JP2013084717A - Three-dimensional mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a three-dimensional mounting device capable of further improving a manufacturing throughput of a semiconductor device, and preventing deterioration of quality of the manufactured semiconductor device.SOLUTION: In a three-dimensional mounting device 11, a transportation tray 16 has an inner tray 16a including an arrangement surface 16aa, and transports eight laminate chips 21 arranged on the arrangement surface 16aa. A chamber 27 houses the inner tray 16a, and a lower stage 28 locates the inner tray 16a in the chamber 27. An upper stage 29 has a pressing face 29a in parallel to the arrangement surface 16aa of the inner tray 16a which is located in the lower stage 28. Heaters 33, 39 are built in the lower stage 28 and the upper stage 29, and the lower stage 28 and the upper stage 29 move to reduce a gap between them.

Description

  The present invention relates to a three-dimensional mounting apparatus that stacks a plurality of chips.

  In recent years, in order to reduce the footprint of a semiconductor device, a three-dimensional mounting method for manufacturing a semiconductor device by stacking a plurality of IC substrates (chips) has been developed. In this three-dimensional mounting method, in each chip, a wiring made of a conductor that penetrates the chip in the thickness direction, for example, TSV (Through Silicon Via) is formed, and an electrode pad formed at the end of the wiring of one chip is formed. A circuit is formed three-dimensionally by bonding with solder bumps formed at the end of the wiring of another chip. As a three-dimensional mounting method, a COW (Chip On Wafer) method, a COC (Chip On Chip) method, and the like are known. In any method, in order to prevent displacement of the stacked chips, each chip is temporarily bonded prior to the main bonding between the chips, and the plurality of temporarily bonded chips are finally bonded by reflow. It is known (see, for example, Patent Document 1).

  In this three-dimensional mounting method, a set of a plurality of stacked chips (hereinafter referred to as “stacked chips”) constituting a semiconductor device in one chamber, for example, a reflow furnace, is reflowed one by one. From this point of view, the reflow of one laminated chip is performed within a few seconds, and the laminated chip for reflow is heated and the laminated chip after reflow is rapidly cooled.

JP 2009-110995 A

  However, since the reflow of one laminated chip is performed within several seconds, it is difficult to improve the throughput by shortening the reflow time. In addition, rapid heating and rapid cooling in the multilayer chip destabilize the molten form and solidified form of the solder, so that the crystal state of the solder cannot be made ideal in a manufactured semiconductor device. There is a problem in that residual stress is generated, bubbles are easily generated in the solder, and the quality of the semiconductor device manufactured from the laminated chip is deteriorated.

  An object of the present invention is to provide a three-dimensional mounting apparatus that can further improve the throughput of manufacturing a semiconductor device and can prevent deterioration of the quality of the manufactured semiconductor device.

  In order to achieve the above object, the three-dimensional mounting apparatus according to claim 1 has an arrangement surface composed of a plane, and the arrangement surface includes at least a laminated chip that is a set of chips formed by laminating a plurality of chips. Two or more are arranged, a conveyance unit that conveys the arranged at least two or more laminated chips, a storage chamber that accommodates a first portion that is a part of the conveyance unit including the arrangement surface, and A placement portion for placing the first portion in the accommodation chamber, and the placement surface of the first portion that is disposed in the accommodation chamber so as to face the placement portion and placed in the placement portion. And a pressing part having a pressing surface parallel to the mounting part, wherein the placing part and the pressing part each include a heating device, and at least one of the placing part and the pressing part is as described above. The space between the mounting part and the pressing part Thus being moved to.

  The three-dimensional mounting apparatus according to claim 2 is the three-dimensional mounting apparatus according to claim 1, wherein the arrangement in the first portion placed on the placement section is the three-dimensional mounting apparatus according to claim 1. The laminated chips having different heights are arranged at respective locations on the mounting surface according to the parallelism of the surface and the pressing surface of the pressing portion.

  The three-dimensional mounting apparatus according to claim 3 is the three-dimensional mounting apparatus according to claim 1 or 2, wherein the accommodation chamber can be divided into an upper part and a lower part, and the transfer unit is accommodated in the accommodation room. A first portion and a second portion that is different from the first portion, and the second portion has a moving force for moving the transport unit in a predetermined direction. When the transfer unit moves in the predetermined direction after the processing is applied to the plurality of laminated chips arranged on the arrangement surface in the storage chamber, the storage chamber is divided and the transfer unit is divided. It is characterized by leaving from the movement route.

  The three-dimensional mounting apparatus according to claim 4 is the three-dimensional mounting apparatus according to any one of claims 1 to 3, wherein the second part is accommodated when the first part is accommodated in the accommodating chamber. Is sandwiched between an upper portion and a lower portion of the storage chamber, and the first portion is separated from the sandwiched second portion.

