JP2013084685A - Handling mechanism of probe card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a handling mechanism of a probe card which enables handling work without being affected by heat even immediately after test under high temperature or low temperature.SOLUTION: Provided is a handling mechanism 25 for handling a probe card 17 including a plurality of probes 18. The mechanism includes a handle 26 which is attached to the probe card 17 and used when the probe card 17 is handled, and an attaching/detaching mechanism 27 which detachably attaches the handle 26 to the probe card 17. The handle 26 can be installed to any of the plurality of probe cards 17.

Description

  The present invention relates to a handling mechanism used for carrying a probe card having a plurality of probes.

  The probe card is a device that is attached to a semiconductor wafer measuring device or the like and applies an inspection signal by contacting an electrode on the surface of the semiconductor wafer or the like. The probe card is provided with a plurality of probes, which are brought into contact with the plurality of electrodes on the surface of the semiconductor wafer mounted on the semiconductor wafer measuring apparatus.

  As such a probe card handling mechanism, those shown in FIGS. 1 and 2 are known.

  1 in the figure is a probe card. The probe card 1 mainly includes a plurality of probes 2 that come into contact with electrodes of a member to be inspected such as a semiconductor wafer, a PCB 3 provided with a circuit (not shown) connected to each probe 2, and the PCB 3 A stiffener 4 to be reinforced and a stiffener cover 5 covering the stiffener 4 are configured.

  The stiffener cover 5 of the probe card 1 is provided with a retractable handle 6 as a handling mechanism. The handle 6 is normally stored as indicated by a solid line in the drawing. When carrying the probe card 1 or the like, as shown by broken lines in the figure, each handle 6 is raised, and the operator grips the two handles 6 by hand to carry or install the probe card 1.

  An example of such a handling mechanism is disclosed in Patent Document 1.

Japanese Patent Laid-Open No. 2008-164591

  In the conventional probe card 1 as described above, since the handle 6 is provided on the probe card 1, a handle 6 is required for each probe card 1. For this reason, the member cost and processing cost of the handle 6 are needed, and there exists a problem that manufacturing cost increases.

  Further, when the test is performed at a high temperature or a low temperature for a heating test, a cooling test, or the like, the handle 6 is also at a high temperature or a low temperature, and therefore handling cannot be performed even if maintenance is performed immediately after the test. For example, when the test is performed at a high temperature of 150 ° C., the handle 6 is also 150 ° C., so it is necessary to wait until it reaches a temperature near room temperature, which causes a problem that workability is poor.

  The present invention has been made in view of such problems, and it is possible to improve the workability by enabling the handling of a probe card even immediately after a test at a high temperature or a low temperature, and to improve the workability and to reduce the cost. The purpose is to provide.

  The present invention provides a handling mechanism for handling a probe card having a plurality of probes, the handle being attached to the probe card and used when the probe card is handled, and the handle being attached to the probe card. An attachment / detachment mechanism that is detachably attached to the handle, and the handle can be attached to any of the plurality of probe cards.

  By attaching the handle detachably to the probe card with the attaching / detaching mechanism, the probe card can be handled even immediately after a test at a high temperature or a low temperature. In addition, the handling mechanism has a simple structure and only requires one set of handles, so that the cost can be reduced.

It is a top view which shows the conventional probe card. It is a front view which shows the conventional probe card. It is a schematic block diagram which shows a semiconductor wafer measuring apparatus. It is a top view which shows the probe card which concerns on embodiment of this invention. It is a front view which shows the probe card which concerns on embodiment of this invention. It is a top view which shows the probe card which concerns on the 1st modification of this invention. It is a front view which shows the probe card which concerns on the 1st modification of this invention. It is a top view which shows the probe card which concerns on the 2nd modification of this invention. It is a front view which shows the probe card which concerns on the 2nd modification of this invention.

  Hereinafter, a probe card handling mechanism according to an embodiment of the present invention will be described.

  The probe card is a device for applying an inspection signal in contact with an electrode on the surface of a semiconductor wafer or the like. This probe card is attached to a semiconductor wafer measuring device or the like. Here, as an example of an apparatus to which a probe card is mounted, a semiconductor wafer measuring apparatus will be described with reference to FIG.

  The semiconductor wafer measuring apparatus 11 mainly comprises a prober 12, a test head 13, and a probe card 17.

