JP2013038173A - Light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device which improves the mountability.SOLUTION: In a light emitting device 100, a first lead part 121 has a first terminal part 121b which is separated from a rear surface 10B and is exposed from a compact 11 so as to continue into a bottom surface 10C and a first side surface 10E1. A first connection part 121a is exposed from the compact 11 at the rear surface 10B of a package 10.

Description

  The present invention relates to a light emitting device including a light emitting element.

  Conventionally, a light emitting device including a light emitting element (for example, a light emitting diode or a laser diode) has been widely used as a light source for a backlight for a liquid crystal television, a lighting fixture, or an optical communication device.

  Generally, light emitting devices can be classified into a top view type and a side view type depending on the direction in which emitted light is extracted when mounted on a substrate. In the top view type light emitting device, emitted light is extracted in a direction perpendicular to the mounting surface of the substrate. In the side-view type light emitting device, emitted light is extracted in a direction parallel to the mounting surface of the substrate.

  Here, in a top view type light emitting device, a method is proposed in which the light emitting device is formed in a plate shape and laid on the substrate, and the four terminals exposed at the four corners on the substrate side are soldered to the substrate (Patent Document 1). reference).

JP 2010-62272 A

  On the other hand, in the side view type light emitting device, it is difficult to expose the terminal on the light emitting surface. Therefore, if the method of Patent Document 1 is applied to a side-view type light emitting device, the light emitting device is made to stand on the substrate, and the two terminals exposed at the two rear corners are soldered to the substrate. . However, the light-emitting device that is erected on the substrate is liable to tilt backward due to the surface tension of the solder, and thus has a problem of low mountability on the substrate.

  The present invention has been made in view of the above-described situation, and an object thereof is to provide a light emitting device capable of improving mountability.

  A light-emitting device according to the present invention includes a light-emitting element, a plate-like package including a molded body and leads embedded in the molded body. The lead is disposed apart from the back surface opposite to the light emitting surface of the package, and is connected to the bottom surface connected to the light emitting surface and the first side surface connected to the bottom surface to be exposed from the molded body, and the light emitting element. And a connection portion that is connected and exposed from the molded body on the back surface.

  ADVANTAGE OF THE INVENTION According to this invention, the light-emitting device which can improve mountability can be provided.

Front perspective view of the light emitting device according to the first embodiment. The rear perspective view of the light-emitting device concerning a 1st embodiment. The bottom perspective view of the light emitting device concerning a 1st embodiment. Front perspective view of a lead according to the first embodiment The rear perspective view of the lead concerning a 1st embodiment The top view of the light-emitting device concerning a 1st embodiment. The figure for demonstrating the manufacturing method of the light-emitting device which concerns on 1st Embodiment. The figure for demonstrating the manufacturing method of the light-emitting device which concerns on 1st Embodiment. The figure for demonstrating the manufacturing method of the light-emitting device which concerns on 1st Embodiment. Front perspective view of a lead according to a second embodiment The rear perspective view of the lead concerning a 2nd embodiment The top view of the light-emitting device concerning a 2nd embodiment. The figure for demonstrating the manufacturing method of the light-emitting device which concerns on 2nd Embodiment. The figure for demonstrating the manufacturing method of the light-emitting device which concerns on 2nd Embodiment.

  Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Accordingly, specific dimensions and the like should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

  In the following embodiments, a side view type light emitting device will be described as an example of a light emitting device. A side view type light emitting device is a type of light emitting device in which light emitted from a light emitting element is extracted in a direction parallel to a mounting surface of a mounting substrate.

  In the following embodiments, the direction from which light emitted from the light emitting element is extracted is referred to as “first direction”, and when the light emitting device is mounted on the mounting surface, the direction perpendicular to the mounting surface is referred to as “second direction”. A direction perpendicular to the first direction and the second direction is referred to as a “third direction”.

[First Embodiment]
(1) Configuration of Light-Emitting Device 100 A schematic configuration of the light-emitting device 100 according to the first embodiment will be described with reference to the drawings. FIG. 1 is a front perspective view of the light emitting device 100. FIG. 2 is a rear perspective view of the light emitting device 100. FIG. 3 is a bottom perspective view of the light emitting device 100.

  As illustrated in FIGS. 1 to 3, the light emitting device 100 includes a package 10, a light emitting element 20, and a sealing resin 30. The light emitting device 100 is formed in a plate shape, the depth in the first direction is about 1 mm, the height in the second direction is about 3 mm, and the width in the third direction is about 4 mm. However, the present invention is not limited to this. . The light emitting device 100 is a side view type light emitting device, and is fixed in a standing state on a mounting surface of a mounting substrate (not shown).

