JP2013084949A - Sealed semiconductor and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a sealed semiconductor that can mold sealed resin (precursor) into a desired shape relatively easily and demold the sealed semiconductor easily even when a mold release film is preheated at a low temperature region.SOLUTION: A method of manufacturing a sealed semiconductor includes a mold release film installation process, a sealed resin injection process, a semiconductor immersion process, and a sealed resin solidification process. In the mold release film installation process, a mold release film 200 having a cushion layer 220 whose main component is polyolefin is made to follow a recess (cavity) 310 of a mold 300. In the sealed resin injection process, sealed resin 400 is injected into a recess 311 (hereinafter, referred to as a "mould release recess"), which the mold release film is made to follow. In the semiconductor immersion process, a semiconductor 120 is immersed into the sealed resin in the mold release recess. In the sealed resin solidification process, sealed resin is solidified with the semiconductor being immersed in the mold resin.

Description

  The present invention relates to a sealed semiconductor and a method for manufacturing the same.

  In the past, it has been proposed that “a light emitting element mounted on a support, for example, an LED chip is sealed with a curable silicone composition” (see, for example, JP 2010-245477 A). As a method for resin-sealing the light-emitting element in this manner, for example, “a mold having a concave cavity corresponding to the arrangement of the light-emitting element mounted on the support is coated with a very thin release film, and then And a method of curing the curable silicone composition by filling the concave cavity with the curable silicone composition and then pressing the support on which the light emitting element is mounted on the mold.

JP 2010-245477 A

  However, the conventional method has a problem that "if the release film is preheated in a low temperature range (a temperature range of less than 100 ° C), the release film cannot sufficiently follow the mold". . That is, in the conventional method, when resin sealing is performed in a low temperature range, it is difficult to fit the release film along the concave portion (cavity) of the mold, and it is difficult to mold the sealing resin (precursor) into a desired shape.

  An object of the present invention is to form a sealing resin (precursor) into a desired shape relatively easily even when resin sealing is performed in a low temperature range, and to easily form a sealing semiconductor. It is providing the manufacturing method of the sealing semiconductor which can be demolded.

(1)
The manufacturing method of the sealing semiconductor which concerns on 1 aspect of this invention is equipped with a mold release film installation process, injection | pouring processes, such as sealing resin, a semiconductor immersion process, and solidification processes, such as sealing resin. In the release film installation step, the release film is placed in the recess of the mold. In addition, this release film has a cushion layer and a release layer. The cushion layer is mainly composed of polyolefin. The release layer is provided on at least one side of the cushion layer. In the step of injecting the sealing resin or the like, the sealing resin or the sealing resin precursor is injected into a recess (hereinafter referred to as “release mold recess”) along which the release film is placed. In the semiconductor dipping step, the semiconductor is dipped in the sealing resin or the sealing resin precursor in the release recess. In the sealing resin or the like solidifying step, the sealing resin or the sealing resin precursor is solidified in a state where the semiconductor is immersed in the sealing resin or the sealing resin precursor.

  In this method for manufacturing a sealed semiconductor, the release film with a cushion layer is placed along the recess of the mold in the release film installation step. For this reason, in this manufacturing method of a sealed semiconductor, the sealed semiconductor can be easily demolded.

  In general, a release film with a cushion layer mainly composed of polyolefin is sufficiently softer than a single-layer film such as a fluororesin film when preheated in a low temperature range. For this reason, in this manufacturing method of a sealing semiconductor, even when the release film is preheated in a low temperature region in the release film installation step, the release film is relatively easily aligned with the recess of the mold. be able to.

  Therefore, in this method of manufacturing a sealing semiconductor, the sealing resin (precursor) can be molded into a desired shape relatively easily even when resin sealing is performed in a low temperature range. The stop semiconductor can be easily removed.

(2)
In the above-described method for producing a sealed semiconductor (1), the release film preferably has a storage elastic modulus at 120 ° C. of 10.0 MPa or more and 120.0 MPa or less.

  This is because if the storage elastic modulus of the release film at 120 ° C. is within this range, the release film can be easily aligned with the concave portion of the mold in the release film installation step of the manufacturing method of the sealing semiconductor. .

(3)
In the method for producing a sealed semiconductor according to the above (1) or (2), the release film preferably has a storage elastic modulus at 30 ° C. of 100.0 MPa or more and 800.0 MPa or less.

  If the storage elastic modulus of the release film at 30 ° C. is within this range, the release film can be easily along the recess of the mold even in a low temperature range in the release film installation process of the manufacturing method of the sealing semiconductor. Because you can.

(4)
A sealed semiconductor according to another aspect of the present invention is obtained by the method for manufacturing a sealed semiconductor according to any one of (1) to (3) above.

(5)
In the method for manufacturing a sealed semiconductor according to any one of the above (1) to (3), the sealed semiconductor is preferably a sealed optical semiconductor.

(6)
The sealed optical semiconductor according to another aspect of the present invention is obtained by the above-described method for manufacturing a sealed semiconductor (5).

