JP2013058579A - Linear light source module and mounting board used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting board capable of linearly positioning a plurality of LEDs with accuracy.SOLUTION: A mounting board 10 comprises: a base material part 11 having a main surface; and a first conductive pattern 12A and a pair of second conductive patterns 12B, 12C provided on the main surface of the base material part 11. A plurality of LEDs 20 are linearly mounted on a surface of the first conductive pattern 12A toward a predetermined direction, and second conductive patterns 12B, 12C contain parts serving as alignment marks for determining mounting positions for each of a plurality of LEDs 20. The pair of second conductive patterns 12B, 12C are positioned on the main surface of the base material part 11 along a direction crossing the predetermined direction so as to sandwich the first conductive pattern 12A, and each of them comprises a plurality of arris parts for alignment arranged to face to the first conductive pattern 12A along the direction crossing the predetermined direction on the main surface of the base material part 11.

Description

  The present invention relates to a linear light source module in which a plurality of light emitting elements are linearly mounted on a mounting substrate along a predetermined direction, and a mounting substrate used for the linear light source module.

  Conventionally, a linear light source module is known as a light source module used for various display devices, illumination devices, and the like. The linear light source module is a light source module in which light emitting elements such as LEDs (Light Emitting Diodes) are linearly arranged along a predetermined direction.

  The linear light source module surrounds the plurality of light emitting elements so that light emitted from the plurality of light emitting elements arranged in a line is efficiently incident on a light guide means such as a light guide plate. Thus, a frame-like reflector is often provided.

  For example, in Japanese Patent Application Laid-Open No. 2004-265978 (Patent Document 1), a mounting board, a plurality of LEDs arranged in a line on the mounting board, and a mounting board so as to surround the LEDs are arranged. A linear light source module including a frame-like reflector is disclosed.

  In this type of linear light source module, it is important to suppress unevenness in the irradiance distribution of the emitted light. For this purpose, the positioning of the above-described reflector and the plurality of light emitting elements should be increased. It is necessary to carry out with accuracy. In order to realize this, one solution is to manage the mounting position of the reflector with respect to the mounting board and the mounting position of the light emitting element with respect to the mounting board individually and accurately.

  Here, the positioning of the mounting position of the reflector with respect to the mounting board is, for example, as disclosed in Patent Document 1 described above, in which a reference hole is provided in each of the mounting board and the reflector, and these reference holes are matched. This can be done by inserting a pin into this. In addition to this, the reflector can be formed on the mounting substrate by injection molding (that is, outsert molding) or the like so that the positioning can be performed with high accuracy.

  On the other hand, positioning of the mounting position of the light emitting element with respect to the mounting board is performed by providing an alignment mark on the mounting board in advance and picking up an image using an imaging means represented by a CCD camera or the like, and binarizing the picked up image This can be done by mounting the light emitting element with reference to the alignment mark detected.

  For example, in JP-A-11-109184 (Patent Document 2), an opening-shaped alignment mark is provided in advance on a resist film having etching resistance provided on a mounting substrate, and the opening-shaped alignment mark is provided. It is described that the mounting position of the light emitting element with respect to the mounting board can be positioned with high accuracy by detecting using the above-described imaging means and mounting the light emitting element on the mounting board with reference to the edge portion of the alignment mark. Has been.

  If the method disclosed in Patent Document 2 is adopted, an opening provided in the resist film is used as an alignment mark, and therefore the step of the edge to be detected can be reduced. As a result, fluctuation at the edge portion is reduced, and detection accuracy can be improved.

JP 2004-265978 A Japanese Patent Laid-Open No. 11-109184

  By the way, in the linear light source module used for various display devices and illumination devices as described above, a white resist is used as a resist film having etching resistance in order to prevent the color from being transferred to the emitted light. It is common for membranes to be used. Here, since the white resist film is formed by curing a white resist agent in which fine particles are kneaded in a base material in order to obtain a high reflectance, the white resist film is assumed to have an opening shape alignment mark. In the case of forming the edge, the presence of the fine particles causes the edge portion to have a jagged shape.

  Therefore, when the method as disclosed in Patent Document 2 described above is applied to these linear light source modules, the linearity is not sufficiently reproduced when the edge portion of the alignment mark is viewed in plan view. As a result, there arises a problem that the detection accuracy of the edge portion is greatly lowered.

  In general, an optical element is often mounted on a conductive pattern provided on a mounting board in order to achieve electrical conduction or to ensure heat dissipation. However, since the resist film is formed in a process different from that of the conductive pattern, the resist film may be displaced with respect to the conductive pattern.

