JP2013086133A - Reflow soldering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a reflow soldering device which can be made small in size.SOLUTION: The reflow soldering device 30 includes: (a) a case in which a work 10 is conveyed; (b) a heater 36 which is arranged, in the case, below a work conveyance route for conveying the work 10 and applies a heat ray toward the work conveyance route; and (b) shielding members 40, 50 and 52 which shield the upper side from the work conveyance route and form, in the case, a closed space 58 communicated with the work conveyance route above the work conveyance route.

Description

  The present invention relates to a reflow soldering apparatus, for example, a reflow soldering apparatus used for reflow soldering a metal cap to an electronic component.

  2. Description of the Related Art Conventionally, a reflow soldering apparatus that is heated when a work is transported inside a housing has been used in order to mount an electronic component on the board or to join a metal cap to the board.

  For example, as shown in the cross-sectional view of FIG. 6A, the substrate 106 to be soldered is conveyed by the conveyor 102 and heated by the upper heater 132 and the lower heater 131 arranged above and below the conveyor 102. A fan 133 is disposed above the upper heater 132 to make the temperature inside the apparatus uniform. And the housing | casing 101 is arrange | positioned so that they may be covered. The board 106 and the electronic component, or the metal cap that covers the board 106 and the board 106 are heated when moving between the upper heater 132 and the lower heater 131, and the solder is melted and soldered (for example, patents). Reference 1).

JP 2003-318530 A

  Thus, in the structure which arrange | positions a heater on the upper and lower sides of a conveyor, there exists a problem that a reflow soldering apparatus becomes large. Further, if a fan is disposed in the apparatus in order to bring the board or electronic component to a temperature necessary for soldering or to reduce temperature variation, there is a problem that the apparatus becomes even larger.

  In view of such circumstances, the present invention intends to provide a reflow soldering apparatus that can be miniaturized.

  In order to solve the above problems, the present invention provides a reflow soldering apparatus configured as follows.

  The reflow soldering apparatus includes: (a) a casing in which a workpiece is conveyed; and (b) a casing in which the workpiece is conveyed, and is disposed below the workpiece conveyance path in which the workpiece is conveyed. A heater that radiates heat rays toward the inside, and (c) a closed space that communicates with the workpiece conveyance path is formed above the workpiece conveyance path by shielding the upper side of the workpiece conveyance path inside the housing. And a shielding member.

  In the above configuration, the heater is only required to be heated to a predetermined temperature necessary for soldering the workpiece in a closed space formed by the shielding member. Since the heater only needs to heat a limited portion of the inside of the housing, that is, the closed space, and the work itself, the work can be efficiently heated and the size can be reduced. Since the heater is disposed below the workpiece transfer path, the casing can be made smaller in the portion above the shielding member. Therefore, the reflow soldering apparatus can be reduced in size.

  Preferably, the shielding member is formed of a glass plate at a portion extending above the workpiece conveyance path.

  When the heat rays radiated from the heater are absorbed by the shielding plate, the temperature of the closed space rises due to radiant heat, but the glass plate easily transmits the heat rays radiated from the heater. It is possible to suppress the deformation and characteristic change of the workpiece due to the temperature rise in the part other than the part that needs to be soldered.

  Preferably, an opening is formed between the workpiece conveyance path and the heater, the heater transmits a heat ray that is radiated toward the workpiece conveyance path, and the heater irradiates other than the workpiece conveyance path. The heater further includes a heater shielding member that shields the heat rays.

  In this case, it is possible to efficiently heat a part that needs to be soldered by irradiating a predetermined part of the work with a heat ray from the heater, and to prevent deformation or characteristic change due to a temperature rise in a part that does not require heating. .

  Preferably, when viewed from the direction in which the workpiece is transported inside the housing, (i) the heater includes a right heater disposed diagonally to the lower right of the workpiece transport path, and a diagonally lower left of the workpiece transport path. (Ii) a center position of an area on the work transfer path that is irradiated with heat rays from the right heater and a work transfer path that is irradiated with heat rays from the left heater. The center position of the area is far away.

  In this case, a plurality of parts of the workpiece conveyed along the workpiece conveyance path can be heated from separate heaters, and the heating time can be shortened.

