JP2013058887A - Multilayer transmission line board having electromagnetic coupling structure, electromagnetic coupling module having the same and antenna module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multifunctional module of an electromagnetic coupling structure, suppressing manufacturing cost and a transmission loss.SOLUTION: The electromagnetic coupling structure between an antenna built-in semiconductor chip and a transmission line of multilayer transmission line board for use at a microwave band includes: between conductor layers, a laminate formed by alternately sandwiching dielectric layers and conductor layers; and an outer conductor layer laminated by further sandwiching a dielectric on the laminate. A hole is provided to penetrate through the laminate, and by the formation of a pipe-shaped metallic film inside the hole, the conductor layers on the laminate surface are mutually electrically connected. By the disposition of a semiconductor chip antenna at a position corresponding to the hole, the outer conductor layer is electromagnetically coupled with the semiconductor chip.

Description

  The present invention relates generally to an electromagnetic coupling structure, and more specifically, a multilayer transmission line plate in a transmission line used in a high frequency band from a microwave band to a millimeter wave band, and an electromagnetic coupling module having the multilayer transmission line plate The present invention relates to an antenna module.

  A transmission line electromagnetic coupling module used as an electromagnetic coupling structure in a high frequency band from the microwave band to the millimeter wave band, or a plurality of slots sandwiching an air layer using a waveguide, a metal plate, etc. Circuit boards have been proposed. (Patent Document 1)

  The invention described in Patent Document 1 provides a circuit board suitable for high-speed and large-capacity information transmission by suppressing transmission loss associated with high-frequency signal passing through a waveguide, and at the same time with low yield and low-cost mass production. For this purpose, a dielectric substrate having a ground pattern that is wired on one surface and a microstrip line connected to the device and forms a first slot hole on the other surface, and other dielectric substrate A circuit board having a waveguide connected to the surface of the substrate, wherein a metal plate forming a second slot hole is provided inside the waveguide at a position coinciding with the first slot hole through the cavity. It is characterized by that.

  FIG. 2 shows a cross-sectional configuration of the circuit board described in Patent Document 1. In FIG. 2, a circuit board 1 </ b> B has a semiconductor element D mounted on a dielectric substrate 94, and a microstrip line 93 is connected to the semiconductor element D. A ground pattern 95 is provided on the lower surface of the dielectric substrate 94. A slot S1 is formed in the ground pattern 95, and the microstrip line 93 and the slot S1 are electromagnetically coupled. Further, the waveguide F is connected to the ground pattern 95, and a metal plate 98 in which an additional slot S2 is formed is accommodated inside the waveguide F. The additional slot S2 is formed so as to coincide with the slot S1 through a cavity 99 formed inside the waveguide F.

Japanese Patent No. 4236607

  However, in the circuit board structure described in Patent Document 1, a waveguide is an indispensable configuration, and a hollow portion that becomes an air layer needs to be formed in the waveguide. There was room for improvement in terms of manufacturing cost. In addition, there is room for improvement in transmission loss in a waveguide having a relatively wide space.

  In addition, because of the presence of the waveguide, there is room for improvement in terms of function development, such as attaching an attachment other than the waveguide.

  Therefore, an object of the present invention is to provide a multifunctional multilayer transmission line plate, an electromagnetic coupling module, and the like while suppressing manufacturing costs and transmission loss.

  The present invention relates to an electromagnetic coupling module having an electromagnetic coupling structure between a semiconductor chip with a built-in antenna and a transmission line of a multilayer transmission line plate used in a microwave band, wherein a dielectric layer and a conductive layer are provided between conductive layers. A laminated body that is alternately sandwiched and an outer conductor layer that is further laminated with a dielectric sandwiched on the laminated body, and a hole is provided so as to penetrate the laminated body; By forming a tubular metal film, the conductor layers on the surface of the laminate are electrically connected to each other, and an antenna of the semiconductor chip is disposed at a position corresponding to the hole, so that the outer conductor layer and the semiconductor chip are It is characterized by electromagnetic coupling.

  According to this structure, the antenna chip with built-in antenna and the outer conductor layer formed with the dielectric layer interposed therebetween are electromagnetically coupled through the hole provided so as to penetrate the multilayer body. Thereby, it is not necessary to use a waveguide, and it is possible to realize an electromagnetic coupling module having a conversion structure of a light-weight and inexpensive semiconductor chip-multilayer transmission line plate.

  The present invention also relates to a multilayer transmission line plate used in a microwave band, wherein a laminated body in which a dielectric layer and a conductive layer are alternately sandwiched between conductive layers, and the laminated body And an outer conductor layer laminated with a dielectric interposed therebetween, and a hole is provided so as to penetrate the laminate, and a tubular metal film is formed in the hole, whereby a conductor on the surface of the laminate is formed. The layers are electrically connected to each other, and a semiconductor chip mounting pattern having an antenna built therein can be arranged at a position corresponding to the hole.

  As a result, the semiconductor chip with a built-in antenna and the outer conductor layer formed with the dielectric layer interposed therebetween are electromagnetically coupled through a hole provided so as to penetrate the multilayer body. Accordingly, it is not necessary to use a waveguide, and a multilayer transmission line plate having a light-weight and inexpensive semiconductor chip-multilayer transmission line plate transmission structure can be realized.

  The present invention also relates to an antenna module used in a microwave band, in which a laminated body in which a dielectric layer and a conductive layer are alternately sandwiched between conductive layers, and a dielectric layer further above and below the laminated body. An outer conductor layer sandwiched between the body, one outer conductor layer having a transmission line and a microstrip antenna, and the other outer conductor layer having a pattern for mounting the transmission line and the semiconductor chip, A semiconductor chip having a microwave circuit mounted thereon, and a hole is provided so as to penetrate the multilayer body, and a tubular metal film is formed in the hole, whereby a conductor on the surface of the multilayer body is formed. By electrically connecting the layers, the outer conductor layers are electromagnetically coupled to each other, and the semiconductor chip and the microstrip antenna are connected.

  According to this structure, the outer conductor layers formed with the dielectric layer interposed therebetween are electromagnetically coupled through the holes provided so as to penetrate the laminate. Thereby, it is not necessary to use a waveguide, and an antenna module having a simple and inexpensive transmission line conversion structure can be realized.

  As described above, it is possible to provide a multifunctional multilayer transmission line plate, an electromagnetic coupling module, and the like while suppressing manufacturing cost and transmission loss.

(A) It is explanatory drawing explaining the perspective exploded structure of the multilayer transmission-line board concerning one Embodiment of this invention. (B) It is a vertical sectional view which passes along the AA line in the above (a). It is explanatory drawing explaining the cross-sectional structure of the circuit board concerning conventional embodiment. (A) It is explanatory drawing explaining the cross-sectional structure of the antenna module concerning one Embodiment of this invention. (B) It is explanatory drawing explaining the cross-sectional structure of the antenna module concerning other embodiment of this invention. (C) It is explanatory drawing explaining the cross-sectional structure of the antenna module concerning other embodiment of this invention. It is explanatory drawing explaining the cross-sectional structure of the antenna module concerning other embodiment of this invention. It is explanatory drawing explaining the cross-sectional structure of the multilayer transmission-line board concerning other embodiment of this invention. (A) It is the plane perspective view which looked at the multilayer transmission-line board 1H for a measurement in connection with Example 1 and Example 2 for measuring the characteristic of the multilayer transmission-line board concerning one Embodiment of this invention from the conductor layer 13 side. is there. (B) It is a vertical sectional view which passes along the BB line in said (a). (A) It is the plane perspective view which looked at the multilayer transmission-line board 1J for a measurement in connection with Example 3 for measuring the characteristic of the multilayer transmission-line board concerning other embodiment of this invention from the conductor layer 13 side. (B) It is a vertical sectional view which passes along CC line in the above (a). (A) It is the plane perspective view which looked at the multilayer transmission-line board 1K for a measurement in connection with Example 4 for measuring the characteristic of the multilayer transmission-line board concerning other embodiment of this invention from the conductor layer 13 side. (B) It is a vertical sectional view which passes along the DD line in the above (a). (A) It is the plane perspective view which looked at the multilayer transmission-line board 1L for a measurement in connection with the comparative example 1 for measuring the characteristic of the multilayer transmission-line board used as a comparison object from the conductor layer 12 side. (B) It is a vertical sectional view which passes along the EE line in the above (a). (A) It is the plane perspective view which looked at the multilayer transmission-line board 1M for a measurement in connection with the comparative example 2 for measuring the characteristic of the multilayer transmission-line board used as a comparison object from the conductor layer 13 side. (B) It is a vertical sectional view which passes along the FF line in said (a). (A) It is the plane perspective view which looked at the multilayer transmission-line board 1N for a measurement in connection with the comparative example 3 for measuring the characteristic of the multilayer transmission-line board used as a comparison object from the conductor layer 13 side. (B) It is a vertical sectional view which passes along the GG line in said (a). (A) It is explanatory drawing explaining the exploded perspective structure of the antenna module concerning other embodiment of this invention. (B) It is a vertical sectional view which passes along the HH line in the above (a). (A) It is explanatory drawing explaining the exploded perspective structure of the antenna module concerning conventional embodiment. (B) It is a vertical sectional view which passes along the II line in said (a). It is explanatory drawing explaining comparatively the measurement result of Example 1 and Comparative Example 1. FIG. It is explanatory drawing explaining comparatively the measurement result of Example 1, Example 2, and the comparative example 2. FIG. It is explanatory drawing explaining comparatively the measurement result of Example 3, Example 4, and the comparative example 3. FIG. It is explanatory drawing explaining the cross-sectional structure of the electromagnetic coupling module concerning one Embodiment of this invention. It is explanatory drawing explaining the cross-sectional structure of the electromagnetic coupling module concerning other embodiment of this invention. It is explanatory drawing explaining the cross-sectional structure of the electromagnetic coupling module concerning other embodiment of this invention. It is explanatory drawing explaining the cross-sectional structure of the electromagnetic coupling module concerning other embodiment of this invention. It is explanatory drawing explaining the cross-sectional structure of the electromagnetic coupling module concerning other embodiment of this invention. It is explanatory drawing explaining the cross-sectional structure of the electromagnetic coupling module concerning other embodiment of this invention. It is explanatory drawing explaining the antenna module concerning other embodiment of this invention. It is explanatory drawing explaining the antenna module concerning other embodiment of this invention. It is explanatory drawing explaining the antenna module concerning other embodiment of this invention. It is explanatory drawing explaining the antenna module concerning other embodiment of this invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for implementing a multilayer transmission line having an electromagnetic coupling structure according to the present invention, an electromagnetic coupling module having the multilayer transmission line, and an antenna module will be described in detail with reference to the drawings.

