JP2013103400A - Liquid injection head and liquid injection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid injection head which can downsize the head and reduce cost, and to provide a liquid injection device including the liquid injection head.SOLUTION: A case 15 includes: a head fixation part 15a where a head unit 16 is fixed; a board retention part 15b which retains a wiring board 30; and a wiring space 22 which makes a flexible cable 40 from the side of the head unit communicate with the side of a board placing surface 46 of the board retention part. One end of the flexible cable is connected to a piezoelectric element 36 and the other end of the flexible cable is disposed on the board placing surface through the wiring space. The wiring board is laminated on the flexible cable which is disposed on the board placing surface so that the terminal of the other end and a board terminal are overlapped. The board retention part has a wiring opening 50 which a connection part reaches at the position corresponding to the connection part 60 of the terminal of the other end and the board terminal on the board placing surface.

Description

  The present invention relates to a liquid ejecting head such as an ink jet recording head, and a liquid ejecting apparatus, and in particular, a head unit that ejects liquid from a nozzle, a wiring member that is electrically connected to a pressure generating unit, The present invention relates to a liquid jet head including a wiring board that supplies a drive signal to a pressure generating unit through the wiring member, and a liquid jet apparatus.

  The liquid ejecting apparatus includes a liquid ejecting head and ejects various liquids from the ejecting head. As this liquid ejecting apparatus, for example, there is an image recording apparatus such as an ink jet printer or an ink jet plotter, but recently, various types of manufacturing have been made by taking advantage of the ability to accurately land a very small amount of liquid on a predetermined position. It is also applied to devices. For example, a display manufacturing apparatus for manufacturing a color filter such as a liquid crystal display, an electrode forming apparatus for forming an electrode such as an organic EL (Electro Luminescence) display or FED (surface emitting display), a chip for manufacturing a biochip (biochemical element) Applied to manufacturing equipment. The recording head for the image recording apparatus ejects liquid ink, and the color material ejecting head for the display manufacturing apparatus ejects solutions of R (Red), G (Green), and B (Blue) color materials. The electrode material ejecting head for the electrode forming apparatus ejects a liquid electrode material, and the bioorganic matter ejecting head for the chip manufacturing apparatus ejects a bioorganic solution.

  There are various types of such liquid ejecting heads, but the so-called on-demand type that is widely used corresponds to a series of liquid flow paths from a common liquid chamber to a nozzle through a pressure chamber. For example, droplets are ejected from the nozzles using pressure fluctuations generated in the liquid in the pressure chamber by driving pressure generating means such as piezoelectric elements and heating elements.

  In this type of liquid jet head, a wiring board (printed board) for receiving a drive signal from the apparatus main body side and supplying it to the pressure generating means is provided in a case member (holding member), and a COF (chip-on-chip) is provided. A driving signal is supplied from the wiring board to each pressure generating means through a flexible wiring member (hereinafter referred to as a flexible cable) such as a film) or a TCP (tape carrier package) (see, for example, Patent Document 1). ). This flexible cable is configured, for example, by forming a conductor pattern with a copper foil or the like on the surface of a base film such as polyimide and covering the conductor pattern with a resist. And the terminal part of the one end side of this flexible cable is connected to the terminal part of a pressure generation means, and the terminal part of the other end side is connected to the board | substrate terminal part on a wiring board.

JP 2010-240856 A (FIG. 5 etc.)

  By the way, in the configuration of Patent Document 1, a flexible cable connected to the pressure generating means (vibrator unit) is accommodated in an empty portion formed inside the case member (head case), and an upper opening of the empty portion is opened. The wiring board is arranged on the case member so as to close it. The wiring board is provided with an opening having a size allowing a flexible cable to be inserted. A flexible cable is inserted through the opening, and the terminals on the surface of the wiring board and the terminals of the flexible cable are electrically connected. In other words, the other end portion of the flexible cable whose one end portion is connected to the pressure generating means is pulled out from the empty portion side of the case member to the connection terminal forming surface side of the wiring substrate through the opening portion of the wiring substrate, and is heated by a heat tool or the like Soldered to the wiring board.