  The three-dimensional mounting apparatus according to claim 5, wherein the transfer unit is interposed between the first part and the second part. And further including a film-like portion for connecting the first portion and the second portion, and when the first portion is accommodated in the accommodation chamber, the film-like portion is disposed in the accommodation chamber. The second portion is sandwiched between an upper portion and a lower portion and is not accommodated in the accommodation chamber.

  According to the present invention, at least one of the placement portion for placing the first portion of the transport portion having the placement surface on which the plurality of laminated chips are placed and the pressing portion having a pressing surface parallel to the placement surface is placed. Since the mounting unit and the pressing unit each have a built-in heating device, the plurality of laminated chips arranged on the arrangement surface are simultaneously pressed and heated. As a result, a plurality of semiconductor devices can be manufactured at the same time, and the manufacturing throughput per semiconductor device can be further improved. In addition, since the manufacturing throughput per semiconductor device is further improved, it is possible to sufficiently secure the time for heating and cooling the laminated chip, thereby stabilizing the molten form and solidified form of the solder. As a result, it is possible to prevent deterioration of the quality of the manufactured semiconductor device.

It is a top view which shows the arrangement | positioning state of the three-dimensional mounting apparatus and chip | tip stacking apparatus which concern on the 1st Embodiment of this invention. FIG. 2 is a cross-sectional view schematically showing a configuration of a laminated chip on which the three-dimensional mounting apparatus in FIG. 1 performs reflow processing, FIG. 2A shows a configuration before performing reflow processing, and FIG. 2B shows reflow processing. The structure after giving is shown. It is sectional drawing which follows the line III-III in FIG. It is a figure for demonstrating the process of the three-dimensional mounting method of the laminated chip which the three-dimensional mounting apparatus of FIG. 3 performs. It is a figure for demonstrating the process of the three-dimensional mounting method of the laminated chip which the three-dimensional mounting apparatus of FIG. 3 performs. It is a figure for demonstrating the process of the three-dimensional mounting method of the laminated chip which the three-dimensional mounting apparatus of FIG. 3 performs. It is a figure for demonstrating the arrangement | positioning method of a laminated chip when the parallelism of the arrangement | positioning surface of an inner tray and the press surface of an upper stage deteriorates, FIG. 7 (A) is a press surface by which the distance with an arrangement surface is measured. FIG. 7B is a cross-sectional view showing a state in which laminated chips having appropriate heights are arranged according to the distance between the arrangement surface and the pressing surface. It is sectional drawing which shows roughly the structure of the three-dimensional mounting apparatus which concerns on the 2nd Embodiment of this invention. It is a figure for demonstrating the process of the three-dimensional mounting method of the laminated chip which the three-dimensional mounting apparatus of FIG. 8 performs. It is a figure for demonstrating the process of the three-dimensional mounting method of the laminated chip which the three-dimensional mounting apparatus of FIG. 8 performs. It is a figure for demonstrating the process of the three-dimensional mounting method of the laminated chip which the three-dimensional mounting apparatus of FIG. 8 performs. It is a top view which shows the case where two conveyance trays are provided. FIG. 13 is a diagram schematically showing a configuration of a first modification of the transport tray in FIG. 8, FIG. 13A is a cross-sectional view of the first modification, and FIG. 13B is a first modification. FIG. It is a figure for demonstrating the process of the three-dimensional mounting method of the laminated chip which the three-dimensional mounting apparatus to which the conveyance tray which concerns on the 1st modification of FIG. 13 is applied performs. It is a top view which shows roughly the structure of the 2nd modification of the conveyance tray in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  First, the three-dimensional mounting apparatus according to the first embodiment of the present invention will be described.

  FIG. 1 is a plan view showing an arrangement state of a three-dimensional mounting apparatus and a chip stacking apparatus according to the present embodiment. In FIG. 1, for simplicity of explanation, both the stacking apparatus and the three-dimensional mounting apparatus are shown with the upper mechanism removed.

  In FIG. 1, the chip stacking device 10 and the three-dimensional mounting device 11 are arranged in a line, and a belt conveyor 12 is stretched between the stacking device 10 and the three-dimensional mounting device 11. The laminating apparatus 10 moves a chip place 15 on which a dicing film 14 on which a plurality of IC circuits (chips) 13 are arranged, a transport tray 16 (transport section) carried on the belt conveyor 12, and a chip 13 are moved. Pickup unit 17, immersion unit 18 filled with solder paste, camera unit 19 for photographing the lower surface of chip 13 picked up by pickup unit 17, and various heads of pickup unit 17 exchanged for the type of chip 13 A tool changing unit 20 on which the tool is placed.

