JP2013084779A - Spherical body suction device, spherical body mounting device, spherical body suction method, and spherical body mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a suction failure.SOLUTION: A spherical body suction device comprises: a suction head 11 having an adsorption face 22a in which a plurality of suction ports 23a are formed; a holding part 32 which holds solder balls 300 by a gas-permeable sheet 32d (holding surface); a movement mechanism which relatively moves the holding part 32 with respect to the suction head 11; a control section which controls the movement mechanism and executes movement processing for moving the holding part 32 along the adsorption face 22a while maintaining the state that the gas-permeable sheet 32d holding the solder balls 300 is in close vicinity to the adsorption face 22a; and a rotation mechanism which rotates the holding part 32. The holding part 32 is so formed that the cross-sectional shape of the gas-permeable sheet 32d is arc-shaped. The control section controls the rotation mechanism to execute rotation processing for rotating the holding part 32 around a specified position, which is previously specified, in interrelation with movement processing, to a direction opposite to a relative moving direction of the holding part 32 in the movement processing.

Description

  The present invention relates to a spherical body adsorption device that adsorbs a spherical body, a spherical body mounting device that includes the spherical body adsorption device and mounts the spherical body on a mounting target body, a spherical body adsorption method that adsorbs a spherical body, and the spherical body The present invention relates to a spherical body mounting method for mounting a spherical body adsorbed by an adsorption method on a mounting target body.

  As this type of spherical body adsorbing apparatus, a solder ball adsorbing apparatus disclosed by the applicant in Japanese Patent Application Laid-Open No. 2011-9591 is known. The solder ball suction device includes a suction head, a container, a suction holding unit, a drive mechanism, an alignment plate, a control unit, and the like, and is configured to be able to suck solder balls. In this solder ball adsorption device, the solder balls are adsorbed as follows. First, the suction holding unit sucks and holds the solder balls stored in the storage container, and then the control unit controls the drive mechanism so that the tip of the suction holding unit faces the suction surface of the suction head. The suction holding part is rotated as described above. Subsequently, the control unit controls the driving mechanism to bring the tip of the suction holding unit close to one end of the alignment plate. At this time, the solder ball held at the tip portion close to the alignment plate (the suction surface of the suction head) is supplied to the suction head, and the supplied solder ball is attracted to the suction port of the suction surface. Then, the air is adsorbed to the air inlet through each insertion hole of the alignment plate. Next, the control unit controls the drive mechanism to move the suction holding unit along the alignment plate (the suction surface of the suction head) in a state where the tip of the suction holding unit is brought close to the alignment plate. At this time, the solder balls held at the tip are gradually supplied to each suction port of the suction head as the suction holding unit moves, and are sucked one by one at the edge of each suction port.

Japanese Patent Laying-Open No. 2011-9591 (page 6-9, FIG. 10-14)

  However, the solder ball suction device has the following problems to be improved. That is, in this solder ball suction device, the solder ball is supplied to the suction head by moving the tip of the suction holding portion holding the solder ball along the alignment plate (the suction surface of the suction head). . On the other hand, in this solder ball suction device, in order to reliably supply the solder balls, the suction holding part is used for the alignment plate by using a spring so that the solder balls held by the suction holding part are in contact with the alignment plate. Is energized. That is, in this solder ball suction device, the solder ball held by the suction holding portion is moved along the alignment plate while being pressed against the alignment plate (that is, slid with respect to the alignment plate). . For this reason, in this solder ball suction device, the solder ball is worn or deformed by sliding, and the solder ball fits into the insertion hole of the alignment plate or the suction port of the suction head, causing a suction failure (suction failure). ) May occur. Also, the solder balls fall off (drop) from the suction holding unit due to sliding, and for example, there is not enough solder balls to be supplied to the suction head in the second half of the process of moving the suction holding unit along the alignment plate. As a result, there is a risk of poor adsorption.

  This invention is made | formed in view of this subject, and it aims at providing the spherical body adsorption | suction apparatus, spherical body mounting apparatus, spherical body adsorption | suction method, and a spherical body mounting method which can prevent adsorption | suction failure.

  In order to achieve the above object, a spherical body suction device according to claim 1, wherein a suction head having a suction surface in which a plurality of air inlets are formed, a holding portion that holds the spherical body on a holding surface of a tip portion, and the holding A moving mechanism that moves the portion relative to the suction head, and a proximity state in which the holding surface that holds the spherical body by controlling the moving mechanism is relatively close to the suction surface A spherical body adsorbing device that adsorbs the spherical body to each of the intake ports, and a control unit that executes a movement process for relatively moving the holding unit along the adsorption surface while maintaining A rotation mechanism for rotating the holding portion; and the holding portion is rotated by the rotation mechanism about a predetermined position at a base end portion, and a cross-sectional shape of the holding surface is the proximity Projecting toward the suction surface in the state The control unit controls the rotation mechanism to rotate the holding unit in a direction opposite to the relative movement direction of the holding unit in the movement process. Execute in conjunction with the move process.

