JP2010194871A - Peeling jig, fine structure transfer molding apparatus, and method for peeling molded body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a peeling jig capable of efficiently peeling a molded body finished with transfer molding, from a stamper or/and a die associated with transfer molding, in a press-type fine structure transfer molding apparatus. <P>SOLUTION: The peeling jig 30 for the press-type fine structure transfer molding apparatus is provided for peeling the molded body 50 transfer-molded and held to an upper die 10, from the upper die 10. The peeling jig 30 includes a body 31; a moving means, a lifting means and an aligning means for the body 31; a seal ring 38 provided at the edge of the body 31 to form a closed space 55 for storing the molded body 50 between the body 31 and the lower face of the upper die 10; a pressurizing means for introducing a fluid into the closed space 55; and a suction means for sucking the edge 53 of the molded body 50 toward the body 31. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a press-type microstructure transfer molding apparatus and a method for peeling a transfer molded object, and in particular, to remove a transfer molded object from an upper or / and a lower stamper and out of a transfer molding work area. The present invention relates to a peeling jig that can be discharged to the surface, a press-type fine structure transfer molding apparatus using the jig, and a method for peeling a workpiece.

  2. Description of the Related Art A press-type microstructure transfer molding apparatus that transfers and forms a microstructure on a workpiece by cooperation of an upper mold and a lower mold has a high molding ability and is widely used. Such a press-type fine structure transfer molding apparatus is provided with a stamper in which a fine structure is engraved in an upper mold and / or a lower mold, and the fine structure inscribed in the stamper is transferred and molded on a workpiece. An optical element having a fine structure, a microchemical chip, and the like are manufactured from a thin plate-shaped object made of resin.

  In this press-type microstructure transfer molding apparatus, the molding is performed in a state where the molded body is heated to the glass transition temperature or higher, and then the transferred molded body is heated to a temperature lower than the glass transition temperature. It must be cooled and peeled off from the stamper. In this peeling, it is not easy for the molded body to adhere to the stamper and peel it off, and there is a problem of damage to the fine structure that occurs when the molded body is peeled from the stamper. Also, in order to easily peel them by reducing the adhesion between the molded body and the stamper, the mold temperature must be lowered to a temperature much lower than the glass transition temperature of the molded body, There is a problem that productivity becomes worse. In order to solve such a problem, various methods and apparatuses have been proposed.

  As one method, after attaching the object to be molded to an upper mold maintained at a temperature equal to or higher than its glass transition temperature and peeling from the lower mold, the upper mold is cooled to a low temperature close to room temperature, and the resin and upper mold are cooled. There is a method of peeling the object to be molded from the upper mold by reducing the adhesive force with the mold. This is a method utilizing the feature that the adhesion between the resin and the metal is high at a high temperature and the adhesion is small at a low temperature. As another method, the linear expansion coefficient of the resin is more than five times the linear expansion coefficient of a metal, quartz, or glass stamper. Therefore, when the mold temperature is cooled to a low temperature, the difference in thermal shrinkage between the resin and the stamper There is a method that utilizes the feature that it occurs and a gap is formed between the molded body and the mold, and as a result, the molded body can be easily peeled off from the mold.

  Further, in Patent Document 1, a cylindrical member (base material holder) that slides up and down on the outer peripheral portion of a stamper (molding tool) holding portion of an upper mold is provided, and after transfer molding, the lower mold is formed on the end surface of the cylindrical member. A stamping tool that lifts the upper mold while raising the upper mold in a state where the periphery of the molded body (base material) provided on the molded body holding part of the mold is pressed against the lower mold. An apparatus for separating a shaped base material from a substrate has been proposed. In addition, a seal ring is provided on the end surface of the cylindrical member, and the separation of the molding body from the stamper is promoted by introducing compressed air into a closed space formed by the stamper holding section, the molded body holding section, and the seal ring. An apparatus for separating a shaped base material from a stamping tool has been proposed.

  Patent Document 2 discloses a molded body that performs transfer molding on a resin layer provided on a stamper having fine irregularities on the surface between a stamper provided on a lower mold and a mirror surface provided on an upper mold. Manufacturing methods have been proposed. In this method of manufacturing a molded body, focusing on the fact that the magnitude of the adhesive force between the resin layer and the mirror surface of the upper mold or the stamper depends on the temperature difference between the upper mold and the lower mold, A resin layer formed by transfer molding with a predetermined temperature difference between the mold and the mold is attached to the mirror surface of the upper mold and separated from the stamper. Patent Document 3 proposes a method of manufacturing an optical article in which a local temperature difference is given to a joint portion between a mold and an optical component (molded body) to peel the optical component from the mold.

