JP2013119567A - Composition for forming intermediate layer for gas barrier film, gas barrier film and method for producing the same, and electronic part or optical part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composition for forming an intermediate layer for a gas barrier film, which forms the intermediate layer for improving tight adhesiveness of a gas barrier layer with other layers such as a substrate and the like, a gas barrier film having the gas barrier layer and the intermediate layer formed of the composition, a method for producing the gas barrier film and electronic parts or optical parts having the gas barrier film.SOLUTION: There are provided the composition for forming the intermediate layer for the gas barrier film comprising an OH-containing resin and a cross-linking agent, the intermediate layer comprising the composition for forming the intermediate layer for the gas barrier film, the gas barrier film having at least the gas barrier layer formed on the intermediate layer, the method for producing the gas barrier film and the electronic parts or the optical parts having the gas barrier film.

Description

  The present invention relates to a gas barrier film intermediate layer forming composition useful for improving interlayer adhesion, a gas barrier film and a method for producing the same, and an electronic member or an optical member provided with the gas barrier film.

  Conventionally, a polymer molded body such as a plastic film is inexpensive and excellent in workability, and therefore has been used in various fields with a desired function. For example, a gas barrier plastic film that prevents the permeation of water vapor and oxygen is used for food and pharmaceutical packaging films to maintain the taste and freshness by suppressing the oxidation and alteration of proteins and fats and oils.

In recent years, a transparent plastic film is used instead of a glass plate as a substrate having electrodes in a display such as a liquid crystal display or an electroluminescence (EL) display in order to realize a reduction in thickness, weight, and flexibility. It is being considered. For example, Patent Document 1 proposes a flexible display substrate in which a transparent gas barrier layer made of a metal oxide is laminated on a transparent plastic film.
However, the flexible display substrate described in this document is obtained by laminating a transparent gas barrier layer made of a metal oxide on the surface of a transparent plastic film by vapor deposition, ion plating, sputtering, or the like. If the gas barrier layer is bent or bent, the gas barrier layer may be cracked to deteriorate the gas barrier property, or the adhesion failure between the plastic film and the gas barrier layer made of the metal oxide film may occur.

  In order to solve such problems, Patent Documents 2 and 3 propose gas barrier sheets in which a smooth layer is provided on a synthetic resin sheet and a gas barrier inorganic compound thin film is further laminated. However, in the gas barrier sheet described in these documents, a functional thin film must be provided between each layer in order to improve the interlayer adhesion between the smooth layer and the inorganic material layer as the gas barrier layer or electrode material. However, the large number of processes and the increase in the thickness of the resulting gas barrier sheet have been problems.

JP 2000-338901 A JP 2003-154596 A JP 2006-264118 A

  The present invention has been made in view of the above-described conventional technology, and an intermediate layer forming composition for a gas barrier film that forms an intermediate layer that improves the adhesion between a base material or another layer and a gas barrier layer, and this composition It is an object of the present invention to provide a gas barrier film having an intermediate layer and a gas barrier layer formed by an object, a method for producing the gas barrier film, and an electronic member or an optical member including the gas barrier film.

  As a result of intensive studies to solve the above problems, the present inventors have used a composition for forming an intermediate layer for a gas barrier film, which contains a hydroxyl group-containing resin and a crosslinking agent, between the substrate and the gas barrier layer. It has been found that when the intermediate layer is formed, the adhesion between the substrate and the gas barrier layer is improved. Further, after forming a layer containing a silicon-based polymer compound on the intermediate layer, ions are implanted into the layer containing the silicon-based polymer compound to form a gas barrier layer, thereby providing gas barrier properties, transparency, And it discovered that the gas barrier film excellent in interlayer adhesiveness could be manufactured simply and efficiently, and came to complete this invention.

  Thus, according to the present invention, the following (1) to (5) composition for forming an intermediate layer for a gas barrier film, (6) to (8) a gas barrier film, (9) a method for producing a gas barrier film, (10) An electronic member or an optical member is provided.

(1) A composition for forming an intermediate layer for a gas barrier film, which contains a hydroxyl group-containing resin and a crosslinking agent.
(2) The composition for forming an intermediate layer for a gas barrier film according to (1), wherein the hydroxyl group-containing resin is a polyvinyl acetal resin.
(3) The composition for forming an intermediate layer for a gas barrier film according to (2), wherein the degree of acetalization of the polyvinyl acetal resin is 50 mol% or more.
(4) The composition for forming an intermediate layer for a gas barrier film according to (2) or (3), wherein the polyvinyl acetal resin is obtained by reacting polyvinyl alcohol with acetaldehyde or butyraldehyde. object.
(5) The composition for forming an intermediate layer for a gas barrier film according to any one of (1) to (4), wherein the crosslinking agent is an isocyanate-based crosslinking agent.

(6) A film base, an intermediate layer formed from the composition for forming an intermediate layer for a gas barrier film according to any one of (1) to (5), and a gas barrier layer formed on the intermediate layer at least Gas barrier film having.
(7) The gas barrier film according to (6), wherein the gas barrier layer is a layer obtained by implanting ions into a layer containing a silicon-based polymer compound.
(8) The gas barrier film according to (7), wherein the silicon-based polymer compound is a polysilazane compound.

(9) A method for producing a gas barrier film having a film substrate, an intermediate layer formed on the substrate, and a gas barrier layer formed on the intermediate layer, the method comprising the following steps: A method for producing a film.
(Step 1) A step of applying an intermediate layer forming composition for a gas barrier film containing a hydroxyl group-containing resin and a crosslinking agent on a film substrate, and forming the intermediate layer by drying the resulting coating film ( Step 2) A step of forming a layer containing a silicon-based polymer compound by coating a coating liquid containing a silicon-based polymer compound on the obtained intermediate layer and drying the obtained coating film (step) 3) Step of forming a gas barrier layer by implanting ions into the layer containing the obtained silicon-based polymer compound (10) The gas barrier film according to any one of (6) to (8) is provided. Electronic member or optical member.

