JP2013081081A - Camera device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a camera device capable of improving a degree of freedom in design thereby to make the camera device applicable to various purposes.SOLUTION: A camera device 10 is configured by the removable connection of multiple modules selected so as to include at least an imaging module 20 and an external communication module 40 among three or more modules having different functions including the imaging module 20 for capturing the image of a subject and acquiring image data and the external communication module 40 for performing communication with an external apparatus. Each one of the respective modules includes communication parts 21, 41 to be mutually communicable with each other through a shared common signal.

Description

  The present invention relates to a camera device that images a subject and records image data.

  In recent years, camera devices have been used in various fields with the spread of digital cameras having an image sensor such as a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS). For example, Patent Document 1 discloses an FA camera device applied to the industrial field. According to the FA camera device, in the electronic component mounting device, the substrate recognition is performed based on the acquired image data, and the positioning accuracy of the head that sucks the component is improved. In such a camera device, as functions are diversified, various functions and performances are required. If the requested function cannot be handled by a general-purpose camera device, a dedicated camera device that implements the function is required. However, a dedicated camera device specialized for a predetermined function takes a lot of time to manufacture, and there is a concern that the cost is higher than that of a general-purpose camera device.

  In addition, the usage and required performance of the camera device may be changed after installation. Then, since a lot of time is required for the correction accompanying this, there is a problem that correction cannot be made immediately and the correction cost is required. For example, Patent Document 2 discloses a camera configured by detachably connecting an imaging module provided with an imaging element to a camera body. Thereby, for example, even if the imaging range and resolution required for the camera device are changed, it is considered that a certain degree of change can be accommodated by replacing the imaging module.

JP 2000-294992 A JP 2004-304604 A

  However, camera devices used in various fields including the industrial field are required to change image processing types and processing functions in addition to replacement of imaging modules. Furthermore, it is necessary to modify the interface depending on the change of the external device for communication, and the external dimensions may be restricted depending on the installation location of the camera device.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a camera device capable of improving the degree of freedom in design so as to be applicable to various uses.

  In order to solve the above-described problem, according to the invention according to claim 1, three or more having different functions including an imaging module that captures an image of a subject and acquires image data and an external communication module that communicates with an external device The plurality of modules selected so as to include at least the imaging module and the external communication module are detachably connected, and the modules can communicate with each other by a common signal that is shared. Has a communicator.

  According to the invention according to claim 2, in claim 1, the module includes an image processing module that executes image processing on the image data, and the camera device includes the imaging module and the image processing module. And the external communication module are detachably connected, and the image processing module includes a circuit element that can define a logic circuit that executes the image processing after the camera device is configured.

  According to a third aspect of the present invention, in the first or second aspect, the imaging module and the external communication module are circuit elements that can define a logic circuit that executes an assigned function after the camera device is configured. Have.

  According to a fourth aspect of the present invention, in any one of the first to third aspects, the module selects a plurality of different angles in a plane perpendicular to the coupling direction with respect to the other modules to be coupled. It has a connection part which can be set and connected.

  According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the imaging module further has an image processing function for performing image processing on the image data acquired by the imaging module.

  According to a sixth aspect of the present invention, in any one of the first to fifth aspects, the module inputs hardware information related to the configuration of the module stored in the memory unit of the other connected module. Then, processing corresponding to the hardware information is executed.

  According to a seventh aspect of the invention, in any one of the first to sixth aspects, the module is configured by detachably connecting a plurality of sub-modules having different functions, thereby assigning the module to the module. Have the functions.

  According to an eighth aspect of the present invention, in any one of the first to seventh aspects, the module includes an image processing module that performs image processing on the image data, and the plurality of modules are referred to as the imaging module and the image. The processing module and the external communication module are connected in this order.

  According to the first aspect of the present invention, the camera device is configured by detachably connecting a plurality of modules selected from three or more modules having different functions. Since each module has a communication unit that can communicate with each other using a common signal, a plurality of modules can be connected as required. Thus, the degree of freedom in design is improved, and the camera device is configured to have required functions and performances, so that it can be applied to various applications. The plurality of modules can be designed and inspected in module units, and existing modules can be used. Thereby, compared with the case where a dedicated camera apparatus is manufactured, a development man-hour can be reduced significantly.

  According to the invention which concerns on Claim 2, the camera apparatus is comprised by connecting the some module selected so that an image processing module may be included. The image processing module includes a circuit element that can define a logic circuit that executes image processing after the camera apparatus is configured. This circuit element is a PLD (Programmable Logic Device) in a broad sense, and is an integrated circuit that can execute specific image processing by defining a logic circuit. The image processing module functions by defining a logic circuit so that the camera apparatus can be used for a specific application at a stage where the camera apparatus is configured by being connected to other modules selectively by having a PLD. be able to. Thereby, the freedom degree in design improves and the camera apparatus according to a request | requirement can be comprised. For example, when the image processing module has an FPGA (Field Programmable Gate Array) included in the PLD, more complex and advanced image processing is possible.

