JP2013094890A - Micro through-hole forming device, method of manufacturing micro through-hole formed product, and micro through-hole formed product - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a micro through-hole forming device capable of easily and efficiently forming many micro through-holes on a sheet of synthetic resin in a simple manner and in a short time, and at that time, preventing the occurrence of the deflection of a preform.SOLUTION: A micro through-hole forming device 10 includes a supporting base 11, a back sheet 12 for supporting a preform 20, and an ultrasonic form block 30 which is arranged above the back sheet 12 and has many projections 31 at a lower part. Flat load imparting regions 39 and 28 are provided around a projection forming region 34 of the ultrasonic form block 30 and around a protrusion region 11a of the supporting base 11, respectively. The ultrasonic form block 30 is movable vertically and made to ultrasonic-vibrate in the vertical direction to heat the preform 20 by vibration, and thus the preform 20 is melted to form many micro through-holes 41. At that time, a load is applied to the preform between the load imparting region 39 of the ultrasonic form block 30 and the load imparting region 28 of the supporting base 11.

Description

  The present invention relates to a fine through-hole forming device for forming a large number of fine through-holes in a preform (preliminary body) made of a synthetic resin, and a fine through-hole having a large number of fine through-holes using the fine through-hole forming device. The present invention relates to a method for producing a fine through-hole molded product for producing a molded product, and a fine through-hole molded product produced using a fine through-hole molding apparatus.

  Conventionally, many fine through holes are formed in a metal sheet. In this case, it is common to first pattern a predetermined pattern on a metal sheet by photolithography, and then perform chemical etching or dry etching on this to form a large number of through holes. There is also a method of making a through hole with a laser beam, an electron beam, or a neutron beam.

  However, when such a method is used, it is difficult to freely set the shape of the fine through-hole according to the functional application due to processing restrictions. Moreover, the sheet | seat used as object is restricted to glass, a semiconductor, a metal. Furthermore, since there are many processes for forming a through-hole, it is necessary to use many manufacturing apparatuses (for example, Unexamined-Japanese-Patent No. 5-28912).

  On the other hand, when a large number of fine (for example, diameter of 100 μm or less) through-holes are to be formed in a synthetic resin sheet, a nanoimprint technique (a technique for transferring fine irregularities formed on a mold onto a resin material) is used. It can also be used. However, when the nanoimprint technique is used, fine unevenness can be formed on the surface of the resin material, but a through-hole penetrating the resin material cannot be formed.

  Moreover, when forming many fine through-holes in a synthetic resin sheet, it is also conceivable to use an injection molding method. However, in this case, the molten resin does not flow well in the mold, and fine through holes cannot be formed. Furthermore, even if the compression molding method is used, it is not possible to form fine through holes in the same manner. As described above, it is not easy to form a large number of fine through holes in a synthetic resin sheet.

  By the way, this applicant forms many fine through-holes in the base material sheet | seat which consists of a synthetic resin using the ultrasonic shaping | molding die which has a protruding part which ultrasonically vibrates in Unexamined-Japanese-Patent No. 2010-137313. Has proposed.

Japanese Patent Laid-Open No. 5-28912 JP 2010-137313 A

  The fine through-hole forming apparatus proposed in Japanese Patent Application Laid-Open No. 2010-137313 makes the ultrasonic vibration vibrate contact with a base material sheet made of a synthetic resin, thereby converting the energy of ultrasonic vibration into thermal energy. The base sheet is melted locally, and the shape of the protruding portion is formed on the base sheet, thereby forming a large number of fine through holes in the base sheet. However, when a large number of fine through-holes are formed in the base sheet, a relatively high temperature portion and a low temperature portion are generated depending on the location of the base sheet. The sheet may be warped. Furthermore, it is necessary to appropriately give strength to the base sheet according to the application to be used.

  The present invention has been made in consideration of these points, and can easily and efficiently form a large number of fine through holes in a preform of a synthetic resin in a simple and short time. A fine through-hole forming device capable of preventing the occurrence of the above-mentioned and obtaining a desired strength in the region of the fine through-hole, a method for manufacturing a fine through-hole molded product, and such a fine through-hole forming device It aims at providing the fine through-hole molded article manufactured by this.

  A fine through-hole forming device according to an embodiment of the present invention is a micro through-hole forming device that manufactures a fine through-hole molded product including a large number of fine through-holes. And a back sheet that supports a preform made of synthetic resin, and an ultrasonic mold that is disposed above the back sheet and has a large number of protrusions on the lower part. A protrusion region that is arranged in a specific protrusion-forming region and that sandwiches the preform and the back sheet with the protrusion-forming region at a position corresponding to the protrusion-forming region of the cradle. A flat load application region is provided around the protruding portion forming region of the ultrasonic forming die and the protruding region of the cradle, respectively, and the ultrasonic forming die can be moved in the vertical direction and in the vertical direction. Ultrasonic vibration and preform Vibration heating is performed and the preform is melted to form a large number of fine through holes. At this time, a load is applied to the preform between the load application region of the ultrasonic mold and the load application region of the cradle. Is characterized in that the preform is compression molded.

  In the fine through-hole forming device according to the embodiment of the present invention, a concave region that is recessed below the load application region may be provided around the load application region of the cradle.

  In the fine through-hole forming apparatus according to the embodiment of the present invention, a concave region that is recessed above the load applying region may be provided around the load applying region in the ultrasonic mold.

  In the fine through-hole forming apparatus according to the embodiment of the present invention, the preform may include a flat plate portion and a peripheral flange that is provided on the outer periphery of the flat plate portion and is thicker than the flat plate portion.

  In the fine through-hole forming apparatus according to one embodiment of the present invention, the flat load application regions provided around the protruding portion forming region of the ultrasonic forming die and around the protruding region of the cradle are respectively rib-shaped. It may consist of the surface which has the unevenness | corrugation. Further, there may be a step in the protruding portion forming region of the ultrasonic forming die and the surrounding load applying region, and the protruding region of the receiving table and the surrounding load applying region.

  In the fine through-hole forming apparatus according to one embodiment of the present invention, a backsheet release layer having peelability with respect to the preform may be formed on the upper surface of the backsheet.

  In the fine through-hole forming apparatus according to one embodiment of the present invention, the temperature control that can heat the upper surface of the cradle to a desired temperature and heat the preform disposed above the back sheet to the desired temperature in the cradle. A device may be connected.

  In the fine through-hole forming apparatus according to one embodiment of the present invention, a preheating device for preheating the preform to a temperature in the vicinity of the glass transition temperature or softening temperature of the resin may be provided.