It is a side view of the backup optical device which concerns on embodiment of this invention. It is a figure which shows the arrangement | positioning relationship of the preliminary | backup optical device, a release film, and a metal mold | die in the release film installation process of the sealing method of the optical semiconductor which concerns on embodiment of this invention. It is a figure which shows the state by which the release film was put in the recessed part of a metal mold | die in the release film installation process of the sealing method of the optical semiconductor which concerns on embodiment of this invention. In addition, in this figure, a preliminary | backup optical device and a release film are represented by the side view, and the metal mold | die is represented by the longitudinal cross-sectional view. It is a figure which shows the state which inject | poured sealing resin etc. into the metal mold | die covered with the release film in the injection | pouring resin etc. process of the sealing method of the optical semiconductor which concerns on embodiment of this invention. In this figure, the preliminary optical device and the release film are represented by side views, and the mold and the sealing resin are represented by longitudinal sectional views. It is a figure which shows the state by which the preliminary | backup optical device was press-contacted with respect to the metal mold | die in the optical semiconductor immersion process of the sealing method of the optical semiconductor which concerns on embodiment of this invention. In this figure, the preliminary optical device and the release film are represented by side views, and the mold and the sealing resin are represented by longitudinal sectional views. It is a figure which shows the state by which sealing resin etc. were solidified in the sealing resin etc. solidification process of the sealing method of the optical semiconductor which concerns on embodiment of this invention. In this figure, the optical device and the release film are represented by side views, and the mold and the solidified sealing resin are represented by longitudinal sectional views. 1 is a side view of an optical device according to an embodiment of the present invention. It is a longitudinal cross-sectional view of the release film which concerns on embodiment of this invention. It is a figure which shows an example of the manufacturing apparatus of the release film which concerns on embodiment of this invention. It is a longitudinal cross-sectional view of the release film which concerns on a modification.

<Optical semiconductor sealing method>
An optical semiconductor sealing method (sealing optical semiconductor manufacturing method) according to an embodiment of the present invention includes a release film installation step, a sealing resin injection step, an optical semiconductor immersion step, and a sealing resin solidification step. Have.

  In the present embodiment, examples of the optical semiconductor to be sealed include a light emitting diode (LED) chip. In the present embodiment, the optical semiconductor 120 is mounted on the support 110 as shown in FIG. Further, a circuit (not shown) is formed on the support 110, and the optical semiconductor 120 is electrically connected to the circuit via a bonding wire 130. Hereinafter, such a device 100 is referred to as a “backup optical device”.

  As the above-described LED chip, indium nitride (InN), aluminum nitride (AlN), gallium nitride (GaN), zinc selenide (ZnSe), silicon carbide (SiC) is formed on the substrate by a liquid phase growth method, MOCVD method or the like. ), Gallium phosphide (GaP), gallium arsenide (GaAs), gallium aluminum arsenide (GaAlAs), gallium aluminum nitride (GaAlN), aluminum indium gallium phosphide (AlInGaP), indium gallium nitride (InGaN), aluminum indium nitride It is preferable that a semiconductor such as gallium (AlInGaN) is formed as the light emitting layer. Examples of the support 110 include ceramic substrates, silicon substrates, metal substrates, and organic resin substrates such as polyimide resin, epoxy resin, and BT resin. Examples of the bonding wire 130 include a gold wire and an aluminum wire. The support 110 may be provided with an external lead of a circuit.

Hereinafter, each process is explained in full detail.
(1) Release Film Installation Step In the release film installation step, as shown in FIGS. 2 and 3, the release film 200 is placed along the recess (cavity) 310 of the mold 300. The release film 200 will be described in detail later. In this step, after the release film 200 covers the mold 300, the air in the recess 310 of the mold 300 is sucked through the air holes 320 by an air suction device (not shown). As a result, the release film 200 is along the recess 310 of the mold 300. In addition, after completion | finish of sealing resin etc. solidification process, while air is supplied to the recessed part 310 through the air hole 320, while the release film 200 is peeled from the metal mold | die 300, the optical device 101 (after-mentioned) is demolded. The

(2) Sealing resin injection process In the sealing resin injection process, as shown in FIG. 3 and FIG. 4, sealing is performed in a recess (hereinafter referred to as “release recess”) 311 along which the release film 200 is placed. A stop resin or a sealing resin precursor (hereinafter collectively referred to as “sealing resin or the like”) 400 is injected. In addition, as a sealing resin precursor, a curable silicone composition, a curable epoxy composition, etc. are mentioned.

(3) Optical Semiconductor Immersion Step In the optical semiconductor immersion step, as shown in FIG. 5, the preliminary optical device 100 is placed in the mold 300 so that the optical semiconductor 120 and the bonding wire 130 face the mold release recess 311 of the mold 300. The spare optical device 100 is pressed against the mold 300. As a result, the optical semiconductor 120 and the bonding wire 130 are immersed in the sealing resin 400 or the like in the release recess 311.

