JP2013044486A - Control method for adsorption type heat pump, information processing system, and control device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a control method for adsorption type heat pump, an information processing system, and a control device that can place an adsorption type heat pump in efficient operation even if a heat source which supplies heat to be used to recycle an adsorbent has large change in temperature.SOLUTION: Heat media discharged from a plurality of electronic apparatuses 41a, 41b, and 41c are put together and supplied to the adsorption type heat pump 10. A control part 30 virtualizes the plurality of electronic apparatuses 41a, 41b, and 41c and determines the electronic apparatuses 41a, 41b to be put in operation and the electronic apparatus 41c to be stopped. Further, the control part 30 individually adjusts flow rates of heat media supplied to the plurality of electronic apparatuses 41a, 41b, and 41c so that the heat media discharged from the plurality of electronic apparatuses 41a, 41b, and 41c may have the same temperature.

Description

  The present invention relates to an adsorption heat pump control method, an information processing system, and a control device.

  In recent years, with the advent of an advanced information society, a large amount of data has been handled by computers, and in many facilities such as data centers, many computers are installed in the same room and collectively managed. For example, in a data center, a large number of racks (server racks) are installed in a computer room, and a plurality of computers (servers) are stored in each rack. And according to the operating state of those computers, jobs are organically distributed to the computers, and a large number of jobs are processed efficiently.

  A large amount of heat is generated from the computer as the computer operates. If the temperature inside the computer rises, it may cause malfunction or failure, so it is important to cool the computer. For this reason, in a normal data center, heat generated by a computer is discharged out of the rack by a fan (blower), and the indoor temperature is adjusted by using an air conditioner (air conditioner).

  By the way, it is said that about 40% of the total power consumption of the data center is consumed by the air conditioning equipment. Therefore, for example, it has been proposed to recover and reuse heat discharged from a computer by an adsorption heat pump (AHP).

Japanese Patent Laid-Open No. 01-269113 JP 07-94881 A JP 2006-29605 A

  It is an object of the present invention to provide an adsorption heat pump control method, an information processing system, and a control device that can efficiently operate an adsorption heat pump even when the temperature of a heat source that supplies heat used for adsorbent regeneration is large.

  According to an aspect of the disclosed technology, there is provided a method for controlling an adsorption heat pump that combines heat mediums discharged from a plurality of electronic devices and supplies the heat medium to an adsorption heat pump. The step of determining the electronic device to be virtualized and operating and the electronic device to be stopped, and the control unit, so that the temperature of the heat medium discharged from the plurality of electronic devices is the same There is provided a method for controlling an adsorption heat pump, comprising individually adjusting a flow rate of the heat medium supplied to a plurality of electronic devices.

  According to another aspect of the disclosed technology, a transfer pump that transfers a heat medium, a branch portion that branches a flow path of the heat medium transferred from the transfer pump, and a flow path branched by the branch portion , A plurality of electronic devices each having a heat medium flow path through which the heat medium flows, and a heat medium merged at the merge part An adsorption heat pump supplied to the plurality of electronic devices, a flow rate adjusting unit capable of individually adjusting a flow rate of the heat medium supplied to the plurality of electronic devices, and a temperature of the heat medium discharged from the plurality of electronic devices individually A temperature sensor to be detected, an electronic device that virtualizes the plurality of electronic devices and an electronic device that is in an operating state, and an electronic device that is in a stopped state, and distributes processing to the electronic devices that are in the operating state, and the temperature Input signal from sensor The information processing system having a control unit for the temperature of the heat medium discharged from the plurality of electronic devices to control the flow rate adjuster so that the same are provided.

  According to still another aspect of the disclosed technology, a transfer pump that transfers a heat medium, a branch portion that branches a flow path of the heat medium transferred from the transfer pump, and a flow branched by the branch portion. A plurality of electronic devices each having a heat medium flow path through which the heat medium flows, and a heat merged at the merge part An adsorption heat pump to which a medium is supplied, a flow rate adjusting unit capable of individually adjusting a flow rate of the heat medium supplied to the plurality of electronic devices, and a temperature of the heat medium discharged from the plurality of electronic devices. A control device for an information processing system having individually detected temperature sensors, wherein an electronic device that virtualizes the plurality of electronic devices to be in an operating state and an electronic device that is to be stopped are determined, and the operating state is determined Distribute processing to electronic devices Together with the temperature sensor receives the signal from the plurality of control apparatus the temperature of the heat medium discharged to control the flow rate adjusting unit so as to be the same from the electronic apparatus is provided.

  According to the above aspect, even if the temperature change of the heat source that supplies heat used for regeneration of the adsorbent is large, the adsorption heat pump can be operated efficiently.

FIG. 1 is a schematic diagram illustrating an example of an adsorption heat pump. FIG. 2 is a schematic diagram for explaining a control method of the adsorption heat pump according to the embodiment. FIG. 3 is a diagram illustrating the result of examining the relationship between the temperature difference ΔT of the heat medium between the inlet side and the outlet side of the electronic device and the junction temperature Tj. FIG. 4 is a flowchart for explaining optimization and processing distribution by the control unit. FIG. 5 is a flowchart illustrating a process for adjusting the flow rate of the cooling water passing through the electronic device according to the temperature of the heat medium discharged from the electronic device. FIG. 6 is a flowchart illustrating a process of switching between the adsorption process and the regeneration process in accordance with the temperature of the heat medium (hot water) supplied to the adsorber. FIG. 7 is a diagram showing a change over time in the temperature of the heat medium on the inlet side and the outlet side of the adsorber. FIG. 8 is a diagram illustrating an outline of a control method of the adsorption heat pump according to the embodiment. FIG. 9 is a diagram illustrating a problem when the flow rate of the heat medium flowing into the electronic device is the same. FIG. 10 is a diagram for explaining a problem when the adsorption process and the regeneration process are switched when the junction temperature of the CPU reaches the upper limit value. FIG. 11 is a diagram for explaining the outline of the apparatus used in the experiment.