  In Patent Document 4, a substrate held on a base is transferred and molded by a mold provided in a press part, and then the edge of the substrate is fixed to the base by a suction force, and the press part is raised, and the substrate and the mold are fixed. A microstructure transfer molding apparatus has been proposed in which a substrate is deformed into a concave shape by an upward adhesive force generated between the substrate and the substrate, and the substrate is peeled off from the mold. There has also been proposed a microstructure transfer molding apparatus in which compressed air is blown from the air holes provided in the base to the central portion of the substrate, and the substrate is positively deformed into a concave shape and peeled off from the mold.

  Further, in Patent Document 5, a knockout pin that abuts an edge of a molded object and has an air outlet, and means for blowing air to the edge of the molded object, both in the press movable part and the press fixed part. There has been proposed a thermal transfer press molding apparatus having a thermal transfer press molding apparatus that can peel off a molding object transferred and molded by a stamper provided in a press movable part and a press fixed part from the stamper.

Special Table 2002-509499 JP 2008-265001 A JP 2002-59440 JP JP 2007-83626 JP 2008-254353 A

  However, when the mold temperature is cooled to a temperature much lower than the glass transition temperature of the resin, there is a problem that the productivity is lowered and the microstructure is damaged. In other words, the linear expansion coefficient of the resin is more than five times that of a metal, quartz or glass stamper, so if the mold is cooled to a very low temperature, it is caused by the difference in mold temperature during pressure transfer and peeling. The difference in the amount of thermal shrinkage between the resin and the stamper becomes large, and a force that deforms the fine irregularities of the stamper in the surface direction is generated. As a result, there is a problem that damage such as breakage, burrs, and deformation occurs in the microstructure of the molded body.

  In addition, the microstructure transfer molding apparatus proposed in Patent Documents 1 to 3 can peel off a transfer molded object from a stamper related to the transfer molding, but the object to be molded is opposed to the stamper. If it remains attached to the mold (or upper mold) and the object to be molded is peeled off from the lower mold (or upper mold) and not discharged outside the transfer molding work area, the next manufacturing cycle should be performed. Have the problem of not being able to.

  The fine structure transfer molding apparatus proposed in Patent Document 5 uses air to peel the object to be molded from the stamper, but mechanically peels the object to be molded from the stamper using a knockout pin. The thin or soft molded object (for example, a film-shaped molded article having a thickness of 50 μm to 300 μm or a molded article that has not been cooled so much from the transfer molding temperature) is peeled off. Is not easy, and there is a problem that the fine structure transferred and molded on the workpiece is easily damaged.

  Further, in the microstructure transfer molding apparatus proposed in Patent Documents 1, 4, and 5, holes for supplying compressed air or evacuation, or knockout pins are put in and out of the contact surface of the molded object to be molded. Therefore, there is a problem in that it cannot be used in a microstructure transfer molding apparatus that performs transfer molding on a molded object in which a melted resin is poured onto a stamper and solidified.

  In view of the problems of the prior art, the present invention can use a molten or solid resin as a molded object for transfer molding, and the molded object after transfer molding is used as a stamper for transfer molding. Also, there is no need to lower the mold temperature as in the past to peel from the mold, and there is no fine structure on both the upper mold side and the lower mold side without damaging the fine structure of the thin or soft workpiece. It is an object of the present invention to provide a peeling jig that can easily peel off a molded body from both sides, and can efficiently eject the molded body that has been transfer-molded out of a transfer molding work area. And It is another object of the present invention to provide a press-type microstructure transfer molding apparatus having such a peeling jig and a method for peeling a molded body.

  A peeling jig according to the present invention is a peeling jig of a press-type microstructure transfer molding apparatus that peels off a molding object that has been molded and held in an upper mold from the upper mold, and a main body, A moving means, an elevating means and an alignment means for the main body, and a seal provided at an edge of the main body and forming a closed space in which the object to be molded is accommodated between the main body and the lower surface of the upper mold A pressure means for introducing a fluid into the closed space; and a suction means for sucking an edge of the molded body toward the main body.

