JP6175316B2 - Information display medium and manufacturing method thereof - Google Patents

Description

 The present invention relates to an information display medium and a manufacturing method thereof.

In recent years, with the progress of the information-oriented society, information is recorded on a card, and information management and settlement using the card are performed.
Cards used for such information management and settlement include IC-type information display media such as IC cards with built-in IC chips and magnetic cards on which information is written by magnetism.

As an information display medium, an electronic component structure in which a display panel or a semiconductor component is mounted on the same surface, an upper cover provided with a spacer to compensate for unevenness of the electronic component, and a lower cover are bonded with an adhesive. Is known (see, for example, Patent Document 1).
In such an information display medium, the display transparent portion and the display panel are bonded by a heating and pressing method through an insulating adhesive applied smoothly.

JP-A-62-179995

Conventionally, since the display transparent portion and the display panel are joined by a heating and pressurizing method, the display panel may be deteriorated when the display panel is electrophoretic electronic paper or the like that is weak against heat.
In addition, since the display panel and the semiconductor component are disposed in the same plane of the electronic component structure, the display area of the display panel is limited. When enlarging the display area of a display panel, it is calculated | required that the thickness of an insulating adhesive is uniform from a viewpoint of preventing that visibility falls. However, in the method of Patent Document 1, even when the entire lower cover is pressed and bonded, the insulating adhesive has fluidity. Therefore, the pressure varies in the surface direction of the lower cover during pressing, and the insulating adhesive is used. In some cases, the thickness was not uniform. For this reason, when the display area of the display panel is enlarged, the visibility of the display panel may be reduced.

 The present invention has been made in view of the above circumstances, and provides an information display medium that can increase the display area of the display element and that does not reduce the visibility of the display element, and a method for manufacturing the information display medium. For the purpose.

 An information display medium of the present invention includes an electronic circuit board, an electronic component disposed on one surface of the electronic circuit board, and a module including a display element disposed on the other surface of the electronic circuit board. A frame material having a first through hole having a shape corresponding to the outer shape of the module, a cushioning material having a second through hole having a shape corresponding to the electronic component, and a resin layer covering the module A pair of base materials sandwiching the module via the frame material, and the module is configured so that the display element faces the base material on the display surface side of the pair of base materials, In the first through hole, the cushioning material is disposed on a surface side of the module where the electronic component is provided, and is inscribed in the frame material. Inserted into the through hole And wherein the are.

 An information display medium manufacturing method of the present invention includes an electronic circuit board, an electronic component disposed on one surface of the electronic circuit board, and a display element disposed on the other surface of the electronic circuit board. A module having a first through hole having a shape corresponding to the outer shape of the module, a cushioning material having a second through hole having a shape corresponding to the electronic component, and covering the module A method for manufacturing an information display medium, comprising: a resin layer made of resin; and a pair of base materials that sandwich the module via the frame material, and is a display surface side of the pair of base materials. A step of applying the resin to a base material and disposing the frame material on the base material on the display surface side via the resin; and a base on the display surface side in the first through hole. So that the display element faces the material, The step of installing the module, and arranging the buffer material on the surface side of the module where the electronic component is provided, and installing the buffer material in the first through hole of the frame material, Inserting the electronic component into the second through-hole, applying the resin onto the module and the cushioning material, and forming the pair of base materials on the frame material via the resin. A step of disposing a base material on the side opposite to the display surface, and a step of pressing the laminated body including the pair of base materials, the frame material, the module, the cushioning material, and the resin in the thickness direction. It is characterized by having.

 ADVANTAGE OF THE INVENTION According to this invention, while being able to enlarge the display area of a display element, the information display medium which does not fall the visibility of a display element, and its manufacturing method can be provided.