  Hereinafter, before describing the embodiment, a preliminary matter for facilitating understanding of the embodiment will be described.

  FIG. 1 is a schematic diagram illustrating an example of an adsorption heat pump.

  As shown in FIG. 1, the adsorption heat pump 10 includes an evaporator 11, a condenser 12 disposed above the evaporator 11, and an adsorber 13 a disposed in parallel between the evaporator 11 and the condenser 12. , 13b. The space in the adsorption heat pump 10 is decompressed to about 1/100 atm, for example.

  The evaporator 11 is provided with a cooling water coil pipe 11a through which the cooling water passes and a spray nozzle (not shown) for spraying a liquid refrigerant (for example, water) toward the cooling water coil pipe 11a.

  A heat transfer pipe 14 and an adsorbent (desiccant) 15 are provided in the adsorbers 13a and 13b, respectively. An on-off valve 16 a is disposed between the adsorber 13 a and the evaporator 11, and an on-off valve 16 b is disposed between the adsorber 13 b and the evaporator 11. For the adsorbent 15, for example, activated carbon, silica gel or zeolite is used.

  The condenser 12 is provided with a cooling water coil pipe 12a through which the cooling water passes. An on-off valve 17a is disposed between the condenser 12 and the adsorber 13a, and an on-off valve 17b is disposed between the condenser 12 and the adsorber 13b.

  Hereinafter, the operation of the adsorption heat pump 10 will be described.

  Here, in the initial state, it is assumed that both the on-off valve 16a between the evaporator 11 and the adsorber 13a and the on-off valve 17b between the adsorber 13b and the condenser 12 are open. Further, it is assumed that the on-off valve 16b between the evaporator 11 and the adsorber 13b and the on-off valve 17a between the adsorber 13a and the condenser 12 are both closed.

  Furthermore, cooling water is supplied to the heat transfer pipe 14 of one adsorber 13a, and hot water heated by heat discharged from the electronic device is supplied to the heat transfer pipe 14 of the other adsorber 13b. To do. Furthermore, water is used as the refrigerant sprayed into the evaporator 11.

  When water (liquid refrigerant) is sprayed onto the cooling water coil pipe 11a of the evaporator 11, the inside of the evaporator 11 is depressurized, so that water easily evaporates around the cooling water coil pipe 11a, and the cooling water coil. The latent heat is taken from the pipe 11a. Thereby, the temperature of the water which passes the inside of the cooling water coil piping 11a falls, and low temperature cooling water is discharged | emitted from the cooling water coil piping 11a. This cooling water is used, for example, for cooling an indoor air conditioner, an electronic device or a power source.

  Water vapor (gaseous refrigerant) generated in the evaporator 11 enters the adsorber 13a through the open on-off valve 16a. And it cools with the cooling water which passes the inside of the heat-transfer piping 14, returns to a liquid, and is adsorbed by the adsorbent 15 of the adsorber 13a.

  While the adsorption process for adsorbing the refrigerant (water vapor) to the adsorbent 15 is performed in one adsorber 13a, the regeneration process for regenerating (drying) the adsorbent 15 is performed in the other adsorber 13b. That is, in the adsorber 13 b, the refrigerant (water) adsorbed by the adsorbent 15 is heated by hot water passing through the heat transfer pipe 14 to become gas (water vapor) and is detached from the adsorbent 15. The refrigerant separated from the adsorbent 15 enters the condenser 12 through the open / close valve 17b.

  Cooling water is supplied to the cooling water coil pipe 12 a in the condenser 12. As this cooling water, cooling water discharged from the adsorber 13a may be used. The water vapor (gaseous refrigerant) that has entered the condenser 12 from the adsorber 13b is condensed around the cooling water coil pipe 12a to become a liquid. This liquid is transferred to the evaporator 11 by a pump (not shown) and sprayed toward the cooling water coil pipe 11a.

  The adsorbers 13a and 13b perform an adsorption process and a regeneration process at regular intervals. That is, the on-off valves 16a, 16b, 17a, and 17b repeat opening and closing at regular intervals, and cooling water and hot water are alternately supplied to the heat transfer pipes 14 of the adsorbers 13a and 13b at regular intervals. In this way, the adsorption heat pump 10 operates continuously.

  By the way, when supplying the cooling water after cooling electronic equipment, such as a computer, to the adsorbers 13a and 13b as hot water, the temperature of the hot water varies greatly depending on the operating state of the electronic equipment. For this reason, as described above, in the method of simply switching between the adsorption process and the regeneration process at regular time intervals, the adsorbent 15 is shifted to the adsorption process before it can be sufficiently regenerated, or conversely, the regeneration of the adsorbent 15 is completed. However, it may not be possible to move to the adsorption process. As a result, the operating efficiency of the adsorption heat pump 10 decreases.

  In the following embodiment, a control method of an adsorption heat pump that can operate efficiently even when the temperature change of a heat source that supplies hot water (heat medium) is large will be described.

(Embodiment)
FIG. 2 is a schematic diagram for explaining a control method of the adsorption heat pump according to the embodiment. This embodiment will also be described with reference to FIG.