(4) Sealing resin etc. solidifying step In the sealing resin etc. solidifying step, as shown in FIG. 6 and FIG. 7, the optical semiconductor 120 and the bonding wire 130 are immersed in the sealing resin etc. 400. The resin 400 or the like is solidified, and the optical device 101 is manufactured. In this step, when the sealing resin 400 is a thermoplastic resin, the sealing resin 400 is solidified by cooling. On the other hand, when the sealing resin 400 is a precursor of a curable resin, the sealing resin 400 is solidified by heat curing or active energy ray curing. Hereinafter, the solidified sealing resin 400 or the like is referred to as “solidified sealing resin” and denoted by reference numeral 401 (see FIGS. 6 and 7).

  Further, the solidified sealing resin 401 is preferably bonded to the support 110 and the optical semiconductor 120. The solidified sealing resin 401 may be a transparent resin or a resin containing a phosphor or the like. The shape of the solidified sealing resin 401 is not particularly limited, and is generally a convex lens shape, a truncated cone shape, or a square truncated cone shape, but is preferably a convex lens shape.

(5) Other steps In the present embodiment, a cutting step may be provided as a subsequent step of the sealing resin or the like solidifying step. In the cutting step, a plurality of optical devices are manufactured from the optical device 101 by cutting or breaking the support 110 with a dicing saw, a laser, or the like.

<Details of release film>
The release film 200 according to the embodiment of the present invention is mainly composed of a release layer 210 and a cushion layer 220 as shown in FIG. In the present embodiment, the release film 200 preferably has a thickness of 25 to 300 μm.

Hereinafter, each of these layers will be described in detail.
<Details of constituent layers of release film>
1. Release Layer The release layer 210 is formed of a resin having good release properties with respect to the sealing resin 400 and the solidified sealing resin 401 (hereinafter referred to as “release layer forming resin”). As such a release layer forming resin, for example, a resin mainly composed of poly (4-methyl-1-pentene) (hereinafter referred to as “TPX (registered trademark) resin”), a polystyrene having a syndiotactic structure. Examples thereof include a resin mainly composed of an epoxy resin (hereinafter referred to as “SPS resin”), a resin mainly composed of polybutylene terephthalate resin, and a resin mainly composed of a polyether ester block copolymer. In the present embodiment, the thickness of the release layer 210 is preferably 5 μm or more, and more preferably 10 μm or more. Hereinafter, each release layer forming resin will be described in detail.

(1) Resin mainly composed of TPX resin The resin mainly composed of TPX resin preferably contains 90% by weight or more, preferably 95% by weight or more of TPX resin. Note that the release layer 210 may be formed of only TPX resin. TPX resin is commercially available from Mitsui Chemicals, Inc. under the trade name TPX (registered trademark).

(2) Resin mainly composed of SPS resin Resin mainly composed of SPS resin is commercially available from Idemitsu Kosan Co., Ltd. under the trade name Zalek (registered trademark) (XAREC (registered trademark)). The content of the SPS resin in the release layer forming resin is 70% by weight or more and 90% by weight or less, but preferably 85% by weight or more and 90% by weight or less.

  The SPS resin is a resin having a syndiotactic structure, that is, a stereoregular structure in which phenyl groups and substituted phenyl groups as side chains are alternately located in opposite directions with respect to the main chain formed from carbon-carbon sigma bonds. is there.

  As such SPS resin, for example, as disclosed in JP-A-2000-038461, racemic dyad is 75% or more, preferably 85% or more, or racemic pentad is 30% or more, preferably Polystyrene, poly (alkyl styrene), poly (aryl styrene), poly (halogenated styrene), poly (halogenated alkyl styrene), poly (alkoxy styrene), poly (vinyl benzoic acid) having a syndiotacticity of 50% or more Esters), hydrogenated polymers thereof and mixtures thereof, or copolymers based on these.

  Examples of poly (alkyl styrene) include poly (methyl styrene), poly (ethyl styrene), poly (isopropyl styrene), poly (t-butyl styrene), and the like.

  Examples of poly (aryl styrene) include poly (phenyl styrene), poly (vinyl naphthalene), poly (vinyl styrene), and the like.

  Examples of poly (halogenated styrene) include poly (chlorostyrene), poly (bromostyrene), poly (fluorostyrene), and the like.

  Examples of poly (halogenated alkylstyrene) include poly (chloromethylstyrene).

  Examples of poly (alkoxystyrene) include poly (methoxystyrene) and poly (ethoxystyrene).

  Of the above, polystyrene, poly (p-methylstyrene), poly (m-methylstyrene), poly (pt-ptylstyrene), poly (p-chlorostyrene), poly (m-chlorostyrene), Particularly preferred are poly (p-fluorostyrene), hydrogenated polystyrene and copolymers containing these structural units.

  In such a case, the crystallinity of the release layer forming resin is preferably 14.0% or more and less than 30.0% as measured by a differential scanning calorimeter (DSC). This is because when the crystallinity of the release layer forming resin is as described above, better mold followability than that of a conventional release film can be obtained.

(3) Resin mainly composed of polybutylene terephthalate resin The resin mainly composed of polybutylene terephthalate preferably contains 90% by weight or more of polybutylene terephthalate, and contains 95% by weight or more. Is preferred. The release layer 210 may be formed only from polybutylene terephthalate.