According to the composition for forming an intermediate layer for a gas barrier film of the present invention, an intermediate layer for a gas barrier film that improves interlayer adhesion between a base material or another layer and the gas barrier layer can be formed.
The gas barrier film of the present invention has excellent gas barrier properties, good transparency, and excellent interlayer adhesion between the base material or other layers and the gas barrier layer.
According to the method for producing a gas barrier film of the present invention, the gas barrier film of the present invention having excellent gas barrier properties, transparency, and interlayer adhesion can be produced simply and efficiently. In addition, the area can be easily increased at a lower cost than the method of forming an inorganic film.
Since the electronic member and the optical member of the present invention are provided with the gas barrier film of the present invention, they have excellent gas barrier properties and excellent interlayer adhesion.

It is layer structure sectional drawing of a gas barrier film in the process of obtaining the gas barrier film of this invention.

  Hereinafter, the present invention is divided into 1) a composition for forming an intermediate layer for a gas barrier film, 2) a gas barrier film, 3) a method for producing the gas barrier film, and 4) an electronic device member and an electronic device. explain.

1) Gas barrier film intermediate layer forming composition The gas barrier film intermediate layer forming composition of the present invention is characterized by containing a hydroxyl group-containing resin and a crosslinking agent.

<Hydroxyl-containing resin>
The hydroxyl group-containing resin to be used is not particularly limited as long as it is a hydroxyl group-containing resin.
For example, polyvinyl alcohol polymers such as polyvinyl alcohol resins and ethylene / vinyl alcohol copolymers; polyvinyl acetals such as polyvinyl formal, polyvinyl acetal, polyvinyl butyral, polyvinyl acetal, polyvinyl butyral, and acetalized products of ethylene / vinyl alcohol copolymer Resins; polyol polymers such as acrylic polyol, polyester polyol, polyether polyol, and urethane polyol; hydroxyl group-containing acrylic polymers such as poly (2-hydroxyethyl methacrylate); polyesters; cellulose polymers such as cellulose; These can be used alone or in combination of two or more.
Among these, a polyvinyl acetal resin is preferable from the viewpoint of excellent compatibility with the crosslinking agent.

  The polyvinyl acetal resin is obtained by an acetalization reaction between a hydroxyl group of polyvinyl alcohol (or a partially saponified product of its ester, the same applies hereinafter) and an aldehyde.

  It does not specifically limit as an aldehyde to be used, According to the performance requested | required, it can select suitably and can be used. Generally, an aldehyde having 1 to 10 carbon atoms is used. Specifically, formaldehyde, acetaldehyde, propionaldehyde, n-butyraldehyde, isobutyraldehyde, n-valeraldehyde, n-hexylaldehyde, 2-ethylbutyraldehyde, n-octylaldehyde, n-nonylaldehyde, n-decylaldehyde Aliphatic saturated aldehydes such as benzaldehyde, aromatic aldehydes such as cinnamaldehyde, and the like. Among these, acetaldehyde and n-butyraldehyde which are excellent in acetalization reaction are preferable. These can be used alone or in combination of two or more.

  Among these, as the polyvinyl acetal resin, polyvinyl acetal (PVAC) obtained by reacting polyvinyl alcohol with acetaldehyde, and polyvinyl butyral (PVB) obtained by reacting polyvinyl alcohol with butyraldehyde are more preferable.

The degree of acetalization of the polyvinyl acetal resin is preferably 50 mol% or more, more preferably 50 mol% or more and 99 mol% or less, and further preferably 60 mol% or more and 90 mol% or less. By setting the degree of acetalization to 50 mol% or more, it is possible to prepare a composition excellent in compatibility with a crosslinking agent and an organic solvent, which will be described later, and further, a hydroxyl group in the crosslinking agent and the polyvinyl acetal resin described later. React to form a three-dimensional network structure, thereby improving the adhesion with the gas barrier layer.
By using such a resin and a crosslinking agent in combination, a gas barrier film excellent in interlayer adhesion intended by the present invention can be obtained.
The degree of acetalization of the polyvinyl acetal resin can be determined by a known measurement method. For example, the peak area of the main chain methine carbon (near 66 to 75 ppm) of polyvinyl acetal observed in ¹³ C-NMR is A, and the peak area of the aldehyde-derived methine carbon (near 94 ppm, near 101 ppm) is B. Can be sought.

  The polyvinyl acetal resin can be synthesized by reacting polyvinyl alcohol (or a repeating unit derived from vinyl alcohol) and an aldehyde in an appropriate solvent using an acid catalyst. Examples of the solvent to be used include water; alcohol solvents such as methyl alcohol and ethyl alcohol; mixed solvents composed of water and alcohol; aprotic polar solvents such as dimethyl sulfoxide;

The polyvinyl acetal resin can also be synthesized by adding an acid catalyst and an aldehyde to a polyvinyl acetate solution and reacting them.
The acid catalyst to be used is not particularly limited, and examples thereof include organic acids such as acetic acid and p-toluenesulfonic acid; inorganic acids such as nitric acid, sulfuric acid and hydrochloric acid.
The reaction is stopped by adding alkali. The alkali to be used is not particularly limited, and examples thereof include metal hydroxides such as sodium hydroxide and potassium hydroxide; ammonia; metal nitrates such as sodium nitrate; metal carbonates such as sodium carbonate and potassium carbonate; Metal hydrogen carbonates such as potassium hydrogen; and the like.

  The molecular weight of the polyvinyl acetal resin is not particularly limited, but preferably has a weight average molecular weight of 200 to 1,000,000 from the viewpoint of obtaining a film having excellent film forming properties and excellent physical properties. Is more preferably from 100,000 to 100,000. When the weight average molecular weight is less than 200, the flexibility is lowered, and when it exceeds 1,000,000, the coating property is deteriorated.

(Crosslinking agent)
As the cross-linking agent, a polyfunctional compound that can react with the hydroxyl group of the hydroxyl group-containing resin to crosslink the molecule of the hydroxyl group-containing resin with a chemical bond to form a three-dimensional network structure can be used.
Examples of the polyfunctional compound include an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent, and a metal chelate crosslinking agent.