  Therefore, the method as disclosed in Patent Document 2 described above is a linear light source in which a light emitting element is mounted on a conductive pattern in consideration of the possibility that a positional shift between the conductive pattern and the resist film occurs. In the first place, there is a problem that the application is not very suitable for the module.

  Therefore, the present invention has been made to solve the above-described problems, and a linear light source module capable of accurately positioning and mounting a plurality of light emitting elements on a mounting substrate and a mounting used for the linear light source module. An object is to provide a substrate.

  A mounting substrate according to the present invention is used for a linear light source module in which a plurality of light emitting elements are linearly mounted along a predetermined direction, and includes a base material portion having a main surface and the base material portion. A first conductive pattern and a second conductive pattern provided on the main surface. The first conductive pattern is a conductive pattern in which the plurality of light emitting elements are mounted on the surface thereof, and the pair of second conductive patterns intersects the predetermined direction on the main surface of the base material portion. The conductive pattern is positioned so as to sandwich the first conductive pattern along the direction. Each of the pair of second conductive patterns has a plurality of protruding corner portions facing the first conductive pattern along a direction intersecting the predetermined direction on the main surface of the base material portion.

  In the mounting substrate according to the present invention, each of the pair of second conductive patterns includes a base portion extending along the predetermined direction, and a plurality of protrusions projecting from the base portion toward the first conductive pattern side. In this case, it is preferable that the plurality of projecting corners are formed by corners located at the tips of the plurality of convex portions.

  In the mounting substrate according to the present invention, when viewed from the normal direction of the main surface of the base material portion, the convex portion of the three sides that are located on the outer periphery of the convex portion. It is preferable that one side to be located at the tip extends along a direction parallel to the predetermined direction.

  In the mounting substrate according to the present invention, when viewed from the normal direction of the main surface of the base material part, the three sides that are located on the outer periphery of the convex part are each 0.3 mm or more It is preferable that it has the length.

  In the mounting substrate according to the present invention, when viewed from the normal direction of the main surface of the base portion, within a range of 1 mm from each position where the plurality of protruding corners are provided, Of the structures provided on the base material, it is preferable that no protruding corners of the structures excluding the second conductive pattern are provided.

  The mounting substrate according to the present invention is further provided on the main surface side of the base material portion and disposed so as to surround the plurality of light emitting elements mounted on the first conductive pattern. It is preferable to provide a frame-like reflector having a reflection surface on the inner peripheral portion for reflecting at least a part of light emitted from the plurality of light emitting elements.

  The linear light source module according to the present invention is formed by linearly mounting a plurality of light emitting elements on a mounting substrate along a predetermined direction, and is provided on the main surface of the base portion of the mounting substrate. A first conductive pattern and a pair of second conductive patterns. The first conductive pattern is a conductive pattern in which the plurality of light emitting elements are mounted on the surface thereof, and the pair of second conductive patterns intersects the predetermined direction on the main surface of the base material portion. The conductive pattern is positioned so as to sandwich the first conductive pattern along the direction. Each of the pair of second conductive patterns has a plurality of protruding corner portions facing the first conductive pattern along a direction intersecting the predetermined direction on the main surface of the base material portion.

  ADVANTAGE OF THE INVENTION According to this invention, it can be set as the mounting substrate used for the linear light source module which can position and mount a several light emitting element on a mounting substrate accurately, and the said linear light source module.

It is a perspective view of the linear light source module in Embodiment 1 of this invention. It is a top view of the linear light source module shown in FIG. It is sectional drawing of the linear light source module shown in FIG. It is a schematic plan view which shows the mounting process of LED in the manufacture stage of the linear light source module shown in FIG. It is a schematic cross section which shows the mounting process of LED in the manufacture stage of the linear light source module shown in FIG. It is a schematic plan view which shows the mounting process of LED in the manufacture stage of the linear light source module which concerns on a comparative example. It is a schematic cross section which shows the mounting process of LED in the manufacture stage of the linear light source module which concerns on a comparative example. It is a top view of the linear light source module in Embodiment 2 of this invention. It is a top view of the linear light source module in Embodiment 3 of this invention. It is sectional drawing of the linear light source module shown in FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Embodiments 1 to 3 described below exemplify a linear light source module incorporated in a backlight of a liquid crystal display device, and the description of the linear light source module is omitted here. This is based on the premise that light guide means such as a light guide is separately provided on the exit surface side. In the following first to third embodiments, similar or common parts are denoted by the same reference numerals in the drawings, and description thereof will not be repeated.