(4) Resin mainly composed of polyetherester block copolymer The resin composed mainly of polyetherester block copolymer contains 90% by weight or more of polyetherester block copolymer. Preferably, it is contained at 95% by weight or more. The release layer 210 may be formed only from the polyether ester block copolymer.

The polyether ester block copolymer is mainly composed of a polyether segment and a polyester segment. The weight ratio of the polyether segment to the polyester segment is preferably in the range of 80:20 to 90:10. The structural unit of the polyether segment is preferably mainly an oxybutylene unit, and the structural unit of the polyester segment is preferably an ester unit mainly represented by the following chemical formula (I). Such polyetherester block copolymers are commercially available from Mitsubishi Engineering Plastics Co., Ltd. under the trade names Novaduran (registered trademark) 5505S and 5510S.

(4) Resin other than TPX resin, SPS resin, polybutylene terephthalate resin, polyether ester block copolymer TPX resin, SPS resin, polybutylene terephthalate resin, polyether ester block copolymer constituting release layer forming resin Examples of other resins include elastomer resins, polyolefin resins, polystyrene resins, polyester resins, polyamide resins, polyphenylene ether resins, polyphenylene sulfide resins (PPS), and the like. In addition, these resin can be used individually or in combination of 2 or more types.

  Examples of the elastomer resin include natural rubber, polybutadiene, polyisoprene, polyisobutylene, neoprene, polysulfide rubber, thiocol rubber, acrylic rubber, urethane rubber, silicone rubber, epichlorohydrin rubber, styrene-butadiene block copolymer (SBR). ), Hydrogenated styrene-butadiene block copolymer (SEB), styrene-butadiene-styrene block copolymer (SBS), hydrogenated styrene-butadiene-styrene block copolymer (SEBS), styrene-isoprene block copolymer (SIR), hydrogenated styrene-isoprene block copolymer (SEP), styrene-isoprene-styrene block copolymer (SIS), hydrogenated styrene-isoprene-styrene block copolymer (S PS), or ethylene propylene rubber (EPM), ethylene propylene diene rubber (EPDM), olefin rubber such as linear low density polyethylene elastomer, or butadiene-acrylonitrile-styrene-core shell rubber (ABS), methyl methacrylate- Butadiene-styrene-core shell rubber (MBS), methyl methacrylate-butyl acrylate-styrene-core shell rubber (MAS), octyl acrylate-butadiene-styrene-core shell rubber (MABS), alkyl acrylate-butadiene-acrylonitrile-styrene-core shell rubber ( ABS), butadiene-styrene-core shell rubber (SBR), siloxane-containing cores such as methyl methacrylate-butyl acrylate-siloxane Particulate elastic material of the core-shell type, such as Rugomu, or they were modified rubber, and the like.

  Examples of the polyolefin resin include linear high-density polyethylene, linear low-density polyethylene, high-pressure low-density polyethylene, isotactic polypropylene, syndiotactic polypropylene, block polypropylene, random polypropylene, polybutene, 1,2- Examples thereof include polybutadiene, poly (4-methyl-1-pentene), cyclic polyolefin, and copolymers thereof (for example, ethylene-methyl methacrylate copolymer).

  Examples of the polystyrene resin include atactic polystyrene, isotactic polystyrene, high impact polystyrene (HIPS), acrylonitrile-butadiene-styrene copolymer (ABS), acrylonitrile-styrene copolymer (AS), and styrene-meta. Acrylic acid copolymer, styrene-methacrylic acid / alkyl ester copolymer, styrene-methacrylic acid / glycidyl ester copolymer, styrene-acrylic acid copolymer, styrene-acrylic acid / alkyl ester copolymer, styrene -Maleic acid copolymer, styrene-fumaric acid copolymer and the like.

  Examples of the polyester-based resin include polycarbonate, polyethylene terephthalate, polybutylene terephthalate, and the like.

  Examples of the polyamide-based resin include nylon (registered trademark) 6, nylon (registered trademark) 6, 6, and the like.

(3) Others For the mold release forming resin, various additives such as anti-blocking agent, antioxidant, nucleating agent, antistatic agent, process oil, plasticizer, mold release agent, flame retardant, flame retardant aid Agents, pigments, etc. may be blended.

  In addition, as an antiblocking agent, the following inorganic particles or organic particles are mentioned. Inorganic particles include Group IA, Group IIA, Group IVA, Group VIA, Group VIIA, Group VIIIA, Group IB, Group IIB, Group IIIB, Group IVB oxides, hydroxides, sulfides, nitrides, halogens , Carbonates, sulfates, acetates, phosphates, phosphites, organic carboxylates, silicates, titanates, borates and their water-containing compounds, and composite compounds and natural mineral particles centered on them Is mentioned.