The isocyanate-based crosslinking agent is not particularly limited as long as it contains at least two isocyanate groups in the molecule, and known ones can be used. For example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate (TDI), 4,4′-diphenylmethane diisocyanate, 2,4′-diphenylmethane diisocyanate, 2,2′-diphenylmethane diisocyanate (MDI), 4, 4'-diphenyl ether diisocyanate, 1,3- or 1,4-xylylene diisocyanate or mixtures thereof (XDI), trimethylolpropane xylylene diisocyanate (XDI-TMP), 1,3- or 1,4-tetramethylxylylene diene Aromatic diisocyanates such as isocyanates or mixtures thereof (TMXDI);
Aliphatic diisocyanates such as hexamethylene diisocyanate (HMDI), tetramethylene diisocyanate, 2-methyl-pentane-1,5-diisocyanate, 3-methyl-pentane-1,5-diisocyanate, lysine diisocyanate, trioxyethylene diisocyanate;
Various polyisocyanates such as isophorone diisocyanate (IPDI), hydrogenated tolylene diisocyanate, hydrogenated xylene diisocyanate, hydrogenated diphenylmethane diisocyanate, hydrogenated tetramethylxylene diisocyanate; Is mentioned.
These can be used alone or in combination of two or more.

  The epoxy-based crosslinking agent is not particularly limited, and for example, 1,3-bis (N, N′-diglycidylaminomethyl) cyclohexane, N, N, N ′, N′-tetraglycidyl-m-xylylene diene Examples include amines, ethylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane diglycidyl ether, diglycidyl aniline, diglycidyl amine and the like. These may be used alone or in combination of two or more.

  The aziridine-based crosslinking agent is not particularly limited, and examples thereof include diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane tri-β-aziridinylpropionate, tetramethylolmethanetri- β-aziridinylpropionate, toluene-2,4-bis (1-aziridinecarboxamide), triethylenemelamine, bisisophthaloyl-1- (2-methylaziridine), tris-1- (2- Methyl aziridin) phosphine, trimethylolpropane tri-β- (2-methylaziridine) propionate, and the like. These may be used alone or in combination of two or more.

  Examples of the metal chelate-based crosslinking agent include chelate compounds whose metal atoms are aluminum, zirconium, titanium, zinc, iron, tin and the like, and aluminum chelate compounds are preferable from the viewpoint of performance. Examples of the aluminum chelate compound include diisopropoxy aluminum monooleyl acetoacetate, monoisopropoxy aluminum bis oleyl acetoacetate, monoisopropoxy aluminum monooleate monoethyl acetoacetate, diisopropoxy aluminum monolauryl acetoacetate, diisopropoxy Examples thereof include aluminum monostearyl acetoacetate and diisopropoxy aluminum monoisostearyl acetoacetate. These may be used alone or in combination of two or more.

  Among these, an isocyanate-based crosslinking agent is preferable, an aromatic isocyanate-based crosslinking agent is more preferable, and xylylene diisocyanate is particularly preferable because more excellent adhesion can be obtained. The isocyanate-based crosslinking agent can improve the adhesion with the gas barrier layer by reacting with the hydroxyl group of the hydroxyl group-containing resin to form a urethane bond and forming a three-dimensional network structure.

  For example, when the crosslinkable group of the crosslinker is an isocyanate group, the content of the crosslinker is such that the ratio (NCO / OH) of the isocyanate group (NCO) to the hydroxyl group (OH) of the hydroxyl group-containing resin is as follows. The amount is preferably 10% to less than 200%, and more preferably 50% to 150%. If the amount of the crosslinkable group is less than 10%, the adhesion to the substrate may not be obtained. If the amount of the crosslinkable group is 200% or more, the substrate on which the intermediate layer is formed is rolled later. There is a possibility that the coated surface and the non-coated surface of the base material may be blocked when wound on the surface. Blocking refers to a phenomenon in which overlapping portions stick together due to the application of excessive pressure.

The composition for forming an intermediate layer for a gas barrier film of the present invention can be prepared by dissolving or dispersing the hydroxyl group-containing resin in a suitable solvent, and then adding and mixing a predetermined amount of a crosslinking agent.
Examples of the solvent used include aromatic solvents such as toluene and benzene; ester solvents such as ethyl acetate and butyl acetate; ether solvents such as tetrahydrofuran; aliphatic solvents such as n-hexane and cyclohexane; And the like.
Although the usage-amount of a solvent is not specifically limited, Usually, it is 1-50 mass% in the density | concentration (solid content) of this composition.

2) Gas Barrier Film The gas barrier film of the present invention is an intermediate layer formed from a film substrate and an intermediate layer forming composition for a gas barrier film of the present invention (hereinafter sometimes simply referred to as “the composition of the present invention”). And a gas barrier layer formed on the intermediate layer.

Since the gas barrier film of the present invention has an intermediate layer made of the composition of the present invention between the gas barrier layer and the film substrate (interlayer), it has excellent interlayer adhesion between the gas barrier layer and the film substrate. . In the intermediate layer, the hydroxyl group contained in the hydroxyl group-containing resin reacts with the crosslinking agent to form a three-dimensional network structure, thereby improving the adhesion with the gas barrier layer.
The thickness of the intermediate layer is 0.1 to 50 μm, preferably 0.1 to 10 μm, and more preferably 0.5 to 1 μm.
The softening temperature of the intermediate layer is preferably 40 ° C. or higher, and more preferably 60 ° C. or higher. If the softening temperature is within the above range, the intermediate layer can be easily handled.

The gas barrier layer of the gas barrier film of the present invention is a layer having a property of suppressing permeation of oxygen and water vapor (hereinafter also referred to as “gas barrier property”).
The material of the gas barrier layer is not particularly limited as long as it has gas barrier properties. Examples thereof include a gas barrier layer made of an inorganic vapor deposition film, a gas barrier layer containing a gas barrier resin, a gas barrier layer obtained by implanting ions into a layer containing a polymer compound, and the like.
Among these, since a thin layer having excellent gas barrier properties can be efficiently formed, a gas barrier layer made of an inorganic vapor deposition film and a gas barrier layer obtained by implanting ions into a layer containing a polymer compound are preferable. A gas barrier layer obtained by implanting ions into the containing layer is particularly preferred.

Examples of the inorganic vapor deposition film include vapor deposition films of inorganic compounds and metals.
Examples of the method for forming the inorganic vapor deposition film include PVD methods such as vacuum vapor deposition, sputtering, and ion plating, and CVD methods such as thermal CVD, plasma CVD, and photo CVD.
As the raw material for the vapor-deposited film of the inorganic compound, inorganic oxides such as silicon oxide, aluminum oxide, magnesium oxide, zinc oxide, indium oxide and tin oxide; inorganic nitrides such as silicon nitride, aluminum nitride and titanium nitride; inorganic carbides; Inorganic sulfides; inorganic oxynitrides such as silicon oxynitride; inorganic oxide carbides; inorganic nitride carbides; inorganic oxynitride carbides and the like.
Examples of the raw material for the metal vapor deposition film include aluminum, magnesium, zinc, and tin.
These may be used alone or in combination of two or more. The inorganic vapor deposition film may be a single layer or a multilayer.
The thickness of the inorganic vapor deposition film is preferably in the range of 10 to 2000 nm, more preferably 20 to 1000 nm, more preferably 30 to 500 nm, and still more preferably 40 to 200 nm, from the viewpoints of gas barrier properties and handling properties.