(Embodiment 1)
FIG. 1 is a perspective view of a linear light source module according to Embodiment 1 of the present invention. 2 is a plan view of the linear light source module shown in FIG. 1, and FIG. 3 is a cross-sectional view of the linear light source module shown in FIG. 3 is a cross-sectional view of the linear light source module cut along the line III-III shown in FIG. First, with reference to these FIG. 1 thru | or FIG. 3, the structure of 1 A of linear light source modules in this Embodiment is demonstrated.

  As shown in FIGS. 1 to 3, the linear light source module 1 </ b> A according to the present embodiment mainly includes a mounting substrate 10, a frame-like reflector 15, and a plurality of LEDs 20.

  The mounting substrate 10 is made of a plate-like member having a rectangular shape in plan view, and includes a base material portion 11, a first conductive pattern 12A, and a pair of second conductive patterns 12B and 12C. The main surface of the mounting substrate 10 is roughly divided into a light source area where the frame-like reflector 15 and the plurality of LEDs 20 are mounted, and a peripheral area where other circuit components are mounted. The first conductive pattern 12A is provided so as to be disposed at a substantially central portion in the light source area, and at least a part of the pair of second conductive patterns 12B and 12C is disposed at the peripheral portion in the light source area. It is provided so that.

  As shown in FIGS. 1 and 3, the base material portion 11 includes a base 11 a and an insulating layer 11 b formed on the base 11 a. The base 11a is a metal having high thermal conductivity such as aluminum from the viewpoint of efficiently dissipating heat generated by driving the LED 20 and heat generated by other circuit components mounted on the mounting substrate 10 to the outside. It is preferable to be comprised with the board. However, the base 11a is not limited to this, and may be composed of a glass epoxy plate or a ceramic plate. The insulating layer 11b may be made of any material as long as the insulation between the base 11a and the first and second conductive patterns 12A to 12C can be ensured. Note that when the base 11a is made of an insulator such as a glass epoxy plate or a ceramic plate as described above, the insulating layer 11b need not be formed.

  As shown in FIGS. 1 to 3, the first conductive pattern 12A and the second conductive patterns 12B and 12C described above are formed on the main surface of the base material portion 11 (that is, on the main surface of the insulating layer 11b). ing. The first conductive pattern 12A is a conductive pattern on which the plurality of LEDs 20 are mounted, and the pair of second conductive patterns 12B and 12C includes an alignment mark for determining the mounting position of each of the plurality of LEDs 20. A conductive pattern including an alignment portion. In the present embodiment, the reason why the plurality of LEDs 20 are mounted on the conductive pattern is mainly to efficiently dissipate heat generated by driving the LEDs 20 to the base material portion 11.

  As shown in FIG. 3, each of the first conductive pattern 12A and the second conductive patterns 12B and 12C is formed so as to cover the wiring layer 13a formed on the main surface of the base member 11 and the wiring layer 13a. And the plated layer 13b. In the linear light source module 1A according to the present embodiment, the first conductive pattern 12A and the second conductive pattern 12C do not have a function as wiring for transmitting an electric signal. In this case, the layer 13a included in the first conductive pattern 12A and the second conductive pattern 12C is also referred to as a wiring layer. ing.

  The material of the wiring layer 13a and the plating layer 13b is not particularly limited, but the wiring layer 13a is preferably made of a metal material such as copper from the viewpoint of thermal conductivity and conductivity. The layer 13b is preferably made of a metal material such as silver, aluminum, or platinum from the viewpoints of thermal conductivity, conductivity, and reflectance. In addition, when it is comprised so that light may not be irradiated to the mounting substrate 10 at all, or when preflux is separately apply | coated to the wiring layer 13a in order to prevent the corrosion of the wiring layer 13a, etc., formation of the plating layer 13b Is unnecessary.

  As the thickness of the wiring layer 13a, it is preferable to form the wiring layer 13a as thick as possible so that its cross-sectional area becomes as large as possible from the viewpoint of easy heat release, easy current flow, and the like. However, if the wiring layer 13a is formed too thick, a large amount of etching solution is required to dissolve unnecessary portions during patterning of the wiring layer 13a, and the etching tact time is prolonged. Therefore, it is preferable to set the optimum thickness in consideration of these. Further, when the wiring layer 13a is formed too thick, it causes a large roundness at the edge portion of the alignment portion described later. Therefore, from the various viewpoints described above, the thickness of the wiring layer 13a is preferably 0.035 mm or less.

  As shown in FIGS. 1 and 2, the first conductive pattern 12A is viewed from the normal direction of the main surface of the base material portion 11 (hereinafter, also simply referred to as “when viewed in plan”). The LED 30 has a long and substantially rectangular shape, and the LEDs 30 are linearly mounted along the direction in which the first conductive pattern 12A extends.