  However, if the opening as described above is opened in the wiring board, it is necessary to form the wiring pattern on the wiring board while avoiding the opening, and there is a problem that the wiring board is increased in size accordingly. In addition, the cost increases as the size of the wiring board increases.

  SUMMARY An advantage of some aspects of the invention is that it provides a liquid ejecting head capable of reducing the size of the head and reducing the cost, and a liquid ejecting apparatus including the liquid ejecting head. is there.

The present invention has been proposed to achieve the above-described object, and has a nozzle forming surface in which nozzles are arranged side by side and pressure generating means for generating pressure fluctuations in a pressure chamber communicating with the nozzles. A head unit that ejects liquid from the nozzles by driving the generating means;
A flexible wiring member having one end electrically connected to the pressure generating means;
A wiring board having a board terminal corresponding to the wiring terminal formed at the other end of the wiring member, and supplying a drive signal to the pressure generating means through the wiring member;
A liquid jet head provided with a holding member,
The holding member includes a head fixing portion to which the head unit is fixed in a posture in which the nozzle forming surface is on the first surface side, and a second surface side opposite to the first surface of the head fixing portion. A board holding portion that holds the wiring board on the second surface and a wiring member that passes the wiring member from the head unit side fixed to the head fixing portion to the second surface side of the substrate holding portion. And
The other end portion of the wiring member having one end portion connected to the pressure generating means is disposed on the second surface through the wiring empty portion, and the wiring terminal portion and the substrate terminal portion overlap with each other. The wiring board is laminated on the wiring member disposed on the surface of 2;
The substrate holding portion has a wiring opening at a position corresponding to the bonding portion between the wiring terminal portion and the substrate terminal portion on the second surface, the bonding portion facing the opening. .

  According to the present invention, the other end portion of the wiring member whose one end portion is connected to the pressure generating means is disposed on the second surface through the wiring empty portion, and the wiring terminal portion and the substrate terminal portion overlap with each other. The wiring board is laminated on the wiring member disposed on the surface of the substrate 2, and the substrate holding portion is opened at a position corresponding to the joint portion of the wiring terminal portion and the substrate terminal portion on the second surface. Since the wiring opening facing inside is provided, it is not necessary to provide a through hole for inserting a wiring member in the wiring board, and the size of the wiring board can be reduced accordingly. Thereby, it can contribute to size reduction of a liquid jet head. In addition, the joint portion between the wiring terminal portion and the substrate terminal portion is sandwiched between the second surface and the wiring substrate, but the wiring terminal portion and the substrate terminal portion can be joined through the wiring opening. Wiring workability can be easily performed without any trouble.

In the above configuration, a plurality of positioning pins are provided on the second surface to define the relative positions of the wiring board and the wiring member.
The wiring member has a plurality of first insertion holes corresponding to the positioning pins,
The wiring board has a plurality of second insertion holes corresponding to the positioning pins,
By positioning positioning pins corresponding to the first insertion hole and the second insertion hole, respectively, and defining the relative positions of the wiring board and the wiring member, the wiring terminal portion and the substrate terminal portion It is desirable to adopt a configuration in which the planar positions match.

  According to this configuration, since the relative positions of the wiring terminal portion and the substrate terminal portion are matched by inserting the positioning pins into the first insertion hole and the second insertion hole, the positions of the terminal portions are aligned. Therefore, it is not necessary to use a jig or the like, and the terminal portions can be easily and reliably connected to each other. As a result, the work efficiency of the wiring work can be improved.

  In each of the above configurations, the wiring vacant portion may be configured to have a guide surface that slopes upward toward the second surface side and guides the other end portion of the wiring member to the second surface. it can.

  According to this configuration, the wiring work is facilitated by wiring along the guide surface guided to the second surface, and the wiring member is bent along the guide surface. Can be kept low. Thereby, it can contribute to size reduction of the whole liquid-jet head.

The holding member has a supply path for supplying liquid from a liquid supply source to the pressure chamber side of the head unit;
The wiring member preferably has an insertion opening through which the supply path is inserted.

