JP2013062339A - Composite substrate, electronic device, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composite substrate which improves the reliability, and to provide an electronic device and an electronic apparatus which include the composite substrate.SOLUTION: A composite substrate 1 includes: an insulation part 20 serving as a substrate body; and a separation part 15 penetrating through the insulation part 20. The separation part 15 is formed into a pillar shape having a flange part 15a at one end part and has a recessed part 15c, which is formed over the flange part 15a and a pillar shape part 15b and penetrates through the flange part 15a, and an opening 15d formed by the recessed part 15c in an area ranging from the flange part 15a to the pillar shape part 15b. A portion in the recessed part 15c at the insulation part 20 and a portion which surrounds the pillar shape part 15b are integrated through the opening 15d.

Description

  The present invention relates to a composite substrate, an electronic device including the composite substrate, and an electronic apparatus.

Conventionally, as a composite substrate, a glass substrate body having a pair of main surfaces facing each other, a silicon island body embedded in the glass substrate body so that at least a part of both of the pair of main surfaces are exposed, There is known a glass substrate provided with (for example, see Patent Document 1).
According to Patent Document 1, this glass substrate is said to have high adhesion at the interface between the glass substrate body and the silicon island.

JP 2006-47279 A

According to Patent Document 1, the glass substrate is configured to be fixed to the glass substrate body by pressing the silicon islands into the heated glass substrate.
However, in the embodiment, the glass substrate is formed in a shape in which the silicon island-like body does not have a portion that engages with the glass substrate body, such as a substantially conical shape, a substantially pyramid shape, a cylindrical shape, or a prism shape. Yes.
For this reason, the glass substrate may have insufficient fixing strength of the silicon island with respect to external force applied in the thickness direction.
As a result, the glass substrate has a problem that the silicon island is displaced in the thickness direction with respect to the glass substrate main body due to an external force applied in the thickness direction, or falls off the glass substrate main body. There is a fear.
As a result, for example, the glass substrate cannot sufficiently maintain the airtightness (adhesiveness) between the glass substrate body and the silicon island, and there is a problem that the reliability is lowered.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A composite substrate according to this application example includes an insulating part, a collar provided through the insulating part, both ends exposed, and a collar provided at one end, and the collar A conductive portion provided with a columnar portion provided on the concave portion provided across the collar portion and the columnar portion, and an opening communicating with the concave portion. The insulating part is filled in the collar part and the columnar part through the opening.

According to this, the composite substrate includes a concave portion in which the conductive portion is provided across the inside of the collar portion and the columnar portion and an opening portion communicating with the concave portion, and the collar portion and the columnar shape via the opening portion. The inside of the part is filled with an insulating part.
Thus, in the composite substrate, the conductive portion is engaged with the insulating portion, and the fixing strength of the conductive portion (corresponding to a silicon island) with respect to the external force applied in the thickness direction is compared with the configuration of Patent Document 1. Thus, it becomes possible to significantly improve.
As a result, the composite substrate can be more reliable than the configuration of Patent Document 1.

  Application Example 2 The composite substrate according to the application example described above preferably includes an outer peripheral frame portion that has conductivity and surrounds the outer periphery of the insulating portion in a frame shape in plan view.

  According to this, the composite substrate has conductivity, and has an outer peripheral frame portion surrounding the outer periphery of the insulating portion in a frame shape in plan view. For example, the outer peripheral frame portion is set to a ground potential (GND). Thus, it is possible to exert a shielding effect against external noise, static electricity, and the like.

  Application Example 3 In the composite substrate according to the application example described above, it is preferable that a beam portion that connects the outer peripheral frame portion and the conductive portion is provided.

  According to this, since the composite substrate includes the beam portion that connects the outer peripheral frame portion and the conductive portion, for example, the potential of the conductive portion on which the external member is mounted is transferred to the outer peripheral frame portion via the beam portion. By setting the same ground potential, it is possible to exert a shielding effect against external noise and static electricity with respect to the external member.

