JP2013098478A5 - - Google Patents

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JP2013098478A5
JP2013098478A5 JP2011242336A JP2011242336A JP2013098478A5 JP 2013098478 A5 JP2013098478 A5 JP 2013098478A5 JP 2011242336 A JP2011242336 A JP 2011242336A JP 2011242336 A JP2011242336 A JP 2011242336A JP 2013098478 A5 JP2013098478 A5 JP 2013098478A5
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Japan
Prior art keywords
substrate
unit
cleaning
processing system
exposure apparatus
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JP2011242336A
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Japanese (ja)
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JP2013098478A (en
JP5689048B2 (en
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Priority claimed from JP2011242336A external-priority patent/JP5689048B2/en
Priority to JP2011242336A priority Critical patent/JP5689048B2/en
Priority to TW101133757A priority patent/TWI550686B/en
Priority to TW101134699A priority patent/TWI524456B/en
Priority to US13/663,179 priority patent/US9287145B2/en
Priority to US13/663,846 priority patent/US9460942B2/en
Priority to KR1020120123696A priority patent/KR101751551B1/en
Priority to KR1020120123672A priority patent/KR101752513B1/en
Priority to CN201210435430.7A priority patent/CN103094164B/en
Priority to CN201210436221.4A priority patent/CN103094160B/en
Priority to CN201710256275.5A priority patent/CN107256838B/en
Priority to CN201710337989.9A priority patent/CN107180775B/en
Publication of JP2013098478A publication Critical patent/JP2013098478A/en
Publication of JP2013098478A5 publication Critical patent/JP2013098478A5/ja
Publication of JP5689048B2 publication Critical patent/JP5689048B2/en
Application granted granted Critical
Priority to US15/252,422 priority patent/US9984905B2/en
Priority to US15/252,374 priority patent/US9984904B2/en
Priority to KR1020170079084A priority patent/KR102034344B1/en
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Claims (12)