  According to the configuration, even in the configuration in which the supply flow path is provided in the central portion of the holding member, it is not necessary to wire the wiring member while avoiding the supply flow path, and the wiring member can be bent and wired in the middle. The height of the holding member can be kept low. Thereby, it can contribute to size reduction of the whole liquid-jet head.

  According to another aspect of the invention, a liquid ejecting apparatus includes the liquid ejecting head having any one of the above configurations.

FIG. 3 is a perspective view illustrating a configuration of a printer. FIG. 3 is a cross-sectional view of a recording head. FIG. 6 is a bottom view of the recording head. FIG. 3 is a top view of the recording head. It is a flexible cable. It is sectional drawing of a head unit. FIG. 6 is a top view of a recording head in another embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the accompanying drawings. In the embodiments described below, various limitations are made as preferred specific examples of the present invention. However, the scope of the present invention is not limited to the following description unless otherwise specified. However, the present invention is not limited to these embodiments. In the following description, as an example of the liquid ejecting apparatus of the present invention, an ink jet printer (a kind of liquid ejecting apparatus of the present invention) provided with an ink jet recording head (hereinafter referred to as a recording head), which is a kind of liquid ejecting head. To do.

  The configuration of the printer 1 will be described with reference to FIG. The printer 1 is a device that records an image or the like by ejecting liquid ink onto the surface of a recording medium 2 (a kind of landing target) such as recording paper. The printer 1 includes a recording head 3 that ejects ink, a carriage 4 to which the recording head 3 is attached, a carriage moving mechanism 5 that moves the carriage 4 in the main scanning direction, and a platen roller 6 that transfers the recording medium 2 in the sub-scanning direction. Etc. Here, the ink is a kind of liquid of the present invention, and is stored in an ink cartridge 7 as a liquid supply source. The ink cartridge 7 is detachably attached to the recording head 3. It is also possible to employ a configuration in which the ink cartridge 7 is disposed on the main body side of the printer 1 and is supplied from the ink cartridge 7 to the recording head 3 through an ink supply tube.

  The carriage moving mechanism 5 includes a timing belt 8. The timing belt 8 is driven by a pulse motor 9 such as a DC motor. Accordingly, when the pulse motor 9 is operated, the carriage 4 is guided by the guide rod 10 installed on the printer 1 and reciprocates in the main scanning direction (width direction of the recording medium 2).

  FIG. 2 is a cross-sectional view showing the configuration of the recording head 3. 3 is a bottom view of the recording head 3, and FIG. 4 is a top view of the recording head 3 (a state in which the needle holder 18 is not attached). The recording head 3 in this embodiment includes a case 15 (corresponding to a holding member in the present invention), a head unit 16, a unit fixing plate 17, and a needle holder 18.

  The needle holder 18 is a member in which a plurality of ink introduction needles 20 are erected on the upper surface side, and is made of, for example, a synthetic resin. In the present embodiment, a total of four ink introduction needles 20 are arranged side by side on the upper surface of the needle holder 18 so as to correspond to the inks of the ink cartridges 7 of the respective colors. The ink introduction needle 20 is a hollow needle-like member that is inserted into the ink cartridge 7, and the ink stored in the ink cartridge 7 is introduced into the case 15 from an introduction hole (not shown) provided at the tip. Is introduced to the head unit 16 side through the supply flow path 14 (see FIG. 4). On the lower surface side of the needle holder 18 is formed a substrate housing portion 21 in which the wiring substrate 30 disposed on the substrate mounting surface 46 (corresponding to the second surface in the present invention) which is the upper surface of the case 15 is accommodated. Yes. The needle holder 18 is fixed to the substrate mounting surface 46 side of the case 15 in a state where the wiring substrate 30 is accommodated in the substrate accommodating portion 21.

