JP2013030714A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device having high mounting stability without reducing productivity even if the size is compact.SOLUTION: The light-emitting device comprises: a package 10 constituted of a molded body 11 having a light emission surface 11b having a recess and an undersurface 11c lined with the light emission surface 11b, and a plate-shaped lead 12 having a front face 12a and a rear face 12b on the light emission surface 11b side; and a light emitting element 20. The plate-shaped lead 12 comprises: a bottom 12c, exposed from the molded body 11 in the recess, and having a placing surface 12aa which places the light emitting element 20; a wall 12d bent from the bottom 12c to the light emission surface 11b side; and a terminal part 12e, extending from the bottom 12c and protruded from the undersurface of the molded body 11. The terminal part 12e has an end part 12f bent to a side where the placing surface 12aa is disposed, making the rear face 12b of the plate-shaped lead 12 as a reference.

Description

  The present invention relates to a light emitting device.

Conventionally, in order to densely mount a plurality of side-mounted light emitting devices on a circuit board, the width of the light emitting portion is increased with respect to the width of the light emitting device by pulling out a terminal from directly below the light emitting portion (cavity) of the light emitting device There are light-emitting devices that are as wide as possible.
However, such a light emitting device is unstable to mount because the height of the package is high and the center of gravity is high.
In view of this, for example, a method has been proposed in which mounting stability is improved by providing a terminal bent forward and a terminal bent backward and balancing the surface tension of the solder before and after the light emitting device ( Patent Document 1).

JP 2003-77317 A

When the terminal is bent back and forth like the light emitting device described above, there is a problem that the bending process is complicated and productivity is lowered.
In addition, in order to bend the terminal back and forth, the thickness of the light emitting device corresponding to the depth arrangement of both terminals is required, and there is a problem that the light emitting device cannot be reduced in size.
The present invention has been made in view of the above problems, and an object of the present invention is to provide a light emitting device with high mounting stability even in a small light emitting device without reducing productivity.

The light emitting device of the present invention is
A molded body having a light emitting surface having a recess and a lower surface continuous with the light emitting surface, a part of which is embedded in the molded body, and has a surface on the light emitting surface side and a back surface opposite to the surface. With a package made up of leads and
The plate-like lead is
A bottom portion that is exposed from the molded body in the recess and has a mounting surface on which the light emitting element is mounted;
A wall bent from the bottom to the light exit surface side;
A terminal portion extending from the bottom and protruding from the lower surface of the molded body,
The terminal portion has an end portion bent toward the placement surface side with respect to the back surface of the plate-like lead.

Such a light-emitting device preferably includes one or more of the following.
Terminal portions are arranged on the same plane from the bottom of the plate-like lead, the wall portion protrudes from the plate-like lead surface to the light emitting surface side, and the terminal portion has an end bent to the light emitting surface side. .
The said wall part is exposed in the recessed part of the said molded object.
The said wall part is exposed in the recessed part of the said molded object corresponding to the said lower surface of the said molded object, and the upper surface facing this lower surface.
The plate-like lead further includes a base portion that is spaced apart from the terminal portion, extends from the bottom portion, and protrudes from the lower surface of the molded body.
The base portion extends from the bottom portion through a connecting portion adjacent to the bottom portion in the molded body, and the connecting portion is wider on the base portion side than the bottom portion side.
The base portion is opposed to the wall portion.
The connecting portion includes a wide portion that is continuous with the base portion, and a narrow portion that is continuous with the bottom portion and narrower than the wide portion,
The wide part is longer in the direction perpendicular to the width than the narrow part.
The terminal portion is extended from the bottom portion through the terminal connecting portion adjacent to the bottom portion in the molded body.
The terminal connecting portion is wider on the lower surface side of the molded body than the bottom side, and the terminal portion faces the wall portion.

  According to the present invention, it is possible to provide a light emitting device with high mounting stability even with a small light emitting device without reducing productivity.

It is an upper surface perspective view which shows the light-emitting device of Embodiment 1 of this invention. It is a X-X 'line schematic sectional drawing of the light-emitting device of FIG. 1A. FIG. 2 is a plan view of a light emitting device plate-like lead surface side for explaining a plate-like lead before partial bending in the light emitting device of FIG. 1. FIG. 2 is a plan view of a light emitting device plate-like lead rear surface side for explaining a plate-shaped lead before partial bending in the light emitting device of FIG. 1. It is A-A 'line sectional drawing of the light-emitting device of FIG. 2A. It is a schematic sectional drawing which shows the light-emitting device of Embodiment 2 of this invention. It is a schematic sectional drawing which shows the light-emitting device of Embodiment 3 of this invention. It is a top view by the side of the light-emitting device plate-shaped lead surface for demonstrating the plate-shaped lead in the light-emitting device of Embodiment 4 of this invention. It is a top view by the side of the light-emitting device plate-shaped lead surface for demonstrating the plate-shaped lead in the light-emitting device of Embodiment 5 of this invention.