基板を処理する複数の処理ユニットが設けられた処理ステーションと、前記処理ステーションと外部に設けられた露光装置との間で基板の受け渡しを行うインターフェイスステーションと、を備えた基板処理システムであって、
前記インターフェイスステーションは、
基板を前記露光装置に搬入する前に少なくとも基板の裏面を洗浄する基板洗浄部と、
少なくとも前記洗浄後の基板の裏面について、当該基板の露光が可能かどうかを前記露光装置に搬入する前に検査する基板検査部と、を有し、
前記基板洗浄部と前記基板検査部は、同一の筐体の内部に配置され、
前記筐体の内部には、前記基板洗浄部と前記基板検査部との間で基板を搬送する搬送手段が設けられていることを特徴とする、基板処理システム。 A substrate processing system comprising: a processing station provided with a plurality of processing units for processing a substrate; and an interface station for transferring the substrate between the processing station and an exposure apparatus provided outside,
The interface station is
A substrate cleaning section for cleaning at least the back surface of the substrate before carrying the substrate into the exposure apparatus;
A substrate inspection unit that inspects at least about the back surface of the substrate after cleaning before inspecting whether the substrate can be exposed to the exposure apparatus;
The substrate cleaning unit and the substrate inspection unit are arranged in the same housing,
The substrate processing system according to claim 1, further comprising a transfer unit configured to transfer a substrate between the substrate cleaning unit and the substrate inspection unit. 前記インターフェイスステーションには、前記基板洗浄部で洗浄した後の基板に付着した水分を除去する脱水ユニットが設けられていることを特徴とする、請求項１に記載の基板処理システム。 The substrate processing system according to claim 1, wherein the interface station is provided with a dehydrating unit that removes moisture adhering to the substrate after being cleaned by the substrate cleaning unit. 前記基板検査部での検査の結果、基板の状態が、前記基板洗浄部での再洗浄により露光可能な状態になると判定されれば、当該基板を前記基板洗浄部に再度搬送するように、前記搬送手段を制御する基板搬送制御部を有していることを特徴とする、請求項１または２のいずれか一項に記載の基板処理システム。 As a result of the inspection in the substrate inspection unit, if it is determined that the state of the substrate is ready to be exposed by re-cleaning in the substrate cleaning unit, the substrate is transferred to the substrate cleaning unit again. characterized in that it has a substrate transport controller for controlling the conveying means, the substrate processing system according to any one of claims 1 or 2. 前記インターフェイスステーションには、前記基板検査部で検査された後であって且つ前記露光装置に搬入前の基板を所定の温度に調整する温度調整機構が設けられていることを特徴とする、請求項１〜３のいずれか一項に記載の基板処理システム。The interface station is provided with a temperature adjustment mechanism for adjusting a substrate after being inspected by the substrate inspection unit and before being carried into the exposure apparatus to a predetermined temperature. The substrate processing system as described in any one of 1-3. 前記温度調整機構は、前記筐体の内部に設けられていることを特徴とする、請求項４に記載の基板処理システム。The substrate processing system according to claim 4, wherein the temperature adjustment mechanism is provided inside the housing. 前記インターフェイスステーションには、前記基板検査部で検査後の基板を一時的に待機させるバッファ待機部が設けられていることを特徴とする、請求項１〜５のいずれか一項に記載の基板処理システム。The substrate processing according to claim 1, wherein the interface station is provided with a buffer standby unit that temporarily waits for a substrate after inspection by the substrate inspection unit. system. 前記バッファ待機部は、前記筐体の内部に設けられていることを特徴とする、請求項６に記載の基板処理システム。The substrate processing system according to claim 6, wherein the buffer standby unit is provided inside the housing. 前記筐体の内部には、前記搬送手段を洗浄する搬送手段洗浄機構が設けられていること特徴とする、請求項１〜７のいずれか一項に記載の基板処理システム。The substrate processing system according to claim 1, wherein a transport unit cleaning mechanism that cleans the transport unit is provided inside the housing. 前記搬送手段洗浄機構は、前記基板洗浄部が兼用していることを特徴とする、請求項８に記載の基板処理システム。9. The substrate processing system according to claim 8, wherein the transport unit cleaning mechanism is also used by the substrate cleaning unit. 基板を処理する複数の処理ユニットが設けられた処理ステーションと、前記処理ステーションと外部に設けられた露光装置との間で基板の受け渡しを行うインターフェイスステーションと、を備えた基板処理システムにおける基板の搬送方法であって、Substrate transport in a substrate processing system comprising: a processing station provided with a plurality of processing units for processing a substrate; and an interface station for transferring the substrate between the processing station and an exposure apparatus provided outside. A method,
前記インターフェイスステーションは、The interface station is
基板を前記露光装置に搬入する前に少なくとも基板の裏面を洗浄する基板洗浄部と、  A substrate cleaning section for cleaning at least the back surface of the substrate before carrying the substrate into the exposure apparatus;
少なくとも前記洗浄後の基板の裏面について、当該基板の露光が可能かどうかを前記露光装置に搬入する前に検査する基板検査部と、を有し、  A substrate inspection unit that inspects at least about the back surface of the substrate after cleaning before inspecting whether the substrate can be exposed to the exposure apparatus;
前記基板洗浄部と前記基板検査部は、同一の筐体の内部に配置され、The substrate cleaning unit and the substrate inspection unit are arranged in the same housing,
前記基板洗浄部と前記基板検査部との間の基板の搬送を、前記筐体の内部に設けられた搬送手段により行うことを特徴とする、基板搬送方法。A substrate transfer method, wherein transfer of a substrate between the substrate cleaning unit and the substrate inspection unit is performed by a transfer unit provided inside the housing. 請求項１０に記載の基板搬送方法を基板処理システムによって実行させるように、当該基板処理システムを制御する制御装置のコンピュータ上で動作するプログラム。The program which operate | moves on the computer of the control apparatus which controls the said substrate processing system so that the substrate conveying method of Claim 10 may be performed with a substrate processing system. 請求項１１に記載のプログラムを格納した読み取り可能なコンピュータ記憶媒体。A readable computer storage medium storing the program according to claim 11.
JP2011242336A 2011-11-04 2011-11-04 Substrate processing system, substrate transfer method, program, and computer storage medium Active JP5689048B2 (en)