  Specific examples of such inorganic particles include group IA element compounds such as lithium fluoride and borax (sodium borate hydrate); magnesium carbonate, magnesium phosphate, magnesium oxide (magnesia), magnesium chloride, acetic acid Magnesium, magnesium fluoride, magnesium titanate, magnesium silicate, magnesium silicate hydrate (talc), calcium carbonate, calcium phosphate, calcium phosphite, calcium sulfate (gypsum), calcium acetate, calcium terephthalate, calcium hydroxide, silicic acid Group IIA element compounds such as calcium, calcium fluoride, calcium titanate, strontium titanate, barium carbonate, barium phosphate, barium sulfate, barium sulfite; titanium dioxide (titania), titanium monoxide, titanium nitride, diacid Group IVA element compounds such as zirconium (zirconia) and zirconium monoxide; Group VIA element compounds such as molybdenum dioxide, molybdenum trioxide and molybdenum sulfide; Group VIIA element compounds such as manganese chloride and manganese acetate; Cobalt chloride and cobalt acetate Group VIII element compounds; Group IB element compounds such as cuprous iodide; Group IIB element compounds such as zinc oxide and zinc acetate; Aluminum oxide (alumina), aluminum hydroxide, aluminum fluoride, alumina silicate (alumina silicate, Group IIIB element compounds such as kaolin and kaolinite; Group IVB element compounds such as silicon oxide (silica, silica gel), graphite, carbon, graphite, glass; carnal stone, kainite, mica (mica, quinumo), and villose ore Examples include natural mineral particles.

  Examples of the organic particles include fluororesins, melamine resins, styrene-divinylbenzene copolymers, acrylic resin silicones, and cross-linked products thereof.

  The average particle size of the above-mentioned inorganic particles and organic particles is preferably 0.1 to 10 μm, and the addition amount is preferably 0.01 to 15% by weight.

  In addition, these antiblocking agents can be used individually or in combination of 2 or more types.

  As antioxidant, phosphorus antioxidant, phenolic antioxidant, sulfur antioxidant, 2-[(1-hydroxy-3,5-di-t-pentylphenyl) ethyl] -4,6- And di-t-pentylphenyl acrylate. These antioxidants can be used alone or in combination of two or more.

  Nucleating agents include metal salts of carboxylic acids such as aluminum di (pt-butylbenzoate), metal salts of phosphoric acid such as methylenebis (2,4-di-t-butylphenol) acid phosphate, talc, phthalocyanine derivatives Etc. In addition, these nucleating agents can be used individually or in combination of 2 or more types.

  Examples of the plasticizer include polyethylene glycol, polyamide oligomer, ethylene bisstearamide, phthalate ester, polystyrene oligomer, polyethylene wax, silicone oil, and the like. In addition, these plasticizers can be used individually or in combination of 2 or more types.

  Examples of the release agent include polyethylene wax, silicone oil, long chain carboxylic acid, and long chain carboxylic acid metal salt. In addition, these mold release agents can be used individually or in combination of 2 or more types.

  Examples of the process oil include paraffinic oil, naphthenic oil, and aromatic oil. Of these, paraffinic oils having a percentage of the number of carbon atoms related to paraffin (straight chain) calculated by the ndM method to the total number of carbon atoms of 60% Cp or more are preferable.

  The viscosity of the process oil is preferably 15 to 600 cs at 40 ° C., more preferably 15 to 500 cs. The amount of process oil added is preferably 0.01 to 1.5 parts by weight, more preferably 0.05 to 1.4 parts by weight, based on 100 parts by weight of the release-forming resin. More preferably, the content is 0.1 to 1.3 parts by weight. In addition, these process oil can be used individually or in combination of 2 or more types.

2. Cushion Layer Cushion layer 220 is formed of a resin mainly composed of polypropylene or ethylene-methyl methacrylate copolymer (hereinafter referred to as “cushion layer forming resin”) in the present embodiment. The cushion layer forming resin may be formed only from polypropylene or ethylene-methyl methacrylate copolymer. In addition, for the purpose of improving the adhesiveness to the release layer 210, the cushion layer forming resin includes a main component resin (TPX resin, SPS resin, polyetherester block copolymer) in the release layer forming resin described above. (Union) may be added. A polyolefin-based resin may be added to the cushion layer forming resin for the purpose of preventing flow-out during heating. Examples of the polyolefin resin include linear high-density polyethylene, linear low-density polyethylene, high-pressure low-density polyethylene, isotactic polypropylene, syndiotactic polypropylene, block polypropylene, random polypropylene, polybutene, 1, Examples include 2-polybutadiene, poly (4-methyl-1-pentene), cyclic polyolefin, and copolymers thereof.
In this embodiment, when the adhesiveness between the release layer 210 and the cushion layer 220 is not good, an anchor layer or a primer layer (adhesive layer) may be interposed between these layers.

  In addition, the above-mentioned elastomer resin and additives may be blended with the cushion layer forming resin as necessary, as long as the spirit of the present invention is not impaired.

<Method for producing release film>
The release film 200 according to the present embodiment can be manufactured by a method such as a coextrusion method or an extrusion lamination method.