  As shown in FIG. 1, the adsorption heat pump 10 includes an evaporator 11, a condenser 12, and adsorbers 13a and 13b. A cooling water coil pipe 11 a is disposed in the evaporator 11, and a cooling water coil pipe 12 a is disposed in the condenser 12. Further, a heat transfer pipe 14 and an adsorbent 15 are arranged in the adsorbers 13a and 13b, respectively.

  As shown in FIG. 2, the cooling water coil pipe 11 a of the evaporator 11 of the adsorption heat pump 10 is connected to the evaporator cooling water flow path 21. The evaporator cooling water flow path 21 is provided with a cooling water storage tank 31 in which cooling water is stored, and a pump 32 that circulates the cooling water between the cooling water storage tank 31 and the evaporator 11. The cooling water stored in the cooling water storage tank 31 is used, for example, for cooling an indoor air conditioner, an electronic device, a power source, or the like.

  The cooling water coil pipe 12 a of the condenser 12 is connected to the condenser cooling water flow path 22. The condenser cooling water flow path 22 is provided with a chiller unit 33 that circulates the cooling water with the condenser 12 while maintaining the temperature of the cooling water at a predetermined temperature.

  The adsorber cooling water flow path 34 is a flow path for supplying cooling water to the adsorbers 13a and 13b. The adsorber cooling water flow path 34 is provided with a chiller unit 35 that transfers the cooling water while keeping the temperature of the cooling water constant.

  The adsorber cooling water channel 34 is provided with switching valves 36a and 36b. These switching valves 36a and 36b operate in response to a signal from the control unit 30 and switch the flow path so that the cooling water returns to the chiller unit 35 through one of the adsorbers 13a and 13b.

  The electronic device cooling water channel 37 is a channel that cools the electronic devices 41a, 41b, and 41c, and supplies cooling water (hot water) whose temperature is increased thereby to the adsorbers 13a and 13b. The electronic device cooling water flow path 37 is provided with a pump 38 and switching valves 39a and 39b.

  Hereinafter, for convenience of explanation, the cooling water passing through the electronic device cooling water flow path 37 is also referred to as a heat medium. A liquid other than water may be used as the heat medium.

  The heat medium discharged from the pump 38 is branched by the branching portion 40a, passes through a plurality (three in FIG. 2) of electronic devices 41a, 41b, and 41c, and cools the electronic devices 41a, 41b, and 41c. Then, the heat medium (hot water) whose temperature has increased by cooling the electronic devices 41a, 41b, and 41c is discharged from the electronic devices 41a, 41b, and 41c, and merges at the junction 40b.

  In the present embodiment, it is assumed that all of the electronic devices 41a, 41b, and 41c are computers (information processing devices). In the present embodiment, one or a plurality of CPUs (Central Processing Units) are mounted on each of the electronic devices 41a, 41b, and 41c, and each of these CPUs is mounted with a cold plate, and the inside of the cold plate is heated. It is assumed that the medium passes. The CPU is an example of a semiconductor component, and other semiconductor components or other electronic components may be cooled with a heat medium.

  The switching valves 39a and 39b operate in response to a signal from the control unit 30 and switch the flow path so that the heat medium joined at the joining unit 40b passes through one of the adsorbers 13a and 13b and returns to the pump 38.

  The switching valves 36a and 36b of the adsorber cooling water flow path 34 and the switching valves 39a and 39b of the electronic device cooling water flow path 37 are driven exclusively. That is, when the adsorber 13a is connected to the adsorber cooling water channel 34, the adsorber 13b is connected to the electronic device cooling water channel 37, and when the adsorber 13b is connected to the electronic device cooling water channel 37, the adsorber. 13 b is connected to the adsorber cooling water flow path 34.

  The control unit 30 also switches the on-off valves 16a, 16b, 17a, and 17b in the adsorption heat pump 10 simultaneously with switching of the switching valves 36a, 36b, 39a, and 39b.

  In the present embodiment, the cooling water passing through the condenser 12 is cooled by the chiller unit 33, but the cooling water discharged from the adsorber (adsorber 13 a or 13 b) that is performing the adsorption process is the condenser 12. You may make it return to the chiller unit 35 through.

  Temperature sensors 42a, 42b, 42c, flow control valves (proportional control valves) 43a, 43b, 43c, and flow meters 44a, 44b, 44c are provided on the heat medium inlet side of the electronic devices 41a, 41b, 41c, respectively. It has been. In place of the flow rate adjusting valves 43a, 43b, 43c, a pump capable of adjusting the flow rate may be arranged.

  The measured value of the temperature of the heat medium by the temperature sensors 42 a, 42 b and 42 c and the measured value of the flow rate of the heat medium by the flow meters 44 a, 44 b and 44 c are transmitted to the control unit 30. Further, the opening degree of the flow rate adjusting valves 43a, 43b, and 43c is changed by a signal from the control unit 30. A heat medium having a flow rate according to the opening degree of the flow rate adjusting valves 43a, 43b, and 43c flows through the electronic devices 41a, 41b, and 41c.

  Temperature sensors 45a, 45b, and 45c are disposed on the heat medium outlet side of the electronic devices 41a, 41b, and 41c, respectively. Temperature measurement values obtained by these temperature sensors 45 a, 45 b, 45 c are also transmitted to the control unit 30.

  The CPUs in the electronic devices 41a, 41b, and 41c have temperature sensors 46a, 46b, and 46c that detect junction temperatures, and the measured values of the junction temperatures by the temperature sensors 46a, 46b, and 46c are also included. It is transmitted to the control unit 30. Instead of the temperature sensors 46a, 46b, and 46c built in the CPU, a temperature sensor may be mounted on the surface of the CPU.

