JP2007283714A - Method and apparatus for manufacturing resin molded product - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To release a resin molded product having minute uneven parts on the surface from a mold having a minute uneven shape promptly, easily and surely, while the uneven shape is satisfactorily maintained. <P>SOLUTION: In a method for manufacturing a resin molded product using molds 11 and 12 constituted of two or more parts assembled, the resin contact face 111 of at least one mold part is partially or wholly subjected to a treatment for enhancing the adhesiveness to resin in advance by a treating means 10, and the mold is opened with the resin molded product adhered on the mold face having been subjected to the treatment, to selectively release the resin molded product from the mold face having been not subjected to the treatment and an apparatus for practising the method is also provided. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method and apparatus for producing a resin molded body, and more specifically, a resin molded body having fine irregularities on the surface can be quickly and easily maintained from a mold while maintaining its irregular shape satisfactorily. In addition, the present invention relates to a method and an apparatus for producing a resin molded body that can be reliably released.

At present, molded products having fine irregularities of several tens of nanometers to several hundreds of micrometers on the surface and three-dimensional, thin, and large-area shapes are used for optical components for electronic displays such as microlens arrays. There is a demand for optical information communication components such as mode optical waveguides, life science components such as microchemical chips, and the like.
Conventionally, products with fine irregularities have been formed on glass and silicon substrates by machining, but there are problems such as long processing time and high cost. In recent years, they are inexpensive and suitable for mass production. Conversion to a new resin is being made.
In general, such a molded body uses an upper mold and a lower mold having fine uneven portions on at least one surface, and a thermoplastic resin is formed on the lower mold (or between the lower mold and the upper mold). The mold is closed and pressed, and then the obtained molded body is released from the mold.
However, the molded article having a fine uneven shape on the surface thus produced is particularly remarkable when the aspect ratio (depth / width) of the fine uneven shape is high, but when the transfer rate is high, It adheres firmly to the fine irregularities of the mold and cannot be released; if it is forcibly released, the fine irregularities will be damaged or the molded body will be damaged; If the mold is not pulled out strictly perpendicular to the fine irregular surface, the fine irregularities will be damaged.

In Patent Document 1 (Japanese Patent Laid-Open No. 2002-59440), when the optical component is released from the mold, a local temperature difference is given to the joint between the two, and the joint is locally peeled off. A method and apparatus for manufacturing an optical component in which a release region due to a typical temperature difference is sequentially expanded to release the entire region is disclosed. However, since this technique uses a warp due to a temperature difference between the mold and the optical component, the optical component is released from the mold in an oblique direction, and there is a problem that the fine uneven shape is damaged. This problem is conspicuous when the fine uneven shape has a shape such as a cylinder or a prism, and there are cases where this is not applicable depending on the fine uneven shape. In addition, when the aspect ratio (depth / width) of the fine uneven shape is large, it is difficult to release in a particularly smooth vertical direction. Also for the device, it is necessary to install an air pipe for cooling and a push-up portion (mechanical ejector portion), and there is a problem that the device configuration becomes complicated and the cost increases.
In Patent Document 2 (Japanese Patent Laid-Open No. 2003-154573), a molding material is filled in a cavity having fine irregularities formed by a fixed side mold and a movable side mold, and both molds are heated, There is disclosed an embossing molding method and apparatus for pressurizing and releasing while ultrasonically oscillating with an ultrasonic vibrator provided on one or both of both molds. Although it is possible to release the molded body by using the ultrasonic vibrator, it is necessary to install the ultrasonic vibrator in the mold, and in this case as well, the apparatus configuration is complicated as in Patent Document 1. Therefore, there is a problem that the cost increases. In addition, fine unevenness may be damaged due to ultrasonic vibration.
Although it is conceivable to apply a mold release agent to the mold surface, the mold release agent has an adverse effect on the resin product, for example, a chip having a fine channel shape cannot be bonded to the cover during post-processing. May not be a fundamental solution.
On the other hand, if the mold is pulled away in a direction perpendicular to the fine irregular surface while the molded article is adhered to the surface opposite to the fine irregularities (mirror side), a defective article can be obtained. As such a method, a method of adhering the molded body to the mirror surface side by vacuum suction can be considered, but there are problems as described below. That is, as shown in FIG. 9, when the molded body 90 is peeled off from the mold 91 having the fine uneven portions 911 using a vacuum force, a force is applied around the vacuum port 92 for vacuum suction of the molded body 90. Since the distribution of the in-plane peeling force becomes unstable, when the fine uneven portion 911 and the molded body 90 are firmly attached, the peeling spreads concentrically around the vacuum port 92. It cannot be pulled out vertically microscopically. Furthermore, there is a problem that the molten resin enters the vacuum port 92 during molding and impairs the appearance of the molded product.

JP 2002-59440 A JP 2003-154573 A

  Accordingly, an object of the present invention is to quickly, easily and reliably remove a resin molded body that is difficult to release, particularly a resin molded body having fine uneven portions on its surface, while maintaining its uneven shape well. Another object of the present invention is to provide a method and an apparatus for producing a resin molded body that can be released from the mold.

  The invention according to claim 1 is a method of manufacturing a resin molded body using a mold constituted by combining two or more parts, and a part of a resin contact surface of at least one mold part or The entire process is performed to increase the adhesion to the resin in advance, and the mold is opened while the resin molded body is adhered to the mold surface that has been subjected to the treatment, so that the mold surface is not subjected to the treatment. It is a manufacturing method of the resin molding characterized by including the process of selectively releasing a resin molding.

  Invention of Claim 2 is a manufacturing method of the resin molding of Claim 1 characterized by the process which improves the said adhesiveness being discharge irradiation treatment.

  Invention of Claim 3 is a manufacturing method of the resin molding of Claim 2 whose said discharge irradiation process is a plasma discharge irradiation process.

  According to a fourth aspect of the present invention, in the method for producing a resin molded body according to the third aspect, the plasma discharge irradiation treatment is a treatment by a plasma discharge irradiation apparatus that can be used under atmospheric pressure conditions. is there.

  The invention according to claim 5 is the method for producing a resin molded body according to claim 3 or 4, wherein the plasma discharge irradiation treatment is a corona discharge irradiation treatment.

  According to a sixth aspect of the present invention, the treatment for improving the adhesion is a photo-ozone method treatment, wherein the mold is irradiated with light in the presence of oxygen and treated with the generated ozone. It is a manufacturing method of the resin molding of description.

  The invention according to claim 7 is the method for producing a resin molded body according to claim 6, wherein the photo-ozone method treatment is treatment with a low-pressure mercury lamp or a xenon excimer lamp.

  The invention according to claim 8 is characterized in that the plasma discharge irradiation treatment is performed by inserting a plasma discharge irradiation apparatus into a mold and performing the plasma discharge irradiation treatment. It is a manufacturing method of a resin molding.

  The invention according to claim 9 is the resin molding according to claim 6, wherein the optical ozone method treatment is performed by inserting a low-pressure mercury lamp or a xenon excimer lamp into a mold and performing the optical ozone method treatment. It is a manufacturing method of a body.

  According to a tenth aspect of the present invention, the mold is a mold composed of a first mold and a second mold, and at least a part or the whole of the resin contact surface of the second mold is a fine uneven part. Yes, a part of or the entire resin contact surface of the first mold was previously subjected to a treatment for increasing the adhesion with the resin, and the resin molded body was adhered to the first mold subjected to the treatment for enhancing the adhesion The resin molded body is selectively released from the mold surface of the second mold having the fine irregularities by opening the mold as it is. It is a manufacturing method of the resin molding as described.

  The invention according to claim 11 is characterized in that the fine uneven portion of the second mold is formed on the second mold by mounting a stamper having the fine uneven portion on the mold. Item 11. A method for producing a resin molded article according to Item 10.

