JP2013045924A - Exposure device, cleaning method, device manufacturing method, program, and recording medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure device capable of suppressing the generation of exposure failures.SOLUTION: An exposure device exposes a substrate with exposure light through an exposure liquid. The exposure device comprises: an optical member having an emitting surface for emitting the exposure light; a substrate holding device including a first holding portion for holding a lower surface of the substrate so as to be released, and a first member regulating an opening in which the substrate can be disposed, disposed on a periphery of an upper surface of the substrate while the substrate is held by the first holding portion, and having a first surface adjacent to the upper surface of the substrate through a clearance; and a cleaning device for at least partially cleaning at least one of the first member and members positioned in a lower part of the clearance.

Description

  The present invention relates to an exposure apparatus, a cleaning method, a device manufacturing method, a program, and a recording medium.

  In the manufacturing process of microdevices such as semiconductor devices and electronic devices, for example, an immersion exposure apparatus that exposes a substrate with exposure light through a liquid as disclosed in the following patent document is used. The exposure apparatus includes a substrate stage that is movable while holding a substrate, and exposes the substrate held on the substrate stage.

US Patent Application Publication No. 2008/0043211 US Patent Application Publication No. 2008/0100812

  In the immersion exposure apparatus, for example, if the substrate stage is contaminated, exposure failure may occur. As a result, a defective device may occur.

  An object of an aspect of the present invention is to provide an exposure apparatus and a cleaning method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method, a program, and a recording medium that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, an exposure apparatus that exposes a substrate with exposure light through an exposure liquid, the optical member having an exit surface from which the exposure light is emitted, and the lower surface of the substrate can be released. The first holding portion to hold and an opening in which the substrate can be arranged are defined, and the substrate is arranged around the upper surface of the substrate in a state where the substrate is held by the first holding portion, and is adjacent to the upper surface of the substrate through a gap. There is provided an exposure apparatus comprising: a substrate holding device including a first member having a first surface; and a cleaning device for cleaning at least a part of at least one of the first member and a member positioned below the gap. The

  According to the second aspect of the present invention, an exposure apparatus that exposes a substrate with exposure light through an exposure liquid, the optical member having an exit surface from which the exposure light is emitted, and the lower surface of the substrate can be released. The first holding portion to hold and an opening in which the substrate can be arranged are defined, and the substrate is arranged around the upper surface of the substrate in a state where the substrate is held by the first holding portion, and is adjacent to the upper surface of the substrate through a gap. A substrate holding device including a first member having a first surface; and a porous member including at least a portion disposed between the substrate and the first member in a state where the substrate is held by the first holding unit. Between the liquid immersion member and the second member, the liquid immersion member disposed at least in part around the second member and the optical member, and forming an immersion space for the exposure liquid between the substrate and the substrate in exposure of the substrate At least a part of the immersion space for the cleaning liquid is formed. As such, the exposure apparatus is provided comprising, a first supply port for supplying the cleaning liquid.

  According to the third aspect of the present invention, an exposure apparatus that exposes a substrate with exposure light through an exposure liquid, the optical member having an exit surface from which the exposure light is emitted, and the lower surface of the substrate can be released. The first holding portion to hold and an opening in which the substrate can be arranged are defined, and the substrate is arranged around the upper surface of the substrate in a state where the substrate is held by the first holding portion, and is adjacent to the upper surface of the substrate through a gap. A substrate holding device including a first member having a first surface; a second member having a recovery port disposed in a space leading to a gap between the substrate and the first surface and capable of recovering a fluid; and a space And a second supply port that supplies a cleaning liquid.

  According to the fourth aspect of the present invention, an exposure apparatus that exposes a substrate with exposure light through an exposure liquid, the optical member having an exit surface from which the exposure light is emitted, and the lower surface of the substrate can be released. The first holding portion to hold and an opening in which the substrate can be arranged are defined, and the substrate is arranged around the upper surface of the substrate in a state where the substrate is held by the first holding portion, and is adjacent to the upper surface of the substrate through a gap. An exposure apparatus comprising: a substrate holding device including a first member having a first surface; and an emission unit that irradiates at least a part of at least one of the first member and a member positioned below the gap. Is provided.

  According to the fifth aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through an exposure liquid, wherein an optical member having an exit surface from which the exposure light is emitted and a lower surface of the substrate can be released. The first holding portion to hold and an opening in which the substrate can be arranged are defined, and the substrate is arranged around the upper surface of the substrate in a state where the substrate is held by the first holding portion, and is adjacent to the upper surface of the substrate through a gap. There is provided an exposure apparatus comprising: a substrate holding device including a first member having a first surface; and a cleaning member that contacts at least a part of at least one of the first member and a member located below the gap. .

  According to a sixth aspect of the present invention, there is provided a device manufacturing method comprising: exposing a substrate using the exposure apparatus according to any one of the first to fifth aspects; and developing the exposed substrate. Is provided.

  According to a seventh aspect of the present invention, there is provided a cleaning method for an exposure apparatus that exposes a substrate with exposure light through an exposure liquid, the exposure apparatus comprising an optical member having an exit surface from which exposure light is emitted, A first holding portion that holds the lower surface of the substrate in a releasable manner and an opening in which the substrate can be disposed are defined, and is disposed around the upper surface of the substrate in a state where the substrate is held by the first holding portion. And a first member having a first surface adjacent to the gap, and cleaning at least a part of at least one of the first member and the member located below the gap. A cleaning method is provided.

  According to an eighth aspect of the present invention, there is provided a cleaning method for an exposure apparatus that exposes a substrate with exposure light through an exposure liquid, the exposure apparatus comprising an optical member having an exit surface from which exposure light is emitted, A first holding portion that holds the lower surface of the substrate in a releasable manner and an opening in which the substrate can be disposed are defined, and is disposed around the upper surface of the substrate in a state where the substrate is held by the first holding portion. And a first member having a first surface adjacent to each other with a gap between the substrate and the first member having the first surface in a state where the substrate is held by the first holding portion An immersion member that is disposed at least in part and is disposed at least at a part of the periphery of the optical member and forms an immersion liquid immersion space between the substrate and the substrate during exposure of the substrate. And between the liquid immersion member and the second member Cleaning method comprising forming a liquid immersion space cleaning liquid is provided.

  According to a ninth aspect of the present invention, there is provided a cleaning method for an exposure apparatus that exposes a substrate with exposure light through an exposure liquid, the exposure apparatus comprising an optical member having an exit surface from which exposure light is emitted, A first holding portion that holds the lower surface of the substrate in a releasable manner and an opening in which the substrate can be disposed are defined, and is disposed around the upper surface of the substrate in a state where the substrate is held by the first holding portion. And a first member having a first surface that is adjacent to the first surface through a gap, and a recovery port that is disposed in a space that communicates with the gap between the substrate and the first surface and that can collect a fluid. And a second member. The cleaning method includes supplying a cleaning liquid to the space.

  According to a tenth aspect of the present invention, there is provided an exposure apparatus cleaning method for exposing a substrate with exposure light through an exposure liquid, the exposure apparatus comprising an optical member having an exit surface from which exposure light is emitted, A first holding portion that holds the lower surface of the substrate in a releasable manner and an opening in which the substrate can be disposed are defined, and is disposed around the upper surface of the substrate in a state where the substrate is held by the first holding portion. And a first member having a first surface adjacent to each other with a gap therebetween, and cleaning light is applied to at least a part of at least one of the first member and the member located below the gap. A cleaning method is provided that includes irradiating.

  According to an eleventh aspect of the present invention, there is provided a cleaning method for an exposure apparatus that exposes a substrate with exposure light through an exposure liquid, the exposure apparatus comprising an optical member having an exit surface from which exposure light is emitted; A first holding portion that holds the lower surface of the substrate in a releasable manner and an opening in which the substrate can be disposed are defined, and is disposed around the upper surface of the substrate in a state where the substrate is held by the first holding portion. And a first member having a first surface adjacent to the gap through the gap, and bringing the cleaning member into contact with the first member and at least a part of the member located below the gap. A cleaning method is provided.

  According to the twelfth aspect of the present invention, the substrate is exposed using the exposure apparatus cleaned by the cleaning method according to any one of the seventh to eleventh aspects, and the exposed substrate is developed. A device manufacturing method is provided.

  According to a thirteenth aspect of the present invention, there is provided a program for causing a computer to execute control of an exposure apparatus that exposes a substrate with exposure light via an exposure liquid, the exposure apparatus having an exit surface from which exposure light is emitted. An optical member, a first holding portion that releasably holds the lower surface of the substrate, and an opening in which the substrate can be disposed, and around the upper surface of the substrate in a state where the substrate is held by the first holding portion. A substrate holding device comprising: a first member having a first surface that is disposed and has a first surface adjacent to the upper surface of the substrate via a gap, and at least one of at least one of the first member and the member positioned below the gap A program is provided that causes a portion to be cleaned.

  According to a fourteenth aspect of the present invention, there is provided a program for causing a computer to execute control of an exposure apparatus that exposes a substrate with exposure light via an exposure liquid, the exposure apparatus having an exit surface on which exposure light is emitted. An optical member, a first holding portion that releasably holds the lower surface of the substrate, and an opening in which the substrate can be disposed, and around the upper surface of the substrate in a state where the substrate is held by the first holding portion. A substrate holding device including a first member having a first surface that is disposed and adjacent to the upper surface of the substrate via a gap; and the substrate and the first surface in a state where the substrate is held by the first holding portion. An immersion liquid immersion space between the first member and at least a portion of the second member including the porous member and at least a portion of the periphery of the optical member, and the substrate in exposure of the substrate A liquid immersion member that forms a Program for executing to form a liquid immersion space of the cleaning liquid between the liquid immersion member and the second member.

  According to a fifteenth aspect of the present invention, there is provided a program for causing a computer to execute control of an exposure apparatus that exposes a substrate with exposure light via an exposure liquid, the exposure apparatus having an emission surface on which exposure light is emitted. An optical member, a first holding portion that releasably holds the lower surface of the substrate, and an opening in which the substrate can be disposed, and around the upper surface of the substrate in a state where the substrate is held by the first holding portion. And a substrate holding device including a first member having a first surface adjacent to the upper surface of the substrate via a gap, and disposed in a space that communicates with the gap between the substrate and the first surface. And a second member having a recoverable recovery port, and a program for executing supply of the cleaning liquid to the space is provided.

  According to a sixteenth aspect of the present invention, there is provided a program for causing a computer to execute control of an exposure apparatus that exposes a substrate with exposure light via an exposure liquid, the exposure apparatus having an emission surface on which exposure light is emitted. An optical member, a first holding portion that releasably holds the lower surface of the substrate, and an opening in which the substrate can be disposed, and around the upper surface of the substrate in a state where the substrate is held by the first holding portion. A substrate holding device comprising: a first member having a first surface that is disposed and has a first surface adjacent to the upper surface of the substrate via a gap, and at least one of at least one of the first member and the member positioned below the gap A program is provided that causes a portion to be irradiated with cleaning light.

  According to a seventeenth aspect of the present invention, there is provided a program for causing a computer to execute control of an exposure apparatus that exposes a substrate with exposure light via an exposure liquid, the exposure apparatus having an exit surface on which exposure light is emitted. An optical member, a first holding portion that releasably holds the lower surface of the substrate, and an opening in which the substrate can be disposed, and around the upper surface of the substrate in a state where the substrate is held by the first holding portion. A substrate holding device including a first member having a first surface that is disposed and adjacent to the upper surface of the substrate via a gap, and at least a part of the first member and the member positioned below the gap A program is provided that performs contacting the cleaning member.

  According to an eighteenth aspect of the present invention, there is provided a computer-readable recording medium on which a program according to any one of the thirteenth to seventeenth aspects is recorded.

  According to the aspect of the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the aspect of the present invention, the occurrence of defective devices can be suppressed.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 1st Embodiment. It is a figure which shows an example of the liquid immersion member and substrate stage which concern on 1st Embodiment. It is a figure showing a part of substrate stage concerning a 1st embodiment. It is a figure showing a part of substrate stage concerning a 1st embodiment. It is a flowchart which shows an example of the exposure method which concerns on 1st Embodiment. It is a flowchart which shows an example of the exposure method which concerns on 1st Embodiment. It is a figure for demonstrating an example of the exposure method which concerns on 1st Embodiment. It is a figure for demonstrating an example of the exposure method which concerns on 1st Embodiment. It is a flowchart which shows an example of the cleaning method which concerns on 1st Embodiment. It is a figure for demonstrating an example of the cleaning method which concerns on 1st Embodiment. It is a figure for demonstrating an example of the cleaning method which concerns on 2nd Embodiment. It is a figure for demonstrating an example of the cleaning method which concerns on 3rd Embodiment. It is a figure for demonstrating an example of the cleaning method which concerns on 4th Embodiment. It is a figure for demonstrating an example of the cleaning method which concerns on 4th Embodiment. It is a figure for demonstrating an example of the cleaning method which concerns on 5th Embodiment. It is a figure for demonstrating an example of the cleaning method which concerns on 6th Embodiment. It is a figure for demonstrating an example of the cleaning method which concerns on 7th Embodiment. It is a figure for demonstrating an example of the cleaning method which concerns on 8th Embodiment. It is a figure for demonstrating an example of the cleaning method which concerns on 8th Embodiment. It is a figure for demonstrating an example of the cleaning method which concerns on 8th Embodiment. It is a figure for demonstrating an example of the cleaning method which concerns on 9th Embodiment. It is a figure for demonstrating an example of the liquid immersion member which concerns on 10th Embodiment. It is a figure for demonstrating an example of the cleaning method which concerns on 10th Embodiment. It is a figure which shows an example of the member located under the gap | interval. It is a figure which shows an example of the member located under the gap | interval. It is a figure which shows an example of the member located under the gap | interval. It is a flowchart which shows an example of the manufacturing process of a device.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, the immersion space LS is formed so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space refers to a portion (space, region) filled with liquid. The substrate P is exposed with the exposure light EL through the liquid LQ in the immersion space LS. In the present embodiment, water (pure water) is used as the liquid LQ.

  Further, the exposure apparatus EX of the present embodiment is an exposure apparatus provided with a substrate stage and a measurement stage as disclosed in, for example, US Pat. No. 6,897,963 and European Patent Application Publication No. 1713113. It is.

  In FIG. 1, an exposure apparatus EX measures a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and exposure light EL without holding the substrate P. A measurement stage 3 that can be moved by mounting a measurement member C and a measuring instrument, a drive system 4 that moves the mask stage 1, a drive system 5 that moves the substrate stage 2, and a drive system 6 that moves the measurement stage 3 And an illumination system IL that illuminates the mask M with the exposure light EL, a projection optical system PL that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and at least a part of the optical path of the exposure light EL The immersion member 7 capable of forming the immersion space LS so as to be filled with the liquid LQ, the control device 8 for controlling the overall operation of the exposure apparatus EX, and the control device 8 for storing various information relating to exposure. And a storage device 8R that. The storage device 8R includes, for example, a memory such as a RAM, a recording medium such as a hard disk and a CD-ROM. In the storage device 8R, an operating system (OS) for controlling the computer system is installed, and a program for controlling the exposure apparatus EX is stored.

  Further, the exposure apparatus EX includes an interferometer system 11 that measures the positions of the mask stage 1, the substrate stage 2, and the measurement stage 3, and a detection system 300. The detection system 300 includes an alignment system 302 that detects an alignment mark on the substrate P, and a surface position detection system 303 that detects the position of the upper surface (surface) Pa of the substrate P. The detection system 300 may include an encoder system that detects the position of the substrate stage 2 as disclosed in, for example, US Patent Application Publication No. 2007/0288121.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chromium. A reflective mask can also be used as the mask M.