  Moreover, the spherical body adsorption | suction apparatus of Claim 2 is a spherical body adsorption | suction apparatus of Claim 1, The said control part WHEREIN: The relative moving speed of the said holding | maintenance part in the said movement process, and the said holding | maintenance in the said rotation process The moving mechanism and the turning mechanism are controlled so that the peripheral speed of the surface is the same.

  Moreover, the spherical body adsorption | suction apparatus of Claim 3 is a spherical body adsorption | suction apparatus of Claim 1 or 2, Comprising: The holding | maintenance part is a part of the periphery where the cross-sectional shape of the said holding surface is centering on the said prescribed position Or it is formed in the same shape as the whole.

  According to a fourth aspect of the present invention, there is provided the spherical body mounting device according to any one of the first to third aspects, the suction position where the spherical body is suctioned, and the spherical body mounted on the mounting target body. And a transport device that transports the suction head of the spherical body suction device between the mounting position and the mounting position.

  According to a fifth aspect of the present invention, there is provided a spherical body suction method in which a holding surface of a holding portion that holds a spherical body is relative to the suction surface of a suction head having a suction surface on which a plurality of air inlets are formed. A spherical body adsorbing method of performing a moving process of relatively moving the holding portion along the adsorption surface while adsorbing the spherical body to each of the intake ports while maintaining a proximity state close to Using the holding portion formed in an arc shape in which the cross-sectional shape of the holding surface protrudes toward the suction surface side in the proximity state, the direction of relative movement of the holding portion in the moving process is reversed. A rotation process for rotating the holding part around the predetermined position at the base end part of the holding part in the direction is executed in conjunction with the movement process.

  The spherical body adsorption method according to claim 6 is the spherical body adsorption method according to claim 5, wherein a relative movement speed of the holding portion in the movement process and a peripheral speed of the holding surface in the rotation process are as follows. The holding part is moved and rotated so as to have the same speed.

  The spherical body adsorption method according to claim 7 is the spherical body adsorption method according to claim 5 or 6, wherein a cross-sectional shape of the holding surface is the same as a part or all of a circumference centered on the specified position. The holding part formed in the above is used.

  Moreover, the spherical body mounting method according to claim 8 is the suction method in which the spherical body is adsorbed by the adsorption head by the spherical body adsorption method according to any one of claims 5 to 7 and the spherical body is adsorbed. The spherical body is mounted on the mounting target body by moving the head to the mounting position.

  According to the spherical body adsorption device according to claim 1, the spherical body mounting device according to claim 4, the spherical body adsorption method according to claim 5, and the spherical body mounting method according to claim 8, the holding surface has a cross-sectional shape. In conjunction with the movement process of moving the holding part formed in an arc along the suction surface of the suction head, a rotation process for rotating the holding part in the direction opposite to the relative movement direction of the holding part is executed. By doing so, the spherical body held on the holding surface does not slide with respect to the suction surface of the plate or suction head that restricts the suction of excess spherical bodies (or the sliding is suppressed to a small extent). Can be supplied in the vicinity of each intake port. Therefore, according to the spherical body adsorption device, the spherical body mounting device, the spherical body adsorption method, and the spherical body mounting method, wear and deformation of the spherical body due to sliding are surely prevented. It is possible to reliably prevent the occurrence of suction failure caused by fitting the spherical body into the through hole of the plate or the suction port of the suction head. In addition, it is possible to reliably prevent the occurrence of suction failure due to the drop of the spherical body from the holding portion (falling) due to sliding and the shortage of the spherical body supplied to the suction head in the second half of the movement process. it can.

  Further, according to the spherical body adsorption device according to claim 2, the spherical body mounting device according to claim 4, the spherical body adsorption method according to claim 6, and the spherical body mounting method according to claim 8, the holding in the movement process is performed. By moving and rotating the holding unit so that the relative moving speed of the unit and the peripheral speed of the holding surface in the rotation process are the same, the extra spherical body held on the holding surface is removed. It can be supplied to the vicinity of each intake port in a state of hardly sliding with respect to a plate or suction surface that restricts the suction of the spherical body. For this reason, according to the spherical body adsorption device, the spherical body mounting device, the spherical body adsorption method, and the spherical body mounting method, wear and deformation of the spherical body due to sliding can be surely prevented, resulting in occurrence of poor adsorption. Can be prevented more reliably.

