JP2013044862A - Optical module, manufacturing method of optical module, and optical module manufacturing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To fix a first optical component and a second optical component while accurately aligning them which are respectively formed on different substrates.SOLUTION: There is provided the optical module including the first optical component, the second optical component fixed to the first optical component and optically coupled to the first optical component, and a first actuator which moves the second optical component relative to the first optical component before the second optical component is fixed to the first optical component and aligns the first optical component and the second optical component. A manufacturing method of the optical module and optical module manufacturing system are also provided.

Description

  The present invention relates to an optical module, an optical module manufacturing method, and an optical module manufacturing system.

Conventionally, there are known optical components such as a laser element, an optical waveguide for guiding laser light, an optical switch for switching an optical path, and an optical coupler for combining a plurality of laser outputs. In addition, a technique for integrating these optical components in one semiconductor laser module is known (see, for example, Patent Document 1).
[Patent Literature]
Patent Document 1 JP 2001-85781 A

  However, when one optical module is formed by optically connecting a plurality of optical components formed on different substrates, it is necessary to control the relative positions of the plurality of optical components to couple the optical components together. Since such optical component position control requires high accuracy, it is necessary to prepare a large-scale device such as an alignment device and align the optical components.

  According to the first aspect of the present invention, the first optical component, the second optical component fixed to the first optical component and coupled to the first optical component, and the second optical component become the first optical component. An optical module including a first optical component and a first actuator for alignment of the second optical component, which moves the second optical component relative to the first optical component before being fixed to the first optical component, and The manufacturing system is provided.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is the top view which looked at the optical module which concerns on the 1st Embodiment of this invention from the upper surface. It is sectional drawing in the bb 'line | wire of the optical module described in FIG. 1A. It is sectional drawing in the aa 'line | wire of the optical module described in FIG. 1A. The structure of the 1st optical component and 2nd optical component which concern on 1st Embodiment is shown. The structure of the 1st optical component which concerns on the 1st modification of 1st Embodiment, and a 2nd optical component is shown. The structure of the optical module which concerns on the 2nd modification of 1st Embodiment is shown. It is sectional drawing in the aa 'line | wire of the optical module of FIG. 4A. It is sectional drawing which shows the structure of the optical module which concerns on the 3rd modification of 1st Embodiment. It is sectional drawing which shows the structure of the optical module which concerns on the 2nd Embodiment of this invention. The structure of the 1st-3rd optical component which concerns on 2nd Embodiment is shown. 1 shows an optical module manufacturing method according to a first embodiment. An optical module manufacturing method concerning a 2nd embodiment is shown. The optical module manufacturing system which concerns on 1st and 2nd embodiment is shown.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1A is a plan view of the optical module 100 according to the first embodiment of the present invention as viewed from above. 1B is a cross-sectional view taken along line bb ′ of the optical module 100 described in FIG. 1A. FIG. 1C is a cross-sectional view taken along the line aa ′ of the optical module 100 described in FIG. 1A.

  The optical module 100 aligns the optical axes of the optical components provided on the respective substrates by adjusting the relative positions of the two substrates on which the optical components are formed. The optical module 100 includes a first substrate 150, a temperature adjustment element 156, a submount 158, a second substrate 152, a base 155, an adhesive 160, and a first actuator 110.

  In the first embodiment, in the manufacturing process of the optical module 100, the first optical component 102 and the second optical component 104 are aligned with each other by driving the first actuator 110 to align the first optical component 102 and the second optical component 104. The two optical components 104 are optically coupled with high accuracy. Here, the optical coupling may be direct connection without using a lens or the like, or may be indirect connection through a lens or the like.

  The first substrate 150 is a substrate made of a semiconductor or the like on which the first optical component 102 is formed. The first optical component 102 includes a semiconductor laser element, and may be a semiconductor laser array provided with a plurality of semiconductor laser elements. Instead, the first optical component 102 may be another optical component or a combination of other optical components.

  The temperature adjustment element 156 is provided on the lower surface side of the first substrate 150 and controls the temperature of the first substrate 150 through the submount 158. Thus, the temperature adjustment element 156 controls the element temperature of the first optical component 102 to a predetermined set temperature, and outputs a laser beam having a wavelength corresponding to the set temperature from the semiconductor laser. The temperature adjustment element 156 keeps the element temperature of the first optical component 102 provided on the first substrate 150 constant, and stabilizes the output wavelength of the semiconductor laser provided as the first optical component 102, for example. The temperature adjustment element 156 is, for example, a Peltier element.

  The submount 158 is provided on the temperature adjustment element 156 and mounts the first substrate 150. Heat generated in the first optical component 102 is transferred to the temperature adjustment element 156 via the submount 158. Each member of the first substrate 150, the temperature adjustment element 156, and the submount 158 may be fixed by bonding or the like.

  The second substrate 152 is a substrate made of a semiconductor or the like on which the second optical component 104 is formed. The second optical component 104 is fixed to the first optical component 102 and is optically coupled to the first optical component 102. The first substrate 150 on which the first optical component 102 is mounted and the second substrate 152 on which the second optical component 104 is mounted are fixed by adhesion or welding. The second optical component 104 includes an optical waveguide that propagates light output from the semiconductor laser element of the first optical component 102. The second optical component 104 may include an optical switch, a photodetector, and / or an optical modulator.