  The second conductive pattern 12B, which is one of the pair of second conductive patterns 12B and 12C, is on the main surface of the base member 11 on the one side in the direction intersecting the direction in which the first conductive pattern 12A extends. It is provided so as to run in parallel with one conductive pattern 12A. More specifically, the second conductive pattern 12B includes a base portion 12b extending along the direction in which the first conductive pattern 12A extends, and a plurality of convex portions protruding from the base portion 12b toward the first conductive pattern 12A. And an alignment unit 18B. The plurality of alignment portions 18B are spaced apart from each other by a certain distance along the direction in which the base portion 12b extends.

  The second conductive pattern 12C, which is the other of the pair of second conductive patterns 12B and 12C, on the other surface in the direction intersecting with the extending direction of the first conductive pattern 12A on the main surface of the base material portion 11. It is provided so as to run in parallel with one conductive pattern 12A. More specifically, the second conductive pattern 12C includes a base portion 12c extending along a direction in which the first conductive pattern 12A extends and a plurality of convex portions protruding from the base portion 12c toward the first conductive pattern 12A side. And an alignment portion 18C. The plurality of alignment portions 18C are provided apart from each other by a certain distance along the direction in which the base portion 12c extends.

  As described above, the pair of second conductive patterns 12B and 12C are positioned on the main surface of the base member 11 so as to sandwich the first conductive pattern 12A along the direction intersecting with the direction in which the first conductive pattern 12A extends. become. The alignment portions 18B and 18C are provided so as to be alternately arranged along the direction in which the first conductive pattern 12A extends.

  Here, each of the alignment portions 18B and 18C made up of a plurality of convex portions has a pair of corner portions when viewed in plan, and each or one of the pair of corner portions is an alignment corner portion for alignment. It becomes. That is, by adopting the above configuration, a plurality of alignment protruding corners formed by the corners of the protrusions intersect the direction in which the first conductive pattern 12 </ b> A extends on the main surface of the base material part 11. The first conductive pattern 12 </ b> A is disposed to face the first conductive pattern 12 </ b> A.

  The plurality of LEDs 20 correspond to light emitting elements that emit light when driven. As described above, the plurality of LEDs 20 linearly extend along the direction in which the first conductive pattern 12A extends as described above on the first conductive pattern 12A. Has been implemented. More specifically, each of the plurality of LEDs 20 is bonded to the first conductive pattern 12A by a die bond material (not shown), and adjacent LEDs among the plurality of LEDs 20 are electrically connected by a bonding wire 21 made of a gold wire or the like. Connected.

  As shown in FIGS. 1 to 3, the frame-like reflector 15 is formed of, for example, a white resin molded body, and is preferably integrated with the mounting substrate 10 by injection molding (outsert molding). Formed. The frame-like reflector 15 is formed in a shape having a slit-like internal hollow so that its outer shape is annular (frame shape), and is disposed along the periphery of the first conductive pattern 12A described above. Yes.

  The frame-like reflector 15 is provided so as to surround the plurality of LEDs 20 arranged in the above-described line shape, and the reflection surface 15a that reflects a part of the light emitted from the plurality of LEDs 20 is provided on the inner periphery thereof. Have in the department. The reflection surface 15a is preferably provided in an inclined shape as shown in FIG. With this configuration, when the LED 20 is driven, the light reflected by the reflecting surface 15a can be guided in the optical axis direction of the LED 20, and light is efficiently emitted toward the outside. .

  Further, as shown in FIG. 3, a sealing resin 16 is filled in the hollow interior of the frame-like reflector 15. The sealing resin 16 is made of, for example, a silicone resin, an epoxy resin, or the like, and seals the plurality of LEDs 20 located inside the frame-like reflector 15. Note that phosphor particles may be dispersedly disposed in the sealing resin 16.

  Next, a specific manufacturing method for manufacturing the linear light source module 1A in the present embodiment will be described.

  When manufacturing the linear light source module 1A in the present embodiment, first, the insulating layer 11b is formed on the base 11a, and the wiring layer 13a is further formed on the formed insulating layer 11b. Specifically, the insulating layer 11b is formed on the base 11a by, for example, adhesion or vapor deposition, and the wiring layer 13a is formed on the conductor layer after the conductor layer is formed on the insulating layer 11b by vapor deposition or adhesion. On the other hand, an etching process using a photomask is performed and patterned into a predetermined shape to be formed on the insulating layer 11b.