  Further, according to the spherical body adsorption device according to claim 3, the spherical body mounting device according to claim 4, the spherical body adsorption method according to claim 7, and the spherical body mounting method according to claim 8, the cross-section of the holding surface The distance between the specified position and the holding surface is constant because the distance between the specified position and the holding surface is constant by using a holding part that has the same shape as a part of the circumference centered on the specified position. When the movement process is executed in the state maintained in this state and the rotation process is executed in conjunction with the movement process, the distance from the position closest to the suction surface on the holding surface to the suction surface can be kept constant. Therefore, according to the spherical body adsorption device, the spherical body mounting device, the spherical body adsorption method, and the spherical body mounting method, when the rotation process is executed, the spherical body held on the holding surface is an extra spherical body. As a result of pressing with the same force against the plate or suction surface that restricts suction, it is possible to reliably prevent deformation of the spherical body due to change in the pressing force.

1 is a configuration diagram showing a configuration of a solder ball mounting device 1. 2 is a configuration diagram showing a configuration of a solder ball adsorption device 2. FIG. 2 is a cross-sectional view showing a configuration of a suction head 11. FIG. FIG. 4 is a cross-sectional view showing the configuration of the bottom wall 22 of the suction head 11 and the alignment plate 14. 3 is a perspective view showing a configuration of a supply unit 12. FIG. 3 is a cross-sectional view showing a configuration of a supply unit 12. FIG. 3 is an exploded perspective view showing a configuration of a supply unit 12. FIG. 3 is a cross-sectional view showing a configuration of a holding unit 32. FIG. FIG. 6 is a first explanatory view explaining the operation of the solder ball mounting apparatus 1. FIG. 6 is a second explanatory view for explaining the operation of the solder ball mounting apparatus 1. FIG. 10 is a third explanatory view for explaining the operation of the solder ball mounting apparatus 1. FIG. 10 is a fourth explanatory view for explaining the operation of the solder ball mounting apparatus 1. FIG. 10 is a fifth explanatory diagram for explaining the operation of the solder ball mounting apparatus 1. FIG. 10 is a sixth explanatory diagram illustrating the operation of the solder ball mounting apparatus 1. FIG. 10 is a seventh explanatory diagram for explaining the operation of the solder ball mounting apparatus 1; FIG. 10 is an eighth explanatory view for explaining the operation of the solder ball mounting apparatus 1; FIG. 10 is a ninth explanatory diagram illustrating the operation of the solder ball mounting apparatus 1.

  Hereinafter, a spherical body adsorption device, a spherical body mounting device, a spherical body adsorption method, and a spherical body mounting method will be described with reference to the accompanying drawings.

  First, the configuration of the solder ball mounting apparatus 1 shown in FIG. 1 will be described. The solder ball mounting device 1 is an example of a spherical body mounting device, and includes a solder ball adsorption device 2 and a transfer device 3 as shown in FIG. Solder balls (microballs) 300 (see FIG. 4), which are spherical particles, can be mounted (placed) on a substrate 400 (a terminal 401 formed on the substrate 400: see FIG. 17) as a mounting object. ing.

  In this case, the solder ball 300 is formed in a spherical shape having a diameter L1 (see FIG. 4) of about 80 μm. In addition, as shown in FIG. 17, the solder ball 300 is mounted on the substrate 400 by the solder ball mounting apparatus 1 and then heated and melted to form a substantially hemispherical surface (a terminal 401 shown in FIG. 17). ) To form a ball grid array (BGA) on the substrate 400, whereby a solder mounted substrate (spherical substrate mounted substrate) is manufactured. In addition, an electronic component (not shown) such as an integrated circuit is mounted on the solder-mounted substrate manufactured in this way, and terminals in the electronic component are fixed to the terminals 401 of the substrate 400 in the solder-mounted substrate. The printed circuit board is connected to the terminal 401 through the solder ball 300, thereby manufacturing the electronic component mounted board.

  The solder ball suction device 2 is an example of a spherical body suction device, and includes a suction head 11, a supply unit 12, a suction device 13, an alignment plate 14, and a control unit 15, as shown in FIG. Then, the solder balls 300 are adsorbed according to the spherical body adsorbing method.

  As illustrated in FIG. 3, the suction head 11 is configured as a hollow box having an internal space 21 as an example. As shown in FIG. 4 and FIG. 4, the bottom wall 22 of the suction head 11 opens to the outer surface of the bottom wall 22 (a surface that functions as a suction surface, hereinafter also referred to as “suction surface 22a”). In addition, a plurality of intake holes 23 communicating with the internal space 21 are formed along the thickness direction of the bottom wall 22 (only one of them is shown in FIG. 4). The opening portion of the suction hole 23 in the suction surface 22a corresponds to an intake port (hereinafter also referred to as “intake port 23a”).