  FIG. 1 shows a perspective exploded configuration of a multilayer transmission line board 1A according to an embodiment of the present invention. In FIG. 1 (a), a mounting hole 7 for a triplate line or a waveguide is shown, but it is omitted in the subsequent drawings. The multilayer transmission line plate, the electromagnetic coupling module, and the antenna module in the present invention are used in the high frequency band of the microwave band. Here, the frequency band of the microwave band specifically refers to a frequency band of 10 GHz to 100 GHz.

  As shown in FIG. 1, a multilayer transmission line plate 1A used for a high frequency band module such as an electromagnetic coupling module or an antenna module includes a first conductor layer 11, a first dielectric layer 21, a second conductor layer 12, and a second dielectric. The body layer 22 and the third conductor layer 13 are laminated in this order.

The first conductor layer 11 and the second conductor layer 12 are ground conductor layers, respectively. A hole 3 is provided so as to penetrate the first conductor layer 11 and the second conductor layer 12, and a metal film is formed on the inner surface of the hole 3, so that the first conductor layer 11 and the second conductor layer 12 are electrically connected. It is configured to be connected to
The metal film can be filled with air. Further, the metal film may be formed by plating.

  Here, the first conductor layer 11 and the second conductor layer 12 sandwiching the dielectric layer 21 constitute a laminate having a conductor layer on the surface.

  The second dielectric layer 22 constitutes an insulating layer that electrically insulates the second conductor layer 12 and the third conductor layer 13.

  The second dielectric layer 22 that insulates the second conductor layer 12 and the third conductor layer 13 is preferably made of a low dielectric loss material, such as ceramic, Teflon (registered trademark), polyphenylene ether, or polyphenylene ether. Insulating materials such as modified products and liquid crystal polymers are used. Note that the second dielectric layer 22 may contain glass fibers. Further, it is preferable to use the same material as the second dielectric layer 22 for the first dielectric layer 21 that insulates the first conductor layer 11 and the second conductor layer 12. However, an FR-4 level normal epoxy substrate or the like may be used for the first dielectric layer 21 in consideration of cost. The first dielectric layer 21 may contain glass fibers.

  The multilayer transmission line plate 1A having the transmission line electromagnetic coupling structure according to one embodiment of the present invention has been described above. As a specific configuration for implementing the transmission line electromagnetic coupling structure, the first dielectric layer is used. The thickness of 21 is preferably designed to be 0.02 mm to 4 mm, more preferably 0.02 mm to 2 mm. The surface roughness of the second conductor layer 12 on the second dielectric layer 22 side is preferably small in consideration of the skin effect, and the specific surface roughness (ten-point average roughness; Rz) is The thickness is preferably 0.1 μm or more and 9 μm or less, more preferably 0.1 μm or more and 6 μm or less, and further preferably 0.1 μm or more and less than 3 μm.

The thickness of the first conductor layer 11 and the second conductor layer 12 is preferably 5 μm or more and 50 μm or less, and more preferably 12 μm or more and 50 μm or less. As a material for obtaining such a structure, a general multilayer wiring board material can also be used, and specifically, a ceramic or organic wiring board material can be used. In order to obtain an inexpensive multilayer transmission line board 1A, a general-purpose multilayer wiring board material can be used. Therefore, as the first conductor layer 11, the first dielectric layer 21, and the second conductor layer 12, for example, MCL-E-679 (trade name, manufactured by Hitachi Chemical Co., Ltd.) that is a double-sided copper-clad laminate is used. Applicable. In order to suppress transmission loss, it is possible to apply a low-loss material. As such a material, for example, MCL-FX-2 (trade name, manufactured by Hitachi Chemical Co., Ltd.) that is a double-sided copper-clad laminate can be employed.
Further, when a material having a low dielectric constant and a low dielectric loss tangent is used as a wiring board material, there is an effect of suppressing transmission loss of a transmission line through which a high-frequency signal flows.

  The thickness of the second dielectric layer 22 is preferably 0.02 mm or more and 0.8 mm or less, more preferably 0.07 mm or more and 0.2 mm or less. As an example, the second dielectric layer 22 includes a double-sided copper-clad laminate MCL-FX-2 (trade name, manufactured by Hitachi Chemical Co., Ltd.) or a prepreg GFA-2 (Hitachi Chemical Co., Ltd.), which is a low dielectric loss tangent high heat resistant multilayer material. Kogyo Co., Ltd. product name) can be used.

Further, regarding the copper foil used when the conductor layer 13 constituting the third transmission line is manufactured, the surface roughness of the surface of the third conductor layer 13 on the second dielectric layer 22 side is considered in consideration of the skin effect. The smaller one is preferable, and the surface roughness (Rz) is preferably 0.1 μm or more and 9 μm or less. More preferably, it is designed to be 0.1 μm or more and 6 μm or less, and more preferably 0.1 μm or more and less than 3 μm.
The thickness of the conductor layer 13 constituting the third transmission line is preferably 5 μm or more and 50 μm or less, and more preferably 12 μm or more and 50 μm or less. For example, 3EC-VLP-12 (Mitsui Metal Mining Co., Ltd., trade name) or the like can be used for the conductor layer 13.

  Further, a patch pattern may be arranged at the open end of the conductor layer 13 constituting the third transmission line. By arranging the patch pattern, it is possible to adjust the impedance of the coupling portion and suppress transmission loss.

  The thickness of the metal film on the inner surface of the hole 3 is preferably 5 μm or more and 50 μm or less, and more preferably 10 μm or more and 50 μm or less. If the thickness of the metal film is less than 5 μm, the tubular metal film may not be formed uniformly. The metal film can be formed by vapor deposition or sputtering in addition to plating, but is preferably formed by plating in order to obtain the above thickness efficiently and uniformly. The metal film is preferably formed over the entire inner surface of the hole 3, but there may be a hole having a size less than ¼ of the effective wavelength λ corresponding to the frequency used.

  The holes 3 are preferably filled with a dielectric 4 satisfying at least one of a relative dielectric constant of 2 to 30 and a dielectric loss tangent of 0 to 0.03 at 10 GHz. Since the transmission loss increases in proportion to the dielectric loss tangent, the transmission loss is suppressed by filling the material having a low dielectric loss tangent in this way.

  The hole 3 may be filled with air. Since the transmission loss increases in proportion to the dielectric loss tangent, the transmission loss is further suppressed by filling air with a low dielectric loss tangent.

  The width of the hole 3 in the direction orthogonal to the extending direction of the outer conductor layer is preferably not more than the wavelength of the frequency to be used. By designing the hole width in this way, high density can be achieved while suppressing transmission loss.

  In the multilayer transmission line plate having the transmission line electromagnetic coupling structure shown in FIG. 1, a semiconductor chip having a built-in antenna, a triplate line, a waveguide opening, or the like at a position corresponding to the hole of the multilayer transmission line plate Can be implemented. Furthermore, it can also be implemented as an antenna module by mounting other passive components on a multilayer transmission line plate (details will be described later).

Further, in the multilayer transmission line plate having the transmission line electromagnetic coupling structure shown in FIG. 1, the conductor layer 13 extends in a direction orthogonal to the long side of the opening of the hole 3 (substantially rectangular in the drawing). Is provided.
Further, although not shown, a microstrip antenna can be connected to one end of the conductor layer 13. It is also possible to connect a microstop antenna to both ends of the conductor layer 13. The microstrip antenna is not limited to a single patch antenna or patch pattern, but can be an array antenna.

