JP2013125855A5 - - Google Patents

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Publication number
JP2013125855A5
JP2013125855A5 JP2011273631A JP2011273631A JP2013125855A5 JP 2013125855 A5 JP2013125855 A5 JP 2013125855A5 JP 2011273631 A JP2011273631 A JP 2011273631A JP 2011273631 A JP2011273631 A JP 2011273631A JP 2013125855 A5 JP2013125855 A5 JP 2013125855A5
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JP
Japan
Prior art keywords
ceramic substrate
substrate according
dividing
electronic component
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011273631A
Other languages
English (en)
Japanese (ja)
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JP2013125855A (ja
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Publication date
Application filed filed Critical
Priority to JP2011273631A priority Critical patent/JP2013125855A/ja
Priority claimed from JP2011273631A external-priority patent/JP2013125855A/ja
Publication of JP2013125855A publication Critical patent/JP2013125855A/ja
Publication of JP2013125855A5 publication Critical patent/JP2013125855A5/ja
Pending legal-status Critical Current

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JP2011273631A 2011-12-14 2011-12-14 セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法 Pending JP2013125855A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011273631A JP2013125855A (ja) 2011-12-14 2011-12-14 セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011273631A JP2013125855A (ja) 2011-12-14 2011-12-14 セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法

Publications (2)

Publication Number Publication Date
JP2013125855A JP2013125855A (ja) 2013-06-24
JP2013125855A5 true JP2013125855A5 (https=) 2015-01-15

Family

ID=48776934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011273631A Pending JP2013125855A (ja) 2011-12-14 2011-12-14 セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法

Country Status (1)

Country Link
JP (1) JP2013125855A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016149419A (ja) * 2015-02-11 2016-08-18 日本特殊陶業株式会社 多数個取り配線基板の製造方法
EP3448133B1 (en) 2016-04-22 2020-12-02 Kyocera Corporation Multipiece wiring board, wiring board, and method for manufacturing multipiece wiring board
DE102021105109A1 (de) * 2021-03-03 2022-09-08 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats und Metall-Keramik-Substrat
CN118435706A (zh) * 2021-12-22 2024-08-02 株式会社东芝 陶瓷划线电路基板、陶瓷电路基板、陶瓷划线电路基板的制造方法、陶瓷电路基板的制造方法以及半导体装置的制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01248683A (ja) * 1988-03-30 1989-10-04 Toshiba Corp 多面取り印刷配線基板
JPH032667U (https=) * 1989-05-31 1991-01-11
CN102132635A (zh) * 2008-06-20 2011-07-20 日立金属株式会社 陶瓷集合基板及其制造方法，陶瓷基板和陶瓷电路基板

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