  A method for producing a fine through-hole molded product according to an embodiment of the present invention is a method for producing a fine through-hole molded product including a large number of fine through-holes using a fine through-hole molding apparatus. A step of holding a heat-resistant back sheet on the table, a step of supporting a preform made of synthetic resin on the back sheet, and a super-arrangement previously disposed above the back sheet and having a number of protrusions on the lower part A step of lowering the sonic molding die, bringing the protruding portion that is ultrasonically vibrated into contact with the preform, vibrating and heating the preform, and softening or melting the portion of the preform that is in contact with the protruding portion; Then, the ultrasonic mold is further lowered, and the softened or melted preform and back sheet are sandwiched between the protruding portion of the ultrasonic mold and the cradle. The ultrasonic vibrations The reforming is vibrated and heated, the preform is passed through the preform, and a large number of fine through-holes are formed in the preform. A load is applied to the preform between the application area and the load application area of the cradle.

  The method for producing a fine through-hole molded article according to an embodiment of the present invention may further include a step of preheating the preform before the step of supporting the preform made of synthetic resin on the back sheet. Good. In this case, the temperature of the flat plate portion of the preform, that is, the fine through-hole region and the loaded region located on the outer periphery thereof is heated by contactless heating with infrared rays or laser light or heating with hot air. May be raised to near the glass transition temperature or softening temperature of the resin.

  In the method for manufacturing a fine through-hole molded article according to an embodiment of the present invention, the method further includes a step of raising the ultrasonic mold after the fine through-hole forming step to extract the protruding portion from the preform. Also good.

  Moreover, the fine through-hole molded product according to one embodiment of the present invention is a fine through-hole molded product formed using a fine through-hole molding apparatus, and a flat plate portion having a fine through-hole region including a large number of fine through-holes. And a peripheral flange that is provided on the outer periphery of the flat plate portion and is thicker than the flat plate portion.

  In the fine through-hole molded article according to one embodiment of the present invention, the diameter of the fine through-hole is different between the front and back of the flat plate portion, the diameter of one surface is 1 to 10 μm, and the diameter of the other surface is 20 It may be ˜80 μm.

In the fine through-hole molded product according to one embodiment of the present invention, the density of the fine through-holes formed in the fine through-hole region of the flat plate portion may be 200 to 1000 / mm ² .

  In the fine through-hole molded product according to one embodiment of the present invention, the through-hole may have a conical shape with a widening end.

  In the fine through-hole molded product according to one embodiment of the present invention, the flat plate portion may have a fine through-hole region and a flat region located on the outer periphery of the fine through-hole region. In this case, the flat region may have a reinforcing rib.

  According to the present invention, when the preform is melted to form a large number of fine through holes, a load is applied to the preform between the load applying region of the ultrasonic mold and the load applying region of the cradle. In the preform, the preform can be cooled without causing deformation in a region other than a region where a large number of fine through-holes are formed, and warping of the preform can be prevented.

The schematic front view which shows the fine through-hole shaping | molding apparatus by one embodiment of this invention. The top view which shows preform. Sectional drawing which shows a preform (III-III sectional view taken on the line of FIG. 2). The expanded schematic sectional drawing which expanded a part of fine through-hole shaping | molding apparatus of FIG. The front view which shows the ultrasonic shaping | molding die of the fine through-hole shaping | molding apparatus by one embodiment of this invention. The bottom view which shows the ultrasonic shaping | molding die of the fine through-hole shaping | molding apparatus by one embodiment of this invention (VI direction arrow line view of FIG. 5). FIG. 7 is a vertical cross-sectional view (cross-sectional view taken along the line VII-VII in FIG. 6) showing the ultrasonic forming die of the fine through-hole forming apparatus according to the embodiment of the present invention. The schematic perspective view which shows the method of producing the ultrasonic shaping | molding die of the fine through-hole shaping | molding apparatus by one embodiment of this invention. The schematic sectional drawing which shows the method of producing the ultrasonic shaping | molding die of the fine through-hole shaping | molding apparatus by one embodiment of this invention. Schematic which shows the manufacturing method of the fine through-hole molded article by one embodiment of this invention. The figure which shows the behavior of the front-end | tip part of an ultrasonic shaping | molding die in the manufacturing method of the fine through-hole molded article by one embodiment of this invention. The top view which shows the fine through-hole molded article by one embodiment of this invention. Sectional drawing which shows the fine through-hole molded article by one embodiment of this invention (XIII-XIII sectional view taken on the line of FIG. 12). The enlarged plan view which shows the fine through-hole molded product by one embodiment of this invention. The expanded vertical sectional view which shows the fine through-hole molded product by one embodiment of this invention (XV-XV sectional view taken on the line of FIG. 14). The expanded schematic sectional drawing which expanded a part of mist generator by one embodiment of this invention. Schematic which shows the modification of an ultrasonic shaping | molding die. Schematic which shows the modification of a receiving stand. Schematic which shows the modification of a receiving stand. The top view which shows the modification of a fine through-hole molded product. Sectional drawing which shows the modification of a fine through-hole molded product (XXI-XXI sectional view taken on the line of FIG. 20).

  Embodiments of the present invention will be described below with reference to the drawings. 1 to 19 are diagrams showing an embodiment of the present invention.

<Micro through-hole forming device>
First, the overall configuration of a fine through-hole forming apparatus for forming a fine through-hole molded product will be described with reference to FIG.

  As shown in FIG. 1, a fine through-hole forming apparatus 10 includes a fixed cradle 11 and a back sheet 12 that is held on the cradle 11 and has a heat resistance and supports a preform 20 made of synthetic resin. It has.

  The upper surface of the cradle 11 can be heated to a desired temperature by the temperature control device 16, and the preform 20 can be heated via the back sheet 12.

  The backsheet 12 has heat resistance (preferably a melting temperature of 250 ° C. or higher) and vibration absorption to absorb vibration by elastic deformation and springback to generate contact pressure against the penetration pressure. Is preferred. The backsheet 12 is preferably excellent in peelability with respect to the preform 20. For example, in the present embodiment, a backsheet release layer 12 a having peelability with respect to the preform 20 is formed on the upper surface of the backsheet 12. As such a back sheet 12, for example, a sheet of polyimide, polytetrafluoroethylene (PTFE), a heat-resistant plastic sheet having a fluorine-coated layer or a silicon resin-coated layer (back sheet peeling layer) 12a, or the like, or A combination of these layers can be used.