  FIG. 3A shows a cross-sectional configuration of an antenna module according to an embodiment of the present invention. In FIG. 3A, the antenna module 1E has a semiconductor chip-transmission line electromagnetic coupling structure with a built-in antenna. A semiconductor chip D incorporating an antenna is disposed at a position corresponding to the hole 3 of the multilayer transmission line plate having this electromagnetic coupling structure (a position covering the lower portion of the hole 3 in the figure). The electric power supplied from the semiconductor chip D is supplied to the microstrip antenna (patch pattern) 5 through the hole 3 and the conductor layer 13 forming the transmission line on the surface of the multilayer transmission line plate. Alternatively, the power received by the microstrip antenna 5 is fed to the semiconductor chip D through the conductor layer 13 and the hole 3 that form a transmission line.

  FIG. 3B shows a cross-sectional configuration of an antenna module according to another embodiment of the present invention. In FIG. 3B, the antenna module 1C has a triplate-transmission line electromagnetic coupling structure. The triplate line C is disposed at a position corresponding to the hole 3 of the multilayer transmission line plate having the electromagnetic coupling structure (a position covering the lower portion of the hole 3 in the figure). The electric power fed from the triplate line C is fed to the microstrip antenna 5 via the hole 3 and the conductor layer 13 forming the transmission line on the surface of the multilayer transmission line plate. Alternatively, the electric power received by the microstrip antenna 5 is fed to the triplate line C through the conductor layer 13 and the hole 3 forming the transmission line.

  FIG. 3C shows a cross-sectional configuration of an antenna module according to another embodiment of the present invention. In FIG. 3C, the antenna module 1D has a waveguide-transmission line electromagnetic coupling structure. A waveguide F is disposed at a position corresponding to the hole 3 of the multilayer transmission line plate having the electromagnetic coupling structure (a position covering the lower portion of the hole 3 in the figure). At this time, the center of the hole 3 and the center of the hollow portion of the waveguide F are arranged so as to substantially coincide. The electric power fed from the waveguide F is fed to the microstrip antenna 5 through the conductor layer 13 that forms the transmission line on the surface of the multilayer transmission line plate with the hole 3. Alternatively, the electric power received by the microstrip antenna 5 is fed to the waveguide F through the conductor layer 13 and the hole 3 forming the transmission line.

3A to 3C, the configuration in which the dielectric layer and the conductor layer are laminated only on one side of the laminate in the module has been described. However, the dielectric layer and the conductor layer are respectively provided on both sides of the laminate. It can also be provided. In FIG. 4, both sides of the laminate (consisting of the first conductor layer 11, the first dielectric layer 21, and the second conductor layer 12) are sandwiched between the second dielectric layer 22 and the third dielectric layer 23, The cross-sectional structure of the antenna module 1F concerning other embodiment which comprised the laminated structure so that the both sides might be pinched | interposed by the 3rd conductor layer 13 and the 4th conductor layer 14 is shown.
With the configuration shown in FIG. 4, the power output from the semiconductor chip D forming the microwave circuit is fed to the microstrip antenna 5 through the transmission line and hole on the semiconductor side and the transmission line on the back surface. Alternatively, the power received by the microstrip antenna 5 is fed to the semiconductor chip D through the front and back transmission lines and holes.

  The difference between the multilayer transmission line plate in the antenna module 1F used in FIG. 4 and the multilayer transmission line plate shown in FIG. 1 is the third difference in the multilayer transmission line plate in the antenna module 1F shown in FIG. The dielectric layer 23 is provided, and the fourth conductor layer 14 is further provided outside thereof.

  When the configuration shown in FIG. 4 is used, it is preferable to use the same insulating material as the second dielectric layer for the third dielectric layer 23, and the third conductor layer and the fourth conductor layer 14 It is preferable to use the same copper foil. Moreover, it is preferable that the thickness of the conductor is approximately the same as that of the third conductor layer, and it is also preferable that the conductor surface roughness on the dielectric side is approximately the same as that of the third conductor layer.

  3A to 3C, the conductor layer in the module is described based on an embodiment in which the first conductor layer 11, the second conductor layer 12, and the third conductor layer 13 are configured in total. However, the conductor layer can be configured as three or more layers. For example, as shown in FIG. 5, the conductor layer can be five layers. The multilayer transmission line board 1G shown in FIG. 5 has a third dielectric layer 23 and a fourth conductor layer 14, a fourth dielectric layer 24 and a fifth conductor layer outside the first conductor layer 11 serving as a ground layer. 15 is provided. With the above configuration, the multilayer transmission line board 1G shown in FIG. 5 includes the first conductor layer 11, the second conductor layer 12, the third conductor layer 13, the fourth conductor layer 14, and the fifth conductor layer 15 in total. A conductor layer is formed.

  Next, several examples for measuring the characteristics of a device according to an embodiment of the present invention will be described. In the electromagnetic coupling structure according to the present invention, wiring (for example, the first conductor layer 11 and the third conductor layer 13) is separated on the front surface side and the back surface side of the multilayer transmission line plate. It is difficult to perform high frequency measurement using the Therefore, in Examples 1 to 4 described below, a multilayer transmission line plate provided with two holes instead of one hole was prepared. By providing such two holes, serial slot coupling is realized with one being the input side and the other being the output side, and measurement by probing becomes possible.

[Example 1 for measuring characteristics of a device according to an embodiment of the present invention]
FIG. 6A shows a measurement multilayer transmission line plate 1H related to Example 1 (and Example 2) for measuring the characteristics of the multilayer transmission line plate according to one embodiment of the present invention from the conductor layer 13 side. A plan perspective view is shown. FIG. 6B is a vertical sectional view taken along the line BB in FIG. In FIG. 6B, the multilayer transmission line plate 1H includes a waveguide F, a first conductor layer 11, a first dielectric layer 21, a second conductor layer 12, a second dielectric layer 22, and a third conductor layer 13. Are stacked in this order.
As described above, serial slot coupling in which one of the holes 31 and 32 is the input side and the other is the output side is realized, and measurement by probing is possible.

Further, both end portions of the third conductor layer 13 are open ends, and the positions closer to the center by a length of ¼ of the effective wavelength λ from each of the open ends and the centers of the respective holes are The hole 31 and the hole 32 are provided at the matching positions. Further, the horizontal cross section of the hole 31 and the hole 32 is a substantially rectangular shape having a long side and a short side, and each long side is formed in a direction orthogonal to the extending direction of the transmission line 13.
The widths of the holes 31 and 32 are preferably designed to be equal to or less than the wavelength of the frequency to be used.

Next, a method for manufacturing the multilayer transmission line board 1H will be described.
First, a laminate (made by Hitachi Chemical Co., Ltd., trade name MCL-E-679) having copper foil formed on both surfaces of the dielectric layer is prepared. The thickness of this laminated board is 0.2 mm, the thickness of the copper foil is 12 μm, and the conductor surface roughness on the dielectric side is Rz: 6.0 μm. Next, a hole having a length of 2 mm is formed in the laminate using a drill having a diameter of 0.45 mm. After copper plating is applied to the inner wall of the hole and the copper foil surface by 10 μm, the hole filling resin (manufactured by Taiyo Ink Manufacturing Co., Ltd., trade name DX-1, 10 GHz dielectric loss tangent 0.03, relative dielectric constant 3.5 ), And the surface is polished to produce an inner layer circuit board.
In FIG. 6B, the copper plating films on the surfaces of the copper foils 11 and 12 are omitted.

  Next, a copper foil having a thickness of 12 μm (made by Mitsui Mining & Smelting Co., Ltd., trade name 3EC-VLP-12, surface roughness Rz: 3.0 μm) and a prepreg (made by Hitachi Chemical Co., Ltd., product) Multi-layer transmission line board 1H by stacking and combining the above-mentioned inner layer circuit board in this order by stacking them together under the conditions of temperature 180 ° C., pressure 3 MPa, time 80 minutes. Is produced.

  Finally, a copper foil was patterned by etching with respect to this multilayer transmission line board 1H, thereby arranging a transmission line 13 having a width of 220 μm at a position corresponding to the conductor pattern formed by the inner circuit board.

[Example 2 for measuring characteristics of a device according to an embodiment of the present invention]
In Example 2, the holes 31 and 32 of the multilayer transmission line plate 1H used in Example 1 were filled with a dielectric such as a resin having a relative dielectric constant of 3.2 and a dielectric loss tangent of 0.003. Other conditions were the same as in Example 1, and a multilayer transmission line plate (1H ′) was produced.
The relative dielectric constant at 10 GHz of the dielectric to be filled is preferably in the range satisfying at least one of 2 to 30 and the dielectric loss tangent of 0 to 0.03.

[Example 3 for measuring characteristics of a device according to an embodiment of the present invention]
FIG. 7A is a perspective plan view of the measurement multilayer transmission line plate 1J according to Example 3 for measuring the characteristics of the multilayer transmission line plate according to another embodiment of the present invention, as viewed from the conductor layer 13 side. Indicates. FIG. 7B is a vertical sectional view taken along the line CC in FIG. In FIG. 7B, the multilayer transmission line plate 1J includes fourth conductor layers 14a and 14b, a third dielectric layer 23, a first conductor layer 11, a first dielectric layer 21, a second conductor layer 12, and a second conductor layer. The dielectric layer 22 and the third conductor layer 13 are laminated in this order. As described above, serial slot coupling in which one of the holes 31 and 32 is the input side and the other is the output side is realized, and measurement by probing is possible.