  The package 10 is formed in a plate shape and is disposed perpendicular to the third direction. The package 10 includes a molded body 11 and leads 12. The molded body 11 forms the outer shape of the package 10. The lead 12 is embedded in the molded body 11 and has a first lead portion 121 and a second lead portion 122. The detailed configuration of the lead 12 will be described later.

  The package 10 includes a light emitting surface 10A, a back surface 10B, a bottom surface 10C, an upper surface 10D, a first side surface 10E1, a second side surface 10E2, and a recess 10F. The light exit surface 10A is a surface from which the emitted light of the light emitting element 20 is extracted. A concave portion 10F for mounting the light emitting element 20 is formed on the light emitting surface 10A. The back surface 10B is provided opposite to the light emitting surface 10A. The bottom surface 10C is connected to the light emitting surface 10A and the back surface 10B. The bottom surface 10C faces the mounting surface when the light emitting device 100 is mounted on the mounting substrate. The upper surface 10D is provided opposite to the bottom surface 10C. The first side surface 10E1 is connected to the light emitting surface 10A, the back surface 10B, the bottom surface 10C, and the top surface 10D. The second side surface 10E2 is provided opposite to the first side surface 10E1.

  The light emitting element 20 is placed on the first lead portion 121 inside the recess 10F. The light emitting element 20 is connected to the first lead portion 121 via the first wire 21 and is connected to the second lead portion 122 via the second wire 22. The emitted light of the light emitting element 20 is extracted in the first direction from the light emitting surface 10A toward the outside of the package 10.

  As the light-emitting element 20, a light-emitting diode having a light-emitting layer of a semiconductor such as GaAlN, ZnS, SnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, or AlInGaN on a substrate is preferably used.

  The sealing resin 30 is filled in the recess 10 </ b> F and seals the light emitting element 20. As the sealing resin 30, a light-transmitting resin, for example, polyolefin resin, polycarbonate resin, polystyrene resin, epoxy resin, acrylic resin, acrylate resin, methacrylic resin (PMMA, etc.), urethane resin, polyimide resin, polynorbornene At least one resin selected from resins, fluororesins, silicone resins, modified silicone resins, modified epoxy resins and the like can be used. Further, such a material may contain, for example, a phosphor, a pigment, a filler, a diffusing material, or the like described in WO2006 / 038502 or JP2006-229055.

(2) Detailed Configuration of Lead 12 The detailed configuration of the lead 12 according to the first embodiment will be described with reference to the drawings. FIG. 4 is a front perspective view of the lead 12. FIG. 5 is a rear perspective view of the lead 12. 6A to 6D are a rear view, a bottom view, a first side view, and a second side view of the light emitting device 100. FIG. 4 and 5, the outer edge of the molded body 11 is indicated by a broken line.

As shown in FIGS. 4 and 5, the first lead portion 121 includes a first connection portion 121a and a first terminal portion 121b.
The first connection portion 121a is formed in a plate shape and is disposed perpendicular to the third direction. The 1st connection part 121a is exposed from the molded object 11 in the recessed part 10F of the package 10 (refer FIG. 1). Moreover, the 1st connection part 121a is exposed from the molded object 11 in the position away from the bottom face 10C in the back surface 10B of the package 10, as shown to Fig.6 (a). The first connection part 121 a is formed flush with the molded body 11 on the back surface 10 </ b> B of the package 10.

  The first terminal portion 121b is disposed below the first connection portion 121a (that is, on the bottom surface 10C side), and protrudes from the first connection portion 121a to the first side surface 10E1 side. The first terminal portion 121b is separated from the back surface 10B of the package 10. Therefore, the first terminal portion 121b is not exposed from the molded body 11 on the back surface 10B of the package 10, as shown in FIG. Further, as shown in FIGS. 6B and 6C, the first terminal portion 121b is exposed from the molded body 11 connected to the bottom surface 10C of the package 10 and the first side surface 10E1. The first terminal portion 121b is formed flush with the molded body 11 on the bottom surface 10C and the first side surface 10E1 of the package 10. In the present embodiment, in the first direction, the thickness of the first terminal portion 121b is smaller than the thickness of the first connection portion 121a.