  Preferably, the workpiece is (a) an exterior member made of a band-shaped metal member and bent upward and formed to face each other; and (b) the bent pieces of the exterior member facing each other. And (c) a contact point between the bent pieces of the exterior member and the substrate, and a solder paste disposed in the vicinity thereof. The heater irradiates heat rays to the base ends of the bent pieces of the exterior member facing each other with respect to the workpiece conveyed inside the housing.

  In this case, the folded piece of the exterior member can be directly heated by the heat rays from the heater to melt the solder paste, and the exterior member can be joined to the substrate.

  According to the present invention, the reflow soldering apparatus can be reduced in size.

It is principal part sectional drawing of a reflow soldering apparatus. Example 1 It is sectional drawing of a workpiece | work. Example 1 It is a principal part top view of a reflow soldering apparatus. Example 1 It is principal part sectional drawing of a reflow soldering apparatus. (Example 2) It is principal part sectional drawing of a reflow soldering apparatus. (Comparative example) (A) It is sectional drawing which shows the structure of a reflow soldering apparatus, (b) It is a diagram which shows the temperature profile. (Conventional example)

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  <Example 1> The reflow soldering apparatus 30 of Example 1 is demonstrated, referring FIGS. 1-3.

  FIG. 1 is a cross-sectional view of a main part of the reflow soldering apparatus 30. FIG. 2 is a cross-sectional view of the workpiece 10. FIG. 3 is a plan view of an essential part of the reflow soldering apparatus 30 as viewed along line AA in FIG.

  In the reflow soldering apparatus 30, as shown in FIG. 1, a heater 36 that irradiates heat rays (infrared rays) is disposed below the work transfer unit 40 that transfers the work 10 inside the housing. The reflow soldering apparatus 30 is used for soldering a metal cap to the substrate 20.

  As shown in FIG. 2, the workpiece 10 includes an exterior member 12 for forming a metal cap, a substrate 20, and a solder paste 28.

  As shown in FIGS. 2 and 3, the exterior member 12 is obtained by punching a band-shaped metal material (hoop material). On both sides of the exterior member 12, through holes 13 having an equal pitch for carrying by a sprocket are formed. Between the two sides, bent pieces 14 and 16 that are bent upward and face each other are spaced at regular intervals. Is formed.

  The substrate 20 is a multilayer ceramic substrate, for example, and as shown in FIG. 2, electronic components 22 and 24 are mounted on one main surface 20a. The substrate 20 is clamped and sandwiched between the bending pieces 14 of the exterior member 12 facing each other with the other main surface 20b facing up.

  As shown in FIG. 2, the solder paste 28 is disposed at a contact point between the bent piece 14 and the substrate 20 facing each other and the vicinity thereof by a method such as application using a dispenser.

  After the folded piece 14 of the exterior member 12 is soldered to the substrate 20, the exterior member 12 is cut at both side portions of the folded piece 14 facing each other, and the central portion 18 of the exterior member 12 and the folded pieces 14, 16. As a result, a metal cap is formed.

  As shown in FIG. 1, the workpiece transport unit 40 has a groove 42 for accommodating the workpiece 10 formed on the upper surface 40 a thereof. A through hole 46 is formed in the center of the bottom surface 44 of the groove 42. The work 10 is conveyed in a state where both sides are in sliding contact with the bottom surface 44 of the groove 42 and supported. At this time, the workpiece 10 is in a state where the central portion 18 and the vicinity thereof are opposed to the through hole 46 of the workpiece transfer unit 40 and floated in space. The work conveyance unit 40 is made of metal and is cooled by a refrigerant circulating inside.

  A spacer member 50 is disposed on the upper surface 40 a of the work transport unit 40, and a shielding plate 52 is disposed on the spacer member 50 so as to cover the groove 42 of the work transport unit 40. The workpiece conveyance unit 40, the spacer member 50, and the shielding plate 52 are shielding members that shield the upper side of the workpiece conveyance path and form a closed space 58 that communicates with the workpiece conveyance path. The shielding plate 52 is formed of a metal plate.