  The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). Further, the substrate P may include another film in addition to the photosensitive film. For example, the substrate P may include an antireflection film or a protective film (topcoat film) that protects the photosensitive film.

  Further, the exposure apparatus EX includes a chamber apparatus 103 that adjusts the environment (at least one of temperature, humidity, pressure, and cleanness) of the space 102 in which the exposure light EL travels. The chamber apparatus 103 includes a chamber member 104 that forms the space 102, and an air conditioning system 105 that adjusts the environment of the space 102.

  The space 102 includes a space 102A and a space 102B. The space 102A is a space where the substrate P is processed. The substrate stage 2 and the measurement stage 3 move in the space 102A.

  The air conditioning system 105 includes an air supply unit 105S that supplies gas to the spaces 102A and 102B, and supplies the gas from the air supply unit 105S to the spaces 102A and 102B to adjust the environment of the spaces 102A and 102B. In the present embodiment, at least the substrate stage 2, the measurement stage 3, and the terminal optical element 12 of the projection optical system PL are arranged in the space 102A.

The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

  The mask stage 1 is movable on the guide surface 9G of the base member 9 including the illumination region IR while holding the mask M. The drive system 4 includes a planar motor for moving the mask stage 1 on the guide surface 9G. The planar motor has a mover disposed on the mask stage 1 and a stator disposed on the base member 9 as disclosed in, for example, US Pat. No. 6,452,292. In the present embodiment, the mask stage 1 can move in six directions on the guide surface 9G in the X axis, Y axis, Z axis, θX, θY, and θZ directions by the operation of the drive system 4.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection region PR includes a position where the exposure light EL emitted from the projection optical system PL can be irradiated. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 2 can be moved to a position (projection region PR) where the exposure light EL emitted from the projection optical system PL can be irradiated. The substrate stage 2 is movable on the guide surface 10G of the base member 10 including the projection region PR while holding the substrate P. The measurement stage 3 is movable to a position (projection region PR) where the exposure light EL emitted from the projection optical system PL can be irradiated. The measurement stage 3 is movable on the guide surface 10G of the base member 10 including the projection region PR while holding the measurement member C. The substrate stage 2 and the measurement stage 3 can move independently on the guide surface 10G.

  The drive system 5 for moving the substrate stage 2 includes a planar motor for moving the substrate stage 2 on the guide surface 10G. The planar motor has a mover disposed on the substrate stage 2 and a stator disposed on the base member 10 as disclosed in, for example, US Pat. No. 6,452,292. Similarly, the drive system 6 for moving the measurement stage 3 includes a planar motor, and includes a mover disposed on the measurement stage 3 and a stator disposed on the base member 10.

  In the present embodiment, the substrate stage 2 defines a first holding portion 31 that releasably holds the lower surface Pb of the substrate P and an opening Th in which the substrate P can be disposed, and the substrate P is held by the first holding portion 31. And an upper surface disposed around the upper surface Pa of the substrate P.

  In the present embodiment, the substrate stage 2 is arranged around the first holding unit 31 as disclosed in, for example, US Patent Application Publication No. 2007/0177125, US Patent Application Publication No. 2008/0049209, and the like. And a second holding portion 32 that holds the lower surface Tb of the cover member T in a releasable manner. The cover member T is disposed around the substrate P held by the first holding unit 31. In the present embodiment, the cover member T has an opening Th in which the substrate P held by the first holding portion 31 is disposed. In the present embodiment, the cover member T has an upper surface 2U.

  In the present embodiment, the first holding unit 31 holds the substrate P so that the upper surface Pa of the substrate P and the XY plane are substantially parallel. The second holding part 32 holds the cover member T so that the upper surface 2U of the cover member T and the XY plane are substantially parallel. In the present embodiment, the upper surface Pa of the substrate P held by the first holding unit 31 and the upper surface 2U of the cover member T held by the second holding unit 32 are arranged in substantially the same plane (substantially flush with each other). Is).

  The cover member T may be formed integrally with the substrate stage 2. For example, at least a part of the substrate stage 2 may have the upper surface 2U.

  In the present embodiment, the measurement stage 3 includes a third holding part 33 that holds the measurement member C so as to be releasable, and a fourth holding part that is disposed around the third holding part 33 and holds the cover member Q so as to be releasable. 34. The third and fourth holding portions 33 and 34 have a pin chuck mechanism. The cover member Q is disposed around the measurement member C held by the third holding unit 33. The holding mechanism used at least one of the third holding part 33 and the fourth holding part 34 is not limited to the pin chuck mechanism. Further, at least one of the measurement member C and the cover member Q may be formed integrally with the measurement stage 3.

  In the present embodiment, the third holding unit 33 holds the measurement member C so that the upper surface of the measurement member C and the XY plane are substantially parallel. The fourth holding portion 34 holds the cover member Q so that the upper surface of the cover member Q and the XY plane are substantially parallel. In the present embodiment, the upper surface of the measurement member C held by the third holding unit 33 and the upper surface of the cover member Q held by the fourth holding unit 34 are arranged in substantially the same plane (substantially flush with each other). is there).

  Here, in the following description, the upper surface 2U of the cover member T held by the second holding unit 32 is appropriately referred to as the upper surface 2U of the substrate stage 2, and the upper surface of the measuring member C held by the third holding unit 33. In addition, the upper surface of the cover member Q held by the fourth holding portion 34 is referred to as the upper surface 3U of the measurement stage 3 as appropriate.

  The interferometer system 11 includes a laser interferometer unit 11A that measures the position of the mask stage 1, and a laser interferometer unit 11B that measures the positions of the substrate stage 2 and the measurement stage 3. The laser interferometer unit 11 </ b> A can measure the position of the mask stage 1 using a measurement mirror 1 </ b> R disposed on the mask stage 1. The laser interferometer unit 11B can measure the positions of the substrate stage 2 and the measurement stage 3 using the measurement mirror 2R arranged on the substrate stage 2 and the measurement mirror 3R arranged on the measurement stage 3.

  The alignment system 302 detects the alignment mark of the substrate P and detects the position of the shot region S of the substrate P. The alignment system 302 has a lower surface to which the substrate stage 2 (substrate P) can face. The upper surface 2U of the substrate stage 2 and the upper surface (front surface) Pa of the substrate P held on the substrate stage 2 can be opposed to the lower surface of the alignment system 302 facing the −Z direction.

  The surface position detection system 303 is also called, for example, an autofocus / leveling system, and detects the position of the upper surface Pa of the substrate P by irradiating the upper surface (front surface) Pa of the substrate P held on the substrate stage 2 with detection light. To do. The surface position detection system 303 has a lower surface to which the substrate stage 2 (substrate P) can face. The upper surface 2U of the substrate stage 2 and the upper surface Pa of the substrate P held on the substrate stage 2 can be opposed to the lower surface of the surface position detection system 303 facing the −Z direction.

  When executing the exposure process of the substrate P or when executing a predetermined measurement process, the control device 8 drives the drive systems 4, 5, 5 based on the measurement result of the interferometer system 11 and the detection result of the detection system 300. 6 is operated to perform position control of the mask stage 1 (mask M), the substrate stage 2 (substrate P), and the measurement stage 3 (measurement member C).

  The liquid immersion member 7 can form the liquid immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The liquid immersion member 7 is disposed in the vicinity of the terminal optical element 12 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. In the present embodiment, the liquid immersion member 7 is an annular member and is disposed around the optical path of the exposure light EL. In the present embodiment, at least a part of the liquid immersion member 7 is disposed around the terminal optical element 12.

  The last optical element 12 has an exit surface 13 that emits the exposure light EL toward the image plane of the projection optical system PL. In the present embodiment, the immersion space LS is formed on the emission surface 13 side. The immersion space LS is formed so that the optical path K of the exposure light EL emitted from the emission surface 13 is filled with the liquid LQ. The exposure light EL emitted from the emission surface 13 travels in the −Z direction. The exit surface 13 faces the traveling direction (−Z direction) of the exposure light EL. In the present embodiment, the emission surface 13 is a plane substantially parallel to the XY plane. The emission surface 13 may be inclined with respect to the XY plane, or may include a curved surface.

  The liquid immersion member 7 has a lower surface 14 at least partially facing the −Z direction. In the present embodiment, the emission surface 13 and the lower surface 14 can hold the liquid LQ with an object arranged at a position (projection region PR) where the exposure light EL emitted from the emission surface 13 can be irradiated. . The immersion space LS is formed by the liquid LQ held between at least a part of the emission surface 13 and the lower surface 14 and the object arranged in the projection region PR. The immersion space LS is formed so that the optical path K of the exposure light EL between the emission surface 13 and the object arranged in the projection region PR is filled with the liquid LQ. The liquid immersion member 7 can hold the liquid LQ with the object so that the optical path K of the exposure light EL between the terminal optical element 12 and the object is filled with the liquid LQ.

  In the present embodiment, the objects that can be arranged in the projection region PR include objects that can move with respect to the projection region PR on the image plane side of the projection optical system PL (the exit surface 13 side of the terminal optical element 12). The object is movable with respect to the last optical element 12 and the liquid immersion member 7. The object has an upper surface (surface) that can face at least one of the emission surface 13 and the lower surface 14. An immersion space LS can be formed between the upper surface of the object and the emission surface 13. In the present embodiment, an immersion space LS can be formed between the upper surface of the object and at least a part of the emission surface 13 and the lower surface 14. By holding the liquid LQ between the emission surface 13 and the lower surface 14 on one side and the upper surface (front surface) of the object on the other side, the optical path K of the exposure light EL between the last optical element 12 and the object is changed. An immersion space LS is formed so as to be filled with the liquid LQ.

  In the present embodiment, the object includes at least one of the substrate stage 2, the substrate P held on the substrate stage 2, the measurement stage 3, and the measurement member C held on the measurement stage 3. For example, the upper surface 2U of the substrate stage 2 and the surface (upper surface) Pa of the substrate P held on the substrate stage 2 are the exit surface 13 of the last optical element 12 facing the −Z direction and the liquid immersion facing the −Z direction. The lower surface 14 of the member 7 can be opposed. Of course, the object that can be placed in the projection region PR is not limited to at least one of the substrate stage 2, the substrate P held on the substrate stage 2, the measurement stage 3, and the measurement member C held on the measurement stage 3. Further, these objects can face at least a part of the detection system 300.

  In this embodiment, when the exposure light EL is irradiated to the substrate P, the immersion space LS is formed so that a partial region on the surface of the substrate P including the projection region PR is covered with the liquid LQ. During the exposure of the substrate P, the liquid immersion member 7 can hold the liquid LQ with the substrate P so that the optical path K of the exposure light EL between the terminal optical element 12 and the substrate P is filled with the liquid LQ. is there. At least a part of the interface (meniscus, edge) LG of the liquid LQ is formed between the lower surface 14 of the liquid immersion member 7 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  FIG. 2 is a side sectional view showing an example of the liquid immersion member 7 and the substrate stage 2 according to the present embodiment. FIG. 3 is an enlarged view of a part of FIG. In FIG. 2, the substrate P is disposed in the projection region PR (position facing the terminal optical element 12 and the liquid immersion member 7), but as described above, the substrate stage 2 (cover member T), and The measurement stage 3 (cover member Q, measurement member C) can also be arranged.

  As shown in FIG. 2, the liquid immersion member 7 includes at least a part 71 facing the exit surface 13 of the last optical element 12 and a main body 72 at least partly disposed around the last optical element 12. Including. The facing portion 71 has a hole (opening) 7 </ b> K at a position facing the emission surface 13. The facing portion 71 has an upper surface 7U at least partially facing the emission surface 13 via a gap, and a lower surface 7H on which the substrate P (object) can face. The hole 7K is formed so as to connect the upper surface 7U and the lower surface 7H. The upper surface 7U is disposed around the upper end of the hole 7K, and the lower surface 7H is disposed around the lower end of the hole 7K. The exposure light EL emitted from the emission surface 13 can pass through the hole 7K and irradiate the substrate P.

  In the present embodiment, each of the upper surface 7U and the lower surface 7H is disposed around the optical path K. In the present embodiment, the lower surface 7H is a flat surface. The lower surface 7H can hold the liquid LQ with the substrate P (object). In the following description, the lower surface 7H is appropriately referred to as a holding surface 7H.

  Further, the liquid immersion member 7 includes a supply port 15 that can supply the liquid LQ and a recovery port 16 that can recover the liquid LQ. The supply port 15 supplies the liquid LQ when the substrate P is exposed, for example. The recovery port 16 recovers the liquid LQ, for example, when the substrate P is exposed. The supply port 15 can supply the liquid LQ during one or both of the exposure and non-exposure of the substrate P. Note that the recovery port 16 can recover the liquid LQ during one or both of exposure and non-exposure of the substrate P.

  The supply port 15 is disposed so as to face the optical path K in the vicinity of the optical path K of the exposure light EL emitted from the emission surface 13. The supply port 15 only needs to face one or both of the space between the exit surface 13 and the opening 7K and the side surface of the last optical element 12. In the present embodiment, the supply port 15 supplies the liquid LQ to the space between the upper surface 7U and the emission surface 13. The liquid LQ supplied from the supply port 15 flows through the space between the upper surface 7U and the emission surface 13, and then is supplied onto the substrate P (object) through the opening 7K.

  The supply port 15 is connected to the liquid supply device 18 via the flow path 17. The liquid supply device 18 can deliver clean and temperature-adjusted liquid LQ. The channel 17 includes a supply channel 17 </ b> R formed inside the liquid immersion member 7 and a channel formed by a supply pipe connecting the supply channel 17 </ b> R and the liquid supply device 18. The liquid LQ delivered from the liquid supply device 18 is supplied to the supply port 15 via the flow path 17. At least in the exposure of the substrate P, the supply port 15 supplies the liquid LQ.

  The recovery port 16 can recover at least a part of the liquid LQ on the object facing the lower surface 14 of the liquid immersion member 7. The collection port 16 is disposed at least at a part around the opening 7K through which the exposure light EL passes. In the present embodiment, the collection port 16 is disposed at least at a part around the holding surface 7H. The recovery port 16 is disposed at a predetermined position of the liquid immersion member 7 facing the surface of the object. At least in the exposure of the substrate P, the substrate P faces the recovery port 16. In the exposure of the substrate P, the recovery port 16 recovers the liquid LQ on the substrate P.

  In the present embodiment, the main body 72 has an opening 7P that faces the substrate P (object). The opening 7P is disposed at least at a part around the holding surface 7H. In the present embodiment, the liquid immersion member 7 has a porous member 19 disposed in the opening 7P. In the present embodiment, the porous member 19 is a plate-like member including a plurality of holes (openings or pores). Note that a mesh filter, which is a porous member in which a large number of small holes are formed in a mesh shape, may be disposed in the opening 7P.

  In the present embodiment, the porous member 19 has a lower surface 19H on which the substrate P (object) can face, an upper surface 19U facing in the opposite direction of the lower surface 19H, and a plurality of holes connecting the upper surface 19U and the lower surface 19H. The lower surface 19H is disposed on at least a part of the periphery of the holding surface 7H. In the present embodiment, at least a part of the lower surface 14 of the liquid immersion member 7 includes a holding surface 7H and a lower surface 19H.