  On the other hand, the preform 20 serves as a preform for producing the fine through-hole molded product 40. As shown in FIGS. 2 and 3, the preform 20 includes a flat plate portion 21 and a peripheral flange 22 that is provided on the outer periphery of the flat plate portion 21 and is thicker than the flat plate portion 21. Among these, the flat plate part 21 has a planar circular shape, and the thickness thereof is arbitrary. However, in consideration of the vibration width of the ultrasonic forming die 30 and the vertical position accuracy of the ultrasonic forming die 30 described later, 10 μm to 1 mm. It is preferable to set the degree. The flat plate portion 21 includes a fine through hole region 21b (a region corresponding to a fine through hole region 43 described later) and a loaded region 21c (a region corresponding to a flat region 44 described later) located around the fine through hole region 21b. ). On the other hand, the peripheral flange 22 has a planar annular shape and protrudes on both the front surface side and the back surface side of the flat plate portion 21. The thickness of the peripheral flange 22 is arbitrary, but is preferably about 100 μm to 10 mm. The shape of the flat plate portion 21 is not limited to a planar circular shape, and may be a polygonal shape such as a rectangle or an elliptical shape. The flat plate portion 21 may include a fine through hole region 21b and a loaded region 21c having a thickness different from that of the fine through hole region 21b. In this case, the loaded region 21c is a rib-shaped uneven surface. It may consist of Furthermore, the peripheral flange 22 is not limited to a planar annular shape, and may be a polygonal ring shape such as a rectangle, an elliptical ring shape, a C-shape, or a fixing uneven groove shape. .

  The preform 20 is made of a heat-melting plastic having a property of being melted by ultrasonic waves, but preferably has a certain degree of rigidity and heat resistance. In this case, the melting temperature of the preform 20 is preferably 50 ° C. or more lower than the melting temperature of the back sheet 12. This is because if the melting temperature of the preform 20 and the melting temperature of the back sheet 12 are close, the back sheet 12 is thermally deformed when the preform 20 is molded. Examples of the material of the preform 20 include polycarbonate (PC), amorphous polyethylene terephthalate (A-PET), crystalline polyethylene terephthalate, stretchable polyethylene terephthalate, methacrylate polymer (PMMA), polystyrene (PS). ), ABS, etc. can be used. In addition, polysulfone (PSU), polyethersulfone (PES), polyetheretherketone (PEEK), polyamideimide (PAI), polyetherimide (PEI), thermoplastic polyimide (TPI), polymethylpentene (PMP), super High molecular weight polyethylene (UHMWPE), liquid crystal polymer (LCP), polyarylate (PAR), polyphenylene sulfide (PPS), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyacetal (POM), Thermoplastics such as polyamide (PA), polyethylene (PE), polypropylene (PP), and polyvinyl chloride (PVC) can also be applied. Note that the flat plate portion 21 and the peripheral flange 22 of the preform 20 may be made of the same material, or may be made of different materials.

  Referring again to FIG. 1, the fine through-hole forming apparatus is provided with a suction portion 13 that penetrates through the back sheet 12. By performing vacuum suction through the suction portion 13, the preform 20 can be fixedly held on the back sheet 12.

  Further, an ultrasonic molding die 30 made of an ultrasonic horn mold is disposed above the back sheet 12. The ultrasonic mold 30 includes a base portion 33 and a horn head 32 that is attached to the base portion 33 and has a large number of protruding portions 31 formed in the lower portion thereof. Further, the temperature control device 14 is connected to the ultrasonic mold 30, and the temperature control device 14 can supplementarily heat the many protruding portions 31 of the ultrasonic mold 30. In addition to the heating by ultrasonic vibration of the ultrasonic mold 30, the temperature adjustment device 14 is used as a supplementary temperature so that the protrusion 31 of the ultrasonic mold 30 can be efficiently and quickly molded. Can be.

  Further, the mold control device 15 is connected to the ultrasonic mold 30. The ultrasonic mold 30 is controlled by the mold control device 15 and moves up and down in the vertical direction and ultrasonically vibrates in the vertical direction. It is preferable that the raising / lowering position accuracy of the ultrasonic molding die 30 and the amplitude accuracy of ultrasonic vibration by the molding die control device 15 are both on the order of 1 μm.

  The ultrasonic mold 30 is controlled by the mold control device 15, and the protrusion 31 provided at the tip of the ultrasonic mold 30 descends while ultrasonically vibrating in the vertical direction, and comes into contact with the preform 20 to vibrate the preform 20. Heat. It takes time for the preform 20 to be softened or melted only by this vibration heating and the preform 20 is shaped by the ultrasonic mold 30. When the energy of the ultrasonic vibration is increased, the vibration amplitude is also increased, so that the position accuracy of the through hole to be formed is lowered. In the present invention, as described above, since the cradle 11 is heated and the preform 20 can be heated to near the glass transition temperature or the softening temperature, ultrasonic vibration energy that can maintain the positional accuracy is imparted to the preform 20. By doing so, the preform 20 can be easily molded (that is, the preform 20 is softened or melted). As a result, a large number of fine through holes can be easily formed in the synthetic resin preform 20 in a simple and short time.

  The cradle 11 is temperature-controlled so that the temperature of the preform 20 is close to the glass transition temperature or the softening temperature, but is preferably controlled to be slightly lower than the softening temperature of the synthetic resin. When the temperature of the preform 20 is equal to or higher than the softening temperature of the synthetic resin, the entire heated portion of the preform 20 starts to soften. If the portion of the preform 20 other than the portion where the protruding portion 31 of the ultrasonic forming die 30 abuts is softened, a highly accurate through hole may not be formed. The temperature of the preform 20 is suitably 1 to 50 ° C., more preferably about 5 to 30 ° C. lower than the softening temperature.

  In addition, as shown in FIG. 1, before forming a fine through-hole in the preform 20 with the back sheet 12 and the ultrasonic mold 30, the preform 20 is preliminarily brought to a temperature near the glass transition temperature or softening temperature of the resin. A preheating device 80 for heating may be provided. In this case, the preheating device 80 heats the preform 20 in a non-contact manner using infrared rays or laser light, or heats it with hot air, so that the flat plate portion 21 of the preform 20, that is, the fine through-hole region 21 b, and the outer periphery thereof. The temperature with the loaded region 21c located is raised to near the glass transition temperature or softening temperature of the resin.

  In the present embodiment, as shown in FIG. 4, the protruding portion 31 of the ultrasonic forming die 30 is disposed in a specific protruding portion forming region 34. The projecting portion forming region 34 corresponds to a fine through-hole region 43 (FIG. 12) described later, and may have, for example, a circular shape. On the other hand, a protruding region 11 a is provided in a region corresponding to the protruding portion forming region 34 in the cradle 11 and in a region where the protruding portion 31 of the ultrasonic forming die 30 contacts the preform 20. The protruding region 11 a is a region that sandwiches the flat plate portion 21 of the preform 20 and the back sheet 12 with the protruding portion forming region 34 of the ultrasonic mold 30.