  As the gas barrier resin, for example, polyvinyl alcohol, or a partially saponified product thereof, an ethylene-vinyl alcohol copolymer, polyacrylonitrile, polyvinyl chloride, polyvinylidene chloride, polychlorotrifluoroethylene, and the like are hardly permeable to oxygen. Resin.

  Examples of a method for forming a gas barrier layer containing a gas barrier resin include a method of producing a gas barrier layer by applying a solution containing a gas barrier resin on an intermediate layer and drying the obtained coating film as appropriate.

  Examples of the polymer compound used in the gas barrier layer obtained by ion implantation into the layer containing the polymer compound include silicon-based polymer compounds, polyimides, polyamides, polyamideimides, polyphenylene ethers, polyether ketones, and polyether ether ketones. Polyolefin, polyester, polycarbonate, polysulfone, polyethersulfone, polyphenylene sulfide, polyarylate, acrylic resin, cycloolefin polymer, aromatic polymer, and combinations of two or more of these polymers.

Among these, a silicon-based polymer compound is preferable in that an excellent gas barrier property can be obtained.
When the gas barrier layer is a layer obtained by implanting ions into a layer containing a silicon-based polymer compound, the hydroxyl group of the hydroxyl-containing resin and the silicon-based polymer at the interface between the layer containing the silicon-based polymer compound and the intermediate layer Reaction with the molecular compound to form a chemical bond prevents ions from being implanted into the substrate. Thereby, the gas barrier film excellent in transparency can be obtained.

  As the silicon-based polymer compound, known compounds can be used, and examples thereof include polysilazane compounds, polycarbosilane compounds, polysilane compounds, and polyorganosiloxane compounds (Japanese Patent Laid-Open No. 10-245436, special table). JP 2003-514822 A, JP 2005-36089 A, JP 2008-63586 A, JP 2009-235358 A, JP 2009-286891 A, JP 2010-106100 A, JP 2010-106 A. No. 2.9445, JP 2010-232569 A, JP 2010-238736 A, etc.). Of these, polysilazane compounds are more preferred.

  The polysilazane compound is a polymer compound having a repeating unit represented by (—Si—N—) in the molecule, and known compounds such as organic polysilazane, inorganic polysilazane, and modified polysilazane can be used.

  Among these, as the polysilazane compound used in the present invention, inorganic polysilazane and organic polysilazane are preferable, and from the viewpoint of easy availability and formation of an injection layer having excellent gas barrier properties, inorganic polysilazane is more preferable, and perhydropolysilazane is preferable. Particularly preferred.

The polysilazane layer (a layer containing a polysilazane compound as a silicon-based polymer compound) is obtained by bringing a plasma polymerizable silazane compound gas such as dimethyldisilazane, tetramethyldisilazane, hexamethyldisilazane, etc. into contact with the intermediate layer. It can also be formed by performing a plasma polymerization treatment (Japanese Patent Laid-Open No. 9-143289).
Moreover, the polysilazane compound can also use the commercial item marketed as a glass coating material etc. as it is.

  The layer containing the polymer compound may contain other components in addition to the polymer compound as long as the object of the present invention is not impaired. Examples of other components include curing agents, other polymers, anti-aging agents, light stabilizers, and flame retardants.

  The content of the polymer compound in the layer containing the polymer compound is preferably 50% by weight or more, and preferably 70% by weight or more from the viewpoint of forming an ion-implanted layer having excellent gas barrier properties. More preferred.

In the present invention, the thickness of the layer containing the polymer compound to be formed is not particularly limited, but is usually 20 nm to 10 μm, preferably 30 to 500 nm, more preferably 40 to 200 nm.
In the present invention, a gas barrier film having a sufficient gas barrier property can be obtained even if the layer containing the polymer compound is nano-order.

Examples of ions implanted into the layer containing a high molecular compound include ions such as argon, helium, neon, krypton, and xenon, rare gases, fluorocarbon, hydrogen, nitrogen, oxygen, carbon dioxide, chlorine, fluorine, and sulfur; gold, And ions of metals such as silver, copper, platinum, nickel, palladium, chromium, titanium, molybdenum, niobium, tantalum, tungsten, and aluminum.
Among them, from the group consisting of hydrogen, nitrogen, oxygen, argon, helium, neon, xenon and krypton because an ion implantation layer that can be implanted more easily and has particularly excellent gas barrier properties and transparency can be obtained. At least one ion selected is preferred.

  What is necessary is just to determine suitably the ion implantation amount according to the intended purpose (necessary gas barrier property, transparency, etc.) of the gas barrier film to form.

  Examples of the method for implanting ions include a method of irradiating ions accelerated by an electric field (ion beam), a method of implanting ions in plasma, and the like. Among them, in the present invention, the latter method of implanting plasma ions is preferable because a gas barrier layer can be easily obtained.

  In the plasma ion implantation, for example, plasma is generated in an atmosphere containing a plasma generating gas such as a rare gas, and a negative high voltage pulse is applied to the polysilazane layer, whereby ions (positive ions) in the plasma are converted into polysilazane. It can be performed by injecting into the surface of the layer.

  By ion implantation, the thickness of the region into which ions are implanted can be controlled by implantation conditions such as ion type, applied voltage, and processing time, and is determined according to the thickness of the polysilazane layer, the purpose of use of the gas barrier film, and the like. Usually, it is 10 to 1000 nm.

  The ion implantation can be confirmed by performing elemental analysis measurement in the vicinity of 10 nm from the surface using X-ray photoelectron spectroscopy (XPS).

  The thickness of the gas barrier layer varies depending on the material and the like, but from the viewpoint of gas barrier properties and handleability, it is usually in the range of 10 to 2000 nm, preferably 20 to 1000 nm, more preferably 30 to 500 nm, and further preferably 40 to 200 nm. It is.