  In the present embodiment, the recovery port 16 includes a hole of the porous member 19. In the present embodiment, the liquid LQ on the substrate P (object) is recovered through the hole (recovery port 16) of the porous member 19. Note that the porous member 19 may not be disposed.

  The recovery port 16 is connected to the liquid recovery device 21 via the flow path 20. The liquid recovery apparatus 21 can connect the recovery port 16 to a vacuum system, and can suck the liquid LQ through the recovery port 16. The channel 20 includes a recovery channel 20R formed inside the liquid immersion member 7 and a channel formed by a recovery pipe that connects the recovery channel 20R and the liquid recovery device 21. The liquid LQ recovered from the recovery port 16 is recovered by the liquid recovery device 21 via the flow path 20.

  In the present embodiment, the control device 8 executes the recovery operation of the liquid LQ from the recovery port 16 in parallel with the supply operation of the liquid LQ from the supply port 15, so that the terminal optical element 12 on one side and An immersion space LS can be formed with the liquid LQ between the immersion member 7 and the object on the other side.

  In addition, as the liquid immersion member 7, for example, a liquid immersion member (nozzle member) as disclosed in US Patent Application Publication No. 2007/0132976 and European Patent Application Publication No. 1768170 can be used.

  As shown in FIGS. 2 and 3, the cover member T has an upper surface Ta adjacent to the upper surface Pa of the substrate P with a gap Ga interposed therebetween. The gap Ga includes a gap between the substrate P held by the first holding unit 31 and the cover member T held by the second holding unit 32. The substrate stage 2 includes a porous member 80 at least partially disposed in the gap Ga between the substrate P and the cover member T (substrate stage 2). At least a part of the porous member 80 is located below the gap Ga. In the present embodiment, at least a part of the liquid LQ flowing into the gap Ga is recovered through the porous member 80.

  In the present embodiment, the porous member 80 includes an upper surface 80A that can face at least one of the injection surface 13 and the lower surface 14, and a first side surface 80B that can face the side surface Pc of the substrate P held by the first holding unit 31. The cover member T held by the second holding part 32 has a second side face 80C that can be opposed to the inner face Tc. The side surface Pc of the substrate P connects the upper surface Pa of the substrate P and the lower surface Pb of the substrate P facing in the direction opposite to the upper surface Pa. The inner surface Tc of the cover member T connects the upper surface Ta of the cover member T and the lower surface Tb of the cover member T facing in the direction opposite to the upper surface Ta. The upper surface Ta of the cover member T includes the upper surface 2U of the substrate stage 2. In a state where the porous member 80 is not disposed, the side surface Pc of the substrate P and the inner surface Tc of the cover member T can face each other.

  In the present embodiment, the porous member 80 is made of, for example, titanium. The porous member 80 can be formed by, for example, a sintering method.

  In the present embodiment, the upper surface 80A of the porous member 80 is liquid repellent with respect to the liquid LQ. In the present embodiment, the contact angle of the upper surface 80A with respect to the liquid LQ is larger than 90 degrees, for example. The contact angle of the upper surface 80A with respect to the liquid LQ may be, for example, 100 degrees or more, or 110 degrees or more.

  In the present embodiment, the upper surface 80A of the porous member 80 is coated with a liquid repellent material containing fluorine. That is, a film 80F containing a liquid repellent material is disposed on the upper surface 80A. The liquid-repellent material may be, for example, PFA (Tetrafluoroethylene-perfluoroalkylvinylether copolymer), PTFE (Polytetrafluoroethylene), PEEK (polyetheretherketone), or Teflon (registered trademark).

  In the present embodiment, the contact angle of the upper surface 80A of the porous member 80 with respect to the liquid LQ is larger than the contact angle of the first side surface 80B. In the present embodiment, the contact angle of the upper surface 80A of the porous member 80 with respect to the liquid LQ is larger than the contact angle of the second side surface 80C.

  The contact angle of the upper surface 80A of the porous member 80 with respect to the liquid LQ may be smaller than the contact angle of the first side surface 80B, or may be substantially the same as the contact angle of the first side surface 80B. The contact angle of the upper surface 80A of the porous member 80 with respect to the liquid LQ may be smaller than the contact angle of the second side surface 80C, or may be substantially the same as the contact angle of the second side surface 80C.

  In the present embodiment, the contact angle of the upper surface Pa of the substrate P with respect to the liquid LQ and the contact angle of the upper surface Ta of the cover member T are larger than the contact angle of the first side surface 80B. In the present embodiment, the contact angle of the upper surface Pa of the substrate P with respect to the liquid LQ and the contact angle of the upper surface Ta of the cover member T are larger than the contact angle of the second side surface 80C.

  Note that the contact angle of the upper surface Pa of the substrate P with respect to the liquid LQ and the contact angle of the upper surface Ta of the cover member T may be smaller than the contact angle of the first side surface 80B or substantially the same as the contact angle of the first side surface 80B. It may be the same. Note that the contact angle of the upper surface Pa of the substrate P with respect to the liquid LQ and the contact angle of the upper surface Ta of the cover member T may be smaller than the contact angle of the second side surface 80C or substantially the same as the contact angle of the second side surface 80C. It may be the same.

  In the present embodiment, the upper surface 80A of the porous member 80 is substantially flush with the upper surface Pa of the substrate P held by the first holding unit 31 and the upper surface Ta of the cover member T held by the second holding unit 32. It is.

  The upper surface 80A of the porous member 80 may be disposed at a position (−Z side position) lower than the upper surface Pa of the substrate P and the upper surface Ta of the cover member T, or at a higher position (position on the + Z side). It may be arranged.

  In the present embodiment, the distance L1 between the side surface Pc of the substrate P held by the first holding unit 31 and the first side surface 80B of the porous member 80 is the inner surface Tc of the cover member T held by the second holding unit 32. And the distance L2 between the second side surface 80C of the porous member 80.

  The distance L1 between the side surface Pc and the first side surface 80B may be smaller than the distance L2 between the inner surface Tc and the second side surface 80C, or may be substantially the same as the distance L2.

  In the present embodiment, the substrate stage 2 has a space 23 that communicates with the gap Ga. The space 23 is located below the gap Ga. In the present embodiment, at least a part of the porous member 80 is disposed in the space portion 23. That is, in this embodiment, at least a part of the porous member 80 is disposed below the gap Ga. In the present embodiment, the porous member 80 includes a first portion 801 disposed in the gap Ga and a second portion 802 disposed in the space portion 23 below the gap Ga.

  In the present embodiment, the dimension Wa of the gap Ga is smaller than the dimension Wb of the space part 23 with respect to the radial direction with respect to the center of the first holding part 31. The dimension Wa may be larger than the dimension Wb or may be substantially the same as the dimension Wb.

  In the present embodiment, the dimension W2 of the second part 802 is larger than the dimension W1 of the first part 801 with respect to the radial direction with respect to the center of the first holding part 31. Note that the dimension W2 may be smaller than the dimension W1, or may be substantially the same as the dimension W1.

  In addition, the dimension of the radial direction with respect to the center of the 1st holding | maintenance part 31 means the dimension regarding the radial direction in XY plane.

  In the present embodiment, the porous member 80 is supported by the case 81. The case 81 is disposed in the space portion 23 so as to contact at least a part of the second portion 802. In the present embodiment, the case 81 is disposed so as to contact at least part of the lower surface and the side surface of the second portion 802. In the present embodiment, the case 81 is made of, for example, ceramic. The case 81 may be made of metal.

  In the present embodiment, a support member 82 is disposed between the porous member 80 and the case 81 and the cover member T. The support member 82 is supported by at least a part of the porous member 80 (second portion 802) and the case 81. The support member 82 can face at least a part of the lower surface Tb of the cover member T. The support member 82 supports at least a part of the lower surface Tb of the cover member T.

  In the present embodiment, the substrate stage 2 has a suction port 24 disposed in the space 23. In the present embodiment, the suction port 24 is formed on at least a part of the inner surface of the substrate stage 2 that forms the space 23. The suction port 24 sucks at least a part of the fluid in the space portion 23 so that the space portion 23 has a negative pressure. The suction port 24 can suck one or both of the liquid and gas in the space 23.

  The suction port 24 is connected to the fluid suction device 26 via the flow path 25. The fluid suction device 26 can connect the suction port 24 to a vacuum system, and can suck one or both of liquid and gas through the suction port 24. At least a part of the flow path 25 is formed inside the substrate stage 2. The fluid (at least one of liquid and gas) sucked from the suction port 24 is sucked into the fluid suction device 26 via the flow path 25.

  In the present embodiment, the case 81 has a hole (opening) 81 </ b> H that connects the outer surface and the inner surface of the case 81. The opening 83 at the upper end of the hole 81 </ b> H faces the lower surface of the porous member 80. The opening at the lower end of the hole 81H is connected to the suction port 24. The suction port 24 can suck the fluid in the space inside the case 81 through the hole 81H so that the space inside the case 81 has a negative pressure.

  In the present embodiment, the first holding unit 31 has, for example, a pin chuck mechanism. The first holding portion 31 is disposed on the support surface 31S of the substrate stage 2, and is disposed on the peripheral wall portion 35 that can be opposed to the lower surface Pb of the substrate P, and the support surface 31S on the inner side of the peripheral wall portion 35, and includes a plurality of pin members. The support portion 36 includes a suction port 37 that is disposed on the support surface 31S and sucks fluid. The suction port 37 is connected to a fluid suction device. The fluid suction device is controlled by the control device 8. The upper surface of the peripheral wall portion 35 can face the lower surface Pb of the substrate P. The peripheral wall portion 35 can form a negative pressure space in at least a part between the lower surface Pb of the substrate P. The control device 8 performs the suction operation of the suction port 37 in a state where the lower surface Pb of the substrate P and the upper surface of the peripheral wall portion 35 are in contact with each other, whereby the peripheral wall portion 35, the lower surface Pb of the substrate P, the support surface 31S, and the like. The space 31H formed by can be set to a negative pressure. As a result, the substrate P is held by the first holding unit 31. In addition, the substrate P is released from the first holding unit 31 by releasing the suction operation of the suction port 37.

  In the present embodiment, the second holding unit 32 has, for example, a pin chuck mechanism. The second holding part 32 is arranged so as to surround the peripheral wall part 35 on the support surface 32S of the substrate stage 2, and surrounds the peripheral wall part 38 on the support surface 32S so that the lower surface Tb of the cover member T can be opposed. And a support surface 40 that includes a plurality of pin members, and a support surface that is disposed on the support surface 32S between the peripheral wall portion 39 and the peripheral wall portion 39. And a suction port 41 for sucking fluid. The suction port 41 is connected to a fluid suction device. The fluid suction device is controlled by the control device 8. The upper surfaces of the peripheral wall portions 38 and 39 can face the lower surface Tb of the cover member T. The peripheral wall portions 38 and 39 can form a negative pressure space in at least a portion between the lower surface Tb of the cover member T. The control device 8 performs the suction operation of the suction port 41 in a state where the lower surface Tb of the cover member T and the upper surfaces of the peripheral wall portions 38 and 39 are in contact with each other, whereby the peripheral wall portion 38, the peripheral wall portion 39, and the cover member T The space 32H formed by the lower surface Tb and the support surface 32S can be set to a negative pressure. Thereby, the cover member T is held by the second holding portion 32. Further, the cover member T is released from the second holding portion 32 by releasing the suction operation of the suction port 41.

  The space portion 23 includes a space around the peripheral wall portion 35. In the present embodiment, the space portion 23 includes a space between the peripheral wall portion 35 and the peripheral wall portion 38.

  FIG. 4 is a diagram illustrating an example of a state in which at least a part of the liquid LQ flowing into the gap Ga is recovered through the porous member 80. In the present embodiment, the immersion space between the last optical element 12 and the liquid immersion member 7 and at least one of the substrate P held by the first holding unit 31 and the cover member T held by the second holding unit 32. LS is formed. Moreover, the immersion space LS may be formed on the gap Ga. There is a possibility that at least a part of the liquid LQ in the immersion space LS flows into the gap Ga.

  In the present embodiment, the control device 8 collects at least a part of the liquid LQ that has flowed into the gap Ga through the porous member 80. When recovering the liquid LQ that has flowed into the gap Ga, the control device 8 controls the fluid suction device 26 to connect the suction port 24 to the vacuum system. As a result, the fluid in the space 23 is sucked from the suction port 24, and the space 23 becomes negative pressure.

  As described above, the suction port 24 can suck the fluid in the space inside the case 81 through the hole 81H. By performing the suction operation of the suction port 24, the space inside the case 81 and the hole of the porous member 80 disposed in the space inside the case 81 become negative pressure. Thereby, the fluid around the porous member 80 is sucked from the hole of the porous member 80. In the present embodiment, the holes of the porous member 80 function as a recovery port that can recover the fluid.

  As shown in FIG. 4, the liquid LQ that flows between the first side surface 80B of the porous member 80 and the side surface Pc of the substrate P by the suction operation of the suction port 24 enters the hole of the first side surface 80B. Sucked. That is, the porous member 80 collects the liquid LQ that has flowed between the first side surface 80B and the side surface Pc of the substrate P from the hole of the first side surface 80B that faces the side surface Pc of the substrate P.

  Further, as shown in FIG. 4, the liquid LQ that has flowed between the second side surface 80C of the porous member 80 and the inner surface Tc of the cover member T by the suction operation of the suction port 24 becomes the second side surface 80C. Sucked into the hole. That is, the porous member 80 collects the liquid LQ that flows between the second side surface 80C and the inner surface Tc of the cover member T from the hole of the second side surface 80C that faces the inner surface Tc of the cover member T.

  At least a part of the liquid LQ collected through the porous member 80 is sucked from the suction port 24. In the present embodiment, at least a part of the liquid LQ collected from the holes of the first and second side surfaces 80B and 80C flows through the porous member 80 and then is sucked from the suction port 24. As a result, the liquid LQ is removed from the gap Ga and the space 23.

  In the present embodiment, the lower surface and side surfaces of the second portion 802 are covered with the case 81. The first and second side surfaces 80 </ b> B and 80 </ b> C of the first portion 801 are not covered with the case 81. The first and second side surfaces 80B and 80C of the first portion 801 can contact the liquid LQ flowing into the gap Ga. Therefore, by performing the suction operation of the suction port 24, the liquid LQ flowing into the gap Ga is smoothly collected from the first and second side surfaces 80B and 80C.

  As described above, in the present embodiment, the contact angle of the upper surface 80A of the porous member 80 with respect to the liquid LQ is larger than the contact angles of the first and second side surfaces 80B and 80C. In the present embodiment, the inflow of the liquid LQ into the hole in the upper surface 80A is suppressed more than the inflow into the holes in the first and second side surfaces 80B and 80C. For example, the porous member 80 does not have to recover the liquid LQ from the hole in the upper surface 80A.

  Note that the inflow of the liquid LQ into the hole in the upper surface 80A may not be suppressed more than the inflow into the holes in the first and second side surfaces 80B and 80C. That is, the porous member 80 may collect the liquid LQ from the hole in the upper surface 80A.

  Next, an example of the operation of the exposure apparatus EX will be described with reference to FIGS.

  FIG. 5 is a flowchart showing an example of the operation of the exposure apparatus EX according to the present embodiment. As shown in FIG. 5, in the present embodiment, an exposure sequence SM1 including a process of exposing the substrate P with the exposure light EL via the exposure liquid LQ, and a cleaning sequence for cleaning at least a part of the exposure apparatus EX. SM2 is executed. In this embodiment, an example in which the cleaning sequence SM2 is executed after the exposure sequence SM1 is executed will be described. However, the exposure sequence SM1 may be executed after the cleaning sequence SM2 is executed, or the exposure sequence SM2 may be executed. SM1 and cleaning sequence SM2 may be repeated a plurality of times.

