JP6187009B2 - Fine through-hole molding apparatus and method for manufacturing fine through-hole molded product - Google Patents

Description

  The present invention relates to a back sheet used in a fine through-hole forming apparatus, a fine through-hole forming apparatus for forming a large number of fine through-holes in a synthetic resin base material sheet, and a large number of fine through-holes using the fine through-hole forming apparatus. The present invention relates to a method for producing a fine through-hole molded article for producing a fine through-hole molded article having holes, and a fine through-hole molded article and a mist forming filter produced by such a method for producing a fine through-hole molded article.

  Conventionally, many fine through holes are formed in a metal sheet. In this case, it is common to first pattern a predetermined pattern on a metal sheet by photolithography, and then perform chemical etching or dry etching on this to form a large number of through holes. There is also a method of making a through hole with a laser beam, an electron beam, or a neutron beam.

  However, when such a method is used, it is difficult to freely set the shape of the fine through-hole according to the functional application due to processing restrictions. Moreover, the sheet | seat used as object is restricted to glass, a semiconductor, a metal, etc. Furthermore, since there are many processes for forming a through-hole, it is necessary to use many manufacturing apparatuses (for example, Unexamined-Japanese-Patent No. 5-28912).

  On the other hand, when a large number of fine (for example, diameter of 100 μm or less) through-holes are to be formed in a synthetic resin sheet, a nanoimprint technique (a technique for transferring fine irregularities formed on a mold onto a resin material) is used. It can also be used. However, when the nanoimprint technique is used, fine unevenness can be formed on the surface of the resin material, but a through-hole penetrating the resin material cannot be formed.

  Moreover, when forming many fine through-holes in a synthetic resin sheet, it is also conceivable to use an injection molding method. However, in this case, the molten resin does not flow well in the mold, and fine through holes cannot be formed. Furthermore, even if the compression molding method is used, it is not possible to form fine through holes in the same manner. As described above, it is not easy to form a large number of fine through holes in a synthetic resin sheet.

  By the way, this applicant forms many fine through-holes in the base material sheet | seat which consists of a synthetic resin using the ultrasonic shaping | molding die which has a protruding part which ultrasonically vibrates in Unexamined-Japanese-Patent No. 2010-137313. Has proposed.

Japanese Patent Laid-Open No. 5-28912 JP 2010-137313 A

  The fine through-hole forming apparatus proposed in Japanese Patent Application Laid-Open No. 2010-137313 makes the ultrasonic vibration vibrate contact with a base material sheet made of a synthetic resin, thereby converting the energy of ultrasonic vibration into thermal energy. The base sheet is melted locally, and the shape of the protruding portion is formed on the base sheet, thereby forming a large number of fine through holes in the base sheet. However, when the base sheet is not firmly fixed to the back sheet, it may be difficult to transport the manufactured fine through-hole molded product. Further, the vibration from the protruding portion of the ultrasonic molding die may cause wear of the cradle and the protruding portion of the ultrasonic forming die after repeated molding.

  The present invention has been made in consideration of such points, and can absorb vibrations from the protruding portion of the ultrasonic molding die, and can transport the fine through-hole molded product and the back sheet in an integrated manner. An object of the present invention is to provide a back sheet, a fine through-hole molding device, a method for producing a fine through-hole molded product, a fine through-hole molded product and a mist-forming filter produced by the method.

  A back sheet according to an embodiment of the present invention includes a cradle, a back sheet that is held on the cradle and supports a base sheet made of a synthetic resin, and is disposed above the back sheet. An ultrasonic molding die having a convex portion, the ultrasonic molding die is movable in the vertical direction, and the protruding portion is ultrasonically vibrated between the protruding portion of the ultrasonic molding die and the cradle. With the base sheet and the back sheet sandwiched between, the ultrasonic molding of the projection of the ultrasonic mold is ultrasonically heated to penetrate the base sheet through the projection. A back sheet used in a fine through-hole forming apparatus that forms a large number of fine through-holes in a material sheet, comprising a heat-resistant layer and an adhesive layer that is provided on the heat-resistant layer and adheres to the base sheet. It is a feature.

  In the back sheet according to one embodiment of the present invention, the pressure-sensitive adhesive layer may have higher heat resistance than the base material sheet and may have lower rigidity than the base material sheet and the heat resistant layer.

  In the back sheet according to the embodiment of the present invention, the adhesive layer may be made of a silicone resin containing silicon rubber or polydimethylsiloxane.

  In the backsheet according to the embodiment of the present invention, the heat-resistant layer may include polyimide, polytetrafluoroethylene (PTFE), or heat-resistant plastic.

  In the back sheet according to the embodiment of the present invention, the adhesive layer may have a thickness of 2 μm to 10 μm.

  A fine through-hole molding apparatus according to an embodiment of the present invention includes a cradle, a back sheet that is held on the cradle and supports a base sheet made of synthetic resin, and is disposed above the back sheet, and is provided at a lower portion. An ultrasonic mold having a large number of protruding portions, the ultrasonic forming die is movable in the vertical direction, and the protruding portions are ultrasonically vibrated, and the protruding portions and the cradle of the ultrasonic forming die In a state where the base sheet and the back sheet are sandwiched between, the base sheet is ultrasonically vibrated by ultrasonically vibrating the protruding portion of the ultrasonic mold, and the base sheet is penetrated by the protruding portion. A large number of fine through holes are formed in the base sheet, and the back sheet has a heat resistant layer and an adhesive layer provided on the heat resistant layer and adhered to the base sheet.