  The prober 12 is an apparatus for inspecting by applying inspection signals to a plurality of electrodes on the surface of the semiconductor wafer W. The prober 12 includes a housing 14, an XYZθ stage 15 mounted in the housing 14, and a chuck top 16 supported by the XYZθ stage 15. The probe card 17 incorporated in the prober 12 is provided with a plurality of probes 18 on its lower surface. The semiconductor wafer W is supported by the chuck top 16 and the electrodes on the upper side thereof are in electrical contact with the probes 18 respectively.

  The test head 13 is an apparatus for applying an inspection signal to the semiconductor wafer W and processing the detection signal. The test head 13 includes a signal processing device (not shown) and the like, and includes a contact portion 19 that is in electrical contact with the probe card 17 on a lower surface thereof.

  The test head 13 is rotatably supported. When the probe card 17 is replaced, the test head 13 is rotated upward and moved to a standby position.

  In the semiconductor wafer measuring apparatus 11 configured as described above, the semiconductor wafer W is placed on the chuck top 16 and the position of the semiconductor wafer W is adjusted by the XYZθ stage 15. Thereby, each electrode on the surface of the semiconductor wafer W and each probe 18 of the probe card 17 are aligned. Then, the chuck top 16 is raised by the XYZθ stage 15 so that the electrodes of the semiconductor wafer W and the probes 18 of the probe card 17 are brought into contact with each other.

  Next, an inspection signal is applied to each electrode of the semiconductor wafer W through the probe 18 from the test head 13 side, and the semiconductor wafer W is tested. At this time, the semiconductor wafer W may be heated to a high temperature or cooled to a low temperature in addition to being tested at normal temperature.

  When the probe card 17 is replaced, the prober 12 automatically releases the probe card 17 to the prober 12 and conveys it to a place where it can be handled.

  The probe card 17 incorporated in the semiconductor wafer measuring apparatus 11 as described above is configured as shown in FIGS.

  This probe card 17 mainly includes a plurality of probes 18 that contact the electrodes of the semiconductor wafer W, a PCB 21 provided with a circuit (not shown) connected to each probe 18, and a stiffener 22 that reinforces the PCB 21. The stiffener cover 23 covers the stiffener 22. The probe card 17 is an example, and there are various other configurations. The present invention can be applied to all probe cards to which a handle 26 described later can be attached.

  A handling mechanism 25 is provided on the stiffener cover 23 of the probe card 17. The handling mechanism 25 is a mechanism for handling the probe card 17 (processing such as carrying and setting). The handling mechanism 25 includes a handle 26 and an attachment / detachment mechanism 27.

  The handle 26 is a member used when handling the probe card 17. The handle 26 is detachably attached to the probe card 17. The handle 26 is a member for the operator to hold by hand. The handle 26 is configured by bending a bar material into a substantially C shape. Here, the bar is bent into an angular C-shape consisting of two right angles. Both ends of the handle 26 are detachably attached to the probe card 17 by an attaching / detaching mechanism 27. Two handles 26 are arranged in parallel. In addition, the material of the handle | steering-wheel 26 can use material of various shapes, such as a round bar-shaped bar material, a square bar-shaped bar material, and a long plate-shaped bar material. The handle 26 functions as a leg portion that supports the probe card 17 when the probe card 17 is inverted.

  The detachable mechanism 27 is a mechanism for detachably attaching the handle 26 to the probe card 17. The attachment / detachment mechanism 27 includes a fitting portion 29 provided at the end of the handle 26 and a fitted portion 30 provided on the stiffener cover 23 of the probe card 17.

  The fitting portion 29 includes a locking claw 31 that can be moved in and out, and a button (not shown) that causes the locking claw 31 to be moved in and out. Two locking claws 31 are provided at both distal ends of the handle 26. Each locking claw 31 is provided at the front end portion of the handle 26 so as to be able to protrude from the outer peripheral surface thereof, and is urged in a direction (projecting direction) to open from each other by a spring (not shown). As the mechanism of the locking claw 31, all existing mechanisms can be used.

  The button is connected to the locking claw 31 via the spring. By pushing this button, the spring is drawn. As a result, the respective locking claws 31 that have been biased in the direction of opening (projecting direction) by the springs are immersed and the locked state is released. Any existing mechanism can be used as the mechanism of the button or spring portion.