  Application Example 4 In the composite substrate according to the application example, it is preferable that the insulating portion includes borosilicate glass and the conductive portion includes silicon.

According to this, since the insulating part includes borosilicate glass and the conductive part includes silicon, the insulating separation between the insulating part and the conductive part can be reliably performed.
In addition, since the conductive portion contains silicon, the composite substrate can provide a composite substrate with high processing accuracy due to its physical properties.
In the composite substrate, since the insulating portion includes borosilicate glass and the conductive portion includes silicon, anodic bonding between the insulating portion and the conductive portion is possible.
Thus, the composite substrate can employ an efficient manufacturing method using anodic bonding that does not require a separate bonding member.

  Application Example 5 In the composite substrate according to the application example, it is preferable that the insulating portion includes a flexible resin.

  According to this, since the composite substrate includes the flexible resin in the insulating portion, for example, a flexible composite substrate that can be bent by using a polyimide-based resin for the insulating portion is provided. be able to.

  Application Example 6 In the composite substrate according to the application example described above, the columnar portion of the conductive portion has a prismatic shape, and the opening is provided on each of the surfaces in contact with the insulating portion of the prism. preferable.

  According to this, in the composite substrate, the columnar portion of the conductive portion has a prismatic shape, and the opening is provided on each of the surfaces in contact with the insulating portion of the rectangular column, so that the conductive portion against the external force applied in the thickness direction is provided. The fixing strength can be further improved.

  Application Example 7 In the composite substrate according to the application example described above, it is preferable that the columnar portion of the conductive portion has a cylindrical shape.

  According to this, since the columnar portion of the conductive portion is cylindrical, the composite substrate can disperse the stress generated by applying an external force or the like substantially evenly over the entire columnar portion.

  Application Example 8 An electronic device according to this application example includes the composite substrate according to any one of the application examples described above and a functional element mounted on the composite substrate.

  According to this, since the electronic device of this configuration includes the composite substrate described in any one of the application examples described above and the functional element mounted on the composite substrate, the electronic device according to any one of the application examples described above. An electronic device having the described effects can be provided.

  Application Example 9 An electronic device according to this application example includes the composite substrate according to any one of the application examples described above.

  According to this, since the electronic apparatus of this configuration includes the composite substrate described in any one of the above application examples, it is possible to provide an electronic apparatus that exhibits the effects described in any one of the above application examples. it can.

It is a schematic diagram which shows schematic structure of an example of a composite substrate, (a) is a principal part perspective view, (b) is an expanded perspective view of an electroconductive part, (c) is the cross section in the AA of (a). Figure. It is a schematic plan view of FIG.1 (b), (a) is the top view seen from the 1st main surface side, (b) is the top view seen from the 2nd main surface side. The flowchart which shows an example of the manufacturing process of a composite substrate. (A)-(d) is a schematic cross section explaining each main manufacturing process. (E)-(g) is a schematic cross section explaining each main manufacturing process. The graph showing the relationship between the heating temperature and viscosity of borosilicate glass. It is a schematic top view which shows the variation of the columnar part shape of a isolation | separation part, (a) is a top view which shows a hexagonal columnar columnar part, (b) is a top view which shows a cylindrical columnar part. The model partial expansion perspective view which shows schematic structure of a physical quantity sensor. The perspective view which shows the structure of the mobile type (or notebook type) personal computer as an electronic device provided with the composite substrate. The perspective view which shows the structure of the mobile telephone (PHS is also included) as an electronic device provided with the composite substrate. The perspective view which shows the structure of the digital still camera as an electronic device provided with the composite substrate.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings.

(Embodiment)
<Composite substrate>
First, a schematic configuration of the composite substrate will be described.
FIG. 1 is a schematic diagram showing a schematic configuration of an example of a composite substrate in a state where a plurality of wafers are taken. 1A is a perspective view of a main part, FIG. 1B is an enlarged perspective view of a conductive part, and FIG. 1C is a cross-sectional view taken along line AA in FIG. FIG.
2 is a schematic plan view of FIG. 1B, FIG. 2A is a plan view seen from the first main surface side, and FIG. 2B is a plan view seen from the second main surface side. FIG.
In addition, for convenience of explanation, including the following figures, the dimensional ratios of the constituent elements are different from actual ones. Moreover, the two-dot chain line of Fig.1 (a) represents the dividing line at the time of dividing | segmenting into a piece.