  According to a twelfth aspect of the present invention, the mold is opened while the resin molded body is adhered to the first mold that has been subjected to the treatment for improving the adhesion, and the second mold has a fine uneven portion. The resin molded body according to claim 10 or 11, wherein, in the step of releasing the resin molded body from the mold surface, the mold is opened perpendicularly to the mold surface having fine uneven portions. It is a manufacturing method.

The invention according to claim 13 is a step of subjecting the first mold to a treatment for improving adhesion to a thermoplastic resin;
Loading the thermoplastic resin between the first mold and the second mold;
The first mold and the second mold are closed, pressure is applied to the thermoplastic resin loaded between the first mold and the second mold, and the heat or the pressure is adjusted while adjusting the pressure or pressure and temperature. Transferring the shape of the fine irregularities of the second mold to a plastic resin, and molding a resin molded body;
By the treatment, the first mold or the second mold is opened perpendicularly with respect to the fine irregularities while the resin molded body is adhered to the first mold. The method for producing a resin molded body according to any one of claims 10 to 12, further comprising a step of selectively releasing the fine irregularities of the second mold.

  According to a fourteenth aspect of the present invention, in the step of loading the thermoplastic resin between the first mold and the second mold, the thermoplastic resin melted on the fine irregularities of the second mold is discharged by means of discharging. It is the process of apply | coating while moving, The manufacturing method of the resin molding of Claim 13 characterized by the above-mentioned.

Invention of Claim 15 is a metal mold | die with which the said metal mold | die is used for a compression molding apparatus,
14. The step of loading a thermoplastic resin between the first mold and the second mold is a step of placing a molten or semi-molten thermoplastic resin in the mold. It is a manufacturing method of the resin molding of description.

The invention according to claim 16 is a mold used in a hot embossing device or a nanoimprinting device.
The step of loading a thermoplastic resin between the first mold and the second mold is a process of installing a film-like or plate-like thermoplastic resin in the mold. It is a manufacturing method of the resin molding as described.

The invention according to claim 17 is a mold in which the mold is used for injection molding,
The step of loading a thermoplastic resin into the mold and the step of transferring the shape of the fine irregularities of the mold to the thermoplastic resin and molding a resin molded body,
(1) injection-filling a molten thermoplastic resin into a completely closed mold;
Applying pressure to the thermoplastic resin injected and filled between the first mold and the second mold, and adjusting the pressure or pressure and temperature, the fine irregularities of the second mold on the thermoplastic resin A process of transferring the shape and molding a resin molded body, or
(2) a step of injecting and filling a molten thermoplastic resin into a mold that is slightly open and in a substantially closed state;
Applying pressure to the injection-filled thermoplastic resin by completely closing the first mold and the second mold in a substantially closed state, and adjusting the pressure or pressure and temperature to the thermoplastic resin The method for producing a resin molded body according to claim 13, wherein the method is a step of forming a resin molded body by transferring the shape of the fine irregularities of the second mold.

  According to an eighteenth aspect of the present invention, the mold is opened while the resin molded body is adhered to at least one mold portion of the mold or the first mold which has been subjected to the treatment for improving the adhesion to the resin. Then, after selectively releasing the resin molded body from the mold surface or the second mold that has not been subjected to the treatment, the resin from at least one mold portion of the mold or the first mold It is a manufacturing method of the resin molding in any one of Claims 1-17 which has the process of releasing a molding.

  According to a nineteenth aspect of the present invention, in the step of releasing the resin molded body from at least one mold portion of the mold or the first mold that has been subjected to a treatment for improving adhesion to the resin, 19. The method for producing a resin molded body according to claim 18, wherein at least one mold portion of the mold or the first mold is cooled.

  The invention according to claim 20 is characterized in that, in the step of releasing the resin molded body from at least one mold portion of the mold or the first mold subjected to a treatment for improving adhesion to the resin, non-contact is performed. 20. The method for producing a resin molded body according to claim 18, wherein the molded resin is released using a transport body and transported to the outside of the mold.

  The invention according to claim 21 is characterized in that the mold has a temperature adjusting function, and when the mold shape is transferred and the resin molded body is released from the mold, the mold is heated and cooled respectively. It is performed, The method for producing a resin molded body according to any one of claims 1 to 20.

  The invention according to claim 22 is a resin molded body manufactured by the manufacturing method according to any one of claims 1 to 21.

Invention of Claim 23 is the manufacturing apparatus of the resin molding for enforcing the manufacturing method of the resin molding of Claim 1, Comprising:
The apparatus for producing a resin molded body includes a mold composed of a pair of a first mold and a second mold that are arranged to face each other,
Temperature adjusting means for adjusting the temperature of at least the resin contact surface of the set of mold parts;
Drive means for performing opening / closing of the first mold and the second mold and pressurization of the thermoplastic resin between the first mold and the second mold;
A means for performing a treatment for increasing the adhesion of the mold to the thermoplastic resin,
Performing a process of increasing the adhesion with the thermoplastic resin to a part or the whole of the resin contact surface of the first type by means for performing the process of increasing the adhesion;
The thermoplastic resin is loaded into the first mold and the second mold or between the first mold and the second mold, and the first mold and the closed mold are closed by the temperature adjusting means and the driving means. While applying pressure between the second molds and adjusting the pressure or pressure and temperature, the mold shape was transferred to the thermoplastic resin to form a resin molded body, followed by a treatment for increasing the adhesion. By releasing the mold while the resin molded body is attached to the first mold, the resin molded body is selectively released from the second mold that has not been subjected to the treatment for improving the adhesion, and then, The apparatus for producing a resin molded body is characterized in that the first mold to which the resin molded body is adhered is cooled and the resin molded body is released from the first mold.

Invention of Claim 24 is the manufacturing apparatus of the resin molding for enforcing the manufacturing method of the resin molding of Claim 10, Comprising:
The apparatus for manufacturing a resin molded body includes a second mold in which a part or the whole of a resin contact surface is a fine uneven portion, and a mold composed of a first mold disposed to face the second mold.
Temperature adjusting means for adjusting the temperature of at least the resin contact surface of the set of mold parts;
Drive means for opening and closing the first mold and the second mold and pressurizing the thermoplastic resin between the first mold and the second mold;
Having a means for increasing the adhesion of the mold to the thermoplastic resin,
Performing a process for increasing the adhesion with the thermoplastic resin on a part or the whole of the resin contact surface of the first type by means for performing the process for increasing the adhesion;
The thermoplastic resin is loaded into the first mold and the second mold or between the first mold and the second mold, and the first mold and the closed mold are closed by the temperature adjusting means and the driving means. While applying pressure between the second molds and adjusting the pressure or pressure and temperature, the mold shape is transferred to the thermoplastic resin to form a resin molded body, and then the adhesion is increased. In addition, the resin molded body is selectively released from the fine uneven portions of the second mold that is not subjected to the treatment while the resin molded body is adhered to the first mold, and then the resin molded body It is the manufacturing apparatus of the resin molding characterized by cooling the 1st type | mold to which this was adhered, and releasing the said resin molding from the said 1st type | mold.

  The invention according to claim 25 is characterized in that the means for performing the treatment for enhancing the adhesion of the mold to the thermoplastic resin is a plasma discharge irradiation treatment apparatus that can be used under atmospheric pressure conditions, and a corona that can be used under atmospheric pressure conditions. The apparatus for producing a resin molded body according to claim 23 or 24, wherein the apparatus is a discharge irradiation treatment apparatus, a low-pressure mercury lamp, or a xenon excimer lamp.

  According to the present invention, a resin molded body that is difficult to release, particularly a resin molded body having fine uneven portions on the surface, can be quickly, easily and reliably removed from the mold while maintaining the uneven shape well. The manufacturing method and apparatus of the resin molding which can be released can be provided. The present invention is particularly effective when a release agent or the like cannot be used due to restrictions on the resin molded body side, but when a release agent or the like is used, the release becomes easier and a greater effect can be obtained. Can do. In addition, in injection molding, compression molding, and hot embossing methods, conventionally, mold release is difficult when 100% of the fine irregularities of the mold are transferred, so in patterns that are difficult to release, the transfer rate is intentionally lowered. There are cases where a method such as taking a large draft is taken, but in the present invention, it is possible to release the resin molded body from the mold well even when 100% is transferred or there is no draft. Become. In addition, in the prior art, it has been difficult to release a molded article having a large area satisfactorily. Since the adhesion to the mold is strong and uniform, even if the mold has a large area, the resin molded body adheres uniformly throughout the entire area, and the mold surface on the side that has not been treated to improve the adhesion is fine. It is possible to release even from uneven portions, and a resin molded body having no deformation and damage of fine uneven portions can be obtained even in a large-area product.