  The fitted portion 30 is configured with a counterbore hole that receives the locking claw 31. A claw receiving portion (not shown) is formed by enlarging the innermost portion of the counterbored hole. The engaging claw 31 of the fitting portion 29 protrudes at the deepest part of the counterbore hole and engages with the claw receiving portion, and the handle 26 is attached to the probe card 17. In addition, as a structure of the latching claw 31 and a nail | claw receiving part, all the existing things can be used.

  The handling mechanism 25 of the probe card 17 configured as described above is used as follows.

  In the semiconductor wafer measuring apparatus 11, the above-described test is performed. At this time, the probe card 17 is replaced in accordance with the type and various conditions of the semiconductor wafer W to be tested.

  When the probe card 17 is replaced, the prober 12 automatically releases the probe card 17 to the prober 12 and conveys the probe card 17 to a place where it can be handled.

  Then, the handle 26 is attached to the probe card 17 conveyed to a place where it can be handled. Specifically, the distal end portion of the handle 26 is pushed into the counterbore hole of the fitted portion 30 of the attachment / detachment mechanism 27. Thereby, each latching claw 31 of the front-end | tip part of the handle | steering-wheel 26 protrudes and opens in the counterbored hole. As a result, the handle 26 is attached to the probe card 17.

  Two handles 26 are attached to the probe card 17. The operator grasps the two handles 26, lifts the probe card 17 and moves it to the storage position. At this time, even when the semiconductor wafer W is tested by being heated to a high temperature or when being tested by being cooled to a low temperature, the handle 26 itself is not heated or cooled. Further, since the high temperature and low temperature are not transmitted to the handle 26 supported by the probe card 17 by the attaching / detaching mechanism 27 in a short time, the operator can avoid the influence of the high temperature and low temperature without affecting the probe card 17. Perform handling work.

  When handling is complete, press the button. Thereby, the said spring is drawn in, each latching claw 31 urged | biased in the direction (projecting direction) mutually opened with this spring immerses, and a latching state is cancelled | released. In this state, the handle 26 is pulled out from the counterbore hole of the fitted portion 30 of the probe card 17.

  Next, the distal end portion of the handle 26 is pushed into the counterbore hole of the fitted portion 30 of the new probe card 17. Thus, as described above, the handle 26 is attached to the probe card 17 by the locking claw 31 projecting and opening at the deepest claw receiving portion of the counterbore hole.

  Next, the operator grasps the two handles 26, lifts the new probe card 17, and installs it at the probe card installation location of the prober 12.

  Next, as described above, the button is pushed in to immerse each locking claw 31 to release the locking state, and the handle 26 is pulled out from the counterbore hole of the fitting portion 30 of the probe card 17.

  Next, the test head 13 is returned to the original position and the replacement of the probe card 17 is completed.

  When the probe card 17 with the handle 26 attached is placed on a mounting table or the like for maintenance or temporary storage, the probe card 17 is inverted and the handle 26 is placed on the surface of the mounting table or the like. As a result, the handle 26 of the handling mechanism 25 functions as a leg portion to support the probe card 17.

[effect]
As described above, the handle 26 can be easily attached to and detached from the probe card 17, and the probe card 17 can be easily handled.

  In addition, the probe card 17 can be handled immediately after the test at a high temperature or a low temperature, and the workability during the handling work is improved.

  Furthermore, since the handling mechanism 25 has a simple structure and only requires one set of handles 26, the cost can be reduced.

  In the conventional probe card, the handle size may be limited due to the relationship between the probe card and the internal structure of the test head. However, in the handling mechanism 25 of this embodiment, the probe card 17 is fixed to the prober 12. The handle 26 is removed and not fixed to the probe card 17, so that the test head 13 and the like are not limited. For this reason, it can set freely to the magnitude | size suitable for handling work. As a result, handling workability is improved.

[First modification]
In the above-described embodiment, the handle 26 of the handling mechanism 25 is configured by bending a bar in an angular C-shape having two right angles, but may be configured by bending in another shape. Specifically, the handle may function as a leg portion that supports the probe card 17 at a set angle. That is, in the above-described embodiment, when the probe card 17 is inverted, the probe card 17 is supported in a horizontal state by the handle 26. However, the probe card 17 may be supported by being inclined. .