  Furthermore, in this embodiment, temperature sensors 47a and 47b for detecting the temperature of the heat medium supplied to the heat transfer pipe 14 are provided at the inlets of the heat transfer pipe 14 of the adsorbers 13a and 13b. Temperature values measured by these temperature sensors 47 a and 47 b are also transmitted to the control unit 30.

  Hereinafter, the upper limit value of the junction temperature and the target temperature will be described.

  A semiconductor device such as a CPU generates heat during operation and fails when the junction temperature exceeds the breakdown temperature. In the present embodiment, the semiconductor device is prevented from being damaged by adjusting the flow rate of the heat medium so that the junction temperature does not exceed the upper limit value with a temperature that is somewhat lower than the breakdown temperature as the upper limit value. Here, the upper limit value of the junction temperature is 75 ° C.

  On the other hand, the target temperature is a temperature at which the adsorption process and the regeneration process of the adsorbers 13a and 13b of the adsorption heat pump 10 are switched. That is, in this embodiment, when the temperature of the heat medium (hot water) supplied to the adsorption heat pump 10 reaches the target temperature, the adsorption process and the regeneration process of the adsorbers 13a and 13b are switched. The target temperature is set according to the type of the adsorbent 15. Here, the target temperature is 55 ° C.

  The database will be described below.

  For example, the relationship between the temperature difference ΔT of the heat medium between the inlet side and the outlet side of the electronic devices 41a, 41b, and 41c and the junction temperature Tj is examined by keeping the load factor of the CPU constant and changing the flow rate of the heat medium. . FIG. 3 is a diagram illustrating the result of examining the relationship between the temperature difference ΔT of the heat medium between the inlet side and the outlet side of the electronic device and the junction temperature Tj.

  FIG. 3 shows values when a server (RX300 R6 manufactured by Fujitsu Limited) equipped with two CPUs (CPU1 and CPU2) is used as an electronic device and the load factor of those CPU1 and CPU2 is 100%. ing. In the ΔT column in FIG. 3, CPU1 is the temperature difference between the heat medium on the inlet side and the outlet side of the CPU arranged on the upstream side in the heat medium flow direction, and CPU2 is arranged on the downstream side in the heat medium flow direction. The temperature difference between the heat medium on the inlet side and the outlet side of the CPU. The server is a temperature difference between the heat medium on the inlet side of the CPU 1 and the outlet side of the CPU 2.

  If the load factor of the CPU is 100% and the flow rate of the heat medium is 1.0 L (liter) / min, the junction temperature Tj of the CPU rises with time, but after a certain amount of time, the junction temperature Tj is almost constant. Become. In the example of FIG. 3, the junction temperature Tj of the CPU becomes substantially constant after about 1300 seconds from the start of the flow of the heat medium, and the temperature difference ΔT between the heat medium on the inlet side and the outlet side of the electronic device (server) at that time is 1 The junction temperature Tj was about 75 ° C. Moreover, the temperature of the heat medium discharged | emitted from an electronic device at this time was 55 degreeC.

  On the other hand, when the flow rate of the heat medium is 0.7 L / min, the junction temperature Tj of the CPU 2 exceeds the upper limit value (75 ° C.), which may damage the CPU. Further, when the flow rate of the heat medium is 1.3 L / min or more, the junction temperature Tj of the CPU 1 and CPU 2 does not reach the upper limit value, and the temperature of the hot water (heat medium) supplied to the adsorption heat pump 10 reaches the target temperature. No, it takes a long time to reach.

  In the present embodiment, the temperature difference ΔT, the junction temperature Tj, the time until the junction temperature Tj reaches the upper limit value, and the temperature of the heat medium discharged from the electronic device are previously determined for each CPU load factor and heat medium flow rate. It is checked and stored in the control unit 30 as a database.

  Hereinafter, a control method of the adsorption heat pump according to the present embodiment will be described.

  FIG. 4 is a flowchart for explaining optimization and processing distribution by the control unit 30.

  First, in step S11, the control unit 30 virtualizes a plurality of electronic devices (in this example, electronic devices 41a, 41b, and 41c) connected to the adsorption heat pump 10. By this virtualization, one or a plurality of virtual servers can be set regardless of the actual number of electronic devices (physical servers).

  Next, the process proceeds to step S12, where the control unit 30 controls the flow rate adjusting valves 43a, 43b, and 43c while monitoring the outputs of the flow meters 44a, 44b, and 44c, and the heat medium flowing through the electronic devices 41a, 41b, and 41c. At a constant flow rate (for example, 1 L / min). And the control part 30 acquires the temperature of the heat medium of the inlet side of each electronic device 41a, 41b, 41c and the exit side from temperature sensor 42a, 42b, 42c and temperature sensor 45a, 45b, 45c.

  Next, the process proceeds to step S13, and the control unit 30 determines each electronic device 41a, 41b from the difference ΔT between the temperature of the heat medium on the inlet side and the temperature of the heat medium on the outlet side of each electronic device 41a, 41b, 41c. , 41c is estimated. The database described above is used for estimating the operating rate. For example, if ΔT is 1.9 ° C. when the flow rate of the heat medium is 1.0 L / min, the operating rate of the electronic device is 100%. If ΔT is lower than 1.9 ° C. when the flow rate of the heat medium is 1.0 L / min, it can be said that the smaller the value of ΔT, the lower the operating rate of the electronic device. Even when the flow rate of the heat medium is other than 1.0 L / min, the operation rate can be estimated with reference to the database.