  The present invention relates to a method and an apparatus for producing a resin molded body from a mold constituted by combining two or more parts, and a resin is previously applied to a part or the whole of a resin contact surface of at least one mold part. The mold is opened with the resin molded body attached to the mold surface subjected to the treatment, and the mold surface not subjected to the treatment and the resin molded body are processed. It is characterized by selective release. In particular, the resin contact surface of at least one mold part is preliminarily subjected to a treatment for improving adhesion to a thermoplastic resin. For the treatment, plasma discharge irradiation treatment, photo-ozone method treatment, or the like can be used. After the resin molded body is manufactured, the resin molded body is attached to the mold subjected to the treatment, and the treatment is not performed. It is characterized in that the resin molded body is peeled from the mold.

  Although not particularly limited as a thermoplastic resin, for example, polymethyl methacrylate resin (PMMA), polycarbonate (PC), cycloolefin (COP), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyarylate (PAR), polyimide (PI), polystyrene (PS), polypropylene (PP), polyamide (PA), polyethylene (PE), polyacetal (POM), ethylene-vinyl acetate copolymer resin (EVA), acrylonitrile butadiene styrene (ABS), polyvinyl chloride (PVC), polyphenylene oxide (PPO), methyl methacrylate / styrene resin (MS), methyl methacrylate / butadiene / styrene resin (MBS), or a mixture thereof. Further, a thermoplastic resin specially manufactured in accordance with the performance required for the resin molded body may be used. In addition, this invention is not limited to the said resin. For example, the same effect can be obtained even if the thermoplastic resin is a photocurable resin, a thermosetting resin, a radiation curable resin, or another polymerizable resin.

  Although there is no restriction | limiting in particular in the material of the metal mold | die used by this invention, Metals, such as steel materials and stainless steel, or inorganic substances, such as glass and a ceramic, are mentioned. Desirably, a stainless steel material often used for a resin molding die is preferable.

Hereinafter, the manufacturing method and manufacturing apparatus of the present invention will be described in more detail with reference to the drawings.
FIG. 1 is a schematic cross-sectional view of an embodiment of a production apparatus according to the present invention, in which one mold (first mold) surface has a mirror surface and the other mold (second mold) surface has several tens of nanometers. It is the form which has a fine uneven part of several hundred micrometers. In the following description, the first mold and the second mold are an upper mold and a lower mold, respectively. In addition, this invention is not restrict | limited to the following form. The mold shape to be transferred is not limited to a fine uneven shape and is arbitrary. A desired shape may be formed on the surfaces of both the upper mold and the lower mold.

In FIG. 1, the manufacturing apparatus 1 includes a pair of an upper mold 11 and a lower mold 12 that are arranged to face each other. The upper mold 11 and the lower mold 12 can be fitted to each other, and a force generator 13 as a driving unit is installed in the upper mold 11 as a movable mold. The force generator 13 enables the mold opening and closing of the upper mold 11 and the lower mold 12 and pressurization of the resin layer between the cavity surfaces of the upper mold 11 and the lower mold 12, and the precision of the mold. It has position / speed and pressure control functions.
In the form of FIG. 1, the cavity surface of the upper mold 11 has a mirror surface 111, and the cavity surface of the lower mold 12 has fine uneven portions 121.
In addition, this invention is not limited to the said form. The upper mold and the lower mold do not necessarily need to be fitted as long as the mold can be opened and closed and pressed, and the mold may be rotated 90 degrees. The mold may be a mold configured by combining three or more mold parts.

The mirror surface 111 of the upper mold 11 is preferably a mirror surface with Ra of 2.0 μm or less, and more preferably a mirror surface of 0.2 μm or less. Ra in the present specification means the arithmetic average roughness defined in JIS B0601-1994.
The lower mold 12 has fine uneven portions 121. The fine uneven portion 121 has, for example, a width or diameter of 10 nm to 1 mm and a depth or height of 10 nm to 1 mm.
Moreover, as shown in FIG. 1, it is preferable to install a heating means and a cooling means in the upper mold 11 and the lower mold 12. The heating means is constituted by a heater 15, for example, and the cooling means is constituted by a cooling pipe 16 through which cooling water flows. Further, the upper mold 11 and the lower mold 12 are provided with a temperature sensor and a temperature control means (not shown), thereby enabling temperature control of both molds. The temperature control of the upper mold 11 and the lower mold 12 can be performed by PID control or the like. The temperature control means is desirably provided separately for the upper mold 11 and the lower mold 12, and more preferably capable of adjusting the heating rate and the cooling rate. The heating rate can be easily controlled by the PID control or the like, and the cooling rate can be easily controlled by adjusting the amount of cooling water.

Moreover, the manufacturing apparatus 1 of this invention has the process means 10 which performs the process which improves the adhesiveness of a thermoplastic resin to one side of a metal mold | die. The processing means 10 can be moved into and out of the mold by a moving means (not shown).
The timing for performing the treatment is not particularly limited, but it is preferable to perform the treatment before the thermoplastic resin is loaded between the upper mold 11 and the lower mold 12. The mold temperature at this time is not particularly limited. In addition, the treatment may be performed every molding cycle, but the present inventors have found that the effect of the treatment for improving the adhesion usually lasts for several hours to about 1 day, and the adhesion If the treatment is carried out before the effect of improvement is lost, a good resin molded article can be continuously produced even at a frequency of about once every several hours.

Although the processing means 10 will not be restrict | limited especially if the adhesiveness of the metal mold | die with respect to a thermoplastic resin can be improved, It is preferable that it is an apparatus in which discharge irradiation processing is possible. Examples of the discharge irradiation treatment apparatus include a plasma discharge irradiation treatment apparatus, and among them, a corona discharge irradiation treatment, among which those that can be used under atmospheric pressure are preferable from the viewpoints of handleability and productivity.
As shown in FIG. 1, the processing means 10 enters the mold while the mold is open. In the form of FIG. 1, the processing means 10 performs a discharge irradiation process as indicated by an arrow on the mirror surface 111 that is the resin contact surface of the upper mold 11 while moving. When the area of the mirror surface 111 is less than or equal to the area of the discharge irradiation, the processing means 10 may be fixed. However, when the area of the mirror surface 111 is larger than the area of the discharge irradiation, the processing means 10 moves and the entire resin contact surface is moved. It is desirable to uniformly perform the discharge irradiation process, and at this time, it is more desirable to keep the distance between the processing means 10 and the mirror surface 111 constant. After completion of the discharge irradiation process, the processing means 10 moves out of the mold. By the discharge irradiation treatment, contaminants such as an oil film on the mirror surface 111 are removed, and at the same time, the mirror surface 111 is activated, polar groups are formed, and wettability with the thermoplastic resin is improved. The improvement of the wettability acts uniformly in the plane and the adhesion force between the resin molded body and the mirror surface 111 is increased. As a result, as described below, the upper mold 11 and the lower mold 12 are placed vertically. When released in the direction, it is possible to achieve a smooth release from the lower mold 12 having the fine concavo-convex portions 121, which has been difficult to release in the related art while the resin molded body is adhered to the mirror surface 111.
In addition, this invention is not limited to the said form. For example, when the lower mold has fine uneven portions only on a part of the resin contact surface, the discharge irradiation treatment may be performed only on a part of the resin contact surface of the upper mold. In this case, if the discharge irradiation treatment is performed on at least the mirror surface portion of the upper mold corresponding to the fine irregularities of the lower mold, the discharge irradiation treatment is performed on the entire mirror surface which is the resin contact surface of the upper mold. Similarly to the above, smooth release from the lower mold having fine uneven portions can be achieved.