As shown in FIG. 1 and FIG. 2, the composite substrate 1 includes a flat plate-like insulating portion 20 that is a substrate body, and a plurality of separating portions 15 as conductive portions that penetrate the insulating portion 20 in the thickness direction. ing.
The separation portion 15 has a first main surface 11 and a second main surface 13 which are flat surfaces connected to and exposed to the insulating portion 20. The separating portion 15 is provided with a collar portion 15a at one end portion on the second main surface 13 side, a columnar portion 15b is provided on the collar portion 15a, and straddles the collar portion 15a and the inside of the columnar portion 15b. The recess 15c penetrating the collar portion 15a in the thickness direction (the direction connecting the first main surface 11 and the second main surface 13) and the recess 15c are provided so as to extend from the collar portion 15a to the columnar portion 15b. (In other words, an opening 15d communicating with the recess 15c).
Thus, in the composite substrate 1, the part in the recess 15 c of the separation part 15 in the insulating part 20 and the part surrounding the columnar part 15 b are integrated via the opening 15 d. In other words, the composite substrate 1 is filled with the insulating portion 20 inside the collar portion 15a and the columnar portion 15b through the opening 15d.

The separation portion 15 has a columnar portion 15b having a prismatic shape (here, a quadrangular columnar shape) and an opening portion 15d on each of the surfaces (here, four side surfaces) in contact with the insulating portion 20 of the quadrangular column (the columnar portion 15b). Provided (here, provided at four locations).
As shown in FIG. 2, the planar shape of the concave portion 15c of the separating portion 15 is a rhombus shape (in other words, a rectangular shape obtained by rotating the columnar portion 15b by 45 degrees around the center of the columnar portion 15b). Yes, a portion that intersects the columnar portion 15b in a plan view and goes outside the columnar portion 15b is an opening 15d in the plan view. For easy understanding, the first main surface 11 is shaded in FIG. 2A and the second main surface 13 is shaded in FIG. 2B.
On the other hand, in the thickness direction, as shown in FIG. 1C, the difference (D1-T1) between the depth D1 of the recess 15c and the thickness T1 of the flange 15a becomes the opening 15d.

The composite substrate 1 has conductivity and includes an outer peripheral frame portion 10 that surrounds the outer periphery of the insulating portion 20 in a frame shape (here, a square frame shape) in plan view. The composite substrate 1 includes a beam portion 12 that connects (mechanically and electrically connects) the outer peripheral frame portion 10 and the separation portion 15. For convenience of explanation, the separating portion 15 connected to the outer peripheral frame portion 10 by the beam portion 12 is referred to as a drawer portion 16.
In the composite substrate 1, it is preferable that a collar 10 a and an opening 10 d are also formed in the outer peripheral frame 10.

  For the separation portion 15, the outer peripheral frame portion 10, and the lead portion 16, for example, low-resistance silicon such as single crystal silicon or polysilicon doped with impurities such as phosphorus and boron is used. The insulating portion 20 is made of, for example, borosilicate glass containing alkali metal ions (movable ions) such as sodium.

As shown in FIG. 1C, electrode pads 17 are provided on the first main surface 11 and the second main surface 13 in at least a part of the separation portion 15 and the lead portion 16. Examples of the material of the electrode pad 17 include Au, Pt, Ag, Cu, Al, and alloys containing these, and one or more of these can be used in combination.
The separation part 15 and the drawer part 16 formed in this way are, for example, an external member (external element, external device) on the first main surface 11 side and an external member on the second main surface 13 side. It functions as a through electrode that is electrically connected in a state of having airtightness between the surface 11 side and the second main surface 13 side.