  Here, as an integrated circuit capable of defining a logic circuit for a specific application, there is an ASIC (Application Specific Integrated Circuit) in addition to the PLD. Such an integrated circuit such as PLD and ASIC can be replaced with a microcomputer capable of executing the same processing. The ASIC is superior to the PLD in that the mounting area can be reduced, but the logic circuit cannot be rewritten. On the other hand, since the PLD can rewrite the defined logic circuit, for example, when the application of the camera device is changed and a different image processing is required, it is possible to cope by defining a new logic circuit. . As described above, in the camera device configured by selectively connecting a plurality of modules, the image processing module has a PLD, so that the degree of freedom in design can be further improved, and the image processing module Versatility can be improved.

  According to the invention of claim 3, at least the imaging module and the external communication module included in the camera device have a circuit element (PLD) that can define a logic circuit that executes an assigned function after the camera device is configured. doing. Here, for example, when the imaging module captures an image of a subject, the imaging module forms an image of the subject light on an imaging element such as a charge coupled device (CCD) or a complementary metal oxide semiconductor (COMS) and converts the image into digital image data. Yes. In addition, the external communication module communicates with an external device by a predetermined communication form or communication protocol. As described above, the imaging module and the external communication module are required to execute specific processing in module units. Therefore, when the imaging module and the external communication module have the above-described PLD, a logic circuit that executes an assigned function can be defined when the camera device is configured. Thereby, the freedom degree in design improves and the camera apparatus according to a request | requirement can be comprised.

  According to the invention of claim 4, the connecting portion of the module can be connected by selectively setting a plurality of different angles in a plane perpendicular to the connecting direction when connected to another module. ing. That is, one module can be connected to the other module to be connected by setting a predetermined angle among at least two kinds of angles around the connecting portion. Thereby, the freedom degree of the connection angle of modules can be improved. For example, when the camera device is applied to the industrial field, the FA camera device is placed in a machine such as an electronic component mounting device or a machine tool, and the external dimensions are restricted depending on the installation location of the camera device. There is. Therefore, by adjusting the connected modules to have a predetermined angle, it is possible to adapt to the arrangement environment of the camera device. Thus, according to the present invention, the degree of freedom in designing the camera device can be improved.

  According to the invention of claim 5, the imaging module has an image processing function for executing image processing in addition to the imaging function for acquiring image data. As a result, the camera device can execute image processing even with a minimum configuration including only the imaging module and the external communication module, so that the overall size of the device can be reduced.

  According to the invention of claim 6, the module executes processing so as to exhibit the assigned function in accordance with the hardware information of the other connected modules. In addition, other modules store the hardware information related to the configuration of this module in the memory unit. For example, if this module is an imaging module, the number of pixels of the imaging element, the image transfer speed, and the like correspond to the hardware information. When the hardware information is input by the image processing module, image processing corresponding to the number of pixels and the image transfer speed is executed. Thereby, even when another module to be connected is replaced and the configuration of the camera apparatus is changed, the module can cope with a new configuration by inputting the hardware information of the other module. . Therefore, the degree of freedom in design can be further improved, and the versatility of the module can be improved.

  According to the invention of claim 7, the module is configured by detachably connecting a plurality of submodules having different functions. Thereby, the design freedom concerning the external shape of the module can be improved. Further, by exchanging a part of the submodule, the function and specification of the module can be changed, so that the versatility of the module can be improved.

  According to the eighth aspect of the invention, the camera device is configured by connecting an imaging module, an image processing module, and an external communication module in this order. For example, the camera apparatus performs image processing on the image data acquired by the imaging module by the image processing module, and transfers the data from the external communication module to the external device. Therefore, by connecting and configuring the modules in this order, the wiring in each module can be designed compactly without complicating the wiring.

1st embodiment: It is a conceptual diagram which shows an example of the use condition of a camera apparatus. It is a schematic diagram of the camera apparatus comprised by selectively connecting a some module. It is a block diagram which shows the 1st example of selection of a camera apparatus. 2nd embodiment: It is a block diagram which shows the 2nd selection example of a camera apparatus. It is a schematic diagram which shows the rotation state of a connection part. 3rd embodiment: It is a schematic diagram of the module comprised by selectively connecting a some submodule.

  Hereinafter, embodiments of the camera device of the present invention will be described with reference to the drawings.