  As shown in FIG. 1, the heaters 36 are respectively disposed on both the left and right sides obliquely below the workpiece conveyance path. The heater 36 is disposed inside the heater block 32 in which the opening 34 is formed. The heater block 32 is a heater shielding member that shields the heat rays that the heater 36 irradiates outside the workpiece conveyance path.

  The heat rays from the left and right heaters 36 are irradiated so as to concentrate in the vicinity of the base ends 15 of the left and right bent pieces 14 of the exterior member 12 as indicated by chain lines 37 in FIGS. 1 and 2. Is done. The center positions of the regions where the left and right heaters 36 irradiate heat rays on the workpiece conveyance path are separated from each other. By heating a plurality of locations of the workpiece 10 from separate heaters 36, the heating time can be shortened.

  A glass plate 38 that transmits heat rays from the heater 36 is disposed on the left and right heater blocks 32. The glass plate 38 increases the efficiency by narrowing the space in which air convects below the workpiece 10.

  When the workpiece 10 is conveyed along the bottom surface 44 of the groove 42 of the workpiece conveyance unit 40, the reflow soldering apparatus 30 heats the workpiece 10 with the heater 36 disposed obliquely below the workpiece conveyance path. The solder paste 28 is melted, and the bent piece 14 of the exterior member 12 is soldered to the substrate 20.

  At this time, the work 10 is heated directly by the concentrated heat rays from the heater 36, and the base end 15 of the bent piece 14 of the exterior member 12 is directly heated, and the heat is efficiently transmitted to the solder paste 28 via the bent piece 14. Is done.

  Further, the shielding plate 52 installed so as to cover the groove 42 of the workpiece transfer unit 40 absorbs the heat rays irradiated from the heater 36 and radiates it to the closed space 58. As a result, the upper surface of the workpiece 10 on which the solder paste 28 is applied can be heated, and the solder paste 28 can be easily melted. When the upper surface of the workpiece 10 is heated by radiation from the shielding plate 52, the temperature difference between the upper surface and the lower surface of the workpiece 10 is reduced, and the solder paste 28 can be melted using the heater 36 having a relatively small output. become.

  The reflow soldering apparatus 30 forms a relatively narrow closed space 58 along the work conveyance path, separately from the space surrounded by the furnace cover (housing), so that the reflow soldering apparatus 30 is directed to the work 10 by convection of air in the furnace. The cooling action is suppressed. By forming the closed space 58, the space surrounding the workpiece 10 to be soldered can be narrowed, so that variations in temperature during soldering can be reduced.

  The reflow soldering apparatus 30 includes a heater 36 disposed below the work conveyance path as a heating apparatus. A heater block 32 in which an opening 34 is formed is provided between the heater 36 and the workpiece conveyance path, and the heat rays irradiated from the heater 36 are irradiated only to a predetermined portion of the workpiece 10. With such a configuration, it is possible to concentrate and irradiate a heat ray for heating the workpiece 10 at a predetermined location.

  Therefore, the heating device (heater) can be downsized, and the reflow soldering device can be downsized.

  <Example 2> The reflow soldering apparatus 30a of Example 2 is demonstrated referring FIG.

  The reflow soldering apparatus 30a according to the second embodiment is configured in substantially the same manner as the reflow soldering apparatus 30 according to the first embodiment. In the following, the same reference numerals are used for the same components as in the first embodiment, and differences from the first embodiment will be mainly described.

  The reflow soldering apparatus 30a according to the second embodiment is different from the first embodiment only in that the shielding plate 54 that covers the upper portion of the groove 42 of the workpiece transfer unit 40 is a glass plate that transmits heat rays. Thereby, the temperature rise of the one main surface 20a of the board | substrate 20 with which the electronic components 22 and 24 were mounted can be suppressed, the excessive temperature rise in the closed space 58 is suppressed, and parts other than the part which needs soldering It is possible to suppress the deformation and characteristic change of the workpiece 10 due to the temperature rise.