  In the laminating apparatus 10, the pickup unit 17 picks one chip 13 from the chip storage 15 and moves it to the immersion unit 18, so that the lower surface of the chip 13 is immersed in the solder paste, and the solder paste is attached to the lower surface. Then, the chip 13 is moved to the camera unit 19 and the lower surface of the chip 13 is photographed to check the state of the solder paste attached to the lower surface. Thereafter, the chip 13 is moved to the transport tray 16 and placed on another chip 13 already arranged on the transport tray 16. Thus, a set of chips (hereinafter referred to as “laminated chips”) 21 in which a plurality of chips 13 are stacked is configured on the transport tray 16. In the present embodiment, eight stacked chips 21 are configured on the transport tray 16.

  The transport tray 16 includes an inner tray 16a (first portion) made of a disk-shaped stainless steel plate, an outer tray 16b (second portion) made of a stainless steel plate surrounding the inner tray 16a, and the outer tray 16b. It consists of a surrounding frame-shaped frame 16c (second portion). In the transport tray 16, only the outer peripheral edge of the inner tray 16a is placed on the inner edge of the outer tray 16b. The inner tray 16a and the outer tray 16b are not fixed to each other, and the outer edge of the outer tray 16b is It is only placed on the frame 16c, and the outer tray 16b and the frame 16c are not fixed to each other (see FIG. 3 and the like). In the present embodiment, four of the above-described eight laminated chips 21 are arranged in two rows on the arrangement surface 16aa which is the surface of the inner tray 16a. Further, the belt conveyor 12 is connected to the frame 16c, and when the belt conveyor 12 applies a driving force to the frame 16c toward the three-dimensional mounting apparatus 11, the transport tray 16 is transferred from the stacking apparatus 10 to the three-dimensional mounting apparatus 11. Move to.

  Among the transport trays 16 moved to the three-dimensional mounting apparatus 11, the inner tray 16 a is accommodated in the chamber 27, and reflow processing is performed on each laminated chip 21 in the chamber 27. Details of the configuration and operation of the three-dimensional mounting apparatus 11 will be described later. The reflow process in the present embodiment corresponds to a process of melting a solder bump 24 of a certain chip 13 with heat and bonding it to an electrode pad 26 of another chip 13 as will be described later.

  2 is a cross-sectional view schematically showing a configuration of a laminated chip on which the three-dimensional mounting apparatus in FIG. 1 performs reflow processing. FIG. 2A shows a configuration before the reflow processing, and FIG. ) Shows the configuration after the reflow process.

  As shown in FIG. 2A, the laminated chip 21 is configured by laminating a plurality of chips 13 on a base chip 22 arranged at the bottom. A plurality of electrode pads 23 are formed on the upper surface of the base chip 22, and a plurality of solder bumps 24 are formed on the lower surface of each chip 13, while a stopper 25 is formed so as to avoid the solder bumps 24. A plurality of electrode pads 26 are formed on the upper surface of the chip 13. The solder bumps 24 on the lower surface of the chip 13 are formed by solder paste attached to the lower surface of the chip 13. Further, a flux (not shown) layer is formed on the surface of each solder bump 24. In each chip 13, the solder bump 24 on the lower surface is connected to the electrode pad 26 on the upper surface by wiring penetrating the chip 13 in the thickness direction, for example, TSV (not shown).

  When the multilayer chip 21 is configured, the chip 13 is stacked on the base chip 22 so that the solder bumps 24 on the lower surface of the chip 13 are brought into contact with the electrode pads on the upper surface of the base chip 22. The chip 13 is stacked on the base chip 22 so that each solder bump 24 on the lower surface of the other chip 13 is brought into contact with each electrode pad 26, and thereafter, the stacking of the chips 13 is repeated. At this time, since the total thickness of the electrode pad 26 and the solder bump 24 is larger than the thickness of the stopper 25, the stopper 25 of the upper chip 13 is placed on the upper surface of the lower chip 13 before the reflow process is performed on the laminated chip 21. Is not abutted.

  On the other hand, when the reflow process is performed on the laminated chip 21, the solder bumps 24 of the upper chip 13 are melted and joined to the electrode pads 26 of the lower chip 13. The upper chip 13 sinks toward the lower chip 13, and the stopper 25 of the upper chip 13 comes into contact with the upper surface of the lower chip 13 (FIG. 2B). Thereby, a semiconductor device is manufactured from the laminated chip 21.

  3 is a cross-sectional view taken along line III-III in FIG. 1, and schematically shows the configuration of the three-dimensional mounting apparatus in FIG.

  In FIG. 3, the three-dimensional mounting apparatus 11 is supported by an octagonal columnar chamber 27 (accommodating chamber) that accommodates at least the inner tray 16 a in the transport tray 16, and a shaft 41 that stands upward from the bottom of the chamber 27. The table-like lower stage 28 (mounting part), the table-like upper stage 29 (pressing part) arranged facing the lower stage 28 in the ceiling part of the chamber 27, and the gas in the chamber 27 are discharged. And an exhaust pipe 30 for adjusting the pressure in the chamber 27.