  In addition, this invention is not limited to the said form. In an apparatus having a moving means such as a rotary mold, if the mirror surface 111 moves in the direction of the processing means 10, the discharge irradiation process can be performed on the mirror surface 111 even when the processing means 10 is fixed. Is possible. It is also possible to use a mold that has been subjected to a treatment for improving adhesion outside the apparatus in advance.

As the plasma discharge irradiation treatment, there are known a high-temperature plasma treatment using arc discharge for welding and the like, and a low-temperature plasma treatment for reforming and cleaning. In the present invention, the latter low-temperature plasma treatment is known. Treatment is preferred. As the low-temperature plasma processing apparatus, apparatuses that can be processed under atmospheric pressure conditions (760 torr) are commercially available, and examples thereof include an atmospheric pressure plasma irradiation surface modification apparatus manufactured by Kasuga Electric Co., Ltd.
The plasma discharge irradiation treatment conditions may be appropriately determined depending on the surface shape of the mold, the material, the type of the thermoplastic resin, and the like, and for example, 1 to 20 W · s / cm ² is exemplified as the plasma treatment amount.

Alternatively, the processing means 10 may be a means utilizing photo-ozone method processing. As such a means, there is one that irradiates light under oxygen conditions and treats the mirror surface 111 that is the resin contact surface of the mold with the generated ozone. The light used in the above means is not particularly limited as long as it can generate ozone under oxygen conditions, but light having a high energy value with a wavelength of 240 nm or less decomposes oxygen and generates ozone. Therefore, for example, a light source capable of irradiating light with a wavelength of 240 nm or less is desirable, and a light source capable of irradiating light with a wavelength of 200 nm or less is more desirable.
Examples of the light source used in the above processing include a mercury lamp and an excimer lamp. In particular, a low-pressure mercury lamp that mainly emits light with a wavelength of 185 nm and a wavelength of 254 nm, a xenon excimer lamp that emits light with a wavelength of 172 nm, and the like. Is desirable. Laser light, electron beam, etc. can also be used.

FIG. 2 is a view for explaining a process of loading a thermoplastic resin between the first mold and the second mold of the manufacturing method of the present invention. In this embodiment, the thermoplastic resin loaded in the mold is a resin layer on the fine uneven portion 121.
In FIG. 2, the resin layer 21 is formed on the fine uneven portion 121 on the lower mold 12. The method for forming the resin layer 21 is not particularly limited, but the thermoplastic resin is supplied to the coating device 23 provided with the discharge ports 22, and the coating device 23 is moved in the direction of the arrow 24 while the heat is applied from above the fine uneven portion 121. It is preferable to discharge the plastic resin and fill the fine uneven portion 121 with the thermoplastic resin. In this way, a resin molded body having high dimensional accuracy, low residual stress, low birefringence, high light transmission, and excellent mechanical strength can be obtained in a three-dimensional, thin-walled, It can be provided in the form of an area. Note that the method of loading the thermoplastic resin between the first mold and the second mold may be a method other than the discharge of the thermoplastic resin.

FIG. 3 is a view for explaining a process of closing a mold, applying pressure or heat and pressure to the thermoplastic resin, and transferring a mold shape (fine uneven shape) to the thermoplastic resin.
In FIG. 3, the force generator 13 is used to fit (close) the upper mold 11 and the lower mold 12, and the mirror surface 111 of the upper mold 11 and the fine uneven portion 121 of the lower mold 12 The resin layer 21 existing therebetween is pressed. During pressing, the upper mold 11 and the lower mold 12 are heated to a desired temperature (usually a temperature higher than the Tg of the thermoplastic resin, preferably a temperature higher than the Tg by 20 ° C.) by the operation of the heater 15. Yes. Although the press pressure at this time is not particularly limited, for example, when the coating apparatus is used, a low pressure press of 10 MPa or less can be employed. By this operation, the shape of the fine uneven portion 121 is transferred to the resin layer 21. After the transfer is completed, the resin layer 21 is cooled and solidified while adjusting the pressure and the mold temperature to produce a resin molded body.

Subsequently, the mold is opened, and the manufactured resin molded body is released from the mold.
Since the mirror surface 111 is subjected to a process for improving the adhesion to the thermoplastic resin, a strong adhesion force is generated between the mirror surface 111 and the resin molded body.

  In this state, when the resin layer 21 is cooled and solidified to a desired temperature while applying the pressing force, the resin layer 21 shrinks in volume and the linear expansion coefficient at the metal-resin interface of the lower mold 12. Relative displacement due to the difference between the two occurs.

FIG. 4 is an enlarged cross-sectional view of the fine concavo-convex portion 121 and the resin layer 21 for explaining volume shrinkage and shear deformation of the resin layer 21 filled in the fine concavo-convex portion 121.
As shown in FIG. 4A, when the resin layer 21 made of a thermoplastic resin is filled in the fine concavo-convex portion 121, and then the resin layer 21 is cooled and solidified while the pressing force in the direction of the arrow 41 is applied, As shown in FIG. 4B, the resin layer 21 shrinks in volume toward the inner side (arrow 42 direction) of the fine uneven portion 121. At the same time, relative slip deformation due to the difference in linear expansion coefficient between the metal of the lower mold 12 and the resin layer 21 occurs in the direction of the arrow 43. For these reasons, the manufactured transfer body is easily released from the fine uneven portion 121.
On the other hand, the resin layer 21 also shrinks in the planar direction. FIG. 5 is an enlarged cross-sectional view of the fine uneven portion 121 and the resin layer 21 for explaining the shrinkage in the planar direction of the resin layer 21 filled in the fine uneven portion 121. As shown in FIG. 5A, since the resin layer 21 also contracts in the planar direction, the resin layer 21 is pressed toward the center direction (arrow direction) of the fine uneven portion 121 due to the difference in linear expansion. In contrast, in the embodiment of the present invention, as shown in FIG. 5B, the mold is subjected to discharge irradiation treatment, and the resin layer 21 is completely attached and fixed to the mirror surface 111 of the upper mold 11. Therefore, even if the resin layer 21 tends to shrink in the planar direction, the shrinkage of the resin molded body in the planar direction (longitudinal, lateral, height, longitudinal and lateral directions) is suppressed. As a result, the resin layer 21 cannot be pressed toward the center direction (arrow direction) of the fine uneven portion 121, and the frictional force is reduced. At the same time, since the resin molding is completely attached to the mirror surface 111 side, by opening the mold perpendicularly to the fine irregularities, the resin molding is adhered to the mirror surface 111 and the fine mold It is possible to release the mold vertically without bringing the concavo-convex part into contact with the fine concavo-convex part of the resin molding.

FIG. 6 is a view for explaining a process of releasing the resin molded body from the fine uneven portion 121 while the resin molded body is adhered to the upper mold 11.
As described above, since the mirror surface 111 and the resin layer 21 of the upper mold 11 are completely attached, the force generator 13 is operated to make the upper mold 11 and the lower mold 12 have fine uneven portions. When opened in the direction perpendicular to the surface (arrow direction), as shown in FIG. 6, the resin molded body 51 is released from the fine irregularities 121 while adhering to the mirror surface 111 of the upper mold 11. The resin molding 51 adhering to the mirror surface 111 of the upper mold 11 cools the mirror surface 111 of the upper mold 11, preferably by cooling the mirror surface 111 at 10 ° C. or higher, more preferably at 20 ° C. or higher. It can be easily released from the mirror surface 111.

  In addition, this invention is not limited to the said form, For example, in the form of FIG. 1, the upper metal mold | die 11 may have uneven | corrugated shape or curved surface shape. In this case, the unevenness or curved surface shape that is relatively easy to release is subjected to a treatment for improving the adhesion to the thermoplastic resin, so that the adhesion is increased as in the case where the upper die is a mirror surface. The resin molded body can be released from the mold that has not been subjected to the treatment for improving the adhesion while the resin molded body is adhered to the mold. The side where mold release is easy may be, for example, the side where the surface area of the concavo-convex part is small, the side where the aspect ratio (depth / width) of the fine concavo-convex part is small, or the side where the draft angle is large.