It is a schematic view showing an embodiment of an information display medium of the present invention, (a) is a plan view, (b) _{A 1 -B 1 -C 1 -D 1} -E 1 -F 1 of (a) - is a sectional view taken along the G ₁ -H ₁ line. Is a schematic diagram illustrating one embodiment of a module constituting the information display medium of the present invention, (a) is a plan view, (b) _{A 2 -B 2 -C 2 -D 2} -E 2 of (a) is a sectional view taken along -F ₂ -G ₂ -H _2-wire. Is a schematic view showing an embodiment of a cushioning material forming the information display medium of the present invention, (a) is a plan view, (b) _{A 3 -B 3 -C 3 -D 3} -E in (a) ₃ is a sectional view taken along -F ₃ -G ₃ -H _3-wire. It is the schematic which shows one Embodiment of the manufacturing method of the information display medium of this invention, (a) is a top view, (b) is sectional drawing which follows the II line | wire of (a). It is the schematic which shows one Embodiment of the manufacturing method of the information display medium of this invention, (a) is a top view, (b) is sectional drawing which follows the JJ line | wire of (a). It is a schematic diagram illustrating an embodiment of a method of manufacturing an information displaying medium of the present invention, (a) is a plan view, (b) the _{A 4 -B 4 -C 4 -D 4} -E 4 in (a) - is a sectional view taken along F ₄ -G ₄ -H _4-wire. It is a schematic diagram illustrating an embodiment of a method of manufacturing an information displaying medium of the present invention, (a) is a plan view, (b) the _{A 5 -B 5 -C 5 -D 5} -E 5 of (a) - is a sectional view taken along F ₅ -G ₅ -H _5-wire. It is a schematic diagram illustrating an embodiment of a method of manufacturing an information displaying medium of the present invention, (a) is a plan view, (b) the _{A 6 -B 6 -C 6 -D 6} -E 6 of (a) - is a sectional view taken along F ₆ -G ₆ -H ₆ line. It is a schematic diagram illustrating an embodiment of a method of manufacturing an information displaying medium of the present invention, (a) is a plan view, (b) _A 7 of _{(a) -B 7 -C 7 -D} 7 -E 7 - is a sectional view taken along F ₇ -G ₇ -H ₇ line. It is a schematic diagram illustrating an embodiment of a method of manufacturing an information displaying medium of the present invention, (a) is a plan view, (b) is _{A 8 -B 8 -C 8 -D 8} -E 8 of (a) - it is a sectional view taken along F ₈ -G ₈ -H ₈ lines. It is a schematic diagram illustrating an embodiment of a method of manufacturing an information displaying medium of the present invention, (a) is a plan view, (b) _A 9 is a _{(a) -B 9 -C 9 -D} 9 -E 9 - is a sectional view taken along F ₉ -G ₉ -H _9-wire.

Embodiments of an information display medium and a manufacturing method thereof according to the present invention will be described.
Note that this embodiment is specifically described in order to better understand the gist of the invention, and does not limit the present invention unless otherwise specified.

"Information display medium"
FIG. 1 is a schematic view showing an embodiment of an information display medium of the present invention, where (a) is a plan view and (b) is A ₁ -B ₁ -C ₁ -D ₁ -E ₁ of (a). is a sectional view taken along -F ₁ -G ₁ -H ₁ line. FIG. 2 is a schematic view showing one embodiment of a module constituting the information display medium of the present invention, where (a) is a plan view and (b) is A ₂ -B ₂ -C ₂ -D of (a). is a sectional view taken along the _{2 -E 2 -F 2 -G 2 -H} 2 -wire. FIG. 3 is a schematic view showing an embodiment of the cushioning material constituting the information display medium of the present invention, where (a) is a plan view and (b) is A ₃ -B ₃ -C _3- of (a). D ₃ is a sectional view taken along -E ₃ -F ₃ -G ₃ -H _3-wire.
The information display medium 10 of the present embodiment has a module 20, a frame material 30 having a shape corresponding to the outer shape of the module 20, and a first through hole 31 penetrating in the thickness direction, and an electronic device constituting the module 20. The module 20 is formed through a cushioning material 40 having a shape corresponding to the component 22 and the like and having a second through-hole 42 penetrating in the thickness direction, a resin layer 50 covering the module 20, and the frame material 30. A pair of base materials 61 and 62 (hereinafter, the pair of base materials 61 and 62 may be referred to as a “first base material 61 and a second base material 62”, respectively) are generally configured. . The information display medium 10 has a rectangular shape in plan view.

The module 20 includes an electronic circuit board 21 in which electronic circuits (not shown) are provided on both surfaces (one surface 21a and the other surface 21b), and an electronic component 22 disposed on one surface 21a of the electronic circuit board 21. , 23, 24, and 25 and a display element 26 disposed on the other surface 21b of the electronic circuit board 21.
The electronic circuit on the electronic circuit board 21 is not particularly limited, and is appropriately selected according to the type and arrangement of the electronic components 22, 23, 24, 25.
Further, the types and arrangement of the electronic components 22, 23, 24, 25 are not particularly limited, and are appropriately selected according to the specifications of the information display medium 10.
The electronic components 22, 23, 24, 25 and the display element 26 are electrically connected by a through electrode (not shown) that penetrates the electronic circuit board 21 in the thickness direction.