  In the fine through-hole forming device according to one embodiment of the present invention, the pressure-sensitive adhesive layer may have higher heat resistance than the base sheet, and may have lower rigidity than the base sheet and the heat-resistant layer.

  In the fine through-hole molding apparatus according to one embodiment of the present invention, the adhesive layer may be made of a silicone resin containing silicon rubber or polydimethylsiloxane.

  In the fine through-hole forming apparatus according to the embodiment of the present invention, the heat-resistant layer may include polyimide, polytetrafluoroethylene (PTFE), or heat-resistant plastic.

  In the fine through-hole forming apparatus according to the embodiment of the present invention, the thickness of the adhesive layer may be 2 μm to 10 μm.

  Moreover, the manufacturing method of the fine through-hole molded product by one Embodiment of this invention is a method of manufacturing a fine through-hole molded product using a fine through-hole molding apparatus, Comprising: A back sheet is hold | maintained on a receiving stand In addition, the step of adhering the adhesive layer of the back sheet to the base material sheet made of synthetic resin, the ultrasonic molding die that is arranged in advance above the back sheet and has a large number of protrusions on the lower part, is lowered, Ultrasonic forming, a step of contacting the protruding portion that is oscillated with sound waves to the base sheet, ultrasonic heating the base sheet, and softening or melting the portion of the base sheet that is in contact with the protruding portion. The mold is further lowered to sandwich the softened or melted base sheet and back sheet between the protruding part of the ultrasonic mold and the cradle. In this state, the protruding part of the ultrasonic forming mold is Ultrasonic vibration to heat the substrate sheet with ultrasonic vibration, Forming a large number of fine through holes in the base sheet by penetrating the base sheet by the shape part, and producing a fine through hole molded product, and the fine through holes adhered to the back sheet and the back sheet from the cradle The method includes a step of removing the molded product as a unit, and a step of peeling from the backsheet the fine through-hole molded product adhered to the adhesive layer of the backsheet.

  In the method for manufacturing a fine through-hole molded product according to an embodiment of the present invention, the ultrasonic molding die may be lowered so that a load weight is applied when the protruding portion penetrates into the base sheet.

  In the method for manufacturing a fine through-hole molded product according to an embodiment of the present invention, when the ultrasonic mold is lowered and the tip of the projection reaches the lowest position, the tip of the projection is the adhesive layer of the back sheet You may stay inside.

  In the method for manufacturing a fine through-hole molded article according to an embodiment of the present invention, in the step of forming the fine through-hole, gradually until the protrusion reaches the adhesive layer of the back sheet after contacting the base sheet. The ultrasonic molding die may be damped and vibrated so that the amplitude decreases, and the ultrasonic vibration may be stopped when the protruding portion reaches the adhesive layer of the back sheet.

  The fine through-hole molded product according to one embodiment of the present invention is obtained by a method for manufacturing a fine through-hole molded product.

  Furthermore, the mist forming filter according to one embodiment of the present invention is a mist forming filter in which a large number of fine through holes are formed in a synthetic resin base material sheet, and the mist forming filter is a fine through hole. The diameter of the through hole is different between the front and back surfaces of the base sheet, the diameter of one surface is 1 to 10 μm, and the diameter of the other surface is 20 to 80 μm.

  According to the present invention, the back sheet used in the fine through-hole forming apparatus includes a heat-resistant layer and an adhesive layer that is provided on the heat-resistant layer and adheres to the base sheet. Thereby, the adhesive layer of the back sheet can absorb vibration from the protruding portion of the ultrasonic forming die, and wear of the receiving portion and the protruding portion of the ultrasonic forming die can be prevented. Further, since the base sheet is adhered to the back sheet, the fine through-hole molded product and the back sheet can be integrated and conveyed.

The schematic front view which shows the fine through-hole shaping | molding apparatus by one embodiment of this invention. The expanded schematic sectional drawing which expanded a part of fine through-hole shaping | molding apparatus of FIG. The front view which shows the ultrasonic shaping | molding die of the fine through-hole shaping | molding apparatus by one embodiment of this invention. The bottom view which shows the ultrasonic shaping | molding die of the fine through-hole shaping | molding apparatus by one embodiment of this invention (IV direction arrow line view of FIG. 3). FIG. 5 is a vertical cross-sectional view (cross-sectional view taken along line VV in FIG. 4) illustrating an ultrasonic forming die of the fine through-hole forming apparatus according to the embodiment of the present invention. The schematic perspective view which shows the method of producing the ultrasonic shaping | molding die of the fine through-hole shaping | molding apparatus by one embodiment of this invention. The schematic sectional drawing which shows the method of producing the ultrasonic shaping | molding die of the fine through-hole shaping | molding apparatus by one embodiment of this invention. Schematic which shows the manufacturing method of the fine through-hole molded article by one embodiment of this invention. The expanded schematic sectional drawing which shows the manufacturing method of the fine through-hole molded article by one embodiment of this invention. The figure which shows the behavior of the front-end | tip part of an ultrasonic shaping | molding die in the manufacturing method of the fine through-hole molded article by one embodiment of this invention. The top view which shows the fine through-hole molded article by one embodiment of this invention. The vertical sectional view which shows the fine through-hole molded article by one embodiment of this invention (XII-XII sectional view taken on the line of FIG. 11). The expanded schematic sectional drawing which expanded a part of mist generator by one embodiment of this invention.

  Embodiments of the present invention will be described below with reference to the drawings. 1 to 13 are views showing an embodiment of the present invention.