  Moreover, it is preferable to use a non-contact conveyance body when releasing the resin molding and conveying the resin molding obtained from the manufacturing apparatus. FIG. 7 is a cross-sectional view illustrating an example of a non-contact conveyance body. The non-contact conveyance body 81 is a device that ejects compressed air from a jet port (not shown) and generates a negative pressure using the principle of an air ejector. The negative pressure causes the resin molded body 51 from the upper mold 11 to move. It makes mold release easier. Further, the released resin molded body can be transported to the outside of the mold in the direction of the arrow without contacting the mold shape transferred to the resin molded body 51 by the recess 812 of the non-contact transport body 81. . This apparatus is known and disclosed in, for example, Japanese Patent Laid-Open Nos. 10-181879 and 2005-219922. Thereby, a resin molding can be conveyed outside a metal mold | die, without damaging the fine uneven | corrugated part formed in the resin molding.

The manufacturing process of the aforementioned resin molded body is as follows:
(1) The processing means 10 for performing a process for improving the adhesion between the mold and the resin is inserted into the open mold, and the process is performed on the mirror surface 111 which is the resin contact surface of the upper mold 11. Process,
(2) Predetermined portions for molding the resin with the mirror surface 111 which is the resin contact surface of the upper mold 11 and the fine uneven portion 121 which is the resin contact surface of the lower mold 12 by the temperature adjusting means. Heating to temperature,
(3) A step of applying a resin on the fine irregularities 121 of the lower mold 12 by the coating device 23 to form the resin layer 21;
(4) The upper mold 11 and the lower mold 12 are closed, pressure is applied to the resin layer 21 between the upper mold 11 and the lower mold 12, and the pressure or pressure and temperature are adjusted, Transferring the shape of the mold to the resin, and molding the resin molded body 51;
(5) The mold is opened perpendicularly to the fine irregularities 121, and the treatment is performed with the resin molded body 51 attached to the mirror surface 111 of the upper mold 11 subjected to the treatment. A step of selectively releasing the resin molded body 51 from the fine uneven portion 121 of the lower mold 12 that is not,
(6) a step of cooling the mirror surface 111 of the upper mold 11 in order to release the resin molded body 51 attached to the mirror surface 111 of the upper mold 11;
(7) After the non-contact carrier has entered between the opened molds, the resin molded body 51 attached to the mirror surface 111 of the upper mold 11 is separated by the negative pressure generated by the non-contact carrier. And a step of molding the resin molded body.
In addition, this invention is not limited to the said form, You may change a part of said process, or may use a completely different method.

  In the form of FIG. 1, the fine uneven portion 121 is provided directly on the lower mold 12. Separately, however, a stamper having fine uneven portions on the surface is used as the upper mold 11 or the lower mold 12. You may install on top of. When using a stamper, it is preferable to provide means for fixing the stamper to the upper mold 11 or the lower mold 12.

In the present invention, in addition to the above method for producing a resin molded body, the mold may be a mold used in an injection molding apparatus. In general, an injection molding apparatus has means for opening and closing and pressurizing a mold, a mold having a resin flow path from a resin melting apparatus, and a mechanism for melting the resin and injecting it into the mold. Have. After injecting and filling molten resin into a slightly open mold and closing the mold, or after injecting and filling molten resin into a closed mold, thermoplasticity while adjusting pressure and temperature The resin is cooled and solidified, the mold is opened, and the resin molded body is released from the mold.
Moreover, in this invention, the metal mold | die used for a compression molding apparatus may be sufficient as a metal mold | die. In general, compression molding equipment places molten or softened resin in a mold, applies pressure and heat to the resin, pressurizes and molds, cools the mold, and cools and solidifies the resin. After that, the mold is opened, and the resin molding is released from the mold.
Furthermore, in this invention, the metal mold | die used for a hot embossing apparatus or a nanoimprint apparatus may be sufficient. Generally, a hot embossing device or nanoimprinting device closes a mold with a thermoplastic resin substrate or a thermoplastic resin film placed on the mold, and applies the pressure to the temperature of the mold surface to the glass transition temperature of the resin. Heat to the vicinity or higher, transfer the fine irregularities of the mold to the resin substrate or resin film, then cool the mold, cool and solidify the resin, open the mold from the fine irregularities The resin molded body is released.
In any of the above-described molding methods, the one mold that has been subjected to the treatment for improving the adhesion of the resin molded body by applying the treatment for enhancing the adhesion between the mold and the thermoplastic resin to one of the molds in advance. As described above, the resin molded body can be smoothly released from the other mold that is difficult to release, as described above. In order to sufficiently exhibit the adhesiveness, it is desirable to heat the mold temperature to a temperature near or above the glass transition temperature, and more preferably to the glass transition temperature or higher.

The resin molded body obtained by the production method and apparatus of the present invention includes (a) a microlens array, a light guide plate for liquid crystal, a flexible display substrate, a wave plate, a reflector, a retardation plate, a free-form mirror, an LED light-emitting panel, Core components in the field of electronic displays such as Fresnel lenses, (b) Cores in the field of optical information communications such as flexible polymer optical waveguides, free-form curved diffraction gratings, two-dimensional image sensor arrays, pickup lenses, holograms, and flexible waveguide illumination plates. Components, (c) Next-generation DVD (Blu-ray Disc), Blu-ray Disc cover layer, DVD, CD, key components in the field of optical recording media such as ultra-thin IC cards, (d) Integrated chemical chips, DNA chips, biochips Key components in life science fields such as protein chips, microfluidic devices, environmental analysis chips, (e) fuel cell separators Mobile phone ultra-thin battery case, is preferably used, such as in the key components of new energy fields such as solar concentrator Fresnel lens.
The present invention is a molded product that is extremely difficult to release, particularly a resin molded body having a large aspect ratio (depth / width) of fine irregularities, and the like among the above products, by forming fine irregularities. It is effective for large-area resin moldings having irregularities, products that cannot be used with mechanical ejectors, mold release agents, vacuum adsorption, etc. due to restrictions on the appearance and function of the product.

  The invention is further illustrated by the following examples. All the manufacturing apparatuses used in the following examples are the apparatuses shown in FIG.

Example 1
An extruder for heating and melting thermoplastic resin, an accumulator for measuring and discharging thermoplastic resin, a T-die for discharging film-like resin, and a drive mechanism for applying them to a mold The coating apparatus which has was prepared.
On the lower mold 12, a Ni stamper having a fine uneven portion 121 having a vertical, horizontal, depth, and uneven portion interval of 50 μm was fixed. The upper mold 11 has a mirror surface 111 with a Ra of 0.20 μm or less. The upper mold 11 and the lower mold 12 are made of stainless steel.
With the upper mold 11 and the lower mold 12 opened, a plasma discharge irradiation apparatus that can be used under atmospheric pressure conditions is introduced into the mold, and the upper mold 11 is exposed under the irradiation treatment conditions shown in Table 1 below. Plasma discharge irradiation treatment was performed on the entire mirror surface 111 from a distance of about 10 mm. Subsequently, the heater 15 is operated to heat the upper mold 11 and the lower mold 12 to 150 ° C., and then the molten cycloolefin polymer heated to 250 ° C. is applied onto the fine irregularities 121 by the coating device. Then, a resin layer 21 having a thickness of 150 μm was formed.
Next, the upper mold 11 and the lower mold 12 are closed, a pressure of 5 MPa is applied to the resin layer 21, a molten resin is formed, and the shape of the fine irregularities 121 is transferred, and then the mold is placed at 70 ° C. Cooled to.
Subsequently, the mold was opened, and the obtained product was released from the fine irregularities 121. Since the adhesion between the mirror surface 111 of the upper mold 11 and the resin layer 21 is improved and the adhesion force is increased by performing the plasma discharge irradiation treatment, the mold is opened and the upper mold 11 is moved vertically. Thus, it was possible to easily peel off the fine uneven portion 121 while the resin molded body 51 was adhered to the upper mold 11.
The resin molded body 51 attached to the upper mold 11 cools the upper mold 11 to 50 ° C. and reduces the adhesive force, and then brings the non-contact conveyance body as shown in FIG. 7 closer to the resin molded body 51. Thus, the mold could be easily released from the mold.