  The chamber 27 can be divided into an upper portion 27a and a lower portion 27b. When the chamber 27 is divided, the lower portion 27b is supported from the base portion 31 of the three-dimensional mounting apparatus 11 via a pillar 32. A flange 27ba is formed on the top of the side wall of the lower portion 27b. The height from the bottom of the lower portion 27b to the upper surface of the flange 27ba is from the bottom of the lower portion 27b to the mounting surface 28a that is the upper surface of the lower stage 28. Lower than height. The lower stage 28 incorporates a heater 33 and has a heat sink 34 for heat dissipation on the lower surface.

  An upper portion 27a of the chamber 27 is supported by a rod 37 from a ceiling plate 36 fixedly supported by a column portion 35 standing from a base portion 31, is fixed to the ceiling plate 36, and controls a protruding amount of the rod 37. The movement in the vertical direction is controlled by the actuator 38. Further, a hook actuator 45 that controls the protruding amount and rotation of the L-shaped hook 44 that protrudes downward is disposed outside the side wall of the upper portion 27a. The upper stage 29 incorporates a heater 39, has a heat sink 40 for heat dissipation on the upper surface, and further has a pressing surface 29a parallel to the mounting surface 28a of the lower stage 28. The upper stage 29 is supported by a rod 42 from the ceiling portion of the upper portion 27a, and the vertical movement is controlled by a table actuator 43 that is fixed to the ceiling portion and controls the protruding amount of the rod 42. In the present embodiment, the chamber actuator 38, the table actuator 43, and the hook actuator 45 each incorporate an electric motor (not shown) as a power source, and the protruding amounts of the rods 37 and 42 and the hook 44 are controlled by the electric motor. Each actuator may include an air cylinder, an electromagnetic spring, or the like as a power source instead of an electric motor.

  In the three-dimensional mounting apparatus 11, when the chamber 27 is divided into the upper part 27a and the lower part 27b, the conveyor tray 16 is carried between the upper part 27a and the lower part 27b by the belt conveyor 12, and the carried tray 16 is carried into the inner tray 16a. The position is adjusted so as to face the lower stage 28. In the present embodiment, the size of the inner tray 16a is set so that the inner tray 16a can be accommodated in the chamber 27, whereby the transport tray 16 is carried between the upper portion 27a and the lower portion 27b. In this case, the outer tray 16b exists between the side wall of the upper part 27a and the side wall of the lower part 27b. In the present embodiment, the size of the lower stage 28 is set to be smaller than the inner tray 16a.

  Next, a three-dimensional mounting method for laminated chips executed by the three-dimensional mounting apparatus in FIG. 3 will be described.

  4, 5, and 6 are diagrams for explaining a process of the three-dimensional mounting method of the laminated chip executed by the three-dimensional mounting apparatus of FIG. 3.

  First, as shown in FIG. 4A, after the transport tray 16 is carried between the upper part 27a and the lower part 27b, the chamber actuator 38 lowers the upper part 27a of the chamber 27 and the tip of the L-shaped hook 44. Is positioned below the flange 27ba of the lower portion 27b. Thereafter, as shown in FIG. 4B, the hook actuator 45 rotates the L-shaped hook 44 to engage the L-shaped portion at the tip of the hook 44 with the flange 27ba.

  Next, as shown in FIG. 5A, the hook actuator 45 abuts the lower portion 27b of the chamber 27 by reducing the protruding amount of the L-shaped hook 44, and the flange 27ba of the lower portion 27b contacts the outer tray 16b. Pull up. At this time, since the height from the bottom of the lower portion 27b to the upper surface of the flange 27ba is lower than the height from the bottom of the lower portion 27b to the placement surface 28a of the lower stage 28, the contact of the flange 27ba with the outer tray 16b. First, the mounting surface 28a of the lower stage 28 comes into contact with the inner tray 16a. However, as described above, the inner tray 16a and the outer tray 16b are not fixed to each other, and the lower stage 28 is more than the inner tray 16a. Since it is small, only the inner tray 16a is placed on the placement surface 28a of the lower stage 28, and is lifted by the lower stage 28 and separated from the outer tray 16b. At this time, since the mounting surface 28a of the lower stage 28 and the pressing surface 29a of the upper stage 29 are parallel to each other, the arrangement surface 16aa of the inner tray 16a mounted on the mounting surface 28a is also parallel to the pressing surface 29a. . Further, the inner tray 16a is adsorbed to the mounting surface 28a of the lower stage 28 by vacuum adsorption or electrostatic adsorption.

  Next, as shown in FIG. 5B, after the flange 27ba of the lower portion 27b contacts the outer tray 16b, the lower portion 27b continues to be pulled up by the hook actuator 45, and the chamber actuator 38 moves down the upper portion 27a of the chamber 27. The outer tray 16b is sandwiched between the side wall portion of the lower portion 27b and the side wall portion of the upper portion 27a, and the inside of the chamber 27 is sealed from the outside. At this time, the outer tray 16b is lifted by the flange 27ba and separated from the frame 16c.