  The base 155 is positioned on the lower surface of the first actuator 110 and mounts the second substrate 152. The base 155 is a support formed of a ceramic substrate, a plastic substrate, a semiconductor substrate, or the like.

  The adhesive 160 is, for example, a resin adhesive, and fixes the relative positions of the aligned first optical component 102 and second optical component 104. The adhesive 160 is desirably light transmissive so that the light output from the first optical component 102 can propagate to the second optical component 104. The adhesive 160 may be a resin that is solidified by light, heat, moisture, or the like, and may be an epoxy resin instead.

  Prior to fixing the first optical component and the second optical component, the first actuator 110 moves the second optical component 104 on the second substrate 152 with respect to the first optical component 102 to thereby generate the first optical component. The component 102 and the second optical component 104 are aligned. The first actuator 110 is provided between the second substrate 152 and the base 155 and holds the second substrate 152.

  The first actuator 110 is driven by a control signal from the outside and moves the second substrate 152. The first actuator 110 may be used for alignment when the optical module 100 is manufactured, and may not be driven after manufacturing.

  In the first embodiment, the first actuator 110 is an electrostatic actuator that uses electrostatic force. Here, the first actuator 110 may use a parallel plate capacitor or a comb-shaped actuator as an electrostatic actuator. The first actuator 110 may include an elastic beam 164 that maintains the distance between the bipolar plates 166 constituting the parallel plate capacitor.

  Instead of the electrostatic actuator, the first actuator 110 may be a piezoelectric actuator using a piezoelectric effect, a thermally driven actuator using thermal deformation, and other actuators capable of controlling a driving amount.

  The first actuator 110 drives the second substrate 152 in three directions including a vertical direction (y direction), a horizontal direction (x direction), and a vertical direction (z direction) in the drawing. The first actuator 110 includes an x-direction actuator 402 that drives in the x-direction, a y-direction actuator 404 that drives in the y-direction, and a z-direction actuator 406 that drives in the z-direction. As an example, the first actuator 110 drives an electrostatic actuator that drives in each direction, and moves the position of the second optical component 104 in each direction with respect to the first optical component 102.

  The first actuator 110 can adjust the angle of the second optical component 104 with respect to the first optical component 102 by driving a combination of two or more electrostatic actuators that drive in one direction. For example, in the first embodiment, the first actuator 110 has two z-direction actuators arranged along the x-direction. The first actuator 110 can adjust the rotation angle of the second substrate 152 in the xz plane by changing the drive amounts of the two z-direction actuators.

  As described above, the optical module 100 according to the first embodiment is high without using an alignment device or the like outside the optical module 100 by driving the first actuator 110 provided integrally in the optical module 100. The first optical component 102 and the second optical component 104 can be optically coupled with accuracy.

  FIG. 2 shows a configuration of the first optical component 102 and the second optical component 104 included in the optical module 100 according to the first embodiment. In the first embodiment, the first optical component 102 has a laser array composed of a plurality of semiconductor laser elements 114. Instead of this, the first optical component 102 may include a single semiconductor laser element 114.

  The semiconductor laser element 114 may be a single longitudinal mode semiconductor laser element. The semiconductor laser element 114 may be a distributed feedback laser element. Since the refractive index of the semiconductor laser element 114 changes depending on the temperature, the oscillation wavelength of the output laser can be controlled by the element temperature. For example, the semiconductor laser element 114 can change the oscillation wavelength within a range of 3 nm to 4 nm by changing the element temperature.

  When the first optical component 102 has, for example, eight semiconductor laser elements 114 arranged so that the oscillation wavelength band is continuously arranged at intervals of 3 nm to 4 nm, the first optical component 102 has a total thickness of 24 nm to Laser light having a wavelength range of 32 nm can be emitted.

  The second optical component 104 includes an optical waveguide 123, an optical switch unit 127, an optical switch unit 128, an optical switch unit 129, an optical waveguide 125, a first light detection unit 120, and a directional coupler 126.

  A plurality of optical waveguides 123 are provided at the light input end of the second optical component 104 corresponding to the plurality of semiconductor laser elements 114. Usually, the emission side of the semiconductor laser element 114 is a low reflection end, and the opposite end face is a high reflection end. Light output from the emission-side end faces of the plurality of semiconductor laser elements 114 is incident on the plurality of optical waveguides 123, respectively. The optical waveguide 123 propagates the light output from the semiconductor laser element 114 to the optical switch unit 127.

  The optical switch units 127 to 129 are optical switch units each having one or a plurality of optical switches each having two inputs and one output, and are connected so that the optical switches form a multistage tree structure. The optical switch units 127 to 129 guide the light of the semiconductor laser element 114 selected from the plurality of semiconductor laser elements 114 to the optical waveguide 125 as a whole.

