JP2013065682A5 - - Google Patents

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Publication number
JP2013065682A5
JP2013065682A5 JP2011203194A JP2011203194A JP2013065682A5 JP 2013065682 A5 JP2013065682 A5 JP 2013065682A5 JP 2011203194 A JP2011203194 A JP 2011203194A JP 2011203194 A JP2011203194 A JP 2011203194A JP 2013065682 A5 JP2013065682 A5 JP 2013065682A5
Authority
JP
Japan
Prior art keywords
resin
ring
base film
dicing
containing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011203194A
Other languages
English (en)
Japanese (ja)
Other versions
JP5361092B2 (ja
JP2013065682A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2011203194A external-priority patent/JP5361092B2/ja
Priority to JP2011203194A priority Critical patent/JP5361092B2/ja
Priority to KR1020147002983A priority patent/KR101941069B1/ko
Priority to PCT/JP2012/072571 priority patent/WO2013038966A1/ja
Priority to MYPI2014700556A priority patent/MY171150A/en
Priority to EP12832328.4A priority patent/EP2757576B1/en
Priority to US14/235,844 priority patent/US9546302B2/en
Priority to CN201280039191.1A priority patent/CN103733313B/zh
Priority to TW101132653A priority patent/TWI550770B/zh
Publication of JP2013065682A publication Critical patent/JP2013065682A/ja
Publication of JP2013065682A5 publication Critical patent/JP2013065682A5/ja
Publication of JP5361092B2 publication Critical patent/JP5361092B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011203194A 2011-09-16 2011-09-16 ダイシングシート用基材フィルムおよびダイシングシート Active JP5361092B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2011203194A JP5361092B2 (ja) 2011-09-16 2011-09-16 ダイシングシート用基材フィルムおよびダイシングシート
CN201280039191.1A CN103733313B (zh) 2011-09-16 2012-09-05 切割片用基材膜及切割片
PCT/JP2012/072571 WO2013038966A1 (ja) 2011-09-16 2012-09-05 ダイシングシート用基材フィルムおよびダイシングシート
MYPI2014700556A MY171150A (en) 2011-09-16 2012-09-05 Base film for dicing sheet and dicing sheet
EP12832328.4A EP2757576B1 (en) 2011-09-16 2012-09-05 Dicing sheet substrate film and dicing sheet
US14/235,844 US9546302B2 (en) 2011-09-16 2012-09-05 Base film for dicing sheet and dicing sheet
KR1020147002983A KR101941069B1 (ko) 2011-09-16 2012-09-05 다이싱 시트용 기재 필름 및 다이싱 시트
TW101132653A TWI550770B (zh) 2011-09-16 2012-09-07 A base sheet for cutting chips and a cutting sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011203194A JP5361092B2 (ja) 2011-09-16 2011-09-16 ダイシングシート用基材フィルムおよびダイシングシート

Publications (3)

Publication Number Publication Date
JP2013065682A JP2013065682A (ja) 2013-04-11
JP2013065682A5 true JP2013065682A5 (https=) 2013-09-26
JP5361092B2 JP5361092B2 (ja) 2013-12-04

Family

ID=47883197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011203194A Active JP5361092B2 (ja) 2011-09-16 2011-09-16 ダイシングシート用基材フィルムおよびダイシングシート

Country Status (8)

Country Link
US (1) US9546302B2 (https=)
EP (1) EP2757576B1 (https=)
JP (1) JP5361092B2 (https=)
KR (1) KR101941069B1 (https=)
CN (1) CN103733313B (https=)
MY (1) MY171150A (https=)
TW (1) TWI550770B (https=)
WO (1) WO2013038966A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150126009A (ko) * 2013-03-04 2015-11-10 린텍 가부시키가이샤 다이싱 시트용 기재 필름 및 해당 기재 필름을 구비한 다이싱 시트
WO2015146596A1 (ja) * 2014-03-28 2015-10-01 リンテック株式会社 ダイシングシート用基材フィルム、当該基材フィルムを備えるダイシングシート、および当該基材フィルムの製造方法
JP6500699B2 (ja) * 2015-01-22 2019-04-17 王子ホールディングス株式会社 延伸フィルム
JP2017108090A (ja) * 2015-12-08 2017-06-15 リンテック株式会社 ダイシングシートおよびダイシングシートの製造方法
WO2018105613A1 (ja) * 2016-12-07 2018-06-14 古河電気工業株式会社 半導体加工用テープ
KR102787962B1 (ko) * 2019-04-25 2025-03-27 리껭테크노스 가부시키가이샤 다이싱 필름용 기재 필름, 및 다이싱 필름, 그리고 제조 방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05211234A (ja) 1991-12-05 1993-08-20 Lintec Corp ウェハ貼着用粘着シートおよびウェハダイシング方法
DE19536043A1 (de) * 1995-09-28 1997-04-10 Hoechst Ag Polyolefinfolie mit Cycloolefinpolymer, Verfahren zu ihrer Herstellung und ihre Verwendung
JPH11199840A (ja) * 1998-01-16 1999-07-27 Kureha Chem Ind Co Ltd 粘着テープ用基材、粘着テープ及び離型テープ付き粘着テープ
CN1643042B (zh) * 2002-03-20 2012-03-14 优泊公司 记录纸和使用该记录纸的标签纸
WO2003097720A1 (en) * 2002-05-20 2003-11-27 Toray Industries, Inc. Resin, resin compositions, process for production thereof, and moldings made by using the same
DE60316310T2 (de) 2002-06-28 2008-06-05 Zeon Corp. Verfahren zur herstellung von thermoplastischen harzen, vernetzten harzen und verbundmaterialien von vernetzten harzen
EP1589054A4 (en) 2003-01-31 2009-04-29 Zeon Corp POLYMERIZABLE COMPOSITION, THERMOPLASTIC RESIN COMPOSITION, RETICULATED RESIN, AND COMPOSITE MATERIALS BASED ON RETICULATED RESIN
CN101090919B (zh) * 2004-12-28 2010-12-01 株式会社钟化 接枝共聚物及其制造方法以及含有该接枝共聚物的树脂组合物
JP4800778B2 (ja) * 2005-05-16 2011-10-26 日東電工株式会社 ダイシング用粘着シート及びそれを用いた被加工物の加工方法
JP5068070B2 (ja) * 2006-12-21 2012-11-07 グンゼ株式会社 ダイシング用基体フイルム
CN101836140B (zh) * 2007-10-24 2012-04-18 日东电工株式会社 偏振片、光学薄膜和图像显示装置
KR101114358B1 (ko) * 2008-04-21 2012-03-14 주식회사 엘지화학 점착 필름 및 이를 사용한 백라인딩 방법
EP2267090B8 (en) * 2008-04-21 2018-10-17 LG Chem, Ltd. Pressure-sensitive adhesive film and back-grinding method using the same
JP5124778B2 (ja) * 2008-09-18 2013-01-23 リンテック株式会社 レーザーダイシングシートおよび半導体チップの製造方法
US8092628B2 (en) * 2008-10-31 2012-01-10 Brewer Science Inc. Cyclic olefin compositions for temporary wafer bonding
WO2010143510A1 (ja) * 2009-06-11 2010-12-16 東京応化工業株式会社 接着剤組成物
JP2011018669A (ja) * 2009-07-07 2011-01-27 Nitto Denko Corp 半導体ウェハダイシング用粘着シート及び該粘着シートを用いる半導体ウェハのダイシング方法
JP5406615B2 (ja) * 2009-07-15 2014-02-05 日東電工株式会社 透明フィルムおよび該フィルムを用いた表面保護フィルム

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