  The case 15 is a hollow box-shaped member made of synthetic resin, for example. The case 15 includes a head fixing portion 15a to which the head unit 16 is fixed, and a substrate holding portion 15b to which the wiring board 30 is held and the needle holder 18 is fixed. On the lower surface (first surface in the present invention) side of the head fixing portion 15a, a head unit accommodation space 19 in which the head unit 16 is accommodated is formed by being recessed from the lower surface side to the upper surface side. A total of two head units 16 are accommodated side by side in a second direction (left-right direction in FIG. 2) orthogonal to the nozzle row direction (first direction) inside the head unit accommodation space 19 in the present embodiment. Is done. Each head unit 16 in the head unit housing space 19 is fixed to a metal unit fixing plate 17 having two openings 17 ′ formed corresponding to each head unit 16.

  In addition, on the substrate holding portion 15b side (substrate mounting surface 46 side) inside the head fixing portion 15a, the lower end communicates with the head unit housing space 19 and the upper end opens to the substrate mounting surface 46. A portion 22 is formed. In the present embodiment, a total of two wiring vacancies 22 corresponding to the two head units 16 are provided in the head fixing portion 15a with a partition wall 22 'therebetween. A part of the inner wall of the wiring cavity 22, specifically, substantially the upper half of the inner wall surface located outside in the second direction is inclined upward toward the substrate placement surface 46. As will be described later, this surface functions as a guide surface 39 that guides the flexible cable 40 to the wiring region 49 side of the substrate mounting surface 46.

  The substrate holding part 15b is a member formed integrally on the upper surface side of the head fixing part 15a. The upper surface of the substrate holding portion 15b is a substrate mounting surface 46 on which the other end portions of the wiring substrate 30 and the flexible cable 40 are arranged. In plan view, the area of the substrate mounting surface 46 is larger than the area of the head fixing portion 15a. A portion of the substrate holding portion 15 b that protrudes to the side of the head fixing portion 15 a is a flange portion 47. In the central part of the substrate mounting surface 46, the wiring vacant part 22 of the head fixing part 15a is opened. On the substrate placement surface 46, outside the openings in the wiring vacancies 22 in the second direction, wiring regions 49 in which the other ends of the flexible cables 40 drawn out from the wiring vacancies 22 are arranged are partitioned. ing. Positioning pins 51 project from both ends of the wiring region 49 in the first direction. In the present embodiment, since two wiring regions 49 are divided, a total of four positioning pins 51 are provided on the substrate mounting surface 46. The positioning pins 51 are for defining the relative positions of the flexible cable 40 and the wiring board 30 on the board placement surface 46. Further, on the substrate mounting surface 46, the upstream ends of the supply flow paths 14 are opened on both sides in the first direction of the openings of the wiring cavities 22, respectively. Each supply channel 14 extends toward the head unit 16 inside the case 15, and its downstream end communicates with the ink introduction channel 43 of the head unit 16.

  In the flange portion 47 of the substrate holding portion 15b, a wiring opening 50 having an elongated rectangular opening is opened in a state of penetrating in the plate thickness direction. The wiring opening 50 is a joint portion that is a position where the substrate terminal portion 53 of the wiring substrate 30 and the other end side terminal portion 54 of the flexible cable 40 that are arranged in a state of being positioned on the substrate mounting surface 46 are overlapped. 60 is formed at a position corresponding to 60. In addition, the size of the wiring opening 50 is set to be slightly larger than the other end side terminal portion 54 and the substrate terminal portion 53. As a result, when the other end of the flexible cable 40 and the wiring board 30 are positioned on the board mounting surface 46 by the positioning pins 51, the joint 60 is placed in the wiring opening 50. It comes to face.

  In the flexible cable 40, for example, a driving IC 58 for controlling application of a driving voltage to the piezoelectric element 36 is mounted on the surface of a base film such as polyimide, and a conductor pattern connected to the driving IC 58 is formed of copper foil or the like. The conductor pattern and the drive IC 58 are covered with a resist. One end portion of the flexible cable 40 is formed with a terminal portion (not shown) that is electrically connected to the piezoelectric element 36, while the other end portion is electrically connected to the substrate terminal portion 53 of the wiring board 30. The other end side terminal portion 54 (corresponding to the wiring terminal portion in the present invention) is formed. At the other end of the flexible cable 40, at a position corresponding to the positioning pin 51 of the substrate mounting surface 46, a cable through hole 59 (corresponding to the first insertion hole in the present invention) through which the positioning pin 51 is inserted. Has been established in two places (see FIG. 4).