  In the coextrusion method, the release film 200 is manufactured by simultaneously extruding the release layer 210 and the cushion layer 220 using a feed block and a multi-manifold die. In the coextrusion method, the melt M that has passed through the die 510 is guided to the first roll 530 and fixed to the first roll 530 by the touch roll 520 as shown in FIG. The release film 200 is cooled by the first roll 530 until it is detached from the 530. Thereafter, the release film 200 is sent to the downstream side in the film feeding direction (see the arrow in FIG. 9) by the second roll 540 and is finally taken up by a take-up roll (not shown). At this time, the temperature of the first roll 530 is preferably 30 to 100 ° C., the temperature of the touch roll 520 is preferably 30 to 100 ° C., and the peripheral speed of the second roll 540 with respect to the first roll 530. The ratio is preferably from 0.990 to 0.998.

  In the extrusion laminating method, the temperature of the extruder cylinder is set to 200 to 300 ° C., the release layer 210 is extruded, and the release layer 210 and the cushion layer 220 are joined together to form the release layer 210 and the cushion layer 220. The release film 200 is manufactured by laminating. In the extrusion laminating method, the release layer forming resin melt M that has passed through the die 510 is guided to the first roll 530 and fixed to the first roll 530 by the touch roll 520 as shown in FIG. Before being released from the first roll 530 and cooled by the first roll 530 to form the release layer film F. Thereafter, the release layer film F is sent downstream by the second roll 540 in the film feeding direction (see the arrow in FIG. 9). And the melt (not shown) of cushion layer formation resin is made to merge with release layer film F sent to the film feed direction downstream side, and it is integrated with release layer film F, and release film 200 is made. Manufactured. In addition, the release film 200 manufactured in this way is further wound up by the winding roll (not shown) provided in the film feed direction downstream side. At this time, the temperature of the first roll 530 is preferably 30 to 100 ° C., the temperature of the touch roll 520 is preferably 30 to 100 ° C., and the circumference of the second roll 540 with respect to the first roll 530 is The speed ratio is preferably 0.990 to 0.998.

  If necessary, the crystallinity of the TPX resin, SPS resin, polybutylene terephthalate resin, and polyetherester block copolymer in the release layer 210 of the release film 200 obtained as described above is publicly known. It may be adjusted by the heat treatment apparatus. For example, the heat treatment may be performed in the vicinity of 50 to 220 ° C. using a method of heat-setting the release film 200 in a dryer using a tenter device or a heat treatment roll.

<Modification>
In the previous embodiment, the release film 200 in which the release layer 210 is provided only on one side of the cushion layer 220 was introduced. However, as shown in FIG. 10, the release layers 210 a, A release film 200A provided with 210b is also included in one embodiment of the present invention. Hereinafter, the release layer denoted by reference numeral 210a is referred to as a “first release layer”, and the release layer denoted by reference numeral 210b is referred to as a “second release layer”.

  The first release layer 210a has the same structure as the release layer 210 according to the previous embodiment. On the other hand, the second release layer 210b may have the same structure as the first release layer 210a or may have a different structure from the first release layer 210a. In the latter case, the adhesive force between the second release layer 210b and the cushion layer 220 may be reduced. In such a case, an anchor layer or a primer is interposed between the second release layer 210b and the cushion layer 220. A layer (adhesive layer) may be interposed.

<Example>
Hereinafter, the present invention will be described in more detail with reference to examples.

1. Production of Release Film (1) Release Layer Raw Material TPX resin (TPX (registered trademark) MX002 manufactured by Mitsui Chemicals, Inc.) was used as a release layer raw material.

(2) Cushion Layer Raw Material As a cushion layer raw material, ethylene-methyl methacrylate copolymer (methyl methacrylate derived unit content: 5% by weight) (Aclift (registered trademark) WD106 manufactured by Sumitomo Chemical Co., Ltd.) ) (Hereinafter referred to as “EMMA”).

(3) Production of Release Film A release film (see FIG. 10) having the same release layer on the front and back sides of the cushion layer was produced using a coextrusion method.

  Specifically, a release film was prepared by simultaneously extruding TPX resin, EMMA and TPX resin using a multi-manifold die. In addition, the temperature of the 1st roll 530 at this time was 30 degreeC, the temperature of the touch roll 520 was 30 degreeC, and the peripheral speed ratio of the 2nd roll 540 with respect to the 1st roll 530 was 0.990.

  The thickness of the release layer of this release film was 15 μm on both sides, and the thickness of the cushion layer was 20 μm.

2. Evaluation of release film (1) Evaluation of mold followability of mold release film and appearance of molded product First, the release film obtained as described above under the condition of a mold temperature of 120 ° C. was divided into 16 hemispheres. A mold having a recess (radius of 3.5 mm) was put on, and air in the hemispherical recess was discharged from the air hole at 700 Torr using an air suction machine, and the release film was placed along the hemispherical recess (see FIGS. 2 and 2). (See FIG. 3). Then, the state (mold followability) of the release film after about 10 seconds was visually confirmed. In this confirmation, if the release film is along 80% or more of the surface area of the concave portion of the mold, the evaluation is A, and if the release film is along 60% or more of the surface area of the concave portion of the mold, it is evaluated as B. If the release film is only along less than 60% of the surface area of the concave portion of the mold, it was rated as C. In addition, the mold followable | trackability of the release film which concerns on a present Example was A evaluation (refer Table 1).