 The size of the display element 26 is not particularly limited, and is appropriately selected according to the specifications of the information display medium 10. That is, the display element 26 and the other surface 21 b of the electronic circuit board 21 may be provided on almost the entire surface, or may be provided on a part of the other surface 21 b of the electronic circuit board 21.

 Although the first through hole 31 of the frame material 30 has a shape corresponding to the outer shape of the module 20, more specifically, the first through hole 31 is substantially the same as the outer shape of the electronic circuit board 21 of the module 20. It has the same shape. Thereby, when the module 20 is inserted into the first through hole 31, the electronic circuit board 21 is inscribed in the first through hole 31, and the module 20 is held in the first through hole 31. In addition, that the electronic circuit board 21 is inscribed in the first through hole 31 means that the outer side surface 21 c of the electronic circuit board 21 is in contact with the inner side surface 31 a of the first through hole 31.

The cushioning material 40 is generally configured by a cushioning material main body 41 and a plurality of second through holes 42, 43, 44, 45 that penetrate in the thickness direction of the cushioning material main body 41.
The size (the size of the cross section perpendicular to the thickness direction of the buffer material main body 41), the arrangement, and the number of the second through holes 42, 43, 44, 45 are not particularly limited, and the electronic components 22, 23 , 24, 25 are appropriately selected according to the size, arrangement, and number.
Moreover, the thickness of the buffer material 40 (buffer material main body 41) is not specifically limited, It is the thickness (height from the one surface 21a of the electronic circuit board 21) of the electronic components 22, 23, 24, and 25. It is selected as appropriate. The thickness of the cushioning material 40 (the cushioning material main body 41) is set so that the unevenness caused by the electronic components 22, 23, 24, and 25 does not occur on the outer surface of the second base material 62. 24 and 25 are accommodated in the buffer material 40, and in order to cancel the thickness of the electronic parts 22, 23, 24, 25, the largest thickness (here, the electronic parts 22, 23, 24, 25) It is necessary to make it equal to the thickness of the component 25.

 The outer shape of the buffer material 40 has a shape corresponding to the first through hole 31 of the frame material 30. Thereby, when the buffer material 40 is inserted into the first through hole 31, the buffer material 40 is inscribed in the first through hole 31, and the buffer material 40 is held in the first through hole 31. The phrase “the buffer material 40 is inscribed in the first through hole 31” means that the outer surface 41 a of the buffer material body 41 is in contact with the inner side surface 31 a of the first through hole 31.

 In the information display medium 10, the module 20 is installed in the first through hole 31 so that the first base 61 on the display surface side and the display element 26 face each other. Specifically, the display surface of the display element 26 of the module 20 is bonded to one surface 61 a of the first base member 61 via a resin (not shown) constituting the resin layer 50. Thereby, the display surface of the display element 26 is arranged in parallel with the one surface 61 a of the first base member 61.

 The buffer material 40 is disposed on the surface side of the module 20 where the electronic components 22, 23, 24, 25 are provided, that is, on the one surface 21 a side of the electronic circuit board 21, and One through hole 31 is provided inside. As a result, the electronic components 22, 23, 24, 25 are inserted into the second through holes 42, 43, 44, 45. Specifically, the electronic component 22 is inserted into the second through hole 42 and disposed in the second through hole 42, and the electronic component 23 is inserted into the second through hole 43, and the second through hole 43, the electronic component 24 is inserted into the second through hole 44, and is disposed within the second through hole 44, and the electronic component 25 is inserted into the second through hole 45, and the second It is disposed in the through hole 45.

 A resin layer 50 (50A) is formed between the first base 61, the electronic circuit board 21 and the display element 26. On the other hand, there is a resin layer 50 (between the second base 62 and the electronic components 22, 23, 24, 25 inserted in the second through holes 42, 43, 44, 45 of the buffer material 40. 50B) is formed. Thereby, the module 20 is covered with the resin layer 50 (50A, 50B).

 The buffer material 40 is bonded to one surface 62 a of the second base material 62 through a resin (not shown) constituting the resin layer 50. Furthermore, it is joined to one surface 61 a of the first base material 61 and one surface 62 a of the second base material 62 via a resin (not shown) constituting the frame material 30 and the resin layer 50.