  In this case, as shown in FIG. 4, the diameter L2 of the suction hole 23 (that is, the suction opening 23a) is defined to be about 40 μm shorter than the diameter L1 of the solder ball 300 (80 μm in this example). As shown in FIG. 3, the suction head 11 is formed with a vent hole 24 for sucking the air in the internal space 21 by the intake device 13. In the suction head 11, the air in the internal space 21 is sucked by the air intake device 13, so that the internal space 21 is in a negative pressure state, and air is sucked from the air intake port 23 a along with this, whereby the air intake port 23 a is soldered. The ball 300 can be adsorbed (see FIG. 4).

  As shown in FIGS. 5 to 7, the supply unit 12 includes a storage container 31, a holding unit 32, a suction unit 33, a moving mechanism 34, and a rotation mechanism 35 (all of which are shown in FIG. 2), and is provided to the suction head 11. Then, supply processing for supplying the solder balls 300 is executed. The supply unit 12 is urged toward the alignment plate 14 (positioning position of the alignment plate 14) by a spring (not shown).

  As shown in FIG. 7, the container 31 includes a container main body 31a and two side walls 31b disposed on both sides of the container main body 31a, and stores the solder balls 300 as shown in FIG. It is configured to be possible.

  As shown in FIG. 6, the holding portion 32 is configured as a hollow box having an internal space 32 c. A breathable sheet 32d as a holding surface is disposed at the distal end portion 32a of the holding portion 32, and an intake pipe 32e is attached to the proximal end portion 32b. In the holding portion 32, the air in the internal space 32 c is sucked by the air intake device 13, so that the internal space 32 c is in a negative pressure state, and air is sucked through the air permeable sheet 32 d accordingly. It is possible to adsorb and hold the solder ball 300 accommodated in the tip 32a (breathable sheet 32d) (see FIG. 10).

  Moreover, in this holding part 32, as shown in FIG. 8, the cross-sectional shape of the air permeable sheet 32d as the holding surface is directed toward the adsorption surface 22a in the proximity state in which the air permeable sheet 32d is brought close to the adsorption surface 22a. It is formed in a protruding arc shape (an example of an arc shape) (upward in the figure). More specifically, the air-permeable sheet 32d has a cross-sectional shape corresponding to a central axis of the intake pipe 32e attached to the base end portion 32b (predetermined predetermined position at the base end portion, It is formed in the same shape as a part (a part or all of an example) of the circumference of a circle (circle C shown in the figure) centered on P). Further, the holding portion 32 is configured to be rotatable about the above-described specified position P.

  As shown in FIG. 7, the suction unit 33 is connected via a suction path 33 c (see FIG. 6) formed by two partition walls 33 a and 33 b and two side walls 31 b and 31 b constituting the storage container 31. The solder ball 300 can be sucked.

  The moving mechanism 34 moves the supply unit 12 (the storage container 31, the holding unit 32, and the suction unit 33) according to the control of the control unit 15. Specifically, the moving mechanism 34 is configured such that the tip 32a is close to the suction surface 22a in a state where the tip 32a of the holding portion 32 holding the solder ball 300 faces the suction surface 22a of the suction head 11. Then, the supply unit 12 is moved. Further, the moving mechanism 34 moves the supply unit 12 along the suction surface 22a while maintaining a proximity state in which the tip portion 32a is brought close to the suction surface 22a. The rotation mechanism 35 rotates the holding unit 32 around the specified position P under the control of the control unit 15.

  The suction device 13 is connected to the vent hole 24 of the suction head 11 via an air tube 50 (see FIG. 2), and sucks the air in the internal space 21 in the suction head 11. The intake device 13 is connected to the intake pipe 32 e of the holding unit 32 in the supply unit 12 via the air tube 50 and is connected to the suction path 33 c of the suction unit 33 in the supply unit 12 via the air tube 50. In addition, the air in the internal space 32c in the holding unit 32 is sucked and air is sucked from the suction path 33c. In this case, the intake device 13 includes a plurality of electromagnetic valves, and is configured to be capable of individually sucking air in the internal space 21, sucking air in the internal space 32c, and sucking air from the suction path 33c. ing.

