JP2013073448A - Module built-in card and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a module built-in card capable of minimizing the waste of a material by effectively using the material, and a method for manufacturing the same.SOLUTION: A module built-in card 10 according to the present invention includes: a core member 11, a module 12 disposed inside the core member 11; and a pair of surface base materials 13 and 14 for clamping the core member 11 and the modules 12. The core member 11 has an opening 11a for disposing the module 12 in the inside thereof. The core member 11 is divided at a part along the opening 11a to be composed of a first member 17 and a second member 18, and the first member 17 and the second member 18 are engaged with each other.

Description

 The present invention relates to a module built-in card that incorporates a module having an electric circuit and is used as an OTP (One Time Password) card or the like.

A module built-in card such as an OTP card is generally configured by a core member, a module built inside the core member, and a pair of base members sandwiching the core member and the module.
Conventionally, a core member consists of one member, and an opening for arranging a module is provided inside thereof. This opening was formed by punching the inner part of the core member when punching a plate-like, film-like or sheet-like base material to form a core member of a predetermined shape (for example, Patent Documents) 1).

JP 2002-269521 A

 However, when the inner portion of the core member is punched to form the opening, the punched portion is merely discarded as an unnecessary portion, which causes a problem that a large amount of material is wasted.

 The present invention has been made in view of the above circumstances, and an object thereof is to provide a module built-in card capable of effectively using materials and minimizing waste of materials, and a manufacturing method thereof. To do.

 The module built-in card of the present invention is a module built-in card comprising a core member, a module disposed inside the core member, and a pair of surface base materials sandwiching the core member and the module, The core member is provided with an opening for arranging the module inside, and the core member is formed of a member divided into two or more at a portion along the opening, and these members are mutually connected. It is characterized by being engaged.

 A method of manufacturing a module built-in card according to the present invention includes a core member, a module disposed inside the core member, and a pair of surface base materials that sandwich the core member and the module, and the core member includes Is provided with an opening for arranging the module inside. The core member is a member divided into two or more at a portion along the opening, and each member is a method of manufacturing a module built-in card which is engaged with each other. A step A in which a plurality of members are collectively produced by punching, a step B in which two or more members constituting the core member are engaged with each other to form the core member, and the pair of members Step C of disposing the core member on one of the surface base materials, disposing the module in the opening of the core member, and placing the pair of surfaces on a surface opposite to the disposition surface of the core member and the module Forming the plurality of members in a lump so that a plurality of members having the same shape can be obtained in a close-packed state in the step A. It is characterized by .

 According to the card with a built-in module of the present invention, since the core member is divided into two or more members, a plurality of the respective members can be produced together. Waste can be minimized.

 According to the method for manufacturing a module built-in card of the present invention, two or more members constituting the core member are each manufactured by punching so that the same member is arranged in the closest state. Effective use of materials can minimize material waste.

It is the schematic which shows one Embodiment of the module built-in card | curd of this invention, (a) is a top view, (b) is the side view seen from the A direction of (a), (c) is the B direction of (a). It is the side view seen from. It is a schematic plan view which shows one Embodiment of the manufacturing method of the module built-in card | curd of this invention. It is a schematic plan view which shows one Embodiment of the manufacturing method of the module built-in card | curd of this invention. It is a schematic plan view which shows one Embodiment of the manufacturing method of the module built-in card | curd of this invention.

Embodiments of a module built-in card and a method for manufacturing the same according to the present invention will be described.
Note that this embodiment is specifically described in order to better understand the gist of the invention, and does not limit the present invention unless otherwise specified.

Module built-in card
1A and 1B are schematic views showing an embodiment of a module built-in card according to the present invention, in which FIG. 1A is a plan view, FIG. 1B is a side view seen from the direction A in FIG. It is the side view seen from the B direction.
The module built-in card 10 according to the present embodiment is schematically configured by a core member 11, a module 12 disposed inside the core member 11, and a pair of surface base materials 13 and 14 sandwiching the core member 11 and the module 12. ing.