<Back sheet and fine through-hole forming device>
First, the configuration of the back sheet and the fine through-hole forming apparatus according to the present embodiment will be described with reference to FIGS.

  As shown in FIG. 1, a fine through-hole forming apparatus 10 includes a fixed cradle 11 and a back sheet 12 that is held on the cradle 11 and has a heat resistance and supports a base sheet 20 made of synthetic resin. And.

  The upper surface of the cradle 11 can be heated to a desired temperature by the temperature control device 16, and the base sheet 20 can be heated via the back sheet 12.

  Of these, the back sheet 12 has a multilayer structure, and includes a heat-resistant layer 12b positioned on the cradle 11 side, and an adhesive layer 12c provided on the heat-resistant layer 12b and adhered to the base sheet 20. . In this case, the pressure-sensitive adhesive layer 12c is provided over the entire surface of the heat-resistant layer 12b. That is, the planar shapes of the heat-resistant layer 12b and the pressure-sensitive adhesive layer 12c are the same as each other, but are not limited thereto. For example, the adhesive layer 12c may be provided only around the area corresponding to each protrusion 31 (described later) on the surface of the heat-resistant layer 12b. Further, the back sheet 12 is configured to be larger than the base sheet 20 as viewed from above. In this Embodiment, the back sheet 12 provided with such a heat-resistant layer 12b and the adhesion layer 12c is also provided.

  The heat-resistant layer 12b has heat resistance (melting temperature is, for example, 250 ° C. or higher), vibration absorption that absorbs vibration by elastic deformation, and springback that generates contact pressure against the penetration pressure. Is preferred. As such a heat-resistant layer 12b, for example, a sheet of polyimide, polytetrafluoroethylene (PTFE), a sheet of heat-resistant plastic, or a combination of these layers can be used.

  The thickness of the heat-resistant layer 12b is preferably 5 μm to 0.5 mm. By setting the thickness of the heat-resistant layer 12b to 5 μm or more, vibration from a protruding portion 31 (described later) of the ultrasonic molding die 30 can be effectively absorbed, and the protrusion of the cradle 11 and the ultrasonic molding die 30 can be absorbed. The wear of the shaped portion 31 can be prevented. In addition, after removing the back sheet 12 and the fine through-hole molded product 40 from the cradle 11, it becomes easy to integrally transport the fine through-hole molded product 40 and the back sheet (FIG. 8E described later). reference). On the other hand, by setting the thickness of the heat-resistant layer 12b to 0.5 mm or less, even if the plastic resin is inferior in heat conductivity to the metal, the thickness of the plastic resin is thin. (It is necessary to control to a softening or melting temperature that optimizes deformation of the base sheet 20 during molding, but this temperature is referred to).

  The adhesive layer 12c functions as a buffer layer that has adhesiveness to the base material sheet 20 and absorbs vibration impact from a protruding portion 31 (described later) of the ultrasonic mold 30 to the heat-resistant layer 12b. The vibration absorbing performance of the adhesive layer 12c is preferably higher than the vibration absorbing performance of the heat resistant layer 12b. Moreover, it is preferable that the adhesion layer 12c has heat resistance higher than the base material sheet 20, and has rigidity lower than the base material sheet 20 and the heat resistance layer 12b. Specifically, for example, a silicone resin containing silicon rubber or polydimethylsiloxane (PDMS) can be used as the adhesive layer 12c. Such a pressure-sensitive adhesive layer 12c is formed by, for example, laminating a thin layer of silicon rubber by adding a crosslinking agent and curing the film-like heat-resistant layer 12b, or coating a component such as polydimethylsiloxane dissolved in a solvent. Is formed.

  The thickness of the adhesive layer 12c is preferably larger than the amplitude of ultrasonic vibration of the ultrasonic molding die 30 (for example, 0 μm to 5 μm to be damped and vibrationed at the final stage of molding), for example, preferably 2 μm to 10 μm. By setting the thickness of the adhesive layer 12c to be equal to or greater than the amplitude of the final stage of molding, it is possible to effectively absorb the vibration of the protruding portion 31 (described later) of the ultrasonic molding die 30, and the heat resistant layer 12b having high rigidity and There is no contact, and wear of the cradle 11 and the protruding portion 31 of the ultrasonic forming die 30 can be prevented. On the other hand, by setting the thickness of the pressure-sensitive adhesive layer 12c to 10 μm or less, the base sheet 20 can be applied to a large amplitude (for example, 5 to 10 μm) added at the initial stage of molding in which the protruding portion 31 does not reach the pressure-sensitive adhesive layer 12c. And the rigidity which generate | occur | produces sufficient drag can be given through the heat-resistant layer 12b.

  On the other hand, the base sheet 20 is made of a heat-melting plastic having a property of being melted by ultrasonic waves, but preferably has a certain degree of rigidity and heat resistance. In this case, the melting temperature of the base sheet 20 is preferably lower by 50 ° C. or more than the melting temperature of the back sheet 12. This is because if the melting temperature of the base sheet 20 and the melting temperature of the back sheet 12 are close, the back sheet 12 is thermally deformed when the base sheet 20 is formed. The material of the base sheet 20 needs to be selected relatively depending on the combination with the back sheet 12. For example, polycarbonate (PC), amorphous polyethylene terephthalate (A-PET), crystalline polyethylene terephthalate Extensible polyethylene terephthalate, methacrylic acid ester polymer (PMMA), polystyrene (PS), ABS and the like can be used. In addition, polysulfone (PSU), polyethersulfone (PES), polyetheretherketone (PEEK), polyamideimide (PAI), polyetherimide (PEI), thermoplastic polyimide (TPI), polymethylpentene (PMP), super High molecular weight polyethylene (UHMWPE), liquid crystal polymer (LCP), polyarylate (PAR), polyphenylene sulfide (PPS), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyacetal (POM), Thermoplastics such as polyamide (PA), polyethylene (PE), polypropylene (PP), and polyvinyl chloride (PVC) can also be applied. In addition, although the thickness of the base material sheet 20 is arbitrary, it is preferable to set it as about 10 micrometers-1 mm in view of the vibration width of the ultrasonic molding die 30 mentioned later and the positional accuracy of the up-down direction of the ultrasonic shaping die 30.