  The cleaning sequence SM2 is executed as necessary, for example, when a defect is increased in a pattern formed on the substrate P by exposure, or when a residual liquid is increased in the peripheral edge of the upper surface Pa of the substrate P after exposure. May be.

  The exposure sequence SM1 will be described. FIG. 6 is a flowchart showing an example of the exposure sequence SM1 according to the present embodiment. FIG. 7 is a diagram illustrating an example of the substrate P held by the first holding unit 31 (substrate stage 2). FIG. 8 is a diagram illustrating an example of operations of the substrate stage 2 and the measurement stage 3.

  In the present embodiment, the substrate stage 2 is movable at least between the first position EP and the second position RP. The first position EP is an immersion space LS between the last optical element 12 and the liquid immersion member 7 and at least one of the upper surface Pa of the substrate P held by the first holding unit 31 and the upper surface 2U (Ta) of the substrate stage 2. Can be formed. In other words, the first position EP is a position facing the last optical element 12 and the liquid immersion member 7.

  In the second position RP, the immersion space LS is not formed between the last optical element 12 and the liquid immersion member 7 and at least one of the upper surface Pa of the substrate P held by the first holding unit 31 and the upper surface 2U of the substrate stage 2. This is a possible position.

  The first position EP is a position where the substrate P held by the first holding unit 31 can be exposed. In the present embodiment, at least one of the operation of carrying out the exposed substrate P from the first holding unit 31 and the operation of carrying the unexposed substrate P into the first holding unit 31 is executed in the second position RP, for example. This is the board replacement position.

  Note that the second position EP is not limited to the substrate replacement position.

  In the following description, the first position EP is appropriately referred to as an exposure position EP, and the second position RP is appropriately referred to as a substrate replacement position RP.

  Further, in the following description, at the substrate replacement position RP, the process of carrying the substrate P before exposure into the first holding unit 31 and the process of carrying out the substrate P after exposure from the first holding unit 31 are performed as appropriate. This is called processing.

  In order to expose the substrate P held by the first holding unit 31, the substrate stage 2 is moved to the exposure position EP, and between the last optical element 12 and the liquid immersion member 7 and the substrate stage 2 (substrate P). After the immersion space LS is formed with the liquid LQ, the control device 8 starts an exposure process for the substrate P (step ST1).

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 8 moves the substrate P in the Y axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction. As a result, the substrate P is exposed with the exposure light EL through the liquid LQ, and the pattern image of the mask M is projected onto the substrate P through the projection optical system PL and the liquid LQ.

  As shown in FIG. 7, in this embodiment, a plurality of shot areas S, which are exposure target areas, are arranged in a matrix on the substrate P. The control device 8 sequentially exposes a plurality of shot areas S determined on the substrate P.

  When exposing the shot region S of the substrate P, the terminal optical element 12 and the liquid immersion member 7 and the substrate P are opposed to each other, and the optical path K of the exposure light EL between the terminal optical element 12 and the substrate P is filled with the liquid LQ. The immersion space LS is formed as described above. When sequentially exposing the plurality of shot regions S of the substrate P, the immersion space LS is filled with the liquid LQ between the last optical element 12 and the liquid immersion member 7 and at least one of the upper surface Pa of the substrate P and the upper surface 2U of the substrate stage 2. Is formed, the substrate stage 2 is moved in the XY plane by the drive system 5. In the state where the immersion space LS is formed with the liquid LQ between the last optical element 12 and the liquid immersion member 7 and at least one of the upper surface Pa of the substrate P and the upper surface 2U of the substrate stage 2, the control device 8 While moving the stage 2, the substrate P is exposed.

  For example, in order to expose the first shot area (first shot area) S among the plurality of shot areas S on the substrate P, the control device 8 moves the first shot area S to the exposure start position. The control device 8 moves the first shot region S (substrate P) in the Y-axis direction with respect to the projection region PR of the projection optical system PL while the immersion space LS is formed. The exposure light EL is irradiated to the shot area S.

  After the exposure of the first shot area S is completed, in order to expose the next second shot area S, the control device 8 moves the substrate P in the X-axis direction (with the immersion space LS formed) Alternatively, the second shot region S is moved to the exposure start position by moving in the direction inclining with respect to the X-axis direction in the XY plane. The control device 8 exposes the second shot area S in the same manner as the first shot area S.

  The control device 8 finishes the operation (scan exposure operation) of irradiating the shot region S with the exposure light EL while moving the shot region S in the Y-axis direction with respect to the projection region PR, and the exposure of the shot region S. Thereafter, while repeating the operation (stepping operation) for moving the next shot region S to the exposure start position, the plurality of shot regions S on the substrate P are transferred to the projection optical system PL and the liquid LQ in the immersion space LS. Are sequentially exposed. The exposure light EL is sequentially irradiated onto the plurality of shot regions S of the substrate P.

  In the present embodiment, the control device 8 moves the substrate stage 2 so that the projection region PR of the projection optical system PL and the substrate P move relatively along the movement locus indicated by the arrow R1 in FIG. While exposing the projection area PR to the exposure light EL, the plurality of shot areas S of the substrate P are sequentially exposed with the exposure light EL through the liquid LQ. In at least part of the movement of the substrate stage 2 in the exposure of the substrate P, the immersion space LS is formed on the gap Ga.

  When the exposure of the last shot area S among the plurality of shot areas S on the substrate P is completed, in other words, the exposure of the exposure light EL to the plurality of shot areas S is completed, thereby exposing the substrate P. Ends (step ST2).

  After the irradiation of the exposure light EL to the plurality of shot regions S (after the exposure of the substrate P) is completed, the control device 8 moves the substrate stage 2 to the substrate replacement position RP in order to execute the substrate replacement process (step ST3). ).

  As shown in FIG. 8, after the substrate stage 2 is disposed at the substrate replacement position RP, the control device 8 unloads the exposed substrate P from the first holding unit 31 using a substrate transport device (not shown). (Unload) (step ST4).

  After the exposed substrate P is unloaded from the first holding unit 31, the control device 8 loads the unexposed substrate P into the first holding unit 31 using a substrate transfer device (not shown). (Load) (step ST5).

  As shown in FIG. 8, when the substrate replacement process is being performed, the measurement stage 3 is disposed at the exposure position EP. The control device 8 executes a predetermined measurement process using the measurement stage 3 (measurement member C, measurement device) as necessary. After the substrate P before exposure is loaded on the first holding unit 31 and the measurement process using the measurement stage 3 is completed, the control device 8 moves the substrate stage 2 to the exposure position EP (step ST6).

  In the present embodiment, the control device 8 is held by the substrate stage 2 (first holding unit 31) using the alignment system 302 when moving the substrate stage 2 from the substrate exchange position RP to the exposure position EP. The alignment mark of the substrate P being detected is detected (step ST7). Further, when the control device 8 moves the substrate stage 2 from the substrate exchange position RP to the exposure position EP, the substrate held by the substrate stage 2 (first holding unit 31) using the surface position detection system 303. The position of the upper surface Pa of P is detected.

  After the detection of the alignment mark on the substrate P and the detection of the position of the upper surface Pa of the substrate P are completed, the control device 8 starts exposure of the substrate P while adjusting the position of the substrate P based on the detection result. To do. Thereafter, similar processing is repeated, and a plurality of substrates P are sequentially exposed.

  In the present embodiment, the suction port 24 (the porous member 80) is in each of at least a part of the first period in which the exposure of the substrate P is executed and at least a part of the second period in which the exposure of the substrate P is not executed. A suction operation is performed.

  In the present embodiment, the first period includes a period in which the substrate stage 2P is disposed at the exposure position EP. The first period includes a period from the start of exposure of the substrate P (step ST1) to the end of exposure of the substrate P (step ST2).

  In the present embodiment, the first period includes a period from the start of exposure of the first shot area S to the end of exposure of the last shot area S among the plurality of shot areas S. The control device 8 continues to perform the fluid suction operation of the suction port 24 from the start of the exposure of the first shot region S to the end of the exposure of the last shot region S among the plurality of shot regions S. Thereby, for example, in at least a part of the first period in which the exposure light EL is sequentially irradiated onto the plurality of shot regions S, the immersion space LS is formed on the gap Ga, and the liquid LQ in the immersion space LS is formed. Even if it flows into the gap Ga, the liquid LQ flowing into the gap Ga is immediately sucked from the suction port 24 (the porous member 80) in the first period. Further, the liquid LQ that has flowed into the space 23 via the gap Ga is also sucked from the suction port 24 (the porous member 80).

  In the present embodiment, the second period includes a period after the irradiation of the exposure light EL to the substrate P is completed. In the present embodiment, the second period includes a period after the irradiation of the exposure light EL with respect to the plurality of shot regions S is completed. In other words, the second period includes a period after the exposure of the last shot area S among the plurality of shot areas S. By performing the suction operation of the suction port 24 (the porous member 80) in the second period, the liquid LQ in the space portion 23 is sucked (collected) by the suction operation of the suction port 24 (the porous member 80) in the first period. Even if not, the liquid LQ is removed from the gap Ga (space portion 23) by the suction operation of the suction port 24 (porous member 80) in the second period.

  In the present embodiment, the second period includes a period before the irradiation of the exposure light EL with respect to the substrate P is started. In the present embodiment, the second period includes a period before the irradiation of the exposure light EL with respect to the plurality of shot regions S is started. In other words, the second period includes a period before the exposure of the first shot area S among the plurality of shot areas S. By performing the suction operation of the suction port 24 (the porous member 80) in the second period, the exposure of the substrate P can be started after the liquid LQ is removed from the gap Ga (space portion 23).

  In the present embodiment, the control device 8 uses the suction force of the suction port 24 (the porous member 80) in at least a part of the first period in which the exposure of the substrate P is performed in the second period in which the exposure of the substrate P is not performed. The suction force is made smaller than the suction force of the suction port 24 (porous member 80). That is, the control device 8 sucks the fluid in the gap Ga (space portion 23) from the suction port 24 with the first suction force during at least a part of the first period, and the gap Ga (space portion 23) during the second period. Is sucked from the suction port 24 with a second suction force larger than the first suction force. In other words, the control device 8 sucks the fluid at the first flow rate per unit time from the suction port 24 (porous member 80) in at least a part of the first period, and sucks the suction port 24 (porous member 80) in the second period. The fluid is sucked at a second flow rate higher than the first flow rate per unit time.

  In the present embodiment, among the plurality of substrates P that are sequentially exposed, in the second period, from the time when the exposure of the first substrate P is completed (when the exposure of the last shot region S is completed), This includes at least a part of the period until the start of exposure (at the start of exposure of the first shot region S).

  For example, in the second period, after the exposure of the first substrate P is completed (step ST2), the first substrate P after the exposure is unloaded from the first holding unit 31, and the second substrate P before the exposure is discharged. It may be a period until the alignment mark detection start (step ST7) of the second substrate P which is carried into the first holding unit 31 and before the exposure. That is, in the present embodiment, the second period may be a period from the end of exposure of the substrate P (step ST2) to the detection of the alignment mark of the next substrate P (step ST7).

  Further, in the second period, after the exposure of the exposure light EL to the substrate P is completed (step ST2), the substrate stage 2 holding the substrate P before exposure by the first holding unit 31 starts moving to the exposure position EP ( It may be the period of step ST6).

  Further, the second period may be a period from the end of irradiation of the exposure light EL to the substrate P (step ST2) until the substrate P before exposure is carried into the first holding unit 31 (step ST5).

  Further, the second period may be a period from the end of irradiation of the exposure light EL to the substrate P (step ST2) until the substrate P is unloaded from the first holding unit 31 (step ST4).

  In the second period, after the exposure of the exposure light EL to the substrate P is completed (step ST2), the substrate stage 2 holding the exposed substrate P by the first holding unit 31 starts moving to the substrate exchange position EP. (Step ST3).

  Note that the second period may be a period in which the substrate stage 2 is disposed at the substrate exchange position RP. Further, the second period may be a period in which the substrate P is not held by the first holding unit 31. During a period in which the substrate P is not held by the first holding unit 31, the exposed substrate P is carried out from the first holding unit 31 (step ST4), and then the unexposed substrate P is carried into the first holding unit 31. This includes a period (substrate replacement processing period) until the process is performed (step ST5). The period during which the substrate P is not held by the first holding unit 31 is not limited to the substrate replacement processing period.

  Note that the second period may be a period of steps ST3 to ST7, a period of steps ST3 to ST6, a period of steps ST3 to ST5, a period of steps ST3 to ST4, or a step ST4 to ST4. It may be a period of ST7 or a period of steps ST4 to ST6.

  In the present embodiment, the control device 8 sucks the fluid with the first suction force from the suction port 24 (the porous member 80) in the exposure of the substrate P (the plurality of shot regions S), and applies to the last shot region S of the substrate P. At the end of irradiation with the exposure light EL (step ST2), the suction force of the suction port 24 (porous member 80) is changed from the first suction force to the second suction force. In that case, in the second period, after the irradiation of the exposure light EL with respect to the substrate P (the plurality of shot regions S), at least one of the last optical element 12, the liquid immersion member 7, the upper surface of the substrate P, and the upper surface 2U of the substrate stage 2 is performed. Including a period in which the immersion space LS is formed.

  When the immersion space LS changes from the state where it is formed on the substrate stage 2 to the state where it is formed on the measurement stage 3 (for example, step ST3), the suction force of the suction port 24 (the porous member 80) is changed. The first suction force may be changed to the second suction force. In that case, after the irradiation of the exposure light EL is completed, the first through the suction port 24 (the porous member 80) during the period in which the immersion space LS is formed on at least one of the upper surface of the substrate P and the upper surface 2U of the substrate stage 2. Fluid is sucked by suction force.

  Note that when the exposed substrate P is unloaded from the first holding unit 31 (step ST4), the suction force of the suction port 24 (porous member 80) may be changed from the first suction force to the second suction force. Good.

  Even when the substrate P before exposure is carried into the first holding unit 31 (step ST5), the suction force of the suction port 24 (the porous member 80) is changed from the second suction force to the first suction force. Good.

  When the immersion space LS is changed from the state formed on the measurement stage 3 to the state formed on the substrate stage 2 (for example, step ST6), the suction force of the suction port 24 (the porous member 80) is changed. The second suction force may be changed to the first suction force.

  When the alignment mark on the substrate P is detected (step ST7), the suction force of the suction port 24 (porous member 80) may be changed from the second suction force to the first suction force.

  Even if the suction force of the suction port 24 (the porous member 80) is changed from the second suction force to the first suction force at the start of irradiation of the exposure light EL to the first shot region S of the substrate P (step ST1). Good.

  In the present embodiment, for example, in the scanning exposure operation in which the exposure light EL is irradiated onto the substrate P (shot region S), the fluid suction operation of the suction port 24 (porous member 80) is executed, and the exposure light EL is applied to the substrate P. The fluid suction operation of the suction port 24 (the porous member 80) may be stopped in the stepping operation that is not irradiated. Note that the fluid suction operation of the suction port 24 (porous member 80) is performed in the stepping operation in which the exposure light EL is not irradiated onto the substrate P, and the suction is performed in the scan exposure operation in which the exposure light EL is irradiated onto the substrate P (shot region S) The fluid suction operation of the port 24 (the porous member 80) may be stopped.