<First embodiment>
(Configuration of the camera device 10)
The camera apparatus 10 of 1st embodiment is demonstrated with reference to FIGS. 1-3. In the present embodiment, the camera apparatus 10 is configured to be incorporated in the electronic component mounting apparatus 1. The electronic component mounting apparatus 1 is an apparatus for mounting a plurality of electronic components on a printed circuit board CB, for example, in an integrated circuit manufacturing process. Also, the printed circuit board CB is coated with solder at the mounting position of the electronic component by a cream solder printing machine, and is transported through a plurality of mounting devices in order to mount the electronic component. Thereafter, the printed circuit board CB on which electronic components are mounted is transported to a reflow furnace and soldered to form an integrated circuit.

  As shown in FIG. 1, the electronic component mounting apparatus 1 includes a control device 2 and a camera device 10. The control device 2 includes a CPU and a memory, and inputs a command value for the electronic component mounting device 1 and information output from the camera device 10 and a sensor. And the control apparatus 2 controls each axis motor, each apparatus, etc. of the electronic component mounting apparatus 1 so that an electronic component is mounted | worn appropriately to the printed circuit board CB based on these command values and various information. In the present embodiment, the camera device 10 is used as a substrate camera that captures an image of the printed circuit board CB transported to a specified position by a transport device such as a conveyor when the electronic component mounting device 1 mounts the electronic component. Yes.

  More specifically, the camera device 10 that is a substrate camera images the printed circuit board CB that has been transported to a specified position and clamped based on an imaging command that is input through communication with the control device 2. Then, the camera device 10 performs predetermined image processing on the acquired image data and outputs it to the control device 2. Next, the control device 2 recognizes the board marks provided at the two opposite corners of the printed circuit board CB as the reference position from the image data. As a result, the control device 2 can mount the electronic component at the set coordinate value. In other words, by correcting the position error that occurs when the printed circuit board CB is clamped based on the image data, the accuracy of component mounting is improved. Thus, in the present embodiment, the control device 2 is an external device positioned above the camera device 10, and the printed circuit board CB is a subject imaged by the camera device 10.

  In addition, the camera device 10 can be used for a component camera that captures the state of an electronic component sucked by a suction nozzle of a component mounting head, for example. Furthermore, it can also be used for the electronic component mounting apparatus 1 as a compound eye camera apparatus 10 having a plurality of imaging elements in order to image a plurality of subjects. In any case, the operation of the camera device 10 is controlled by the control device 2 which is a host device. The camera device 10 can also be incorporated into a board inspection apparatus that inspects the printed circuit board CB on which electronic components are mounted. In this case, the camera device 10 is used as an inspection camera that images the printed circuit board CB. Thus, the camera apparatus 10 can be used for purposes other than board production. In this case, a general-purpose personal computer or a dedicated image processing board is used as the host device.

  The camera device 10 is configured by detachably connecting modules selected from three or more modules having different functions. In the present embodiment, as illustrated in FIG. 2, the camera device 10 captures an image from among modules including an imaging module 20, an image processing module 30, an external communication module 40, an autonomous operation module 50, and a light source module 60. The module 20, the image processing module 30, and the external communication module 40 are selected one by one and connected in this order.

  Moreover, each illustrated module 20-60 has a mutually different function. Each module 20-60 is prepared with a plurality of types having similar functions. Each of the modules 20 to 60 has a communication unit that can communicate with each other by a common signal that is shared, and is housed in a housing of the same shape provided with a detachable connecting unit. And the camera apparatus 10 can be selected from each module 20-60 according to a use, and can be combined freely. It is also possible to connect a plurality of modules of the same type. Details of functions and configurations of the modules 20 to 60 will be described later.

  The imaging module 20 is a module that captures an image of a printed circuit board CB that is a subject and acquires image data. As shown in FIG. 3, the imaging module 20 includes a PLD 21, a memory unit 22, a connecting unit 23, a lens unit 24, and an image sensor 25. The PLD 21 is a circuit element that can define a logic circuit that executes an assigned imaging function after the imaging module 20 configures the camera device 10. More specifically, it is an integrated circuit such as an FPGA (Field Programmable Gate Array) or CPLD (Complex Programmable Logic Device).

  The PLD 21 has a logic circuit defined by dedicated software so as to have a function necessary for the imaging module 20 of the camera device 10. The logic circuit defined in the PLD 21 is a device driver that operates the image sensor 25, a communication program that communicates with the image processing module 30 connected thereto, and the like. The communication program can communicate with each other by a common signal shared between the modules 20 to 60. Therefore, the PLD 21 also functions as a communication unit in the imaging module 20.