In addition, in the back surface 10B, the exposed area of the first connection part 121a is larger than the exposed area of the first terminal part 121b.
As shown in FIGS. 4 and 5, the second lead portion 122 includes a second connection portion 122a and a second terminal portion 122b.

  The second connection part 122a is formed in a plate shape and is disposed perpendicular to the third direction. The 2nd connection part 122a is exposed from the molded object 11 in the recessed part 10F of the package 10 (refer FIG. 1). Moreover, the 2nd connection part 122a is exposed from the molded object 11 in the position away from the bottom face 10C in the back surface 10B of the package 10, as shown to Fig.6 (a). The second connection part 122 a is formed flush with the molded body 11 on the back surface 10 </ b> B of the package 10.

  The second terminal portion 122b is disposed below the second connection portion 122a (that is, on the bottom surface 10C side), and protrudes from the second connection portion 122a to the second side surface 10E2 side. The second terminal portion 122b is separated from the back surface 10B of the package 10. Therefore, the second terminal portion 122b is not exposed from the molded body 11 on the back surface 10B of the package 10, as shown in FIG. Further, as shown in FIGS. 6B and 6D, the second terminal portion 122b is exposed from the molded body 11 continuously to the bottom surface 10C and the second side surface 10E2 of the package 10. The second terminal portion 122b is formed flush with the molded body 11 on the bottom surface 10C and the second side surface 10E2 of the package 10. In the present embodiment, the thickness of the second terminal portion 122b is smaller than the thickness of the second connection portion 122a in the first direction.

In the back surface 10B, the exposed area of the second connection part 122a is larger than the exposed area of the second terminal part 122b.
Although not shown, when the light emitting device 100 is mounted on the mounting substrate, the portions exposed to the bottom surface 10C of the first and second terminal portions 121b and 122b are landed on the mounting surface via solder. Connected. Further, a portion of the first terminal portion 121b exposed to the first side surface 10E1 is connected to a land on the mounting surface via a solder fillet, and a portion of the second terminal portion 122b exposed to the second side surface 10E2 is It is connected to a land on the mounting surface through a solder fillet.

(3) Manufacturing Method of Light-Emitting Device 100 A manufacturing method of the light-emitting device 100 according to the first embodiment will be described with reference to the drawings. 7 to 9 are diagrams for explaining a method of manufacturing the light emitting device 100. FIG.

First, as shown in FIG. 7, a lead board 200 having a desired shape is formed by punching a copper plate (Ag plated) having a predetermined thickness (for example, about 0.5 mm).
Next, as shown in FIG. 8, a recess 200 </ b> A having a desired shape (a hatched area in FIG. 8) is formed in the lead substrate 200 by etching one surface of the lead substrate 200. The thickness of the recess 200A is, for example, about 0.3 mm. The recess 200 </ b> A includes regions that become the first and second terminal portions 121 b and 122 b of the light emitting device 100. In FIG. 8, a region used for one light emitting device 100 in the lead substrate 200 is surrounded by an alternate long and short dash line.

Next, as shown in FIG. 9A, the lead substrate 200 after the half etching is sandwiched between the upper mold 300 and the lower mold 350.
Next, as shown in FIG. 9B, the thermosetting resin 11 </ b> A constituting the molded body 11 is filled between the upper mold 300 and the lower mold 350 and then cooled and cured.

  Next, as shown in FIG. 9C, the upper mold 300 and the lower mold 350 are removed, and the light emitting element 20 is placed on the bottom surface of the recess formed by the upper mold 300. Sealing is performed with a sealing resin 30.

  Next, as shown in FIG. 9D, the lead substrate 200 and the thermosetting resin 11A are cut with a dicing saw along a predetermined direction. As a result, a plurality of light emitting devices 100 are collectively formed.

(4) Action and Effect In the light emitting device 100 according to the first embodiment, the lead 12 (first lead portion 121) is separated from the back surface 10B, and is connected to the bottom surface 10C and the first side surface 10E1 to form the molded body 11. The first terminal portion 121b is exposed from the surface.

  As described above, the first terminal portion 121b is exposed to the bottom surface 10C and the first side surface 10E1, but is not exposed to the back surface 10B. Therefore, when the first terminal portion 121b is soldered to the mounting surface, it is possible to prevent the surface tension of the solder from being applied to the back surface 10B, so that the light emitting device 100 can be prevented from tilting backward. In addition, when there is excess solder between the bottom surface 10C and the mounting surface, the amount of solder between the bottom surface 10C and the mounting surface can be made uniform by releasing the solder to the first side surface 10E1 side. As a result, the mountability of the light emitting device 100 on the substrate can be improved.