  In the above invention, it is preferable that the molded object holding portion of the upper mold is held in a state where the edge of the molded object protrudes. Further, the main body of the peeling jig has a stepped portion on which an edge of the molded body is placed, and a hole portion for preventing the central portion of the transfer molding from contacting the main body. Is good.

  A press-type microstructure transfer molding apparatus that can efficiently perform transfer molding using the peeling jig according to the invention can be configured. That is, the press-type microstructure transfer molding apparatus includes the peeling jig, a lower mold having a temperature adjusting means, an upper mold having a temperature adjusting means that moves up and down to face the lower mold. And a stamper provided on the lower mold and / or the upper mold.

  A method for peeling a molded body according to the present invention is a method of peeling a molded body that is transferred and molded and held on an upper mold from the upper mold in a press-type microstructure transfer molding apparatus. The edge of the object to be molded is held in a freely supported state by the upper mold and opened from the lower mold together with the upper mold; Forming a closed space in which the molded body is accommodated, and causing a slight deflection in a direction of peeling from the upper mold at the edge of the molded body in a free-supporting state, and in the closed space Pressurizing, forming the gap between the upper mold and the molded body by applying the applied pressure in the direction in which the slight deflection expands, and peeling the molded body from the upper mold Can be carried out by a method comprising:

  In the invention of the method for peeling off the molded body, a method of causing the slight deflection generated at the edge of the molded body by sucking the edge of the molded body can be used. Further, the slight bending caused at the edge of the molded body is a method of fixing the edge of the molded body and raising the upper mold relative to the fixing point, or the fixing point. In contrast, it is possible to use a method in which the peeling jig is moved down relative to the bottom.

  The pressurization in the closed space can be performed by introducing air, water vapor or inert gas into the closed space. The applied pressure in the closed space is preferably 0.1 to 1.0 MPa.

  Further, when the upper mold is opened from the lower mold after the molding of the molded body, the upper body and the lower mold are adjusted to adjust the mold temperature between the upper mold and the upper mold. It should be held in the mold. The said to-be-molded body can use that whose thickness is 50 micrometers-3 mm.

  The peeling jig or the method for peeling a molded body according to the present invention can be used in a press-type fine structure transfer molding apparatus that uses a molten or solid resin as a molded body for transfer molding. In a press-type microstructure transfer molding apparatus using this peeling jig, the mold temperature is lowered as much as conventionally in order to peel the molded object after the transfer molding from the stamper and / or the mold related to the transfer molding. Since there is no need, productivity can be increased, and even a stamper having a microstructure on both the upper mold side and the lower mold side can be easily obtained without damaging the transferred microstructure. Thus, the molded body can be peeled off, and the molded body that has been efficiently transferred and molded can be discharged out of the transfer molding work area.

It is a partial cross section figure which shows the main components of the press type fine structure transfer molding apparatus which concerns on this invention. It is sectional drawing which shows the state where closed space was formed by the main body of a peeling jig, the lower surface of an upper metal mold | die, and a seal ring when the peeling jig | tool which concerns on this invention moved out to the upper metal mold | die lower surface. It is sectional drawing which shows operation | movement of the fine transfer molding apparatus and peeling jig | tool which concern on this invention. It is sectional drawing which shows operation | movement of the fine transfer molding apparatus and peeling jig | tool which concern on this invention. It is sectional drawing which shows operation | movement of the fine transfer molding apparatus and peeling jig | tool which concern on this invention. It is sectional drawing which shows operation | movement of the fine transfer molding apparatus and peeling jig | tool which concern on this invention. It is sectional drawing which shows operation | movement of the fine transfer molding apparatus and peeling jig | tool which concern on this invention. It is sectional drawing which shows operation | movement of the fine transfer molding apparatus and peeling jig | tool which concern on this invention.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing the main components of a press-type microstructure transfer molding apparatus according to the present invention. FIG. 2 shows a state in which the peeling jig 30 according to the present invention is inserted into the lower surface of the upper mold of the microstructure transfer molding apparatus shown in FIG. 1, and a closed space is formed by the main body, the lower surface of the upper mold and the seal ring. FIG.