  Next, the plating layer 13b is formed on the wiring layer 13a. More specifically, a work-in-process product in which a wiring layer 13a patterned in a predetermined shape is formed on the main surface of the base member 11 is immersed in a plating solution, and a voltage is applied to the wiring layer 13a while maintaining the state. As a result, the surface of the exposed wiring layer 13a is plated, and thereby the plating layer 13b is formed on the wiring layer 13a. In this way, the mounting substrate 10 in which the first conductive pattern 12A and the second conductive patterns 12B and 12C are formed on the main surface of the base member 11 is manufactured.

  In the above-described etching process, the edge portion of the wiring layer 13a to be formed is rounded. The roundness of the edge portion appears rounded at the edge portion of the plating layer 13b during the subsequent plating process, and as a result, the edge portions of the first conductive pattern 12A and the second conductive patterns 12B and 12C. Will be rounded. Therefore, in order to prevent the edge portions of the alignment portions included in the second conductive patterns 12B and 12C from being rounded as much as possible, the wiring layer 13a is not formed too thick as described above. This is very important.

  Next, a frame-like reflector 15 is formed on the main surface side of the mounting substrate 10. More specifically, after the mounting substrate 10 is placed on a molding die of an injection molding apparatus, a white resin is poured into the molding die and cured to form a frame-like reflector 15 on the first conductive pattern 12A. The By forming the reflector 15 on the mounting substrate 10 by injection molding in this way, the mounting position of the reflector 15 with respect to the mounting substrate 10 is positioned with high accuracy.

  Next, the plurality of LEDs 20 are positioned and mounted on the first conductive pattern 12A. More specifically, the mounting positions of the plurality of LEDs 20 are determined with reference to the alignment portion included in the second conductive patterns 12B and 12C described above, and based on this, the plurality of LEDs 20 are first connected using a chip mounter or the like. It is mounted on the conductive pattern 12A. In this case, the reason why the plurality of LEDs 20 are positioned with high accuracy with respect to the mounting substrate 10 and a more specific positioning method will be described later.

  Thereafter, the plurality of LEDs 20 are wire-bonded using the bonding wires 21, and further sealed with the sealing resin 16, thereby completing the linear light source module 1A as shown in FIGS.

  4 is a schematic plan view showing the LED mounting process in the manufacturing stage of the linear light source module shown in FIG. 1, and FIG. 5 shows the LED mounting process in the manufacturing stage of the linear light source module shown in FIG. It is a schematic cross section. Next, referring to FIG. 4 and FIG. 5, in the linear light source module 1 </ b> A in the present embodiment, the reason why the plurality of LEDs 20 can be positioned and mounted with high accuracy with respect to the mounting substrate 10 and more concretely. The positioning method will be described in detail.

  As shown in FIGS. 4 and 5, in the LED 20 mounting process, the mounting position of each of the plurality of LEDs 20 is determined by using an image captured using a CCD camera 30 as an imaging unit. Is done. Here, an illumination device 31 is provided adjacent to the CCD camera 30, and the inside of the visual field VF of the CCD camera 30 is illuminated by illumination light emitted from the illumination device 31.

  The CCD camera 30 is disposed to face the main surface of the mounting substrate 10 so that the main surface of the mounting substrate 10 can be imaged. Further, the visual field VF of the CCD camera 30 is set so that the first conductive pattern 12A and the portion where the alignment portions 18B and 18C of the pair of second conductive patterns 12B and 12C are provided are at least within the visual field VF. The Further, the CCD camera 30 is moved relative to the mounting substrate 10 by a moving mechanism (not shown) so that the visual field VF can be scanned along the direction in which the first conductive pattern 12A extends (the arrow direction shown in the figure). Moved to.

  When positioning the mounting position of the LED 20, the image picked up by the CCD camera 30 is binarized, and the coordinates of the corners of the alignment portions 18B and 18C are detected based on the binarized image. Based on this, the mounting position of the LED 20 is determined. For example, the mounting may be performed according to a rule such as calculating the center position of a line segment that connects each of the projected corners included in the adjacent alignment sections 18B and 18C, and determining the calculated center position as the mounting position of the LED 20. For example, the plurality of LEDs 20 can be mounted in a linear arrangement with a predetermined interval, and the plurality of LEDs 20 can be mounted with high accuracy positioning with respect to the mounting substrate 10.

  Here, in the present embodiment, as described above, the alignment corner portion is arranged on the main surface of the base material portion 11 so as to face the first conductive pattern 12A. Therefore, as shown in FIG. 5, among the illumination light emitted from the illumination device 31, a lot of light irradiated to the alignment corner is reflected toward the CCD camera 30 side. Fluctuations at the corners are reduced, and the contrast at the boundary between the alignment parts 18B and 18C and the main surface of the base material part 11 is cleared in the image after binarization processing. As a result, the detection of the corners is highly accurate. You can do it. Therefore, the mounting position of the LED 20 can be managed with high accuracy, and the mounting accuracy of the LED 20 is improved.