 The material of the electronic circuit board 21 is not particularly limited, and examples thereof include polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polybutylene terephthalate (PBT), and polyethylene naphthalate (PEN). A substrate made of a polyester resin; a substrate made of a polyolefin resin such as polyethylene (PE) or polypropylene (PP); a substrate made of a polyfluorinated ethylene resin such as polyvinyl fluoride, polyvinylidene fluoride, or polytetrafluoroethylene; Substrates made of polyamide resins such as nylon 6, nylon 6,6; substrates made of vinyl polymers such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, vinylon; polymethyl methacrylate, Polymeta Base material made of acrylic resin such as ethyl laurate, polyethyl acrylate, polybutyl acrylate, etc .; base material made of polystyrene; base material made of polycarbonate (PC); base material made of polyarylate; base material made of polyimide A base material made of glass epoxy resin; a base material made of paper such as fine paper, thin paper, glassine paper, sulfate paper, and the like.

Examples of the electronic components 22, 23, 24, and 25 include an IC chip, a battery, a diode, and a control device.
Examples of the display element 26 include electronic paper, a liquid crystal display element, an organic electroluminescence element (organic EL element), and the like.

 Specific examples of the module 20 include, for example, a module including a display element 26, a non-contact type IC chip, and a control device electrically connected to the display element 26 through electrodes, and an antenna connected to each other. And an RFID application module including a non-contact type IC chip.

 When the module 20 is a module for RFID use, the antenna is formed by a printing method such as screen printing or ink jet printing in a predetermined pattern using polymer type conductive ink, or the conductive foil is etched. It is made by metal plating.

 Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.

If a thermosetting resin is used as the resin composition, the polymer conductive ink becomes a thermosetting type capable of forming a coating film forming an antenna at 200 ° C. or less, for example, about 100 to 150 ° C. The electric current path of the coating film forming the antenna is formed when the conductive fine particles forming the coating film contact each other, and the resistance value of this coating film is on the order of 10 ⁻⁵ Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photo-curing type, a permeation drying type, and a solvent volatilization type are used in addition to the thermosetting type.

 The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photocurable polymer type conductive ink include, for example, a thermoplastic resin alone, or a conductive resin fine particle in a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin made of polyester and isocyanate). 60% by mass or more and a polyester resin of 10% by mass or more, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), heat Polyester resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) is blended with 10% by mass or more of a polyester resin, that is, a crosslinked type or A cross-linking / thermoplastic combination type is preferably used.

Examples of the conductive foil forming the antenna include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Furthermore, examples of the metal plating that forms the antenna include copper plating, silver plating, gold plating, and platinum plating.

 When the module 20 is a module for RFID use, the non-contact type IC chip is not particularly limited, and information can be written and read out in a non-contact state via the antenna. Any tag can be used as long as it is applicable to RFID media such as a tag, a non-contact type IC label, or a non-contact type IC card.

 The material of the frame material 30 includes a polyamide resin substrate, a polyester resin substrate, a polyolefin resin substrate, a polyimide resin substrate, an ethylene-vinyl alcohol copolymer substrate, a polyvinyl alcohol resin substrate, a poly Plastic base materials such as vinyl chloride resin base materials, polyvinylidene chloride resin base materials, polystyrene resin base materials, polycarbonate resin base materials, acrylonitrile butadiene styrene copolymer resin base materials, polyether sulfone base resin base materials; Polyamide resin substrate, polyester resin substrate, polyolefin resin substrate, polyimide resin substrate, ethylene-vinyl alcohol copolymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, poly Vinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate Over preparative resin substrate, an acrylonitrile butadiene styrene copolymerization system resin substrate, is used to select a plastic substrate such as polyethersulfone resin substrate. The frame material 30 is preferably opaque.

 The material of the buffer material 40 is not particularly limited, but acrylic rubber, acrylonitrile butadiene rubber, isoprene rubber, urethane rubber, ethylene propylene rubber, epichlorohydrin rubber, chloroprene rubber, silicone rubber, styrene butadiene rubber, butadiene rubber, fluorine rubber, butyl rubber. Synthetic rubber (elastic rubber) selected from the above. The buffer material 40 having such a configuration can be elastically deformed, but it is particularly preferable that the buffer material 40 can be elastically deformed in the thickness direction.