  The peeling jig according to the present invention is a jig used in a press-type fine structure transfer molding apparatus, and is a jig for peeling a molded object held in an upper mold after transfer molding from the upper mold. . That is, as shown in FIG. 1, the peeling jig 30 is a press-type fine structure transfer for producing a molded body 50 having a fine structure on the surface by the cooperation of the upper mold 10 and the lower mold 20. After the upper mold 10 used for the molding apparatus and holding the molded object 50 after the transfer molding is opened from the lower mold 20, the main body 31 of the peeling jig 30 is moved below the upper mold 10. As shown in FIG. 2, the main body 31 is used by being mounted on the lower surface of the upper mold 10. Thereby, the molded object 50 held by the upper mold 10 can be effectively peeled from the upper mold 10, and the peeled molded object 50 can be discharged out of the transfer molding work area.

  The peeling jig 30 includes a main body 31, moving means for moving the main body 31 below the upper mold 10 and mounting it on the lower surface of the upper mold 10, lifting means and positioning means (both not shown) A seal ring 38 which is provided at an edge of the main body 31 and forms a closed space 55 in which the molded body 50 is accommodated between the main body 31 and the lower surface of the upper mold 10, and a fluid is supplied to the closed space 55. A pressurizing means (not shown) to be introduced, and a suction means (not shown) for sucking the edge 53 of the molded body 50 toward the main body 31 are provided.

  The main body 31 is held by a holding frame 61 provided with a moving means, an elevating means, and an alignment means, and as shown in FIG. 2, a step 35 on which an edge 53 of the molded body 50 is placed. In addition, a hole 36 is provided so that the surface formed by transfer molding does not come into contact with the main body 31 and is damaged even if the molded body 50 is bent. The step portion 35 is provided with a buffer member 37 so that the suction force is not reduced by sucking the gas outside the edge portion 53 when the edge portion 53 of the molded body 50 is vacuum-sucked from the suction hole 33. And seal it.

  A suction hole 33 is opened in the step portion 35, and the suction hole 33 communicates with suction means such as a vacuum device through a pipe 43. As a result, the edge 53 of the molded body 50 is sucked, and the edge 53 of the molded body 50 can be slightly bent in the direction in which the molded body 50 is peeled from the lower mold 10. It should be noted that the suction ports 33 are preferably provided at a plurality of locations, and are preferably provided around the edge portion 53 of the molded body 50 so as to meet the interval.

  A supply hole 34 is opened in the main body 31. The supply hole 34 communicates with a pressurizing means such as a compressor through a pipe 44. As a result, fluid such as air, water vapor, or inert gas can be introduced into the closed space 55 to pressurize the closed space 55. The applied pressure is preferably 0.1 to 1.0 MPa. The supply holes 44 can be provided at a plurality of locations.

  The seal ring 38 only needs to be suitable for maintaining the pressure in the closed space 55. Moreover, what is necessary is just to be suitable for pressurized media, such as air, water vapor | steam, or an inert gas. The height of the seal ring 38 must be such that the closed space 55 can be formed by contacting the lower surface of the upper mold 10 in a state where the edge 53 of the molded body 50 is in contact with the buffer member 37 of the stepped portion 35. In order to ensure contact with the lower surface of the upper mold 10 in accordance with the thickness change of the molded body 50, the seal ring 38 is elastically deformable or has a vertical movement mechanism by a spring, a vertical movement mechanism by an actuator, etc. It is desirable to be.

  The upper mold 10 moves up and down to face the lower mold 20. As the upper mold 10, a known one can be used. However, as shown in FIG. 1, the molded body holding portion of the upper mold 10 that holds the molded body 50 is held with the end portion 53 of the molded body 50 protruding. Is good. Thus, the suction means can effectively cause the edge 53 of the molded body 50 to be slightly bent in the direction in which the molded body 50 is peeled from the upper mold 10. 1 shows an example in which the holding member 15 is used as the molded object holding portion of the upper mold 10; however, the molded object holding portion has fine irregularities for performing transfer molding on the molded object 50. It may be a stamper having

  Further, the upper mold 10 preferably has a temperature adjusting means capable of adjusting the temperature of the upper mold 10. Thus, the temperature dependence of the adhesive force with the mold of the molded body 50 is utilized, and the molded body 50 is held by the upper mold 10 when the upper mold 10 is opened from the lower mold. Therefore, the structure of the peeling jig 30 can be simplified.