  In the present embodiment, fluid is sucked from the suction port 24 (porous member 80) by the first suction force during the scan exposure operation, and fluid is sucked from the suction port 24 (porous member 80) by the second suction force during the stepping operation. May be aspirated.

  Next, the cleaning sequence SM2 will be described. FIG. 9 is a flowchart showing an example of the cleaning sequence SM2 according to the present embodiment.

  In the present embodiment, the cleaning sequence SM2 is executed using the cleaning liquid LC. In the present embodiment, the cleaning sequence SM2 includes a process of supplying a cleaning liquid LC (step SC1), and a process of supplying a rinse (flushing) liquid after cleaning using the liquid LC (step SC2). Including.

  In the present embodiment, an example in which at least a part of the cover member T and / or at least a part of the member positioned below the gap Ga is cleaned using the liquid LC will be described. In the present embodiment, the member located below the gap Ga includes at least a part of the porous member 80. Note that the member positioned below the gap Ga may be a member of the substrate stage 2. The member positioned below the gap Ga may be at least a part of the inner surface of the space portion 23 of the substrate stage 2 disposed below the gap Ga. That is, for example, in exposure of the substrate P, a member that may come into contact with the liquid LQ that has flowed into the space below the gap Ga from the gap Ga between the substrate P and the cover member T may be cleaned with the liquid LC. .

  FIG. 10 is a diagram illustrating an example of the cleaning sequence SM2 according to the present embodiment. In the present embodiment, the dummy substrate DP is held by the first holding unit 31 when the cleaning sequence SM2 is executed. The dummy substrate DP is a substrate that is less likely to emit foreign matter than the substrate P for manufacturing a device. For example, a semiconductor wafer may be used as the dummy substrate DP. For example, a semiconductor wafer in which a photosensitive film is not formed and a film having a liquid repellency with respect to the liquid LC (LQ) may be used. For example, a metal substrate may be used as the dummy substrate DP.

  In the present embodiment, the outer shape of the dummy substrate DP is substantially equal to the outer shape of the substrate P. The first holding unit 31 can hold the dummy substrate DP. In the present embodiment, the distance between the side surface of the dummy substrate DP held by the first holding unit 31 and the first side surface 80B is the distance between the side surface of the substrate P held by the first holding unit 31 and the first side surface 80B. Is almost equal to Note that the outer shape of the dummy substrate DP may be smaller or larger than the outer shape of the substrate P. The distance between the side surface of the dummy substrate DP held by the first holding unit 31 and the first side surface 80B is larger than the distance between the side surface of the substrate P held by the first holding unit 31 and the first side surface 80B. It may be small or small.

  In the present embodiment, the upper surface of the dummy substrate DP to which the lower surface 14 of the liquid immersion member 7 can face is liquid repellent with respect to the liquid LC (LQ). The side surface of the dummy substrate DP facing the first side surface 80B is also liquid repellent with respect to the liquid LC (LQ). For example, the contact angle between the upper surface and the side surface of the dummy substrate DP with respect to the liquid LC (LQ) is 90 degrees or more.

  In the present embodiment, the types of the liquid LC and the liquid LQ are different. The liquid LC may contain alcohol, for example. For example, the liquid LC may include at least one of ethanol, isopropyl alcohol (IPA), and pentanol.

  An alkaline liquid may be used as the liquid LC. For example, the liquid LC may contain tetramethyl ammonium hydroxide (TMAH). For example, a tetramethyl ammonium hydroxide (TMAH) aqueous solution may be used as the liquid LC.

  An acidic liquid may be used as the liquid LC. For example, the liquid LC may contain hydrogen peroxide. For example, an aqueous hydrogen peroxide solution (hydrogen peroxide solution) may be used as the liquid LC.

  As the liquid LC, an inorganic alkali solution such as sodium hydroxide or potassium hydroxide, or an organic alkali solution such as trimethyl (2-hydroxyethyl) ammonium hydroxide may be used. Note that ammonia water may be used as the liquid LC.

  The liquid LC may include a buffered hydrofluoric acid solution. The liquid LC may be a solution containing buffered hydrofluoric acid and hydrogen peroxide. Buffered hydrofluoric acid (buffered hydrofluoric acid) is a mixture of hydrofluoric acid and ammonium fluoride. Note that an ozone liquid containing ozone may be used as the liquid LC. Note that a solution containing hydrogen peroxide and ozone may be used as the liquid LC.

  As shown in FIG. 10, in the present embodiment, the space that the lower surface 14 of the liquid immersion member 7 faces so that the liquid LC immersion space LT is formed between the liquid immersion member 7 and the porous member 80. Is supplied with liquid LC. In the present embodiment, when the liquid LC is supplied to the space that the lower surface 14 faces, the dummy substrate DP is held by the first holding unit 31 and the cover member T is held by the second holding unit 32. In a state where at least a part of the porous member 80 is disposed in the gap Gd between the dummy substrate DP and the cover member T, the liquid LC is supplied to the space where the lower surface 14 faces.

  In the present embodiment, the lower surface 14 of the liquid immersion member 7, the upper surface Pad of the dummy substrate DP, and the cover member T are formed so that at least a part of the liquid LC immersion space LT is formed on the porous member 80. The liquid LC is supplied to the space where the lower surface 14 faces in a state where at least one of the upper surfaces Ta faces.

  In the present embodiment, from the supply port arranged at a position where at least one of the upper surface Ta of the cover member T, the upper surface 80A of the porous member 80, and the upper surface Pad of the dummy substrate DP can be opposed to the space facing the lower surface 14. Liquid LC is supplied.

  For example, the liquid LC may be supplied from the supply port 15 of the liquid immersion member 7 to the space where the lower surface 14 faces. For example, a supply device capable of delivering the liquid LC may be connected to the flow path 17 and the liquid LC delivered from the supply apparatus may be supplied to the supply port 15 via the flow path 17. For example, the control device 8 supplies the liquid LC from the supply port 15, collects the liquid LC from the recovery port 16 of the liquid immersion member 7, and sets the liquid LC between the liquid immersion member 7 and the porous member 80. The immersion space LT may be formed.

  The liquid LC may be supplied from the recovery port 16 of the liquid immersion member 7 to the space where the lower surface 14 faces. That is, in the cleaning sequence SM2, the recovery port 16 of the liquid immersion member 7 that can face at least one of the upper surface Ta, the upper surface 80A, and the upper surface Pad may function as a supply port that supplies the liquid LC. For example, a supply device capable of delivering the liquid LC may be connected to the flow path 20, and the liquid LC delivered from the supply device may be supplied to the recovery port 16 via the flow path 20.

  Note that an opening different from the supply port 15 and the recovery port 16 is provided in at least a part of the liquid immersion member 7 to which at least one of the upper surface Ta, the upper surface 80A, and the upper surface Pad can face, and the liquid LC is supplied from the opening. May be.

  The liquid LC supplied from the liquid immersion member 7 (for example, one or both of the supply port 15 and the recovery port 16) contacts the upper surface 80A of the porous member 80. Thereby, the upper surface 80A is cleaned with the liquid LC. Further, the liquid LC contacts at least a part of the upper surface Ta of the cover member T. Thereby, at least a part of the upper surface Ta is cleaned with the liquid LC. Further, the liquid LC flows into the gap between the porous member 80 and the dummy substrate DP. Thereby, the first side surface 80B of the porous member 80 is cleaned with the liquid LC. Further, the liquid LC flows into the gap between the porous member 80 and the cover member T. Thereby, the second side surface 80C of the porous member 80 and the inner surface Tc of the cover member T are cleaned with the liquid LC.

  In the present embodiment, the porous member 80 collects at least a part of the liquid LC supplied from the liquid immersion member 7. The control device 8 controls the fluid suction device 26 to recover the liquid LC from the hole of the porous member 80. Thereby, the inner surface of the hole of the porous member 80 (inside the porous member 80) is cleaned with the liquid LC.

  In the present embodiment, the control device 8 supplies the liquid LC from the liquid immersion member 7, collects the liquid LC from the hole of the porous member 80, and removes the liquid LC between the liquid immersion member 7 and the porous member 80. The immersion space LT is formed. The control device 8 stops the recovery operation of the porous member 80 when supplying the liquid LC from the liquid immersion member 7, and stops the liquid from the porous member 80 when the supply of the liquid LC from the liquid immersion member 7 is stopped. LC recovery may be performed.

  The control device 8 executes the supply of the liquid LC for a predetermined time. The predetermined time is a supply time of the liquid LC sufficient to clean the porous member 80, the cover member T, and the like. The control device 8 stops the supply of the liquid LC after a predetermined time has elapsed since the supply of the liquid LC was started. Thereby, the cleaning using the liquid LC is completed.

  The control device 8 may stop supplying the liquid LC after supplying a predetermined amount of the liquid LC. The predetermined amount is a supply amount of the liquid LC sufficient to clean the porous member 80, the cover member T, and the like.

  After stopping the supply of the liquid LC, the control device 8 is engaged in the recovery using the porous member 80 for a predetermined time, and recovers all the liquid LC existing in the gap Gd and the like.

  After all the liquid LC is collected, the control device 8 supplies a liquid for rinsing (flushing). In the present embodiment, the exposure liquid LQ is used as the rinse liquid.

  In the present embodiment, the rinsing liquid LQ is supplied from the liquid immersion member 7. For example, the liquid LQ may be supplied from the supply port 15 of the liquid immersion member 7, the liquid LQ may be supplied from the recovery port 16, or the liquid immersion member 7 is separated from the supply port 15 and the recovery port 16. The liquid LQ may be supplied from the provided opening.

  When the rinsing liquid LQ is supplied from the liquid immersion member 7, the dummy substrate DP is held by the first holding unit 31. In the present embodiment, the liquid immersion member 7 is formed such that the liquid immersion space LS is formed between the liquid immersion member 7 and at least a part of the dummy substrate DP, the porous member 80, and the cover member T. The liquid LQ is supplied to the space where the lower surface 14 of the substrate faces. In the present embodiment, the control device 8 supplies the liquid LQ from the supply port 15 of the liquid immersion member 7 and collects the liquid LQ from the recovery port 16 of the liquid immersion member 7, so that the liquid immersion member 7 and the porous member 80 are collected. An immersion space LS for the liquid LQ is formed between the two.

  The liquid LQ supplied from the liquid immersion member 7 contacts the upper surface 80A of the porous member 80. Thereby, the upper surface 80A is rinsed with the liquid LQ. Further, the liquid LQ comes into contact with at least a part of the upper surface Ta of the cover member T. Thereby, at least a part of the upper surface Ta is rinsed with the liquid LQ. Further, the liquid LQ flows into the gap between the porous member 80 and the dummy substrate DP. As a result, the first side surface 80B of the porous member 80 is rinsed with the liquid LQ. Further, the liquid LQ flows into the gap between the porous member 80 and the cover member T. Thereby, the second side surface 80C of the porous member 80 and the inner surface Tc of the cover member T are rinsed with the liquid LQ.

  In the present embodiment, at least a part of the liquid LQ is recovered from the porous member 80 in a state where at least a part of the liquid LQ immersion space LS is formed on the porous member 80. The control device 8 controls the fluid suction device 26 to recover the liquid LQ from the hole of the porous member 80. Thereby, the inner surface of the hole of the porous member 80 (inside the porous member 80) is rinsed with the liquid LQ.

  For example, the rinsing liquid LQ may be supplied from the supply port 15, at least a part of the liquid LQ may be recovered from the porous member 80, and the liquid LQ may not be recovered from the recovery port 16 of the liquid immersion member 7. .

  The control device 8 executes the supply of the liquid LQ for a predetermined time. The predetermined time is a supply time of the liquid LQ sufficient to rinse the porous member 80, the cover member T, and the like. The control device 8 stops the supply of the liquid LQ after a predetermined time has elapsed since the start of the supply of the liquid LQ. Thereby, the rinse using the liquid LQ is completed. By supplying the rinsing liquid LQ, the liquid LC remaining in the porous member 80, the cover member T, and the like is removed.

  The control device 8 may stop supplying the liquid LQ after supplying a predetermined amount of the liquid LQ. The predetermined amount is a supply amount of the liquid LQ sufficient to rinse the porous member 80, the cover member T, and the like.

  In the present embodiment, the rinsing process (flushing process) for supplying the rinsing (flushing) liquid LQ is performed after the cleaning process for supplying the cleaning liquid LC is performed. Processing (flushing processing) may be omitted.

  Thus, the cleaning sequence SM2 ends. After completion of the cleaning sequence SM2, for example, the exposure sequence SM1 may be executed.

  As described above, according to this embodiment, the porous member 80, the cover member T, and the like disposed around the gap Ga can be cleaned well. Therefore, it is possible to suppress the occurrence of exposure failure and the occurrence of defective devices.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  In the following embodiment, a case where mainly at least a part of the inner surface of the porous member 80, the case 81, the cover member T, and the space portion 23 is cleaned will be described as an example. A member located below the gap Ga or a member that may come into contact with the liquid LQ flowing into the space below the gap Ga from the gap Ga between the substrate P and the cover member T in the exposure of the substrate P is cleaned. It may be a target.

  FIG. 11 is a diagram illustrating an example of a substrate stage 200A according to the second embodiment. As shown in FIG. 11, in the present embodiment, the porous member 80 is disposed so that the second side surface 80 </ b> C of the porous member 80 and the inner surface Tc of the cover member T are in contact with each other. In the example shown in FIG. 11, the support member 82 is omitted. In the example shown in FIG. 11, the support member 82 may be disposed.

  In the present embodiment, the substrate stage 2 includes a temperature adjustment device 305 that adjusts the temperature of the porous member 80. The temperature adjustment device 305 includes, for example, a Peltier element. In the present embodiment, the temperature adjustment device 305 is disposed so as to contact the case 81. The temperature adjustment device 305 adjusts the temperature of the porous member 80 via the case 81. The temperature adjustment device 305 can also adjust the temperature of the case 81.

  The temperature adjusting device 305 may be disposed so as to contact at least a part of the porous member 80.

  Note that the temperature adjustment device 305 may include a supply device that supplies a temperature-adjusted fluid (one or both of gas and liquid) to a flow path formed inside the case 81, for example.

  In the present embodiment, the substrate stage 200A includes a temperature adjustment device 306 that adjusts the temperature of the cover member T. The temperature adjustment device 306 includes, for example, a Peltier element. In the present embodiment, the temperature adjustment device 306 is disposed so as to contact the lower surface Tb of the cover member T. In the present embodiment, the temperature adjustment device 306 is disposed in contact with the lower surface Tb of the cover member T in the space 32H between the peripheral wall portion 38 and the peripheral wall portion 39. The temperature adjustment device 306 may not contact the cover member T. For example, the temperature adjustment device 306 may be disposed on the support surface 32S so as to face the lower surface Tb of the cover member T.

  The temperature adjustment device 306 may include, for example, a supply device that supplies a temperature-adjusted fluid (one or both of a gas and a liquid) to a flow path formed inside the cover member T.

  In addition, the temperature adjustment apparatus which adjusts the temperature of the porous member 80 demonstrated in 1st Embodiment, and the temperature adjustment apparatus which adjusts the temperature of the cover member T may be provided.

  In the present embodiment, when the porous member 80 is cleaned, an immersion space LT for the liquid LC is formed in the gap between the first side surface 80B and the side surface of the dummy substrate DP. The liquid LC contacts the upper surface 80A and the first side surface 80B.