  In addition, as shown in FIG. 1, the fine through-hole forming apparatus 10 is provided with a suction portion 13 that penetrates through the inside of the cradle 11. The back sheet 12 can also be fixedly held on the cradle 11 by vacuum suction through the suction part 13.

  Further, an ultrasonic molding die 30 made of an ultrasonic horn mold is disposed above the back sheet 12. The ultrasonic mold 30 includes a base portion 33 and a horn head 32 that is attached to the base portion 33 and has a large number of protruding portions 31 formed in the lower portion thereof. Further, the heating device 14 is connected to the ultrasonic molding die 30, and a large number of the protruding portions 31 of the ultrasonic molding die 30 can be supplementarily heated by the heating device 14. In addition to heating by ultrasonic vibration of the ultrasonic mold 30, the protrusion 31 of the ultrasonic mold 30 can be efficiently heated by using such a heating device 14 as an auxiliary.

  Further, the mold control device 15 is connected to the ultrasonic mold 30. The ultrasonic mold 30 is controlled by the mold control device 15 and moves up and down in the vertical direction and ultrasonically vibrates in the vertical direction. It is preferable that the raising / lowering position accuracy of the ultrasonic molding die 30 and the amplitude accuracy of ultrasonic vibration by the molding die control device 15 are both on the order of 1 μm.

  The ultrasonic mold 30 is controlled by the mold control device 15, and the protruding portion 31 provided at the tip of the ultrasonic mold 30 descends while ultrasonically vibrating in the vertical direction, and comes into contact with the base sheet 20 to contact the base sheet 20. The ultrasonic vibration is heated. It takes time to soften or melt the base sheet 20 only by this ultrasonic vibration heating and to mold the base sheet 20 with the ultrasonic mold 30. When the energy of the ultrasonic vibration is increased, the vibration amplitude is also increased, so that the position accuracy of the through hole to be formed is lowered. In the present invention, as described above, since the cradle 11 is heated and the base sheet 20 can be heated to near the glass transition temperature or the softening temperature, ultrasonic vibration energy capable of maintaining positional accuracy is provided. The base sheet 20 can be easily molded (that is, the base sheet 20 is softened or melted). As a result, a large number of fine through-holes can be easily formed in the synthetic resin base material sheet 20 in a simple and short time.

  The cradle 11 is temperature-controlled so that the temperature of the base sheet 20 is close to the glass transition temperature or the softening temperature, but is preferably controlled to be a little lower than the softening temperature of the synthetic resin. When the temperature of the base material sheet 20 becomes a temperature equal to or higher than the softening temperature of the synthetic resin, the entire heated portion of the base material sheet 20 starts to soften. If the portion other than the portion with which the protruding portion 31 of the ultrasonic forming die 30 of the base sheet 20 abuts is softened, a highly accurate through hole may not be formed. The temperature of the base material sheet 20 is suitably 1 to 50 ° C., more preferably about 5 to 30 ° C. lower than the softening temperature.

  In FIG. 1, the ultrasonic mold 30 is lowered by the mold control device 15, the protruding portion 31 that ultrasonically vibrates is brought into contact with the base material sheet 20, and the base material sheet 20 is ultrasonically heated. Thereby, the base material sheet 20 of the part which the protruding part 31 contacted is softened or melted. When the base material sheet 20 is softened or melted, the ultrasonic mold 30 is further lowered by the mold control device 15, and the base material sheet 20 is formed between the protruding portion 31 of the ultrasonic mold 30 and the cradle 11. And the back sheet 12 is clamped. In this state, the protruding portion 31 of the ultrasonic molding die 30 is ultrasonically vibrated to ultrasonically heat the base sheet 20, and the protruding portion 31 provided at the tip of the ultrasonic forming die 30 is the base sheet. 20 is penetrated. During this time, the vibration impact from the protruding portion 31 of the ultrasonic mold 30 is absorbed by the heat-resistant layer 12b and the adhesive layer 12c of the backsheet 12. When the tip of the projecting portion 31 reaches the adhesive layer 12c of the back sheet 12, the mold control device 15 stops the ultrasonic vibration of the ultrasonic mold 30 and also stops heating by adding vibration energy, The process proceeds to cooling by heat conduction from the upper surface and the lower surface of the base sheet 20. On the upper surface of the base material sheet 20, the base material sheet 20 is cooled by the protruding portions 31 whose temperature is adjusted to a glass transition point or a softening temperature or lower. On the other hand, the lower surface of the base sheet 20 is cooled by the temperature control device 16 to cool the base sheet 20 or the temperature of the base 11 is changed to a glass transition of the synthetic resin by the temperature control device 16. The base sheet 20 is cooled to a desired temperature by heat conduction from the base sheet 20 to the cradle 11.