  The alignment plate 14 has a function of regulating the suction of the excessive solder balls 300 by the suction head 11 and is disposed at a position above the position where the supply unit 12 is disposed. Further, as shown in FIG. 4, the alignment plate 14 is opposed to the air inlet 23 a of the suction head 11 in a mounted state where the suction surface 22 a and the upper surface 14 a of the suction head 11 are in contact (or close proximity). The through-hole 14c is formed in. In this case, the diameter L4 of the through hole 14c is defined as about 95 μm through which the solder ball 300 can pass. Further, as shown in the figure, the thickness L3 of the alignment plate 14 is defined to be about 75 μm in which the tip of the solder ball 300 adsorbed to the air inlet 23a slightly protrudes from the lower surface 14b in the mounted state.

  The control unit 15 controls the moving mechanism 34 of the supply unit 12 to move the holding unit 32 (supply unit 12) (executes a movement process described later). Further, the control unit 15 controls the rotation mechanism 35 of the supply unit 12 to rotate the holding unit 32 with the specified position P as the rotation center (executes a rotation process described later). Further, the control unit 15 controls intake (air suction) by the intake device 13. Further, the control unit 15 controls the transport of the substrate 400 by the transport device 3.

  The transfer device 3 mounts the solder ball 300 on the substrate 400 and a suction position (positioning position of the alignment plate 14) where the solder ball 300 is sucked according to the control of the control unit 15 in the solder ball suction device 2. The suction head 11 is transported between the position (position where the substrate 400 is disposed).

  Next, a method for mounting the solder ball 300 adsorbed on the substrate 400 using the solder ball mounting apparatus 1 according to the spherical body adsorption method (spherical body mounting method) will be described with reference to the drawings.

  First, the air suction device 13 of the solder ball adsorption device 2 is operated, and then a start operation is performed on an operation unit (not shown). In response to this, the control unit 15 controls the electromagnetic valve of the intake device 13 to suck air in the internal space 21 in the suction head 11, suck air in the internal space 32c in the holding unit 32 of the supply unit 12, and Intake from the suction path 33c in the suction part 33 of the supply part 12 is started. At this time, the internal space 32c is brought into a negative pressure state due to the suction of air in the internal space 32c in the holding portion 32, and the air is sucked through the air permeable sheet 32d accordingly, thereby being accommodated in the storage container 31. The solder ball 300 is attracted and held by the air permeable sheet 32d.

  In addition, the control unit 15 controls the transport device 3 to transport the suction head 11 to a suction position (positioning position of the alignment plate 14) where the solder balls 300 are suctioned, and the suction surface 22 a of the suction head 11. And the upper surface 14a of the alignment plate 14 are brought into contact (close proximity) (see FIG. 4).

  Subsequently, the control unit 15 causes the supply unit 12 to execute a supply process. Specifically, the control unit 15 controls the moving mechanism 34 of the supply unit 12, and as shown in FIG. 9, the base end portion 32b of the holding unit 32 holding the solder balls 300 on the air permeable sheet 32d. By rotating the intake pipe 32e attached to the holder 32, the holding portion 32 is rotated about the specified position P.

  Next, as shown in FIG. 10, the control unit 15 is configured such that one end portion (the left end portion in the drawing) of the breathable sheet 32 d of the holding portion 32 is one end portion (on the lower surface 14 b of the alignment plate 14). When this position is opposite to the “movement start position” at the left end in the figure, the rotation mechanism 35 is controlled to rotate the holding section 32 (the rotation of the intake pipe 32e). Motion).

  Subsequently, the control unit 15 controls the moving mechanism 34 to move the holding unit 32 (supply unit 12) toward the suction surface 22a of the suction head 11 as illustrated in FIG. One end of the is moved closer to the movement start position. In this case, since the supply unit 12 is urged toward the alignment plate 14 by a spring (not shown), the solder balls 300 held by the air-permeable sheet 32d are moved to the alignment plate 14 as shown in FIG. In contact (contact) with the lower surface 14b.

  Next, as shown in FIG. 12, the control unit 15 controls the moving mechanism 34 to move along the suction surface 22a, for example, to the right in the figure (direction of arrow A shown in the figure: relative to the holding unit). A process of moving the holding unit 32 in the direction of movement (hereinafter, a process of moving the holding unit 32 along the suction surface 22a is also referred to as a “movement process”) is started. Further, the control unit 15 controls the rotation mechanism 35 to rotate the intake pipe 32e in conjunction with the start of the movement process, thereby holding the movement process around the specified position P (see FIG. 10). In the direction opposite to the relative movement direction of the portion 32 (in this example, the direction in which the air-permeable sheet 32d moves to the left and the counterclockwise direction indicated by the arrow B in the figure). A process of rotating the holding unit 32 (hereinafter, a process of rotating the holding unit 32 in a direction opposite to the direction of relative movement of the holding unit 32 in the moving process is also referred to as “rotating process”) is started.