  In the gas barrier film of the present invention, the number of layers and the stacking order are not particularly limited as long as an intermediate layer made of the composition of the present invention is formed between the gas barrier layer and the film substrate. For example, it may have a gas barrier layer on one side of the film substrate, or may have the gas barrier layer on both sides of the film substrate. Further, a plurality of the gas barrier films may be laminated.

(Film substrate)
The material for the film substrate is not particularly limited as long as it is other than the silicon-based polymer compound and can meet the purpose of the gas barrier film of the present invention. For example, polyimide, polyamide, polyamideimide, polyphenylene ether, polyether ketone, polyether ether ketone, polyolefin, polyester, polycarbonate, polysulfone, polyether sulfone, polyphenylene sulfide, polyarylate, acrylic resin, cycloolefin polymer, aromatic Group polymers and the like.

  Among these, polyester, polyamide, polysulfone, polyethersulfone, polyphenylene sulfide, polyarylate, or cycloolefin polymer is preferable, and polyester or cycloolefin polymer is more preferable because of excellent transparency and versatility.

Examples of the polyester include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and polyarylate.
Examples of the polyamide include wholly aromatic polyamide, nylon 6, nylon 66, nylon copolymer, and the like.

  Examples of cycloolefin polymers include norbornene polymers, monocyclic olefin polymers, cyclic conjugated diene polymers, vinyl alicyclic hydrocarbon polymers, and hydrides thereof. Specific examples thereof include Apel (an ethylene-cycloolefin copolymer manufactured by Mitsui Chemicals), Arton (a norbornene polymer manufactured by JSR), Zeonoa (a norbornene polymer manufactured by Nippon Zeon), and the like. .

  Although it does not specifically limit as thickness of a film base material, What is necessary is just to determine according to the objective of a gas barrier film, Usually, 0.5-500 micrometers, Preferably it is 1-100 micrometers.

  Moreover, the gas barrier film of this invention may have another layer. Examples of other layers include a protective layer, a conductor layer, a protective sheet, and an adhesive layer.

(Protective layer)
The protective layer is a layer having a role of protecting the gas barrier layer when an impact is applied from the outside.
The position where the protective layer is laminated is not particularly limited, but is preferably laminated adjacent to the gas barrier layer.
As the protective layer, those having good transparency and good scratch resistance are preferable. Furthermore, when it is placed on the outermost surface when the protective layer is incorporated into an electronic device or optical device, it has functions such as antifouling property, anti-fingerprint resistance, antistatic property, water repellency and hydrophilicity. can do.

The thickness of the protective layer can be appropriately selected in consideration of the purpose of use of the gas barrier film. The thickness is usually less than 0.05 to 10 μm, preferably 0.1 to 8.0 μm, more preferably 0.2 to 5 μm.
If it is 0.05 μm or more, the scratch resistance is sufficient. If it is 9 μm or less, curling due to distortion during curing is unlikely to occur.

The surface roughness Ra (arithmetic mean roughness) of the protective layer is preferably 10.0 nm or less, and more preferably 8.0 nm or less. Further, the surface roughness Rt (maximum cross-sectional height) is preferably 100 nm or less, and more preferably 50 nm or less.
When the surface roughness Ra and Rt exceed 10.0 nm and 100 nm, respectively, the surface roughness of the gas barrier layer increases, and the gas barrier property of the gas barrier film may be lowered.
The surface roughness Ra and Rt are values obtained by an optical interference method using a 100 μm square sample.

The material of the protective layer is not particularly limited, and is, for example, a polymer containing a silicon-containing compound; a photopolymerizable compound composed of a photopolymerizable monomer and / or a photopolymerizable prepolymer, and a polymerization initiator that generates radicals at least in the UV. Composition: polyester resin, polyurethane resin (particularly two-part curable resin of polyacryl polyol, polyester polyol, polyether polyol, etc. and isocyanate compound), acrylic resin, polycarbonate resin, vinyl chloride / vinyl acetate copolymer Examples thereof include resins such as coalescence, polyvinyl butyral resin and nitrocellulose resin; alkyl titanates; ethyleneimine;
These may be used alone or in combination of two or more.

  Among these, as a material for the protective layer, from the viewpoint of excellent transparency and scratch resistance, a photopolymerizable compound comprising a photopolymerizable monomer and / or a photopolymerizable prepolymer, and polymerization that generates radicals at least in UV. A polymerizable composition containing an initiator is preferred.

  For the protective layer, a solution for forming a protective layer obtained by dissolving or dispersing the above materials in an appropriate solvent is applied onto the layer to be laminated by a known method, and the obtained coating film is dried, and heated if desired. Can be formed.

(Conductor layer)
The conductor layer is a layer having conductivity, and is a layer provided to be used as an electrode in an electronic member or the like, or to improve antistatic properties and heat dissipation properties.
The position where the conductor layer is laminated can be selected according to the purpose for which the gas barrier film is used, and is not particularly limited.
The surface resistivity of the conductor layer is preferably 1000Ω / □ or less, more preferably 200Ω / □.
The thickness of the conductor layer can be appropriately selected in consideration of the purpose of use of the gas barrier film. The thickness is usually 10 nm to 9 μm, preferably 20 nm to 1.0 μm.

  Examples of the material for the conductor layer include metals, alloys, metal oxides, electrically conductive compounds, and mixtures thereof. Specifically, tin oxide doped with antimony (ATO); tin oxide doped with fluorine (FTO); metals such as tin oxide, zinc oxide, indium oxide, indium tin oxide (ITO), and zinc indium oxide (IZO) Oxides; metals such as gold, silver, chromium and nickel; mixtures of these metals and metal oxides; inorganic conductive materials such as copper iodide and copper sulfide; organic conductive materials such as polyaniline, polythiophene and polypyrrole; etc. Is mentioned. Among these, metal oxides are preferable from the viewpoint of transparency, and indium oxide-based and zinc oxide-based metal oxides such as zinc oxide, indium oxide, indium tin oxide (ITO), and zinc oxide indium (IZO) are particularly preferable. preferable.

  Examples of the method for forming the conductor layer include a vapor deposition method, a sputtering method, an ion plating method, a thermal CVD method, a plasma CVD method, and the like. Among these, the sputtering method is preferable because the conductor layer can be easily formed.