  After the synthetic resin of the portion of the base sheet 20 cooled as described above is in contact with the ultrasonic forming die 30 (the portion where the protruding portion 31 penetrates) is solidified, the forming die control device 15 Then, the ultrasonic forming die 30 is moved upward to extract the protruding portion 31. At this time, the protruding portion 31 may not peel from the through hole formed in the base sheet 20, and the lower end of the horn head 32 of the ultrasonic forming die 30 as the ultrasonic forming die 30 moves upward. The base material sheet 20 may also be lifted upward together with the protruding portions 31 in the above, and the fine through holes may be deformed. In the present invention, the protruding portion 31 can be easily pulled out by causing the ultrasonic forming die 30 to vibrate ultrasonically again. As a result, a more accurate through hole can be formed in the base sheet.

<Ultrasonic mold>
Next, the configuration of the above-described ultrasonic mold 30 will be further described with reference to FIGS.

  As shown in FIG. 3, the ultrasonic mold 30 includes a base portion 33 having a shape that tapers from the top to the bottom, and a horn head 32 screwed to the lower end of the base portion 33 by a screw portion 32b. Have. Of these, a cylindrical tip convex portion 32 a is formed at the lower end of the horn head 32. Further, a large number of projecting portions 31 are provided so as to project downward from the tip convex portion 32a. The horn head 32 is made of a metal such as titanium, aluminum, steel, and stainless steel. Further, the projecting portion 31 can be constituted by a Ni plating layer or a Cr plating layer provided on these metals. The base portion 33 has a circular horizontal cross section whose diameter gradually decreases from the top to the bottom.

  Next, the configuration of the protruding portion 31 of the ultrasonic forming die 30 will be further described with reference to FIGS. As shown in FIGS. 4 and 5, a large number of protruding portions 31 having the same shape are formed on the tip convex portion 32 a of the horn head 32. Each protrusion 31 has a mountain shape. That is, each protrusion 31 has a planar circular top 31a and a skirt 31b extending from the top 31a to the periphery. Among these, the skirt part 31b has a circular horizontal cross section whose diameter gradually increases from the top part 31a side toward the tip convex part 32a side of the horn head 32. If the amplitude of the ultrasonic forming die 30 is desired to be set small, the diameter may be gradually increased from the upper side to the lower side in accordance with the ultrasonic transducer, or the diameter may be the same. Also good. Furthermore, a valley portion 31c is formed between adjacent top portions 31a. Each protruding portion 31 may have any shape having a taper, but it is particularly preferable to form the tip of each protruding portion 31 at an acute angle. By making the tip of each protruding portion 31 have an acute angle, the area of the portion that first contacts the base sheet 20 can be reduced during molding. When pressed with the same pressure, the smaller the tip area of each protrusion 31, the greater the pressure applied to each protrusion 31, so that each protrusion 31 is more easily pushed into the base sheet 20. For this reason, the area which the protrusion part 31 and the base material sheet | seat 20 contact becomes large, and a bigger frictional heat generate | occur | produces. Thereby, it is possible to easily start melting of the base material sheet 20.

In FIG. 5, the diameter d ₁ of the top portion 31 a of each protrusion 31 can be arbitrarily determined depending on the shape of the fine through-hole molded product 40, but is preferably about 1 μm to 10 μm, for example. Distance L ₁ between the top 31a Adjacent, can be arbitrarily determined similarly by the shape of the fine through-hole molded article 40, for example, it is preferably about 20 m to 100 m. Similarly, the height h ₁ of each protrusion 31 can be arbitrarily determined, but is preferably about 10 μm to 100 μm, for example.

  Next, with reference to FIGS. 6 and 7, a method for producing such an ultrasonic mold 30, particularly a method for forming a plurality of protruding portions 31 of the ultrasonic mold 30 will be described.

  First, a raw horn head 32 made of titanium or the like is prepared. Next, the unprocessed horn head 32 is mounted on the ultraprecision cutting machine 36. Here, as shown in FIGS. 5 and 6, the ultraprecision cutting machine 36 has a cutting tool 37 having a diamond cutting edge 38 provided at the tip. As such an ultra-precise cutting machine 36, a machine having a control accuracy of about 1 nm and capable of setting the surface roughness Ra of the processed mold to several nm is preferable.

Then, the cutting tool 37 of the ultra-precision cutting machine 36 abuts the leading protrusion 32a of the horn head 32 while rotating (rotation) in a clockwise direction around the axis A _1. Subsequently, the cutting tool 37 rotates (revolves) clockwise around the portion that becomes the top portion 31a of each protruding portion 31 in the tip convex portion 32a of the horn head 32, while the tip convex portion 32a of the horn head 32. Cutting. As a result, a chevron-shaped projecting portion 31 having a top portion 31a and a skirt portion 31b is formed on the tip convex portion 32a of the horn head 32. Thereafter, by repeating such an operation as many as the number of the projecting portions 31, a large number of projecting portions 31 are formed on the tip convex portion 32 a of the horn head 32.

<Method for producing fine through-hole molded product>
Next, referring to FIGS. 8A to 8F, FIGS. 9A to 9D, and FIG. 10, the fine through-hole molded product 40 is manufactured by using the fine through-hole forming apparatus 10 described above. A method will be described.

  First, based on the three-dimensional shape data of the fine through-hole molded product 40 to be manufactured, the horn head 32 is cut using the ultra-precision cutting machine 36, and the ultrasonic mold 30 is manufactured by the method described above. To do. Further, the surface of the film-like heat-resistant layer 12b is cured by adding a cross-linking agent and thinly laminating silicon rubber, or coating a component such as polydimethylsiloxane dissolved in a solvent, thereby forming the heat-resistant layer 12b. And a back sheet 12 having an adhesive layer 12c provided on the heat-resistant layer 12b.