  When the coordinates of the corners of the actual alignment portions 18B and 18C are detected, the corners of the alignment portions 18B and 18C are rounded due to the roundness of the wiring layer 13a during the etching process described above. In the image after binarization processing, the extension lines of the two sides that are continuous with the protruding corners of the alignment parts 18B and 18C made up of the convex portions are calculated, and the intersection of these is calculated as the protruding corner. It is preferable to use the coordinates.

  In addition, when the alignment parts 18B and 18C made of a convex part are viewed in plan, one of the three sides located at the tip of the convex part extends along a direction parallel to the first conductive pattern 12A. It is preferable. Moreover, when alignment part 18B, 18C which consists of convex parts is planarly viewed, it is preferable that the length of the three sides is each 0.3 mm or more. With this configuration, even when the rounded corners of the alignment portions 18B and 18C are generated due to the rounding of the wiring layer 13a during the etching process described above, the coordinates of the convex corners are sufficiently obtained. Detection can be performed.

  As described above, by using the linear light source module 1A in the present embodiment and the mounting substrate 10 used therefor, it is possible to position and mount a plurality of LEDs 20 on the mounting substrate 10 with high accuracy. Become. Therefore, the positioning accuracy of the reflector 15 and the plurality of LEDs 20 is also improved, and a linear light source module in which unevenness in the irradiance distribution of the emitted light is suppressed can be obtained.

(Example)
Hereinafter, a result of confirming the effect of the present invention by actually producing a plurality of linear light source modules 1A having the above-described configuration as an example and measuring the variation in the mounting position of the LED 20 will be described. A plurality of linear light source modules in which the alignment portion is included in the first conductive pattern 12A are manufactured as a comparative example, and the results of actually measuring the variation in the mounting position of the LED 20 in the comparative example are also described.

  FIG. 6 is a schematic plan view showing an LED mounting process in the manufacturing stage of the linear light source module according to the comparative example, and FIG. 7 shows an LED mounting process in the manufacturing stage of the linear light source module according to the comparative example. It is a schematic cross section. First, referring to FIG. 6 and FIG. 7, the configuration of the linear light source module 1 </ b> X according to the comparative example and a plurality of LEDs 20 are positioned with high accuracy relative to the mounting substrate 10 when the configuration is employed. Explain why this is not possible.

  As shown in FIGS. 6 and 7, the linear light source module 1X according to the comparative example is provided with an alignment portion 18A on the outer peripheral portion of the first conductive pattern 12A, as compared with the linear light source module 1A having the above-described configuration. Is different. The alignment portion 18A is provided in a convex shape so as to protrude toward the outside of the reflector 15 when seen in a plan view, and a corner portion for alignment is formed at a corner portion of the convex portion. . That is, by adopting the above configuration, the plurality of alignment protruding corners configured by the corners of the convex portions are different from the linear light source module 1A having the above-described configuration on the main surface of the base member 11. In this case, the first conductive pattern 12A is not disposed opposite to the first conductive pattern 12A.

  Therefore, as shown in FIG. 7, among the illumination light emitted from the illumination device 31, the light emitted to the alignment corner is difficult to be reflected toward the CCD camera 30 side. The light is blocked by the projected corner portion and a shadow is generated, and a lot of fluctuations occur at the projected corner portion. In the image after binarization processing, the alignment unit 18A and the substrate unit 11 are formed. As a result, the contrast at the boundary with the main surface is blurred, and as a result, the detection of the projected corner cannot be performed with high accuracy. Therefore, it becomes difficult to manage the mounting position of the LED 20 with high accuracy, and the mounting accuracy of the LED 20 is lowered.

  In each of the examples and comparative examples, an aluminum plate having a length of 110 mm, a width of 10 mm, and a thickness of 1.5 mm is used as the base 11a, and an insulating layer 11b having a thickness of 0.07 mm is formed on the aluminum plate. A wiring layer 13a made of a copper foil having a thickness of 0.035 mm is formed thereon, and a mounting substrate 10 is prepared on which a plating layer 13b is formed by performing silver plating on the wiring layer 13a. The first conductive pattern 12A of the mounting substrate 10 is prepared. A reflector having an outer dimension of 105 mm in length, a width of 1.5 mm, a thickness of 0.5 mm, and an inner diameter of 95 mm in length and a width of 0.5 mm was formed by injection molding.

  Here, in any of the examples and comparative examples, the lengths of the three sides in the plan view of the alignment portions 18A to 18C made of the convex portions were all set to 0.3 mm. In this case, it was confirmed that the roundness generated in the alignment portions 18A to 18C was substantially a curved shape having a curvature radius of 0.5 mm.