Further, both end portions of the third conductor layer 13 are open ends, and the positions closer to the center by a length of ¼ of the effective wavelength λ from each of the open ends and the centers of the respective holes are The hole 31 and the hole 32 are provided at the matching positions. Further, the horizontal cross section of the hole 31 and the hole 32 is a substantially rectangular shape having a long side and a short side, and each long side is formed in a direction orthogonal to the extending direction of the transmission line 13.
The widths of the holes 31 and 32 are preferably designed to be equal to or less than the wavelength of the frequency to be used.

Next, a method for manufacturing the multilayer transmission line board 1J will be described.
In Example 1, the laminated body and the conductor layer were provided only on one side of the laminated body with holes, but in Example 3, the third dielectric layer 23 and the fourth conductor layer 14 were further inserted so as to sandwich the laminated body. Then, the fourth conductor layer 14 on the surface is patterned by etching to form 14a and 14b, and the multilayer transmission line plate 1J is manufactured.

[Example 4 for measuring characteristics of a device according to an embodiment of the present invention]
FIG. 8A is a plan perspective view of the measurement multilayer transmission line plate 1K according to Example 4 for measuring the characteristics of the multilayer transmission line plate according to another embodiment of the present invention, as viewed from the conductor layer 13 side. Indicates. FIG. 8B is a vertical sectional view taken along the line DD in FIG. In FIG. 8B, the multilayer transmission line plate 1K includes fourth conductor layers 14a and 14b, a third dielectric layer 23, a first conductor layer 11, a first dielectric layer 21, a second conductor layer 12, and a second conductor layer. The dielectric layer 22 and the third conductor layer 13 are laminated in this order. As described above, serial slot coupling in which one of the holes 31 and 32 is the input side and the other is the output side is realized, and measurement by probing is possible.

Next, a method for manufacturing the multilayer transmission line board 1K will be described.
In Example 3, the widths of the transmission lines formed in the third conductor layer 13 and the fourth conductor layer 14 were made constant. However, in the multilayer transmission line plate 1K, as shown in FIG. A patch pattern was provided.

That is, in FIGS. 8A and 8B, patch patterns 62 and 63 are provided at both ends of the third conductor layer 13, and the patch patterns 61 and 63 are provided at the ends of the fourth conductor layers 14a and 14b. 64 is provided.
As shown in FIG. 8A, the patch patterns 62 and 63 provided at both ends of the third conductor layer 13 are provided so as to be located outside the centers of the hole 31 and the hole 32, respectively. The patch patterns 61 and 64 provided at the tips of the fourth conductor layers 14a and 14b are provided so as to be located inside the centers of the holes 31 and 32, respectively.

  Other conditions were the same as in Example 3 to fabricate the multilayer transmission line plate 1K.

  The third conductor layer 13 and the fourth conductor layer 14 as transmission lines are microstrip lines each having a characteristic impedance of 50Ω.

[Comparative Example 1]
FIG. 9A shows a plan perspective view of the measurement multilayer transmission line plate 1L according to Comparative Example 1 for measuring the characteristics of the multilayer transmission line plate to be compared, as viewed from the conductor layer 12 side. FIG. 9B is a vertical sectional view taken along line EE in FIG. In FIG. 9B, the multilayer transmission line plate 1L has a first conductor layer 11, a first dielectric layer 21, and a second conductor layer 12 laminated in this order. A waveguide F is connected to the lower portion of the first conductor layer 11.
In the multilayer transmission line plate 1L, as shown in FIG. 9 (b), slots S2 and S4 that penetrate only the first conductor layer 11 and metal plates M1 and M2 installed in the waveguide F respectively. It has additional slots S1, S3 formed.

  Further, both end portions of the second conductor layer 12 are open ends, and a position closer to the center by a length of ¼ of the effective wavelength λ from each of the open ends and the center of each hole Slots S2 and S4 are provided at the matching positions. Further, the slots S2 and S4 have a rectangular shape having a long side and a short side, and each long side is formed in a direction orthogonal to the extending direction of the transmission line 12.

  Next, a method for producing the multilayer transmission line plate 1L will be described. First, a laminate (made by Hitachi Chemical Co., Ltd., trade name MCL-FX-2) in which copper foil is formed on both surfaces of the dielectric layer is prepared. By patterning the first conductor layer by etching, slots S2 and S4 having a width of 0.2 mm and a length of 2.2 mm are formed so as to penetrate only the copper foil serving as the conductor layer 11, and the second conductor layer is also formed. The transmission line 12 having a width of 220 μm is formed by patterning.

  Next, an additional slot is drilled in the metal plate, the outer shape is processed according to the opening size of the waveguide, and the metal plate is attached to the waveguide. Finally, the slots S1 and S2, and the centers of S3 and S4 are aligned and screwed to the transmission line plate.

[Comparative Example 2]
FIG. 10A shows a plan perspective view of the measurement multilayer transmission line plate 1M related to Comparative Example 2 for measuring the characteristics of the multilayer transmission line plate to be compared, as viewed from the conductor layer 13 side. FIG. 10B is a vertical sectional view taken along line FF in FIG. In FIG. 10 (b), the multilayer transmission line board 1M has a first conductor layer 11, a first dielectric layer 21, a second conductor layer 12, a second dielectric layer 22, and a third conductor layer 13 laminated in this order. ing. A waveguide F is connected to the lower portion of the first conductor layer 11.
In the multilayer transmission line board 1M, as shown in FIG. 10 (b), slots S1 and S3 penetrating only the first conductor layer 11 and slot slots S2 and S4 penetrating only the second conductor layer are provided. Have. The slot is a hole provided in the conductor.

  Further, both end portions of the third conductor layer 13 are open ends, and a position from the center by a length of ¼ of the effective wavelength λ from each of the open ends and the center of each hole. Slots S2 and S4 are provided at the matching positions. Further, the slots S2 and S4 have a rectangular shape having a long side and a short side, and each long side is formed in a direction orthogonal to the extending direction of the transmission line 13.

Next, a manufacturing method of the multilayer transmission line board 1M will be described.
First, a laminate (made by Hitachi Chemical Co., Ltd., trade name MCL-E-679) having copper foil formed on both surfaces of the dielectric layer is prepared. By patterning by etching, slots S2 and S4 having a width of 0.4 mm and a length of 2.2 mm are formed so as to penetrate only the copper foil serving as the conductor layer 12 to produce an inner layer circuit board.

  Next, a copper foil having a thickness of 12 μm (made by Mitsui Mining & Smelting Co., Ltd., trade name 3EC-VLP-12, surface roughness Rz: 3.0 μm) and a prepreg (made by Hitachi Chemical Co., Ltd., product) Name GFA-2, thickness 100 μm) and the above-mentioned inner circuit board are stacked in this order, and are laminated and integrated at a temperature of 180 ° C., a pressure of 3 MPa, and a time of 80 minutes. A plate 1M is produced.

  Finally, by patterning the upper and lower copper foils on the multilayer transmission line board 1M by etching, the transmission line 13 having a width of 220 μm is arranged at a position corresponding to the conductor pattern formed by the inner layer circuit board, and the conductive line is guided. A multilayer transmission line plate 1M having slots S1 and S3 arranged on the surface to which the wave tube is connected was manufactured. The sizes of the slots S1 and S3 are substantially the same as those of S2 and S4.

[Comparative Example 3]
FIG. 11A is a perspective plan view of the measurement multilayer transmission line plate 1N related to Comparative Example 3 for measuring the characteristics of the multilayer transmission line plate to be compared, as viewed from the conductor layer 13 side. FIG.11 (b) is a vertical sectional view which passes the GG line in Fig.11 (a). In FIG. 11B, the multilayer transmission line plate 1N includes fourth conductor layers 14a and 14b, a third dielectric layer 23, a first conductor layer 11, a first dielectric layer 21, a second conductor layer 12, and a second conductor layer. The dielectric layer 22 and the third conductor layer 13 are laminated in this order.
And in multilayer transmission line board 1N, both surfaces of a layered product (12, 21, 11) were etched, and slots S1-S4 were patterned. Further, after sandwiching the laminate (12, 21, 11) and laminating the dielectrics (22, 23) and the conductor layers (13, 14), the conductor layers 13, 14a, 14b on the surface are patterned by etching, and the multilayer A transmission line plate 1N was manufactured.

[Measurement result]
As described above, a waveguide is connected to a position corresponding to the hole and slot of the multilayer transmission line plate produced in Example 1, Example 2, Comparative Example 1, and Comparative Example 2, and a coaxial cable (manufactured by Agilent Technologies, Inc.). Then, power was supplied from a network analyzer (trade name HP8510C, manufactured by Agilent Technologies, Inc.) connected via a product name E7342), and transmission loss when passing through the multilayer transmission line plate was measured. In Example 3, Example 4, and Comparative Example 3, measurement was performed using a high-frequency probe instead of the waveguide.