  As the lower mold 20, a known one can be used, but, like the upper mold 10, it is preferable to have a temperature adjusting means capable of adjusting the temperature of the lower mold 20. In the case of this example, as shown in FIG. 1, the stamper 25 having fine irregularities is provided only in the lower mold 20, but the peeling jig 30 has a stamper having fine irregularities as the upper mold. 10 can also be used when the fine structure is transferred and molded on the front and back surfaces of the molded body 50.

  A known material can be used for the molded body 50. As an example, all kinds of thermoplastic resins such as methacrylic resin, polycarbonate resin, cyclic polyolefin resin, polystyrene resin, polyethylene terephthalate resin, polyethylene naphthalate resin, polyacetal resin, polyethylene resin, and polypropylene resin can be used. However, in the present invention, even if it is a solid molded object 50 from the beginning, it may be used even if it is a molded object 50 that is solidified by applying or injecting a molten resin onto the stamper 25. Can do. Moreover, the to-be-molded body 50 can have a thickness of 50 μm to 3 mm.

  In the peeling jig 30 according to the present invention, the moving means and the lifting means are not particularly limited. Further, the positioning means is not particularly limited. Any material can be used as long as the main body 31 can be mounted at a predetermined position and can be controlled so that the molded body 50 peeled from the upper mold 10 can be discharged out of a predetermined transfer molding work area. The lifting means presses the buffer member 37 upward against the molded body 50, presses the seal ring 38 upward against the lower surface of the upper mold 10, and adsorbs the molded body 50 at the portion of the buffer member 37. After that, it only needs to have an action of pulling down the molded body 50 downward. The moving means moves and positions the mold release jig 30 and the lifting / lowering means directly under the molding target 50, and after peeling the molding target 50 from the upper mold 10, these are moved to the upper mold 10 and the lower mold. What is necessary is just to move out of the vertical movement range of the mold 20. As an example, this can be implemented by mounting the release tool 30 on a pneumatic cylinder that can be raised and lowered, and mounting the pneumatic cylinder on a linear actuator that can be moved back and forth and aligned. Further, if the release tool 30 is attached to the arm of an articulated robot, the lifting, back-and-forth movement, and positioning can be performed with a single drive mechanism.

  The configuration of the peeling jig 30 according to the present invention has been described above. The peeling jig 30 is used as follows. After the upper mold 10 and the lower mold 20 are closed and the molded object 50 is transferred and molded at a temperature higher than the glass transition temperature, the process proceeds to cooling. At that time, when the temperature of the upper mold 10 and the lower mold 20 reaches the highest possible temperature at which the workpiece 50 adheres to the upper mold 10 and can be peeled off from the lower mold 20 at the same time, the upper mold 10 open. As a result, the molding object 50 can be held by the upper mold 10 by utilizing the difference in adhesive strength of the molding object 50. In general, a method using such a temperature difference between molds often sets the temperature of the upper mold 10 to be higher than that of the lower mold 20. In the case of the molded body 50 in which the microstructure is transferred and molded on the front and back surfaces, the molded body 50 is held by the upper mold 10 by utilizing the difference in the adhesive force of the molded body 50 due to the microstructure. You can also make it.

  Next, the main body 31 of the peeling jig 30 is moved below the upper mold 10, the main body 31 is mounted on the lower surface of the upper mold 10, and the main body 31 is raised as shown in FIG. The seal ring 38 is pressed against the lower surface of the upper mold 10 to form a closed space 55. Next, as shown in FIG. 3, the peeling jig 30 is further raised, and the buffer member 37 provided on the surface of the stepped portion 35 is brought into close contact with the edge portion 53 of the molded body 50. Next, as shown in FIG. 4, the edge portion 53 of the molded body 50 is sucked by the suction means. After the edge portion 53 of the molding 50 is reliably sucked, the peeling jig 30 is lowered downward while maintaining the contact between the seal ring 38 and the lower surface of the upper mold 10 as shown in FIG. Then, the inside of the closed space 55 is pressurized to 0.1 to 1.0 MPa by the pressurizing means.

  Then, as shown in FIG. 6, the edge portion 53 of the molded body 50 is bent downward while being fixed to the buffer member 37 on the step portion 35 by the suction means, and the inside of the closed space 55 is pressurized. Since the pressure is applied by the medium, a fine gap is formed between the edge 53 of the molded body and the holding member 15, and the pressure medium enters the gap. Then, the gap between the edge 53 of the molded body and the holding member 15 gradually increases, and the molded body 50 is gradually peeled from the holding member 15.