 The phrase “the module 12 is disposed inside the core member 11” means that the module 12 is disposed in the opening 11a formed on the inside (center portion) of the core member 11.

The surface base material 13 is provided so as to cover the one surface 11 b of the core member 11 and the one surface 12 a of the module 12 through the adhesive layer 15.
On the other hand, the surface base material 14 is provided so as to cover the other surface 11 c of the core member 11 and the other surface 12 b of the module 12 via the adhesive layer 16.

The core member 11 includes a first member 17 and a second member 18, and the first member 17 and the second member 18 are divided at the peripheral edge of the opening 11a, and are engaged with each other at the divided portions. ing.
That is, the first member 17 is provided with the engagement concave portions 17a and 17b in the portion forming the peripheral portion of the opening portion 11a, and the second member 18 is provided with the engagement convex portion 18a in the portion forming the peripheral portion of the opening portion 11a. , 18b are provided, and the engagement concave portions 17a, 17b and the engagement convex portions 18a, 18b are engaged, whereby the first member 17 and the second member 18 are engaged to form the core member 11. ing.

 Note that the shapes of the engaging portions 17a, 17b, 18a, and 18b provided on the first member 17 and the second member 18 are not particularly limited, and may be engaged with each other such as an uneven shape or a V shape (triangular shape). Any shape is possible as long as it is possible.

 The core member 11 includes at least a woven fabric made of inorganic fibers such as glass fibers and alumina fibers, non-woven fabric, mat, paper, or a combination thereof; at least a surface layer portion; woven fabric made of organic fibers such as polyester fibers and polyamide fibers. Cloth, non-woven fabric, mat, paper, etc., or a combination thereof; a composite base material formed by impregnating a resin varnish into a woven fabric, non-woven fabric, mat, paper, etc. made of organic fibers such as polyester fiber and polyamide fiber; Resin substrate, polyester resin substrate, polyolefin resin substrate, polyimide resin substrate, ethylene-vinyl alcohol copolymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride Resin base material, polystyrene resin base material, polycarbonate resin base material, acrylic resin base Plastic base materials such as nitrile butadiene styrene copolymer resin base materials and polyethersulfone resin base materials; polyamide resin base materials, polyester resin base materials, polyolefin resin base materials, polyimide resin base materials, ethylene-vinyl Alcohol copolymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene styrene copolymer resin group Surface treatments such as matte treatment, corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, flame plasma treatment, ozone treatment, or various easy adhesion treatments on plastic materials such as materials and polyethersulfone resin substrates , Foamed PET (polyethylene terf Selected and used from the rate (PET) sheets extrusion foaming the resin) it is known, such as those.

 Examples of the module 12 include modules having various electric circuits. For example, a module having a display element and a contact type IC chip, an RFID module having an antenna and a non-contact type IC chip connected to each other, a battery, a diode, a control device, etc. Module.

Examples of the display element include an electrophoretic display, a liquid crystal display element, and an organic electroluminescence element (organic EL element).
As the contact type IC chip, a metal terminal is exposed on the surface, and an information writing / reading device is brought into contact with the metal terminal to read / write information.

 When the module 12 is a module for RFID use, the antenna is formed by a printing method such as screen printing or ink jet printing in a predetermined pattern using polymer type conductive ink, or the conductive foil is etched. It is made by metal plating.

 When the module 12 is a module for RFID, the IC chip is not particularly limited, and information can be written and read out in a non-contact state via the antenna, and a non-contact type IC tag or a non-contact type can be used. Any type of label can be used as long as it is applicable to RFID media such as a type IC label or a non-contact type IC card.

 As the surface base materials 13 and 14, base materials made of a polyester resin such as polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN); polyethylene (PE ), A substrate made of a polyolefin resin such as polypropylene (PP); a substrate made of a polyfluorinated ethylene resin such as polyvinyl fluoride, polyvinylidene fluoride, or polytetrafluoroethylene; a polyamide such as nylon 6, nylon 6, 6 or the like Base material made of resin; base material made of vinyl polymer such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, vinylon; polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, Po Base material made of acrylic resin such as butyl acrylate; Base material made of polystyrene; Base material made of polycarbonate (PC); Base material made of polyarylate; Base material made of polyimide; Fine paper, thin paper, glassine paper, sulfuric acid A substrate made of paper such as paper is used.