  Further, the above effect can be obtained similarly by the second terminal portion 122b of the second lead portion 122. In this case, since the light emitting device 100 can be supported from both sides by the surface tension of the solder applied to the first and second terminal portions 121b and 122b, the light emitting device 100 can be further prevented from tilting backward.

  Further, the first connecting portion 121a is exposed from the molded body 11 on the back surface 10B of the package 10. Therefore, the heat of the light emitting element 20 connected to the first connection part 121a can be efficiently released from the back surface 10B.

  In the back surface 10B, the exposed area of the first connecting portion 121a is larger than the exposed area of the first terminal portion 121b. Therefore, the heat of the light emitting element 20 can be efficiently released from the back surface 10B into the air. Such an effect becomes particularly prominent when a blower fan for cooling the light emitting device is provided in a unit such as a backlight unit. The same effect can be obtained also when the exposed area of the second connection part 122a is larger than the exposed area of the second terminal part 122b.

[Second Embodiment]
The configuration of the light emitting device 100 according to the second embodiment will be described with reference to the drawings. Since the difference from the first embodiment lies in the configuration of the lead 12, the difference related to the lead 12 will be mainly described below.

(1) Configuration of Lead 12 The configuration of the lead 12 according to the second embodiment will be described with reference to the drawings. FIG. 10 is a front perspective view of the lead 12. FIG. 11 is a rear perspective view of the lead 12. 12A to 12D are a rear view, a bottom view, a first side view, and a second side view of the light emitting device 100. FIG.

As shown in FIGS. 10 and 11, the first lead part 121 includes a first connection part 121a, a first terminal part 121b ′, and a base part 121c.
The configuration of the first connection part 121a is as described in the first embodiment.

  As shown in FIGS. 10 and 11, the first terminal portion 121b 'is located closer to the light emitting surface 10A than the first connecting portion 121a. In addition, as shown in FIGS. 12B and 12C, in the first direction, the thickness x of the first terminal portion 121b ′ is the same as the thickness of the first connection portion 121a (the thickness y of the base portion 121c). ). The thickness x of the first terminal portion 121b 'is preferably 40 to 90% of the depth of the package 10 in the first direction, and more preferably 50 to 80%. As will be described later, the first terminal portion 121b 'is formed by press working.

  The base portion 121c is disposed below the first connection portion 121a (that is, on the bottom surface 10C side) and is separated from the first terminal portion 121b. As shown in FIG. 12A and FIG. 12B, the base portion 121c is exposed from the molded body 11 in a manner connected to the back surface 10B and the bottom surface 10C of the package 10. The base portion 121 c is formed flush with the molded body 11 on the back surface 10 </ b> B of the package 10.

  Here, as shown in FIGS. 11, 12A, and 12B, the base portion 121c has a recess 121T that is formed continuously with the back surface 10B and the bottom surface 10C of the package 10. Although not shown, when mounting the light emitting device 100 on the mounting substrate, a solder fillet is formed inside the recess 121T, and the base portion 121c is connected to the land on the mounting surface by the solder fillet.

As shown in FIGS. 10 and 11, the second lead portion 122 includes a second connection portion 122a and a second terminal portion 122b ′.
The configuration of the second connection part 122a is as described in the first embodiment.

  As shown in FIGS. 10 and 11, the second terminal portion 122b 'is located closer to the light emitting surface than the second connection portion 122a. Also, as shown in FIGS. 12B and 12C, in the first direction, the thickness x of the second terminal portion 122b ′ is the same as the thickness of the second connection portion 122a (the thickness y of the base portion 121c). ). The thickness x of the second terminal portion 122b 'is preferably 40 to 90% of the depth of the package 10 in the first direction, and more preferably 50 to 80%. As will be described later, the second terminal portion 122b 'is formed by press working.

(2) Manufacturing Method of Light Emitting Device 100 A manufacturing method of the light emitting device 100 according to the second embodiment will be described with reference to the drawings. 13 and 14 are diagrams for explaining a method of manufacturing the light emitting device 100. FIG.
First, as shown in FIG. 13, a lead board 200 having a desired shape is formed by punching a copper plate (Ag plated) having a predetermined thickness (for example, about 0.5 mm).
Next, as shown in FIG. 14, a recess 200 </ b> B having a desired shape is formed in the lead substrate 200 by performing half etching from one side of the lead substrate 200. The recess 200B corresponds to the recess 121T of the base portion 121c described above.