  The formed conductor layer may be patterned as necessary. Examples of the patterning method include chemical etching by photolithography and the like, physical etching using a laser and the like, vacuum deposition method using a mask, sputtering method, lift-off method, printing method, and the like.

(Protective sheet)
A protective sheet is laminated | stacked on the outermost layer of a gas barrier film, has a role which protects a gas barrier layer, when a gas barrier film is preserve | saved, transported, etc., and peels off at the time of use.

The gas barrier film of the present invention may have a protective sheet on one side or may have a protective sheet on both sides.
As a protective sheet, what provided the releasable adhesive layer and release agent layer in base materials, such as paper and a plastic film, is mentioned.

(Adhesive layer)
An adhesive layer can be provided when laminating | stacking two or more gas barrier films, or when affixing on a to-be-adhered body.
It does not specifically limit as a material of an adhesive layer, A well-known adhesive can be used. For example, an acrylic adhesive, a silicone adhesive, a urethane adhesive, a rubber adhesive, and the like can be given.

As long as the above-mentioned other layers satisfy the above conditions, the order of stacking and the number of stacks are not particularly limited.
The gas barrier film of the present invention is excellent in interlayer adhesion because the base material and the gas barrier layer are hardly peeled off even after being placed under a high temperature and high humidity for a long time.

  The gas barrier film of the present invention has excellent interlaminar adhesion, for example, after placing it under high-temperature and humid-heat conditions (60 ° C., humidity 90%) for 150 hours, followed by a cross-cut test (JIS K-5400 (1990) )), The peeling of the film is observed, and it can be confirmed from the fact that, in the number of test specimens, the number of peeling is 90% or more.

It can be confirmed that the gas barrier film of the present invention has an excellent gas barrier property because the water vapor permeability of the gas barrier film is small.
Water vapor permeability of the gas barrier film, 40 ° C., under a relative humidity of 90%, generally not more than 0.1g ^/ m 2 ^/ day, preferably not more than 0.05g ^/ m 2 ^/ day. The water vapor transmission rate can be measured by a known method.

That the gas barrier film of the present invention has excellent transparency can be confirmed from the high visible light transmittance of the gas barrier film and the like.
The visible light transmittance of the gas barrier film is preferably 90% or more. A visible light transmittance of 90% or more is preferable for use as an electronic member or an optical member because of high transparency and excellent optical properties.
The visible light transmittance is a transmittance at a wavelength of 550 nm, and can be measured using a known measuring device.

  Since the gas barrier film of the present invention is excellent in gas barrier properties, interlayer adhesion, and transparency, it can be used as a gas barrier film for electronic members and optical members. Among them, it is preferable for electronic members and optical members, especially for electronic members that require flexibility such as flexible display substrates, and for electronic members that require heat resistance and moisture resistance such as plastic substrates for liquid crystal display elements. Used.

3) Method for Producing Gas Barrier Film The method for producing a gas barrier film of the present invention is a method for producing a gas barrier film having a film substrate, an intermediate layer formed on the substrate, and a gas barrier layer formed on the intermediate layer. And it has the following processes, It is characterized by the above-mentioned.

(Process 1) The process of forming an intermediate | middle layer by applying the composition for gas barrier film intermediate | middle layer formation containing a hydroxyl-containing resin and a crosslinking agent on a film base material, and drying the obtained coating film.
(Step 2) A step of forming a layer containing a silicon-based polymer compound by coating a coating liquid containing a silicon-based polymer compound on the obtained intermediate layer and drying the obtained coating film. .
(Step 3) A step of forming a gas barrier layer by implanting ions into the layer containing the obtained silicon polymer compound.

Hereinafter, the manufacturing method of the present invention will be described with reference to the drawings.
(1) Step 1
First, as shown to Fig.1 (a), the composition for gas barrier film intermediate | middle layer formation containing a hydroxyl-containing resin and a crosslinking agent is applied on the film base material 1, and the obtained coating film is dried. Thus, the intermediate layer 2 is formed.

Examples of the film substrate used in step 1 include the same as those exemplified in the previous section.
As the intermediate layer forming composition for a gas barrier film containing a hydroxyl group-containing resin and a crosslinking agent, the intermediate layer forming composition for a gas barrier film of the present invention can be preferably used.

  As a method for coating the intermediate layer forming composition for gas barrier film on the film substrate, a usual wet coating method can be used. Examples include dipping method, roll coating, gravure coating, knife coating, air knife coating, roll knife coating, die coating, screen printing method, spray coating, gravure offset method and the like.

  As a method for drying the coating film of the composition, a conventionally known drying method such as hot air drying, hot roll drying, infrared irradiation or the like can be adopted. The heating temperature is usually in the range of 60 to 130 ° C.

In step 1, the intermediate layer is preferably formed by drying and then optionally heating.
In step 1, while the intermediate layer is formed as described above, the hydroxyl group contained in the hydroxyl group-containing resin reacts with the crosslinking agent to form a three-dimensional network structure. Can be improved.

(2) Step 2
Next, as shown in FIG. 1 (b), the obtained intermediate layer 2 is coated with a coating solution containing a silicon-based polymer compound, and the resulting coating film is dried to thereby obtain a silicon-based polymer. A layer 3 containing the compound is formed.

  Examples of the silicon-based polymer compound used in step 2 include a polysilazane compound, a polycarbosilane compound, a polysilane compound, and a polyorganosiloxane compound. The silicon polymer compounds can be used alone or in combination of two or more. Of these, polysilazane compounds are preferred, and specific examples thereof include those described above.

The solvent used in the coating solution containing the silicon-based polymer compound is not particularly limited as long as it can dissolve the silicon-based polymer compound. For example, aliphatic hydrocarbon solvents such as hexane and heptane; aromatic hydrocarbon solvents such as toluene and xylene; halogenated hydrocarbon solvents such as methylene chloride and ethylene chloride; methanol, ethanol, propanol, butanol, propylene glycol Examples include alcohol solvents such as monomethyl ether; ketone solvents such as acetone, methyl ethyl ketone, 2-pentanone, isophorone, and cyclohexanone; ester solvents such as ethyl acetate and butyl acetate; and cellosolv solvents such as ethyl cellosolve.
The concentration of the silicon-based polymer compound in the coating solution containing the silicon-based polymer compound is usually 1 to 70% by mass, preferably 1 to 30% by mass, from the viewpoint of coating suitability and the like.