  The results of measuring the characteristics to be measured as transmission loss are shown in FIGS. The characteristic shown in these graphs is a transmission loss between the input side (one hole) and the output side (the other hole) via the transmission line and the transmission line electromagnetic coupling structure.

  FIG. 14 is a graph showing the measurement results of the high frequency characteristics of Example 1 and Comparative Example 1 in comparison. In FIG. 14, G1 indicates a transmission loss between the input side and the output side in the first embodiment. R1 indicates the transmission loss between the input side and the output side in Comparative Example 1.

FIG. 15 is a graph showing the measurement results of the high frequency characteristics of Example 1, Example 2, and Comparative Example 2 in comparison. In FIG. 15, G1 indicates a transmission loss between the input side and the output side in the first embodiment. G2 indicates a transmission loss between the input side and the output side in the second embodiment. R2 represents the transmission loss between the input side and the output side in Comparative Example 2.
Table 1 below shows the characteristics at 71 GHz of Example 1, Example 2, Comparative Example 1, and Comparative Example 2 measured by connecting a waveguide.

FIG. 16 is a graph showing the measurement results of the high frequency characteristics of the example and the comparative example. In FIG. 16, G3 indicates the transmission loss between the input side and the output side in the third embodiment, and G4 indicates the transmission loss between the input side and the output side in the fourth embodiment. R3 indicates a transmission loss between the input side and the output side in the third comparative example. In addition, the characteristics at 71 GHz of Example 3, Example 4, and Comparative Example 3 measured using a probe are shown in Table 2 below.

[Discussion]
As shown in G1 shown in FIG. 14 or Table 1, the transmission loss of Example 1 is −7.12 dB, which is about the same as R1 shown in FIG. 14 or Comparative Example 1 shown in Table 1. It is.

  As shown in G1 shown in FIG. 15 or Table 1, the transmission loss of Example 1 is −7.12 dB, which is smaller than R2 shown in FIG. 15 or Comparative Example 2 shown in Table 1. . Moreover, the measurement result of G2 of FIG. 15 or Example 2 of Table 1 is −6.10 dB, which is smaller than Example 1.

  As shown in G3 shown in FIG. 16 or Table 2, the transmission loss of Example 3 is −2.59 dB, which is smaller than R3 shown in FIG. 16 or Comparative Example 3 shown in Table 2. . Moreover, the measurement result of Example 4 of Table 2 is -2.70 dB, and is the same level as Example 3.

  From the above-described measurement results, it is possible to manufacture a general multilayer transmission line plate without using a specially processed waveguide, and a simple transmission line electromagnetic coupling structure can be obtained. Moreover, conversion loss can be made smaller than the structure using the slot formed in the multilayer transmission line board.

Further, in the structures shown in Example 3 and Comparative Example 3, the characteristics when the same microstrip antenna 5 was connected were compared. FIG. 12 shows a modified structure of the third embodiment. FIG. 12A is an exploded perspective view of a modified structure of the transmission line plate 1J shown in the third embodiment. FIG. 12B is a vertical sectional view taken along the line HH in FIG. In FIG. 12B, the modified structure of the multilayer transmission line plate 1J includes a fourth conductor layer 14, a third dielectric layer 23, a first conductor layer 11, a first dielectric layer 21, a second conductor layer 12, The two dielectric layers 22 and the third conductor layer 13 are laminated in this order, and the microstrip antenna 5 is connected to the end of the third conductor layer 13.
FIG. 13 shows a modified structure of Comparative Example 3. FIG. 13A is an exploded perspective view of a modified structure of the multilayer transmission line plate 1N shown in Comparative Example 3. FIG. FIG. 13B is a vertical sectional view taken along line GG in FIG. In FIG. 13B, the deformed structure of the multilayer transmission line plate 1N includes a fourth conductor layer 14, a third dielectric layer 23, a first conductor layer 11, a first dielectric layer 21, a second conductor layer 12, Two dielectric layers 22 and a third conductor layer 13 are laminated in this order.

  Then, power is supplied in each of the modifications shown in FIGS. 12 and 13, and the supplied power propagates through the transmission line 14, the electromagnetic coupling structure, and the transmission line 15, and reaches the end of the transmission line 15. The emission power when emitted from the connected square microstrip antenna 5 having a side of 1 mm was calculated and compared. For power radiation calculation, an electromagnetic field simulator (finite element method) was used.

The results of calculating the gain of the microstrip antenna 5 at 71 GHz are shown in Table 3 below.

  From the results of Table 3, it can be seen that even when the microstrip antenna 5 having the same characteristics is connected, better characteristics can be obtained than in the conventional structure using the slot structure. That is, a transmission line electromagnetic coupling structure that can be manufactured in a general multilayer transmission line board manufacturing process and has a simple structure, a multilayer transmission line board having this electromagnetic coupling structure, an antenna integrated high-frequency module, and the like are obtained. Can do.

[Modification of Embodiment]
The multilayer transmission line plate having an electromagnetic coupling structure according to the embodiment of the present invention, the electromagnetic coupling module having the multilayer transmission line plate, and the antenna module have many modifications in addition to the above-described embodiments. Hereinafter, systematic examples including the above-described embodiments will be given.

[C1]
FIG. 17 shows a cross-sectional configuration of an electromagnetic coupling module according to an embodiment of the present invention. In FIG. 17, the electromagnetic coupling module includes a fifth conductor layer 15, a fourth dielectric layer 24, a fourth conductor layer 14, a third dielectric layer 23, a first conductor layer 11, a first dielectric layer 21, and a second dielectric layer. The conductor layer 12, the second dielectric layer 22, and the third conductor layer 13 are laminated in this order, and the semiconductor chip D is connected to the lower portion of the patterned fifth conductor layer 15 via the connection member 89.

  That is, the electromagnetic coupling module shown in FIG. 17 is an electromagnetic coupling module having an electromagnetic coupling structure between a transmission line of a semiconductor chip with a built-in antenna and a multilayer transmission line plate used in the microwave band, and between the conductor layers. A laminated body in which dielectric layers and conductor layers are alternately sandwiched, and an outer conductor layer in which a dielectric is further sandwiched on the laminated body, and has a hole extending through the laminated body By forming a tubular metal film in the hole, the conductor layers on the surface of the laminate are electrically connected to each other, and the antenna of the semiconductor chip is disposed at a position corresponding to the hole. The outer conductor layer and the semiconductor chip are electromagnetically coupled.

[C2]
FIG. 18 shows a cross-sectional configuration of an electromagnetic coupling module according to another embodiment of the present invention. In FIG. 18, in the electromagnetic coupling module, the first conductor layer 11, the first dielectric layer 21, the second conductor layer 12, the second dielectric layer 22, and the third conductor layer 13 are laminated and patterned in this order. A semiconductor chip D is connected to the lower portion of the first conductor layer 11 via a connection member 89.

  That is, the electromagnetic coupling module shown in FIG. 18 is an electromagnetic coupling module having an electromagnetic coupling structure between a transmission line of a semiconductor chip with a built-in antenna and a multilayer transmission line plate used in a microwave band, and between the conductor layers. A laminated body laminated with a dielectric layer in between, and an outer conductor layer laminated on the laminated body with a dielectric further sandwiched, wherein a hole is provided so as to penetrate the laminated body, and the hole By forming a tubular metal film inside, the conductor layers on the surface of the laminate are electrically connected to each other, and an antenna of the semiconductor chip is disposed at a position corresponding to the hole, so that the outer conductor layer and the semiconductor chip are arranged. And are electromagnetically coupled.

[C3]
FIG. 19 shows a cross-sectional configuration of an electromagnetic coupling module according to another embodiment of the present invention. In FIG. 19, the electromagnetic coupling module includes a fifth conductor layer 15, a fourth dielectric layer 24, a fourth conductor layer 14, a third dielectric layer 23, a first conductor layer 11, a first dielectric layer 21, and a second dielectric layer. The conductor layer 12, the second dielectric layer 22, and the third conductor layer 13 are laminated in this order, and the triplate line C is connected to the lower part of the fifth conductor layer 15.

  That is, the electromagnetic coupling module shown in FIG. 19 is an electromagnetic coupling module having an electromagnetic coupling structure between a transmission line of a triplate line and a multilayer transmission line plate used in a microwave band, and a dielectric layer between conductor layers. A laminate formed by alternately sandwiching body layers and conductor layers, and an outer conductor layer laminated by further sandwiching a dielectric on the laminate, and a hole is formed so as to penetrate the laminate. By forming a tubular metal film in the hole, the conductor layers on the surface of the laminate are electrically connected to each other, and the center of the hole and the center of the opening of the triplate line are made to coincide with each other. By arranging, the outer conductor layer and the triplate line are electromagnetically coupled.

[C4]
FIG. 20 shows a cross-sectional configuration of an electromagnetic coupling module according to another embodiment of the present invention. In FIG. 20, the electromagnetic coupling module includes a first conductor layer 11, a first dielectric layer 21, a second conductor layer 12, a second dielectric layer 22, and a third conductor layer 13 laminated in this order, A triplate line C is connected to the lower part of the layer 11.