  A plurality of composite substrates 1 in a wafer shape are divided into individual pieces along a dividing line (two-dot chain line) shown in FIG. 1A by a dividing device such as a dicing saw (not shown).

Next, a method for manufacturing the composite substrate 1 will be described.
FIG. 3 is a flowchart showing an example of the manufacturing process of the composite substrate, and FIGS. 4A to 4D and 5E to 5G are schematic cross-sectional views for explaining the main manufacturing processes. . These cross-sectional views correspond to the cross-sectional view taken along line BB in FIG.
As shown in FIG. 3, the manufacturing method of the composite substrate 1 includes a columnar portion forming step S1, a glass substrate bonding step S2, a concave portion forming step S3, a heating / suction step S4, a polishing step S5, and an electrode pad formation. It has process S6 and division process S7.

[Columnar Forming Step S1]
First, as shown in FIG. 4A, for example, SiO ₂ (dioxide dioxide) is formed on the first main surface 11 of the silicon substrate 115 having a thickness of about 300 μm, which will later become the separation portion 15, the outer peripheral frame portion 10, and the extraction portion 16. A mask pattern 101 containing silicon is formed by a photolithography method.
Next, the first main surface 11 is dry-etched to a depth of, for example, about 200 μm using SF ₆ (sulfur hexafluoride) as an etching gas, and the columnar portion 15b of the separation portion 15, the columnar portion 16b of the lead-out portion 16, and the outer peripheral frame. The outer shape of the part corresponding to the columnar part in the part 10 is formed.

[Glass substrate bonding step S2]
Next, as shown in FIG. 4B, a glass substrate 120 having a thickness of about 400 μm, which will later become the insulating portion 20, is bonded to the first main surface 11 of the silicon substrate 115 by an anodic bonding method.
More specifically, a voltage of about 800 V is applied to a silicon substrate 115 that is low-resistance silicon and a glass substrate 120 that is borosilicate glass containing alkali metal ions (mobile ions) such as sodium in a nitrogen atmosphere at about 320 ° C. Anodic bonding is performed. As a result, the silicon substrate 115 and the glass substrate 120 are strongly bonded to each other due to a covalent bond at the interface due to electrostatic attraction.

[Concave forming step S3]
Next, as shown in FIG. 4C, a mask pattern 102 made of SiO _{2 is} formed on the second main surface 13 of the silicon substrate 115 by photolithography.
Next, the second main surface 13 is dry-etched to a depth of, for example, about 200 μm using SF ₆ as an etching gas, and the plurality of recesses 15c, 16c, the separation portion 15, the outer peripheral frame portion 10, and the lead portion 16 are independent ( And a recess 18 to be separated).
Thereby, the openings 15d and 16d and the flanges 15a, 16a and 10a are formed. At this time, although not shown in FIG. 4C, an opening 10 d (see FIG. 1C) is also formed in the outer peripheral frame portion 10. And the 2nd main surface 13 side of the isolation | separation part 15, the outer periphery frame part 10, and the drawer | drawing-out part 16 which were mutually connected isolate | separates.

[Heating / Suction Step S4]
Next, as shown in FIG. 4D, using the manufacturing apparatus 50, a portion surrounding the separation portion 15, the outer peripheral frame portion 10, and the drawer portion 16 on the first main surface 11 side of the silicon substrate 115 (hereinafter referred to as a first portion). The glass substrate 120 is filled in the recesses 116), the recesses 15 c, 16 c, 18 on the second main surface 13 side, and the recesses of the outer peripheral frame 10 (not shown) (hereinafter referred to as the second recesses 118).
The composite substrate 1 manufacturing apparatus 50 includes a heating unit 52 that places the second main surface 13 of the silicon substrate 115 on the placement surface 51 and heats the glass substrate 120 via the silicon substrate 115 to bring the glass substrate 120 into a viscous flow state. The glass substrate 120 in a viscous flow state is sucked from the second main surface 13 side of the silicon substrate 115 through a plurality of fine through holes 53 provided on the smooth mounting surface 51 of the heating unit 52. A suction section 54 that fills the first recess 116 and the second recess 118, a silicon substrate 115, a glass substrate 120, a heating section 52, and an airtight chamber 55 that accommodates the suction port portion of the suction section 54. It has become.