 As the resin constituting the resin layer 50, a resin that is in a liquid state before use and is cured by applying external conditions such as ultraviolet irradiation and electron beam irradiation is used. Examples of such a resin include an ultraviolet curable resin and an electron beam curable resin. Further, a two-component curable resin that is cured by a reaction between the main agent and the curing agent without applying external conditions is also used.

Examples of the ultraviolet curable resin include an ultraviolet curable acrylic resin, an ultraviolet curable urethane acrylate resin, an ultraviolet curable polyester acrylate resin, an ultraviolet curable polyurethane resin, an ultraviolet curable epoxy acrylate resin, and an ultraviolet curable imide acrylate resin. .
Electron beam curable resins include electron beam curable acrylic resins, electron beam curable urethane acrylate resins, electron beam curable polyester acrylate resins, electron beam curable polyurethane resins, electron beam curable epoxy acrylate resins, and cationic curable resins. Etc.
Examples of the two-component curable resin include a mixture of a polyester resin and a polyisocyanate prepolymer, a mixture of a polyester polyol and a polyisocyanate, a mixture of a urethane and a polyisocyanate, and a mixture of an epoxy resin and an amine.

 In addition, the resin constituting the resin layer 50 may contain a colorant such as a known inorganic pigment, organic pigment, or dye as necessary. With this colorant, the resin layer 50 can also be colored in an arbitrary color within a range in which the display content on the display element 26 can be visually recognized.

As the first substrate 61, a transparent material is used so that the display content by the display element 26 can be recognized visually, and as the second substrate 62, a colored or transparent material is used.
As the first base material 61 and the second base material 62, polyester resins such as polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN) are used. Base material made of polyolefin resin such as polyethylene (PE), polypropylene (PP); Base material made of polyfluorinated ethylene resin such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene; Nylon 6, Base material made of polyamide resin such as nylon 6,6; Base material made of vinyl polymer such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, vinylon; Polymethyl methacrylate, polymethacrylic acid Ethyl, polyac Substrates made of acrylic resins such as ethyl acrylate and polybutyl acrylate; Base materials made of polystyrene; Base materials made of polycarbonate (PC); Base materials made of polyarylate; Base materials made of polyimide; Fine paper, thin paper A base material made of paper such as glassine paper or sulfuric acid paper is used.

Further, a portion other than the display portion of the display element 26 is mainly provided on a surface (hereinafter referred to as “the other surface”) 62 b opposite to the surface facing the resin layer 50 of the second base material 62. A concealment printing layer for concealing the image may be provided.
Similarly, decorative printing is mainly performed on a surface (hereinafter referred to as “the other surface”) 62b opposite to the surface facing the resin layer 50 of the first base member 61. However, a concealed print layer for concealing the inside of the information display medium 10 or a decorative print layer may be provided.

 According to the information display medium 10 of the present embodiment, as the module 20, in the electronic circuit board 21, the surface on which the electronic components 22, 23, 24, and 25 are provided (one surface 21a) and the surface on which the display element 26 is provided (the other surface). By distinguishing from the surface 21 b), the display area of the display element 26 is not limited by the presence of the electronic components 22, 23, 24, 25 on the other surface 21 b of the electronic circuit board 21. Can be expanded to a size equivalent to the area of the other surface 21b of the electronic circuit board 21. In addition, the display surface of the display element 26 of the module 20 is bonded to the one surface 61a of the first base member 61 and arranged in parallel with the one surface 61a of the first base member 61. The visibility of 26 is excellent.

 In the present embodiment, the case where the information display medium 10 has a rectangular shape in plan view is illustrated, but the present embodiment is not limited to this. In the present embodiment, the information display medium 10 may have a square shape when viewed in plan.

"Method of manufacturing information display medium"
Next, the manufacturing method of the information display medium of this embodiment will be described with reference to FIGS.
First, as shown in FIG. 4, a rectangular shape in plan view that is on the display surface side of the information display medium 10 on one surface 70 a of the metal plate 70 in which the positioning pins 71, 71 are erected at predetermined positions. The first base member 61 is fixed (step A).
In the process A, for example, the metal plate 70 is inserted into the through holes 61 a and 61 a provided on the outer edge of the first base 61 and in the vicinity of two corners on one long side of the first base 61. The first base member 61 is fixed to one surface 70 a of the metal plate 70 by inserting the positioning pins 71, 71. The alignment pins 71 and 71 are provided perpendicular to one surface 70 a of the metal plate 70.