  Moreover, in any of an Example and a comparative example, the center position of the line segment which ties each one protrusion corner part contained in an adjacent alignment part is calculated, and the said calculated center position is determined to the mounting position of LED20. The LED 20 is mounted according to the rule, and when detecting the coordinates of the projected corner portion, in the image after binarization processing, the extension lines of the two sides continuous to the projected corner portions of the alignment portions 18A to 18C made up of the convex portions are displayed. This was done by calculating the intersection.

  As a result, in the embodiment, the variation (3σ) in the mounting position of the LED 20 is ± 0.036 mm in the longitudinal direction (the direction in which the first conductive pattern A extends), and the short direction (the direction in which the first conductive pattern 12A extends). ± 0.020 mm in the direction perpendicular to the direction). In the example, the detection error rate of the alignment portion was 0.2%.

  On the other hand, in the comparative example, the variation (3σ) in the mounting position of the LED 20 was ± 0.038 mm in the longitudinal direction and ± 0.035 mm in the lateral direction. In the comparative example, the detection error rate of the alignment part was 10.5%.

  From the above results, according to the present invention, it can be confirmed that the mounting accuracy of the LED 20 is improved with respect to the comparative example, and the occurrence of the detection error of the alignment unit is greatly improved with respect to the comparative example. Therefore, the significant effect of the present invention was confirmed by the results.

(Embodiment 2)
FIG. 8 is a plan view of the linear light source module according to Embodiment 2 of the present invention. Hereinafter, with reference to this FIG. 8, the linear light source module 1B in this Embodiment in this Embodiment is demonstrated.

  As shown in FIG. 8, in the linear light source module 1B according to the present embodiment, the alignment portions 18B and 18C including the convex portions provided on the pair of second conductive patterns 12B and 12C are the above-described embodiments. Compared to Embodiment 1A, the first conductive pattern 12A is formed wider in the extending direction.

  Even when configured in this way, the plurality of alignment protruding corners formed by the corners of the wide alignment portions 18B and 18C have the first conductive pattern on the main surface of the base member 11. Since the first conductive pattern 12A is disposed along the direction intersecting the extending direction of 12A, the plurality of LEDs 20 are mounted on the mounting substrate 10 in the same manner as in the first embodiment. It becomes possible to position and mount with high accuracy. Therefore, the positioning accuracy of the reflector 15 and the plurality of LEDs 20 is also improved, and a linear light source module in which unevenness in the irradiance distribution of the emitted light is suppressed can be obtained.

(Embodiment 3)
FIG. 9 is a plan view of the linear light source module according to Embodiment 3 of the present invention, and FIG. 10 is a cross-sectional view of the linear light source module shown in FIG. In addition, FIG. 10 is sectional drawing at the time of cut | disconnecting a linear light source module along the XX line shown in FIG. Hereinafter, with reference to these FIG. 9 and FIG. 10, the linear light source module 1C in this Embodiment in this Embodiment is demonstrated.

  As shown in FIGS. 9 and 10, the linear light source module 1 </ b> C in the present embodiment has a white resist film 14 on the main surface side of the mounting substrate 10, compared to the linear light source module 1 </ b> C in the first embodiment described above. It has more. The white resist film 14 is for reflecting light emitted from the plurality of LEDs 20 as stray light and irradiating the peripheral area of the mounting substrate 10 to the outside. This is also for protecting the conductive pattern formed on the material part 11 by covering it. In addition, by adopting such a white resist film 14, it is possible to prevent the color from being transferred to the light emitted from the linear light source module 1C.

  For example, the white resist film 14 is formed on the main surface side of the substrate portion 11 after the formation of the wiring layer 13a and before the formation of the plating layer 13b, or after the formation of the plating layer 13b and before the formation of the reflector 15. A white resist agent is applied to the entire surface, and a portion of the white resist agent is selectively cured by applying light through a photomask, and then the uncured white resist agent is removed. The material of the white resist film 14 is not particularly limited, and any material may be used as long as insulation can be ensured between the conductive pattern and the outside.

  Here, as shown in FIG. 9, in the linear light source module 1 </ b> C in the present embodiment, the white resist film 14 covers the portions other than the alignment portions 18 </ b> B and 18 </ b> C and the vicinity thereof when viewed in plan. Is formed. Specifically, as shown in the drawing, the white resist film 14 is provided with a notch-shaped recess so that the alignment portions 18B and 18C and the vicinity thereof are exposed.