  The plurality of optical switch units 127 in the first stage of the tree structure selects half the number of lights propagating through the plurality of optical waveguides 123 and outputs the selected light to the optical switch unit 128 connected downstream. . The plurality of optical switch units 128 provided after the second stage of the tree structure and before the final stage select the half of the plurality of lights input from the optical switch unit 127 of the previous stage and connect to the downstream side. To the optical switch unit 129. One optical switch unit 129 provided at the final stage of the tree structure selects one of the two lights input from the previous optical switch unit 128 and outputs the selected light to the optical waveguide 125.

  The optical waveguide 125 is provided at the light output end of the second optical component 104. The optical waveguide 125 propagates the light selected by the optical switch unit 129 to the output end of the second optical component 104.

  As described above, in the first embodiment, the second optical component 104 selects a path of light propagating through the eight optical waveguides by using a total of seven optical switches of the optical switch units 127 to 129. Can be guided to one optical waveguide. Depending on the number of semiconductor laser elements 114 included in the first optical component 102, the number of optical switch units 127 to 129 included in the second optical component 104 and the number of optical switches included in each step vary. When the first optical component 102 includes a single semiconductor laser element 114, the optical switch portions 127 to 129 are unnecessary, and the optical waveguide 125 is directly connected to the semiconductor laser element 114.

  The optical switch units 127 to 129 are MZI (Mach-Zehnder Interferometer) elements. The MZI element demultiplexes the input light into two waveguides, and then applies phase modulation to the light passing through one or both waveguides to control the phase of the light passing through the two waveguides. Thus, it is possible to selectively output light having a predetermined wavelength. The optical switch units 127 to 129 may use other optical switches instead of the MZI elements.

  The first light detection unit 120 detects light incident from the first optical component 102 during the alignment operation of the first optical component 102 and the second optical component 104. The first light detection unit 120 detects light emitted from one of the semiconductor laser elements 114 and selected by the optical switch units 127 to 129. The optical module 100 can align the first optical component 102 and the second optical component 104 using the change in the intensity of light detected by the first light detection unit 120. For example, the optical module 100 moves and aligns the second optical component 104 in a direction in which the intensity of the detection light is increased.

  The first light detection unit 120 can be used as a laser light intensity monitor when the optical module 100 is used. By feeding back the result of monitoring the intensity to the semiconductor laser element 114, the optical module 100 can output a laser having a stable intensity. Since the first light detection unit 120 is formed on the second substrate 152, another light monitor is not required outside the optical module 100. For this reason, alignment of the second optical component 104 and the optical monitor is unnecessary.

  The directional coupler 126 is provided between the optical waveguide 125 and the first light detection unit 120, and transmits a part of the light transmitted through the optical waveguide 125 to the first light detection unit 120.

  FIG. 3 shows the configuration of the first optical component 102 and the second optical component 104 in the first modification of the first embodiment. Since the optical module 100 according to the first modification has the same configuration as the optical module 100 shown in FIG. 2 except that the second optical component 104 includes the optical modulator 130, the following description will be made except for differences. Omitted.

  The optical modulator 130 is provided on the downstream side of the first light detection unit 120 and modulates the laser light guided by the optical waveguide 125. The optical modulator 130 outputs the modulated light to the output end of the second optical component 104.

  According to the first modification, the optical modulator 130 is integrally formed on the second substrate 152 on which the optical waveguides 123 and 125, the optical switch units 127 to 9, the directional coupler 126, and the first light detection unit 120 are provided. It is formed. Instead, the optical modulator 130 is formed on a different substrate from the second substrate 152, and the second substrate 152 and the second substrate 152 are formed in the same manner as the alignment of the first optical component 102 and the second optical component 104. You may align with another board | substrate with which the light modulator 130 was formed.

  4A and 4B show a configuration of an optical module according to a second modification of the first embodiment. FIG. 4A is a plan view of the optical module 100 according to the second modification as viewed from above. 4B is a cross-sectional view taken along the line aa ′ of the optical module 100 described in FIG. 4A.

  The optical module 100 includes a first actuator 110 including four actuators on the lower surface of the second substrate 152. The optical module 100 can adjust the inclination at the joint between the first optical component 102 and the second optical component 104 by independently controlling the driving amounts of the four actuators in the height direction (y direction).

  For example, the optical module 100 drives two actuators on the + x side (upper side in FIG. 4A) in the + y direction (or −y direction), and drives two actuators on the −x side (lower side in FIG. 4A) in the −y direction. By driving in the (or + y direction), the inclination of the second substrate 152 can be adjusted. By such adjustment, the optical module 100 can adjust the inclination of the arrangement direction of the plurality of optical waveguides 123 arranged in parallel with the plurality of semiconductor laser elements 114 arranged in parallel.

  In the second modification, the first optical component 102 and the second optical component 104 having the plurality of semiconductor laser elements 114 may be aligned by sequentially adjusting the inclination and height of the second substrate 152. For example, first, the inclination of the second substrate 152 is adjusted, and the optical waveguides 123 corresponding to the semiconductor laser elements 114 existing at both ends of the laser array are aligned. Next, the driving amount in the height direction (y direction) of the entire second substrate 152 is adjusted, and the optical waveguide 123 corresponding to the semiconductor laser element 114 existing at the center of the laser array is aligned.