  Finally, as shown in FIG. 7, the molded body 50 is completely peeled from the holding member 15. Until the molded body 50 is completely peeled from the holding member 15, the seal ring 38 is kept in contact with the lower surface of the upper mold 10 so that the pressurized medium does not leak to the outside of the seal ring 38. I must.

  Finally, as shown in FIG. 8, the seal ring 38 is separated from the lower surface of the upper mold 10 and the pressurized medium is released into the atmosphere. On the other hand, the edge 58 of the molded body 50 is still sucked at the site of the buffer member 37, and the molded body 50 falls until the peeling jig 30 is moved out of the vertical movement range of the upper mold 10. And is kept so as not to deviate.

  As described above, since the edge 53 of the molded body 50 is in a free support state, the molded body 50 is attached to the edge 53 of the molded body 50 by suction at the portion of the buffer member 37. A slight strain that can be easily peeled off from the mold 10 can be generated. That is, by generating a local slight distortion on the entire circumference of the edge 53 of the molded body 50, the peeling easily proceeds from the entire circumference of the edge 53 of the molded body 50.

  The suction is performed in a state where the edge 53 of the molded body 50 is fixed to the buffer member 37. Then, the peeling jig is lowered or the upper mold 10 is raised. Thereby, slight bending can be caused in the edge 53 of the molded body 50.

  The pressurization is usually performed using air. When slight peeling occurs at the edge 53 of the molded body 50, the peeling portion can be enlarged by the applied pressure, and the peeling from the upper mold 10 of the molded body 50 can be promoted. In addition to air, water vapor and inert gas can be used to cause slight distortion in the edge portion 53 and promote peeling.

  Even after the workpiece 50 is peeled from the upper mold 10, the suction of the edge 53 is continued, and the edge 53 is maintained in a state of being fixed to the main body 31. As a result, it is possible to suppress bending of the peeled molded body 50 and to prevent damage to the transferred microstructure.

  Next, the peeled molded body 50 is discharged out of the transfer molding work area. Then, the peeling jig 30 is retracted to the original predetermined position, and one cycle of transfer molding is completed.

  The present invention has been described above. The peeling jig according to the present invention is not limited to the embodiment described above. In the microstructure transfer molding apparatus of the type that causes slight distortion in the edge 53 of the molded body 50 by fixing the edge 53 of the molded body 50 to the stepped portion 35 and raising the upper mold 10. In order to fix the edge 53 of the molded body 50 to the stepped portion 35, for example, an adhesive whose adhesive force depends on the temperature of the main body 31 can be used.

  Examples of the present invention will be described below. Using a resin material (methacrylic resin Kuraray Parapet GH1000S) as the molding, attach the transfer molded article to the upper mold and open the upper mold from the lower mold. A peeling test for peeling from the mold was performed, and a peeling temperature at which the molded body could be peeled from the upper mold was determined. The upper mold had a size of 102 × 102 mm, and the surface of the holding member 15 was a mirror surface. As the lower mold stamper, one having fine irregularities with a width and a depth of 100 to 200 nm formed on the surface was used. Three types of workpieces having a width × length (102 × 102 mm) and a thickness of 100 μm, 300 μm, and 500 μm were used. The transfer molding temperature was 150 ° C. for the upper mold and 150 ° C. for the lower mold, and the temperatures for starting the mold opening were 110 ° C. for the upper mold and 95 ° C. for the lower mold. The transfer molding pressure was 9 MPa.

  The peeling temperature at which the molded body is peeled from the upper mold is as shown in Table 1, and the effectiveness of the peeling jig of the present invention was confirmed. The details of each method shown in Table 1 are as follows. That is, (1) When manually peeling from the upper mold, peeling was not possible if the upper mold remained at 110 ° C. When the upper mold was water-cooled to 40 ° C., the molded object could be peeled from the upper mold manually. Then, (2) when using only the suction of the peeling jig and peeling without using pressure, peeling was not possible with the upper mold still at 110 ° C. When the upper mold was water-cooled to 70 ° C., the edge of the molded body was adsorbed by the peeling jig, and the peeling jig was pulled down to peel the molded body.