  Next, as shown in FIG. 6A, the upper stage 29 is lowered by the table actuator 43, and the plurality of laminated chips 21 arranged on the arrangement surface 16aa are pressed by the pressing surface 29a with a predetermined pressure. At this time, the inside of the chamber 27 is evacuated by the exhaust pipe 30 to reduce the pressure, and the heaters 39 in the upper stage 29 and the heater 33 in the lower stage 28 are heated to heat the respective laminated chips 21. A reflow process is performed on the chip 21. As a result, the solder bumps 24 are melted and bonded to the electrode pads 26 in each laminated chip 21 to manufacture a semiconductor device.

  After the semiconductor device is manufactured from each laminated chip 21, as shown in FIG. 6B, the upper stage 29 is pulled up by the table actuator 43, the upper portion 27a of the chamber 27 is pulled up by the chamber actuator 38, and the hook actuator 45 Thus, the hook 44 is rotated to disengage the flange 27ba at the lower portion 27b of the chamber 27 and the L-shaped portion at the tip of the hook 44 and lower the lower portion 27b. As a result, the chamber 27 is divided into an upper part 27a and a lower part 27b, and the outer tray 16b is placed on the frame 16c, and the inner tray 16a is placed on the outer tray 16b.

  Thereafter, the conveyor tray 16 is moved by the belt conveyor 12 and unloaded from between the upper part 27a and the lower part 27b, and this process is completed.

  The three-dimensional mounting apparatus 11 described above includes a lower stage 28 on which the inner tray 16a of the transport tray 16 having the arrangement surface 16aa on which the plurality of laminated chips 21 are arranged, and a pressing surface 29a parallel to the arrangement surface 16aa. Since the upper stage 29 moves so as to close the space between the lower stage 28 and the upper stage 29, and the lower stage 28 and the upper stage 29 respectively incorporate heaters 33 and 39, a plurality of laminated chips 21 arranged on the arrangement surface 16aa. Are simultaneously pressed and heated to perform a reflow process. As a result, a plurality of semiconductor devices can be manufactured at the same time, and the manufacturing throughput per semiconductor device can be further improved. Further, since the manufacturing throughput per semiconductor device is further improved, a sufficient time for heating and cooling the laminated chip 21 can be ensured, and the molten form and solidified form of solder can be stabilized. As a result, it is possible to prevent deterioration of the quality of the manufactured semiconductor device.

  Further, in the three-dimensional mounting apparatus 11, when the inner tray 16a is accommodated in the chamber 27, the inner tray 16a is separated from the outer tray 16b sandwiched between the upper portion 27a and the lower portion 27b of the chamber 27. It is pressed by the upper stage 29 and the lower stage 28 without being restrained by the tray 16b. As a result, it is possible to reliably press the plurality of laminated chips 21 arranged on the arrangement surface 16aa.

  Furthermore, in the three-dimensional mounting apparatus 11, after the reflow process is performed on the plurality of laminated chips 21 arranged on the arrangement surface 16aa in the chamber 27, the chamber 27 is divided when the conveyance tray 16 moves, and the conveyance tray Since the sixteen moving paths are withdrawn, the transfer tray 16 can be moved while the plurality of semiconductor devices are arranged on the arrangement surface 16aa. As a result, the throughput of manufacturing semiconductor devices can be further improved.

In the three-dimensional mounting apparatus 11, when the reflow process is performed on each laminated chip 21, the inside of the chamber 27 is evacuated and depressurized, so that the solder bump 24 and the electrode pad 26 are melt-bonded in a low oxygen state. Therefore, oxidation of the electrode pad 26 can be prevented, evaporation of the flux on the surface of each solder bump 24 can be promoted, and bubbles generated in the molten solder bump 24 can be removed. Can do. In order to promote the transition to the low oxygen state, an N ₂ introduction port may be provided in the chamber 27 and N ₂ gas may be introduced into the chamber 27 during the reflow process.

By the way, when the three-dimensional mounting method of FIG. 3 is repeated in the three-dimensional mounting apparatus 11, the parallelism of the placing surface 28a of the lower stage 28 and the pressing surface 29a of the upper stage 29, in other words,
The parallelism of the arrangement surface 16aa and the pressing surface 29a of the inner tray 16a placed on the placement surface 28a may be somewhat deteriorated. In this case, for example, the pressing surface 29a of the upper stage 29 is divided into several regions as shown in FIG. 7A, the distance from the arrangement surface 16aa in each region is measured, and each laminated chip 21 is further measured. In the laminating apparatus 10, the laminated chip 21 having an appropriate height is arranged at each location of the arrangement surface 16aa in accordance with the distance between the arrangement surface 16aa and the pressing surface 29a at the location. Specifically, the laminated chip 21 having a relatively high height is arranged at a location where the distance between the arrangement surface 16aa and the pressing surface 29a is far, and the location where the distance between the arrangement surface 16aa and the pressing surface 29a is near is relatively small. A laminated chip 21 having a low height is arranged.

