JP2013125855A5 - - Google Patents

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Publication number
JP2013125855A5
JP2013125855A5 JP2011273631A JP2011273631A JP2013125855A5 JP 2013125855 A5 JP2013125855 A5 JP 2013125855A5 JP 2011273631 A JP2011273631 A JP 2011273631A JP 2011273631 A JP2011273631 A JP 2011273631A JP 2013125855 A5 JP2013125855 A5 JP 2013125855A5
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JP
Japan
Prior art keywords
ceramic substrate
substrate according
dividing
electronic component
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011273631A
Other languages
English (en)
Japanese (ja)
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JP2013125855A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011273631A priority Critical patent/JP2013125855A/ja
Priority claimed from JP2011273631A external-priority patent/JP2013125855A/ja
Publication of JP2013125855A publication Critical patent/JP2013125855A/ja
Publication of JP2013125855A5 publication Critical patent/JP2013125855A5/ja
Pending legal-status Critical Current

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JP2011273631A 2011-12-14 2011-12-14 セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法 Pending JP2013125855A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011273631A JP2013125855A (ja) 2011-12-14 2011-12-14 セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011273631A JP2013125855A (ja) 2011-12-14 2011-12-14 セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法

Publications (2)

Publication Number Publication Date
JP2013125855A JP2013125855A (ja) 2013-06-24
JP2013125855A5 true JP2013125855A5 (ru) 2015-01-15

Family

ID=48776934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011273631A Pending JP2013125855A (ja) 2011-12-14 2011-12-14 セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法

Country Status (1)

Country Link
JP (1) JP2013125855A (ru)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016149419A (ja) * 2015-02-11 2016-08-18 日本特殊陶業株式会社 多数個取り配線基板の製造方法
CN108781502B (zh) * 2016-04-22 2021-11-30 京瓷株式会社 多连片布线基板、布线基板
WO2023120654A1 (ja) * 2021-12-22 2023-06-29 株式会社 東芝 セラミックススクライブ回路基板、セラミックス回路基板、セラミックススクライブ回路基板の製造方法、セラミックス回路基板の製造方法、及び、半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01248683A (ja) * 1988-03-30 1989-10-04 Toshiba Corp 多面取り印刷配線基板
JPH032667U (ru) * 1989-05-31 1991-01-11
JPWO2009154295A1 (ja) * 2008-06-20 2011-12-01 日立金属株式会社 セラミックス集合基板とその製造方法及びセラミックス基板並びにセラミックス回路基板

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