  Thus, after estimating the operation rate of each electronic device 41a, 41b, 41c, it transfers to step S14 and the control part 30 performs optimization. Here, the optimization refers to reducing power consumption by integrating processing of a plurality of electronic devices having a low operation rate into a smaller number of electronic devices. For example, when the operating rate of the electronic device 41c is low, the control unit 30 determines whether or not the processing executed by the electronic device 41c can be executed by the electronic devices 41a and 41b. And when it determines with it being executable, the control part 30 determines the stop of the electronic device 41c.

  Next, the control part 30 transfers to step S15, and distributes a process according to optimization. Here, it is assumed that the electronic device 41c is stopped and the processing is distributed to the electronic devices 41a and 41b in the operating state.

  When the processing is distributed, if the electronic devices 41a, 41b, and 41c are the same model, the processing may be distributed so that the load is uniform. However, if the models are different, the number of CPUs installed, the performance, It is preferable to disperse the treatment according to the calorific value. In this case, for example, it is preferable that power consumption and heat generation for each load factor of each electronic device and power consumption of other devices (such as a pump) are added in advance to the database. The control unit 30 may refer to the database to determine an electronic device to be stopped so that the power consumption is minimized, or to determine a process to be shared by each operating electronic device.

  After virtualizing the electronic devices and distributing the processes in this way, the processes illustrated in FIGS. 5 and 6 are executed simultaneously.

  FIG. 5 is a flowchart illustrating a process for adjusting the flow rate of the cooling water passing through each electronic device 41a, 41b, 41c in accordance with the temperature of the heat medium discharged from each electronic device 41a, 41b, 41c.

  In the initial state, the adsorber 13a is connected to the electronic device cooling water flow path 37 via the switching valves 39a and 39b, and the adsorber 13b is connected to the adsorber cooling water flow path 34 via the switching valves 36a and 36b. And

  First, in step S21, the control unit 30 acquires the temperature of the heat medium discharged from the electronic devices 41a, 41b, and 41c, that is, the temperature measurement value by the temperature sensors 45a, 45b, and 45c.

  Thereafter, the process proceeds to step S22, and the control unit 30 determines whether or not the temperature of the heat medium discharged from each electronic device 41a, 41b, 41c is the same. When the temperature of the heat medium discharged from each electronic device 41a, 41b, 41c is not the same, the process returns to step S21 and the process is continued.

  On the other hand, when the control unit 30 determines in step S22 that the temperature of the heat medium discharged from each electronic device 41a, 41b, 41c is the same, the process proceeds to step S23. In step S23, the control unit 30 adjusts the opening degree of the flow rate adjusting valves 43a, 43b, and 43c so that the temperature of the heat medium discharged from each electronic device 41a, 41b, and 41c becomes the same.

  In this embodiment, when adjusting the opening degree of the flow rate adjusting valves 43a, 43b, and 43c, the control unit 30 sets the flow rate adjusting valve based on the heat medium flow rate in the electronic device having the highest temperature of the discharged heat medium. The opening degree of 43a, 43b, 43c is determined.

  For example, the temperature of the heat medium discharged from the electronic device 41a is higher than the temperature of the heat medium discharged from the other electronic devices 41b, 41c when the flow rate adjusting valves 43a, 43b, 43c have the same opening degree. And In this case, the control unit 30 opens the flow rate adjustment valves 43b and 43c so that the temperature of the heat medium discharged from the other electronic devices 41b and 41c is the same as the temperature of the heat medium discharged from the electronic device 41a. Adjust the degree.

  Thus, after adjusting the opening degree of each flow regulating valve 43a, 43b, 43c, it returns to Step S21 and control part 30 repeats the above-mentioned processing.

  FIG. 6 is a flowchart illustrating a process of switching between the adsorption process and the regeneration process according to the temperature of the heat medium (hot water) supplied to the adsorbers 13a and 13b.

  First, in step S31, the control unit 30 acquires the temperature of the heat medium supplied to the adsorber 13a performing the regeneration process from the temperature sensor 47a.

  Next, in step S32, the control unit 30 acquires the junction temperature of each CPU, that is, the temperature measurement value by the temperature sensors 46a, 46b, and 46c.

  Next, the process proceeds to step S33, and the control unit 30 predicts a time (hereinafter referred to as “target arrival time”) for the temperature of the heat medium supplied to the adsorber 13a to reach a preset target temperature. The aforementioned database is used for the prediction of the target arrival time.

  Next, the process proceeds to step S34, and the control unit 30 makes the temperature of the heat medium supplied to the adsorber 13a reach the target temperature at the target arrival time, and the junction temperatures of all the CPUs exceed the above-described upper limit value. The discharge amount (total flow rate of the heat medium) of the pump 38 is adjusted so as not to be present. The aforementioned database is also referred to for adjusting the discharge amount of the pump 38.

  Next, it transfers to step S35 and the control part 30 determines whether the temperature of the heat medium supplied to the adsorption device 13a reached target temperature. If the determination is negative, the process returns to step S31 to continue the process.

  On the other hand, when it determines with having reached target temperature in step S35, it transfers to step S36. In step S36, the control unit 30 drives the on-off valves 16a, 16b, 17a, 17b and the switching valves 36a, 36b, 39a, 39b to switch between the adsorption process and the regeneration process. Then, it returns to step S31 and repeats the above-mentioned process.

  By using the aforementioned database, the junction temperature and surface temperature of the CPU can be estimated from the flow rate and temperature of the heat medium. For this reason, it is also possible to switch between the adsorption process and the regeneration process by measuring the flow rate and temperature of the heat medium in each flow path without directly measuring the junction temperature and surface temperature of the CPU.

  FIG. 7 is a graph showing the change over time in the temperature of the heat medium on the inlet side (IN) and the outlet side (OUT) of the adsorbers 13a and 13b, with time on the horizontal axis and temperature on the vertical axis. .

