JP2013125855A5 - - Google Patents
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- Publication number
- JP2013125855A5 JP2013125855A5 JP2011273631A JP2011273631A JP2013125855A5 JP 2013125855 A5 JP2013125855 A5 JP 2013125855A5 JP 2011273631 A JP2011273631 A JP 2011273631A JP 2011273631 A JP2011273631 A JP 2011273631A JP 2013125855 A5 JP2013125855 A5 JP 2013125855A5
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- substrate according
- dividing
- electronic component
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011273631A JP2013125855A (ja) | 2011-12-14 | 2011-12-14 | セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011273631A JP2013125855A (ja) | 2011-12-14 | 2011-12-14 | セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013125855A JP2013125855A (ja) | 2013-06-24 |
JP2013125855A5 true JP2013125855A5 (ru) | 2015-01-15 |
Family
ID=48776934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011273631A Pending JP2013125855A (ja) | 2011-12-14 | 2011-12-14 | セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2013125855A (ru) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016149419A (ja) * | 2015-02-11 | 2016-08-18 | 日本特殊陶業株式会社 | 多数個取り配線基板の製造方法 |
CN108781502B (zh) * | 2016-04-22 | 2021-11-30 | 京瓷株式会社 | 多连片布线基板、布线基板 |
WO2023120654A1 (ja) * | 2021-12-22 | 2023-06-29 | 株式会社 東芝 | セラミックススクライブ回路基板、セラミックス回路基板、セラミックススクライブ回路基板の製造方法、セラミックス回路基板の製造方法、及び、半導体装置の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01248683A (ja) * | 1988-03-30 | 1989-10-04 | Toshiba Corp | 多面取り印刷配線基板 |
JPH032667U (ru) * | 1989-05-31 | 1991-01-11 | ||
JPWO2009154295A1 (ja) * | 2008-06-20 | 2011-12-01 | 日立金属株式会社 | セラミックス集合基板とその製造方法及びセラミックス基板並びにセラミックス回路基板 |
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2011
- 2011-12-14 JP JP2011273631A patent/JP2013125855A/ja active Pending
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