  The memory unit 22 is a flash memory that stores hardware information related to the configuration of the imaging module 20. In the present embodiment, the memory unit 22 can change the stored content by rewriting and is non-volatile that retains the stored content even when the power is turned off, but is a read-only non-volatile memory ROM (Read Only Memory). Specifically, the hardware information includes the number of pixels of the image sensor 25 and the image transfer speed. The memory unit 22 can also operate as a temporary storage unit during processing by the PLD 21. The connecting portion 23 is a part that is detachably connected to another module. The imaging module 20 is coupled to the image processing module 30 and is electrically connected via the coupling unit 23 so that communication is possible.

  The lens unit 24 is an optical system that forms an image of subject light, and includes a lens and a lens holding member (not shown). The image sensor 25 is an image sensor such as a CCD or a CMOS. The image sensor 25 is arranged so that its imaging surface is perpendicular to the optical axis of the lens unit 24. Then, the image sensor 25 converts the signal charges generated according to the intensity of the light imaged on the imaging surface by the lens unit 24 into a digital signal and images the subject. The PLD 21 converts the image data into image data based on the digital signal output from the image sensor 25. In the present embodiment, the imaging module 20 is configured to have only one set of the lens unit 24 and the image sensor 25.

  The image processing module 30 is a module that executes image processing on the image data acquired by the imaging module 20. As shown in FIG. 3, the image processing module 30 includes a PLD 31, a memory unit 32, and connecting units 33a and 33b. The PLD 31 is a circuit element that can define a logic circuit that executes image processing after the image processing module 30 configures the camera device 10. Since the PLD 31 of the image processing module 30 is the same as the PLD 21 of the imaging module 20, detailed description thereof is omitted.

  The logic circuit defined in the PLD 31 of the image processing module 30 is an image processing program as a board camera, a communication program for communicating with the imaging module 20 and the external communication module 40 to be connected, and the like. This image processing program executes image processing so that the control device 2 that has input image data from the camera device 10 can recognize the substrate mark as a reference position. This image processing is, for example, binarization of image data, filtering, hue extraction, and the like, and is selectively implemented as necessary. Further, the communication program performs communication using a common signal, similar to the one defined in the PLD 21 of the imaging module 20. Therefore, the PLD 31 also functions as a communication unit in the image processing module 30.

  The memory unit 32 is a non-volatile flash memory that can change the stored content by rewriting and retains the stored content even when the power is turned off. The memory unit 32 is used as an auxiliary storage unit, for example, temporarily holding image data during image processing by the PLD 31. The connecting portions 33 a and 33 b are portions that are detachably connected to other modules, and are provided at symmetrical positions in the image processing module 30. The image processing module 30 is coupled to the imaging module 20 and the image processing module 30 and is electrically connected to be communicable via the coupling portions 33a and 33b.

  The external communication module 40 is a module that communicates with the control device 2 that is an external device. As shown in FIG. 3, the external communication module 40 includes a PLD 41, a memory unit 42, a coupling unit 43, and an interface IC 44. The PLD 41 is a circuit element that can define a logic circuit that executes an assigned external communication function after the external communication module 40 configures the camera device 10. Since the PLD 41 of the external communication module 40 is the same as the PLD 21 of the imaging module 20, detailed description thereof is omitted.

  The logic circuit defined in the PLD 41 of the external communication module 40 is a device driver that operates the interface IC 44, a communication program that communicates with a connected image processing module, and the like. In addition, this communication program communicates with a common signal, similar to the one defined in the PLD 21 of the imaging module 20. Therefore, the PLD 41 also functions as a communication unit in the external communication module 40.

  The memory unit 42 is a flash memory that stores hardware information related to the configuration of the external communication module 40. The memory unit 42 may be a ROM that is a read-only nonvolatile memory, like the memory unit 22 of the imaging module 20. The hardware information specifically includes the transfer speed of the interface IC 44 and the transfer bus width. The memory unit 42 can also operate as a temporary storage unit during processing by the PLD 41.

  The connecting portion 43 is a portion that is detachably connected to another module. The external communication module 40 is coupled to the image processing module 30 and is electrically connected via the coupling unit 43 so that communication is possible. The interface IC 44 is an electronic circuit having a predetermined communication function for communicating with the control device 2. Such an interface IC 44 is designed according to various communication protocols and communication standards, and has a communication form corresponding to a data transmission path such as a parallel interface, a coaxial cable, or a USB.