  Thereby, the distance from each laminated chip 21 arranged on the arrangement surface 16aa to the pressing surface 29a can be made uniform before each laminated chip 21 is pressed, and accordingly, when the upper stage 29 is moved toward the lower stage 28. As shown in FIG. 7B, the laminated chips 21 can be evenly pressed by the pressing surface 29a that is not parallel to the arrangement surface 16aa.

  The height of each laminated chip 21 is adjusted by adjusting the amount of solder paste attached to the lower surface of the chip 13 by adjusting the immersion time in the solder paste in the immersion unit 18 when the chips 13 are laminated. This is done by changing the height of 24. Further, the height of each laminated chip 21 is measured by a laser measuring device (not shown) included in the laminated device 10.

  Next, a three-dimensional mounting apparatus according to the second embodiment of the present invention will be described.

  Since the configuration and operation of this embodiment are basically the same as those of the first embodiment described above, the description of the overlapping configuration and operation will be omitted, and the description of the different configuration and operation will be described below. Do.

  FIG. 8 is a sectional view schematically showing the configuration of the three-dimensional mounting apparatus according to the second embodiment of the present invention.

  In FIG. 8, the three-dimensional mounting apparatus 46 includes a transport tray 47 (transport section) carried on the belt conveyor 12. The transport tray 47 includes an inner tray 47a (first portion) made of a disk-shaped stainless steel plate, a frame-shaped frame 47b (second portion) surrounding the inner tray 47a, and the inner tray 47a and the frame 47b. For example, it is composed of a tray film 47c (film-like portion) made of a heat-resistant resin. In the transport tray 47, since the inner tray 47a and the frame 47b are only connected by the tray film 47c, neither the inner tray 47a nor the frame 47b regulates the movement of the other unless the tray film 47c is extended to the pull limit. .

  In the present embodiment, four laminated chips 21 are arranged in two rows of four on the arrangement surface 47aa which is the surface of the internal tray 47a. The belt conveyor 12 is connected to the frame 47b.

  In the three-dimensional mounting device 46, when the chamber 27 is divided into the upper part 27a and the lower part 27b, the conveyor tray 47 is carried in between the upper part 27a and the lower part 27b by the belt conveyor 12, and the carried tray 47 is loaded into the inner tray 47a. The position is adjusted so as to face the lower stage 28. In the present embodiment, the size of the internal tray 47a is set so that the internal tray 47a can be accommodated in the chamber 27, and the size of the opening of the frame 47b can surround the chamber 27. Set to

  Thus, when the transport tray 47 is carried between the upper portion 27a and the lower portion 27b, the tray film 47c exists between the side wall portion of the upper portion 27a and the side wall portion of the lower portion 27b of the chamber 27. In the present embodiment, the size of the lower stage 28 is set to be smaller than the internal tray 47a.

  Next, a three-dimensional mounting method for laminated chips executed by the three-dimensional mounting apparatus in FIG. 8 will be described.

  9, FIG. 10 and FIG. 11 are diagrams for explaining the steps of the three-dimensional mounting method of the laminated chip executed by the three-dimensional mounting apparatus of FIG.

  First, as shown in FIG. 9A, after the transport tray 47 is carried between the upper part 27a and the lower part 27b, the chamber actuator 38 lowers the upper part 27a of the chamber 27 and the tip of the L-shaped hook 44. Is positioned below the flange 27ba of the lower portion 27b. Thereafter, as shown in FIG. 9B, the hook actuator 45 rotates the L-shaped hook 44 to engage the L-shaped portion at the tip of the hook 44 with the flange 27ba.

  Next, as shown in FIG. 10A, the hook actuator 45 pulls up the lower portion 27 b of the chamber 27 through the hook 44. At this time, the placement surface 28a of the lower stage 28 comes into contact with the inner tray 47a. However, as described above, the frame 47b does not regulate the movement of the inner tray 47a, and the lower stage 28 is smaller than the inner tray 47a. Only the inner tray 47 a is lifted by the lower stage 28. At this time, the arrangement surface 47aa of the internal tray 47a placed on the placement surface 28a is parallel to the pressing surface 29a. Further, the internal tray 47a is adsorbed to the mounting surface 28a of the lower stage 28 by vacuum adsorption or electrostatic adsorption.

  Next, as shown in FIG. 10 (B), after the internal tray 47a is lifted by the lower stage 28, the chamber actuator 38 lowers the upper portion 27a of the chamber 27 so that the side wall portion of the lower portion 27b and the side wall portion of the upper portion 27a. The tray film 47c is sandwiched between them, and the inside of the chamber 27 is sealed from the outside.