  The method for forming the layer 3 containing the silicon-based polymer compound by applying a coating liquid containing the silicon-based polymer compound on the intermediate layer 2 and drying the obtained coating film is particularly limited. For example, a layer-forming solution containing at least one polymer compound, optionally other components, and a solvent is applied on the intermediate layer, and the resulting coating film is appropriately dried. The method of doing is mentioned.

  As the coating apparatus, known apparatuses such as a spin coater, a knife coater, and a gravure coater can be used.

  The obtained coating film is preferably heated to improve gas barrier properties. Heating can be performed at 80 to 150 ° C. for several tens of seconds to several tens of minutes.

(3) Process 3
Next, as shown in FIG. 1C, a gas barrier layer 4 is formed by implanting ions into the obtained layer 3 containing the silicon-based polymer compound.
In step 3, the method of implanting ions into the layer 3 containing the silicon-based polymer compound may be the same method as exemplified in the previous section.
By implanting ions into the layer 3 containing the silicon-based polymer compound, an ion-implanted layer 3a having gas barrier properties is formed on the surface portion of the layer 3 containing the silicon-based polymer compound. In FIG. 1C, the gas barrier layer 4 is the entire layer 3 containing the silicon-based polymer compound in which the ion implantation layer 3 a is formed on the surface portion.
According to the production method of the present invention, the gas barrier film of the present invention can be produced efficiently and simply.

4) Electronic member or optical member The electronic member and optical member of the present invention include the gas barrier film of the present invention.
Examples of the electronic member include flexible substrates such as a liquid crystal display member, an organic EL display member, an inorganic EL display member, an electronic paper member, a solar cell, and a thermoelectric conversion member.
Examples of the optical member include an optical filter, a wavelength conversion device, a light control device, a polarizing plate, an optical member of a retardation plate, and the like.

Since the electronic member and the optical member of the present invention include the gas barrier film of the present invention, the electronic member and the optical member are excellent in gas barrier properties and can prevent intrusion of gas such as water vapor.
In addition, since the electronic member and the optical member of the present invention are provided with the gas barrier film of the present invention, even when used under high temperature conditions or high humidity conditions, they are excellent in interlayer adhesion and hardly deteriorate in gas barrier properties. Is.

  Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to the following examples.

Example 1
As a hydroxyl group-containing resin, a polyvinyl acetal resin obtained by reacting polyvinyl alcohol and acetaldehyde (“ESREC KS-10”, manufactured by Sekisui Chemical Co., Ltd., repeating unit containing a hydroxyl group: 25 mol%, degree of acetalization: 75 mol%, Weight average molecular weight: 17,000, expressed as “PVAC1” in Table 1 below) is dissolved in a mixed solvent (volume ratio = 1/1) consisting of toluene and ethyl acetate, and then a fragrance is used as a crosslinking agent. Xylylene diisocyanate (XDI), which is an aliphatic isocyanate-based cross-linking agent (“TD-75”, manufactured by Soken Chemical Co., Ltd., indicated as cross-linking agent “A” in Table 1 below) is used for the hydroxyl group in the polyvinyl acetal resin. The ratio of isocyanate groups in xylylene diisocyanate (NCO / OH) is 50%. The composition for forming an intermediate layer 1 was prepared gas barrier film.

Next, on the easy-adhesion surface of a polyethylene terephthalate film (“PET50A-4100”, manufactured by Toyobo Co., Ltd., thickness 50 μm, hereinafter referred to as “PET”) as a film base, It was coated with a bar coater so that the thickness after drying was 1 μm, dried at 120 ° C. for 2 minutes, and then allowed to stand at 40 ° C. for 7 days to form a gas barrier film intermediate layer on the substrate (Step 1). The thickness of the intermediate layer was 1 μm.
On the obtained intermediate layer, a coating agent (“Aquamica NL110-20”, manufactured by Clariant Japan Co., Ltd.) mainly composed of perhydropolysilazane as a silicon-based polymer compound is spin-coated, and the thickness after drying becomes 150 nm. And heated at 120 ° C. for 2 minutes to form a layer containing a silicon polymer compound (step 2).
Next, using a plasma ion implantation apparatus, argon (Ar) was plasma ion implanted on the surface of the layer containing the silicon-based polymer compound to form a gas barrier layer, thereby producing a gas barrier film 1 (step 3). The thickness of the formed gas barrier layer was 150 nm.

The conditions for plasma ion implantation are shown below.
・ Gas flow rate: 100sccm
・ Duty ratio: 0.5%
・ Repetition frequency: 1000Hz
-Applied voltage: -10 kV
-RF power supply: frequency 13.56 MHz, applied power 1000 W
-Chamber internal pressure: 0.2 Pa
・ Pulse width: 5μsec
・ Processing time (ion implantation time): 5 minutes ・ Conveying speed: 0.2 m / min

(Examples 2 to 6)
In Example 1, except that the addition amount of the crosslinking agent A is as shown in Table 1 below, the gas barrier film intermediate layer forming compositions 2 to 6 were prepared in the same manner as in Example 1, and the gas barrier film was prepared. 2-6 were obtained.

(Example 7)
In Example 5, as a hydroxyl group-containing resin, a polyvinyl acetal resin obtained by reacting polyvinyl alcohol and acetaldehyde (“ESREC KS-3”, manufactured by Sekisui Chemical Co., Ltd., hydroxyl group-containing repeating unit: 25 mol%, acetalization) The composition for forming an intermediate layer for a gas barrier film is the same as in Example 5, except that the degree is 75 mol%, the weight average molecular weight is 108,000, and is expressed as “PVAC2” in Table 1 below. Then, a gas barrier film 7 was produced.

(Example 8)
In Example 5, as a hydroxyl group-containing resin, a polyvinyl acetal resin obtained by reacting polyvinyl alcohol and acetaldehyde (“ESREC BX-1”, manufactured by Sekisui Chemical Co., Ltd., hydroxyl group-containing repeating unit: 33 mol%, acetalization) Degree: 67 mol%, weight average molecular weight: 100,000, indicated as “PVAC3” in Table 1 below) Then, a gas barrier film 8 was produced.

Example 9
In Example 3, the cross-linking agent was changed from cross-linking agent A to xylylene diisocyanate (made by Mitsui Chemicals Polyurethanes Co., Ltd., indicated as cross-linking agent “B” in Table 1 below). Thus, a gas barrier film intermediate layer forming composition 9 was prepared, and then a gas barrier film 9 was produced.