  The flexible cable 40 is accommodated in the wiring cavity 22 with one end connected to the element terminal of the piezoelectric element 36. As shown in FIG. 2, the flexible cable 40 is pulled out from the head unit 16 into the wiring void 22 in a posture substantially perpendicular to the nozzle formation surface (nozzle plate 23). It can be bent at. Specifically, the posture is inclined with respect to the nozzle forming surface so as to be along the guide surface 39 of the wiring cavity 22. Thus, by bending and wiring the flexible cable 40, the height of the case 15 can be kept low. Thereby, it can contribute to size reduction of the recording head 3 whole. Then, the other end portion of the wiring flexible cable 40 is drawn from the wiring empty portion 22 side along the guide surface 39 to the substrate mounting surface 46 side, and the positioning pin 51 is inserted into each cable through hole 59 so that It is disposed on the wiring area 49 of the substrate mounting surface 46.

  FIG. 5 is a plan view illustrating the configuration of the wiring board 30 and shows a surface on the substrate mounting surface 46 side. The wiring board 30 is a board on which a wiring pattern for receiving a driving signal from the printer main body side and supplying the driving signal to the piezoelectric element 36 through the flexible cable 40 is formed. The wiring board 30 is formed with a board terminal portion 53 that is electrically connected to the other end side terminal portion 54 of the flexible cable 40 and is mounted with a connector 55 and other electronic components for connection to the printer main body side. ing. In the wiring board 30 in the present embodiment, two board terminal parts 53 are formed corresponding to the other end side terminal parts 54 of the two flexible cables 40 arranged on the board mounting surface 46. Further, a wiring member such as an FFC (flexible flat cable) is connected to the connector 55, and the wiring board 30 receives a drive signal from the printer main body side via the FFC.

  In the wiring board 30, at positions corresponding to the positioning pins 51 on the board mounting surface 46, there are a total of four board through holes 56 (corresponding to the second insertion holes in the present invention) through which the positioning pins 51 are inserted. It has been established. The wiring board 30 has the board terminal portion forming surface facing the board mounting surface 46 side of the case 15, the positioning pins 51 are inserted through the board through holes 56, and the other end 9 b of the flexible cable 40 is interposed between the wiring boards 30. The substrate is placed on the substrate mounting surface 46 in a state of being interposed between the two. Thereby, the position on the plane of the board | substrate terminal part 53 and the other end side terminal part 54 of the flexible cable 40 corresponds. The overlapping portion of these terminal portions corresponds to the joint portion 60 in the present invention.

  FIG. 6 is a cross-sectional view showing the internal configuration of the head unit 16. The head unit 16 in the present embodiment is schematically configured from a nozzle plate 23, a flow path substrate 24, a common liquid chamber substrate 25, and a compliance substrate 26, and is attached to the unit case 27 in a state where these members are stacked. . The nozzle plate 23 (a kind of nozzle forming member) is a plate-like member in which a plurality of nozzles 28 are opened in a row at a pitch corresponding to the dot formation density. In the present embodiment, a nozzle row is configured by arranging 360 nozzles 28 in a row at a pitch of 360 dpi.

  A thin elastic film 31 made of silicon dioxide is formed on the upper surface (the surface on the common liquid chamber substrate 25 side) of the flow path substrate 24 by thermal oxidation. As shown in FIG. 4, a plurality of pressure chambers 32 defined by a plurality of partition walls are formed in the flow path substrate 24 corresponding to each nozzle 28. On the outside of the row of pressure chambers 32 in the flow path substrate 24, a communication empty portion 34 that defines a part of the common liquid chamber 33 as a chamber into which ink common to the pressure chambers 32 is introduced is formed. . The communication space 34 communicates with each pressure chamber 32 via the ink supply path 35.