  As described above, by individually controlling the plurality of actuators included in the first actuator, the first light can be efficiently compared with the case where the optical waveguide 123 corresponding to the semiconductor laser element 114 is individually aligned. The component 102 and the second optical component 104 can be aligned.

  FIG. 5 is a cross-sectional view illustrating a configuration of an optical module according to a third modification of the first embodiment. The optical module 100 according to the third modification has the same configuration as that of the optical module 100 according to the first embodiment, except that the base 155 has both the first substrate 150 and the second substrate 152 mounted thereon. According to the third modified example, since the first optical component 102 and the second optical component 104 are fixed by the base 155 in addition to the adhesive 160, the strength of the entire optical module 100 is improved.

  6 and 7 show the configuration of the optical module 101 according to the second embodiment of the present invention. FIG. 6 is a cross-sectional view of the optical module 101 according to the second embodiment. The optical module 101 according to the second embodiment includes a third substrate 154 on which a third optical component 106 is formed, in addition to the optical module 100 of the first embodiment. The optical module 101 of the second embodiment drives the second actuator 112 to align the first optical component 102 and the third optical component 106. Note that, in the second embodiment, portions denoted by the same reference numerals as those in the first embodiment are the same as those in the first embodiment, and thus description thereof is omitted.

  The third substrate 154 is a substrate such as a semiconductor substrate on which the third optical component 106 is formed. The third optical component 106 formed on the third substrate 154 is optically coupled to the first optical component 102 formed on the first substrate 150 and is fixed to the first optical component 102 by the adhesive 162. . The adhesive 162 may be an adhesive made of the same material as the adhesive 160.

  Prior to fixing the first optical component 102 and the third optical component 106, the second actuator 112 moves the third optical component 106 on the third substrate 154 relative to the first optical component 102, thereby The optical component 102 and the third optical component 106 are aligned. The second actuator 112 is provided on the lower surface of the third substrate 154 and holds the third substrate 154.

  The second actuator 112 may be used for alignment when the optical module 101 is manufactured, and may not be driven after manufacturing. The second actuator 112 can employ the same configuration as the first actuator 110.

  The optical module 101 may include a temperature adjustment element between the third substrate 154 and the second actuator 112. The optical module 101 may have a submount between the third substrate 154 and the temperature adjustment element.

  FIG. 7 shows the configuration of the first to third optical components of the optical module according to the second embodiment. The first optical component 102 includes a laser array composed of a plurality of semiconductor laser elements 114 and an optical multiplexer 132.

  The optical multiplexer 132 is provided at the high reflection end 172 of the semiconductor laser element 114, combines the light output from the high reflection ends 172 of the plurality of semiconductor laser elements 114, and outputs the combined light to the third optical component 106. The optical multiplexer 132 may be a multimode interference (MMI) optical coupler.

  The second optical component 104 includes an optical waveguide 123, an optical waveguide 125, an optical switch unit 127, an optical switch unit 128, an optical switch unit 129, a first light detection unit 120, and a directional coupler 126. The optical waveguide 123 receives light output from the low reflection ends 170 of the plurality of semiconductor laser elements 114. Since the configuration of the second optical component 104 is the same as that of the first embodiment, a description thereof will be omitted.

  The third optical component 106 includes a second light detection unit 122 and a variable wavelength optical filter 134. The third optical component 106 is optically coupled to the first optical component 102 and fixed to the first optical component 102.

  The second light detection unit 122 detects light incident from the first optical component 102 during the alignment operation of the first optical component 102 and the third optical component 106. In the second embodiment, the second light detection unit 122 detects light emitted from the semiconductor laser element 114 and transmitted through the variable wavelength optical filter 134. The optical module 101 can align the first optical component 102 and the third optical component 106 using the change in the intensity of light detected by the second light detection unit 122. For example, the optical module 101 can align the third optical component 106 by moving the third optical component 106 in a direction in which the intensity of the detection light is increased.

  When the optical module 101 is used, the second light detection unit 122 can be used as an intensity monitor of laser light having a target wavelength. By feeding back the result of monitoring the intensity to the semiconductor laser element 114, the optical module 101 stabilizes the frequency of the laser beam to be output. Since the second light detection unit 122 is formed on the third substrate 154, a separate light monitor is not required outside the optical module 101. For this reason, alignment of the third optical component 106 and the optical monitor is unnecessary.

  The variable wavelength optical filter 134 can adjust the wavelength of light transmitted through the second light detection unit 122. The variable wavelength optical filter 134 transmits the wavelength component corresponding to the light to be output from the designated semiconductor laser element 114 from the light combined by the optical multiplexer 132. The variable wavelength optical filter 134 is, for example, a ring filter. The variable wavelength optical filter 134 changes the wavelength of light to be shielded by expanding and contracting the optical path length of the ring filter, for example, by heat.

  As described above with reference to FIGS. 6 and 7, the optical module 101 uses the two actuators so that both the first optical component 102, the second optical component 104, the first optical component 102, and the third optical component 106 are used. Can be aligned.