(Example 10)
In Example 3, the gas barrier was changed in the same manner as in Example 3 except that the film base material was changed to a polycarbonate film (“Pure Ace”, manufactured by Teijin Chemicals Ltd., indicated as “PC” in Table 1 below). A film intermediate layer forming composition 10 was prepared, and then a gas barrier film 10 was prepared.

(Comparative Example 1)
Without using a cross-linking agent, a polyvinyl alcohol resin (“GOHSENOL GL-03”, manufactured by Nippon Gosei Kagaku Kogyo Co., Ltd., a hydroxyl group-containing repeating unit: 86.5 to 89.0 mol%, as shown in Table 1 below, without using a crosslinking agent. A gas barrier film 1r was produced in the same manner as in Example 10, except that PVA was used as a composition for forming an intermediate layer for a gas barrier film.

(Comparative Example 2)
As a composition for forming an intermediate layer for a gas barrier film, a urethane resin (“Byron UR 1350”, manufactured by Toyobo Co., Ltd., a solid content weight ratio of 8%, a polyurethane acrylate UV curable resin compound containing no hydroxyl group as a main component is used. Using a solution in which the resin was dissolved in methyl ethyl ketone / toluene solvent (weight ratio: 65/35), the thickness after drying was 1 μm on the easy-adhesion surface of PET as a film substrate in the same manner as in Example 1. After coating with a bar coat and drying at 120 ° C. for 2 minutes, UV irradiation (high pressure mercury lamp, line speed 20 m / min, integrated light quantity 100 mJ / cm ² ) is performed using a UV irradiation line to form an intermediate layer did. Next, a gas barrier film 2r was produced in the same manner as in Example 1.

(Comparative Example 3)
In Example 1, a composition for forming an intermediate layer for a gas barrier film was prepared in the same manner as in Example 1 except that no crosslinking agent was added, and then a gas barrier film 3r was produced.

(Comparative Example 4)
In Example 1, a gas barrier layer was formed by directly applying a coating agent mainly composed of perhydropolysilazane as a silicon-based polymer compound on the base material without forming an intermediate layer by the intermediate layer forming composition. A gas barrier film 4r was obtained in the same manner as in Example 1 except that it was formed.

  About the gas barrier films 1-10 and 1r-4r obtained by the said Example and comparative example, the measurement of the water-vapor-permeation rate, the interlayer adhesive evaluation test, and the measurement of visible light transmittance were performed by the method shown below. The results are shown in Table 1 below.

(Measurement of water vapor transmission rate)
The water vapor transmission rate was measured using a water vapor transmission rate measuring device (“PERMATRAN-W3 / 33”, manufactured by mocon) under the conditions of 40 ° C. and relative humidity 90%.

(Evaluation of optical properties)
According to JIS K 7631-1, “NDH2000” (manufactured by Nippon Denshoku Industries Co., Ltd.) is used as the visible light transmittance of the gas barrier film before and after being placed for 150 hours under high-temperature and humid heat conditions (60 ° C., humidity 90%). It measured using.

(Interlayer adhesion evaluation test)
After placing for 150 hours under high-temperature and humid-heat conditions (60 ° C., humidity 90%), peeling of the film was observed according to a cross-cut test (JIS K-5400 (1990)). In addition, 100 squares were observed, and those in which peeling of 90 squares or more was not observed were evaluated as “good”, and the others were evaluated as “bad”.

From Table 1, it can be seen that the gas barrier films of the present invention of Examples 1 to 10 are excellent in gas barrier properties, interlayer adhesion and transparency.
The gas barrier film of Comparative Examples 1 and 3 that does not contain a crosslinking agent in the intermediate layer, the gas barrier film of Comparative Example 2 that does not contain a hydroxyl group-containing resin in the intermediate layer is inferior in interlayer adhesion, and the gas barrier film of Comparative Example 2 is It was inferior in transparency.
The gas barrier film of Comparative Example 4 that did not use an intermediate layer was inferior in both interlayer adhesion and transparency.

DESCRIPTION OF SYMBOLS 1 ... Film base material 2 ... Intermediate | middle layer 3 ... Layer 4 containing a silicon-type polymer compound ... Gas barrier layer 3a ... Ion implantation layer

Claims (10)

  A composition for forming an intermediate layer for a gas barrier film, which comprises a hydroxyl group-containing resin and a crosslinking agent.   The composition for forming an intermediate layer for a gas barrier film according to claim 1, wherein the hydroxyl group-containing resin is a polyvinyl acetal resin.   The composition for forming an intermediate layer for a gas barrier film according to claim 2, wherein the degree of acetalization of the polyvinyl acetal resin is 50 mol% or more.   The composition for forming an intermediate layer for a gas barrier film according to claim 2 or 3, wherein the polyvinyl acetal resin is obtained by reacting polyvinyl alcohol with acetaldehyde or butyraldehyde.   The composition for forming an intermediate layer for a gas barrier film according to any one of claims 1 to 4, wherein the crosslinking agent is an isocyanate-based crosslinking agent.   A gas barrier film comprising at least a film substrate, an intermediate layer formed from the composition for forming an intermediate layer for a gas barrier film according to any one of claims 1 to 5, and a gas barrier layer formed on the intermediate layer.   The gas barrier film according to claim 6, wherein the gas barrier layer is a layer obtained by implanting ions into a layer containing a silicon-based polymer compound.   The gas barrier film according to claim 7, wherein the silicon-based polymer compound is a polysilazane compound. A method for producing a gas barrier film comprising a film substrate, an intermediate layer formed on the substrate, and a gas barrier layer formed on the intermediate layer, the method comprising: Method.
(Step 1) A step of applying an intermediate layer forming composition for a gas barrier film containing a hydroxyl group-containing resin and a crosslinking agent on a film substrate, and forming the intermediate layer by drying the resulting coating film ( Step 2) A step of forming a layer containing a silicon-based polymer compound by coating a coating liquid containing a silicon-based polymer compound on the obtained intermediate layer and drying the obtained coating film (step) 3) Step of forming a gas barrier layer by implanting ions into the layer containing the obtained silicon-based polymer compound   An electronic member or an optical member comprising the gas barrier film according to claim 6.

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