  The autonomous operation module 50 is a module to which a function of automatically performing a predetermined operation in the camera device 10 based on image data acquired by the imaging module 20 is assigned. Examples of such functions include an automatic tracking function that changes the imaging direction of the camera device 10 in accordance with the movement of the subject, and an automatic imaging function that recognizes a specific mark of the subject and outputs an imaging command to the imaging module 20. The autonomous operation module 50 includes a communication unit that can communicate with other modules by a common signal regardless of the function. The communication unit of the autonomous operation module 50 may implement a communication program in a PLD or a microcomputer that executes an autonomous operation function. Moreover, in this embodiment, the autonomous operation module 50 has a connection part formed in the same shape as a connection part such as the imaging module 20. Thereby, the autonomous operation module 50 can be connected to any module.

  The light source module 60 is a module to which an illumination function for irradiating a subject when the camera device 10 performs imaging is assigned based on a control command of the control device 2 that is a host device. Such a light source module 60 may have a function of adjusting an irradiation amount according to a measurement value obtained by an illuminance sensor using an LED or a light bulb as a light source. The light source module 60 includes a communication unit that can communicate with other modules using a common signal, regardless of the configuration of the light source module 60. The communication unit of the light source module 60 may be a module that implements a communication program in a PLD or a microcomputer that performs an illumination function. In the present embodiment, the light source module 60 has a connecting portion formed in the same shape as the connecting portion of the imaging module 20 or the like. Thereby, the light source module 60 can be connected to any module.

  The camera device 10 configured as described above, for example, captures an image of the printed circuit board CB based on an imaging command from the control device 2 and outputs image data that has undergone image processing to the control device 2. Thus, the camera device 10 is used as a board camera in the electronic component mounting apparatus 1. Here, when an imaging command is input to the camera apparatus 10, the PLDs 21, 31, and 41 of the modules 20 to 40 execute predetermined programs to execute imaging of an object, image processing, and output of image data. At this time, the PLDs 21, 31, and 41 of the modules 20 to 40 communicate with each other by a preset common signal. More specifically, the PLDs 21, 31, and 41 are connected in a bus format, for example, and perform synchronous or asynchronous serial communication at a predetermined transfer rate. With such a configuration, even when various modules are selectively connected to form a camera device, communication between the modules is possible.

  Further, the image processing module 30 inputs hardware information stored in the memory unit 22 of the imaging module 20 to be connected when the power of the camera device 10 is turned on. Accordingly, the image processing module 30 inputs image data at a predetermined image transfer speed according to the hardware information related to the configuration of the imaging module 20, and executes image processing corresponding to a predetermined number of pixels. Similarly, the image processing module 30 inputs hardware information stored in the memory unit 42 of the connected external communication module 40. As a result, the image processing module 30 transfers the image data subjected to the image processing to the external communication module 40 according to the hardware information related to the configuration of the external communication module 40.

(Effect in the first embodiment)
The camera device 10 described above is configured by selecting the imaging module 20, the image processing module 30, and the external communication module 40 one by one from among three or more modules having different functions, and detachably connecting them. Each module 20-40 has PLD21,31,41 which functions as a communication part, and can communicate with each other by the common signal made common. As described above, in the present embodiment, the camera device 10 that uses a substrate camera is illustrated.

  In addition, as shown in FIG. 2, each module having different functions can be considered in various forms in order to exhibit its functions. For example, in the imaging module 20, it is conceivable to prepare imaging modules having different numbers of pixels depending on the combination of the lens unit 24 and the image sensor 25 depending on the application. Further, it may be a compound eye imaging module having a plurality of lens units 24 and an image sensor 25. In the image processing module 30, a plurality of types having different PLDs and memory units may be prepared in consideration of necessary image processing and cost. In the external communication module 40, as described above, a plurality of types having different data transmission paths may be prepared. The same applies to the autonomous operation module 50 and the light source module 60. Furthermore, in the present embodiment, the modules 20 to 60 having different functions as described above are exemplified, but in addition, modules such as a sensor module having a function of acquiring information of the electronic component mounting apparatus 1 by various sensors. May be included in a selectable manner.

  Each module has a communication unit that can communicate with each other using a common signal. Thereby, it becomes possible to connect a plurality of modules as required. Thus, the degree of freedom in design is improved, and the camera device is configured to have required functions and performances, so that it can be applied to various applications. The plurality of modules can be designed and inspected in module units, and existing modules can be used. Thereby, compared with the case where the exclusive camera apparatus 10 is manufactured, a development man-hour can be reduced significantly.

  Further, the image processing module 30 includes a PLD 31 that can define a logic circuit that executes image processing after the camera apparatus 10 is configured. Thus, the logic circuit is defined in the image processing module 30 so that the camera device 10 can be used as a substrate camera when the camera device 10 is selectively connected to the other modules 20 and 40 to configure the camera device 10. Can function. Thereby, the freedom degree in design improves and the camera apparatus 10 according to a request | requirement can be comprised. If the PLD 31 is an FPGA (Field Programmable Gate Array), more complicated and advanced image processing can be performed.