  In addition, the present inventors used acrylic resin (PMMA) instead of the above cycloolefin polymer as the thermoplastic resin, and performed the same test as described above. The results are shown in Table 1.

In addition, as a method for improving adhesion, instead of a plasma discharge irradiation treatment apparatus that can be used under atmospheric pressure conditions, a corona discharge irradiation treatment apparatus that can be used under commercial atmospheric pressure conditions, a photo-ozone method treatment (low pressure mercury lamp or A test using a xenon excimer lamp was performed in the same manner as in Example 1 under the irradiation processing conditions shown in Table 1 below.
Note that the plasma discharge irradiation treatment was tested by changing the size of the mold. That is, the size of the resin molded body is 50 mm in length and width (hereinafter referred to as 50 mm square), 200 mm in length and width (hereinafter referred to as 200 mm square), and 1000 mm in length and width (hereinafter referred to as 1000 mm square). Each mold was irradiated with plasma discharge and then tested to verify the effect of the method of the present invention on increasing the area.
The results are shown in Table 1.

Comparative Example 1
A coating apparatus similar to that in Example 1 was prepared.
On the lower mold 12, a fine uneven portion 121 having a vertical, horizontal, depth, and uneven portion interval of 50 μm was processed. The upper mold 11 has a mirror surface 111 with a Ra of 0.20 μm or less. The upper mold 11 and the lower mold 12 are made of stainless steel and have an effective area of 100 × 100 mm. Twelve ejector pins and a mechanism for projecting the ejector pins were installed on the outer edge of the effective surface of the lower mold 12.
Except for not using the plasma discharge irradiation apparatus, after transferring the shape of the fine irregularities 121 to the resin molding under the same conditions as in Example 1, the mold was cooled to 70 ° C. and resin molding was performed on the fine irregularities 121. The mold was opened with the body 51 attached. Thereafter, the resin molded body 51 was pushed up from the fine uneven portion 121 side by an ejector pin, and the resin molded body 51 was peeled from the fine uneven portion 121.
The results are shown in Table 1.

Comparative Example 2
A coating apparatus similar to that in Example 1 was prepared.
On the lower mold 12, a fine uneven portion 121 having a vertical, horizontal, depth, and uneven portion interval of 50 μm was processed. The upper mold 11 has a mirror surface 111 with a Ra of 0.20 μm or less. The upper mold 11 and the lower mold 12 are made of stainless steel and have an effective area of 100 × 100 mm.
Except for not using the plasma discharge irradiation apparatus, after transferring the shape of the fine irregularities 121 of the mold to the thermoplastic resin under the same conditions as in Example 1, the mold was cooled to 70 ° C. The mold was opened while the resin molded body 51 was adhered to the concavo-convex portion 121. Thereafter, a vacuum suction pad having an effective suction area of 95 mm in diameter is attached to the mirror surface side of the resin molded body 51, and the vacuum suction pad is lifted in a direction perpendicular to the fine concavo-convex portion 121 while evacuating the resin molded body 51. The mold was released from the fine uneven portion 121 of the mold.
The test results are shown in Table 1.

  In the resin molded product obtained by the method of the present invention, the shape of the fine concavo-convex part was faithfully transferred, and no defects such as collapse of the fine concavo-convex part and burrs were observed. In contrast, when the plasma discharge irradiation treatment was not performed (the method using the mechanical ejector and the vacuum suction pad described above), defects such as the collapse of the shape of the fine irregularities and burrs were recognized. Further, in peel peeling, the resin molded body was cracked at the time of release, and the resin molded body could not be obtained. “Burr” refers to the portion where the fine irregularities of the resin molding are deformed by friction with the mold, and “collapse” refers to the fine irregularities of the resin molding when the mold is released. It represents a portion that is not peeled off from the inside of the unevenness but remains on the fine unevenness of the mold and is damaged.

  FIG. 8 shows a laser micrograph of the fine irregularities of the resin molded body 51 as a result of the experiment. (A) of FIG. 8 is the conventional method described in the comparative example 1, and burrs deformed due to friction with the mold at the time of release are formed on the fine uneven portions transferred to the resin molded body. I understand that. In contrast, in the resin molded body 51 manufactured by the method of the present invention shown in FIG. 10B, it can be seen that the shape of the fine uneven portion 121 is faithfully transferred.

Irradiation treatment conditions (Example)
Plasma discharge treatment system Processing time: 30 seconds (50 mm square), 1 minute (200 mm square), 5 minutes (1000 mm square)
Irradiation distance: 10mm
Corona discharge treatment equipment Treatment time: 1 minute (200 mm square)
Irradiation distance: 10mm
Low pressure mercury lamp Treatment time: 1 minute (200 mm square)
Irradiation distance: 10mm
Xenon excimer lamp Processing time: 1 minute (200 mm square)
Irradiation distance: 3mm

Example 2
An acrylic resin was used as the thermoplastic resin, and a molding test was performed on an injection molding machine.
The upper mold and the lower mold have a flow path (not shown) for injecting molten resin from the configuration and injection nozzle shown in FIG.
On the surface of the lower mold 12, a fine uneven portion 121 having a vertical, horizontal, depth, and uneven portion interval of 50 μm was processed. The upper mold 11 has a mirror surface 111 with a Ra of 0.20 μm or less. The upper mold 11 and the lower mold 12 are made of stainless steel and have an effective area of 50 mm square.
With the upper mold 11 and the lower mold 12 open, a plasma discharge irradiation apparatus that can be used under atmospheric pressure conditions is inserted into the mold, and the upper mold 11 is applied to the upper mold 11 under the same irradiation processing conditions as in the first embodiment. Then, plasma discharge irradiation treatment was performed. The irradiation processing time was 30 seconds.
The thickness of the resin molding was 1 mm. In order to transfer 100% of the fine irregularities 121, the resin temperature is set to 280 ° C, the mold temperature is set to 130 ° C, and the upper mold 11 and the lower mold 12 are slightly opened, and the molten resin is put into the mold. After injecting the mold, the mold is completely closed, the pressure of 50MPa is applied as the mold internal pressure, and the mold temperature is cooled to 70 ° C while the shape of the fine irregularities 121 is transferred to the resin and molded. A molded body 51 was produced.
Subsequently, the upper mold 11 and the lower mold 12 were opened in the vertical direction, and the resin molded body 51 was released from the fine uneven portion 121 while the resin molded body 51 was adhered to the upper mold 11.
Thereafter, the mold was further cooled to 50 ° C., and the resin molded body 51 was released from the mold by a non-contact transfer body as shown in FIG.
In the obtained resin molded body 51, the fine uneven portions 121 were faithfully transferred, and no defects such as burrs or collapse of the fine uneven portions were observed.
On the other hand, when the plasma discharge irradiation treatment is not performed, it is difficult to release the resin molded body 51 from the fine uneven portion 121, and the mold cannot be released from the fine uneven portion 121 side when the mold is opened. Could not get.