  FIG. 8 shows an optical module manufacturing method according to the first embodiment. 8A to 8D show an optical module for manufacturing an optical module 100 having a first substrate 150 on which a first optical component is formed and a second substrate 152 on which a second optical component is formed. The first optical member forming stage, the first actuator forming stage, the second optical member forming stage, the first alignment stage, and the first fixing stage in the manufacturing process are respectively shown.

  First, as shown in FIG. 8A, in the first optical member formation stage, a first semiconductor laser element 114 or a laser array composed of a plurality of semiconductor laser elements 114, a first optical multiplexer 132, and the like are provided. The optical component 102 is formed on the first substrate 150.

  Next, as shown in FIG. 8B, in the first actuator formation stage, the first actuator 110 that aligns the second optical component 104 with the first optical component 102 is formed. The first actuator 110 has a single or a plurality of actuators.

  Next, in the second optical component formation stage, the second optical component 104 including the optical waveguide 123, the optical waveguide 125, the optical switch units 127 to 129, the first light detection unit 120, the directional coupler 126, and the like is replaced with the second optical component 104. It is formed on the substrate 152. Next, the second substrate 152 on which the second optical component 104 is formed is attached to the first actuator 110. Alternatively, the second substrate 152 may be formed on the first actuator 110, and the second optical component 104 may be formed thereon.

  Next, as shown in FIG. 8C, in the first alignment stage, the first actuator 110 is driven to move the second optical component 104, and the second optical component 102 is moved with respect to the first optical component 102. 104 is aligned. Here, a laser drive circuit is connected to the semiconductor laser element 114 of the first optical component 102 to output laser light, and the first light detection unit 120 detects the laser light from the first optical component 102. Based on the detected result, the first actuator 110 is driven to adjust the position of the second optical component 104 with respect to the first optical component 102.

  When the first optical component 102 is a laser array provided with a plurality of semiconductor laser elements 114, light is output from at least one of the plurality of semiconductor laser elements 114 and the optical switch units 127 to 129 are controlled to control the semiconductor laser. The light output from the element 114 is output from the optical switch unit 129, and the output light is detected by the first light detection unit 120.

  Further, among the plurality of semiconductor laser elements 114 arranged in parallel in the laser array, light is sequentially output from at least the semiconductor laser elements 114 at both ends, and the light from at least the semiconductor laser elements 114 at both ends is output to the first light detection unit 120. The position of the second optical component 104 relative to the first optical component 102 may be adjusted by driving the first actuator 110 based on the result detected by the above.

  In the first alignment stage, the light output to the first optical component 102 is detected by the first light detection unit 120, and the first actuator 110 is driven in a direction to increase the intensity of the light detected by the first light detection unit 120. Then, the second optical component 104 may be moved. When the first actuator 110 has a plurality of actuators, the position of the second optical component 104 with respect to the first optical component 102 may be adjusted by individually adjusting the respective driving amounts.

  In the example shown in (c) of FIG. 8, the first actuator 110 is driven in the ± y direction to adjust the height of the second substrate 152. The first actuator 110 may be further driven in the ± x direction and the ± z direction. The positions of the first optical component 102 and the second optical component 104 may be adjusted by sequentially driving a plurality of actuators of the first actuator 110 in each direction.

  For example, by first driving the first actuator 110 in the ± x direction and the ± y direction, the relative positions of the first optical component 102 and the second optical component 104 in the front-rear direction and the vertical direction are adjusted, and the next Alternatively, the relative distance between the first optical component 102 and the second optical component 104 may be adjusted by driving the first actuator 110 in the ± z direction. When such an adjustment method is used, since the high reflection end 172 is moved away from the z direction and aligned, the end surface can be prevented from being scratched.

  Prior to the first alignment step, the relative position may be roughly adjusted by moving one of the first optical component 102 and the second optical component 104 with respect to the other by a substrate moving device or the like. In this case, after the coarse adjustment stage, the first actuator 110 is driven to finely adjust the relative positions of the first optical component 102 and the second optical component 104. Further, after the coarse adjustment stage, an adhesive 160 used in the subsequent first fixing stage may be injected between the first optical component 102 and the second optical component 104.

  Next, as shown in FIG. 8D, in the first fixing stage, the first optical component 102 and the second optical component 104 with the first optical component 102 and the second optical component 104 aligned. Is fixed with an adhesive 160 and optically coupled. For example, after a photo-curing adhesive is injected between the first optical component 102 and the second optical component 104 that are aligned, the first optical component 102 and the second optical component 104 are fixed by photo-curing. . Instead, prior to the first alignment step, a photo-curing adhesive is injected between the first optical component 102 and the second optical component 104 in advance, and after the first alignment step, the photo-curing type is injected. The first optical component 102 and the second optical component 104 may be fixed by photocuring the adhesive.