  For example, as shown in FIGS. 6 and 7, installation portions 34 and 35 may be provided on the handle 33. The installation portions 34 and 35 are portions for inverting and supporting the probe card 17 obliquely. The installation parts 34 and 35 are configured by obliquely molding positions corresponding to the two corners of the handle 26 of the above-described embodiment in the handle 33. The angles of the two installation portions 34 and 35 are formed symmetrically as shown in FIG. In addition, you may shape | mold by making the angle of these two installation parts 34 and 35 differ on right and left. Specifically, the two installation parts 34 and 35 may be set to different angles in accordance with two angles (different angles depending on the work contents) at which the probe card 17 is to be tilted.

  By configuring in this way, as shown in FIG. 7, the inverted probe card 17 can be installed on the mounting table 36 while being inclined by a set angle. In this state, visual check and maintenance of the probe 18 are performed.

  Thereby, while having the same operation and effect as the above-mentioned embodiment, confirmation of the probe 18 and various processes can be easily performed.

[Second modification]
In the first modification, the handling mechanism is configured to support the probe card 17 by inverting it, but may be configured to support the probe card 17 without inverting it. In this case, as shown in FIGS. 8 and 9, the handle 38 includes an arched bar 39, a support bar 40, and a handle bar 41.

  The arched bar 39 is a member for supporting the probe card 17 as it is without being inverted. The arch-shaped bar 39 is formed by bending the probe card 17 into a substantially C shape so as to straddle the probe card 17 from one side (the upper side in FIG. 9), and both ends thereof are on the other side of the probe card 17 (see FIG. 9). The lower side of the probe 18 protrudes downward. Two arched bars 39 are arranged in parallel. Note that three or more arched bars 39 may be arranged in parallel. Further, the arched bar 39 may be disposed so that both ends of the arched bar 39 are disposed on the entire circumference of the probe card 17. For example, the two arched bars 39 may be arranged in the orthogonal direction with respect to the two arched bars 39 of FIG. The number of arched bars 39 may be further increased.

  The support bar 40 is a member for supporting the arched bar 39 on the probe card 17. Two support bars 40 are provided on one arched bar 39. The support bar 40 is provided with an attaching / detaching mechanism 27 at the lower end thereof with the upper end thereof being integrally connected to and supported by the arched bar 39. The support bar 40 is detachably attached to the probe card 17 via the attachment / detachment mechanism 27.

  Furthermore, a handle bar 41 is mounted over the plurality of arched bar members 39. The handle bar 41 is a member for the operator to carry the probe card 17 with his / her hand. By this handle bar 41, each arch-type bar 39 is integrally assembled at a predetermined interval. In addition, although the handle bar 41 is formed in a straight line shape, in the case where three or more arched bar members 39 are provided in a radial pattern, the handle bar 41 is formed in a curved shape or a circular shape.

  In the case of the handle 38 configured as described above, the handle 38 is attached to the probe card 17 by attaching the support bar 40 to the probe card 17 via the attaching / detaching mechanism 27. In this state, the operator grasps the handle bar 41 of the handle 38 and transports or installs the probe card 17.

  When installing the probe card 17, as shown in FIG. 9, the probe card 17 is mounted on the mounting table 42 with the probe 18 of the probe card 17 facing downward. At this time, both ends of each arched bar 39 of the handle 38 come into contact with each other on the surface of the mounting table 42 to support the probe card 17. As a result, the probe 18 of the probe card 17 is supported in a state where it is lifted off the surface of the mounting table 42 without contacting the surface of the mounting table 42.

  In some cases, the probe card 17 is inverted by holding the handle 38 and placed on the mounting table 42 with the probe 18 facing upward. As a result, the probe 18 faces upward, and visual confirmation of the probe 18 can be performed.

  Here, one probe card 17 is supported by one handle 38 and placed on the placing table 42, but the handles 38 may be stacked in a plurality of stages. In this case, each arch-type bar 39 of the upper handle 38 is connected to each arch-type bar 39 of the lower handle 38 by providing a bar connecting the ends of the arch-type bars 39 of the handle 38. So that the end of the can be placed.

  Accordingly, the probe card 17 can be easily transported, installed, stored, and the like while the probes 18 are protected by the arched bar members 39.