Example 3
An acrylic resin was used as the thermoplastic resin, and a molding test was conducted by a compression molding method.
The apparatus and the mold used for the test are almost the same as in Example 1, except that the T die at the tip of the extruder is a die for extruding a sheet-like resin having a thickness of 3 mm. The lower mold 12 is provided with the following fine irregularities 121.
With the upper mold 11 and the lower mold 12 opened, a plasma discharge irradiation apparatus that can be used under atmospheric pressure conditions is inserted into the mold, and the upper mold 12 is applied to the upper mold 12 under the same irradiation treatment conditions as in Example 1. Then, plasma discharge irradiation treatment was performed. The irradiation processing time was 30 seconds. Thereafter, the mold temperature was raised to 150 ° C.
On a lower mold 12 provided with a fine uneven part 121 having a resin temperature of 250 ° C. extruded by an extruder and a thickness of 3 mm and a vertical, horizontal, depth, and uneven part interval of 50 μm. Then, the mold was closed, a pressure of 20 MPa was applied, a molten resin was formed, the shape of the fine irregularities 121 was transferred, and the mold was cooled to 70 ° C.
Subsequently, the upper mold 11 and the lower mold 12 are opened in the vertical direction with respect to the fine irregularities 121, and the resin molding 51 is finely irregular with the resin molding 51 attached to the upper mold 11. The mold was released from the part 121.
The resin molded body 51 attached to the upper mold 11 cools the upper mold 11 to 50 ° C. and reduces the adhesion force, and then brings the non-contact conveyance body closer to the resin molded body 51 as shown in FIG. Thus, the mold could be easily released from the upper mold 11.
In the obtained resin molded body 51, the shape of the fine uneven portion 121 was faithfully transferred, and the shape of the fine uneven portion 121 was not broken and defects such as burrs were not recognized.
On the other hand, when plasma irradiation was not performed, the resin molded body 51 adhered to the lower mold 12 when the mold was opened, and the resin molded body 51 could not be released.

Example 4
An acrylic resin was used as the thermoplastic resin, and a molding test was conducted by a hot embossing method.
The apparatus and the mold used for the test are almost the same as those in Example 1, except that the coating apparatus for discharging the molten resin onto the mold is not provided, and a mold having an effective area of 200 mm square is used. The point is different from the apparatus of the first embodiment. The lower mold 12 is provided with the following fine irregularities 121.
With the upper mold 11 and the lower mold 12 opened, a plasma discharge irradiation apparatus that can be used under atmospheric pressure conditions is inserted into the mold, and the upper mold 12 is applied to the upper mold 12 under the same irradiation treatment conditions as in Example 1. Then, plasma discharge irradiation treatment was performed. The irradiation processing time was 30 seconds.
Subsequently, an acrylic resin substrate having a thickness of 0.5 mm was placed on the lower mold 12 provided with fine uneven portions 121 each having a vertical, horizontal, depth, and uneven portion interval of 50 μm, and the upper mold After closing the mold 11 and the lower mold 12 and increasing the mold temperature to 110 ° C. while applying a pressure of 1 MPa, the pressure of 10 MPa is applied to transfer the shape of the fine irregularities 121 to the resin substrate, The temperature of the upper mold 11 and the lower mold 12 was cooled to 70 ° C.
Thereafter, the upper mold 11 and the lower mold 12 are opened perpendicularly to the fine concavo-convex portion 121, and the resin molded body 51 is made fine concavo-convex while the resin molded body 51 is attached to the upper mold 11. The mold was released from the part 121.
The resin molded body 51 attached to the upper mold 11 is obtained by cooling the upper mold 11 to 50 ° C. and reducing the adhesion force, and then bringing the non-contact conveyance body closer to the resin molded body as shown in FIG. The upper mold 11 could be easily released from the mold.
In the obtained resin molded body 51, the shape of the fine uneven portion 121 was faithfully transferred, and the shape of the fine uneven portion 121 was not broken and defects such as burrs were not recognized.
On the other hand, when plasma irradiation was not performed, the resin molded body 51 adhered to the lower mold 12 when the mold was opened, and the resin molded body 51 could not be released.

According to the present invention, a mold having a fine concavo-convex shape is obtained while maintaining a good concavo-convex shape of a resin molded body having a fine concavo-convex portion on the surface without requiring a special mold with a complicated apparatus configuration. It is possible to provide a method and an apparatus for producing a resin molded body that can be quickly and easily and reliably released from a mold.
The resin molded body obtained by the production method and production apparatus of the present invention includes: (a) a microlens array, a liquid crystal light guide plate, a flexible display substrate, a wave plate, a reflector, a retardation plate, a free-form curved mirror, and an LED light-emitting panel. Key components in the field of electronic displays such as Fresnel lenses, (b) optical polymer communication waveguides such as flexible polymer optical waveguides, free-form curved gratings, two-dimensional image sensor arrays, pickup lenses, holograms, and flexible waveguide illumination plates Core parts, (c) Next-generation DVD (Blu-ray Disc), Blu-ray Disc cover layer, DVD, CD, key components in the field of optical recording media such as ultra-thin IC cards, (d) Integrated chemical chips, DNA chips, biotechnology Life science field key components such as chips, protein chips, microfluidic devices, environmental analysis chips, (e) Fuel cell separation Data, mobile phone ultra-thin battery case, is preferably used, such as in the key components of new energy fields such as solar concentrator Fresnel lens.
The present invention is a molded product that is extremely difficult to release, particularly a resin molded body having a large aspect ratio (depth / width) of fine irregularities, and the like among the above products, by forming fine irregularities. It is effective for large-area resin moldings having irregularities, products that cannot be used with mechanical ejectors, mold release agents, vacuum adsorption, etc. due to restrictions on the appearance and function of the product.

It is a schematic sectional drawing of one Embodiment of the manufacturing apparatus in this invention. It is a figure for demonstrating the process of loading a thermoplastic resin between the 1st type | mold and 2nd type | mold of the manufacturing method of this invention. It is a figure for demonstrating the process of closing a metal mold | die, applying a heat | fever and / or pressure to the said thermoplastic resin, and transferring a metal mold | die shape (fine uneven | corrugated shape) to the said thermoplastic resin. It is an expanded sectional view of a fine uneven | corrugated | grooved part and a resin layer for demonstrating volume shrinkage | contraction and shear deformation | transformation of the resin layer with which the fine uneven | corrugated | grooved part was filled. It is an expanded sectional view of a fine uneven part and a resin layer for explaining contraction of a plane direction of a resin layer with which the fine uneven part was filled. It is a figure for demonstrating the process of releasing a resin molding from a fine uneven | corrugated | grooved part, with a resin molding adhered to an upper metal mold | die. It is sectional drawing which shows an example of a non-contact conveyance body. (A) is a laser micrograph of a fine concavo-convex shape of a resin molded body produced by a conventional method, and (b) is a laser micrograph of a fine concavo-convex shape of a resin molded body produced by the method of the present invention. is there. It is sectional drawing for demonstrating the case where a resin molding is peeled from the metal mold | die which has a fine uneven part using a vacuum force.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Manufacturing apparatus 10 Processing means 11 Upper metal mold | die 111 Mirror surface 12 Lower metal mold | die 121 Fine uneven | corrugated | grooved part 13 Force generator 15 Heater 16 Cooling pipe 21 Resin layer 23 Coating apparatus 51 Resin molding

Claims (25)