  That is, as shown by the arrow 39, the glass plate shielding plate 54 transmits the heat rays irradiated from the heater 36, so that no radiant heat is generated into the closed space 58, and the workpiece 10 is generated by the radiant heat from the shielding plate 54. There is no heating of the top surface. Therefore, the temperature rise of the entire workpiece 10 can be suppressed. Since the solder paste 28 is directly heated by the heat rays from the heater 36 to the base end 15 of the bent piece 14 of the exterior member 12, the heat is transmitted to the solder paste 28 via the bent piece 14. can do.

  Even in the case of the shielding plate 54 made of a glass plate, a relatively narrow closed space 58 can be formed along the workpiece transfer path separately from the space surrounded by the furnace cover (housing). The cooling effect on the workpiece 10 due to air convection is suppressed.

  <Comparative example> FIG. 5: is principal part sectional drawing of the reflow soldering apparatus 30x of a comparative example.

  As shown in FIG. 5, in the reflow soldering apparatus 30x of the comparative example, the upper part of the groove 42 of the work transfer unit 40 is open, and no closed space is formed above the work transfer path.

  When the lower surface side of the workpiece 10 is heated by the heater 36, air is convected on the upper side of the workpiece conveyance path, so that the workpiece 10 is cooled. In order to raise the temperature around the workpiece 10 to a predetermined temperature, it is necessary to increase the output of the heater 36 or to provide a separate heater above the workpiece conveyance path.

  On the other hand, in Example 1 and Example 2, since there is no such necessity, a reflow soldering apparatus can be reduced in size compared with Comparative Example 1.

  <Summary> As described above, the reflow soldering apparatuses 30 and 30a can be made compact by forming the closed space 58 that communicates with the workpiece conveyance path by shielding the upper side of the workpiece conveyance path with the shielding plates 52 and 54. Can be

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

  For example, the reflow soldering apparatus of the present invention can be used not only when reflow soldering a metal cap to a substrate but also when soldering an electronic component on the substrate.

DESCRIPTION OF SYMBOLS 10 Work 12 Exterior member 13 Through-hole 14 Bending piece 15 Base end 16 Bending piece 18 Center part 20 Substrate 20a One main surface 20b The other main surface 22, 24 Electronic component 28 Solder paste 30, 30a, 30x Reflow soldering device 32 Heater block 34 Opening 36 Heater 38 Glass plate 40 Work transfer part (shielding member)
40a Top surface 42 Groove 44 Bottom surface 46 Through hole 50 Spacer member (shielding member)
52, 54 Shielding plate (shielding member)
58 closed space

Claims (5)

A housing in which the workpiece is transported,
Inside the housing, a heater that is disposed below the workpiece conveyance path through which the workpiece is conveyed, and radiates heat rays toward the workpiece conveyance path;
In the inside of the housing, a shielding member that shields the upper side of the work transport path and forms a closed space communicating with the work transport path on the upper side of the work transport path;
A reflow soldering apparatus comprising:   The reflow soldering apparatus according to claim 1, wherein a portion of the shielding member that extends above the workpiece conveyance path is formed of a glass plate.   An opening is formed between the work transfer path and the heater, the opening through which the heater radiates heat toward the work transfer path is formed, and the heater radiates heat rays other than the work transfer path. The reflow soldering apparatus according to claim 1, further comprising a heater shielding member for shielding. When viewed from the direction in which the workpiece is transported inside the housing,
The heater includes a right heater disposed diagonally to the lower right of the workpiece conveyance path, and a left heater disposed diagonally to the left of the workpiece conveyance path,
The center position of the area on the workpiece conveyance path where the heat rays from the right heater are irradiated is separated from the center position of the area on the workpiece conveyance path where the heat rays from the left heater are irradiated. The reflow soldering apparatus according to claim 1 or 2. The workpiece is
An exterior member made of a band-shaped metal member, bent upward and formed with bent pieces facing each other;
A substrate sandwiched between the bent pieces of the exterior member facing each other;
A solder paste disposed in the vicinity of the contact point between the bent piece and the substrate facing each other of the exterior member; and
With
5. The heater according to claim 1, wherein the heater radiates heat rays to the base ends of the bending pieces of the exterior member facing each other with respect to the workpiece conveyed inside the housing. 6. The reflow soldering apparatus as described in one.

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