  In this case, the control unit 15 determines the relative moving speed Vt of the holding unit 32 in the moving process (the relative speed of the specified position P (the position of the central axis of the intake pipe 32e) with respect to the suction surface 22a) and the rotation of the holding unit 32. The moving mechanism 34 and the rotating mechanism 35 are controlled so that the peripheral speed Vr of the breathable sheet 32d during the movement is the same speed.

  By starting the movement process and the rotation process, as shown in FIG. 12, the solder ball 300 held by the air permeable sheet 32d is supplied to the vicinity of the air inlet 23a formed in the suction surface 22a. The Further, the suction of the air causes the internal space 21 of the suction head 11 to be in a negative pressure state, which causes air to flow into the internal space 21 of the suction head 11 from each intake port 23a. The supplied solder balls 300 are attracted to the intake port 23a and are adsorbed to the intake port 23a through the through holes 14c of the alignment plate 14 as shown in FIG.

  Subsequently, as shown in FIG. 13, the movement process and the rotation process are successively performed, whereby the solder balls 300 are attracted one by one to each of the air inlets 23a. Subsequently, as shown in FIG. 14, the control unit 15 is configured such that the other end (the right end in the figure) of the air permeable sheet 32 d is the other end (the right side in the figure) of the lower surface 14 b of the alignment plate 14. When it is positioned at the right end), the rotation mechanism 35 is controlled to end the rotation process (at this point, the movement process is continued).

  In the solder ball mounting device 1, as described above, the moving process is performed in which the holding portion 32 in which the cross-sectional shape of the air-permeable sheet 32d as the holding surface is formed in an arc shape is moved along the suction surface 22a. In conjunction with the movement process, a rotation process for rotating the holding part 32 in the direction opposite to the direction of relative movement of the holding part 32 is executed. In this case, by executing the rotation process in conjunction with the movement process, the solder balls 300 held by the air permeable sheet 32d do not slide with respect to the alignment plate 14 (or the sliding is less). In a suppressed state), the air is supplied to the vicinity of each intake port 23a. For this reason, in this solder ball mounting apparatus 1, wear and deformation of the solder ball 300 due to sliding are prevented, and as a result, the worn solder ball 300 and the deformed solder ball 300 are inserted into the through holes 14 c of the alignment plate 14 and the suction head. 11 is reliably prevented from occurring due to fitting into the 11 intake ports 23a. In addition, it is possible to surely generate a suction failure due to the solder ball 300 dropping (falling) from the holding portion 32 due to sliding, and insufficient solder balls 300 supplied to the suction head 11 in the second half of the movement process. Is prevented.

  Further, in the solder ball mounting apparatus 1, the holding unit 32 is moved and rotated so that the moving speed Vt in the moving process and the peripheral speed Vr of the air-permeable sheet 32d in the rotating process become the same speed. For this reason, in the solder ball mounting apparatus 1, the solder balls 300 held by the air permeable sheet 32d are supplied to the vicinity of the air inlets 23a in a state of hardly sliding with respect to the alignment plate 14. Therefore, in this solder ball mounting apparatus 1, the wear and deformation of the solder ball 300 due to sliding are surely prevented, and as a result, the occurrence of poor suction is more reliably prevented.

  Next, the control unit 15 controls the moving mechanism 34 to further move the supply unit 12 along the lower surface 14b of the alignment plate 14 as shown in FIG. At this time, as shown in the drawing, the tip of the suction portion 33 moves along the lower surface 14b in a state of being close to the lower surface 14b, and excess solder balls 300 are sucked and removed by suction from the suction path 33c. Is done. As a result, the supply process is completed, and the solder balls 300 are attracted to the intake ports 23a.

  Subsequently, the control unit 15 controls the transport device 3 to move the suction head 11 upward so that the suction head 11 is separated from the alignment plate 14 as shown in FIG. The suction head 11 is moved to a position where the solder ball 300 is located above the substrate 400.

  Subsequently, when the solder ball 300 is positioned above the substrate 400, the control unit 15 controls the electromagnetic valve of the suction device 13 to stop the suction of air from the internal space 21 in the suction head 11. At this time, the suction by the air inlet 23a is released, and the solder balls 300 are mounted on the terminals 401 of the substrate 400 as shown in FIG. Next, the control unit 15 controls the transport device 3 to move the suction head 11 to the initial position. Thus, the mounting of the solder ball 300 on the substrate 400 is completed.