  The imaging module 20 and the external communication module 40 include the PLDs 21 and 41 that can define logic circuits that execute assigned functions after the camera device 10 is configured. Here, when imaging the printed circuit board CB, the imaging module 20 images subject light on an imaging element such as a CCD or a COMS and converts it into digital image data. Further, the external communication module 40 communicates with an external device by a predetermined communication form or communication protocol. As described above, the imaging module 20 and the external communication module 40 are required to execute specific processing in module units. Therefore, when the imaging module 20 and the external communication module 40 have the above-described PLD, a logic circuit that executes an assigned function can be defined when the camera apparatus 10 is configured. Thereby, the freedom degree in design improves and the camera apparatus 10 according to a request | requirement can be comprised.

  Further, the image processing module 30 executes image processing according to the hardware information of the imaging module 20 and the external communication module 40 to be connected. As a result, even when the imaging module 20 to be connected is replaced and the configuration of the camera device 10 is changed, the image processing module 30 can input new hardware information of the imaging module 20 after replacement. Can correspond to the configuration. Therefore, the degree of freedom in design can be further improved, and the versatility of each module can be improved.

  In the present embodiment, the camera device 10 is configured by connecting the imaging module 20, the image processing module 30, and the external communication module 40 in this order. The camera device 10 functioning as a substrate camera performs image processing on the image data acquired by the imaging module 20 by the image processing module 30 and transfers the data from the external communication module 40 to the external device. Therefore, by connecting and configuring the modules in this order, the wiring in each module can be designed compactly without complicating the wiring.

<Second embodiment>
(Configuration of Camera Device 110)
A camera device 110 according to the second embodiment will be described with reference to FIGS. The camera device 110 in the present embodiment is mainly different from the first embodiment in the configuration of the selected module. Since other common configurations are substantially the same as those in the first embodiment, detailed description thereof is omitted. Only the differences will be described below. In the present embodiment, as shown in FIG. 4, the camera device 110 is configured by selecting the imaging module 120 and the external communication module 140 one by one from among three or more modules having different functions and detachably connecting them. Has been.

  The imaging module 120 is a module that captures an image of a subject and acquires image data. As illustrated in FIG. 4, the imaging module 120 includes a PLD 121, a memory unit 22, a connecting unit 123, a lens unit 24, and an image sensor 25. Here, since the memory unit 22, the lens unit 24, and the image sensor 25 are the same as those in the first embodiment, detailed description thereof is omitted. The PLD 121 is an integrated circuit such as an FPGA or a CPLD, and a logic circuit is defined by dedicated software so as to have a function necessary for the imaging module 120 of the camera device 110.

  In the present embodiment, the logic circuit defined in the PLD 121 is a device driver that operates the image sensor 25, a communication program that communicates with the connected external communication module 140, an image processing program according to the application, and the like. The PLD 121 also functions as a communication unit in the imaging module 120 by this communication program, as in the first embodiment. Further, the image processing program is the same as that defined in the PLD 31 of the image processing module 30 in the first embodiment, and executes image processing on the image data acquired by the image sensor 25. In other words, the imaging module 120 has an image processing function equivalent to or simpler than that of the image processing module by the image processing program defined in the PLD 121.

  The connecting part 123 is a part that is detachably connected to another module. The imaging module 120 is coupled to the external communication module 140 and is electrically connected via the coupling unit 123 so as to be communicable. In addition, in the present embodiment, the connection part 123 of the imaging module 120 is formed in a circular convex shape and is connected to the connection part 143 of the external communication module 140.

  The external communication module 140 is a module that communicates with the control device 2 that is an external device. As illustrated in FIG. 4, the external communication module 140 includes a communication unit 145, a memory unit 42, a connection unit 143, and an interface IC 44. Here, since the memory unit 42 and the interface IC 44 are the same as those in the first embodiment, detailed description thereof is omitted. The communication unit 145 can communicate with each other by a common signal shared between the modules. The communication unit 145 is interposed between the PLD 121 and the memory unit 42 of the imaging module 120 and between the PLD 121 and the interface IC 44, thereby communicating an imaging command and image data between the control device 2 and the PLD 121. It is possible.

  Here, the device driver of the interface IC 44 is defined in the PLD 121 of the imaging module 120. Thus, the operation of the interface IC 44 is controlled by the PLD 121 of the imaging module 120 via the communication unit 145. As described above, in the camera device 110, the external communication module 140 does not include a circuit element such as a PLD, and the image processing module 120 controls the image processing and external communication in an integrated manner.