As the adhesive forming the adhesive layers 15 and 16, an adhesive that is liquid before use and is cured by applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation is used. Examples of such an adhesive include thermosetting resins, ultraviolet curable resins, and electron beam curable resins. A two-component curable adhesive that cures by the reaction between the main agent and the curing agent without applying external conditions is also used.
Examples of the thermosetting resin include phenol resin, epoxy resin, polyurethane curable resin, urea resin, melamine resin, acrylic reaction resin, and a mixture of epoxy resin and amine.

Examples of the ultraviolet curable resin include an ultraviolet curable acrylic resin, an ultraviolet curable urethane acrylate resin, an ultraviolet curable polyester acrylate resin, an ultraviolet curable polyurethane resin, an ultraviolet curable epoxy acrylate resin, and an ultraviolet curable imide acrylate resin. .
Electron beam curable resins include electron beam curable acrylic resins, electron beam curable urethane acrylate resins, electron beam curable polyester acrylate resins, electron beam curable polyurethane resins, electron beam curable epoxy acrylate resins, and cationic curable resins. Etc.
Examples of the two-component curable adhesive include a mixture of polyester resin and polyisocyanate prepolymer, a mixture of polyester polyol and polyisocyanate, a mixture of urethane and polyisocyanate, and the like.

 As a specific example of such an adhesive, a two-component mixture comprising a main agent (trade name: Aronmighty AP-317A, manufactured by Toagosei Co., Ltd.) and a curing agent (trade name: Aronmighty AP-317B, manufactured by Toagosei Co., Ltd.). Type epoxy adhesive, main component (trade name: MLT2900, manufactured by Etec) and two-component mixed urethane adhesive composed of a curing agent (trade name: G3021-B174, manufactured by Etec).

 Further, the adhesive forming the adhesive layers 15 and 16 may contain a colorant such as a known inorganic pigment, organic pigment, or dye, if necessary. With this colorant, the adhesive layers 15 and 16 can be colored in an arbitrary color.

 According to the module built-in card 10, since the core member 11 is divided into the first member 17 and the second member 18, a plurality of the first members 17 and the second members 18 can be produced together. Can be effectively utilized to minimize material waste.

 In addition, in this embodiment, although the case where the core member 11 was comprised from the 1st member 17 and the 2nd member 18 was illustrated, the module built-in card | curd of this invention is not limited to this. In the module built-in card of the present invention, the core member may be composed of three or more members.

"Manufacturing method of module built-in card"
Next, a method for manufacturing the module built-in card 10 will be described.
First, a plurality of first members 17 and second members 18 constituting the core member 11 are collectively produced by punching (step A).

In Step A, a method for producing the first member 17 will be described.
As shown in FIG. 2, the base member (the base member forming the core member 11 described above) is formed so that one first member 17A and the other first member 17B are arranged in a close-packed state. The first member 17A and the first member 17B are collectively formed.
The state in which the first member 17A and the first member 17B are arranged in a close-packed manner is, for example, the outer shape of the second member 17B in the recess 17c that forms part of the opening 11a of the core member 11 of the first member 17A. A portion 17d forming a part of the first member 17A is disposed in a concave portion 17c forming a part of the opening 11a of the core member 11 in the second member 17B. Say the state.

In Step A, a method for producing the second member 18 will be described.
As shown in FIG. 3, the second member 18A, the second member 18B, the second member 18C, and the second member 18D are arranged so as to be in a close-packed state. The second member 18A, the second member 18B, the second member 18C, and the second member 18D are collectively formed by punching the base material forming the core member 11.
The state in which the second member 18A, the second member 18B, the second member 18C, and the second member 18D are arranged in a close-packed state is, for example, the second member 18B is arranged along the outer edge of the second member 18A, The second member 18C is arranged along the outer edge of the two member 18B, and the second member 18D is arranged along the outer edge of the second member 18CB.