Next, as shown in FIG. 5, after applying the resin 51 to one surface 61 a of the first substrate 61, on the first substrate 61 (on one surface 61 a of the first substrate 61). The frame material 30 that is a frame having a rectangular shape when viewed in plan is disposed through the resin 51 (step B).
In the process B, for example, the alignment pin 71 of the metal plate 70 is inserted into the through holes 30a and 30a provided on the outer edge of the frame member 30 and in the vicinity of two corners on one long side of the frame member 30. , 71 is inserted to fix the frame material 30 on one surface 61a of the first base member 61.

In the process B, as the resin 51, the same resin as that constituting the resin layer 50 is used.
In the process B, the amount of the resin 51 applied is not particularly limited, but the shape and size of the module 20 covered by the resin 51, the size and depth of the first through hole 31 of the frame material 30, and the like. It is adjusted accordingly.

Next, as shown in FIG. 6, the first base 61 (one surface 61 a of the first base 61) and the display element 26 are opposed to the first through hole 31 of the frame member 30. Module 20 is installed internally (process C).
In the process C, installing the module 20 in the first through hole 31 of the frame material 30 means disposing the module 20 in the first through hole 31. Since the first through hole 31 of the frame member 30 has a shape corresponding to the outer shape of the module 20, the first through hole 31 of the frame member 30 is provided with the module 20 to provide the first through hole 31. The module 20 is held in the through hole 31, and the module 20 is held at a predetermined position of the first base material 61.

 In Step C, the display element 26 of the module 20 is bonded to one surface 61 a of the first base member 61 through the resin 51. In addition, since the resin 51 interposed between the display element 26 and the first base material 61 is very small amount (very thin), it is omitted in FIG.

Next, as shown in FIG. 7, the cushioning material 40 is disposed on the side of the module 20 on which the electronic components 22, 23, 24, and 25 are provided (one surface 21 a of the electronic circuit board 21), and the frame material. The buffer material 40 is provided in the first through hole 31 of 30 and the electronic components 22, 23, 24, 25 are inserted into the second through holes 42, 43, 44, 45 (process D).
In the process D, providing the buffer material 40 in the first through hole 31 of the frame material 30 means arranging the buffer material 40 in the first through hole 31. In addition, since the outer shape of the buffer material 40 has a shape corresponding to the first through hole 31 of the frame material 30, by installing the buffer material 40 in the first through hole 31 of the frame material 30, The buffer material 40 is held in the first through hole 31.

Next, as shown in FIG. 8, a resin 52 is applied on the module 20 and the buffer material 40 (step E).
In step E, the resin 52 is applied so that the resin 52 also enters the second through holes 42, 43, 44, 45 of the buffer material 40.

Further, in step E, as the resin 52, the same resin as that constituting the resin layer 50 is used.
In the process E, the amount of the resin 52 applied is not particularly limited, but the shape and size of the module 20, the size and depth of the first through hole 31 of the frame material 30, and the buffer, which are covered with the resin 52. The second through-holes 42, 43, 44, 45 of the material 40 are adjusted as appropriate according to the size and depth of the second through-holes.

 Next, as illustrated in FIG. 9, the second base material 62 that is opposite to the display surface of the information display medium 10 is disposed on the frame material 30, the module 20, and the buffer material 40 via the resin 52. (Process F).

Next, as shown in FIG. 10, the laminated body including the first base material 61, the frame material 30, the module 20, the buffer material 40, the resins 51 and 52, and the second base material 62 is pressed in the thickness direction (steps). G).
In step G, the laminate is sandwiched between the metal plate 70 and the metal plate 80 from the thickness direction and pressurized. As a result, the resin 51 extends, and the resin 51 is filled between the first base member 61, the frame material 30, and the module 20. Similarly, the resin 52 extends, and the resin 52 is filled between the second base material 62, the frame material 30, the module 20, and the buffer material 40.

Next, the resins 51 and 52 are cured to form the resin layer 50 (step H).
As the resins 51 and 52, those constituting the resin layer 50 are used, and therefore, in the process H, a heating step is not required when the resins 51 and 52 are cured. Therefore, the display elements 26 of the module 20 are not deteriorated by curing the resins 51 and 52.