  Next, as shown in FIG. 11A, the upper stage 29 is lowered by the table actuator 43 and the plurality of laminated chips 21 arranged on the arrangement surface 47aa are pressed by the pressing surface 29a with a predetermined pressure. In addition, the chamber 27 is evacuated to reduce the pressure, and each laminated chip 21 is heated to perform a reflow process on each laminated chip 21. Thereby, a semiconductor device is manufactured from each laminated chip 21.

  After the semiconductor device is manufactured from each laminated chip 21, as shown in FIG. 11B, the upper stage 29 is pulled up by the table actuator 43, and the chamber 27 is moved to the upper portion 27a and the lower portion 27b by the chamber actuator 38 and the hook actuator 45. Divide and exit from the moving path of the transport tray 47.

  Thereafter, the conveyor tray 47 is moved by the belt conveyor 12 and unloaded from between the upper part 27a and the lower part 27b, and this process is terminated.

  In the above-described three-dimensional mounting apparatus 46, the plurality of laminated chips 21 arranged on the arrangement surface 47aa of the internal tray 47a are simultaneously pressed and heated to perform the reflow process, so the three-dimensional in the first embodiment is performed. Similar to the mounting apparatus 11, a plurality of semiconductor devices can be manufactured at the same time, the manufacturing throughput per semiconductor device can be further improved, and the deterioration of the quality of the manufactured semiconductor devices can be prevented. .

  In the three-dimensional mounting device 46, when the internal tray 47a is accommodated in the chamber 27, the tray film 47c for connecting the internal tray 47a and the frame 47b is sandwiched between the upper portion 27a and the lower portion 27b of the chamber 27. Since the movement of the internal tray 47a is not restricted unless the film 47c is stretched to the pull limit, the internal tray 47a is pressed by the upper stage 29 and the lower stage 28 without being restrained by the tray film 47c. As a result, it is possible to reliably press the plurality of laminated chips 21 arranged on the arrangement surface 47aa.

  As described above, the present invention has been described using the above embodiments, but the present invention is not limited to the above embodiments.

  In each of the embodiments described above, eight stacked chips 21 are placed on one transport tray 16 (47), and the eight-layer chips 21 are simultaneously subjected to reflow processing in the three-dimensional mounting apparatus 11 (46). The number of trays is not limited to one. For example, as illustrated in FIG. 12, two transport trays 48 are provided, and four stacked chips 21 are placed on each transport tray 48, and correspond to each transport tray 48. Each of the two chambers 49 of the three-dimensional mounting apparatus provided may accommodate the four laminated chips 21 and simultaneously perform the reflow process.

  The transport tray 47 in the second embodiment described above includes an internal tray 47a, a frame 47b, and a tray film 47c interposed therebetween, but the structure of the transport tray using the tray film is limited to this. Absent.

  13 is a diagram schematically showing a configuration of a first modification of the transport tray in FIG. 8, FIG. 13A is a cross-sectional view of the first modification, and FIG. It is a top view of the modification of 1.

  13 (A) and 13 (B), the transfer tray 50 is composed of an inner tray (wafer tray) 50a made of a disk-shaped stainless steel plate and an inner part made of an annular aluminum material arranged so as to surround the inner tray 50a. The tray support 50b, a frame-like frame 50c surrounding the inner tray support 50b, and a tray film 50d made of, for example, a heat-resistant resin, are connected between the inner tray support 50b and the frame 50c. The inner tray support 50b may be made of a hard material, and may be made of, for example, a metal material or resin material different from the aluminum material, specifically, Vespel (registered trademark).

  The frame 50c has an opening made of a large-diameter circular hole at the center, and the internal tray 50a and the internal tray support 50b are concentrically disposed in the circular hole. The inner tray support 50b has a flange 50e protruding inward, and the inner tray 50a is supported by the inner tray support 50b by placing the peripheral edge of the inner tray 50a on the flange 50e.

  In this modification, as shown in FIG. 14A described later, four laminated chips 21 are arranged in two rows of four on the arrangement surface 50aa which is the surface of the internal tray 50a. The belt conveyor 12 is connected to the frame 50c.

  In this modification, when the chamber 27 is divided into the upper part 27a and the lower part 27b, the conveyor tray 50 is carried between the upper part 27a and the lower part 27b by the belt conveyor 12, and the carried tray 50 is loaded with the inner tray 50a at the lower part. The position is adjusted so as to face the stage 28. In the present embodiment, the size of the inner tray 50a is set so that the inner tray 50a can be accommodated in the chamber 27, and the size of the opening of the frame 50c can surround the chamber 27. Further, when the internal tray 50a is accommodated in the chamber 27, the internal tray support 50b is set so as to be sandwiched between the upper portion 27a and the lower portion 27b.

  Next, a three-dimensional mounting method for laminated chips executed by the three-dimensional mounting apparatus to which the transport tray according to the first modification of FIG. 13 is applied will be described.