  Further, as shown in FIG. 4, a flat load applying region 39 is provided around the protruding portion forming region 34 of the ultrasonic mold 30. The load application region 39 is formed so as to surround the projecting portion formation region 34, and may have, for example, an annular shape when viewed from below. In this case, the load application region 39 is located on the same plane as the trough portion 31 c on the proximal end side of the protruding portion 31.

  Further, a flat load application region 28 is provided around the protruding region 11 a of the cradle 11 and at a position corresponding to the load application region 39 of the ultrasonic mold 30. The load application region 28 is formed so as to surround the protruding region 11a, and may have a planar annular shape, for example. In this case, the load application region 28 is located on the same plane as the protruding region 11a.

  With such a configuration, the flat plate portion 21 of the preform 20 is sandwiched between the protruding portion forming region 34 of the ultrasonic mold 30 and the protruding region 11 a of the cradle 11, and the protruding portion 31 The fine through holes 41 can be reliably formed in the flat plate portion 21 of the preform 20. Further, the heat from the cradle 11 is not transmitted to a region other than the region of the preform 20 where the fine through hole 41 is formed (that is, the portion corresponding to the protruding region 11a). Therefore, deformation of the preform 20 due to heat can be minimized.

  Further, in the present embodiment, when the preform 20 is melted to form a large number of fine through holes 41, between the load application region 39 of the ultrasonic molding die 30 and the load application region 28 of the cradle 11. A load is applied to the preform 20. That is, the area other than the area where the numerous fine through holes 41 are formed in the preform 20 (ie, the fine through hole area 21 b) by the load applying area 39 of the ultrasonic mold 30 and the load applying area 28 of the cradle 11. The region (that is, the loaded region 21c) is securely held. Accordingly, the preform 20 can be cooled without causing deformation in a region of the preform 20 other than a region where a large number of fine through holes 41 are formed. Thereby, it can prevent that the preform 20 warps.

  By the way, a recessed area 26 is provided around the protruding area 11 a of the cradle 11, and the peripheral flange 22 of the preform 20 is adapted to fit into the recessed area 26. The shape of the concave region 26 may be a shape that can completely accommodate the lower portion of the peripheral flange 22. For example, when the peripheral flange 22 has a planar annular shape, the concave region 26 also has a planar annular shape. May be.

  Further, as shown in FIG. 4, a concave region 35 is provided around the protruding portion forming region 34 in the ultrasonic molding die 30. The concave region 35 is formed so that the peripheral flange of the preform 20 is formed when the ultrasonic molding die 30 is lowered and the flat plate portion 21 of the preform 20 is sandwiched between the protruding portion forming region 34 and the protruding region 11a. 22 is fitted. The shape of the concave region 35 may be a shape that can completely accommodate the upper portion of the peripheral flange 22 when the ultrasonic molding die 30 is lowered downward. For example, the concave region 35 has a planar annular shape like the concave region 26. Also good.

  By adopting such a configuration, the flat plate portion 21 of the preform 20 is sandwiched between the protruding portion forming region 34 of the ultrasonic forming die 30 and the protruding region 11a of the cradle 11 so that the flat plate portion 21 is efficiently attached. It can be melted or softened. Thereby, the fine through-hole molding which has the flat plate part 21 which has the fine through-hole area | region 43 containing many fine through-holes 41, and the peripheral flange 22 which is provided in the outer periphery of the flat plate part 21, and becomes thicker than the flat plate part 21. The product 40 (see FIGS. 12 and 13) can be easily manufactured. Further, since the peripheral flange 22 of the preform 20 fits into the concave region 26 of the cradle 11 and the concave region 35 of the ultrasonic mold 30, the peripheral flange 22 interferes with the ultrasonic mold 30 and the cradle 11. There is no risk of deformation of the preform 20 during molding.

  On the other hand, as a comparative example, a large number of fine through holes 41 are formed in the sheet-like flat plate portion 21 using the protruding portions 31 of the ultrasonic mold 30, and then the flat plate portion 21 in which the fine through holes 41 are formed. It is also conceivable to attach a peripheral flange 22. However, particularly when the flat plate portion 21 is thin, it is difficult to handle the flat plate portion 21 and it is difficult to accurately attach the peripheral flange 22 to the flat plate portion 21 in which the fine through holes 41 are formed. On the other hand, in the present embodiment, a preform 20 having a flat plate portion 21 and a peripheral flange 22 is prepared in advance with the above-described configuration, and a large number of fine penetrations are accurately made to the preform 20. Hole 41 is formed. Thereby, the fine through-hole molded product 40 having the flat plate portion 21 having a large number of fine through holes 41 and the peripheral flange 22 provided around the flat plate portion 21 can be easily manufactured.

  In FIG. 1, the ultrasonic mold 30 is lowered by the mold control device 15, the ultrasonic vibration-protruding protrusion 31 is brought into contact with the preform 20, and the preform 20 is vibrated and heated. This softens or melts the preform 20 at the portion where the protrusion 31 abuts. When the preform 20 is softened or melted, the ultrasonic mold 30 is further lowered by the mold control device 15, and between the protruding portion forming region 34 of the ultrasonic forming die 30 and the protruding region 11 a of the cradle 11. Thus, the preform 20 and the back sheet 12 are sandwiched. In this state, the protruding portion 31 of the ultrasonic forming die 30 is ultrasonically vibrated to vibrate and heat the preform 20, and the protruding portion 31 provided at the tip of the ultrasonic forming die 30 penetrates into the preform 20. . When the tip of the projecting portion 31 reaches the back sheet 12, the molding die control device 15 stops the ultrasonic vibration of the ultrasonic molding die 30, and also stops heating due to the addition of vibration energy. Transition to cooling by heat conduction from the upper and lower surfaces. On the upper surface of the preform 20, the preform 20 is cooled by the projecting portion 31 whose temperature is adjusted to a glass transition point or a softening temperature or lower. On the other hand, the temperature of the lower surface of the preform 20 is lowered by the temperature control device 16 to cool the preform 20, or the temperature of the cradle 11 is lowered by the temperature control device 16 to the glass transition temperature of the synthetic resin. The preform 20 is controlled to a temperature equal to or lower than the softening temperature, and the preform 20 is cooled to a desired temperature by heat conduction from the preform 20 to the cradle 11.

  After the synthetic resin is solidified in the portion of the preform 20 cooled as described above, which is in contact with the ultrasonic molding die 30 (the portion in which the protruding portion 31 penetrates), the molding die control device 15 The protruding part 31 is extracted by moving the ultrasonic molding die 30 upward. At this time, the protruding portion 31 may not be peeled off from the through hole formed in the preform 20, and as the ultrasonic forming die 30 moves upward, the lower end of the horn head 32 of the ultrasonic forming die 30. The preform 20 may be lifted upward together with a certain protruding portion 31, and the fine through hole may be deformed. In the present invention, the protruding portion 31 can be easily pulled out by causing the ultrasonic forming die 30 to vibrate ultrasonically again. As a result, a more accurate through hole can be formed in the preform 20.

