising: A metal layer covering the first resin and the second resin and electrically connected to the ground of the substrate;
An opening provided in the metal layer and exposing at least a part of the porous layer to the outside of the metal layer,
2. The electronic circuit module component according to claim 1, wherein the maximum thickness of the stress relaxation layer in the opening is 10 μm to 200 μm.   3. The electronic circuit module component according to claim 2, wherein the thickness of the porous layer obtained by subtracting the maximum thickness of the stress relaxation layer from the thickness of the first resin is 10 μm or more and 400 μm or less.   The porosity of the porous layer is 5% by volume or more and 30% by volume or less, and the porosity of the stress relaxation layer is 1% by volume or more and less than 5% by volume. The electronic circuit module component according to Item. Mounting electronic components on a substrate;
Providing a first resin on the substrate on which the electronic component is mounted so as to be in contact with at least a part of the electronic component;
A covering step of covering the first resin with a second resin;
A curing step of curing the second resin,
The method for producing an electronic circuit module component, wherein a minimum dynamic shear viscosity of the resin component of the second resin is 350 Pa · s or more and 40000 Pa · s or less at the heating temperature in the curing step.

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