  The control device 8 controls the fluid suction device 26 to execute the suction operation of the porous member 80. The liquid LC in the gap between the first side surface 80B and the side surface of the dummy substrate DP is recovered from the hole in the first side surface 80B. Thereby, the inside of the porous member 80 is cleaned with the liquid LC.

  Further, by bringing the liquid LC in the immersion space LT into contact with the cover member T, the cover member T is cleaned with the liquid LC.

  In the cleaning sequence SM2, the liquid LC may be supplied to the porous member 80 while adjusting the temperature of the porous member 80 using the temperature adjusting device 305. Further, the liquid LC may be recovered from the holes of the porous member 80 while adjusting the temperature of the porous member 80 using the temperature adjusting device 305.

  In the cleaning sequence SM2, the liquid LC may be supplied to the cover member T while adjusting the temperature of the cover member T using the temperature adjusting device 306.

<Third Embodiment>
Next, a third embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 12 is a diagram showing an example of the cleaning sequence SM2 according to the present embodiment. As shown in FIG. 12, in the present embodiment, the cleaning liquid LC is supplied to the space 23 </ b> S between the inner surface of the space portion 23 and the outer surface of the case 81. The liquid LC contacts at least one of the inner surface of the space 23 and the outer surface of the case 81. Thereby, at least a part of the inner surface of the space 23 and the outer surface of the case 81 is cleaned with the liquid LC.

  In the present embodiment, the supply of the liquid LC from the liquid immersion member 7 and the recovery of the liquid LC from the porous member 80 are performed so that the liquid LC is supplied to the space 23S. For example, when the liquid LC is supplied from the liquid immersion member 7, the recovery amount of the liquid LC from the porous member 80 is reduced so that the liquid LC flows into the space 23S.

  In the present embodiment, a recovery mechanism 350 having a recovery port 351 for recovering the liquid LC in the space 23S is provided. In FIG. 12, the recovery port 351 is formed on the inner surface of the space 23 so as to face the space 23S. The recovery port 351 is connected to the fluid suction device 26B via the flow path 352. At least a part of the liquid LC recovered from the recovery port 351 is sucked into the fluid suction device 26B.

  According to the present embodiment, not only the porous member 23 and the cover member T but also at least one of the inner surface of the space 23 and the outer surface of the case 81 disposed below the gap Ga (Gd) is cleaned with the liquid LC.

<Fourth embodiment>
Next, a fourth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 13 is a diagram showing an example of the cleaning sequence SM2 according to the present embodiment. In FIG. 13, the dummy substrate DP2 held by the first holding unit 31 has a side surface Pcd that the first side surface 80B faces. In the present embodiment, the side surface Pcd is inclined downward toward the outside with respect to the center of the dummy substrate DP2 (the center of the first holding unit 31).

  In the present embodiment, since the side surface Pcd is inclined, the liquid LC supplied to the gap between the upper surface of the dummy substrate DP2 and the upper surface 80A of the porous member 80 smoothly contacts the first side surface 80B. In addition, the liquid LC supplied to the gap between the upper surface of the dummy substrate DP2 and the upper surface 80A of the porous member 80 flows smoothly into the space portion 23 through the gap. Thereby, the porous member 80 and the like are cleaned satisfactorily.

  FIG. 14 is a diagram showing an example of the cleaning sequence SM2 according to the present embodiment. In FIG. 14, the dummy substrate DP3 held by the first holding unit 31 has a side surface Pcd that the first side surface 80B faces. In the present embodiment, the side surface Pcd is inclined upward toward the outside with respect to the center of the dummy substrate DP3 (the center of the first holding part 31).

  In the present embodiment, since the side surface Pcd is inclined upward, the liquid LC supplied to the gap between the upper surface of the dummy substrate DP3 and the upper surface 80A of the porous member 80 passes through the gap to form a space portion. 23 flows smoothly. Thereby, the porous member 80 and the like are cleaned satisfactorily.

<Fifth Embodiment>
Next, a fifth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 15 is a diagram illustrating an example of the cleaning sequence SM2 according to the present embodiment. In the present embodiment, the liquid LC is supplied from the movable member 360 disposed at a position where at least one of the upper surface Ta of the cover member T and the upper surface Pad of the dummy substrate DP can face each other. The movable member 360 can supply the liquid LC to at least a part of the substrate stage 2 at the substrate exchange position RP, for example.

  The movable member 360 is movable with respect to the substrate stage 2. The movable member 360 is disposed at a position where at least one of the upper surface Ta and the upper surface Pad can face each other, and has a supply port 361 that can supply the liquid LC.

  In the present embodiment, the movable member 360 is movable by the operation of the driving device 362 including an actuator. The movable member 360 is movable in the Z-axis direction, for example. In the present embodiment, the driving device 362 can move the movable member 360 in six directions of X axis, Y axis, Z axis, θX, θY, and θZ.

  In the present embodiment, the supply port 361 is disposed on the lower surface of the movable member 360 that can face at least one of the upper surface Ta and the upper surface Pad. In the present embodiment, the movable member 360 has a recovery port 363 that can recover the liquid LC.

  A porous member 80 is disposed in the space portion 23. At least a part of the porous member 80 is disposed in the gap Gd (Ga).

  In the present embodiment, an ultrasonic generator 85 that applies ultrasonic waves to the cover member T is provided. The ultrasonic generator 85 includes an ultrasonic generator such as a piezo element.

  The ultrasonic generator 85 contacts at least a part of the cover member T. In the present embodiment, the ultrasonic generator 85 is disposed so as to contact the back surface Tb of the cover member T. In the present embodiment, the ultrasonic generator 85 is disposed in contact with the back surface Tb in the space 32H between the peripheral wall portion 38 and the peripheral wall portion 39. In the present embodiment, the second holding part 32 includes a support part 86 that is disposed in the space 32 </ b> H and supports the ultrasonic generator 85. When the ultrasonic generator 85 operates, the cover member T vibrates.

  In the present embodiment, the lower surface of the movable member 360 is formed so that at least a part of the immersion space LT of the liquid LC is formed in the gap between the upper surface Pad of the dummy substrate DP and the upper surface Ta of the cover member T. The liquid LC is supplied from the supply port 361 in a state where the upper surface Pad of the dummy substrate DP and at least one of the upper surface Ta of the cover member T face each other.

  At least a part of the liquid LC supplied from the supply port 361 flows into the space portion 23 in which the porous member 800 is disposed via the gap between the upper surface Ta and the upper surface Pad. Thereby, the upper surface of the porous member 800 is cleaned with the liquid LC. The inner surface of the space 23 is also cleaned with the liquid LC.

  The control device 8 supplies the liquid LC from the supply port 361 while recovering the liquid LC from the hole of the porous member 800. Thereby, the inside of the porous member 800 is also cleaned with the liquid LC.

  In the present embodiment, the liquid LC is recovered from the recovery port 363 in parallel with the supply of the liquid LC from the supply port 361 of the movable member 360.

  The control device 8 can supply the liquid LC from the supply port 361 while controlling the driving device 362 and adjusting the position of the movable member 360 with respect to the substrate stage 2 (gap).

  In the present embodiment, the control device 8 can supply the liquid LC from the supply port 361 while controlling the ultrasonic generator 85 to apply ultrasonic waves to the cover member T.

  Also in this embodiment, at least a part of the substrate stage 2 including the porous member 800 can be satisfactorily cleaned.

  In the present embodiment, at least a part of the substrate stage 2 using the movable member 360 is cleaned at the substrate replacement position RP. However, at the exposure position EP, the substrate using the liquid immersion member 7 is used. Cleaning of at least a part of the stage 2 may be performed. When cleaning is performed using the liquid immersion member 7, the control device 8 places the substrate stage 2 at a position where the lower surface 14 of the liquid immersion member 7 can face. The control device 8 includes a lower surface 14 of the liquid immersion member 7 so that at least a part of the liquid immersion space LT of the liquid LC is formed in the gap between the upper surface Pad of the dummy substrate DP and the upper surface Ta of the cover member T. For example, the liquid LC is supplied from the supply port 15 in a state where the upper surface of the dummy substrate DP and at least one of the upper surface Ta of the cover member T face each other.

<Sixth Embodiment>
Next, a sixth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 16 is a diagram showing an example of the cleaning sequence SM2 according to the present embodiment. In the present embodiment, the substrate stage 2 is at least partially disposed in the space portion 23 and has a porous member 80 having holes capable of collecting fluid, and a supply that supplies the cleaning liquid LC disposed in the space portion 23. And a mouth 370.

  In the present embodiment, the supply port 370 is disposed on the inner surface of the space portion 23 so as to face the space 23 </ b> S between the inner surface of the space portion 23 and the outer surface of the case 81. The supply port 370 is connected via a flow path 371 to a supply device 372 that can deliver the liquid LC. The liquid LC delivered from the supply device 372 is supplied to the supply port 370 through the flow path 371.

  The dummy substrate DP is held by the first holding unit 31 during at least a part of the cleaning sequence SM2. A part of the porous member 80 is disposed in the gap between the dummy substrate DP and the cover member T. A part of the porous member 80 is disposed in the space portion 23. In the present embodiment, the dummy substrate DP is held by the first holding unit 31 at least when the liquid LC is supplied from the supply port 370.

  In the cleaning sequence SM2, the liquid LC is supplied from the supply port 370 to the space 23S. The liquid LC supplied from the supply port 370 to the space 23 </ b> S contacts at least a part of the inner surface of the space portion 23 and the outer surface of the case 81. Thereby, at least a part of the inner surface of the space 23 and the outer surface of the case 81 is cleaned with the liquid LC.

  In addition, at least a part of the liquid LC supplied from the supply port 370 to the space 23 </ b> S contacts the first side surface 80 </ b> B of the porous member 80. Thereby, at least a part of the first side surface 80B of the porous member 80 is cleaned with the liquid LC.

  In the present embodiment, the liquid LC supplied from the supply port 370 and contacting the surface of the porous member 80 is collected through the holes of the porous member 80. That is, in the cleaning sequence SM2, the control device 8 controls the fluid suction device 26 to execute the recovery operation from the hole of the porous member 80.

  In the example shown in FIG. 16, at least a part of the liquid LC supplied from the supply port 370 contacts the first side surface 80B. At least a part of the liquid LC that has contacted the first side surface 80B is recovered from the hole of the first side surface 80B. Note that at least a part of the liquid LC supplied from the supply port 370 may contact the second side surface 80C. In addition, at least a part of the liquid LC in contact with the second side surface 80C may be recovered from the hole of the second side surface 80C.

  In the present embodiment, the control device 8 executes the recovery of the liquid LC from the porous member 80 in parallel with the supply of the liquid LC from the supply port 370. Note that when the liquid LC is supplied from the supply port 370, the recovery operation of the porous member 80 may be stopped. Further, when the supply of the liquid LC from the supply port 370 is stopped, the recovery of the liquid LC of the porous member 80 may be executed.

  As described above, according to the present embodiment, by supplying the liquid LC from the supply port 370 disposed in the space portion 23, at least the inner surface of the space portion 23 disposed below the gap Gd (Ga). A part and at least a part of the outer surface of the case 81 can be cleaned with the liquid LC. Further, the holes of the porous member 80 can be cleaned with the liquid LC supplied from the supply port 370.

  As shown in FIG. 17, at least a part of the liquid LC supplied from the supply port 370 of the space portion 23 passes through the gap Gd between the dummy substrate DP and the cover member T, and the upper surface of the dummy substrate DP. It may flow into a space where at least one of the pad and the upper surface Ta of the cover member T faces. In the example shown in FIG. 17, the liquid LC in the space portion 23 enters the space between the upper surface Pad and the upper surface Ta from the gap between the upper surface Pad of the dummy substrate DP and the upper surface 80A of the porous member 80 in the gap Gd. Supplied. Thereby, at least one of the upper surface Ta and the inner surface Tc of the cover member T is cleaned with the liquid LC.

  In the present embodiment, the liquid LC that has flowed out of the space 23 into the space that the upper surface Ta and the upper surface Pad face, for example, from the recovery port 16 of the liquid immersion member 7 disposed so that at least one of the upper surface Ta and the upper surface Pad can face each other. To be recovered. For example, the liquid LC may be recovered from the recovery port 363 included in the movable member 360 described with reference to FIG.

<Seventh embodiment>
Next, a seventh embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 18 is a diagram showing an example of the cleaning sequence SM2 according to the present embodiment. In the present embodiment, the exposure apparatus EX includes an emission device 380 that irradiates at least part of the cover member T, the porous member 80, the outer surface of the case 81, and the inner surface of the space 23 with light EC.

  In the present embodiment, the light EC is light for cleaning at least a part of the cover member T, the porous member 80, the outer surface of the case 81, and the inner surface of the space 23. The light EC includes, for example, ultraviolet light having a light cleaning effect.

  In the present embodiment, the ejection device 380 includes an ejection member 382 that includes an ejection portion 381 that ejects the light EC, and a drive device 383 that includes an actuator that can move the ejection member 382.

  In the present embodiment, the injection portion 381 is disposed at a position where at least one of the upper surface Ta and the upper surface 80A can face each other. The driving device 383 can move the injection member 382 relative to the substrate stage 2. In the present embodiment, the injection member 382 is movable in six directions of X axis, Y axis, Z axis, θX, θY, and θZ. Further, the driving device 383 can adjust the position of the injection member 382 with respect to the substrate stage 2. As the injection member 382 moves, the injection portion 381 also moves. By adjusting the position of the injection member 382, the position of the injection unit 381 with respect to the substrate stage 2 is also adjusted.

  In the present embodiment, the dummy substrate D4 is held by the first holding unit 31 during at least a part of the cleaning sequence SM2. In the present embodiment, the dummy substrate DP4 is held by the first holding unit 31 at least when the light EC is emitted from the emission unit 381. In the present embodiment, at least a part of the porous member 80 is disposed in the gap between the dummy substrate DP4 and the cover member T.

  In the present embodiment, at least a part of the dummy substrate DP4 faces the first side surface 80B. In the present embodiment, the dummy substrate DP4 has a side surface Pc4 that can face the first side surface 80B. In the present embodiment, the side surface Pc4 includes a reflection surface that reflects at least a part of the light EC. The reflective surface includes the surface of a metal film formed by, for example, a vapor deposition method. In the present embodiment, the side surface Pc4 is inclined downward toward the outside with respect to the radial direction with respect to the center of the dummy substrate DP4 (first holding part 31).

  In the present embodiment, the emitting unit 381 irradiates the side surface Pc4 of the dummy substrate DP4 with the light EC. The control device 8 adjusts the position of the emission unit 381 with respect to the dummy substrate DP4 (substrate stage 2) so that the light EC from the emission unit 381 is irradiated onto the side surface Pc4.

  At least a part of the light EC emitted from the emission unit 381 and applied to the side surface Pc4 is reflected by the side surface Pc4. At least a part of the light EC reflected by the side surface Pc4 is irradiated to the first side surface 80B of the porous member 80. Thereby, the first side surface 80B is cleaned with the light EC.

  In the present embodiment, the light EC emitted from the emission unit 381 is applied to the first side surface 80B via the dummy substrate DP4. For example, as shown in FIG. The light EC emitted from the emission portion 381 arranged at a position where at least one of Ta can be opposed may be applied to at least a part of the outer surface of the case 81 and the inner surface of the space portion 23.