  In this case, in the solder ball mounting apparatus 1, as described above, there is an air inlet 23 a that does not attract the solder ball 300 due to the solder ball 300 fitting into the through hole 14 c of the alignment plate 14. In addition, it is possible to reliably prevent a suction failure in which the solder ball 300 is fitted into the air inlet 23a. For this reason, in this solder ball mounting apparatus 1, a situation in which a defect in which the solder ball 300 is not mounted on the terminal 401 of the substrate 400 is reliably prevented.

  As described above, according to the solder ball suction device 2, the solder ball mounting device 1, the spherical body suction method, and the spherical body mounting method, the holding portion 32 in which the cross-sectional shape of the air-permeable sheet 32d as the holding surface is formed in an arc shape. The breathable sheet is executed by rotating the holding portion 32 in the direction opposite to the direction of relative movement of the holding portion 32 in conjunction with the movement processing for moving the suction portion 22a along the suction surface 22a. The solder balls 300 held by 32d can be supplied to the vicinity of each air inlet 23a in a state where the solder balls 300 are not slid with respect to the alignment plate 14 (or in a state where sliding is suppressed to a small extent). For this reason, according to the solder ball adsorption device 2, the solder ball mounting device 1, the spherical body adsorption method, and the spherical body mounting method, the wear and deformation of the solder ball 300 due to sliding are reliably prevented. It is possible to reliably prevent the occurrence of poor suction due to the balls 300 and the deformed solder balls 300 being fitted into the through holes 14c of the alignment plate 14 and the suction ports 23a of the suction head 11. In addition, it is ensured that the solder ball 300 is dropped (dropped) from the holding portion 32 due to sliding, and the suction failure due to the shortage of the solder ball 300 supplied to the suction head 11 in the second half of the movement process is ensured. Can be prevented.

  Further, according to the solder ball suction device 2, the solder ball mounting device 1, the spherical body suction method, and the spherical body mounting method, the moving speed Vt in the moving process is the same as the peripheral speed Vr of the breathable sheet 32d in the rotating process. By moving and rotating the holding portion 32 so as to achieve a speed, the solder balls 300 held by the air permeable sheet 32d are hardly slid with respect to the alignment plate 14, and each of the intake ports 23a is moved. Can be supplied in the vicinity. Therefore, according to the solder ball suction device 2, the solder ball mounting device 1, the spherical body suction method and the spherical body mounting method, it is possible to reliably prevent the solder ball 300 from being worn or deformed by sliding, and as a result, The occurrence of defects can be prevented more reliably.

  Further, according to the solder ball suction device 2, the solder ball mounting device 1, the spherical body suction method, and the spherical body mounting method, the cross-sectional shape of the air-permeable sheet 32d as the holding surface is a circumference centered on the specified position P. Since the distance from the specified position P to the air permeable sheet 32d is constant by using the holding part 32 formed in the same shape as a part, the distance between the specified position P and the suction surface 22a is maintained constant. By executing the movement process and performing the rotation process in conjunction with the movement process, the distance from the position closest to the suction surface 22a in the breathable sheet 32d to the suction surface 22a can be maintained constant. Therefore, according to the solder ball suction device 2, the solder ball mounting device 1, the spherical body suction method, and the spherical body mounting method, the solder ball 300 held by the air permeable sheet 32d is obtained when the rotation process is executed. As a result of being pressed against the alignment plate 14 with the same force, it is possible to reliably prevent deformation of the solder balls 300 due to a change in the pressing force.

  The spherical body adsorption device, the spherical body mounting device, the spherical body adsorption method, and the spherical body mounting method are not limited to the above configuration and method. For example, the moving mechanism 34 and the rotating mechanism 35 are controlled so that the moving speed Vt of the holding unit 32 along the suction surface 22a and the peripheral speed Vr of the breathable sheet 32d when the holding unit 32 rotates are the same. Although the configuration and method for performing the above are described above, the moving speed Vt and the peripheral speed Vr may be different from each other, and a configuration and a method for controlling the moving mechanism 34 and the rotating mechanism 35 in this way may be employed.

  Moreover, although the cross-sectional shape of the air permeable sheet 32d as the holding surface has been described above as an example in which the cross-sectional shape of the air permeable sheet 32d is formed in the same shape as a part of the circumference of the circle C centering on the specified position P, A holding part formed in the same shape as the entire circumference of C (that is, the holding surface having a circular cross-sectional shape) may be employed. In addition, the holding portion formed in the same shape as a part or all of the circumference of a circle centering on a position different from the rotation center (predetermined position P) as the cross-sectional shape of the holding surface, or the cross-sectional shape of the holding surface A holding portion formed in the same shape as part or all of the circumference of the ellipse can also be employed.

  Although the configuration and method using the alignment plate 14 have been described above, a configuration and method that does not use the alignment plate 14 may be employed.