  Since the low-temperature cooling water supplied from the chiller unit 35 remains in the heat transfer pipe 14 of the adsorber (adsorber 13a or 13b) at the moment of switching from the adsorption process to the regeneration process, the electronic devices 41a and 41b , 41c is supplied with a relatively low-temperature heat medium (cooling water).

  This heat medium is heated by the CPU (heat source) in the electronic devices 41a, 41b, 41c while circulating between the electronic devices 41a, 41b, 41c and the adsorption heat pump 10 (adsorber 13a or adsorber 13b). The temperature gradually rises. When the temperature of the heat medium reaches the target temperature (55 ° C. in this example), the regeneration process and the adsorption process are switched.

  FIG. 8 is a diagram showing an outline of the control method of the adsorption heat pump according to the present embodiment. Here, for convenience of explanation, four electronic devices 41a to 41d are arranged in the electronic device cooling flow path 37, and flow rate adjusting valves 43a to 43d are provided on the heat medium inlet side of these electronic devices 41a to 41d, respectively. It is assumed that it is arranged.

  In the present embodiment, the junction temperature Tj of the CPU is equal to or lower than the upper limit value (75 ° C. in this example), and the temperature of the heat medium (warm water) on the heat medium outlet side of the electronic devices 41a to 41d is the same. The opening degree of each flow regulating valve 43a to 41d and the flow rate of the pump 38 are adjusted.

  Here, it is assumed that the electronic devices 41a to 41d are the same model. Further, as a result of the virtualization and optimization, the electronic device 41d is stopped, and the processing is distributed almost evenly to the electronic devices 41a to 41c. As shown in FIG. 8, it is assumed that the power consumption of the electronic devices 41a to 41c is 75W, and the power consumption of the electronic device 41d is 0W. Further, it is assumed that the flow rate of the heat medium flowing through the electronic devices 41a to 41c is 0.5 L (liter) / min and the flow rate of the heat medium flowing through the electronic device 41d is 0 L / min.

  In the present embodiment, as illustrated in FIG. 8, when there is a stopped electronic device (in this example, the electronic device 41 d), the temperature of the heat medium is the same on the inlet side and the outlet side of the electronic device. Therefore, the opening degree of the flow rate adjusting valve gradually decreases and finally closes.

  As illustrated in FIG. 8, in this embodiment, virtualization and optimization are performed to place the electronic device 41d having a low operation rate in a stopped state, and the heat generation amounts of the electronic devices 41a, 41b, and 41c in the operating state are almost equal. Disperse the process so that it is uniform. And the flow volume of the heat medium which passes through each electronic device 41a, 41b, 41c is adjusted so that the temperature of the heat medium discharged | emitted from each electronic device 41a, 41b, 41c may become uniform. As a result, a decrease in the temperature of the heat medium supplied to the adsorption heat pump 10 can be suppressed. In this embodiment, since the discharge amount of the pump 38 is adjusted so that the junction temperature of each CPU does not exceed the upper limit value, it is possible to avoid a malfunction or failure of the CPU.

  FIG. 9 is a diagram illustrating a problem when the flow rate of the heat medium flowing into the electronic devices 41a to 41d is the same. Here, as in the case of FIG. 8, when the temperature of the heat medium supplied to the adsorption heat pump 10 reaches 55 ° C., the adsorption process and the regeneration process are switched. The power consumption of the electronic device 41a is 150W, the power consumption of the electronic device 41b is 100W, the power consumption of the electronic device 41c is 50W, and the power consumption of the electronic device 41d is 0W.

  As illustrated in FIG. 9, when the flow rate of the heat medium flowing into each of the electronic devices 41a to 41d is the same, the temperature of the heat medium discharged from each of the electronic devices 41a to 41d is the operating state of the electronic devices 41a to 41d. Dependent. In this case, if switching between the adsorption process and the regeneration process is not performed until the temperature of the heat medium supplied to the adsorption heat pump 10 reaches 55 ° C., an electronic apparatus having a high CPU load factor (electronic apparatus in the example of FIG. 9). In 41a), the junction temperature of the CPU may exceed the upper limit (75 ° C.).

  FIG. 10 is a diagram for explaining a problem when the adsorption process and the regeneration process are switched when the junction temperature of the CPU reaches the upper limit value. Here again, the power consumption of the electronic device 41a is 150W, the power consumption of the electronic device 41b is 100W, the power consumption of the electronic device 41c is 50W, and the power consumption of the electronic device 41d is 0W.

  In the example of FIG. 10, the flow rate of the heat medium flowing into each of the electronic devices 41a to 41d is the same (1.0 L / min), and at least one of the plurality of CPUs is the upper limit value of the junction temperature (75 ° C.). When reaching, the adsorption process and the regeneration process are switched. In this case, the adsorption process and the regeneration process may be switched before the temperature of the heat medium supplied to the adsorption heat pump 10 is sufficiently increased.

  For example, in the example of FIG. 10, when the junction temperature Tj of the CPU of the electronic device 41a reaches 75 ° C., the temperature of the heat medium supplied to the adsorption heat pump 10 is 53.9 ° C. At this temperature, the adsorbent in the adsorbers 13a and 13b may not be sufficiently regenerated (dried).

(Experimental example)
Hereinafter, the result of confirming the effect of the control method of the adsorption heat pump according to the embodiment by experiments will be described.

FIG. 11 is a diagram for explaining the outline of the apparatus used in the experiment. In FIG. 11, the same components as those in FIG. A chiller unit 51 is arranged in the evaporator cooling water flow path 21 instead of the cooling water storage tank 31 and the pump 32 illustrated in FIG. The set temperature T _L of the chiller unit 51 was 18 ° C., and the set temperature T _M of the chiller units 33 and 35 was 25 ° C.