  More specifically, when viewed in plan, the protruding corner portion of the white resist film 14 is not provided within a range of 1 mm from the position where the protruding corner portions of the alignment portions 18B and 18C are provided. More preferably, among the structures provided on the main surface of the base material portion 11 within a range of 1 mm from the position where the protruding corner portions of the alignment portions 18B and 18C are provided, the second conductive pattern 12B is preferred. , 12C is laid out so that no protruding corners of the structures are located.

  If comprised in this way, when mounting LED20, it will avoid detecting parts other than the protrusion corner part of alignment part 18B, 18C as a protrusion corner part for positioning accidentally. The LED 20 can be accurately positioned and mounted on the mounting substrate 10, and a linear light source module in which unevenness in the irradiance distribution of the emitted light is suppressed can be obtained.

  In the first to third embodiments of the present invention described above, the case where the first conductive pattern 12A and the second conductive pattern 12C are configured not to have a function as wiring for transmitting an electric signal is used. Although illustrated, it is good also as giving the said function to these conductive patterns naturally.

  In the first to third embodiments of the present invention described above, the second conductive patterns 12B and 12C both have the base portions 12b and 12c, and the alignment portions 18B and 18C are all the base portions. Although the case where they are connected by 12b and 12c has been described as an example, the alignment portions 18B and 18C may be individually formed in an island shape without providing the base portions 12b and 12c.

  Moreover, in Embodiment 1 thru | or 3 of this invention demonstrated above, although the case where the reflector 15 was integrated with the mounting board | substrate 10 by outsert shaping | molding was demonstrated and demonstrated, the other method was used. The reflector 15 may be assembled to the mounting substrate 10.

  Thus, the above-described embodiment disclosed herein is illustrative in all respects and is not restrictive. The technical scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  1A to 1C linear light source module, 10 mounting substrate, 11 base material portion, 11a base, 11b insulating layer, 12A first conductive pattern, 12B, 12C second conductive pattern, 12b, 12c base portion, 13a wiring layer, 13b plating Layer, 14 White resist film, 15 Reflector, 15a Reflecting surface, 16 Sealing resin, 18B, 18C Alignment part, 20 LED, 21 Bonding wire, 30 CCD camera, 31 Illumination device, VF field of view.

Claims (7)

A mounting substrate used in a linear light source module in which a plurality of light emitting elements are linearly mounted along a predetermined direction,
A base material portion having a main surface;
A first conductive pattern that is provided on the main surface of the base material portion and on which the plurality of light emitting elements are mounted;
A pair of second conductive patterns provided on the main surface of the base material portion and positioned so as to sandwich the first conductive pattern along a direction intersecting the predetermined direction on the main surface of the base material portion. And
Each of the pair of second conductive patterns has a plurality of projecting corner portions facing the first conductive pattern along a direction intersecting the predetermined direction on the main surface of the base material portion. Mounting board. Each of the pair of second conductive patterns includes a base portion extending along the predetermined direction, and a plurality of convex portions protruding from the base portion toward the first conductive pattern side,
The mounting substrate according to claim 1, wherein the plurality of protruding corner portions are configured by corner portions positioned at tips of the plurality of convex portions.   When viewed from the normal direction of the main surface of the base material portion, one side that is located at the tip of the convex portion among the three sides that are located on the outer periphery of the convex portion is the predetermined The mounting substrate according to claim 2, which extends along a direction parallel to the direction.   The three sides which are located on the outer periphery of the convex portion when viewed from the normal direction of the main surface of the base material portion each have a length of 0.3 mm or more. Or the mounting board described in 3.   When viewed from the normal direction of the main surface of the base material portion, the structure provided on the base material portion within a range of 1 mm from each position where the plurality of protruding corner portions are provided. 5. The mounting substrate according to claim 1, wherein no protruding corner portion of the structure excluding the second conductive pattern is provided.   At least the light emitted from the plurality of light emitting elements is disposed on the main surface side of the base material portion and disposed so as to surround the plurality of light emitting elements mounted on the first conductive pattern. The mounting substrate according to claim 1, further comprising a frame-like reflector having a reflecting surface for reflecting a part thereof on an inner peripheral portion thereof. A linear light source module in which a plurality of light emitting elements are linearly mounted on a mounting substrate along a predetermined direction,
A first conductive pattern provided on the main surface of the base portion of the mounting substrate, wherein the plurality of light emitting elements are mounted on the surface;
A pair of second conductive patterns provided on the main surface of the base material portion and positioned so as to sandwich the first conductive pattern along a direction intersecting the predetermined direction on the main surface of the base material portion. And
Each of the pair of second conductive patterns has a plurality of projecting corner portions facing the first conductive pattern along a direction intersecting the predetermined direction on the main surface of the base material portion. Linear light source module.

Images