  Further, in the supply process, the configuration and the method for moving the holding unit 32 along the suction surface 22a in proximity to the suction surface 22a of the suction head 11 in the stationary state (the lower surface 14b of the alignment plate 14) have been described above. A configuration and a method of moving the suction head 11 and the alignment plate 14 with respect to the holding unit 32 can also be adopted. Further, in the supply process, a configuration and method for moving the suction head 11 and the alignment plate 14 relative to the holding portion 32 at the same time as moving the holding portion 32 relative to the suction head 11 and the alignment plate 14 are adopted. You can also.

  Further, when the alignment plate 14 is not used, a configuration and method for moving the holding unit 32 with respect to the stationary suction head 11, a configuration and method for moving the suction head 11 with respect to the holding unit 32, and the holding unit 32. Any configuration and method for moving both the suction head 11 and the suction head 11 can be employed.

  In the above example, the relative movement direction of the holding unit 32 in the movement process is set to the right direction, and the rotation direction of the holding unit 32 in the rotation process is set to the counterclockwise direction. On the contrary, a configuration and a method in which the relative movement direction of the holding unit 32 in the movement process is set to the left and the rotation direction of the holding unit 32 in the rotation process is set to the clockwise (clockwise) direction. It can also be adopted.

DESCRIPTION OF SYMBOLS 1 Solder ball mounting apparatus 2 Solder ball adsorption apparatus 3 Conveyance apparatus 11 Adsorption head 15 Control part 22a Adsorption surface 23a Intake port 32 Holding part 32a Front end part 32b Base end part 32d Breathable sheet 34 Movement mechanism 35 Rotation mechanism 300 Solder ball 400 Substrate 401 Terminal C Circle P Specified position Vr Peripheral speed Vt Moving speed

Claims (8)

A suction head having a suction surface formed with a plurality of air inlets, a holding portion that holds a spherical body on the holding surface of the tip, and a moving mechanism that moves the holding portion relative to the suction head; The holding portion is relatively moved along the suction surface while maintaining a close state in which the holding surface holding the spherical body is controlled to be relatively close to the suction surface by controlling the moving mechanism. A spherical body adsorbing device that adsorbs the spherical body to each of the air intakes, and includes a control unit that executes a movement process for moving the spherical body,
A rotation mechanism for rotating the holding portion;
The holding portion is rotated by the rotation mechanism about a predetermined position defined in a base end portion, and an arc shape in which a cross-sectional shape of the holding surface protrudes toward the suction surface in the proximity state Formed into
The control unit controls the rotation mechanism to link a rotation process for rotating the holding unit in a direction opposite to a relative movement direction of the holding unit in the movement process. Spherical adsorption device to perform.   The said control part controls the said moving mechanism and the said rotation mechanism so that the relative moving speed of the said holding | maintenance part in the said movement process and the circumferential speed of the said holding surface in the said rotation process may become the same speed. Item 4. The spherical body adsorption device according to Item 1.   The spherical body adsorbing device according to claim 1 or 2, wherein the holding portion is formed such that a cross-sectional shape of the holding surface is the same as a part or all of a circumference centered on the specified position.   The spherical body adsorbing device according to any one of claims 1 to 3, and the spherical body adsorbing device between an adsorption position where the spherical body is adsorbed and a mounting position where the spherical body is mounted on a mounting object. A spherical body mounting apparatus that mounts the spherical body on the mounting target body. While holding the adjoining state in which the holding surface of the holding unit holding the spherical body is relatively close to the suction surface of the suction head having the suction surface formed with a plurality of air inlets, the suction A spherical body adsorbing method for performing a movement process for relatively moving the holding unit along a surface, and adsorbing the spherical body to each of the intake ports,
Using the holding part formed in an arc shape in which the cross-sectional shape of the holding surface protrudes toward the suction surface side in the proximity state, the direction of relative movement of the holding part in the movement process is opposite And a spherical body adsorption method in which a rotation process for rotating the holding unit around a predetermined position at a base end portion of the holding unit is executed in conjunction with the movement process.   The spherical body according to claim 5, wherein the holding unit is moved and rotated so that a relative moving speed of the holding unit in the moving process is equal to a peripheral speed of the holding surface in the rotating process. Adsorption method.   The spherical body adsorption | suction method of Claim 5 or 6 using the said holding | maintenance part currently formed in the same shape as a part or all of the circumference centering on the said predetermined position in the cross-sectional shape of the said holding surface.   The spherical body adsorbing method according to any one of claims 5 to 7, wherein the adsorbing head adsorbs the spherical body, moves the adsorbing head adsorbing the spherical body to a mounting position, and A spherical body mounting method for mounting on a mounting object.

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