  That is, the electromagnetic coupling module shown in FIG. 20 is an electromagnetic coupling module having an electromagnetic coupling structure between a transmission line of a triplate line and a multilayer transmission line plate used in the microwave band, and a dielectric layer between the conductor layers. A laminated body that is laminated with a body layer interposed therebetween, and an outer conductor layer that is laminated on the laminated body with a dielectric interposed therebetween, and a hole is provided so as to penetrate the laminated body, By forming a tubular metal film on the outer surface, the conductor layers on the surface of the multilayer body are electrically connected to each other, and the center of the hole and the center of the opening of the triplate line are arranged to coincide with each other. The conductor layer and the triplate line are electromagnetically coupled.

[C5]
FIG. 21 shows a cross-sectional configuration of an electromagnetic coupling module according to another embodiment of the present invention. In FIG. 21, the electromagnetic coupling module includes a fifth conductor layer 15, a fourth dielectric layer 24, a fourth conductor layer 14, a third dielectric layer 23, a first conductor layer 11, a first dielectric layer 21, and a second dielectric layer. The conductor layer 12, the second dielectric layer 22, and the third conductor layer 13 are laminated in this order, and the waveguide F is connected to the lower portion of the fifth conductor layer 15.

  That is, the electromagnetic coupling module shown in FIG. 21 is an electromagnetic coupling module having an electromagnetic coupling structure between a transmission line of a waveguide and a multilayer transmission line plate used in a microwave band, and a dielectric layer between conductor layers. A laminate formed by alternately sandwiching body layers and conductor layers, and an outer conductor layer laminated by further sandwiching a dielectric on the laminate, and a hole is formed so as to penetrate the laminate. By forming a tubular metal film in the hole, the conductor layers on the surface of the multilayer body are electrically connected to each other, and the center of the hole and the center of the opening of the waveguide are aligned with each other. By arranging, the outer conductor layer and the waveguide are electromagnetically coupled.

[C6]
FIG. 22 shows a cross-sectional configuration of an electromagnetic coupling module according to another embodiment of the present invention. In FIG. 22, the electromagnetic coupling module includes a first conductor layer 11, a first dielectric layer 21, a second conductor layer 12, a second dielectric layer 22, and a third conductor layer 13 laminated in this order, A waveguide F is connected to the lower part of the layer 11.

  That is, the electromagnetic coupling module shown in FIG. 22 is an electromagnetic coupling module having an electromagnetic coupling structure between a transmission line of a waveguide and a multilayer transmission line plate used in a microwave band, and a dielectric layer between conductor layers. A laminated body that is laminated with a body layer interposed therebetween, and an outer conductor layer that is laminated on the laminated body with a dielectric interposed therebetween, and a hole is provided so as to penetrate the laminated body, By forming a tubular metal film on the outer surface, the conductor layers on the surface of the multilayer body are electrically connected to each other, and the center of the hole and the center of the opening of the waveguide are aligned with each other. The conductor layer and the waveguide are electromagnetically coupled.

[C7]
Another modification is a multilayer transmission line plate excluding the semiconductor chip D in the electromagnetic coupling module shown in FIG.
That is, a multilayer transmission line plate used in a microwave band, wherein a laminated body in which a dielectric layer and a conductive layer are alternately sandwiched between conductor layers, and a dielectric is further provided on the laminated body. An outer conductor layer sandwiched and laminated, and a hole is provided so as to penetrate the laminate, and a tubular metal film is formed in the hole to electrically connect the conductor layers on the surface of the laminate. And a semiconductor chip mounting pattern having an antenna built therein can be arranged at a position corresponding to the hole.

[C8]
Another modification is a multilayer transmission line plate excluding the semiconductor chip D from the electromagnetic coupling module shown in FIG.
That is, a multilayer transmission line plate used in a microwave band, a laminate in which a dielectric layer is sandwiched between conductor layers, and a conductor in which a dielectric is further sandwiched on the laminate A layer is formed, and a hole is provided so as to penetrate the multilayer body, and a tubular metal film is formed in the hole to electrically connect the conductor layers on the surface of the multilayer body. The semiconductor chip mounting pattern with the built-in antenna can be arranged at a position corresponding to.

[C9]
Another modification is a multilayer transmission line plate excluding the triplate line C in the electromagnetic coupling module shown in FIG.
That is, a multilayer transmission line plate used in a microwave band, wherein a laminated body in which a dielectric layer and a conductive layer are alternately sandwiched between conductor layers, and a dielectric is further provided on the laminated body. An outer conductor layer sandwiched and laminated, and a hole is provided so as to penetrate the laminate, and a tubular metal film is formed in the hole to electrically connect the conductor layers on the surface of the laminate. And the triplate line mounting hole can be arranged so that the centers of the hole and the triplate line opening coincide with each other.

[C10]
Another modification is a multilayer transmission line plate excluding the triplate line C in the electromagnetic coupling module shown in FIG.
That is, a multilayer transmission line plate used in a microwave band, which is a laminate in which a dielectric layer is sandwiched between conductor layers, and an outer side in which a dielectric is further sandwiched on the laminate. A conductor layer, and a hole is provided so as to penetrate the laminate, and by forming a tubular metal film in the hole, the conductor layers on the surface of the laminate are electrically connected to each other, The triplate line mounting hole is configured to be arranged so that the centers of the hole and the triplate line opening coincide with each other.

[C11]
Another modification is a multilayer transmission line plate excluding the waveguide F in the electromagnetic coupling module shown in FIG.
That is, a multilayer transmission line plate used in a microwave band, wherein a laminated body in which a dielectric layer and a conductive layer are alternately sandwiched between conductor layers, and a dielectric is further provided on the laminated body. An outer conductor layer sandwiched and laminated, and a hole is provided so as to penetrate the laminate, and a tubular metal film is formed in the hole to electrically connect the conductor layers on the surface of the laminate. The waveguide mounting holes can be arranged so that the centers of the holes and the opening of the waveguide coincide with each other.

[C12]
Another modification is a multilayer transmission line plate excluding the waveguide F in the electromagnetic coupling module shown in FIG.
That is, a multilayer transmission line plate used in a microwave band, which is a laminate in which a dielectric layer is sandwiched between conductor layers, and an outer side in which a dielectric is further sandwiched on the laminate. A conductor layer, and a hole is provided so as to penetrate the laminate, and by forming a tubular metal film in the hole, the conductor layers on the surface of the laminate are electrically connected to each other, The waveguide mounting hole can be arranged so that the centers of the hole and the opening of the waveguide coincide with each other.

[C13]
FIG. 23 shows an antenna module according to another embodiment of the present invention. 23, the antenna module includes a sixth conductor layer 16, a fifth dielectric layer 25, a fifth conductor layer 15, a fourth dielectric layer 24, a fourth conductor layer 14, a third dielectric layer 23, and a first conductor. The layer 11, the first dielectric layer 21, the second conductor layer 12, the second dielectric layer 22, and the third conductor layer 13 are laminated in this order, and the microstrip antenna 5 is connected to the tip of the third conductor layer 13. The passive component E is mounted on the upper part of the patterned third conductor layer, and the semiconductor chip D is connected to the lower part of the patterned sixth conductor layer 16 via the connection member 89.

  That is, the antenna module shown in FIG. 23 is an antenna module used in a microwave band, and a laminate in which dielectric layers and conductor layers are alternately sandwiched between conductor layers, and the laminate It has an outer conductor layer with a dielectric layer sandwiched between the top and bottom of the body, one outer conductor layer has a transmission line and a microstrip antenna, and the other outer conductor layer has a transmission line and a semiconductor chip mounted And a semiconductor chip formed with a microwave circuit mounted thereon, and a hole is provided so as to penetrate the laminate, and a tubular metal film is formed in the hole, By electrically connecting the conductor layers on the surface of the multilayer body, the outer conductor layers are electromagnetically coupled, and the semiconductor chip and the microstrip antenna are connected.

[C14]
Another modification is the antenna module shown in FIG. 4 and has already been described.

[C15]
FIG. 24 shows an antenna module according to another embodiment of the present invention. 24, the antenna module includes a fifth conductor layer 15, a fourth dielectric layer 24, a fourth conductor layer 14, a third dielectric layer 23, a first conductor layer 11, a first dielectric layer 21, and a second conductor. The layer 12, the second dielectric layer 22, and the third conductor layer 13 are laminated in this order, the microstrip antenna 5 is connected to the tip of the third conductor layer 13, and the upper part of the patterned third conductor layer is The passive component E is mounted, and the semiconductor chip D and the passive component E are connected to the lower part of the patterned fifth conductor layer 15 via the connection member 89.