<Ultrasonic mold>
Next, the configuration of the above-described ultrasonic mold 30 will be further described with reference to FIGS.

  As shown in FIG. 5, the ultrasonic mold 30 includes a base portion 33 having a tapered shape from the top to the bottom, and a horn head 32 screwed to the lower end of the base portion 33 by a screw portion 32b. Have. Of these, a cylindrical tip convex portion 32 a is formed at the lower end of the horn head 32. Further, a large number of projecting portions 31 are provided so as to project downward from the tip convex portion 32a. The horn head 32 is made of a metal such as titanium, aluminum, steel, and stainless steel. Further, the projecting portion 31 can be constituted by a Ni plating layer or a Cr plating layer provided on these metals. The base portion 33 has a circular horizontal cross section whose diameter gradually decreases from the top to the bottom. In FIG. 5, illustration of the concave region 35 and the load application region 39 is omitted.

  next. The configuration of the protruding portion 31 of the ultrasonic mold 30 will be further described with reference to FIGS. As shown in FIGS. 6 and 7, a large number of protruding portions 31 having the same shape are formed on the tip convex portion 32 a of the horn head 32. Each protrusion 31 has a mountain shape. That is, each protrusion 31 has a planar circular top 31a and a skirt 31b extending from the top 31a to the periphery. Among these, the skirt part 31b has a circular horizontal cross section whose diameter gradually increases from the top part 31a side toward the tip convex part 32a side of the horn head 32. In order to set the amplitude of the ultrasonic mold 30 small, the diameter may be gradually decreased from the upper side to the lower side in accordance with the ultrasonic transducer, or the diameter may be the same. Also good. Furthermore, a valley portion 31c is formed between adjacent top portions 31a. Each protruding portion 31 may have any shape having a taper, but it is particularly preferable to form the tip of each protruding portion 31 at an acute angle. By making the tip of each protrusion 31 have an acute angle, the area of the portion that first contacts the preform 20 during molding can be reduced. Thus, vibration energy can be easily transmitted to the preform 20 and melting of the preform 20 can be easily started.

In FIG. 7, the diameter d ₁ of the top portion 31 a of each protrusion 31 can be arbitrarily determined depending on the shape of the fine through-hole molded product 40, but is preferably about 1 μm to 10 μm, for example. Distance L ₁ between the top 31a Adjacent, can be arbitrarily determined similarly by the shape of the fine through-hole molded article 40, for example, it is preferably about 20 m to 100 m. Similarly, the height h ₁ of each protrusion 31 can be arbitrarily determined, but is preferably about 10 μm to 100 μm, for example.

  Next, with reference to FIGS. 8 and 9, a method for producing such an ultrasonic mold 30, particularly a method for forming a plurality of protruding portions 31 of the ultrasonic mold 30 will be described.

  First, a raw horn head 32 made of titanium or the like is prepared. Next, the unprocessed horn head 32 is mounted on the ultraprecision cutting machine 36. Here, as shown in FIGS. 7 and 8, the ultraprecision cutting machine 36 has a cutting tool 37 having a diamond cutting edge 38 provided at the tip. As such an ultra-precise cutting machine 36, a machine having a control accuracy of about 1 nm and capable of setting the surface roughness Ra of the die after processing to several nm is preferable.

Then, the cutting tool 37 of the ultra-precision cutting machine 36 abuts the leading protrusion 32a of the horn head 32 while rotating (rotation) in a clockwise direction about the axis A _1. Subsequently, the cutting tool 37 rotates (revolves) clockwise around the portion that becomes the top portion 31a of each protruding portion 31 in the tip convex portion 32a of the horn head 32, while the tip convex portion 32a of the horn head 32. Cutting. As a result, a chevron-shaped projecting portion 31 having a top portion 31a and a skirt portion 31b is formed on the tip convex portion 32a of the horn head 32. Thereafter, by repeating such an operation as many as the number of the projecting portions 31, a large number of projecting portions 31 are formed on the tip convex portion 32 a of the horn head 32.

<Method for producing fine through-hole molded product>
Next, with reference to FIGS. 10A to 10F and FIG. 11, a method for manufacturing the fine through-hole molded product 40 using the fine through-hole forming apparatus 10 will be described.

  First, based on the three-dimensional shape data of the fine through-hole molded product 40 to be manufactured, the horn head 32 is cut using the ultra-precision cutting machine 36, and the ultrasonic mold 30 is manufactured by the method described above. To do.

  Subsequently, the ultrasonic molding die 30 is mounted on the fine through-hole molding device 10 and the ultrasonic molding die 30 is moved from the normal room temperature (20 ° C.) to the synthetic resin glass by the temperature control device 14. Heating is performed at a temperature in the vicinity of the transition point temperature or the softening temperature so that the preform 20 is cured and not deformed after molding.

  Next, a preform 20 (FIGS. 2 and 3) made of a synthetic resin having a flat plate portion 21 and a peripheral flange 22 provided on the outer periphery of the flat plate portion 21 and thicker than the flat plate portion 21 is prepared. Examples of the method for producing the preform 20 include a film hoop molding method, an injection compression molding method, and a welding method.

  Next, the back sheet 12 is held on the cradle 11, and the preform 20 is placed on the back sheet 12. At this time, the flat plate portion 21 of the preform 20 is placed on the protruding region 11 a of the cradle 11, and the peripheral flange 22 of the preform 20 is fitted into the concave region 26. Further, the preform 20 is fixed and supported so as not to move on the back sheet 12 by vacuum suction by the suction portion 13 (FIG. 10A).

  Subsequently, the cradle 11 is heated by the temperature control device 16 to heat the preform 20 to near the glass transition temperature or softening temperature of the synthetic resin.

  In addition, when taking the preheating method using the preheating apparatus 80, the flat plate part 21 of the preform 20 is locally contactlessly heated by infrared rays or laser light, or is heated locally by hot air, thereby forming a flat plate. The part 21 is heated to a relatively higher temperature than the peripheral flange 22. In this case, the preform 20 preheated by the preheating device 80 is placed on the back sheet 12.

  Next, the ultrasonic mold 30, which is arranged in advance in the vertical direction, is ultrasonically vibrated in the vertical direction by the mold control device 15, and the ultrasonic mold 30 is further oscillated in this manner. Lower toward the preform 20. In this case, the frequency of the ultrasonic mold 30 can be arbitrarily set, but is preferably set to about 20 kHz to 40 kHz.