  Subsequently, the ultrasonic molding die 30 is mounted on the fine through-hole molding device 10, and the ultrasonic molding die 30 is moved from the normal room temperature (20 ° C.) by the heating device 14 to the synthetic resin glass. Heating is performed at a temperature in the vicinity of the transition point temperature or the softening temperature so that the base sheet 20 is cured and not deformed after molding.

  Next, the back sheet 12 is held on the cradle 11, and the base sheet 20 is placed on the back sheet 12. At this time, the adhesive layer 12 c of the back sheet 12 is adhered to the base material sheet 20. Accordingly, the base sheet 20 is supported so as not to move on the back sheet 12. Further, the back sheet 12 is fixed and supported so as not to move on the cradle 11 by vacuum suction using the suction part 13 (FIG. 8A). Alternatively, the adhesive layer 12c of the back sheet 12 may be adhered to the base material sheet 20 in advance, and then the back sheet 12 and the base material sheet 20 integrated together may be placed on the cradle 11.

  Subsequently, the cradle 11 is heated by the temperature control device 16 to heat the base sheet 20 to near the glass transition temperature or softening temperature of the synthetic resin.

  Next, the ultrasonic mold 30, which is arranged in advance in the vertical direction, is ultrasonically vibrated in the vertical direction by the mold control device 15, and the ultrasonic mold 30 is further oscillated in this manner. It is lowered toward the base material sheet 20 (FIG. 9A). In this case, the frequency of the ultrasonic mold 30 can be arbitrarily set, but is preferably set to about 20 kHz to 40 kHz.

  The protrusions 31 come into contact with the base material sheet 20 as the ultrasonic mold 30 is lowered. At this time, the portion of the base sheet 20 where the protrusions 31 are in contact is ultrasonically heated by the vibration energy of the ultrasonic vibration. The ultrasonic vibration heating by the vibration energy and the thermal energy applied from the cradle 11 cause the synthetic resin constituting the base sheet 20 to soften or reach a melting temperature, and as a result, the protruding portion 31 of the base sheet 20. Only the portion in contact with the region is locally softened or melted in advance (FIGS. 8B and 9B).

  Subsequently, the ultrasonic mold 30 is further lowered. During this time, each protruding portion 31 of the ultrasonic mold 30 penetrates through the base sheet 20 while heating the base sheet 20 by ultrasonic vibration (FIG. 9C). At this time, the softened or melted base material sheet 20 and the back sheet 12 are sandwiched between the protruding portions 31 of the ultrasonic forming die 30 and the cradle 11. Further, while the ultrasonic molding die 30 is lowered, a load is applied when the protruding portion 31 penetrates the base sheet 20. In this case, since the adhesive layer 12c is provided on the heat-resistant layer 12b of the back sheet 12, the adhesive layer 12c can absorb the vibration from the protruding portion 31 and reduce the impact on the cradle 11. Can do. As a result, it is possible to prevent the cradle 11 and the protruding portion 31 from being worn by vibration impact.

  In this state, the protruding portion 31 of the ultrasonic forming die 30 is ultrasonically vibrated, the base sheet 20 is ultrasonically vibrated and heated, and the base sheet 20 penetrates through the protruding portion 31. In this way, the tip of each protruding portion 31 of the ultrasonic mold 30 reaches the adhesive layer 12 c of the backsheet 12. (FIGS. 8C and 9D). In addition, when the front-end | tip of each protrusion part 31 reaches the lowest part, it is preferable that the front-end | tip of each protrusion part 31 stays in the adhesion layer 12c of the backsheet 12, and does not reach the heat-resistant layer 12b. This is because the vibration shock from the protrusion 31 can be absorbed more effectively.

  When the tip of each protrusion 31 reaches the adhesive layer 12c of the back sheet 12, the lowering of the ultrasonic mold 30 is stopped. At this time, by monitoring the load weight, it can be seen that the protruding portion 31 has reached the adhesive layer 12c of the back sheet 12. Therefore, the downward movement of the ultrasonic mold 30 is controlled by monitoring the load weight. May be. Thereafter, the amplitude of the ultrasonic vibration of the ultrasonic forming die 30 is gradually attenuated while maintaining the vibration lower end at the tip of each protrusion 31 so as to be positioned in the adhesive layer 12c of the back sheet 12. To stop.

  In this way, while the ultrasonic mold 30 is lowered, the ultrasonic mold 30 is controlled by the mold control device 15 and has a large amplitude (for example, 5 μm to 10 μm) in the former stage during molding, and in the latter stage during molding. It is preferable to vibrate so as to have a small amplitude (for example, 0 μm to 5 μm). Furthermore, it is preferable that the lower end of the protruding portion 31 of the ultrasonic forming die 30 when the vibration is attenuated and stopped is the lowermost position among the moving positions during the forming process.