Priority Applications (14)

Application Number Priority Date Filing Date Title
JP2011242336A JP5689048B2 (en) 2011-11-04 2011-11-04 Substrate processing system, substrate transfer method, program, and computer storage medium
TW101133757A TWI550686B (en) 2011-11-04 2012-09-14 Substrate treatment system, substrate delivery method, and computer memory medium
TW101134699A TWI524456B (en) 2011-11-04 2012-09-21 Substrate treatment system, substrate delivery method, program, and computer memory medium
US13/663,179 US9287145B2 (en) 2011-11-04 2012-10-29 Substrate treatment system, substrate transfer method, and a non-transitory computer storage medium
US13/663,846 US9460942B2 (en) 2011-11-04 2012-10-30 Substrate treatment system, substrate transfer method and computer storage medium
KR1020120123696A KR101751551B1 (en) 2011-11-04 2012-11-02 Substrate processing system, substrate transfer method and computer storage medium
KR1020120123672A KR101752513B1 (en) 2011-11-04 2012-11-02 Substrate processing system, substrate transfer method and computer storage medium
CN201210436221.4A CN103094160B (en) 2011-11-04 2012-11-05 Base plate processing system and substrate transfer method adopted therein
CN201210435430.7A CN103094164B (en) 2011-11-04 2012-11-05 Substrate Treatment System And Substrate Transfer Method
CN201710256275.5A CN107256838B (en) 2011-11-04 2012-11-05 Substrate processing system and substrate transfer method
CN201710337989.9A CN107180775B (en) 2011-11-04 2012-11-05 Substrate processing system and substrate transfer method
US15/252,422 US9984905B2 (en) 2011-11-04 2016-08-31 Substrate treatment system, substrate transfer method and computer storage medium
US15/252,374 US9984904B2 (en) 2011-11-04 2016-08-31 Substrate treatment system, substrate transfer method and computer storage medium
KR1020170079084A KR102034344B1 (en) 2011-11-04 2017-06-22 Substrate processing system, substrate transfer method and computer storage medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011242336A JP5689048B2 (en) 2011-11-04 2011-11-04 Substrate processing system, substrate transfer method, program, and computer storage medium

Publications (3)

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JP2013098478A JP2013098478A (en) 2013-05-20
JP2013098478A5 true JP2013098478A5 (en) 2014-01-23
JP5689048B2 JP5689048B2 (en) 2015-03-25

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5512633B2 (en) * 2011-11-04 2014-06-04 東京エレクトロン株式会社 Substrate processing system, substrate transfer method, program, and computer storage medium
JP5752827B2 (en) * 2014-03-26 2015-07-22 東京エレクトロン株式会社 Substrate processing system, substrate transfer method, program, and computer storage medium
JP6363249B2 (en) * 2017-04-17 2018-07-25 東京エレクトロン株式会社 Substrate processing method and substrate processing apparatus

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JP2004022876A (en) * 2002-06-18 2004-01-22 Nikon Corp Cleaning mechanism
JP4410121B2 (en) * 2005-02-08 2010-02-03 東京エレクトロン株式会社 Coating and developing apparatus and coating and developing method
JP2008135583A (en) * 2006-11-29 2008-06-12 Tokyo Electron Ltd Coating film formation equipment, and coating film formation method
JP4331199B2 (en) * 2006-11-29 2009-09-16 東京エレクトロン株式会社 Coating film forming apparatus for immersion exposure and coating film forming method
JP5002471B2 (en) * 2008-01-31 2012-08-15 東京エレクトロン株式会社 Substrate cleaning apparatus, substrate cleaning method, program, and computer storage medium

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