  The light EC emitted from the emission unit 381 may be applied to at least a part of the cover member T. For example, the light EC emitted from the emission unit 381 may be applied to at least one of the upper surface Ta and the inner surface Tc.

  In the present embodiment, the first side surface 80B may be irradiated with the light EC without passing through the dummy substrate DP4. Further, not only the first side surface 80B but also the upper surface 80A and the second side surface 80C may be irradiated with the light EC from the emission unit 381.

  In addition, as shown in FIG. 20, the emission part 381B which inject | emits light EC may be arrange | positioned in the space part 23. FIG. The light EC emitted from the emission part 381B is irradiated onto at least part of the inner surface of the porous member 80 (case 81), the cover member T, and the space 23, whereby the porous member 80 (case 81) and the cover are covered. At least a part of the inner surface of the member T and the space 23 is cleaned with the light EC.

<Eighth Embodiment>
Next, an eighth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 21 is a diagram showing an example of the cleaning sequence SM2 according to the present embodiment. In the present embodiment, the exposure apparatus EX includes a cleaning member 390 that contacts at least a part of the surface of the cover member T and the surface of the porous member 80.

  In the present embodiment, the cleaning member 390 includes an abrasive member capable of rubbing at least part of the surface of the cover member T and the surface of the porous member 80. In the present embodiment, the cleaning member 390 includes a grindstone.

  In the present embodiment, the cleaning member 390 is movable with respect to the substrate stage 2 by the operation of the driving device 391 including an actuator. The driving device 391 can adjust the position of the cleaning member 390 relative to the substrate stage 2. In the present embodiment, the cleaning member 390 is movable in six directions of X axis, Y axis, Z axis, θX, θY, and θZ.

  In the present embodiment, the cleaning member 390 is disposed at a position where at least one of the upper surface Ta of the cover member T and the upper surface 80A of the porous member 80 can face each other.

  In the present embodiment, an object such as a dummy substrate is not held by the first holding unit 31 during at least a part of the cleaning sequence SM2.

  In the present embodiment, the porous member 80 has a first portion 801 disposed in the gap Ga in the exposure of the substrate P. In the example shown in FIG. 21, the cleaning member 391 contacts the first side surface 80B. The driving device 391 moves the cleaning member 391 in a state where the first side surface 80B and the cleaning member 391 are in contact with each other. Thereby, the first side surface 80B is rubbed by the cleaning member 391, and the first side surface 80B is cleaned.

  In the present embodiment, the cleaning member 390 has a suction port 392 that sucks foreign matter. The suction port 392 is connected to the suction device 394 via the flow path 393. In the present embodiment, at least a part of the flow path 393 is formed inside the cleaning member 390. Foreign matter generated by contact between the porous member 80 and the cleaning member 390 is sucked from the suction port 392.

  As described above, according to the present embodiment, at least a part of the porous member 80 can be cleaned using the cleaning member 390.

  In the present embodiment, the first side surface 392 is cleaned using the cleaning member 390. However, the upper surface 80A and the cleaning member 390 may be brought into contact with each other, or the second side surface 80C and the cleaning member 390 may be contacted. May be contacted. Further, the surface of the cover member T (at least one of the upper surface Ta, the inner surface Tc, and the lower surface Tb) and the cleaning member 390 may be brought into contact with each other.

  The cleaning member 390 and the outer surface of the case 81 may be brought into contact with each other, or the cleaning member 390 and the inner surface of the space portion 23 may be brought into contact with each other. Note that the outer shape of the cleaning member 390 may be adjusted so that it can contact at least one of the outer surface of the case 81 and the outer surface of the space portion 23.

<Ninth Embodiment>
Next, a ninth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 22 is a diagram illustrating an example of the liquid immersion member 700 according to the present embodiment. In FIG. 22, the liquid immersion member 700 includes a supply port 15K for supplying the liquid LQ and a recovery port 16K for recovering the liquid LQ.

  The supply port 15K is disposed so as to face the optical path K of the exposure light EL emitted from the emission surface 13. Note that at least a part of the supply port 15K may be disposed so as to face the side surface of the last optical element 12.

  The collection port 16K is arranged so that the substrate P can be opposed thereto. In the present embodiment, the recovery port 16K includes a hole of the porous member 19K. The collection port 16 is disposed outside the supply port 15K with respect to the optical path K.

  The liquid immersion member 700 has a flow path 20K through which the liquid LQ recovered from the recovery port 16 can flow. Note that the gas recovered from the recovery port 16 also flows through the flow path 20K.

  In the present embodiment, the liquid immersion member 700 has a first discharge port 701 facing the flow path 20K and a second discharge port 702 facing the flow path 20K. In the present embodiment, the first discharge port 701 substantially discharges only the gas in the flow path 20K and does not discharge the liquid LQ. The second discharge port 702 substantially discharges only the liquid LQ in the flow path 20K and does not discharge the gas. In the present embodiment, the second discharge port 702 includes a hole of a porous member. Note that both liquid and gas may be discharged from the first discharge port 701, and both liquid and gas may be discharged from the second discharge port 702.

  The supply port 15K is connected to the liquid supply device 18K through a flow path. The 1st discharge port 701 is connected with the 1st collection | recovery apparatus 21Ka via a flow path. The second discharge port 702 is connected to the second recovery device 21Kb via a flow path.

  In the present embodiment, a recovery member 750 that recovers the fluid is disposed at least around the periphery of the liquid immersion member 700. The recovery member 750 has a lower surface to which the substrate P can face. The recovery member 750 has a recovery port 751 to which the substrate P can face. The collection port 751 is connected to the collection device 21Kc through a flow path.

  The recovery port 751 can recover the liquid LQ in the space between the lower surface of the recovery member 750 and the substrate P. The recovery port 751 recovers the liquid LQ that has flowed out of the space between the lower surface of the liquid immersion member 700 and the substrate P.

  In FIG. 22, the substrate P is disposed at a position facing the lower surface of the liquid immersion member 700 and the lower surface of the recovery member 750. However, for example, at least one of the substrate stage 2 and the measurement stage 3 is disposed. Alternatively, an object different from the substrate P, the substrate stage 2 and the measurement stage 3 may be arranged.

  Next, an example in which at least a part of the substrate stage 2 is cleaned using the liquid immersion member 700 will be described. FIG. 23 is a diagram illustrating an example of the cleaning sequence SM <b> 2 using the liquid immersion member 700.

  In the cleaning sequence SM2, the dummy substrate DP is disposed in the first holding unit 31. The first portion 801 of the porous member 80 is disposed in the gap between the dummy substrate DP and the cover member T.

  In the cleaning sequence SM2, the position of the substrate stage 2 relative to the liquid immersion member 700 is adjusted so that the lower surface of the liquid immersion member 700 and the upper surface 80A of the porous member 80 face each other.

  In the present embodiment, at least a part of the inner surface of the cover member T, the porous member 80, the case 81, and the space 23 is cleaned with the cleaning liquid LC. In the present embodiment, the liquid LC is supplied from the second outlet 702 to the flow path 20K. In the present embodiment, the second recovery device 21Kb can deliver the liquid LC. The liquid LC sent from the second recovery device 21Kb is supplied to the second discharge port 702.

  By supplying the liquid LC from the second discharge port 702 to the flow path 20K, at least a part of the inner surface of the flow path 20K is cleaned with the liquid LC. Further, at least a part of the liquid LC in the flow path 20K is supplied to the space SP facing the lower surface of the liquid immersion member 700 via the recovery port 16K. The space that the lower surface of the liquid immersion member 700 faces includes a space between the liquid immersion member 700 and the substrate stage 2.

  In the present embodiment, the liquid LC is supplied from the recovery port 16K with the lower surface of the liquid immersion member 700 and the upper surface 80A (gap Gd) of the porous member 80 facing each other. The liquid LC supplied from the recovery port 16K contacts at least a part of the porous member 80. Thereby, at least a part of the porous member 80 is cleaned with the liquid LC.

  In the present embodiment, when the liquid LC is supplied from the recovery port 16K to the space SP, the liquid LQ is supplied from the supply port 15K. The liquid LQ supplied from the supply port 15K covers at least a part of the surface of the last optical element 12. The liquid LQ supplied from the supply port 15K flows outward from the terminal optical element 12 with respect to the radiation direction with respect to the optical axis of the terminal optical element 12. Thereby, the liquid LC in the space SP is suppressed from coming into contact with the last optical element 12.

  The liquid LC supplied to the space SP from the recovery port 16K and the liquid LQ supplied from the supply port 15K are recovered from the recovery port 751 of the recovery member 750.

  As described above, also in the present embodiment, at least a part of the surface of the member existing around the gap Ga (Gd) can be satisfactorily cleaned using the liquid LC.

  In each of the above-described embodiments, the porous member 80 at least partially disposed in the gap Ga is cleaned. For example, as shown in FIG. 24, the porous member 800 positioned below the gap Ga is It may be cleaned. In FIG. 24, the entire porous member 800 is disposed below the gap Ga. That is, the porous member 800 is not disposed in the gap Ga. In the example shown in FIG. 24, the porous member 800 is supported by the case 810. Even the porous member 800 (case 810) shown in FIG. 24 can be cleaned according to the above-described embodiment.

  As shown in FIGS. 25 and 26, the case 81 (810) may be omitted. The porous member 80 (800) not supported by the case 81 (810) may be cleaned according to the above-described embodiment.

  As described above, the control device 8 includes a computer system including a CPU and the like. Further, the control device 8 includes an interface capable of executing communication between the computer system and an external device. The storage device 8R includes, for example, a memory such as a RAM, a recording medium such as a hard disk and a CD-ROM. In the storage device 8R, an operating system (OS) for controlling the computer system is installed, and a program for controlling the exposure apparatus EX is stored.

  Note that an input device capable of inputting an input signal may be connected to the control device 8. The input device includes an input device such as a keyboard and a mouse, or a communication device that can input data from an external device. Further, a display device such as a liquid crystal display may be provided.

  Various information including the program recorded in the storage device 8R can be read by the control device (computer system) 8. In the storage device 8R, a program for causing the control device 8 to control the exposure device EX that exposes the substrate P with the exposure light EL via the liquid LQ is recorded.

  An exposure apparatus defines an optical member having an emission surface from which exposure light is emitted, a first holding unit that releasably holds the lower surface of the substrate, an opening in which the substrate can be disposed, and the substrate serves as the first holding unit. In the case where the storage device 8R includes a substrate holding device that is disposed around the upper surface of the substrate in a held state and includes a first member having a first surface that is adjacent to the upper surface of the substrate via a gap, The recorded program may cause the control device 8 to perform cleaning of at least a part of at least one of the first member and the member located below the gap according to the above-described embodiment.

  The exposure apparatus defines an optical member having an emission surface from which exposure light is emitted, a first holding unit that releasably holds the lower surface of the substrate, an opening in which the substrate can be disposed, and the substrate is held first. A substrate holding device that includes a first member that is disposed around the upper surface of the substrate and is adjacent to the upper surface of the substrate via a gap, and the substrate is a first holding unit. At least a portion is disposed between the substrate and the first member having the first surface in the state of being held by the substrate, the second member including the porous member, and at least a portion of the periphery of the optical member. And a liquid immersion member that forms an immersion space for the exposure liquid between the substrate and the substrate, the program recorded in the storage device 8R is stored in the control device 8 according to the above-described embodiment. Cleanin between the member and the second member It may be executed to form a liquid immersion space of the liquid.

  The exposure apparatus defines an optical member having an emission surface from which exposure light is emitted, a first holding unit that releasably holds the lower surface of the substrate, an opening in which the substrate can be disposed, and the substrate is held first. A substrate holding device including a first member disposed around the upper surface of the substrate in a state of being held by the unit and having a first surface adjacent to the upper surface of the substrate via a gap, the substrate and the first surface; And a second member having a recovery port capable of recovering fluid, the program recorded in the storage device 8R is in accordance with the above-described embodiment. Further, supplying the cleaning liquid to the space portion may be executed.

  The exposure apparatus defines an optical member having an emission surface from which exposure light is emitted, a first holding unit that releasably holds the lower surface of the substrate, an opening in which the substrate can be disposed, and the substrate is held first. A substrate holding device including a first member that is disposed around the upper surface of the substrate in a state of being held by the unit and has a first surface that is adjacent to the upper surface of the substrate with a gap interposed therebetween. The program recorded in 8R causes the control device 8 to irradiate at least a part of at least one of the first member and the member located below the gap according to the above-described embodiment. Also good.

  The exposure apparatus defines an optical member having an emission surface from which exposure light is emitted, a first holding unit that releasably holds the lower surface of the substrate, an opening in which the substrate can be disposed, and the substrate is held first. A substrate holding device including a first member that is disposed around the upper surface of the substrate in a state of being held by the unit and has a first surface that is adjacent to the upper surface of the substrate with a gap interposed therebetween. According to the above-described embodiment, the program recorded in 8R may cause the control device 8 to cause the cleaning member to come into contact with the first member and at least a part of the member located below the gap.

  By reading the program stored in the storage device 8R into the control device 8, various devices of the exposure apparatus EX such as the substrate stage 2, the liquid immersion member 7, the drive system 5, and the fluid suction device 26 cooperate. In the state where the immersion space LS is formed, various processes such as immersion exposure of the substrate P are executed.

  In each of the above-described embodiments, the optical path K on the exit side (image plane side) of the terminal optical element 12 of the projection optical system PL is filled with the liquid LQ. As disclosed in the 2004/019128 pamphlet, the optical path on the incident side (object plane side) of the last optical element 12 may also be a projection optical system filled with the liquid LQ.

  In each of the above-described embodiments, water is used as the exposure liquid LQ, but a liquid other than water may be used. The liquid LQ is a film such as a photosensitive material (photoresist) that is transmissive to the exposure light EL, has a high refractive index with respect to the exposure light EL, and forms the surface of the projection optical system PL or the substrate P. Stable ones are preferable. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot area on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also relates to a twin-stage type exposure having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to devices.