Specifically, as shown in FIG. 10, the ultrasonic forming die 30 is lowered while vibrating with a relatively large amplitude until the tip of the protruding portion 31 reaches the inside of the adhesive layer 12c of the back sheet 12 (see FIG. 10). 10 times T ₁ ). On the other hand, after the tip of the protruding portion 31 reaches the adhesive layer 12c of the backsheet 12, the ultrasonic forming die 30 oscillates so that the amplitude gradually decreases, and then stops (see FIG. 10). time T _2). In addition, while the ultrasonic mold 30 is oscillating damped, the vibration lower end at the tip of the protruding portion 31 is maintained so as to remain in the adhesive layer 12c of the back sheet 12 (see FIG. 10). By controlling the vibration of the ultrasonic mold 30 in this way, the fine through hole 41 of the fine through hole molded product 40 can be shaped with high accuracy. Further, when the protrusion 31 is penetrated, the ultrasonic molding die 30 does not vary in amplitude, and penetrates into the base sheet 20 with the same low amplitude (2 μm to 5 μm), and the tip position (adhesive layer of the back sheet 12) There is also a method of stopping in a state where the load is applied and a load is applied.

  Next, at the same time as the vibration is stopped, the base sheet 20 is cooled and cured at the temperature of the cradle 11 with the ultrasonic molding die 30 and the back sheet 12 having a preset temperature adjusted. In order to further ensure the curing, the heating device 14 is stopped, the ultrasonic molding die 30 is cooled, and at the same time, the temperature control device 16 lowers the temperature of the cradle 11 so that the base sheet 20 is softened by the glass temperature of the synthetic resin or softened. Cool until below temperature. As a result, the base material sheet 20 that has been softened or melted locally is solidified, and a large number of fine through holes 41 are formed in the base material sheet 20. A hole-formed product 40 is formed. In this case, the ultrasonic mold 30 and the base sheet 20 may be actively cooled by using a cooling device (not shown).

  Next, the ultrasonic mold 30 is raised by the mold control device 15. In this case, the ultrasonic mold 30 and the fine through-hole molded product 40 (base material sheet 20) are cooled and the dimensions are slightly reduced. In this state, the fine through-hole molded product 40 can be released from the ultrasonic molding die 30 (FIG. 8D). Further, when the fine through-hole molded product 40 (base sheet 20) adheres to the ultrasonic mold 30, the ultrasonic mold 30 is first raised slightly, and then the ultra short time ultrasonic mold 30 is again formed. By vibrating, the fine through-hole molded product 40 can be easily released from the ultrasonic mold 30.

  Thereafter, the vacuum suction by the suction unit 13 is stopped, and the back sheet 12 and the fine through-hole molded product 40 are removed from the cradle 11 (FIG. 8E). At this time, since the fine through-hole molded product 40 is firmly adhered to the adhesive layer 12c of the backsheet 12, the fine through-hole molded product 40 and the backsheet 12 are integrated and protected by the backsheet 12. In this state, the fine through-hole molded product 40 can be conveyed. Thereby, the malfunction that the thin through-hole molded product 40 with thin thickness is damaged or deform | transformed accidentally can be prevented.

  Finally, after the fine through-hole molded product 40 and the back sheet 12 are conveyed to a predetermined place, the fine through-hole molded product 40 is obtained by peeling the fine through-hole molded product 40 from the back sheet 12 (see FIG. 8 (f)). When peeling the fine through-hole molded product 40 from the backsheet 12, the fine through-hole molded product 40 can be peeled from the adhesive layer 12 c of the backsheet 12 by pulling up the end of the fine through-hole molded product 40.

<Fine through-hole molded product>
Next, the configuration of the fine through-hole molded product 40 formed by the fine through-hole forming apparatus 10 will be described with reference to FIGS. 11 and 12. 11 is a plan view showing a fine through-hole molded product, and FIG. 12 is a cross-sectional view taken along line XII-XII in FIG.

  A fine through-hole molded product 40 shown in FIGS. 11 and 12 is manufactured by molding the base sheet 20 using the fine through-hole forming apparatus 10. Such a fine through-hole molded product 40 is used as a member that exhibits various functions, such as a filter member, a breathable member, and a mesh for generating fine droplets used in a nebulizer. As a material constituting such a fine through-hole molded article 40, various heat-meltable resins as described above, for example, polycarbonate (PC), amorphous polyethylene terephthalate (A-PET), crystalline polyethylene terephthalate, stretched Include polyethylene terephthalate, methacrylic acid ester polymer (PMMA), polystyrene (PS), and ABS. In addition, polysulfone (PSU), polyethersulfone (PES), polyetheretherketone (PEEK), polyamideimide (PAI), polyetherimide (PEI), thermoplastic polyimide (TPI), polymethylpentene (PMP), super High molecular weight polyethylene (UHMWPE), liquid crystal polymer (LCP), polyarylate (PAR), polyphenylene sulfide (PPS), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyacetal (POM), Thermoplastics such as polyamide (PA), polyethylene (PE), polypropylene (PP), and polyvinyl chloride (PVC) can also be applied.

  As shown in FIGS. 11 and 12, the fine through-hole molded product 40 includes a molded product main body 42 and a plurality of fine through-holes 41 formed over the entire molded product main body 42. Each fine through hole 41 is formed by each protruding portion 31 of the ultrasonic forming die 30, and thus has a shape corresponding to the shape of each protruding portion 31. Each fine through hole 41 includes a circular opening 41a provided on one surface 42a of the molded product main body 42, and a slope 41b extending from the circular opening 41a toward the circular opening 42b on the other surface of the molded product main body 42. Have. The slope 41b may be a straight line or a curve, but in particular, when the fine through-hole molded product 40 is used as a mist forming filter as will be described later, the cone-shaped through-hole in which the slope 41b becomes a parabola. It is preferable that Further, reference numeral 40a denotes a hole peripheral part formed at the peripheral edge of the circular opening 41a, reference numeral 40b denotes a connecting part formed between adjacent fine through holes 41, and reference numeral 40c denotes a fine through hole. 41 is a thick portion formed around 41.