  On the elastic film 31 on the upper surface of the flow path substrate 24, a metal lower electrode film, a piezoelectric layer made of lead zirconate titanate (PZT), and an upper electrode film made of metal are sequentially laminated. A piezoelectric element 36 is formed for each pressure chamber 32. The piezoelectric element 36 is a so-called flexural mode piezoelectric element and is formed so as to cover the upper portion of the pressure chamber 32. Electrode wiring portions 48a and 48b extend from the respective element electrodes of the piezoelectric element 36 on the elastic film 31, and are provided at one end of the flexible cable 40 at portions corresponding to the electrode terminals of these electrode wiring portions. Connected wiring terminals (not shown) are electrically connected. Each piezoelectric element 36 is deformed when a driving voltage is applied between the upper electrode film and the lower electrode film through the flexible cable 40.

  On the flow path substrate 24 on which the piezoelectric element 36 is formed, a common liquid chamber substrate 25 having a through-opening portion 37 penetrating in the thickness direction is disposed. The common liquid chamber substrate 25 is manufactured using a silicon single crystal substrate in the same manner as the flow path substrate 24 and the nozzle plate 23. The through space 37 in the common liquid chamber substrate 25 communicates with the communication space 34 of the flow path substrate 24 to partition a part of the common liquid chamber 33.

  A compliance substrate 26 is disposed on the upper surface side of the common liquid chamber substrate 25. An ink introduction port 41 that supplies ink from the ink introduction needle 20 side to the common liquid chamber 33 penetrates in the thickness direction in a region of the compliance substrate 26 facing the through-opening portion 37 of the common liquid chamber substrate 25. Is formed. In addition, the area other than the ink introduction port 41 in the area facing the through hole 37 of the compliance substrate 26 is a flexible part 42 formed extremely thin. The common liquid chamber 33 is partitioned and formed by sealing the upper opening. The flexible portion 42 functions as a compliance portion that absorbs pressure fluctuations of ink in the common liquid chamber 33.

  The unit case 27 communicates with the ink introduction port 41 and is formed with an ink introduction path 43 for supplying ink introduced from the ink introduction needle 20 side to the common liquid chamber 33 side and faces the flexible portion 42. This is a member in which a recess 44 that allows expansion of the flexible portion 42 is formed in a region to be operated. A hollow portion 44 penetrating in the thickness direction is formed in the center portion of the unit case 27, and one end side of the flexible cable 40 is inserted into the hollow portion 44, and the electrode wiring portion 48 of the piezoelectric element 36 and Electrically connected.

  The nozzle plate 23, the flow path substrate 24, the common liquid chamber substrate 25, the compliance substrate 26, and the unit case 27 are heated in a state in which an adhesive, a heat-welded film, or the like is disposed and laminated. Are joined together.

  The recording head 3 including the head unit 16 configured as described above is attached to the carriage 4 so that the nozzle row direction (first direction) matches the sub-scanning direction with each nozzle plate 23 facing the platen. It is done. Each head unit 16 takes ink from the ink cartridge 3 from the ink introduction port 41 to the common liquid chamber 33 side through the ink introduction needle 20, the ink supply path 35, and the ink introduction path 43, and from the common liquid chamber 33. The ink flow path reaching the nozzle 28 is filled with ink. Then, by applying a driving voltage from the flexible cable 40 to the piezoelectric element 36 to cause the piezoelectric element 36 to bend and deform, a pressure fluctuation is generated in the ink in the corresponding pressure chamber 32, and the pressure fluctuation of the ink is utilized. Then, ink is ejected from the nozzle 28.

  Here, in the recording head 3 configured as described above, the wiring between the flexible cable 40 and the wiring substrate 30, that is, the conduction between the other end side terminal portion 54 of the flexible cable 40 and the substrate terminal portion 53 of the wiring substrate 30 is performed. It has a feature in the structure for illustration. Hereinafter, this point will be described.