  The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. For example, an immersion space can be formed between an optical member such as a lens and the substrate, and the substrate can be irradiated with exposure light through the optical member.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  The exposure apparatus EX of the above-described embodiment is manufactured by assembling various subsystems including each component so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 27, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate which is a base material of the device. Substrate processing step 204, including substrate processing (exposure processing) including exposing the substrate with exposure light from the pattern of the mask and developing the exposed substrate according to the above-described embodiment, It is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage, 2U ... Upper surface, 3 ... Measurement stage, 5 ... Drive system, 6 ... Drive system, 7 ... Immersion member, 8 ... Control device, 8R ... Storage device, 12 ... End optical element, 13 ... Ejection surface , 14 ... lower surface, 15 ... supply port, 16 ... collection port, 19 ... porous member, 22 ... suction port, 23 ... space, 24 ... suction port, 26 ... fluid suction device, 31 ... first holding unit, 32 ... 2nd holding part, 35 ... peripheral wall part, 38 ... peripheral wall part, 80 ... porous member, 80A ... upper surface, 80B ... first side surface, 80C ... second side surface, 85 ... ultrasonic generator, 360 ... movable member, 361 ... Supply port, 380 ... injection device, 381 ... injection portion, 382 ... injection member, 383 ... drive device, 390 ... cleaning member, 801 ... first portion, 802 ... second portion, EL ... exposure light, EX ... exposure device, Ga ... Gap, LC ... Liquid, LQ ... Liquid, P Substrate, T ... cover member,

Claims (57)

An exposure apparatus that exposes a substrate with exposure light through an exposure liquid,
An optical member having an exit surface from which the exposure light is emitted;
A first holding part for holding the lower surface of the substrate in a releasable manner and an opening in which the substrate can be arranged are defined, and arranged around the upper surface of the substrate in a state where the substrate is held by the first holding unit. A first member having a first surface adjacent to the upper surface of the substrate via a gap, and a substrate holding device,
An exposure apparatus comprising: the first member; and a cleaning device that cleans at least a part of at least one of the members positioned below the gap.   The exposure apparatus according to claim 1, wherein the member positioned below the gap has a recovery port capable of recovering the fluid.   The exposure apparatus according to claim 1, wherein the substrate holding device includes a member positioned below the gap.   The exposure apparatus according to any one of claims 1 to 3, wherein the cleaning device is disposed at a position where the first surface can be opposed to the cleaning device, and has a first supply port for supplying a cleaning liquid.   The exposure apparatus according to claim 4, wherein the first supply port is disposed in a first movable member that is movable with respect to the substrate holding apparatus. An immersion member that is disposed at least part of the periphery of the optical member and forms an immersion space for the exposure liquid with the substrate in exposure of the substrate;
The exposure apparatus according to claim 4, wherein the first supply port is disposed in the liquid immersion member. At least when the cleaning liquid is supplied from the first supply port, a dummy substrate is held in the first holding portion,
The lower surface of the liquid immersion member, the upper surface of the dummy substrate, and the first surface are formed so that at least a part of the immersion space of the cleaning liquid is formed in the gap between the upper surface of the dummy substrate and the first surface. The exposure apparatus according to claim 6, wherein the cleaning liquid is supplied from the first supply port in a state in which at least one of the one surface faces.   The exposure apparatus according to claim 1, wherein the member positioned below the gap includes a porous member. An exposure apparatus that exposes a substrate with exposure light through an exposure liquid,
An optical member having an exit surface from which the exposure light is emitted;
A first holding part for holding the lower surface of the substrate in a releasable manner and an opening in which the substrate can be arranged are defined, and arranged around the upper surface of the substrate in a state where the substrate is held by the first holding unit. A first member having a first surface adjacent to the upper surface of the substrate via a gap, and a substrate holding device,
A second member including a porous member, at least part of which is disposed between the substrate and the first member in a state where the substrate is held by the first holding unit;
An immersion member that is disposed at least part of the periphery of the optical member and forms an immersion space for the exposure liquid with the substrate in exposure of the substrate;
An exposure apparatus comprising: a first supply port that supplies the cleaning liquid so that at least a part of a liquid immersion space for cleaning liquid is formed between the liquid immersion member and the second member. At least when the cleaning liquid is supplied from the first supply port, a dummy substrate is held in the first holding portion,
The exposure apparatus according to claim 9, wherein the cleaning liquid is supplied from the first supply port in a state where at least a part of the second member is disposed in a gap between the dummy substrate and the first member.   In a state where the lower surface of the liquid immersion member faces at least one of the upper surface of the dummy substrate and the first surface so that at least a part of the immersion space of the cleaning liquid is formed on the second member. The exposure apparatus according to claim 9 or 10, wherein the cleaning liquid is supplied from the first supply port.   The exposure apparatus according to claim 9, wherein the first supply port is disposed in the liquid immersion member.   13. The exposure apparatus according to claim 9, wherein a recovery port included in the second member recovers at least a part of the cleaning liquid supplied from the first supply port.   The exposure apparatus according to claim 9, wherein the first supply port performs one or both of supply and recovery of the exposure liquid in exposure of the substrate.   The substrate holding device includes a space that communicates with a gap between an upper surface of the substrate and the first surface, and a second supply port that is disposed in the space and is capable of supplying a cleaning liquid. The exposure apparatus according to any one of -14. An exposure apparatus that exposes a substrate with exposure light through an exposure liquid,
An optical member having an exit surface from which the exposure light is emitted;
A first holding part for holding the lower surface of the substrate in a releasable manner and an opening in which the substrate can be arranged are defined, and arranged around the upper surface of the substrate in a state where the substrate is held by the first holding unit. A first member having a first surface adjacent to the upper surface of the substrate via a gap, and a substrate holding device,
A second member disposed in a space leading to a gap between the substrate and the first surface and having a recovery port capable of recovering a fluid;
An exposure apparatus comprising: a second supply port that is disposed in the space and supplies a cleaning liquid.   17. The exposure apparatus according to claim 16, wherein a recovery port included in the second member recovers at least a part of the cleaning liquid supplied from the second supply port. At least when the cleaning liquid is supplied from the second supply port, a dummy substrate is held in the first holding part,
At least a part of the cleaning liquid supplied from the second supply port has at least one of the upper surface of the dummy substrate and the first surface through a gap between the dummy substrate and the first member. The exposure apparatus according to claim 16 or 17, wherein the exposure apparatus flows in a space to be moved.   The exposure apparatus according to claim 18, wherein the cleaning liquid is supplied from the second supply port in a state where at least a part of the second member is disposed in a gap between the dummy substrate and the first member.   The exposure apparatus according to any one of claims 1 to 19, wherein the cleaning apparatus includes an emission unit that emits cleaning light. An exposure apparatus that exposes a substrate with exposure light through an exposure liquid,
An optical member having an exit surface from which the exposure light is emitted;
A first holding part for holding the lower surface of the substrate in a releasable manner and an opening in which the substrate can be arranged are defined, and arranged around the upper surface of the substrate in a state where the substrate is held by the first holding unit. A first member having a first surface adjacent to the upper surface of the substrate via a gap, and a substrate holding device,
An exposure apparatus comprising: the first member; and an emission unit that irradiates at least a part of at least one of the members positioned below the gap.   The exposure apparatus according to claim 21, wherein the member positioned below the gap has a recovery port capable of recovering the fluid.   The exposure apparatus according to claim 21, wherein the substrate holding device includes a member positioned below the gap.   The exposure apparatus according to any one of claims 20 to 23, wherein the emission unit is disposed at a position where the first surface can be opposed.   The exposure apparatus according to any one of claims 20 to 24, wherein the emission unit is disposed on a second movable member that is movable with respect to the substrate holding device. At least when the cleaning light is emitted from the emission unit, a dummy substrate is held in the first holding unit,
The exposure apparatus according to any one of claims 20 to 25, wherein the cleaning light emitted from the emission unit is irradiated through a reflective surface of the dummy substrate.   27. The cleaning light according to claim 20, wherein at least a part of the second member is disposed in a gap between the dummy substrate and the first member. The exposure apparatus described.   The exposure apparatus according to any one of claims 20 to 27, wherein the emission unit is disposed in a space that communicates with a gap between an upper surface of the substrate and the first surface.   The exposure apparatus according to any one of claims 20 to 28, wherein at least a part of a member positioned below the gap is disposed in a gap between the substrate and the first member in exposure of the substrate. .   The exposure apparatus according to any one of claims 1 to 28, further comprising a cleaning member that contacts at least a part of a surface of the first member and a surface of a member positioned below the gap. An exposure apparatus that exposes a substrate with exposure light through an exposure liquid,
An optical member having an exit surface from which the exposure light is emitted;
A first holding part for holding the lower surface of the substrate in a releasable manner and an opening in which the substrate can be arranged are defined, and arranged around the upper surface of the substrate in a state where the substrate is held by the first holding unit. A first member having a first surface adjacent to the upper surface of the substrate via a gap, and a substrate holding device,
An exposure apparatus comprising: the first member; and a cleaning member that contacts at least a part of at least one of the members positioned below the gap.   32. The exposure apparatus according to claim 31, wherein the member positioned below the gap has a recovery port capable of recovering the fluid.   The exposure apparatus according to claim 31 or 32, wherein the substrate holding device has a member positioned below the gap.   The exposure apparatus according to any one of claims 31 to 33, wherein the cleaning member is disposed at a position where the first surface can face the cleaning member.   The exposure apparatus according to any one of claims 31 to 334, wherein the cleaning member is movable with respect to the substrate holding device.   36. The exposure apparatus according to any one of claims 31 to 35, wherein the cleaning member has a suction port for sucking foreign matter.   37. The exposure apparatus according to any one of claims 31 to 36, wherein at least a part of a member positioned below the gap is disposed in a gap between the substrate and the first member in exposure of the substrate. .   The exposure apparatus according to any one of claims 1 to 37, further comprising a second holding unit that is disposed around the first holding unit and holds the first member in a releasable manner. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 38;
Developing the exposed substrate. A device manufacturing method. An exposure apparatus cleaning method for exposing a substrate with exposure light through an exposure liquid,
The exposure apparatus includes:
An optical member having an exit surface from which the exposure light is emitted;
A first holding part for holding the lower surface of the substrate in a releasable manner and an opening in which the substrate can be arranged are defined, and arranged around the upper surface of the substrate in a state where the substrate is held by the first holding unit. A substrate holding device comprising: a first member having a first surface adjacent to the upper surface of the substrate via a gap;
A cleaning method comprising cleaning at least a part of at least one of the first member and a member located below the gap.   41. The cleaning method according to claim 40, wherein the member positioned below the gap has a recovery port capable of recovering fluid.   The cleaning method according to claim 40 or 41, wherein the substrate holding device includes a member positioned below the gap. An exposure apparatus cleaning method for exposing a substrate with exposure light through an exposure liquid,
The exposure apparatus includes:
An optical member having an exit surface from which the exposure light is emitted;
A first holding part for holding the lower surface of the substrate in a releasable manner and an opening in which the substrate can be arranged are defined, and arranged around the upper surface of the substrate in a state where the substrate is held by the first holding unit. A first member having a first surface adjacent to the upper surface of the substrate via a gap, and a substrate holding device,
A second member including a porous member, at least part of which is disposed between the substrate and the first member having the first surface in a state where the substrate is held by the first holding unit;
An immersion member disposed at least at a part of the periphery of the optical member, and forming an immersion space for the exposure liquid with the substrate in exposure of the substrate,
A cleaning method including forming an immersion space for a cleaning liquid between the liquid immersion member and the second member. An exposure apparatus cleaning method for exposing a substrate with exposure light through an exposure liquid,
The exposure apparatus includes:
An optical member having an exit surface from which the exposure light is emitted;
A first holding part for holding the lower surface of the substrate in a releasable manner and an opening in which the substrate can be arranged are defined, and arranged around the upper surface of the substrate in a state where the substrate is held by the first holding unit. A first member having a first surface adjacent to the upper surface of the substrate via a gap, and a substrate holding device,
A second member having a recovery port disposed in a space leading to a gap between the substrate and the first surface and capable of recovering a fluid;
A cleaning method comprising supplying a cleaning liquid to the space. An exposure apparatus cleaning method for exposing a substrate with exposure light through an exposure liquid,
The exposure apparatus includes:
An optical member having an exit surface from which the exposure light is emitted;
A first holding part for holding the lower surface of the substrate in a releasable manner and an opening in which the substrate can be arranged are defined, and arranged around the upper surface of the substrate in a state where the substrate is held by the first holding unit. A substrate holding device comprising: a first member having a first surface adjacent to the upper surface of the substrate via a gap;
A cleaning method comprising irradiating at least a part of at least one of the first member and a member located below the gap.   46. The cleaning method according to claim 45, wherein the member positioned below the gap has a recovery port capable of recovering fluid.   47. The cleaning method according to claim 45 or 46, wherein the substrate holding device has a member positioned below the gap. An exposure apparatus cleaning method for exposing a substrate with exposure light through an exposure liquid,
The exposure apparatus includes:
An optical member having an exit surface from which the exposure light is emitted;
A first holding part for holding the lower surface of the substrate in a releasable manner and an opening in which the substrate can be arranged are defined, and arranged around the upper surface of the substrate in a state where the substrate is held by the first holding unit. A substrate holding device comprising: a first member having a first surface adjacent to the upper surface of the substrate via a gap;
A cleaning method comprising bringing a cleaning member into contact with at least a part of the first member and a member located below the gap.   49. The cleaning method according to claim 48, wherein the member positioned below the gap has a recovery port capable of recovering fluid.   50. The cleaning method according to claim 48 or 49, wherein the substrate holding device has a member positioned below the gap. Exposing the substrate using the exposure apparatus cleaned by the cleaning method according to any one of claims 40 to 50;
Developing the exposed substrate. A device manufacturing method. A program that causes a computer to execute control of an exposure apparatus that exposes a substrate with exposure light via an exposure liquid,
The exposure apparatus includes:
An optical member having an exit surface from which the exposure light is emitted;
A first holding part for holding the lower surface of the substrate in a releasable manner and an opening in which the substrate can be arranged are defined, and arranged around the upper surface of the substrate in a state where the substrate is held by the first holding unit. A substrate holding device comprising: a first member having a first surface adjacent to the upper surface of the substrate via a gap;
A program for executing cleaning of at least a part of at least one of the first member and a member located below the gap. A program that causes a computer to execute control of an exposure apparatus that exposes a substrate with exposure light via an exposure liquid,
The exposure apparatus includes:
An optical member having an exit surface from which the exposure light is emitted;
A first holding part for holding the lower surface of the substrate in a releasable manner and an opening in which the substrate can be arranged are defined, and arranged around the upper surface of the substrate in a state where the substrate is held by the first holding unit. A first member having a first surface adjacent to the upper surface of the substrate via a gap, and a substrate holding device,
A second member including a porous member, at least part of which is disposed between the substrate and the first member having the first surface in a state where the substrate is held by the first holding unit;
An immersion member disposed at least at a part of the periphery of the optical member, and forming an immersion space for the exposure liquid with the substrate in exposure of the substrate,
A program for executing formation of a liquid immersion space for cleaning liquid between the liquid immersion member and the second member. A program that causes a computer to execute control of an exposure apparatus that exposes a substrate with exposure light via an exposure liquid,
The exposure apparatus includes:
An optical member having an exit surface from which the exposure light is emitted;
A first holding part for holding the lower surface of the substrate in a releasable manner and an opening in which the substrate can be arranged are defined, and arranged around the upper surface of the substrate in a state where the substrate is held by the first holding unit. A first member having a first surface adjacent to the upper surface of the substrate via a gap, and a substrate holding device,
A second member having a recovery port disposed in a space leading to a gap between the substrate and the first surface and capable of recovering a fluid;
A program for causing the cleaning liquid to be supplied to the space. A program that causes a computer to execute control of an exposure apparatus that exposes a substrate with exposure light via an exposure liquid,
The exposure apparatus includes:
An optical member having an exit surface from which the exposure light is emitted;
A first holding part for holding the lower surface of the substrate in a releasable manner and an opening in which the substrate can be arranged are defined, and arranged around the upper surface of the substrate in a state where the substrate is held by the first holding unit. A substrate holding device comprising: a first member having a first surface adjacent to the upper surface of the substrate via a gap;
A program for executing irradiation of cleaning light to at least a part of at least one of the first member and a member located below the gap. A program that causes a computer to execute control of an exposure apparatus that exposes a substrate with exposure light via an exposure liquid,
The exposure apparatus includes:
An optical member having an exit surface from which the exposure light is emitted;
A first holding part for holding the lower surface of the substrate in a releasable manner and an opening in which the substrate can be arranged are defined, and arranged around the upper surface of the substrate in a state where the substrate is held by the first holding unit. A substrate holding device comprising: a first member having a first surface adjacent to the upper surface of the substrate via a gap;
A program for executing a contact of a cleaning member with at least a part of the first member and a member located below the gap.   The computer-readable recording medium which recorded the program as described in any one of Claims 52-56.

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