  In the experiment, three servers (RX300 S6 manufactured by Fujitsu Limited) 53a, 53b, and 53c were used as electronic devices. Each server 53a, 53b, 53c is equipped with two CPUs 55 each equipped with a cold plate, and the heat medium is discharged out of the servers 53a, 53b, 53c through the cold plate in order. Temperature sensors 61 for measuring the temperature of the heat medium are disposed on the heat medium inlet side and the outlet side of the cold plate attached to the CPU 55, respectively. A temperature sensor 62 that measures the surface temperature of the CPU 55 is disposed between the CPU 55 and the cold plate.

  The size of the adsorption heat pump 10 used in the experiment is 450 mm × 200 mm × 500 mm, and the inside is reduced to about 1/100 atm.

  Inside the evaporator 11, the condenser 12, and the adsorbers 13a and 13b of the adsorption heat pump 10, a heat exchanger having a size of 120 mm × 240 mm × 30 mm was arranged. Fins are provided at a pitch of 1 mm in pipes (cooling water pipes or heat transfer pipes) in these heat exchangers. The heat exchangers of the adsorbers 13a and 13b are filled with activated carbon (manufactured by Kureha Corporation) having a particle diameter of 400 μm as an adsorbent. The adsorption heat pump 10 is filled with 400 g of water as a refrigerant.

  Using such an apparatus, the load factor of the CPU 55 of the server 53a is 100%, the load factor of the CPU 55 of the server 53b is 75%, and the load factor of the CPU 55 of the server 53c is 25%. The flow rate of the heat medium flowing through each server 53a, 53b, 53c is adjusted so that the temperature difference ΔT between the heat medium at the inlet side and the outlet side of each server 53a, 53b, 53c is 1.9 ° C. , 43b, 43c.

  Thereafter, the processing performed by the server 53c is transferred to the server 53b, and the operation of the server 53c is stopped. As a result, the loads on the servers 53a and 53b become the same, and the flow rate of the heat medium flowing through these servers 53a and 53b can be made the same. Further, the junction temperature of the CPU 55 did not exceed 75 ° C., and the cold heat could be continuously taken out from the adsorption heat pump 10.

  The following additional notes are disclosed with respect to the above embodiments.

(Additional remark 1) It is the control method of the adsorption-type heat pump which joins the heat medium discharged | emitted from several electronic devices, and supplies to an adsorption-type heat pump,
A step of determining, by the control unit, an electronic device that virtualizes the plurality of electronic devices to be in an operating state and an electronic device that is to be stopped;
Individually adjusting the flow rate of the heat medium supplied to the plurality of electronic devices so that the temperature of the heat medium discharged from the plurality of electronic devices becomes the same by the control unit. A control method for an adsorption heat pump.

  (Additional remark 2) The said control part grasps | ascertains the operation rate of these electronic devices separately from the difference of the heat medium temperature of each heat medium inlet side of each of these electronic devices, and an exit side, According to the result The control method of the adsorption heat pump according to appendix 1, wherein the electronic device to be operated and the electronic device to be stopped are determined.

  (Additional remark 3) The said control part distributes a process so that load may be uniform with respect to the several electronic device made into the said operation state, The adsorption type of Additional remark 1 or 2 characterized by the above-mentioned Heat pump control method.

(Appendix 4) The adsorption heat pump includes an evaporator that changes liquid refrigerant to gas, and a first adsorber and a second adsorber in which an adsorbent that adsorbs the gaseous refrigerant is disposed,
The control unit controls the switching valve every time the temperature of the heat medium supplied to the adsorption heat pump reaches a preset target temperature, so that the heat medium is transferred to the first adsorber and the second heat medium. The method for controlling an adsorption heat pump according to any one of appendices 1 to 3, wherein the adsorption is alternately passed through the adsorber.

  (Additional remark 5) The said control part is supplied to these electronic devices so that the junction temperature or surface temperature of the semiconductor components mounted in each of these electronic devices may not exceed the preset upper limit. The method for controlling an adsorption heat pump according to appendix 4, wherein the total flow rate of the heat medium is controlled.

  (Additional remark 6) When the temperature of the heat medium supplied to the adsorption heat pump reaches the target temperature, the control unit is configured so that the junction temperature or the surface temperature of the semiconductor component reaches the upper limit value. The method for controlling an adsorption heat pump according to appendix 5, wherein a total flow rate of the heat medium supplied to the plurality of electronic devices is controlled.

(Appendix 7) a transfer pump for transferring a heat medium;
A branching portion for branching the flow path of the heat medium transferred from the transfer pump;
A merging section where the flow paths branched by the branch section merge;
A plurality of electronic devices each having a heat medium flow path through which the heat medium flows and is arranged between the branch part and the junction part;
An adsorption heat pump to which the heat medium merged at the merge section is supplied;
A flow rate adjusting unit capable of individually adjusting the flow rate of the heat medium supplied to the plurality of electronic devices;
A temperature sensor for individually detecting the temperature of the heat medium discharged from the plurality of electronic devices;
Determining an electronic device that is in an operating state by virtualizing the plurality of electronic devices and an electronic device that is in a stopped state, distributes processing to the electronic devices that are in an operating state, and inputs a signal from the temperature sensor An information processing system comprising: a control unit that controls the flow rate adjusting unit so that the temperature of the heat medium discharged from the plurality of electronic devices is the same.