  That is, the antenna module shown in FIG. 24 is an antenna module used in a microwave band, and a laminate in which dielectric layers and conductor layers are alternately sandwiched between conductor layers, and the laminate And a transmission line laminated with a dielectric sandwiched on the body and an outer conductor layer having a microstrip antenna, and a hole is provided so as to penetrate the laminated body, and a tubular metal film is formed in the hole. By forming, electrically connecting the conductor layers on the surface of the laminate, and mounting a semiconductor chip incorporating the antenna at a position corresponding to the hole, the outer conductor layer and the antenna are inserted through the hole. The built-in semiconductor chip is electromagnetically coupled, whereby the semiconductor chip with built-in antenna and the microstrip antenna are connected.

[C16]
Another modification is the antenna module shown in FIG. 3A, which has already been described.

[C17]
FIG. 25 shows an antenna module according to another embodiment of the present invention. 25, the antenna module includes a fifth conductor layer 15, a fourth dielectric layer 24, a fourth conductor layer 14, a third dielectric layer 23, a first conductor layer 11, a first dielectric layer 21, and a second conductor. The layer 12, the second dielectric layer 22, and the third conductor layer 13 are laminated in this order. The microstrip antenna 5 is connected to the tip of the third conductor layer 13, and is formed on the patterned third conductor layer 13. Is connected to a passive component E, and a triplate line C is connected to the lower portion of the fifth conductor layer 15.

  That is, the antenna module shown in FIG. 25 is an antenna module used in a microwave band, and a laminate in which dielectric layers and conductor layers are alternately sandwiched between conductor layers, and the laminate And a transmission line laminated with a dielectric sandwiched on the body and an outer conductor layer having a microstrip antenna, and a hole is provided so as to penetrate the laminated body, and a tubular metal film is formed in the hole. By forming the electrical connection between the conductor layers on the surface of the laminate, and arranging the opening of the triplate line at a position corresponding to the hole, the outer conductor layer and the triplate line are electromagnetically coupled. Thus, the triplate line and the microstrip antenna are connected.

[C18]
Another modification is the antenna module shown in FIG. 3B, which has already been described.

[C19]
FIG. 26 shows an antenna module according to another embodiment of the present invention. 26, the antenna module includes a fifth conductor layer 15, a fourth dielectric layer 24, a fourth conductor layer 14, a third dielectric layer 23, a first conductor layer 11, a first dielectric layer 21, and a second conductor. The layer 12, the second dielectric layer 22, and the third conductor layer 13 are laminated in this order. The microstrip antenna 5 is connected to the tip of the third conductor layer 13, and is formed on the patterned third conductor layer 13. Is connected to a passive component E, and a waveguide F is connected to the lower portion of the fifth conductor layer 15.

  That is, the antenna module shown in FIG. 26 is an antenna module used in a microwave band, and is a laminate in which dielectric layers and conductor layers are alternately sandwiched between conductor layers, and the laminate And a transmission line laminated with a dielectric sandwiched on the body and an outer conductor layer having a microstrip antenna, and a hole is provided so as to penetrate the laminated body, and a tubular metal film is formed in the hole. By electrically connecting the conductor layers on the surface of the laminate, and arranging the opening of the waveguide at a position corresponding to the hole, the outer conductor layer and the waveguide are electromagnetically coupled. Thus, the waveguide and the microstrip antenna are connected to each other.

[C20]
Another modification is the antenna module shown in FIG. 3C, which has already been described.

DESCRIPTION OF SYMBOLS 1 Multilayer transmission line board 11 1st conductor layer 12 2nd conductor layer 13 3rd conductor layer 14 4th conductor layer 15 5th conductor layer 16 6th conductor layer 21 1st dielectric layer 22 2nd dielectric layer 23 3rd Dielectric layer 24 Fourth dielectric layer 25 Fifth dielectric layer 3 Tubular metal film 4 Dielectric 5 Microstrip antenna (patch pattern)
6 Conductor patch 7 Mounting hole C Triplate line D Semiconductor chip E Passive component F Waveguide S Slot

Claims (35)