[Third Modification]
In the above embodiment, the fitted portion 30 of the attaching / detaching mechanism 27 of the handling mechanism 25 is provided on the stiffener cover 23 of the probe card 17, but it may be provided on other portions such as the stiffener 22. The fitted portion 30 can be provided at a position corresponding to a handle having various sizes.

  Moreover, in the said embodiment, although the latching nail | claw 31 protruded and latched to the nail | claw receiving part in the deepest part of the counterbore hole, the handle 26 was attached to the probe card 17, However, It fixes with another structure. You may do it. For example, a tip T-shaped latch portion (not shown) rotatably attached to the tip of each handle and a latch locking hole (not shown) provided in the stiffener 22 may be used. .

  Further, the handle may be attached and detached using a magnet. One or both of the fitting part and the fitted part are provided with magnets that attract each other. A mechanism for turning on and off the magnet is configured by rotating the magnet. Thus, when the magnet is turned on, the handle is attracted to the stiffener cover 23 of the probe card 17, and when the magnet is turned off, the handle is desorbed and the handle is detached from the probe card 17.

  Also in this case, the same operation and effect as the above embodiment can be obtained.

  Further, in the above-described embodiment and each modification, the operator grasps the handle with his / her hand to carry it, but it may be adapted to automation by a carrying device or the like. In this case, the handle is provided with a fitting portion that is compatible with a gripping device such as a hook of the transport device. For example, the handle may be improved so as to be adapted to the chuck element 5 of the probe card removal means 4 of the probe card transfer device described in JP-A-2009-200390. Thereby, the probe card 17 is automatically conveyed by the probe card transfer device.

  In addition, the aspect of this invention is not limited to embodiment mentioned above and each modification, It includes the various deformation | transformation which those skilled in the art can think, and the effect of this invention is not limited to the content mentioned above. . That is, various additions, changes, partial deletions, and the like are possible without departing from the concept and spirit of the present invention derived from the contents defined in the claims and equivalents thereof.

  11: Semiconductor wafer measuring device, 12: prober, 13: test head, 14: housing, 15: XYZθ stage, 16: chuck top, 17: probe card, 18: probe, 19: contact part, 21: PCB, 22: Stiffener, 23: Stiffener cover, 25: Handling mechanism, 26: Handle, 27: Detachable mechanism, 29: Fitting part, 30: Fitting part, 31: Locking claw, 33: Handle, 34, 35: Installation part 36: mounting table, 38: handle, 39: arch bar, 40: support bar, 41: handle bar, 42: mounting table.

Claims (8)

A handling mechanism for handling a probe card having a plurality of probes,
A handle used when the probe card is handled by being attached to the probe card, and a detachable mechanism for detachably attaching the handle to the probe card,
A probe card handling mechanism, wherein the handle can be attached to any of the plurality of probe cards. In the probe card handling mechanism according to claim 1,
A probe card handling mechanism, wherein the handle is configured to be bent in a substantially C-shape, and both ends thereof are formed of a bar material attached to the probe card by the attachment / detachment mechanism. In the probe card handling mechanism according to claim 2,
A probe card handling mechanism, wherein the handle functions as a leg portion for supporting the probe card when the probe card is inverted. In the probe card handling mechanism according to claim 1,
The handle is formed by bending the probe card into a substantially C-shape so as to straddle the probe card from one side thereof, and a plurality of arches provided at both ends projecting from the probe to the other side of the probe card. A probe card handling comprising: a mold bar; and a support bar that supports each of the plurality of arched bars and is detachably attached to the probe card via the attachment / detachment mechanism. mechanism. In the probe card handling mechanism according to claim 4,
A handling mechanism for a probe card, wherein a handle bar is mounted over the plurality of arched bar members. In the probe card handling mechanism according to claim 1,
2. A probe card handling mechanism, wherein the attachment / detachment mechanism comprises a fitting portion provided at an end of the handle and a fitted portion provided in the probe card. The probe card handling mechanism according to claim 6,
The probe card handling mechanism, wherein the fitting portion is a locking claw, and the fitted portion is a claw receiving portion that receives the locking claw. The probe card handling mechanism according to claim 6,
A probe card handling mechanism, wherein either one or both of the fitting part and the fitted part are magnets that attract each other.

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