  The flexible cable 40 having one end connected to the electrode wiring portion 48 of the piezoelectric element 36 in the head unit 16 is drawn out from the head unit 16 into the wiring empty portion 22 in a posture substantially perpendicular to the nozzle formation surface, and the wiring The other end portion ahead of the bent portion is pulled out from the wiring vacant portion 22 side along the guide surface 39 to the substrate mounting surface 46 side. Then, the positioning pins 51 are respectively inserted into the cable through holes 59 and positioned on the wiring area 49 of the substrate mounting surface 46 in a positioned state. At this time, the surface of the other end portion of the flexible cable 40 on which the other end side terminal portion 54 is formed is in a state facing the side opposite to the substrate placement surface 46 (upward).

  Next, the wiring substrate 30 is laminated on the other end portion of the flexible cable 40 on the substrate mounting surface 46. At this time, the wiring substrate 30 has the substrate through hole in a state where the surface on which the substrate terminal portion 53 is formed faces the substrate mounting surface 46 side, that is, the other end of the flexible cable 40 on the substrate mounting surface 46. The positioning pin 51 is inserted into the substrate 56 and attached to the substrate mounting surface 46 with the other end of the flexible cable 40 interposed therebetween. Thereby, the other end side terminal part 54 and the board | substrate terminal part 53 overlap in the state in which the relative position of each terminal of the other end side terminal part 54 and each terminal of the board | substrate terminal part 53 corresponded. In this state, the joining portion 60 where the other end side terminal portion 54 and the substrate terminal portion 53 overlap each other faces the wiring opening 50 provided in the substrate holding portion 15b. Note that at least one of the other end side terminal portion 54 and the substrate terminal portion 53 is pre-soldered. And in this embodiment, the other end side terminal part 54 and the board | substrate terminal part 53 are soldered and electrically joined by heating the junction part 60 with the heat tool etc. through the opening part 50 for wiring. The

  By configuring the recording head 3 as described above, there is no need to provide a through hole for inserting the flexible cable 40 in the wiring board 30, and the size of the wiring board 30 can be reduced correspondingly. As a result, the recording head 3 can be reduced in size. In the present embodiment, the joint portion 60 is sandwiched between the substrate placement surface 46 and the wiring substrate 30, but the other end side terminal portion 54 and the substrate terminal portion 53 can be joined through the wiring opening 50. Therefore, wiring work can be easily performed without any trouble. Further, by inserting the positioning pin 51 into the board through hole 56 and the cable through hole 32, the relative positions of the other end side terminal part 54 and the board terminal part 53 are matched. There is no need to use a jig or the like for matching, and the terminal portions 53 and 54 can be conducted easily and reliably. As a result, the work efficiency of the wiring work can be improved.

  By the way, the present invention is not limited to the above-described embodiment, and various modifications can be made based on the description of the scope of claims.

  For example, in the above-described embodiment, the configuration in which the supply flow path 14 of the case 15 is provided at one place on each side of the substrate placement surface 46 in the first direction is illustrated, but the present invention is not limited thereto. For example, in the second embodiment shown in FIG. 7, in addition to the two supply channels 14 on both sides in the first direction on the substrate mounting surface 46, the supply channel 14 is also formed in the central portion in the same direction. The upper end of the supply flow path 14 is open to the substrate placement surface 46. If a conventional flexible cable is used in this configuration, it is necessary to perform wiring while avoiding the supply flow path 14 in the case 15. That is, in this case, wiring is performed in the space between the two supply channels 14 formed in the central portion. As a result, the flexible cable is inevitably pulled out to the substrate mounting surface 46 in a posture substantially perpendicular to the nozzle forming surface, and the total length of the flexible cable is determined by the standard (should be shortened). There is a problem that the height of the case 15 increases accordingly. On the other hand, the flexible cable 40 ′ in the present embodiment has an insertion opening 62 through which the supply channel 14 in the center is inserted. Thereby, it is not necessary to perform wiring by avoiding the supply flow path 14, and it is possible to bend and perform wiring in the middle, and the height of the case 15 can be kept low. Thereby, it can contribute to size reduction of the recording head 3 whole.

