JP2013073475A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013073475A5 JP2013073475A5 JP2011212934A JP2011212934A JP2013073475A5 JP 2013073475 A5 JP2013073475 A5 JP 2013073475A5 JP 2011212934 A JP2011212934 A JP 2011212934A JP 2011212934 A JP2011212934 A JP 2011212934A JP 2013073475 A5 JP2013073475 A5 JP 2013073475A5
- Authority
- JP
- Japan
- Prior art keywords
- binder
- transparent conductive
- region
- conductive
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Claims (13)
前記配線構造体は、
バインダーと導電性繊維とを含む透明導電膜と、
前記透明導電膜の一の領域と電気的に接触する導体膜と、を含み、
前記透明導電膜の一の領域は、前記透明導電膜の他の領域と比較して、前記バインダーと前記導電性繊維との重量比率(導電性繊維/バインダー)が大きい配線構造体。 A wiring structure formed on a substrate,
The wiring structure is
A transparent conductive film containing a binder and conductive fibers;
A conductor film in electrical contact with one region of the transparent conductive film,
One region of the transparent conductive film is a wiring structure in which a weight ratio (conductive fiber / binder) between the binder and the conductive fiber is larger than that of the other region of the transparent conductive film.
基板上に導体膜を形成する工程と、
前記導体膜と一の領域が電気的に接触する、バインダーと導電性繊維とを含む透明導電膜を形成する工程と、
前記透明導電膜の一の領域と前記導体膜とのコンタクト抵抗を低減するため、前記透明導電膜の他の領域と比較して、前記透明導電膜の一の領域の前記バインダーと前記導電性繊維との重量比率(導電性繊維/バインダー)を大きくする工程と、
を有する配線構造体の製造方法。 A method of manufacturing a wiring structure,
Forming a conductor film on the substrate;
Forming a transparent conductive film containing a binder and conductive fibers, wherein the conductive film and one region are in electrical contact;
In order to reduce contact resistance between one region of the transparent conductive film and the conductive film, the binder and the conductive fiber in one region of the transparent conductive film are compared with other regions of the transparent conductive film. And increasing the weight ratio (conductive fiber / binder),
Manufacturing method of wiring structure having
前記透明基板上に形成され、バインダーと導電性繊維とを含み、第1方向に延びる複数の第1透明導電パターンと、
前記第1透明導電パターンの端部と電気的に接触する第1周辺配線と、
前記透明基板上に形成され、バインダーと導電性繊維とを含み、前記第1方向と直交する第2方向に延びる複数の第2透明導電パターンと、
前記第2透明導電パターンの端部と電気的に接触する第2周辺配線と、
前記第1周辺配線と接触する前記第1透明導電パターンの一の領域は、前記第1周辺配線とのコンタクト抵抗を低減するため、前記第1透明導電パターンの一の領域は、前記第1透明導電パターンの他の領域と比較して、前記バインダーと前記導電性繊維との重量比率(導電性繊維/バインダー)が大きく、
前記第2周辺配線と接触する前記第2透明導電パターンの一の領域は、前記第2周辺配線とのコンタクト抵抗を低減するため、前記第2透明導電パターンの一の領域は、前記第2透明導電パターンの他の領域と比較して、前記バインダーと前記導電性繊維との重量比率(導電性繊維/バインダー)が大きいタッチパネル。 A transparent substrate;
A plurality of first transparent conductive patterns formed on the transparent substrate, including a binder and conductive fibers, and extending in a first direction;
First peripheral wiring in electrical contact with an end of the first transparent conductive pattern;
A plurality of second transparent conductive patterns formed on the transparent substrate, including a binder and conductive fibers, and extending in a second direction orthogonal to the first direction;
A second peripheral wiring in electrical contact with an end of the second transparent conductive pattern;
One region of the first transparent conductive pattern in contact with the first peripheral wiring reduces the contact resistance with the first peripheral wiring, so that one region of the first transparent conductive pattern is the first transparent conductive pattern. Compared to other regions of the conductive pattern, the weight ratio of the binder and the conductive fiber (conductive fiber / binder) is large,
One region of the second transparent conductive pattern in contact with the second peripheral wiring reduces the contact resistance with the second peripheral wiring, so that one region of the second transparent conductive pattern is the second transparent conductive pattern. A touch panel in which the weight ratio of the binder and the conductive fiber (conductive fiber / binder) is large compared to other regions of the conductive pattern.