  As the photocurable adhesive, an adhesive that is not cured by light output from the first optical component 102, for example, a UV curable adhesive can be used. By using such an adhesive 160, it is possible to prevent the first optical component 102 and the second optical component 104 from being fixed during the first alignment step. As the UV curable adhesive, an acrylic resin, an epoxy resin, or a polyester resin can be used. Further, in the first fixing stage, a part or all of the contact surfaces of the first substrate 150 and the second substrate 152 are melted by a laser or the like without using the adhesive 160, and then the first substrate 150 and the second substrate 152 are bonded. It may be welded.

  As described above with reference to FIG. 8, the optical module 100 of the first embodiment includes the first optical member forming stage, the first actuator forming stage, the second optical member forming stage, the first alignment stage, and the first fixing stage. It can be manufactured by going through.

  FIG. 9 shows an optical module manufacturing method according to the second embodiment. FIGS. 9E to 9H show a second actuator formation stage, a third optical component formation stage, a second alignment stage, and a second fixing stage, respectively. The optical module 101 according to the second embodiment is manufactured by performing the steps (e) to (h) in FIG. 9 after the steps described with reference to (a) to (d) in FIG. 8. When the first optical component 102 includes a plurality of semiconductor laser elements 114, an optical multiplexer 132 is formed on the high reflection end 172 side of the semiconductor laser element 114 as the first optical component 102 in the first optical member formation stage. Keep it.

  As shown in FIG. 9 (e), following the first fixing step described with reference to FIG. 8 (d), the third optical component 106 is moved to the first optical component 102 in the second actuator forming step. The second actuator 112 to be aligned is formed. The second actuator 112 has a single or a plurality of actuators.

  As shown in FIG. 9 (f), following the second actuator formation stage, in the third optical part formation stage, the third optical component 106 having the variable wavelength optical filter 134, the second light detection unit 122, etc. It is formed on the substrate 154. Next, the third substrate 154 on which the third optical component 106 is formed is attached to the second actuator 112. Instead, the third substrate 154 may be formed on the second actuator 112, and the third optical component 106 may be formed thereon.

  Next, as shown in FIG. 9G, in the second alignment stage, the second actuator 112 is driven to move the third optical component 106, and the third optical component 102 is moved relative to the first optical component 102. 106 is aligned. Here, a laser drive circuit is connected to the semiconductor laser element 114 of the first optical component 102 to output laser light. Since part of the laser light leaks from the high reflection end 172 of the semiconductor laser element 114, the laser light leaked from the high reflection end 172 is detected by the second light detection unit 122. Based on the detected result, the second actuator 112 is driven to adjust the position of the third optical component 106 relative to the first optical component 102. In the description of the first alignment step, the second optical component 104 is replaced with the third optical component 106, the second substrate 152 is replaced with the third substrate 154, and the first light detection unit 120 is replaced with the second light detection unit 122. It is also possible to explain the second alignment step.

  Next, as shown in (h) of FIG. 9, in the second fixing stage, the first optical component 102 and the third optical component 106 with the first optical component 102 and the third optical component 106 aligned. Are fixed by an adhesive 162 and optically coupled. In the description of the first fixing step, the second optical component 104 is replaced with the third optical component 106, the second substrate 152 is replaced with the third substrate 154, and the first light detection unit 120 is replaced with the second light detection unit 122. Thus, the second fixing stage may be described.

  As described above with reference to FIG. 9, the optical module 101 according to the second embodiment is manufactured after the optical module 100 according to the first embodiment is manufactured, the second actuator formation stage, the third optical component formation stage, and the second adjustment. It can be manufactured by passing through the lead stage and the second fixing stage.

  FIG. 10 shows an optical module manufacturing system according to the first and second embodiments. The optical module manufacturing system includes an optical component manufacturing apparatus 200 and an optical component assembling apparatus 300. The optical module manufacturing system manufactures optical modules 100 and 101 in which the first optical component 102 and the second optical component 104 are aligned with high accuracy.

  The optical component manufacturing apparatus 200 manufactures the first optical component 102, the second optical component 104, and the first actuator 110. The optical component manufacturing apparatus 200 may further manufacture the third optical component 106, the second actuator 112, and other components. The optical component manufacturing apparatus 200 may be composed of one manufacturing apparatus or a plurality of manufacturing apparatuses. Components such as the first optical component 102, the second optical component 104, and the first actuator 110 manufactured by the optical component manufacturing apparatus 200 are transported to the optical component assembling apparatus 300 by a substrate transport device or the like.

  The optical component assembling apparatus 300 receives the first optical component 102, the second optical component 104, and the first actuator 110 manufactured by the optical component manufacturing apparatus 200, and converts the first optical component 102 and the second optical component 104. Align and fix. The optical component assembling apparatus 300 includes an adhesive device 310 that fixes the first optical component 102 and the second optical component 104, and a control device 320 that moves and aligns the positions of the first optical component 102 and the second optical component 104. Have

  The control device 320 has a drive circuit that drives the semiconductor laser element 114, and outputs the selected semiconductor laser element 114 from among the plurality of semiconductor laser elements 114. The control device 320 controls the optical switch units 127 to 129 so that the laser light output from the selected semiconductor laser element 114 is guided to the optical waveguide 125 and the first light detection unit 120. The control device 320 causes the first light detection unit 120 to detect the intensity of the laser light and receives the detection result. The control device 320 moves the second optical component 104 to the first actuator 110 based on the detection result, and aligns the first optical component 102 and the second optical component 104.