  In the above description, the so-called flexural vibration type piezoelectric element is exemplified as the pressure generating means in the present invention, but the present invention is not limited to this, and a so-called electrostatic actuator that displaces a part of the pressure chamber by electrostatic force, The present invention can also be applied to a configuration that employs other pressure generating means such as a heat generating element that causes a pressure fluctuation in the pressure chamber due to bubbles generated by bumping.

  In the above description, the ink jet recording head 3 which is a kind of liquid ejecting head has been described as an example. However, the present invention is electrically connected to a head unit that ejects liquid from a slur and pressure generating means. The present invention can also be applied to other liquid jet heads that employ a configuration in which a holding member includes a wiring member and a wiring board that supplies a driving signal to the pressure generating unit through the wiring member. For example, a color material ejecting head used for manufacturing a color filter such as a liquid crystal display, an electrode material ejecting head used for forming an electrode such as an organic EL (Electro Luminescence) display, FED (surface emitting display), a biochip (biochemical element) The present invention can also be applied to bioorganic matter ejecting heads and the like used in the production of

  DESCRIPTION OF SYMBOLS 1 ... Printer, 3 ... Recording head, 14 ... Supply flow path, 15 ... Case, 16 ... Head unit, 19 ... Head unit accommodation empty part, 22 ... Wiring empty part, 23 ... Nozzle plate, 28 ... Nozzle, 30 ... Wiring Substrate, 36 ... piezoelectric element, 39 ... guide surface, 40 ... flexible cable, 46 ... substrate mounting surface, 47 ... flange, 49 ... wiring area, 50 ... wiring opening, 51 ... positioning pin, 53 ... substrate terminal 54, the other end side terminal portion, 56, the substrate through hole, 58, the drive IC, 59, the cable insertion hole, 60, the joining portion, 62, the insertion opening.

Claims (5)

A head unit that has pressure generating means for generating pressure fluctuations in a nozzle forming surface in which nozzles are arranged in parallel and a pressure chamber communicating with the nozzle, and ejects liquid from the nozzle by driving the pressure generating means;
A flexible wiring member having one end electrically connected to the pressure generating means;
A wiring board having a board terminal corresponding to the wiring terminal formed at the other end of the wiring member, and supplying a drive signal to the pressure generating means through the wiring member;
A liquid jet head provided with a holding member,
The holding member includes a head fixing portion to which the head unit is fixed in a posture in which the nozzle forming surface is on the first surface side, and a second surface side opposite to the first surface of the head fixing portion. A board holding portion that holds the wiring board on the second surface and a wiring member that passes the wiring member from the head unit side fixed to the head fixing portion to the second surface side of the substrate holding portion. And
The other end portion of the wiring member having one end portion connected to the pressure generating means is disposed on the second surface through the wiring empty portion, and the wiring terminal portion and the substrate terminal portion overlap with each other. The wiring board is laminated on the wiring member disposed on the surface of 2;
The substrate holding portion has a wiring opening at a position corresponding to the bonding portion between the wiring terminal portion and the substrate terminal portion on the second surface, the bonding portion facing the opening. Liquid jet head. A plurality of positioning pins are provided on the second surface to define the relative positions of the wiring board and the wiring member.
The wiring member has a plurality of first insertion holes corresponding to the positioning pins,
The wiring board has a plurality of second insertion holes corresponding to the positioning pins,
By positioning positioning pins corresponding to the first insertion hole and the second insertion hole, respectively, and defining the relative positions of the wiring board and the wiring member, the wiring terminal portion and the substrate terminal portion The liquid jet head according to claim 1, wherein the plane positions of the liquid jet heads coincide with each other.   The said wiring empty part has a guide surface which inclines upward toward the said 2nd surface side, and guides the other end part of the said wiring member to the said 2nd surface. 2. A liquid jet head according to 2. The holding member has a supply path for supplying liquid from a liquid supply source to the pressure chamber side of the head unit;
4. The liquid jet head according to claim 1, wherein the wiring member has an insertion opening through which the supply path is inserted. 5.   A liquid ejecting apparatus comprising the liquid ejecting head according to claim 1.

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