More specifically, first, in the hermetic chamber 55, the second main surface 13 of the silicon substrate 115 is placed on the placement surface 51 of the heating unit 52 provided with a heater or the like, and the heating unit 52 passes the silicon substrate 115 through the silicon substrate 115. The glass substrate 120 is heated to a viscous flow state.
At this time, the logarithm Log η of the viscosity η (dPa · s) of the glass substrate 120 is 7.5 to 14.4 as shown in the graph showing the relationship between the heating temperature and the viscosity of the borosilicate glass in FIG. It is preferably set to be within the range of 0 (dPa · s).
As an example of heating temperature, the temperature range of about 525 degreeC-about 820 degreeC which is the glass transition point of borosilicate glass and the temperature below a glass softening point is mentioned, for example. As will be described later, since the present manufacturing method is heated in a vacuum state, the heating time can be shortened as compared with the case of heating at atmospheric pressure.

Along with the heating, the glass substrate 120 is vacuumed from the second main surface 13 side of the silicon substrate 115 through the plurality of fine through holes 53 provided on the mounting surface 51 of the heating unit 52 by the suction unit 54 ( Suction (evacuation) is performed at a reduced pressure of about 10 ⁻² Pa. Thereby, the glass substrate 120 in the viscous flow state is transferred from the first recess 116 of the silicon substrate 115 and the communication portion (opening portions 10d, 15d, 16d) between the first recess 116 and the second recess 118 to the second recess 118. Fill.
At this time, since the second main surface 13 of the silicon substrate 115 is in close contact (adsorbed) with the mounting surface 51 of the heating unit 52 by suction, the second main surface 13 is in a viscous flow state toward the second main surface 13 side. Intrusion of the glass substrate 120 and movement (position shift) of the separation unit 15 are avoided.

[Polishing step S5]
Next, as shown in FIG. 5 (e), the first main surface 11 side and the second main surface 13 side of the composite substrate 1 in the wafer state are polished, and slightly attracted to the first main surface 11 of the silicon substrate 115 during suction. The remaining glass substrate 120 residue and the protruding portion of the glass substrate 120 that is drawn into the through hole 53 during suction and slightly protrudes from the second main surface 13 of the silicon substrate 115 to the outside (through hole 53 side) are smoothed. To do.

[Electrode pad forming step S6]
Next, as shown in FIG. 5 (f), for example, Au, Pt, Ag, Cu, Al, or these are included on the first main surface 11 side and the second main surface 13 side of the separation portion 15 and the lead-out portion 16. An electrode pad 17 is formed by vapor deposition or sputtering using an electrode material such as an alloy.
Thereby, the separation part 15 and the lead part 16 have a function as a through electrode.

[Division step S7]
Next, as shown in FIG. 5G, the composite substrate 1 in a wafer state is divided into individual pieces along a dividing line 19 by a dividing device such as a dicing saw (not shown). Thereby, for example, a composite substrate 1 used in a physical quantity sensor 2 shown in FIG.
In addition, it may be wet etching instead of the dry etching in the columnar portion forming step S1 and the concave portion forming step S3.

As described above, in the composite substrate 1 of the present embodiment, the separation portion 15 has a columnar shape having the collar portion 15a, the recess portion 15c straddling the collar portion 15a and the columnar portion 15b, and penetrating the collar portion 15a, And an opening 15d formed from the collar portion 15a to the columnar portion 15b. In the composite substrate 1, a portion in the recess 15 c in the insulating portion 20 and a portion surrounding the columnar portion 15 b are integrated through the opening 15 d.
Thereby, in the composite substrate 1, the separation portion 15 is engaged with the insulating portion 20, and the fixing strength of the separation portion 15 with respect to the external force applied in the thickness direction is significantly higher than that of the configuration of the conventional Patent Document 1. Can be improved. As a result, the composite substrate 1 can be more reliable than the configuration of Patent Document 1.