 Next, as shown in FIG. 4, the engagement protrusions 18 a and 18 b of the second member 18 are engaged with the engagement recesses 17 a and 17 b of the first member 17 to form the core member 11 (step B). .

 Next, the core member 11 is disposed on the surface base material 14 via the adhesive layer 16 (step C).

Next, after disposing the module 12 in the opening 11a of the core member 11, the core member 11 and the module 12 are covered with the surface base material 13 via the adhesive layer 15, and pressure is applied. Surface base materials 13 and 14 are laminated on both surfaces of the module 12 (step D) to obtain the module built-in card 10.
Thereafter, in order to align the side surfaces of the surface base materials 13 and 14 and the core member 11, if necessary, a punching process is performed to cut out the periphery of the surface base materials 13 and 14 and the core member 11 by several millimeters so as to form a card shape. You may give it.

 According to the method for manufacturing a module built-in card of the present embodiment, the first member 17 and the second member 18 constituting the core member 11 are each punched out so that the same member is in the most closely arranged state. Since a plurality of pieces are produced collectively, waste of materials can be minimized by effectively using the materials.

 In addition, in this embodiment, although the case where the core member 11 was comprised from the 1st member 17 and the 2nd member 18 was illustrated, the manufacturing method of the module built-in card | curd of this invention is not limited to this. In the method for manufacturing a module built-in card of the present invention, the core member may be composed of three or more members.

Moreover, in the manufacturing method of the module built-in card according to the present embodiment, in the production of the first member 17, the first member 17A and the first member 17B are arranged in a close-packed state, and the core in the first member 17A. A portion 17d that forms a part of the outline of the second member 17B is disposed in a recess 17c that forms a part of the opening 11a of the member 11, while a part of the opening 11a of the core member 11 in the second member 17B. Although the portion 17d that forms part of the outline of the first member 17A is disposed in the concave portion 17c that forms the above, the method for manufacturing the module built-in card of the present invention is not limited to this. Further, in the production of the second member 18, the second member 18A, the second member 18B, the second member 18C, and the second member 18D are arranged in a close-packed state along the outer edge of the second member 18A. Although the member 18B is disposed, the second member 18C is disposed along the outer edge of the second member 18B, and the second member 18D is disposed along the outer edge of the second member 18CB, the module of the present invention is illustrated. The method for manufacturing the built-in card is not limited to this.
In the method for manufacturing a module built-in card according to the present invention, any arrangement may be employed as long as two or more members constituting the core member are arranged in a close-packed manner.

DESCRIPTION OF SYMBOLS 10 ... Module built-in card, 11 ... Core member, 12 ... Module, 13, 14 ... Surface base material, 15, 16 ... Adhesive layer, 17 ... First member, 18. ..Second member.

Claims (2)

A module built-in card comprising a core member, a module disposed inside the core member, and a pair of surface base materials sandwiching the core member and the module,
The core member is provided with an opening for arranging the module inside,
The module built-in card according to claim 1, wherein the core member includes a member divided into two or more at a portion along the opening, and these members are engaged with each other. A core member, a module disposed inside the core member, and a pair of surface base materials sandwiching the core member and the module, the core member including the module disposed inside An opening is provided. The core member comprises a member divided into two or more at a portion along the opening, and each member is a method of manufacturing a module built-in card engaged with each other,
Step A for producing a plurality of two or more members constituting the core member together by punching, and
A step B in which two or more members constituting the core member are engaged with each other to form the core member;
Step C of disposing the core member on one of the pair of surface base materials,
Arranging the module in the opening of the core member, and laminating the other of the pair of surface base materials on the surface opposite to the arrangement surface of the core member and the module,
In the step A, the plurality of members are collectively formed so that a plurality of members having the same shape are arranged in a close-packed state.

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