Next, as shown in FIG. 11, unnecessary portions of the outer edge portion of the laminate including the first base material 61, the frame material 30, the module 20, the buffer material 40, the resins 51 and 52, and the second base material 62, details For this purpose, unnecessary portions of the outer edges of the first base member 61, the frame member 30 and the second base member 62 are removed by cutting to obtain the information display medium 10 as shown in FIG. 1 (step I).
In step I, for example, unnecessary portions of the outer edge portion of the laminate are removed along the alternate long and short dash line α shown in FIG. That is, in the process I, the through holes 61a and 61a for inserting the alignment pins 71 and 71 in the first base material 61 and the through holes for inserting the alignment pins 71 and 71 in the frame material 30 are inserted. The portions corresponding to 30a and 30a are removed.

According to the method for manufacturing the information display medium of the present embodiment, the module 20 is installed in the first through hole 31 of the frame member 30 so that the first base member 61 and the display element 26 face each other. Since the module 20 is held in the first through hole 31 and the module 20 is held at a predetermined position of the first base 61, the first base 61, the frame member 30, the module 20, the buffer The thickness of the laminated body can be made uniform by the step of pressing the laminated body including the material 40, the resins 51 and 52 and the second base material 62 in the thickness direction. Further, the display element 26 of the module 20 can be disposed at a predetermined position of the first base member 61. Therefore, the information display medium 10 with excellent display element 26 visibility is obtained.
Further, according to the method for manufacturing the information display medium of the present embodiment, it is not necessary to use a heating and pressurizing step, so that the electronic components 22, 23, 24, 25 and the display element 26 of the module 20 can be prevented from being damaged. .

In addition, according to the method for manufacturing the information display medium of the present embodiment, as the resins 51 and 52, those that do not require a heating step are used for curing, so by curing the resins 51 and 52, The display element 26 of the module 20 does not deteriorate.
Furthermore, according to the method for manufacturing the information display medium of the present embodiment, the module 20 is elastically deformed on the surface (one surface 21a of the electronic circuit board 21) on which the electronic components 22, 23, 24, 25 are provided. The possible buffer material 40 is arranged, and the laminated body including the first base material 61, the frame material 30, the module 20, the buffer material 40, the resins 51 and 52, and the second base material 62 is pressed in the thickness direction. Therefore, the buffer material 40 can relieve the pressure applied to the electronic components 22, 23, 24, and 25 and prevent the electronic components 22, 23, 24, and 25 from being damaged by the pressurization.

DESCRIPTION OF SYMBOLS 10 ... Information display medium, 20 ... Module, 21 ... Electronic circuit board, 22, 23, 24, 25 ... Electronic component, 26 ... Display element, 30 ... Frame material, 31 ... 1st through-hole, 40 ... Buffer material, 41 ... Buffer material body, 42, 43, 44, 45 ... Second through-hole, 50 ... Resin layer, 51, 52 ..Resin, 61... Substrate (first substrate), 62... Substrate (second substrate).

Claims (2)

An electronic circuit board, an electronic component disposed on one surface of the electronic circuit board, and a module including a display element disposed on the other surface of the electronic circuit board;
A frame material having a first through hole having a shape corresponding to the outer shape of the module;
A cushioning material having a second through-hole having a shape corresponding to the electronic component;
A resin layer covering the module;
A pair of base materials sandwiching the module via the frame material,
The module is installed in the first through hole so that the display element and the base material on the display surface side of the pair of base materials face each other.
The cushioning material is disposed on the surface side of the module where the electronic component is provided, and is inscribed in the frame material,
The information display medium, wherein the electronic component is inserted into the second through hole. An electronic circuit board, an electronic component disposed on one surface of the electronic circuit board, and a module including a display element disposed on the other surface of the electronic circuit board;
A frame material having a first through hole having a shape corresponding to the outer shape of the module;
A cushioning material having a second through-hole having a shape corresponding to the electronic component;
A resin layer made of a resin covering the module;
A method of manufacturing an information display medium comprising a pair of base materials sandwiching the module via the frame material,
The step of applying the resin to a base material that is on the display surface side of the pair of base materials and disposing the frame material on the base material that is on the display surface side through the resin;
Installing the module in the first through hole so that the display element faces the base material on the display surface side;
The buffer material is disposed on a surface side of the module where the electronic component is provided, the buffer material is provided in the first through hole of the frame material, and the electronic device is provided in the second through hole. Inserting a part;
Applying the resin on the module and the cushioning material;
Disposing a base material on the opposite side of the display surface among the pair of base materials via the resin on the frame material;
And a step of pressing in a thickness direction a laminate including the pair of base materials, the frame material, the module, the buffer material, and the resin.

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