  As the ultrasonic molding die 30 is lowered, each protruding portion 31 comes into contact with the flat plate portion 21 of the preform 20. At this time, a portion of the preform 20 where the protruding portions 31 are in contact is vibrated and heated by vibration energy of ultrasonic vibration. Due to the vibration heating by the vibration energy and the heat energy applied from the cradle 11, the synthetic resin constituting the preform 20 reaches the softening or melting temperature, and as a result, the protruding portion 31 of the preform 20 comes into contact. Only the existing part is locally softened or melted in advance (FIG. 10B).

  Subsequently, the ultrasonic mold 30 is further lowered. During this time, each protruding portion 31 of the ultrasonic mold 30 penetrates into the preform 20 while heating the flat plate portion 21 of the preform 20 by ultrasonic vibration. At this time, the softened or melted preform 20 and the back sheet 12 are sandwiched between the protruding portion forming region 34 of the ultrasonic mold 30 and the protruding region 11 a of the cradle 11. Further, while the ultrasonic forming die 30 is lowered, a load is applied when the protruding portion 31 penetrates into the preform 20. In this state, the protruding portion 31 of the ultrasonic molding die 30 is ultrasonically vibrated, the preform 20 is vibrated and heated, and the flat plate portion 21 of the preform 20 passes through the protruding portion 31. In this way, the tip of each protruding portion 31 of the ultrasonic mold 30 is in contact with the back sheet 12 (back sheet release layer 12a). (FIG. 10 (c)). When the flat plate portion 21 of the preform 20 penetrates, the peripheral flange 22 of the preform 20 is fitted into the concave region 35 of the ultrasonic forming die 30. Further, a load is applied to the flat plate portion 21 of the preform 20 between the load applying region 39 of the ultrasonic mold 30 and the load applying region 28 of the cradle 11.

  When the tip of each protrusion 31 comes into contact with the backsheet 12, the lowering of the ultrasonic forming die 30 is stopped. At this time, since the load weight is monitored, it can be seen that the protruding portion 31 is in contact with the back sheet 12, and therefore, the downward movement of the ultrasonic mold 30 may be controlled by monitoring the load weight. . Thereafter, the amplitude of the ultrasonic vibration of the ultrasonic forming die 30 is gradually attenuated while maintaining the vibration lower end at the tip of each protruding portion 31 on the surface of the back sheet 12, and finally stopped. Let

  In this way, while the ultrasonic mold 30 is lowered, the ultrasonic mold 30 is controlled by the mold control device 15 so as to have a large amplitude in the former stage during molding and a small amplitude in the latter stage during molding. It is preferable to vibrate.

Specifically, as shown in FIG. 11, the ultrasonic forming die 30 descends while vibrating with a relatively large amplitude until the tip of the protruding portion 31 contacts the back sheet 12 (time T _{1 in} FIG. 11). ). On the other hand, after the tip of the protruding portion 31 comes into contact with the back sheet 12, the ultrasonic molding die 30 oscillates so that the amplitude gradually decreases, and then stops (time T _{2 in} FIG. 11). . In addition, while the ultrasonic mold 30 is oscillating damped, the vibration lower end of the protrusion 31 is maintained so as to be on the surface of the back sheet 12 (see FIG. 11). By controlling the vibration of the ultrasonic mold 30 in this way, the fine through hole 41 of the fine through hole molded product 40 can be shaped with high accuracy. Further, when the protrusion 31 penetrates, the ultrasonic molding die 30 does not vary in amplitude, and penetrates into the preform 20 with the same low amplitude (2 μm to 5 μm), and reaches the tip position (the back sheet 12 surface) as it is. There is also a method of stopping in a pressed state with a load applied.

  Next, at the same time as the vibration is stopped, the preform 20 is cooled and cured at the temperature of the ultrasonic molding die 30 and the cradle 11 that have been temperature-controlled in advance. Further, in order to ensure curing, the temperature control device 14 is stopped, the ultrasonic mold 30 is cooled, and at the same time, the temperature control device 16 lowers the temperature of the cradle 11 so that the preform 20 is softened or softened by the glass temperature of the synthetic resin. Cool until below temperature. Thereby, the preform 20 that has been locally softened or melted is solidified, and a large number of fine through holes 41 are formed in the flat plate portion 21 of the preform 20. The through-hole molded product 40 is molded. In this case, the ultrasonic mold 30 and the preform 20 may be actively cooled by using a cooling device (not shown).

  In this way, while the lowering of the ultrasonic forming die 30 is stopped and the preform 20 is cooled, between the load applying region 39 of the ultrasonic forming die 30 and the load applying region 28 of the cradle 11, A load is continuously applied to the flat plate portion 21 of the preform 20. Therefore, regions (that is, the loaded region 21c and the flat region 44 described later) other than the region (that is, the fine through hole region 21b and the fine through hole region 43 described later) in the preform 20 where the numerous fine through holes 41 are formed. Thus, the preform 20 can be cooled without causing deformation of the preform 20, and warpage of the preform 20 can be prevented.

  Next, the ultrasonic mold 30 is raised by the mold control device 15. In this case, the ultrasonic mold 30 and the fine through-hole molded product 40 (preform 20) are cooled and the dimensions are slightly reduced. In this state, the fine through-hole molded product 40 can be released from the ultrasonic molding die 30 (FIG. 10D). Further, when the fine through-hole molded product 40 (preform 20) adheres to the ultrasonic mold 30, the ultrasonic mold 30 is first raised slightly, and then the ultrasonic mold 30 is vibrated again for a very short time. By doing so, the fine through-hole molded product 40 can be easily released from the ultrasonic mold 30.

  Subsequently, the vacuum suction by the suction unit 13 is stopped, and the back sheet 12 and the fine through-hole molded product 40 are removed from the cradle 11 (FIG. 10E). Finally, the fine through-hole molded product 40 is obtained by peeling the fine through-hole molded product 40 from the back sheet 12 (FIG. 10 (f)). The fine through-hole molded product 40 may be peeled directly from the back sheet 12 held on the cradle 11. The fine through-hole molded product 40 thus obtained is provided on the flat plate portion 21 having the fine through-hole region 43 including a large number of fine through-holes 41 and the outer periphery of the flat plate portion 21 as described below. A peripheral flange 22 that is thicker than the flat plate portion 21 is provided.

<Fine through-hole molded product>
Next, the structure of the fine through-hole molded product 40 formed by the above-described fine through-hole forming apparatus 10 will be described with reference to FIGS. 12 is a plan view showing a fine through-hole molded product, and FIG. 13 is a cross-sectional view taken along line XIII-XIII in FIG. 14 is an enlarged plan view showing a fine through-hole molded product, and FIG. 15 is a cross-sectional view taken along the line XV-XV in FIG.