前記透明基板上に形成され、バインダーと導電性繊維とを含み、第1方向に延びる複数の第1透明導電パターンであって、該第1透明導電パターンは複数の第1感知部と、複数の前記第1感知部の間を電気的に接続する第1接続部とから構成され、
前記透明基板上に形成され、バインダーと導電性繊維とを含み、前記第1方向と直交する第2方向に延びる複数の第2透明導電パターンであって、該第2透明導電パターンは複数の第2感知部と、前記第1接続部上に形成された絶縁膜上に形成され、複数の前記第2感知部の間を電気的に接続する第2接続部とから構成され、
前記第2感知部と第2接続部とのコンタクト抵抗を低減するため、前記第2感知部と第2接続部との接触領域は、前記第2感知部における他の領域と比較して、前記バインダーと前記導電性繊維との重量比率(導電性繊維/バインダー)が大きいタッチパネル。 A transparent substrate;
Formed on the transparent substrate, comprising a binder and a conductive fiber, a plurality of first transparent conductive patterns extending in a first direction, the first transparent conductive pattern and a plurality of first sensing unit, a plurality of A first connection unit that electrically connects the first sensing units;
Formed on the transparent substrate, comprising a binder and a conductive fiber, a plurality of second transparent conductive patterns extending in a second direction perpendicular to the first direction, the second transparent conductive patterns of the plurality first 2 sensing parts and a second connection part formed on an insulating film formed on the first connection part and electrically connecting the plurality of second sensing parts,
In order to reduce the contact resistance between the second sensing part and the second connection part, the contact area between the second sensing part and the second connection part is compared with the other areas in the second sensing part. A touch panel having a large weight ratio (conductive fiber / binder) between the binder and the conductive fiber.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011212934A JP5750017B2 (en) | 2011-09-28 | 2011-09-28 | Wiring structure, manufacturing method of wiring structure, and touch panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011212934A JP5750017B2 (en) | 2011-09-28 | 2011-09-28 | Wiring structure, manufacturing method of wiring structure, and touch panel |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013073475A JP2013073475A (en) | 2013-04-22 |
JP2013073475A5 true JP2013073475A5 (en) | 2014-07-24 |
JP5750017B2 JP5750017B2 (en) | 2015-07-15 |
Family
ID=48477914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011212934A Active JP5750017B2 (en) | 2011-09-28 | 2011-09-28 | Wiring structure, manufacturing method of wiring structure, and touch panel |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5750017B2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5803825B2 (en) * | 2012-06-28 | 2015-11-04 | 日立化成株式会社 | Capacitive coupling type touch panel and manufacturing method thereof |
JP6563811B2 (en) * | 2013-08-22 | 2019-08-21 | 昭和電工株式会社 | Transparent electrode and manufacturing method thereof |
JP6177072B2 (en) * | 2013-09-25 | 2017-08-09 | グンゼ株式会社 | Manufacturing method of touch panel |
KR102207143B1 (en) * | 2013-11-06 | 2021-01-25 | 삼성디스플레이 주식회사 | Touch panel and manufacturing method thereof |
KR102303069B1 (en) * | 2014-02-20 | 2021-09-17 | 엘지이노텍 주식회사 | Touch window |
CN105448423B (en) * | 2014-06-12 | 2018-06-22 | 宸鸿科技(厦门)有限公司 | The production method of conductive film and the production method of touch panel and touch panel |
WO2016113980A1 (en) * | 2015-01-16 | 2016-07-21 | アルプス電気株式会社 | Capacitive sensor |
DE102015115004A1 (en) * | 2015-09-07 | 2017-03-09 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Process for producing structured surfaces |
CN114385020B (en) * | 2020-10-21 | 2024-04-19 | 宸美(厦门)光电有限公司 | Touch panel and touch device |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5289859B2 (en) * | 2008-08-13 | 2013-09-11 | 日本写真印刷株式会社 | Method for manufacturing conductive pattern covering and conductive pattern covering |
JP5730240B2 (en) * | 2011-04-25 | 2015-06-03 | 信越ポリマー株式会社 | Capacitance sensor sheet manufacturing method and capacitance sensor sheet |
-
2011
- 2011-09-28 JP JP2011212934A patent/JP5750017B2/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2013073475A5 (en) | ||
US11449181B2 (en) | Electrically conductive articles | |
JP6856793B2 (en) | Touch panel and touch panel manufacturing method | |
KR200479189Y1 (en) | Touch screen and manufacturing method of the same | |
TWI509477B (en) | Touch panel and method for manufacturing the same | |
CN105324820B (en) | Conductive film and touch tablet including conductive film | |
CN102819367B (en) | Manufacturing method of touch panel | |
CN104951155B (en) | Capacitive touch device and preparation method thereof | |
JP2014519115A (en) | Capacitive touch panel and manufacturing method thereof | |
KR101199155B1 (en) | Touch panel and method for manufacturing the same | |
CN104854542B (en) | Conducting film, manufacture the method for the conducting film and the display device comprising the conducting film | |
JP5838131B2 (en) | Method for manufacturing a touch-on-lens device | |
KR101521694B1 (en) | flexible/stretchable transparent film having conductivity and manufacturing method thereof | |
KR20140055684A (en) | Touch screen panel and method for manufacturing the same | |
TWI626567B (en) | Touch panel and manufacturing method thereof | |
TWI497392B (en) | Bypass structure of conductive grid and preparation method thereof | |
KR20130047018A (en) | Touch panel having multi-layer metal line and method of manufacturing the same | |
CN104850252A (en) | Touch panel and manufacturing method thereof | |
TWI465993B (en) | Touch sensing structure and manufacturing method thereof | |
JP2015507231A5 (en) | ||
TWI479387B (en) | The structure of touch device and the methods for forming the same | |
KR20130107236A (en) | Conductive film of a touch panel and manufacturing method thereof | |
KR101969355B1 (en) | Touch screen device using graphene | |
CN103870043B (en) | touch electrode structure and its manufacturing process | |
CN102695405A (en) | Wafer level electromagnetic protection structure and manufacturing method thereof |