  An electromagnetic coupling module having an electromagnetic coupling structure between a semiconductor chip with a built-in antenna and a transmission line of a multilayer transmission line plate used in a microwave band, wherein dielectric layers and conductive layers are alternately sandwiched between conductive layers A laminated body and an outer conductor layer laminated with a dielectric sandwiched on the laminated body, and a hole is provided so as to penetrate the laminated body, and a tubular metal film is formed in the hole. By electrically connecting the conductor layers on the surface of the multilayer body and disposing the semiconductor chip antenna at a position corresponding to the hole, the outer conductor layer and the semiconductor chip are electromagnetically coupled. A transmission line electromagnetic coupling module characterized by the above.   An electromagnetic coupling module having an electromagnetic coupling structure between a semiconductor chip with a built-in antenna used in a microwave band and a transmission line of a multilayer transmission line plate, and a laminate in which a dielectric layer is sandwiched between conductor layers; An outer conductor layer laminated with a dielectric sandwiched on the laminate, and a hole is provided so as to penetrate the laminate, and a tubular metal film is formed in the hole, A transmission line characterized in that the outer conductor layer and the semiconductor chip are electromagnetically coupled by electrically connecting the conductor layers on the surface of the laminate and disposing an antenna of the semiconductor chip at a position corresponding to the hole. Electromagnetic coupling module.   An electromagnetic coupling module having an electromagnetic coupling structure between a transmission line of a triplate line and a multilayer transmission line plate used in a microwave band, wherein a dielectric layer and a conductor layer are alternately sandwiched between conductor layers. A laminated body and an outer conductor layer laminated with a dielectric sandwiched on the laminated body, and a hole is provided so as to penetrate the laminated body, and a tubular metal film is formed in the hole. By forming the electrical connection between the conductor layers on the surface of the multilayer body and arranging the center of the hole and the center of the opening of the triplate line to coincide, the outer conductor layer and the triplate line are arranged. And an electromagnetic coupling module of a transmission line, characterized in that and are electromagnetically coupled.   An electromagnetic coupling module having an electromagnetic coupling structure between a transmission line of a triplate line and a multilayer transmission line plate used in a microwave band, and a laminate in which a dielectric layer is sandwiched between conductor layers; An outer conductor layer that is further laminated with a dielectric sandwiched on the laminate, and a hole is provided so as to penetrate the laminate, and a tubular metal film is formed in the hole, The conductor layers on the surface of the laminate are electrically connected to each other, and the outer conductor layer and the triplate line are electromagnetically coupled by arranging the center of the hole and the center of the opening of the triplate line so as to coincide with each other. A transmission line electromagnetic coupling module characterized by the above.   An electromagnetic coupling module having an electromagnetic coupling structure between a transmission line of a waveguide and a multilayer transmission line plate used in a microwave band, wherein dielectric layers and conductive layers are alternately sandwiched between conductive layers. A laminated body and an outer conductor layer laminated with a dielectric sandwiched on the laminated body, and a hole is provided so as to penetrate the laminated body, and a tubular metal film is formed in the hole. By forming the conductor layers on the surface of the laminate, the conductor layers are electrically connected to each other, and the center of the hole and the center of the opening of the waveguide are aligned with each other. And an electromagnetic coupling module of a transmission line, characterized in that and are electromagnetically coupled.   An electromagnetic coupling module having an electromagnetic coupling structure between a transmission line of a waveguide and a multilayer transmission line plate used in a microwave band, and a laminate in which a dielectric layer is sandwiched between conductor layers; An outer conductor layer laminated with a dielectric sandwiched on the laminate, and a hole is provided so as to penetrate the laminate, and a tubular metal film is formed in the hole, The outer conductor layer and the waveguide are electromagnetically coupled by electrically connecting the conductor layers on the surface of the laminated body and arranging the center of the hole and the center of the opening of the waveguide to coincide with each other. A transmission line electromagnetic coupling module characterized by the above.   A multilayer transmission line plate used in a microwave band, wherein a laminated body in which a dielectric layer and a conductive layer are alternately sandwiched between conductor layers, and a dielectric is further sandwiched on the laminated body An outer conductor layer laminated, and a hole is provided so as to penetrate the laminate, and a tubular metal film is formed in the hole to electrically connect the conductor layers on the surface of the laminate. A multilayer transmission line board comprising a semiconductor chip mounting pattern which is connected and can be disposed at a position corresponding to the hole.   A multilayer transmission line plate used in a microwave band, wherein a laminate is formed by sandwiching a dielectric layer between conductor layers, and a conductor layer is formed by further sandwiching a dielectric on the laminate. And forming a tubular metal film in the hole to electrically connect the conductor layers on the surface of the multilayer body and to correspond to the hole. A multilayer transmission line board characterized in that a semiconductor chip mounting pattern with a built-in antenna can be arranged at a position to be mounted.   A multilayer transmission line plate used in a microwave band, wherein a laminated body in which a dielectric layer and a conductive layer are alternately sandwiched between conductor layers, and a dielectric is further sandwiched on the laminated body An outer conductor layer laminated, and a hole is provided so as to penetrate the laminate, and a tubular metal film is formed in the hole to electrically connect the conductor layers on the surface of the laminate. A multi-layer transmission line board, characterized in that the triplate line mounting holes can be arranged so as to be connected so that the centers of the holes and the triplate line openings coincide.   A multilayer transmission line plate used in a microwave band, wherein a laminated body having a dielectric layer sandwiched between conductor layers, and an outer conductor layer laminated by further sandwiching a dielectric on the laminated body And a hole is provided so as to penetrate the laminate, and a conductive metal layer on the surface of the laminate is electrically connected by forming a tubular metal film in the hole, and the hole and A multilayer transmission line board characterized in that a triplate line mounting hole can be arranged so that the center of the opening is aligned with the center of the triplate line opening.   A multilayer transmission line plate used in a microwave band, wherein a laminated body in which a dielectric layer and a conductive layer are alternately sandwiched between conductor layers, and a dielectric is further sandwiched on the laminated body An outer conductor layer laminated, and a hole is provided so as to penetrate the laminate, and a tubular metal film is formed in the hole to electrically connect the conductor layers on the surface of the laminate. A multilayer transmission line plate, characterized in that it is connected and a waveguide mounting hole can be arranged so that the centers of the hole and the opening of the waveguide coincide with each other.   A multilayer transmission line plate used in a microwave band, wherein a laminated body having a dielectric layer sandwiched between conductor layers, and an outer conductor layer laminated by further sandwiching a dielectric on the laminated body And a hole is provided so as to penetrate the laminate, and a conductive metal layer on the surface of the laminate is electrically connected by forming a tubular metal film in the hole, and the hole and A multilayer transmission line board, wherein a waveguide mounting hole can be arranged so that the center of the waveguide is coincident with an opening of the waveguide.   An antenna module for use in a microwave band, in which a dielectric body and a conductor layer are alternately sandwiched between conductor layers, and a dielectric is further sandwiched between the top and bottom of the laminate. It has an outer conductor layer, one outer conductor layer has a transmission line and a microstrip antenna, and the other outer conductor layer has a pattern for mounting a transmission line and a semiconductor chip, and a microwave mounted on the pattern. A semiconductor chip on which a circuit is formed, and a hole is provided so as to penetrate the laminate, and a tubular metal film is formed in the hole to electrically connect the conductor layers on the surface of the laminate. By connecting, the outer conductor layers are electromagnetically coupled to each other, and the semiconductor chip and the microstrip antenna are connected.   An antenna module for use in a microwave band, which is a laminate in which a dielectric layer is sandwiched between conductor layers, and an outer dielectric layer and an outer layer in which a dielectric is further sandwiched above and below the laminate. A conductor layer, one outer conductor layer having a transmission line and a microstrip antenna, and the other outer conductor layer having a pattern for mounting a transmission line and a semiconductor chip, and a microwave circuit mounted thereon A semiconductor chip formed with a hole, and a hole is provided so as to penetrate the multilayer body, and a tubular metal film is formed in the hole to electrically connect the conductor layers on the surface of the multilayer body By doing so, the outer conductor layers are electromagnetically coupled to each other, and the semiconductor chip and the microstrip antenna are connected.   An antenna module for use in a microwave band, in which a dielectric layer and a conductor layer are alternately sandwiched between conductor layers, and a dielectric is further sandwiched on the laminate. A transmission line and an outer conductor layer having a microstrip antenna, wherein a hole is provided so as to penetrate the multilayer body, and a tubular metal film is formed in the hole, whereby a conductor on the surface of the multilayer body is formed. By electrically connecting the layers and mounting a semiconductor chip incorporating an antenna at a position corresponding to the hole, the outer conductor layer and the semiconductor chip incorporating the antenna are electromagnetically coupled through the hole. An antenna module characterized by connecting a semiconductor chip with a built-in antenna and a microstrip antenna.   An antenna module for use in a microwave band, in which a dielectric layer is sandwiched between conductor layers, and a transmission line and a microstrip that are further laminated with a dielectric layer sandwiched on the multilayer body An outer conductor layer having an antenna, and a hole is provided so as to penetrate the laminate, and a tubular metal film is formed in the hole to electrically connect the conductor layers on the surface of the laminate. By connecting and mounting a semiconductor chip with a built-in antenna at a position corresponding to the hole, the outer conductor layer and the semiconductor chip with a built-in antenna are electromagnetically coupled through the hole, whereby the semiconductor chip with a built-in antenna and the microchip An antenna module characterized by connecting a strip antenna.   An antenna module for use in a microwave band, in which a dielectric layer and a conductor layer are alternately sandwiched between conductor layers, and a dielectric is further sandwiched on the laminate. A transmission line and an outer conductor layer having a microstrip antenna, wherein a hole is provided so as to penetrate the multilayer body, and a tubular metal film is formed in the hole, whereby a conductor on the surface of the multilayer body is formed. The layers are electrically connected to each other, and the opening portion of the triplate line is disposed at a position corresponding to the hole, so that the outer conductor layer and the triplate line are electromagnetically coupled, whereby the triplate line and the microstrip antenna are coupled. An antenna module characterized by connecting to the antenna module.   An antenna module for use in a microwave band, which is a laminate in which a dielectric layer is sandwiched between conductor layers, and a transmission line and a microstrip antenna in which a dielectric is further sandwiched on the laminate. An outer conductor layer having a hole, and a hole is provided so as to penetrate the multilayer body, and a tubular metal film is formed in the hole to electrically connect the conductor layers on the surface of the multilayer body And, by arranging the opening of the triplate line at a position corresponding to the hole, the outer conductor layer and the triplate line are electromagnetically coupled, thereby connecting the triplate line and the microstrip antenna. An antenna module.   An antenna module for use in a microwave band, in which a dielectric layer and a conductor layer are alternately sandwiched between conductor layers, and a dielectric is further sandwiched on the laminate. A transmission line and an outer conductor layer having a microstrip antenna, wherein a hole is provided so as to penetrate the multilayer body, and a tubular metal film is formed in the hole, whereby a conductor on the surface of the multilayer body is formed. By electrically connecting the layers and arranging the opening of the waveguide at a position corresponding to the hole, the outer conductor layer and the waveguide are electromagnetically coupled, thereby the waveguide and the microstrip antenna. An antenna module characterized by connecting to the antenna module.   An antenna module for use in a microwave band, which is a laminate in which a dielectric layer is sandwiched between conductor layers, and a transmission line and a microstrip antenna in which a dielectric is further sandwiched on the laminate. An outer conductor layer having a hole, and a hole is provided so as to penetrate the multilayer body, and a tubular metal film is formed in the hole to electrically connect the conductor layers on the surface of the multilayer body And, by arranging the opening of the waveguide at a position corresponding to the hole, the outer conductor layer and the waveguide are electromagnetically coupled, thereby connecting the waveguide and the microstrip antenna. An antenna module.   The electromagnetic coupling module for a transmission line according to any one of claims 1 to 6, wherein a tubular metal film in the hole is formed by plating.   The transmission line according to any one of claims 1 to 6, wherein the tubular metal film is filled with a dielectric satisfying at least one of a relative dielectric constant of 2 to 30 and a dielectric loss tangent of 0 to 0.03 at 10 GHz. Electromagnetic coupling module.   The transmission line electromagnetic coupling module according to claim 1, wherein the tubular metal film is filled with air.   The transmission according to any one of claims 1 to 6, wherein a width of a hole in a direction orthogonal to an extending direction of a conductor layer laminated with a dielectric on the laminated body is equal to or less than a wavelength of a frequency to be used. Line electromagnetic coupling module.   The electromagnetic coupling module for a transmission line according to any one of claims 1 to 6, wherein a patch pattern is disposed at an end portion of a conductor layer laminated on the laminated body with a dielectric interposed therebetween.   The multilayer transmission line board according to any one of claims 7 to 12, wherein a tubular metal film in the hole is formed by plating.   The multilayer transmission according to any one of claims 7 to 12, wherein the tubular metal film is filled with a dielectric that satisfies at least one of a relative dielectric constant of 2 to 30 and a dielectric loss tangent of 0 to 0.03 at 10 GHz. Line board.   The multilayer transmission line board according to any one of claims 7 to 12, wherein the tubular metal film is filled with air.   The multilayer according to any one of claims 7 to 12, wherein a width of a hole in a direction orthogonal to an extending direction of a conductor layer laminated with a dielectric on the laminated body is equal to or less than a wavelength of a frequency to be used. Transmission line board.   The multilayer transmission line board according to any one of claims 7 to 12, wherein a patch pattern is disposed at an end portion of a conductor layer laminated on the laminated body with a dielectric interposed therebetween.   The antenna module according to any one of claims 13 to 20, wherein a tubular metal film in the hole is formed by plating.   The antenna module according to any one of claims 13 to 20, wherein the tubular metal film is filled with a dielectric satisfying at least one of a relative dielectric constant of 2 to 30 and a dielectric loss tangent of 0 to 0.03 at 10 GHz. .   The antenna module according to any one of claims 13 to 20, wherein the tubular metal film is filled with air.   The antenna according to any one of claims 13 to 20, wherein a width of a hole in a direction orthogonal to an extending direction of a conductor layer laminated with a dielectric on the laminated body is equal to or less than a wavelength of a frequency to be used. module.   The antenna module according to any one of claims 13 to 20, wherein a patch pattern is disposed at an end of a conductor layer laminated on the laminated body with a dielectric interposed therebetween.

Images