  In addition, since the composite substrate 1 includes the outer peripheral frame portion 10 that has conductivity and surrounds the outer periphery of the insulating portion 20 in a plan view in a plan view, for example, the outer peripheral frame portion 10 is set to a ground potential (GND). As a result, it is possible to exert a shielding effect against external noise, static electricity, and the like.

  In addition, since the composite substrate 1 includes the beam portion 12 that connects the outer peripheral frame portion 10 and the separation portion 15, for example, the potential of the drawer portion 16 on which an external member is mounted is set to the outer periphery via the beam portion 12. By setting the same ground potential as that of the frame part 10, it is possible to exert a shielding effect against external noise and static electricity with respect to the external member.

Moreover, since the insulating part 20 contains borosilicate glass and the separating part 15 contains silicon, the composite substrate 1 can reliably perform the insulating separation between the insulating part 20 and the separating part 15.
In addition, since the separation part 15 contains silicon, the composite substrate 1 can provide a composite substrate with high processing accuracy due to its physical properties.
Moreover, since the insulating part 20 contains borosilicate glass and the separating part 15 contains silicon, the composite substrate 1 can be anodic bonded to the insulating part 20 (glass substrate 120) and the separating part 15 (silicon substrate 115). It becomes.
Thus, the composite substrate 1 can be efficiently manufactured without separately preparing a bonding member by anodically bonding the glass substrate 120 and the silicon substrate 115 in the manufacturing process.

Further, in the composite substrate 1, the columnar portion 15b of the separation portion 15 is a quadrangular columnar shape, and the opening 15d is provided on each of the four surfaces in contact with the insulating portion 20 of the quadrangular column (columnar portion 15b). For example, the fixing strength of the separating portion 15 against the external force applied in the vertical direction can be further improved as compared with the case where the opening portion 15d is provided on a part of the four surfaces.
Note that the shape of the columnar portion 15b (16b) of the separation portion 15 (drawer portion 16) is not limited to a square columnar shape, and may be a shape as shown in FIG.

FIG. 7 is a schematic plan view showing variations of the columnar part shape of the separation part, FIG. 7A is a plan view showing the hexagonal columnar part, and FIG. 7B is a columnar part. FIG.
As shown in FIG. 7A, the columnar portion 15b of the separating portion 15 may have a hexagonal columnar shape. According to this, the composite substrate 1 can be provided with six openings 15d by making the planar shape of the recess 15c into a hexagon according to the shape of the columnar portion 15b.
As a result, the composite substrate 1 can further improve the fixing strength of the separation portion 15 against an external force applied in the thickness direction, as compared with the above embodiment.
The shape of the columnar portion 15b of the separating portion 15 may be a triangular prism shape, or may be a polygonal column shape such as a pentagonal column shape or an octagonal column shape.

Moreover, as shown in FIG.7 (b), the columnar part 15b of the isolation | separation part 15 may be cylindrical. According to this, since the columnar part 15b of the separation part 15 is cylindrical, the composite substrate 1 can disperse the stress generated by the application of an external force or the like substantially uniformly throughout the columnar part 15b.
Note that the shape of the columnar portion 15b of the separation portion 15 may be neither a prismatic column nor a cylindrical shape, for example, an irregular columnar shape such as an elliptical columnar shape.

Note that the planar shape of the recess 15c of the separating portion 15 is not limited to a polygon such as a rhombus (quadrangle) or a hexagon, and for example, a cross of a cross-recessed screw as shown in FIG. It may be a shape like a hole. According to this, the composite substrate 1 can sufficiently secure the thickness in the radial direction (the direction along the first main surface 11) of the columnar portion 15b between the adjacent openings 15d. The fixing strength of the separation part 15 can be further improved.
The planar shape of the collar portion 15a is not limited to a quadrangular shape, and may be a polygonal shape such as a pentagon, hexagon, or octagon, or a circular shape.

