JP2013073475A5

JP2013073475A5 -

Info

Publication number: JP2013073475A5
Application number: JP2011212934A
Authority: JP
Filing date: 2011-09-28
Publication date: 2014-07-24
Anticipated expiration: 2031-09-28

Claims

A wiring structure formed on a substrate,
The wiring structure is
A transparent conductive film containing a binder and conductive fibers;
A conductor film in electrical contact with one region of the transparent conductive film,
One region of the transparent conductive film is a wiring structure in which a weight ratio (conductive fiber / binder) between the binder and the conductive fiber is larger than that of the other region of the transparent conductive film.

The weight ratio (conductive fiber / binder) of the binder and the conductive fiber in one region of the transparent conductive film is 1.1 or more, and the binder and the conductive property in the other region of the transparent conductive film The wiring structure according to claim 1 , wherein a weight ratio to the fiber (conductive fiber / binder) is 1.0 or less.

The wiring structure according to claim 1, wherein the conductive fiber is a silver nanowire.

Wiring structure according to any one of the conductive film of claims 1 is a metal film 3.

The wiring structure according to claim 4 , wherein a contact resistance between one region of the transparent conductive film and the conductor film is 1.0 × 10 ⁻³ Ω · cm ² or less.

The conductive film is a transparent conductive film containing a binder and conductive fibers, and a contact resistance between one region of the transparent conductive film and the conductive film is 8.0 × 10 ⁻⁴ Ω · cm ² or less. Item 4. The wiring structure according to any one of Items 1 to 3.

The wiring structure according to any one of claims 1 to 6, wherein the conductive fiber has a minor axis of 50 nm or less.

A method of manufacturing a wiring structure,
Forming a conductor film on the substrate;
Forming a transparent conductive film containing a binder and conductive fibers, wherein the conductive film and one region are in electrical contact;
In order to reduce contact resistance between one region of the transparent conductive film and the conductive film, the binder and the conductive fiber in one region of the transparent conductive film are compared with other regions of the transparent conductive film. And increasing the weight ratio (conductive fiber / binder),
Manufacturing method of wiring structure having

The step of increasing the weight ratio of the binder and the conductive fiber (conductive fiber / binder) in one region of the transparent conductive film is a plasma ashing process using an inert gas in one region of the transparent conductive film. a method for manufacturing a wiring structure according to claim 8 comprising.

The method for manufacturing a wiring structure according to claim 9 , wherein the inert gas is one inert gas selected from the group consisting of N ₂ , Ne, Ar, Kr, and Xe.

The binder is made of a photosensitive resin, and the step of increasing a weight ratio (conductive fiber / binder) of the binder and the conductive fiber in one region of the transparent conductive film is a region of the transparent conductive film. The method for manufacturing a wiring structure according to claim 9 , comprising differentiating an exposure amount between the transparent conductive film and another region of the transparent conductive film.

A transparent substrate;
A plurality of first transparent conductive patterns formed on the transparent substrate, including a binder and conductive fibers, and extending in a first direction;
First peripheral wiring in electrical contact with an end of the first transparent conductive pattern;
A plurality of second transparent conductive patterns formed on the transparent substrate, including a binder and conductive fibers, and extending in a second direction orthogonal to the first direction;
A second peripheral wiring in electrical contact with an end of the second transparent conductive pattern;
One region of the first transparent conductive pattern in contact with the first peripheral wiring reduces the contact resistance with the first peripheral wiring, so that one region of the first transparent conductive pattern is the first transparent conductive pattern. Compared to other regions of the conductive pattern, the weight ratio of the binder and the conductive fiber (conductive fiber / binder) is large,
One region of the second transparent conductive pattern in contact with the second peripheral wiring reduces the contact resistance with the second peripheral wiring, so that one region of the second transparent conductive pattern is the second transparent conductive pattern. A touch panel in which the weight ratio of the binder and the conductive fiber (conductive fiber / binder) is large compared to other regions of the conductive pattern.

A transparent substrate;
Formed on the transparent substrate, comprising a binder and a conductive fiber, a plurality of first transparent conductive patterns extending in a first direction, the first transparent conductive pattern and a plurality of first sensing unit, a plurality of A first connection unit that electrically connects the first sensing units;
Formed on the transparent substrate, comprising a binder and a conductive fiber, a plurality of second transparent conductive patterns extending in a second direction perpendicular to the first direction, the second transparent conductive patterns of the plurality first 2 sensing parts and a second connection part formed on an insulating film formed on the first connection part and electrically connecting the plurality of second sensing parts,
In order to reduce the contact resistance between the second sensing part and the second connection part, the contact area between the second sensing part and the second connection part is compared with the other areas in the second sensing part. A touch panel having a large weight ratio (conductive fiber / binder) between the binder and the conductive fiber.