  A fine through-hole molded product 40 shown in FIGS. 12 to 15 is manufactured by molding the preform 20 (FIGS. 2 and 3) using the fine through-hole forming apparatus 10. Such a fine through-hole molded product 40 is used as a member that exhibits various functions, such as a filter member, a breathable member, and a mesh for generating fine droplets used in a nebulizer. As a material constituting such a fine through-hole molded article 40, various heat-meltable resins as described above, for example, polycarbonate (PC), amorphous polyethylene terephthalate (A-PET), crystalline polyethylene terephthalate, stretched Include polyethylene terephthalate, methacrylic acid ester polymer (PMMA), polystyrene (PS), and ABS. In addition, polysulfone (PSU), polyethersulfone (PES), polyetheretherketone (PEEK), polyamideimide (PAI), polyetherimide (PEI), thermoplastic polyimide (TPI), polymethylpentene (PMP), super High molecular weight polyethylene (UHMWPE), liquid crystal polymer (LCP), polyarylate (PAR), polyphenylene sulfide (PPS), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyacetal (POM), Thermoplastics such as polyamide (PA), polyethylene (PE), polypropylene (PP), and polyvinyl chloride (PVC) can also be applied. In addition, the flat plate part 21 and the peripheral flange 22 of the fine through-hole molded product 40 may be made of the same material or different materials.

  As shown in FIG. 12 and FIG. 13, the fine through-hole molded product 40 is provided on the flat plate portion 21 having the fine through-hole region 43 including a large number of fine through-holes 41 and the outer periphery of the flat plate portion 21. A peripheral flange 22 that is thick is provided. The flat plate portion 21 corresponds to the flat plate portion 21 of the preform 20 described above, and has a planar circular shape. The peripheral flange 22 corresponds to the peripheral flange 22 of the preform 20 described above and has a planar annular shape. Note that the shape of the flat plate portion 21 and the peripheral flange 22 is not limited to this, as described above.

  The fine through-hole region 43 has a planar circular shape smaller than the flat plate portion 21, and a large number of fine through-holes 41 are formed in the fine through-hole region 43 at equal intervals. In FIG. 12, the region surrounded by the alternate long and short dash line corresponds to the fine through-hole region 43. Further, a flat region 44 in which the fine through hole 41 is not formed is provided outside the fine through hole region 43 in the flat plate portion 21.

  Next, with reference to FIG. 14 and FIG. 15, the configuration inside the fine through hole region 43 in the fine through hole molded product 40 will be further described. As shown in FIGS. 14 and 15, the fine through-hole molded product 40 has a molded product main body 42 and a plurality of fine through-holes 41 formed over the entire fine through-hole region 43. Each fine through hole 41 is formed by each protruding portion 31 of the ultrasonic forming die 30, and thus has a shape corresponding to the shape of each protruding portion 31. Each fine through hole 41 includes a circular opening 41a provided on one surface 42a of the molded product main body 42, and a slope 41b extending from the circular opening 41a toward the circular opening 42b on the other surface of the molded product main body 42. Have. The slope 41b may be a straight line or a curve, but in particular, when the fine through-hole molded product 40 is used as a mist forming filter as will be described later, the cone-shaped through-hole in which the slope 41b becomes a parabola. It is preferable that Further, reference numeral 40a denotes a hole peripheral part formed at the peripheral edge of the circular opening 41a, reference numeral 40b denotes a connecting part formed between adjacent fine through holes 41, and reference numeral 40c denotes a fine through hole. 41 is a thick portion formed around 41.

As shown in FIG. 15, the diameter of the through hole is different between the front and back of the fine through hole molded product 40 in the conical-shaped through hole in which the inclined surface portion 41 b becomes a parabola. For example, the diameter d ₂ of the circular opening 41a of each fine through hole 41 is preferably about 1 μm to 10 μm, for example. The diameter d ₃ of the circular opening 42b, for example is preferably about 20Myuemu～80myuemu. The number of through-holes 41 is preferably about 200 to 1000 per mm ² per unit area of the fine through-hole molded product 40, and the adjacent circular openings 41 a are necessary for each through-hole 41 to have the above number. distance L ₂ between each other, for example, is preferably about 32Myuemu～70myuemu. Furthermore, the thickness t ₂ of the fine through-hole molded product 40 is preferably about 10 μm to 100 μm, for example.

  The fine through-hole molded product 40 as described above can be suitably used as a mist forming filter of a mist generating device such as a nebulizer. For example, as shown in FIG. 16, the fine through-hole molded product 40 (mist forming filter 54) is disposed between the ultrasonic vibrator 51 and the mist generating port 52 of the mist generating device 50. The liquid 53 supplied onto the ultrasonic transducer 51 forms granular droplets 53a by vibration energy from the ultrasonic transducer 51, but the droplets pass through the through holes of the mist forming filter 54. By being discharged to the mist generating port 52, a droplet 53a having a desired particle diameter can be formed. By arranging the fine through-hole molded product 40 such that the side with the larger diameter of the through-hole molded product 40 provided with through-holes with different diameters on the front and back as described above is the ultrasonic transducer 51 side. A mist having a particle size of the droplet 53a of about 1 to 10 μm can be formed.

<Modification>
In the above-described embodiment, the preform 20 has an example having the flat plate portion 21 and the peripheral flange 22 that is thicker than the flat plate portion 21. However, the shape of the preform 20 is not limited to this. For example, the preform 20 may consist of a flat sheet-like member as a whole.

  Furthermore, the fine through-hole molded product 40 and the preform 20 may have a flange 22 having an arbitrary fitting shape according to the purpose of use. That is, as shown in FIGS. 20 and 21, in the fine through-hole molded product 40, the flange 22 may have a fitting recess 46 that is recessed inward from the back surface side. As shown in FIGS. 20 and 21, the flat region 44 includes reinforcing ribs 45 that are laid radially at equal intervals in the circumferential direction, and a thin portion that is provided between the ribs 45 and is thinner than the ribs 45. 47. In this case, flat load application regions 39 and 28 provided around the protruding portion forming region 34 of the ultrasonic forming die 30 for forming the fine through-hole molded product 40 and around the protruding region 11a of the cradle 11 are respectively provided. , Each may be composed of a surface having rib-like irregularities.

  Further, in the above-described embodiment, an example in which the load application region 39 of the ultrasonic forming die 30 is located on the same plane as the valley portion 31 c of the protruding portion 31 has been shown. However, the present invention is not limited to this, and depending on the shape of the preform 20, the protruding portion forming region 34 of the ultrasonic forming die 30 and the surrounding load applying region 39, and the protruding region 11 a of the cradle 11 Each of the surrounding load application regions 28 may have a step. Specifically, the load application region 39 of the ultrasonic forming die 30 may be retracted above the valley 31c of the protruding portion 31 (FIG. 17A). Or the load provision area | region 39 may protrude below the trough part 31c of the protruding part 31 (FIG.17 (b)). Also, the load application region 28 of the cradle 11 may be retracted below the projecting region 11a (FIG. 18A), or may project above the projecting region 11a (FIG. 18 ( b)).