  (Additional remark 8) The said control part grasps | ascertains the operation rate of these electronic devices separately from the difference of the heat medium temperature of each heat medium inlet side of each of these electronic devices, and an exit side, and according to the result The information processing system according to appendix 7, wherein the electronic device to be in the operating state and the electronic device to be in the stopped state are determined.

  (Additional remark 9) The said control part distributes a process so that load may become uniform with respect to the several electronic device made into the said operation state, The information processing of Additional remark 7 or 8 characterized by the above-mentioned system.

(Appendix 10) a transfer pump for transferring a heat medium;
A branching portion for branching the flow path of the heat medium transferred from the transfer pump;
A merging section where the flow paths branched by the branch section merge;
A plurality of electronic devices each having a heat medium flow path through which the heat medium flows and is arranged between the branch part and the junction part;
An adsorption heat pump to which the heat medium merged at the merge section is supplied;
A flow rate adjusting unit capable of individually adjusting the flow rate of the heat medium supplied to the plurality of electronic devices;
A control device of an information processing system having a temperature sensor for individually detecting the temperature of the heat medium discharged from the plurality of electronic devices,
Determining an electronic device that is in an operating state by virtualizing the plurality of electronic devices and an electronic device that is in a stopped state, distributes processing to the electronic devices that are in an operating state, and inputs a signal from the temperature sensor, The control device that controls the flow rate adjusting unit so that the temperature of the heat medium discharged from the plurality of electronic devices is the same.

  DESCRIPTION OF SYMBOLS 10 ... Adsorption type heat pump, 11 ... Evaporator, 11a ... Cooling water coil piping, 12 ... Condenser, 12a ... Cooling water coil piping, 13a, 13b ... Adsorber, 14 ... Heat transfer piping, 15 ... Adsorbent, 16a, 16b, 17a, 17b ... open / close valve, 21 ... evaporator cooling water flow path, 22 ... condenser cooling water flow path, 30 ... control unit, 31 ... cooling water storage tank, 32 ... pump, 33 ... chiller unit, 34 ... adsorber Cooling water flow path, 35 ... chiller unit, 36a, 36b ... switching valve, 37 ... electronic equipment cooling water flow path, 38 ... pump, 39a, 39b ... switching valve, 40a ... branching part, 40b ... confluence part, 41a-41d ... electronic Equipment, 42a-42c ... Temperature sensor, 43a-43d ... Flow rate adjusting valve, 44a-44c ... Flow meter, 45a-45c, 46a-46c, 47a, 47b ... Temperature sensor, 51 Chiller unit.

Claims (5)

A control method for an adsorption heat pump that joins the heat medium discharged from a plurality of electronic devices and supplies the heat medium to the adsorption heat pump,
A step of determining, by the control unit, an electronic device that virtualizes the plurality of electronic devices to be in an operating state and an electronic device that is to be stopped;
Individually adjusting the flow rate of the heat medium supplied to the plurality of electronic devices so that the temperature of the heat medium discharged from the plurality of electronic devices becomes the same by the control unit. A control method for an adsorption heat pump.   The control unit individually grasps the operation rate of the plurality of electronic devices from the difference in heat medium temperature between the heat medium inlet side and the outlet side of each of the plurality of electronic devices, and enters the operation state according to the result. The method of controlling an adsorption heat pump according to claim 1, wherein an electronic device to be operated and an electronic device to be stopped are determined. The adsorption heat pump includes an evaporator that changes liquid refrigerant to gas, and a first adsorber and a second adsorber in which an adsorbent that adsorbs the gaseous refrigerant is disposed,
The control unit controls the switching valve every time the temperature of the heat medium supplied to the adsorption heat pump reaches a preset target temperature, so that the heat medium is transferred to the first adsorber and the second heat medium. The method of controlling an adsorption heat pump according to claim 1 or 2, wherein the adsorber is alternately passed. A transfer pump for transferring the heat medium;
A branching portion for branching the flow path of the heat medium transferred from the transfer pump;
A merging section where the flow paths branched by the branch section merge;
A plurality of electronic devices each having a heat medium flow path through which the heat medium flows and is arranged between the branch part and the junction part;
An adsorption heat pump to which the heat medium merged at the merge section is supplied;
A flow rate adjusting unit capable of individually adjusting the flow rate of the heat medium supplied to the plurality of electronic devices;
A temperature sensor for individually detecting the temperature of the heat medium discharged from the plurality of electronic devices;
Determining an electronic device that is in an operating state by virtualizing the plurality of electronic devices and an electronic device that is in a stopped state, distributes processing to the electronic devices that are in an operating state, and inputs a signal from the temperature sensor, An information processing system comprising: a control unit that controls the flow rate adjusting unit so that the temperature of the heat medium discharged from the plurality of electronic devices is the same. A transfer pump for transferring the heat medium;
A branching portion for branching the flow path of the heat medium transferred from the transfer pump;
A merging section where the flow paths branched by the branch section merge;
A plurality of electronic devices each having a heat medium flow path through which the heat medium flows and is arranged between the branch part and the junction part;
An adsorption heat pump to which the heat medium merged at the merge section is supplied;
A flow rate adjusting unit capable of individually adjusting the flow rate of the heat medium supplied to the plurality of electronic devices;
A control device of an information processing system having a temperature sensor for individually detecting the temperature of the heat medium discharged from the plurality of electronic devices,
Determining an electronic device that is in an operating state by virtualizing the plurality of electronic devices and an electronic device that is in a stopped state, distributes processing to the electronic devices that are in an operating state, and inputs a signal from the temperature sensor, The control device that controls the flow rate adjusting unit so that the temperature of the heat medium discharged from the plurality of electronic devices is the same.

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