Next, as shown in FIG. 14, a recess 200 </ b> C having a desired shape is formed in the lead substrate 200 by performing press working from one side of the lead substrate 200. The thickness of the recess 200 </ b> C is about 0.5 mm, which is the same as the thickness of the lead substrate 200. The recess 200C corresponds to the first and second terminal portions 121b ′ and 122b ′ described above.
Thereafter, as in the first embodiment, after sandwiching between upper and lower molds, the lead substrate 200 is molded with a thermosetting resin by a transfer molding method, and then cut with a dicing saw (see FIG. 9).

(3) Action and Effect In the light emitting device 100 according to the second embodiment, the first lead part 121 has a base part 121c disposed below the first connection part 121a.

Accordingly, since the center of gravity of the lead 12 can be moved downward as compared with the case where the base portion 121c does not exist, the stability of the light emitting device 100 can be improved.
In addition, the base portion 121c has a recess 121T that is formed continuously with the back surface 10B and the bottom surface 10C.

  Therefore, when the first and second terminal portions 121b ′ and 122b ′ are soldered to the mounting surface, the light emitting device 100 can be stably supported at three points by forming solder fillets also in the recesses 121T. it can. Accordingly, the mountability of the light emitting device 100 on the substrate can be further improved.

In the first direction perpendicular to the light exit surface 10B, the thickness x of the first terminal portion 121b ′ is equal to the thickness y of the first connection portion 121a.
Therefore, the surface tension of the solder applied to the first terminal portion 121b ′ can be increased as compared with the case where the thickness of the first terminal portion 121b ′ is smaller than the thickness of the first connection portion 121a. Therefore, since the light emitting device 100 can be pulled to the side with a greater force, the light emitting device 100 can be further prevented from tilting backward.

[Other Embodiments]
Although the present invention has been described according to the above-described embodiments, it should not be understood that the descriptions and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  (A) In the first embodiment, each of the first and second terminal portions 121b and 122b is separated from the back surface 10B of the package 10. However, the present invention is not limited to this. Any one of the first and second terminal portions 121b and 122b may be exposed from the molded body 11 on the back surface 10B of the package 10.

  (B) In the second embodiment, the base portion 121c has the recess 121T for accommodating the solder fillet, but is not limited thereto. The base part 121c may not have the recess 121T. Even in this case, the light emitting device 100 can be supported at three points by forming solder fillets in the region of the base portion 121c exposed to the back surface 10B.

  (C) In the second embodiment, the concave portion 200B corresponding to the base portion 121c is formed by performing half-etching on one surface of the lead substrate 200. However, the present invention is not limited to this. For example, the concave portion 200 </ b> B can also be formed by pressing one side of the lead substrate 200.

  (D) The base part 121c according to the second embodiment can be applied to the first lead part 121 according to the first embodiment and the second lead part 122 according to the first and second embodiments.

DESCRIPTION OF SYMBOLS 10 ... Package 11 ... Molded body 12 ... Lead 20 ... Light emitting element 30 ... Sealing resin 100 ... Light emitting device 121 ... 1st lead part 121a ... 1st connection part 121b, 121b '... 1st terminal part 121c ... Base part 122 ... 2nd lead part 122a ... 2nd connection part 122b, 122b '... 2nd terminal part 200 ... Lead board 200A, 200B ... Recessed part

Claims (5)

A light emitting element;
A plate-like package composed of a molded body and leads embedded in the molded body;
With
The lead is
A first terminal portion that is spaced apart from a back surface provided opposite to the light emitting surface of the package, and that is exposed from the molded body connected to a bottom surface connected to the light emitting surface and a first side surface connected to the bottom surface;
A connection portion connected to the light emitting element and exposed from the molded body on the back surface;
A light emitting device. The lead is disposed below the connection portion and has a base portion exposed from the molded body at the bottom surface.
The light emitting device according to claim 1. The base portion is exposed from the molded body connected to the bottom surface and the back surface.
The light emitting device according to claim 2. The lead is disposed apart from the back surface, and has a second terminal portion that is exposed from the molded body and is connected to a second side surface and the bottom surface provided opposite to the first side surface,
The base portion has a recess formed continuously with the bottom surface and the back surface.
The light emitting device according to claim 3. In the direction perpendicular to the light emitting surface, the thickness of the terminal portion is equal to or greater than the thickness of the connection portion.
The light emitting device according to claim 1.

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