  The connecting part 143 is a part that is detachably connected to another module. The external communication module 140 is coupled to the imaging module 120 and is electrically connected via the coupling unit 143 so that communication is possible. Further, in the present embodiment, the connecting portion 143 of the external communication module 140 is formed in a circular concave shape, and is connected by being fitted to the connecting portion 123 of the imaging module 120. With such a structure, as shown in FIG. 5, the imaging module 120 can be connected to the external communication module 140 to be connected by selectively setting a plurality of different angles in a plane perpendicular to the connection direction. It has become.

(Effect in 2nd embodiment)
According to the camera apparatus 110 mentioned above, there exists an effect similar to 1st embodiment. In the camera device 110, the connecting portion 123 of the imaging module 120 and the connecting portion 143 of the external communication module 140 are fitted and connected. Then, the imaging module 120 can rotate around the connecting portion 123 while maintaining an electrical connection state with the external communication module 140. Thereby, the camera apparatus 110 can change the whole shape easily by adjusting the connection angle of each connection part 123,143. Here, the camera apparatus 110 is disposed in the electronic component mounting apparatus, and the external dimensions may be restricted depending on the installation location. Therefore, with the above-described configuration, the modules to be connected can be adjusted to have a predetermined angle, and can be adapted to the arrangement environment of the camera device 110 and the like.

  The imaging module 120 has an image processing function for executing image processing in addition to an imaging function for acquiring image data. As a result, the camera device 110 can execute image processing even with a minimum configuration including only the imaging module 120 and the external communication module 140, and thus the camera device 110 as a whole can be reduced in size.

<Third embodiment>
(Configuration of Camera Device 210)
A camera device 210 according to the third embodiment will be described with reference to FIG. The camera device 210 in the present embodiment is different from the first embodiment in that a predetermined module constituting the camera device 210 is mainly configured by connecting a plurality of submodules. Since other common configurations are substantially the same as those in the first embodiment, detailed description thereof is omitted. Only the differences will be described below. In the present embodiment, as shown in FIG. 6, the camera device 210 selects the imaging module 20, the image processing module 230, and the external communication module 40 one by one from among three or more modules having different functions, and attaches / detaches them. It is configured to be connected. Here, since the imaging module 20 and the external communication module 40 are the same as those in the first embodiment, detailed description thereof is omitted.

  The image processing module 230 is a module that executes image processing on the image data acquired by the imaging module 20. The image processing module 230 is configured by detachably connecting a plurality of submodules having different functions. In the present embodiment, as shown in FIG. 6, the image processing module 230 is a control submodule among submodules including a control submodule 235, a memory submodule 236, a connection submodule 237, and a communication submodule 238. 235 and memory submodule 236 are selected one by one, and two connection submodules 237 are selected and detachably connected.

  The illustrated submodules 235 to 238 have different functions. Each of the submodules 235 to 238 is prepared with a plurality of types having the same function. In addition, each of the sub modules 235 to 238 is accommodated in a housing having the same shape provided with a detachable connecting portion. The image processing module 230 can be selected from the submodules 235 to 238 according to the application and can be freely combined.

  However, it is necessary to configure the function assigned to the image processing module 230 by combining a plurality of submodules. Therefore, when the image processing module 230 is configured by a plurality of submodules as in the present embodiment, it is necessary to include at least a control submodule 235 that executes image processing, for example. Further, as a communication unit, the configured module has a communication submodule 238 or selects a control submodule 235 in which a communication program is defined so that the camera device 210 can communicate with other modules. It is necessary to configure the function.

  In addition, the control submodule 235, the memory submodule 236, and the connection submodule 237 have image functions so as to have functions corresponding to the PLD 31, the memory unit 32, and the connection units 33a and 33b of the image processing module 30 in the first embodiment. The processing module 30 is modularized. In order to execute image processing of input image data, the control submodule 235 is provided with a plurality of types having different circuit elements such as PLD such as FPGA, ASIC, and microcomputer. The control submodule 235 may be configured to execute control of each part by defining a communication program, a device driver, and the like in addition to image processing. For example, the memory submodule 236 is provided with a plurality of different capacity forms for the flash memory. The connection sub-module 237 is prepared in a form adapted to a plurality of connection methods, for example, in connection with other modules so as to be rotatable or considering the number of connections.

  The communication submodule 238 is a submodule having a function of communicating with another module to which the image processing module 230 is connected, and corresponds to the function of the communication program defined in the PLD 31 in the first embodiment. For example, when a submodule having an ASIC or a microcomputer is selected as the control submodule 235 and no communication program is defined in this ASIC, a communication submodule 238 having a predetermined communication function is required to communicate with other modules. It becomes. Therefore, various forms are prepared in the communication submodule 238 so as to enable a predetermined transfer rate and synchronous or asynchronous serial communication so as to correspond to the standardized common signal.