  Further, in the above-described state, after injecting the curable silicone composition into the hemispherical recesses covered with the release film, the curable silicone composition is heated to 120 ° C. while pressing the preliminary optical device against the mold. Heat cured under 5 minutes. “A cured product of the curable silicone composition completely transferred to the hemispherical recesses” was evaluated as A, and “the cured product could not completely transfer the shape of the hemispherical recesses” and “the same. “The cured product was distorted or chipped” was evaluated as B. In addition, the external appearance of the hardened | cured material (molded article) obtained using the release film which concerns on a present Example was A evaluation (refer Table 1).

(2) Storage Elastic Modulus of Release Film The storage elastic modulus of the release film was measured using “DMS-210 type manufactured by Seiko Electronics Co., Ltd.” viscoelasticity measuring device. Specifically, the release film was cut into a width of 4.0 mm and a length of 20.0 mm to prepare a test piece, and then the test piece was fixed to a chuck. And the storage elastic modulus of the test piece was measured while pulling the test piece. In addition, the storage elastic modulus in 30 degreeC was set to X, and the measurement result was classified by A determination and B determination as follows.
A determination: 100.0 MPa ≦ X ≦ 800.0 MPa
B determination: X <100.0 MPa or 800.0 MPa <X
Moreover, the storage elastic modulus in 120 degreeC was set to Y, and the measurement result was classified by A determination and B determination as follows.
A determination: 10.0 MPa ≦ Y ≦ 120.0 MPa
B determination: Y <10.0 MPa or 120.0 MPa <Y
The storage elastic modulus at 30 ° C. of the release film according to this example was A determination, and the storage elastic modulus at 120 ° C. was A determination (see Table 1).

  A release film was prepared in the same manner as in Example 1 except that polypropylene (Noblen FLX80E4 manufactured by Sumitomo Chemical Co., Ltd.) was used as a material for the cushion layer, and the release film was evaluated in the same manner as in Example 1. It was.

  As a result of the evaluation, the mold followability of the release film according to this example was B evaluation, and the appearance of the molded product was A evaluation (see Table 1). Moreover, the storage elastic modulus in 30 degreeC of the release film which concerns on a present Example was A determination, and the storage elastic modulus in 120 degreeC of the release film was A determination (refer Table 1).

  Except using a mixture of 70 parts by weight of polypropylene (Nobrene FLX80E4 manufactured by Sumitomo Chemical Co., Ltd.) and 30 parts by weight of TPX resin (TPX (registered trademark) MX002 manufactured by Mitsui Chemicals, Inc.) as a material for the cushion layer A release film was prepared in the same manner as in Example 1, and the release film was evaluated in the same manner as in Example 1.

  As a result of the evaluation, the mold followability of the release film according to this example was B evaluation, and the appearance of the molded product was A evaluation (see Table 1). Moreover, the storage elastic modulus in 30 degreeC of the release film which concerns on a present Example was A determination, and the storage elastic modulus in 120 degreeC of the release film was A determination (refer Table 1).

  A release film was prepared in the same manner as in Example 1 except that SPS resin (Zarek (registered trademark) S107 manufactured by Idemitsu Kosan Co., Ltd.) was used as a raw material for the release layer. The release film was evaluated.

  As a result of the evaluation, the mold followability of the release film according to this example was A evaluation, and the appearance of the molded product was A evaluation (see Table 1). Moreover, the storage elastic modulus in 30 degreeC of the release film which concerns on a present Example was A determination, and the storage elastic modulus in 120 degreeC of the release film was A determination (refer Table 1).

  Polybutylene terephthalate / polytetramethylene glycol block copolymer (polybutylene terephthalate structural unit / polytetramethylene glycol structural unit 90 parts by weight / 10 parts by weight) (Novaduran manufactured by Mitsubishi Engineering Plastics Co., Ltd.) A release film was prepared in the same manner as in Example 1 except that (registered trademark) 5505S) was used, and the release film was evaluated in the same manner as in Example 1.

As a result of the evaluation, the mold followability of the release film according to this example was A evaluation, and the appearance of the molded product was A evaluation (see Table 1). Moreover, the storage elastic modulus in 30 degreeC of the release film which concerns on a present Example was A determination, and the storage elastic modulus in 120 degreeC of the release film was A determination (refer Table 1).
(Comparative Example 1)

  A single-layer release film of TPX resin was produced using an extrusion method. The single-layer release film had a thickness of 50 μm. Then, this single-layer release film was evaluated in the same manner as in Example 1.

As a result of the evaluation, the mold followability of the single-layer mold release film according to this comparative example was C evaluation, and the appearance of the molded product was also B evaluation (see Table 1). Further, the storage elastic modulus at 30 ° C. of the single-layer release film according to this comparative example was A, and the storage elastic modulus at 120 ° C. of the single-layer release film was B (see Table 1). ).
(Comparative Example 2)

1. Production of Release Film (1) Release Layer Raw Material An ethylene-tetrafluoroethylene copolymer (ethylene content: 41% by weight) (hereinafter referred to as “ETFE”) was used as a release layer raw material.