  The control device 320 has a coarse adjustment unit 322. The coarse adjustment unit 322 roughly adjusts the positions of the first optical component 102 and the second optical component 104 by moving the relative position of the first optical component 102 or the second optical component 104 by the substrate moving device.

  After the coarse adjustment, the control device 320 drives the first actuator 110 to finely adjust the relative positions of the first optical component 102 and the second optical component 104 to perform alignment. At the time of fine adjustment, the control device 320 is based on the result of detecting the light incident on the second optical component 104 from the first optical component 102 by the first light detection unit 120 formed on the second optical component 104. The first optical component and the second optical component are aligned.

  The bonding apparatus 310 fixes the first optical component 102 and the second optical component 104 in a state where the first optical component 102 and the second optical component 104 are aligned. The bonding apparatus 310 includes an adhesive injection unit 312 and a light irradiation unit 314. The adhesive injection unit 312 injects a photocurable adhesive between the first optical component 102 and the second optical component 104. The light irradiation unit 314 irradiates the light curable adhesive with light in a state where the first optical component 102 and the second optical component 104 are aligned, and cures the light curable adhesive. The adhesive device 310 may include a welding device that welds the first optical component 102 and the second optical component 104 with a laser or the like instead of the adhesive injection unit 312 and the light irradiation unit 314.

  When the optical component assembling apparatus 300 assembles the optical module 101 according to the second embodiment, the control device 320 causes the semiconductor laser element 114 to output a laser beam, and the laser light detected by the second light detection unit 122. Based on the intensity, the third optical component 106 and the first optical component 102 are aligned. The bonding apparatus 310 fixes the third optical component 106 and the first optical component 102 by bonding or fixing after alignment. A specific method of alignment may be the same as the alignment of the first optical component 102 and the second optical component 104.

  As described above with reference to FIG. 10, the optical module 100 according to the first embodiment and the optical module 101 according to the second embodiment are configured by the optical module manufacturing system including the optical component manufacturing apparatus 200 and the optical component assembling apparatus 300. Can be manufactured.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above embodiment. It is apparent from the description of the scope of claims that embodiments with such changes or improvements can be included in the technical scope of the present invention.

  The execution order of each process such as operation, procedure, step, and stage in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the specification, and the drawings, even if it is described using “first”, “next”, etc. for the sake of convenience, it means that it is essential to carry out in this order. It is not a thing.

DESCRIPTION OF SYMBOLS 100,101 Optical module 102 1st optical component 104 2nd optical component 106 3rd optical component 110 1st actuator 112 2nd actuator 114 Semiconductor laser element 120 1st light detection part 122 2nd light detection part 123, 125 Optical waveguide 126 Directional coupler 127, 128, 129 Optical switch unit 130 Optical modulator 132 Optical multiplexer 134 Variable wavelength optical filter 150 First substrate 152 Second substrate 154 Third substrate 155 Base 156 Temperature control element 158 Submount 160, 162 Adhesion Agent 164 Elastic beam 166 Bipolar plate 170 Low reflection end 172 High reflection end 200 Optical component manufacturing device 300 Optical component assembly device 310 Adhesive device 312 Adhesive injection unit 314 Light irradiation unit 320 Controller 322 Coarse adjustment unit 402 x-direction actuator 404 y-direction actuator 406 z-direction actuator

Claims (21)