As shown in FIG. 12, the diameter of the through hole differs between the front and back surfaces of the fine through hole molded product 40 in the conical-shaped through hole in which the slope portion 41b is a parabola. For example, the diameter d ₂ of the circular opening 41a of each fine through hole 41 is preferably about 1 μm to 10 μm, for example. The diameter d ₃ of the circular opening 42b, for example is preferably about 20Myuemu～80myuemu. The number of through-holes 41 is preferably about 200 to 1000 per mm ² per unit area of the fine through-hole molded product 40, and the adjacent circular openings 41 a are necessary for each through-hole 41 to have the above number. distance L ₂ between each other, for example, is preferably about 32Myuemu～70myuemu. Furthermore, the thickness t ₂ of the fine through-hole molded product 40 is preferably about 10 μm to 100 μm, for example.

  The fine through-hole molded product 40 as described above can be suitably used as a mist forming filter of a mist generating device such as a nebulizer. For example, as shown in FIG. 13, the fine through-hole molded product 40 (mist forming filter 54) is disposed between the ultrasonic vibrator 51 and the mist generating port 52 of the mist generating device 50. The liquid 53 supplied onto the ultrasonic transducer 51 forms granular droplets 53a by vibration energy from the ultrasonic transducer 51, but the droplets pass through the through holes of the mist forming filter 54. By being discharged to the mist generating port 52, a droplet 53a having a desired particle diameter can be formed. By arranging the fine through-hole molded product 40 such that the side with the larger diameter of the through-hole molded product 40 provided with through-holes with different diameters on the front and back as described above is the ultrasonic transducer 51 side. A mist having a particle size of the droplet 53a of about 1 to 10 μm can be formed.

DESCRIPTION OF SYMBOLS 10 Fine through-hole shaping | molding apparatus 11 Base 12 Back sheet 12b Heat-resistant layer 12c Adhesive layer 13 Suction part 14 Heating device 15 Mold control device 16 Temperature control device 20 Base material sheet 30 Ultrasonic molding die 31 Projection part 32 Horn head 33 Base part 40 Molded fine through-hole product 50 Mist generator 54 Mist forming filter

Claims (9)

A cradle,
A back sheet that is held on a cradle and supports a base sheet made of synthetic resin;
An ultrasonic molding die disposed above the backsheet and having a number of protruding portions on the lower portion, the ultrasonic forming die is movable in the vertical direction, and the protruding portions vibrate ultrasonically,
In a state where the base sheet and the back sheet are sandwiched between the protruding portion of the ultrasonic mold and the cradle, the protruding portion of the ultrasonic forming die is ultrasonically vibrated to heat the base sheet by ultrasonic vibration. , Penetrating the base sheet by the protruding part, forming a number of fine through holes in the base sheet,
Backsheet, and the heat-resistant layer provided on the heat-resistant layer, possess the adhesive layer is adhered to the base sheet,
The adhesive layer of the back sheet is characterized by adhering and holding the base sheet both before and after the fine through hole is formed in the base sheet. Hole forming device. The fine through-hole forming device according to claim 1 , wherein the adhesive layer has higher heat resistance than the base material sheet and has lower rigidity than the base material sheet and the heat resistant layer. Adhesive layer comprises a silicone resin containing a silicone rubber or polydimethylsiloxane, fine through-holes forming apparatus according to claim 1 or 2. The fine heat-resistant hole forming apparatus according to any one of claims 1 to 3 , wherein the heat-resistant layer includes polyimide, polytetrafluoroethylene (PTFE), or heat-resistant plastic. The thickness of the adhesive layer is 2Myuemu～10myuemu, fine through-holes forming apparatus according to any one of claims 1 to 4. A method for producing a fine through-hole molded product using the fine through-hole molding apparatus according to any one of claims 1 to 5 ,
While holding the back sheet on the cradle, the step of sticking the adhesive layer of the back sheet to the base material sheet made of synthetic resin,
An ultrasonic mold having a large number of protrusions in the lower part is lowered in advance above the back sheet, the protrusions that vibrate ultrasonically are brought into contact with the base sheet, and the base sheet is ultrasonicated. Vibration heating and softening or melting the portion of the base sheet that the projecting portion is in contact with, and
The ultrasonic molding die is further lowered to sandwich the softened or melted base sheet and back sheet between the protruding portion of the ultrasonic molding die and the cradle. The substrate sheet is ultrasonically vibrated and heated by ultrasonic vibration, and the substrate sheet is penetrated by the projecting portion to form a large number of fine through holes in the substrate sheet to produce a fine through hole molded product. Process,
Removing the back sheet and the fine through-hole molded product adhered to the back sheet as a unit from the cradle;
A step of peeling the fine through-hole molded product adhered to the adhesive layer of the backsheet from the backsheet ,
The method according to claim 1, wherein the adhesive layer of the back sheet adheres and holds the base sheet both before and after the fine through hole is formed in the base sheet . The method according to claim 6 , wherein the ultrasonic forming die is lowered so that a load weight is applied when the protruding portion penetrates into the base sheet. The method according to claim 6 or 7 , wherein when the ultrasonic mold is lowered and the tip of the protrusion reaches the lowest position, the tip of the protrusion remains in the adhesive layer of the backsheet. In the step of forming the fine through-holes, after the protruding portion reaches the adhesive layer, gradually damped oscillation ultrasonic mold so that the amplitude is reduced, thereafter stops the ultrasonic vibration, claims 6 to 8 The method as described in any one of.

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