(Effect in the third embodiment)
In the image processing module 230 having such a configuration, sub-modules can be selected according to the application. Further, even in the operational state of the camera apparatus 210, it is possible to cope with the problem by exchanging the submodules according to the purpose of use or a request for higher speed processing. In the present embodiment, the image processing module 230 has been described as an example. Similarly, each part of the imaging module 20, the external communication module 40, the autonomous operation module 50, the light source module 60, and the like is divided into submodules. A configuration to be applied can be applied. Thereby, the freedom degree in the design concerning the external shape of each module can be improved. Further, by exchanging a part of the submodule, the function and specification of the module can be changed, so that the versatility of the module can be improved.

<Modification of Embodiment>
In the embodiments (first embodiment to third embodiment), each module is electrically connected by a connecting portion and can communicate with each other. On the other hand, the modules may be configured such that only the housings are integrally connected by a connecting portion and communicate with each other by wireless communication. That is, the communication unit of each module performs wireless communication using a common signal that is shared, and transfers an imaging command and image data. Even in such a configuration, the same effects as in the embodiment can be obtained.

  For example, in the first embodiment, the camera apparatus 10 is configured such that the image processing module 30 includes the PLD 31. On the other hand, the camera device 10 may be configured by selecting an image processing module 30 prepared in the form of an ASIC or a microcomputer that exhibits an imaging function. That is, each module can assume various forms in order to perform the assigned function. For example, by combining the microcomputer and the flash memory as described above, the functions similar to those of the FPGA are configured at low cost. Can be realized.

  In the second embodiment, the camera device 110 has a configuration in which only the imaging module 120 includes the PLD 121. Thus, even when a plurality of modules are connected, only one module may have a controllable circuit element such as a PLD. A configuration in which the module functions as a main board in the camera device, sends various commands to other modules, and controls input of image data and transfer to an external device is also possible.

  Further, any module may be configured not to have a controllable circuit element such as a PLD. In such a configuration, when an imaging command is received from the external device, each module communicates with the communication unit, mechanically captures the subject, and then performs image processing as necessary. Transfer image data to. Thus, the camera device does not necessarily require a circuit element such as a PLD. However, as in the present invention, in a camera device configured by selectively linking a plurality of modules, having a PLD makes it possible to enhance and speed up image processing, and to provide flexibility and versatility in module design. From this point of view, it is preferable to have a circuit element such as a PLD.

1: Electronic component mounting device 2: Control device 10, 110, 210: Camera device 20, 120: Imaging module 21, 121: PLD (communication unit)
22: Memory part, 23, 123: Connection part, 24: Lens part 25: Image sensor 30, 230: Image processing module, 31: PLD (communication part), 32: Memory part 33a, 33b: Connection part 235: Control sub Module 236: Memory sub-module 237: Connection sub-module 238: Communication sub-module (communication unit)
40, 140: External communication module, 41: PLD (communication unit), 42: Memory unit 43, 143: Connection unit, 44: Interface IC, 145: Communication unit 50: Autonomous operation module 60: Light source module CB: Printed circuit board ( subject)

Claims (8)

Among at least three modules having different functions including an imaging module that captures an image of a subject and acquires image data, and an external communication module that communicates with an external device, so as to include at least the imaging module and the external communication module A plurality of selected modules are detachably connected, and
Each of the modules is a camera device having a communication unit capable of communicating with each other by a common signal. In claim 1,
The module includes an image processing module that performs image processing on the image data,
The camera device is configured by detachably connecting the imaging module, the image processing module, and the external communication module,
The said image processing module is a camera apparatus which has a circuit element which can define the logic circuit which performs the said image process, after comprising the said camera apparatus. In claim 1 or 2,
The imaging device and the external communication module are camera devices having circuit elements capable of defining logic circuits that execute assigned functions after the camera device is configured. In any one of Claims 1-3,
The module has a connecting part that can be connected by selectively setting a plurality of different angles in a plane perpendicular to the connecting direction with respect to the other connected modules. In any one of Claims 1-4,
The imaging apparatus further includes an image processing function for executing image processing on the image data acquired by the imaging module. In any one of Claims 1-5,
The module is a camera device that inputs hardware information related to a configuration of the module stored in a memory unit of another module to be connected, and executes processing according to the hardware information. In any one of Claims 1-6,
The module is a camera device having a function assigned to the module by detachably connecting a plurality of submodules having different functions. In claims 1-7,
The module includes an image processing module that performs image processing on the image data,
A camera device configured by connecting a plurality of the modules in the order of the imaging module, the image processing module, and the external communication module.

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