  In the above-described embodiment, the protruding region 11a of the cradle 11 has a flat surface. However, the present invention is not limited to this, and as shown in FIGS. A large number of protrusions 18 may be provided on the surface of the protruding region 11 a at positions corresponding to the protruding portions 31 of the ultrasonic molding die 30. The protrusion 18 may have a trapezoidal cross section (FIG. 19A), a rectangular cross section (FIG. 19B), or a cross-sectional arch shape (FIG. 19C).

  Thus, when many protrusions 18 are provided on the surface of the protruding region 11 a of the cradle 11, the protruding shape of the ultrasonic mold 30 is concentrated around the portion of the preform 20 where the fine through holes 41 are formed. Vibration energy from the part 31 can be added. Moreover, it becomes difficult for the heat from the cradle 11 to be transmitted to a region (a loaded region 21 c) other than the portion where the through hole is formed in the preform 20. Thus, the preform 20 can be efficiently melted or softened using the ultrasonic mold 30, and the through hole can be easily formed in the preform 20 with high accuracy. In addition, since the portion of the preform 20 where the through-hole is formed can be preferentially heated, the entire preform 20 is not heated, so that the preform 20 is deformed by heat. Can be minimized.

  17 to 21, the same parts as those of the embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and detailed description thereof is omitted.

DESCRIPTION OF SYMBOLS 10 Fine through-hole shaping | molding apparatus 11 Receptacle 11a Protrusion area | region 12 Back sheet 12a Back sheet peeling layer 13 Suction part 14 Temperature control apparatus 15 Mold control apparatus 16 Temperature control apparatus 20 Preform 21 Flat plate part 22 Peripheral flange 26 Concave area 28 Load Application area 30 Ultrasonic molding die 31 Projection part 32 Horn head 33 Base part 34 Projection part formation area 35 Concave area 39 Load application area 40 Fine through-hole molded product 41 Fine through-hole 42 Molded product main body 43 Fine through-hole area 44 Flat area 45 Rib 46 Fitting recess 47 Thin portion 50 Mist generator 51 Ultrasonic vibrator 52 Mist generating port 53 Liquid 54 Mist forming filter

Claims (15)

In a fine through-hole forming apparatus for producing a fine through-hole molded product including a large number of fine through-holes,
A cradle,
A backsheet that is held on a cradle and has heat resistance and supports a preform made of synthetic resin;
An ultrasonic molding die disposed above the backsheet and having a number of protrusions on the lower part;
The protruding part of the ultrasonic forming die is arranged in a specific protruding part forming region,
Protruding regions for sandwiching the preform and the back sheet between the protruding portion forming regions are provided at positions corresponding to the protruding portion forming regions of the cradle,
A flat load application region is provided around the protruding portion forming region of the ultrasonic molding die and the protruding region of the cradle, respectively.
The ultrasonic mold is movable in the vertical direction and ultrasonically vibrates in the vertical direction to vibrate and heat the preform and melt the preform to form a large number of fine through holes. A fine through-hole forming apparatus, wherein a load is applied to a preform between a load application region of a mold and a load application region of a cradle.   The fine through-hole forming device according to claim 1, wherein a concave region that is recessed downward from the load application region is provided around the load application region of the cradle.   The fine through-hole forming apparatus according to claim 2 or 3, wherein a concave region that is recessed above the load application region is provided around the load application region of the ultrasonic mold.   The preform is a fine through-hole forming device according to any one of claims 1 to 3, comprising a flat plate portion and a peripheral flange that is provided on an outer periphery of the flat plate portion and is thicker than the flat plate portion.   The fine through-hole forming device according to any one of claims 1 to 4, wherein a backsheet release layer having releasability with respect to the preform is formed on an upper surface of the backsheet.   The temperature control apparatus which can heat the preform arrange | positioned above a back seat | sheet to a desired temperature by heating the upper surface of a cradle to a desired temperature is connected to the cradle. The fine through-hole forming device according to one item.   The fine through-hole forming apparatus according to any one of claims 1 to 6, further comprising a preheating device that preheats the preform to a temperature in the vicinity of a glass transition temperature or a softening temperature of the resin. A method for producing a fine through-hole molded product including a large number of fine through-holes using the fine through-hole forming device according to any one of claims 1 to 7,
A step of holding a heat-resistant back sheet on the cradle;
A step of supporting a preform made of synthetic resin on the back sheet;
Preliminarily disposed above the backsheet, lowering the ultrasonic molding die having a number of protrusions in the lower part, contacting the protrusions that vibrate ultrasonically with the preform, and vibrating and heating the preform, A step of softening or melting a portion of the preform that comes into contact with the protrusion,
The ultrasonic mold is further lowered, and the softened or melted preform and the back sheet are sandwiched between the protruding part of the ultrasonic mold and the cradle. In this state, the protruding part of the ultrasonic mold A step of ultrasonically vibrating the part to vibrate and heat the preform, penetrating the preform through the protruding part, and forming a number of fine through holes in the preform,
A method in which a load is applied to a preform between a load applying region of an ultrasonic mold and a load applying region of a cradle in the step of forming a fine through hole.   The method according to claim 8, further comprising a step of preheating the preform before the step of supporting the preform made of synthetic resin on the back sheet.   The method according to claim 8 or 9, further comprising a step of raising the ultrasonic mold and extracting the protrusion from the preform after the step of forming the fine through hole. In the fine through-hole molded product formed using the fine through-hole forming device according to any one of claims 1 to 7,
A flat plate portion having a fine through hole region including a large number of fine through holes;
A fine through-hole molded product comprising a peripheral flange provided on the outer periphery of the flat plate portion and thicker than the flat plate portion.   The diameter of a fine through-hole is different in the front and back of a flat plate part, the diameter of one surface is 1-10 micrometers, and the diameter of the other surface is 20-80 micrometers, The fine through-hole shaping | molding of Claim 11 Goods. The density of formed micro through holes region of the flat plate portion micro through holes is 200 to 1000 pieces / mm ^2, claim 11 or fine through holes molded article according to 12.   The fine through-hole molded product according to any one of claims 11 to 13, wherein the through-hole has a conical shape that widens toward the end.   The flat plate portion has a fine through-hole region and a flat region located on the outer periphery of the fine through-hole region, and the flat region has a reinforcing rib. A fine through-hole molded product according to 1.

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