(2) Raw material for heat-resistant resin layer Polyamide-66 (Leona 1700S manufactured by Asahi Kasei Co., Ltd.) (hereinafter referred to as “PA-66”) was used as a raw material for the heat-resistant resin layer.

(3) Adhesive Layer Raw Material A polyester-based adhesive (PEs AD) was used as a raw material for the adhesive layer that bonds the release layer and the heat-resistant resin layer.

(4) Production of Release Film First, PA-66 was melt extruded at 300 ° C. to produce a polyamide film having a thickness of 30 μm. Next, a polyester adhesive was applied to one side of the polyamide film so that the film thickness after drying was 1 μm, and an adhesive layer was formed on one side of the polyamide film. Subsequently, this polyamide film with an adhesive layer was placed in an extrusion laminating apparatus. Thereafter, ETFE was melt extruded at 320 ° C. while adjusting the slit width of the T-type die so that the film thickness of the release layer was 15 μm, thereby producing an ETFE film. And this ETFE film was laminated at 130 degreeC on the polyamide film with an adhesive layer using the back roll, and the release film was obtained.

2. Evaluation of Release Film In the same manner as in Example 1, the release film according to this comparative example was evaluated.
As a result of evaluation, the mold followability of the release film according to this comparative example was C evaluation, and the appearance of the molded product was also B evaluation (see Table 1). Moreover, the storage elastic modulus in 30 degreeC of the release film which concerns on this comparative example was B determination, and the storage elastic modulus in 120 degreeC of the release film was B determination (refer Table 1).
(Comparative Example 3)

1. Production of release film (1) Raw material for release layer As raw material for the first release layer, 4-methyl-1-pentene and dialene 168 (Mitsubishi Chemical Corporation's 16- and 18-carbon α-olefins) And a copolymer (content of diallene 168: 1.5% by weight) (hereinafter referred to as “MP copolymer”).

(2) Raw material for heat-resistant resin layer Polyamide-66 (Leona 1700S manufactured by Asahi Kasei Co., Ltd.) (hereinafter referred to as “PA-66”) was used as a raw material for the heat-resistant resin layer.

(3) Raw Material for Adhesive Layer As a raw material for the adhesive layer that bonds the release layer and the heat-resistant resin layer, a graft copolymer obtained by grafting maleic anhydride onto poly (4-methyl-1-pentene) (hereinafter referred to as “MA-”). g-MP copolymer ").

(4) Production of release film Using a coextrusion method, a release film having the same adhesive layer and release layer on the front and back of the heat-resistant resin layer was produced.

  Specifically, MP copolymer, MA-g-MP copolymer, PA-66, MA-g-MP copolymer and MP copolymer are simultaneously mixed using a feed block and a multi-manifold die. A release film was prepared by extrusion.

  The thickness of the release layer of this release film was 15 μm on both sides, the thickness of the adhesive layer was 5 μm on both sides, and the thickness of the cushion layer was 25 μm.

2. Evaluation of Release Film The release film according to this comparative example was evaluated in the same manner as in Example 1.
As a result of evaluation, the mold followability of the release film according to this comparative example was C evaluation, and the appearance of the molded product was also B evaluation (see Table 1). Moreover, the storage elastic modulus in 30 degreeC of the release film which concerns on this comparative example was B determination, and the storage elastic modulus in 120 degreeC of the release film was B determination (refer Table 1).

100 Preliminary optical device 101 Optical device 110 Support 120 Optical semiconductor (semiconductor)
130 Bonding wire 200 Release film 200A Release film 210 Release layer 210a First release layer 210b Second release layer 220 Cushion layer 300 Mold (mold)
310 Concave part 311 Release concave part 320 Air hole 400 Sealing resin, etc. (sealing resin or sealing resin precursor)
401 Solidified sealing resin 510 Dice 520 Touch roll 530 First roll 540 Second roll

Claims (6)

A release film installation step in which a release film having a cushion layer mainly composed of polyolefin and a release layer provided on at least one side of the cushion layer is disposed along a recess of the mold;
A sealing resin injection step for injecting a sealing resin or a sealing resin precursor into the concave portion (hereinafter referred to as “release concave portion”) along which the release film is placed;
A semiconductor immersion step of immersing a semiconductor in the sealing resin or the sealing resin precursor in the release recess;
A method for producing a sealing semiconductor, comprising: a step of solidifying the sealing resin or the sealing resin precursor in a state where the semiconductor is immersed in the sealing resin or the sealing resin precursor, and the like. . The method for producing a sealed semiconductor according to claim 1, wherein the release film has a storage elastic modulus at 120 ° C. of 10.0 MPa or more and 120.0 MPa or less. The method for producing a sealed semiconductor according to claim 1, wherein the release film has a storage elastic modulus at 30 ° C. of 100.0 MPa or more and 800.0 MPa or less.   The sealing semiconductor obtained by the manufacturing method of the sealing semiconductor of any one of Claim 1 to 3. The method for manufacturing a sealed semiconductor according to claim 1, wherein the sealed semiconductor is a sealed optical semiconductor.   A sealed optical semiconductor obtained by the method for producing a sealed semiconductor according to claim 5.