  FIG. 14 is a diagram for explaining a process of the three-dimensional mounting method of the laminated chips executed by the three-dimensional mounting apparatus to which the transport tray according to the first modification of FIG. 13 is applied.

  First, as shown in FIG. 14 (A), a transport tray 50 in which eight laminated chips 21 are arranged in four rows on the arrangement surface 50aa is carried by the belt conveyor 12 between the upper portion 27a and the lower portion 27b. .

  Next, as shown in FIG. 14B, the hook actuator 45 pulls up the lower portion 27b of the chamber 27 and brings the mounting surface 28a of the lower stage 28 into contact with the internal tray 50a. At this time, the internal tray 50a is lifted by the lower stage 28 and separated from the internal tray support 50b. Further, the inner tray support 50b is also lifted by the flange 27ba. However, unless the tray film 50d is extended to the pull limit, the movement of the inner tray support 50b with respect to the frame 50c is not restricted, so the inner tray support 50b moves upward together with the flange 27ba. To do.

  Next, the chamber actuator 38 lowers the upper portion 27a of the chamber 27 to sandwich the inner tray support 50b between the side wall portion of the lower portion 27b and the side wall portion of the upper portion 27a. The actuator 43 lowers the upper stage 29 and presses the plurality of laminated chips 21 arranged on the arrangement surface 50aa by the pressing surface 29a with a predetermined pressure. In addition, the chamber 27 is evacuated to reduce the pressure, and each laminated chip 21 is heated to perform a reflow process on each laminated chip 21. Thereby, a semiconductor device is manufactured from each laminated chip 21.

  In the transport tray 50 according to the first modified example of FIG. 13, the inner tray support 50b is made of a hard material, so that it is hardly consumed even when sandwiched by the side wall portion of the lower portion 27b and the side wall portion of the upper portion 27a. Accordingly, the life of the transport tray 50 can be extended.

  In the transport tray 50 described above, the internal tray support 50b and the frame 50c are connected by the tray film 50d, but the member that connects the internal tray support 50b and the frame 50c is not limited to a film. For example, the internal tray support 50b and the frame 50c may be connected by a low-rigidity metal piece 51 as in the second modification of the transport tray shown in FIG.

DESCRIPTION OF SYMBOLS 10 Laminating apparatus 11,46 Three-dimensional mounting apparatus 12 Belt conveyor 13 Chip | tip 16,47 Conveying tray 16a Inner tray 16aa Arrangement surface 16b Outer tray 21 Laminated chip 27 Chamber 27a Upper part 27b Lower part 28 Lower stage 28a Mounting surface 29 Upper stage 29a Press Surface 33, 39 Heater 47a Internal tray 47b Frame 47c Tray film

Claims (5)

A plurality of stacked chips, each of which is a set of chips formed by stacking a plurality of chips, and at least two or more stacked chips arranged; A transport unit for transport;
A storage chamber for storing a first portion formed of a part of the transport unit including the arrangement surface;
A placement section for placing the first portion in the accommodation chamber;
A three-dimensional mounting apparatus comprising: a pressing portion that is disposed opposite to the placement portion in the accommodation chamber and has a pressing surface parallel to the placement surface in the first portion placed on the placement portion. There,
Each of the placing portion and the pressing portion includes a heating device,
A three-dimensional mounting apparatus, wherein at least one of the placement portion and the pressing portion moves so as to close between the placement portion and the pressing portion.   Arranging the laminated chips having different heights at each position of the placement surface according to the parallelism of the placement surface and the pressing surface of the pressing portion in the first portion placed on the placement portion. The three-dimensional mounting apparatus according to claim 1. The storage chamber can be divided into an upper part and a lower part,
The transport unit includes the first part accommodated in the accommodation chamber and a second part composed of a part different from the first part, and the second part includes a predetermined part. The moving force for moving the transport unit in the direction is loaded,
After the processing is performed on the plurality of laminated chips arranged on the arrangement surface in the accommodation chamber, the accommodation chamber is divided when the conveyance unit moves in the predetermined direction, and the movement path of the conveyance unit 3. The three-dimensional mounting apparatus according to claim 1 or 2, wherein the three-dimensional mounting apparatus exits from.   When the first portion is accommodated in the accommodation chamber, the second portion is sandwiched between an upper portion and a lower portion of the accommodation chamber, and the first portion is separated from the sandwiched second portion. The three-dimensional mounting apparatus according to any one of claims 1 to 3, wherein the three-dimensional mounting apparatus is characterized. The transport unit further includes a film-like part that is interposed between the first part and the second part and connects between the first part and the second part,
When the first portion is accommodated in the accommodation chamber, the film-like portion is sandwiched between an upper portion and a lower portion of the accommodation chamber, and the second portion is not accommodated in the accommodation chamber. Item 4. The three-dimensional mounting apparatus according to any one of Items 1 to 3.

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