Further, the composite substrate 1 may use a flexible resin for the insulating portion 20 instead of borosilicate glass. According to this, since the insulating substrate 20 includes a flexible resin, the composite substrate 1 can be bent by using, for example, a polyimide resin for the insulating member 20. Can be provided.
In addition, the drawer | drawing-out part 16 and the outer periphery frame part 10 do not need depending on the use of the composite substrate 1. FIG.

<Electronic device>
Next, an electronic device including a composite substrate and a functional element mounted on the composite substrate will be described.
The composite substrate 1 described above can be used as a substrate having a package function of an electronic device, for example. Here, a physical quantity sensor as an example of an electronic device including the composite substrate 1 will be described.
FIG. 8 is a schematic partially developed perspective view showing a schematic configuration of the physical quantity sensor.

As shown in FIG. 8, the physical quantity sensor 2 includes a composite substrate 1 that also serves as a package base, a sensor element 30 as an example of a functional element mounted on the composite substrate 1, and covers the sensor element 30 and is airtight to the composite substrate 1. And a cap 40 (lid) joined to each other.
Thus, in the physical quantity sensor 2, the composite substrate 1 and the cap 40 constitute a package 60 that houses the sensor element 30.

The sensor element 30 is attached to, for example, the drawer portion 16 of the composite substrate 1, and a plurality of terminals (not shown) of the sensor element 30 are formed on the composite substrate 1 by wire bonding using a metal wire 31 such as Au or Al. Each is connected (electrically connected) to the separation part 15 (drawer part 16).
The sensor element 30 can also be configured to be flip-chip mounted on the separating portion 15 (leading portion 16) with a plurality of terminals reversed directly or via bumps such as Au, Al, solder, etc. It is.

The cap 40 is formed in a box shape with one surface opened, covers the sensor element 30 and the metal wire 31 through the internal space 41, and the opening side is joined to the outer peripheral frame portion 10 of the composite substrate 1. The cap 40 can be anodic bonded to the outer peripheral frame 10 containing silicon of the composite substrate 1 by using glass (for example, borosilicate glass) containing alkali metal ions (mobile ions) such as sodium. It becomes.
Further, the physical quantity sensor 2 uses a conductive material for the cap 40, for example, by setting the outer peripheral frame portion 10 to the ground potential (GND), so that the composite substrate 1 and the cap 40 can cause noise and static electricity from the outside. It is possible to exert a shielding effect against such as.

The internal space 41 of the physical quantity sensor 2 is hermetically sealed. Depending on the type of the sensor element 30 (for example, a pressure sensor, an acceleration sensor, an angular velocity sensor, etc.) and a physical quantity detection method, a vacuum state (depressurized state) or nitrogen It is in a state filled with an inert gas such as helium or argon.
With such a configuration, the physical quantity sensor 2 has the internal space 41 via the separation unit 15 (drawer unit 16) that functions as the through electrode of the composite substrate 1 and the reliability is improved by improving the fixing strength. It is possible to make an electrical connection with an external member while maintaining the airtightness. As a result, the physical quantity sensor 2 can improve reliability as compared with, for example, the case where the glass substrate of Patent Document 1 is used.
Note that the electronic device is not limited to the above-described sensor device such as a physical quantity sensor. For example, the electronic device may be a timing device such as a crystal resonator or a crystal oscillator, a frequency filter, a MEMS (Micro Electro Mechanical Systems) device, or the like. Applicable.

<Electronic equipment>
Next, an electronic device provided with the composite substrate will be described.
FIG. 9 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer as an electronic apparatus including the composite substrate.
As shown in FIG. 9, the personal computer 1100 includes a main body portion 1104 having a keyboard 1102 and a display unit 1106 having a display portion 1101. The display unit 1106 is connected to the main body portion 1104 via a hinge structure portion. And is rotatably supported.
Such a personal computer 1100 incorporates the composite substrate 1.