A first optical component;
A second optical component fixed to the first optical component and optically coupled to the first optical component;
Before the second optical component is fixed to the first optical component, the second optical component is moved with respect to the first optical component, and the first optical component and the second optical component are adjusted. A first actuator for the core;
An optical module comprising:   2. The optical module according to claim 1, wherein the first actuator is driven in alignment at the time of manufacturing the optical module and is not driven after manufacturing.   3. The optical module according to claim 1, wherein the second optical component includes a first light detection unit that detects light incident from the first optical component.   The optical module according to claim 3, wherein the first optical component and the second optical component are fixed by a light-transmitting adhesive. The first optical component is mounted on a first substrate;
The second optical component is mounted on a second substrate;
The optical module according to claim 3 or 4, wherein the first substrate and the second substrate are fixed to each other by adhesion or welding. The first optical component includes a semiconductor laser element,
The optical module according to claim 5, wherein the second optical component includes an optical waveguide for propagating light output from the semiconductor laser element. The first optical component is a laser array provided with a plurality of semiconductor laser elements,
The second optical component includes: a plurality of optical waveguides that receive light output from the plurality of semiconductor laser elements; and an optical switch unit that outputs light from a selected optical waveguide among the plurality of optical waveguides. Have
The optical module according to claim 5, wherein the first light detection unit detects light output through the optical switch unit. A base on which the first substrate and the second substrate are mounted;
The optical module according to claim 7, wherein the first actuator is provided between the second substrate and the base, and adjusts a height of the second optical component with respect to the base. A third optical component fixed to the first optical component and optically coupled to the first optical component;
Alignment of the first optical component and the third optical component, wherein the third optical component is moved relative to the first optical component before the third optical component is fixed to the first optical component. A second actuator for
The optical module according to any one of claims 1 to 6, further comprising: The first optical component includes a laser array provided with a plurality of semiconductor laser elements, and an optical multiplexer that multiplexes light leaking from high reflection ends of the plurality of semiconductor laser elements,
The second optical component includes: a plurality of optical waveguides that receive light output from low reflection ends of the plurality of semiconductor laser elements; and light that outputs light from a selected one of the plurality of optical waveguides. A switch part,
The third optical component includes a variable wavelength optical filter that transmits a predetermined wavelength component from the light combined by the optical multiplexer, and a second light detection unit that detects light transmitted through the variable wavelength optical filter; The optical module according to claim 9. A manufacturing method for manufacturing an optical module including a first optical component and a second optical component,
A first optical component forming step of forming the first optical component;
Forming a first actuator for aligning the second optical component with the first optical component;
A second optical component forming step of forming the second optical component;
A first alignment step of driving the first actuator to move the second optical component to align the first optical component and the second optical component;
A first fixing step of fixing and optically coupling the first optical component and the second optical component in a state where the first optical component and the second optical component are aligned;
A manufacturing method comprising: The second optical component forming step includes an optical waveguide that guides light incident from the first optical component, and a first light detection unit that detects light incident from the first optical component via the optical waveguide; Forming the second optical component having
In the first alignment step, the first optical component is driven by driving the first actuator based on a result of detection of light from the first optical component to the second optical component by the first optical detection unit. The manufacturing method according to claim 11, wherein the position of the second optical component with respect to is adjusted. Prior to the first alignment step, further comprising the step of injecting a photocurable adhesive between the first optical component and the second optical component;
The said 1st fixing step irradiates light to the photocurable adhesive inject | poured between the said 1st optical component and the said 2nd optical component, and hardens the said photocurable adhesive. Production method. Prior to the first alignment step, the method further includes a coarse adjustment step of roughly adjusting a relative position by moving one of the first optical component and the second optical component relative to the other,
The manufacturing method according to claim 12 or 13, wherein, in the first alignment step, the relative position between the first optical component and the second optical component is finely adjusted by driving the first actuator after the coarse adjustment step. . The first optical component is a laser array provided with a plurality of semiconductor laser elements,
The second optical component includes: a plurality of optical waveguides that receive light output from the plurality of semiconductor laser elements; and an optical switch unit that outputs light from a selected optical waveguide among the plurality of optical waveguides. Have
The first alignment step includes
Outputting light from at least one of the plurality of semiconductor laser elements;
Controlling the optical switch unit to output light output from the semiconductor laser element from the optical switch unit;
The light output from the optical switch unit is detected by the first light detection unit,
The manufacturing method according to any one of claims 12 to 14, wherein the second optical component is moved in a direction in which the first actuator is driven to increase the intensity of light detected by the first light detection unit. The first alignment step includes
Among the plurality of semiconductor laser elements arranged in parallel in the laser array, the light is sequentially output from at least the semiconductor laser elements at both ends,
The position of the second optical component relative to the first optical component is adjusted by driving the first actuator based on a result of detection of light from the semiconductor laser elements at least at both ends by the first light detection unit. Item 16. The production method according to Item 15. The first actuator forming step forms a plurality of the actuators under a substrate on which the second optical component is mounted,
17. The first alignment step adjusts the driving amount of each of the plurality of actuators to adjust the position of the second optical component relative to the first optical component. 17. Manufacturing method. A second actuator forming step of forming a second actuator for aligning a third optical component with the first optical component;
A third optical component forming step of forming the third optical component;
A second alignment step of driving the second actuator to move the third optical component to align the first optical component and the third optical component;
A second fixing step of fixing and optically coupling the first optical component and the third optical component in a state where the first optical component and the third optical component are aligned;
The manufacturing method according to any one of claims 12 to 17, further comprising: A manufacturing system for manufacturing an optical module including a first optical component and a second optical component,
An optical component manufacturing apparatus for manufacturing the first optical component, the second optical component, and a first actuator for aligning the second optical component with respect to the first optical component;
A controller for driving the first actuator to move the second optical component and aligning the first optical component and the second optical component;
An adhesive device for fixing and optically coupling the first optical component and the second optical component in a state where the first optical component and the second optical component are aligned;
A manufacturing system comprising: The optical component manufacturing apparatus manufactures the second optical component having a first light detection unit that detects light incident from the first optical component,
The control device adjusts the first optical component and the second optical component based on a result of detection by the first light detection unit of light incident on the second optical component from the first optical component. The manufacturing system according to claim 19. The bonding apparatus includes:
An adhesive injection part for injecting a photocurable adhesive between the first optical component and the second optical component;
A light irradiator for fixing the first optical component and the second optical component by irradiating the photocurable adhesive with light in a state where the first optical component and the second optical component are aligned. When,
The manufacturing system according to claim 19 or 20, comprising:

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