  In a method for producing a resin molded body using a mold constituted by combining two or more parts, a part or the whole of the resin contact surface of at least one mold part is previously adhered to the resin. The mold is selectively released from the mold surface not subjected to the treatment by opening the mold while the resin mold is attached to the mold surface subjected to the treatment. The manufacturing method of the resin molding characterized by including the process to do.   The method for producing a resin molded body according to claim 1, wherein the treatment for improving adhesion is a discharge irradiation treatment.   The method for producing a resin molded body according to claim 2, wherein the discharge irradiation treatment is a plasma discharge irradiation treatment.   The method for producing a resin molded product according to claim 3, wherein the plasma discharge irradiation treatment is a treatment by a plasma discharge irradiation apparatus that can be used under atmospheric pressure conditions.   The method for producing a resin molded body according to claim 3 or 4, wherein the plasma discharge irradiation treatment is a corona discharge irradiation treatment.   The method for producing a resin molded body according to claim 1, wherein the treatment for improving the adhesion is a photo-ozone method treatment, wherein the mold is irradiated with light in the presence of oxygen and treated with generated ozone. .   The method for producing a resin molded product according to claim 6, wherein the photo-ozone method treatment is treatment with a low-pressure mercury lamp or a xenon excimer lamp.   The said plasma discharge irradiation process inserts a plasma discharge irradiation apparatus in a metal mold | die, and performs the plasma discharge irradiation process, The manufacturing method of the resin molding in any one of Claims 3-5 characterized by the above-mentioned.   The method for producing a resin molded body according to claim 6, wherein the photo-ozone method treatment is performed by inserting a low-pressure mercury lamp or a xenon excimer lamp into a mold and performing the photo-ozone method treatment.   The mold is a mold composed of a first mold and a second mold, and at least a part or the whole of the resin contact surface of the second mold is a fine uneven part, and the resin contact of the first mold By performing a process for increasing the adhesion with the resin in advance on a part or the whole of the surface, and opening the mold while the resin molded body is adhered to the first mold subjected to the process for increasing the adhesion The method for producing a resin molded body according to any one of claims 1 to 9, wherein the resin molded body is selectively released from a mold surface having fine irregularities of the second mold.   11. The resin molded body according to claim 10, wherein the fine uneven portion of the second mold is formed on the second mold by mounting a stamper having the fine uneven portion on the mold. Production method.   The mold is opened while the resin mold is adhered to the first mold that has been subjected to the treatment for improving the adhesion, and the resin mold is separated from the mold surface of the second mold having the fine irregularities. The method for producing a resin molded body according to claim 10 or 11, wherein, in the step of molding, the mold is opened perpendicularly to a mold surface having fine uneven portions. Applying a treatment to the first mold to enhance adhesion with the thermoplastic resin;
Loading the thermoplastic resin between the first mold and the second mold;
The first mold and the second mold are closed, pressure is applied to the thermoplastic resin loaded between the first mold and the second mold, and the heat or the pressure is adjusted while adjusting the pressure or pressure and temperature. Transferring the shape of the fine irregularities of the second mold to a plastic resin, and molding a resin molded body;
By the treatment, the first mold or the second mold is opened perpendicularly with respect to the fine irregularities while the resin molded body is adhered to the first mold. The method for producing a resin molded body according to any one of claims 10 to 12, further comprising a step of selectively releasing the fine irregularities of the second mold.   The step of loading the thermoplastic resin between the first mold and the second mold is a process of applying the molten thermoplastic resin on the fine irregularities of the second mold while moving the discharge means. The method for producing a resin molded body according to claim 13. The mold is a mold used in a compression molding apparatus,
14. The step of loading a thermoplastic resin between the first mold and the second mold is a step of placing a molten or semi-molten thermoplastic resin in the mold. The manufacturing method of the resin molding of description. The mold is a mold used for a hot embossing device or a nanoimprinting device,
The step of loading a thermoplastic resin between the first mold and the second mold is a process of installing a film-like or plate-like thermoplastic resin in the mold. The manufacturing method of the resin molding of description. The mold is a mold used for injection molding,
The step of loading a thermoplastic resin into the mold and the step of transferring the shape of the fine irregularities of the mold to the thermoplastic resin and molding a resin molded body,
(1) injection-filling a molten thermoplastic resin into a completely closed mold;
Applying pressure to the thermoplastic resin injected and filled between the first mold and the second mold, and adjusting the pressure or pressure and temperature, the fine irregularities of the second mold on the thermoplastic resin A process of transferring the shape and molding a resin molded body, or
(2) a step of injecting and filling a molten thermoplastic resin into a mold that is slightly open and in a substantially closed state;
Applying pressure to the injection-filled thermoplastic resin by completely closing the first mold and the second mold in a substantially closed state, and adjusting the pressure or pressure and temperature to the thermoplastic resin The method for producing a resin molded body according to claim 13, which is a step of transferring the shape of the fine irregularities of the second mold and molding the resin molded body.   The process is not performed by opening the mold with the resin molded body attached to at least one mold part of the mold or the first mold that has been subjected to the process for improving the adhesion to the resin. After selectively releasing the resin molded body from the mold surface or the second mold, there is a step of releasing the resin molded body from at least one mold portion of the mold or the first mold. The manufacturing method of the resin molding in any one of Claims 1-17 characterized by the above-mentioned.   In the step of releasing the resin molded body from the at least one mold part of the mold or the first mold that has been subjected to the treatment for improving the adhesion to the resin, at least one mold part of the mold or The method for producing a resin molded body according to claim 18, wherein the first mold is cooled.   In the step of releasing the resin molded body from at least one mold part of the mold or the first mold subjected to the treatment for improving the adhesion to the resin, the resin molded body is used by using a non-contact conveying body. The method for producing a resin molded body according to claim 18 or 19, wherein the mold is released and conveyed to the outside of the mold.   The mold has a temperature control function, and the mold is heated and cooled when transferring the mold shape and releasing the resin molded body from the mold, respectively. The manufacturing method of the resin molding in any one of 1-20.   A resin molded article produced by the production method according to claim 1. An apparatus for manufacturing a resin molded body for carrying out the method for manufacturing a resin molded body according to claim 1,
The apparatus for producing a resin molded body includes a mold composed of a set of a first mold and a second mold that are arranged to face each other,
Temperature adjusting means for adjusting the temperature of at least the resin contact surface of the set of mold parts;
Driving means for performing opening / closing of the first mold and the second mold and pressurization of the thermoplastic resin between the first mold and the second mold;
A means for performing a treatment for increasing the adhesion of the mold to the thermoplastic resin,
Performing a process for increasing the adhesion with the thermoplastic resin on a part or the whole of the resin contact surface of the first type by means for performing the process for increasing the adhesion;
The thermoplastic resin is loaded into the first mold and the second mold or between the first mold and the second mold, and the first mold and the closed mold are closed by the temperature adjusting means and the driving means. While applying pressure between the second molds and adjusting the pressure or pressure and temperature, the mold shape was transferred to the thermoplastic resin to form a resin molded body, and then the treatment for improving the adhesion was performed. By releasing the mold while the resin molded body is attached to the first mold, the resin molded body is selectively released from the second mold that has not been subjected to the treatment for improving the adhesion, and then, An apparatus for producing a resin molded body, wherein the first mold to which the resin molded body is adhered is cooled and the resin molded body is released from the first mold. A resin molded body manufacturing apparatus for carrying out the method of manufacturing a resin molded body according to claim 10,
The apparatus for manufacturing a resin molded body includes a second mold in which a part or the whole of a resin contact surface is a fine uneven portion, and a mold composed of a first mold disposed to face the second mold.
Temperature adjusting means for adjusting the temperature of at least the resin contact surface of the set of mold parts;
Drive means for opening and closing the first mold and the second mold and pressurizing the thermoplastic resin between the first mold and the second mold;
Having a means for increasing the adhesion of the mold to the thermoplastic resin,
Performing a process for increasing the adhesion with the thermoplastic resin on a part or the whole of the resin contact surface of the first type by means for performing the process for increasing the adhesion;
The thermoplastic resin is loaded into the first mold and the second mold or between the first mold and the second mold, and the first mold and the closed mold are closed by the temperature adjusting means and the driving means. While applying pressure between the second molds and adjusting the pressure or pressure and temperature, the mold shape is transferred to the thermoplastic resin to form a resin molded body, and then the adhesion is increased. In addition, the resin molded body is selectively released from the fine uneven portions of the second mold that is not subjected to the treatment while the resin molded body is adhered to the first mold, and then the resin molded body The apparatus for producing a resin molded body is characterized in that the first mold to which is adhered is cooled and the resin molded body is released from the first mold.   The means for performing the treatment for enhancing the adhesion of the mold to the thermoplastic resin is a plasma discharge irradiation treatment apparatus usable under atmospheric pressure conditions, a corona discharge irradiation treatment apparatus usable under atmospheric pressure conditions, a low pressure mercury lamp, The apparatus for producing a resin molded body according to claim 23 or 24, wherein the apparatus is a xenon excimer lamp.

Images