JP2013076901A5 - - Google Patents

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Publication number
JP2013076901A5
JP2013076901A5 JP2011217504A JP2011217504A JP2013076901A5 JP 2013076901 A5 JP2013076901 A5 JP 2013076901A5 JP 2011217504 A JP2011217504 A JP 2011217504A JP 2011217504 A JP2011217504 A JP 2011217504A JP 2013076901 A5 JP2013076901 A5 JP 2013076901A5
Authority
JP
Japan
Prior art keywords
adhesive
resin
seal
seal portion
dispenser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011217504A
Other languages
Japanese (ja)
Other versions
JP2013076901A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2011217504A priority Critical patent/JP2013076901A/en
Priority claimed from JP2011217504A external-priority patent/JP2013076901A/en
Priority to KR1020120102011A priority patent/KR20130035875A/en
Priority to CN2012103744300A priority patent/CN103033957A/en
Priority to TW101135693A priority patent/TW201314324A/en
Publication of JP2013076901A publication Critical patent/JP2013076901A/en
Publication of JP2013076901A5 publication Critical patent/JP2013076901A5/ja
Pending legal-status Critical Current

Links

Description

また、樹脂材料を供給するディスペンサ、インクジェットヘッドを用いて、樹脂を塗布することにより、シール部を形成してもよい。これにより、様々なシール部の形成パターンを、適宜選択して適用することができる。樹脂としては、光学特性や材料のコンタミネーション等の観点から、接着剤充填部と同種の粘度違いとすることが望ましいが、これには限定されない。 Alternatively, the seal portion may be formed by applying resin using a dispenser that supplies a resin material or an inkjet head. Thereby, various formation patterns of the seal portion can be appropriately selected and applied. The resin preferably has the same viscosity difference as the adhesive-filled portion from the viewpoint of optical characteristics, material contamination, and the like, but is not limited thereto.

３…シール部
４…接着剤充填部
３１…拡張部
３１ａ…狭幅部
３１ｂ…広幅部
Ａ…気泡
Ｍ…貼合構造体
Ｒ…接着剤
Ｓ１、Ｓ２…ワーク
Ｗ…視野範囲
DESCRIPTION OF SYMBOLS 3 ... Seal part 4 ... Adhesive filling part 31 ... Expansion part 31a ... Narrow part 31b ... Wide part A ... Bubble M ... Bonding structure R ... Adhesive S1, S2 ... Workpiece W ... View range

JP2011217504A 2011-09-30 2011-09-30 Bonding structure and manufacturing method of the same Pending JP2013076901A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011217504A JP2013076901A (en) 2011-09-30 2011-09-30 Bonding structure and manufacturing method of the same
KR1020120102011A KR20130035875A (en) 2011-09-30 2012-09-14 Bonding structure and manufacturing method of bonding structure
CN2012103744300A CN103033957A (en) 2011-09-30 2012-09-27 Bonding structure and manufacturing method of bonding structure
TW101135693A TW201314324A (en) 2011-09-30 2012-09-28 Laminated structure body and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011217504A JP2013076901A (en) 2011-09-30 2011-09-30 Bonding structure and manufacturing method of the same

Publications (2)

Publication Number Publication Date
JP2013076901A JP2013076901A (en) 2013-04-25
JP2013076901A5 true JP2013076901A5 (en) 2014-11-06

Family

ID=48020992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011217504A Pending JP2013076901A (en) 2011-09-30 2011-09-30 Bonding structure and manufacturing method of the same

Country Status (4)

Country Link
JP (1) JP2013076901A (en)
KR (1) KR20130035875A (en)
CN (1) CN103033957A (en)
TW (1) TW201314324A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015138088A (en) * 2014-01-21 2015-07-30 三菱電機株式会社 image display device
JP2017009662A (en) * 2015-06-17 2017-01-12 株式会社ジャパンディスプレイ Display and manufacturing method of display
JP6566739B2 (en) * 2015-06-24 2019-08-28 株式会社ジャパンディスプレイ Display device
CN105068326B (en) * 2015-09-01 2017-09-26 深圳市华星光电技术有限公司 Liquid crystal display substrate
JP6723742B2 (en) * 2015-12-28 2020-07-15 株式会社デンソーテン Electronic device and method of manufacturing electronic device
KR101937892B1 (en) * 2016-04-15 2019-01-14 주식회사 엘지화학 Method for bonding substrates and substrate for displays manufactured by same
JP6891499B2 (en) * 2017-01-10 2021-06-18 大日本印刷株式会社 Dimming cell
JP7000901B2 (en) * 2018-02-14 2022-01-19 株式会社デンソー Image display device and its manufacturing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06289405A (en) * 1993-04-02 1994-10-18 Optrex Corp Liquid crystal display device
JP2005084324A (en) * 2003-09-08 2005-03-31 Seiko Epson Corp Electro-optical apparatus, its manufacturing method, and electronic equipment
JP2007127739A (en) * 2005-11-02 2007-05-24 Sony Corp Display apparatus and method of manufacturing display apparatus
JP5125345B2 (en) * 2007-09-19 2013-01-23 日立化成工業株式会社 Liquid crystal display
JP2008203714A (en) * 2007-02-22 2008-09-04 Fujitsu Ltd Panel laminated structure and panel lamination method
JP4462317B2 (en) * 2007-09-28 2010-05-12 カシオ計算機株式会社 Protection plate integrated display panel
JP5451015B2 (en) * 2008-09-12 2014-03-26 協立化学産業株式会社 Display panel manufacturing method and display panel
JP5529428B2 (en) * 2009-03-25 2014-06-25 株式会社ジャパンディスプレイ ELECTRO-OPTICAL DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
JP5527650B2 (en) * 2009-08-31 2014-06-18 Ｎｌｔテクノロジー株式会社 Display device
KR101074801B1 (en) * 2009-09-09 2011-10-19 삼성모바일디스플레이주식회사 Light emitting display device
KR101146994B1 (en) * 2010-06-10 2012-05-22 삼성모바일디스플레이주식회사 A display apparatus and a method for manufacturing the same

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