  In addition, (3) using the peeling jig suction and pressurization, but without forming a closed space with the seal ring, the applied pressure leaks into the atmosphere, and the applied pressure peels off the workpiece If the upper mold did not work sufficiently, it could not be peeled off if the upper mold remained at 110 ° C. When the upper mold was water-cooled to 90 ° C., the molded object could be peeled from the upper mold. This test was a condition in which pressurized air leaks into the atmosphere without using a seal ring, but because the pressurized air has the effect of cooling the mold from the edge of the molded body, the above (2) Compared with the case of this, it is thought that the to-be-molded body was able to be peeled in the state whose upper mold was higher temperature.

  In contrast to the above method, (4) using a peeling jig suction and pressurization, forming a closed space in the seal ring, and peeling so that the pressurized air does not leak to the atmosphere through the seal ring In this case, the upper mold could be peeled off at 110 ° C. Furthermore, even if the upper mold was 140 ° C., peeling was possible. In addition, in the case of 140 degreeC, a to-be-molded body deform | transformed after peeling, but it is thought that this is because the to-be-molded body was peeled from the upper mold at a temperature higher than the thermal deformation temperature of the methacrylic resin.

10 Upper mold
15 Holding member
20 Lower mold
25 Stamper
30 Peeling jig
31 body
32 steps
33 Suction hole
34 Supply hole
35 steps
36 holes
37 Buffer member
38 Seal ring
43 Piping
44 Piping
50 Molded body
53 Edge
55 enclosed space
61 Holding frame

Claims (12)

A peeling jig of a press-type microstructure transfer molding device that peels off a molded object that has been transferred and held in an upper mold from the upper mold,
The body,
Means for moving the body, lifting means and positioning means;
A seal ring which is provided at an edge of the main body and forms a closed space in which the molded body is accommodated between the main body and the lower surface of the upper mold;
Pressurizing means for introducing a fluid into the enclosed space;
A peeling jig comprising suction means for sucking an edge of the molded body in the body direction.   The peeling jig according to claim 1, wherein the molded body holding portion of the upper mold is held in a state in which an edge of the molded body protrudes.   The main body includes a step portion on which an edge portion of the molded body is placed, and a hole portion for preventing a central portion of the transfer-molded portion from coming into contact with the main body. Item 3. The peeling jig according to Item 1 or 2. The peeling jig according to any one of claims 1 to 3,
A lower mold having a temperature adjusting means;
An upper mold that moves up and down to face the lower mold and has temperature adjusting means;
A press-type microstructure transfer molding apparatus having a stamper provided on the lower mold and / or the upper mold. In a press-type fine structure transfer molding apparatus, a method for peeling a molded body that is transferred and molded and held on an upper mold from the upper mold,
A step of opening the object to be molded from the lower mold together with the upper mold while the edge of the upper mold is held in a freely supported state;
Forming a closed space in which the molding target is accommodated on the lower surface of the upper mold,
A step of causing a slight deflection in a direction of peeling from the upper mold at the edge of the molded body, and pressurizing the closed space;
A step of enlarging a gap between the upper mold and the molded body by applying the pressing force in a direction in which the minute deflection is expanded;
A step of peeling the molded body from the upper mold.   6. The method for peeling a molded body according to claim 5, wherein the slight deflection generated at the edge of the molded body is generated by sucking the edge of the molded body.   The slight deflection generated at the edge of the molded body is caused by fixing the edge of the molded body and raising the upper mold relative to the fixing point. 5. A method for peeling a molded body according to 5.   The slight deflection caused at the edge of the molded body is generated by fixing the edge of the molded body and lowering the peeling jig relative to the fixing point. 5. A method for peeling a molded body according to 5.   The method for peeling a molded body according to any one of claims 5 to 8, wherein the pressurization in the closed space is performed by introducing air, water vapor, or an inert gas into the closed space.   The method of peeling a molded body according to any one of claims 5 to 9, wherein the pressure in the closed space is 0.1 to 1.0 MPa.   When the upper mold is opened from the lower mold after the molding of the molded body, the upper mold is adjusted by adjusting the mold temperature between the upper mold and the lower mold. The method for peeling a molded body according to any one of claims 5 to 10, characterized in that the molded body is held on the surface.   The method for peeling a molded body according to claim 5, wherein the molded body has a thickness of 50 μm to 3 mm.

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