FIG. 10 is a perspective view illustrating a configuration of a mobile phone (including PHS) as an electronic apparatus including the composite substrate.
As shown in FIG. 10, the cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1201 is disposed between the operation buttons 1202 and the earpiece 1204. .
Such a cellular phone 1200 incorporates the composite substrate 1.

FIG. 11 is a perspective view illustrating a configuration of a digital still camera as an electronic apparatus including the composite substrate. Note that FIG. 11 also shows a simple connection with an external device.
Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an image sensor such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.
A display unit 1310 is provided on the back surface (front side in the figure) of the case (body) 1302 in the digital still camera 1300, and the display unit 1310 is configured to perform display based on an imaging signal from the CCD. Functions as a viewfinder that displays images as electronic images.
A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the figure) of the case 1302.

When the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308.
In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. A television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication, if necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation.
Such a digital still camera 1300 incorporates the composite substrate 1.

Since such an electronic apparatus includes the composite substrate 1 having excellent reliability, it can exhibit excellent performance.
In addition to the personal computer (mobile personal computer) in FIG. 9, the mobile phone in FIG. 10, and the digital still camera in FIG. Inkjet printers), laptop personal computers, televisions, video cameras, video tape recorders, various navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, televisions Telephone, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices, Instruments (eg, vehicles, aircraft, Instruments of 舶), can be applied to a flight simulator.

  DESCRIPTION OF SYMBOLS 1 ... Composite substrate, 2 ... Physical quantity sensor as electronic device, 10 ... Peripheral frame part, 10a ... Collar part, 10d ... Opening part, 11 ... 1st main surface, 12 ... Beam part, 13 ... 2nd main surface, 15 ... Separation part as conductive part, 15a ... collar part, 15b ... columnar part, 15c ... concave part, 15d ... opening part, 16 ... drawer part, 16a ... collar part, 16b ... columnar part, 16c ... concave part, 16d ... opening part DESCRIPTION OF SYMBOLS 17 ... Electrode pad, 18 ... Recessed part, 19 ... Dividing line, 20 ... Insulating part, 30 ... Sensor element as a functional element, 31 ... Metal wire, 40 ... Cap, 41 ... Internal space, 50 ... Manufacturing apparatus, 51 ... Placement surface, 52 ... heating part, 53 ... through hole, 54 ... suction part, 55 ... airtight chamber, 60 ... package, 101,102 ... mask pattern, 115 ... silicon substrate, 116 ... first recess, 118 ... second Recess, 1 0 ... glass substrate.

Claims (9)

An insulating part;
A conductive portion provided through the insulating portion, exposed at both ends, and having a flange portion provided at one end portion and a columnar portion provided on the flange portion;
The conductive portion includes a recess provided across the inside of the collar portion and the columnar portion, and an opening portion communicating with the recess portion, and the collar portion and the columnar portion are interposed through the opening portion. A composite substrate, wherein the insulating portion is filled therein.   The composite substrate according to claim 1, further comprising an outer peripheral frame portion that has conductivity and surrounds the outer periphery of the insulating portion in a frame shape in plan view.   The composite substrate according to claim 2, further comprising a beam portion that connects the outer peripheral frame portion and the conductive portion.   4. The composite substrate according to claim 1, wherein the insulating portion includes borosilicate glass, and the conductive portion includes silicon. 5.   4. The composite substrate according to claim 1, wherein the insulating portion includes a flexible resin. 5.   6. The composite substrate according to claim 1, wherein the columnar portion of the conductive portion has a prismatic shape, and the opening is provided on each of the surfaces in contact with the insulating portion of the prismatic column. A composite substrate characterized by the above.   6. The composite substrate according to claim 1, wherein the columnar portion of the conductive portion has a columnar shape. 7. A composite substrate according to any one of claims 1 to 7,
An electronic device comprising: a functional element mounted on the composite substrate.   An electronic apparatus comprising the composite substrate according to any one of claims 1 to 7.

Images