  Embodiments of the present invention will be described below with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. The drawings are schematic, and the ratio of each dimension may differ from the actual dimension.

Embodiment 1
The light emitting device of this embodiment includes at least a package 10 as shown in FIGS. 1A and 1B. In addition, the light emitting element 20 is usually mounted in a package.
This light-emitting device is a so-called side-view type, and the side-view type light-emitting device is a type of light-emitting device in which light emitted from the light-emitting element is extracted in a direction parallel to the mounting surface of the mounting substrate. is there. Such a side-view type light-emitting device generally has a small depth, and thus has a property of being easily tilted forward or backward as compared with a so-called top-view type light-emitting device.

[Package 10]
The package 10 includes a molded body 11 made of resin and a plate-like lead 12 partially embedded in the molded body 11.
(Molded body 11)
The molded body 11 is generally formed in a substantially rectangular parallelepiped shape and defines the outer shape of the package 10. The shape of the molded body 11 is not limited to a rectangular parallelepiped shape, and may have a shape such as a polygonal column or a polygonal frustum. Such a package 10 usually has a light emitting surface 11b and a lower surface 11c connected to the light emitting surface 11b.
The light emission surface 11b is a surface from which the emitted light of the light emitting element 20 is extracted, and has a concave portion 11a for placing the light emitting element 20 thereon.

  The molded body 11 is preferably made of a material having heat resistance, appropriate strength, light shielding properties that do not easily transmit light emitted from the light emitting element 20 and external light, and insulating properties. As such a material, any conventionally known thermoplastic resins such as liquid crystal polymer, polyphthalamide resin, polybutylene terephthalate, and the like can be used. Especially when a semi-crystalline polymer resin containing a high melting point crystal such as polyphthalamide resin is used, the surface energy is large, a sealing member that can be provided inside the opening, a light guide plate that can be attached later, etc. A package with good adhesion to the substrate can be obtained. In addition, known thermosetting resins used in this field, for example, epoxy resins, modified epoxy resins, silicone resins, modified silicone resins and the like can also be used. Moreover, in order to reflect the light from a light emitting element efficiently, white pigments, such as a titanium oxide, can be mixed in the material of a molded object.

(Plate-shaped lead 12)
As shown in FIGS. 1A and 1B, the plate-like lead 12 is substantially plate-like, and is a surface 12a that is a surface disposed on the light emitting surface side, and a back surface 12b that is a surface located on the opposite side of the surface. Have The plate-like lead 12 is partially deformed such as curved or bent, and irregularities may be formed on the front surface 12a and the back surface 12b.
The plate-like lead 12 is exposed from the molded body 11 in the recess 11a of the molded body 11, and has an exposed surface as a mounting surface 12aa on which the light emitting element is mounted. The placement surface 12aa is disposed on the surface 12a of the plate-like lead 12. A portion of the plate-like lead 12 including the mounting surface 12aa of the light emitting element is referred to as a bottom portion 12c. The plate-like lead 12 has a wall portion 12d bent from the bottom portion 12c to the light emitting surface side, and a terminal portion 12e extending from the bottom portion 12c and protruding from the lower surface 11c of the molded body 11. . In FIG. 1B, the terminal part 12e is arrange | positioned from the bottom part 12c of the plate-shaped lead | read | reed 12 in the same plane.
The terminal portion 12e has an end portion 12f that is bent toward the side on which the placement surface 12aa is disposed with reference to the back surface 12b of the plate-like lead 12.

For example, as shown in FIG. 1B, when the terminal portion 12 e is arranged on the same plane from the bottom portion 12 c of the plate-like lead 12, the mounting surface 12 aa of the light emitting element emits light with respect to the back surface 12 b of the plate-like lead 12. The wall portion 12d is arranged on the surface side and protrudes from the surface 12a of the plate-like lead 12 to the light emitting surface side.
In such a light-emitting device including the plate-like lead 12, when the side-view type is mounted, the side on which the mounting surface 12a is arranged is caused by the weight and position of the light-emitting element and / or the bottom of the plate-like lead. Thus, the center of the weight in the light emitting device is unevenly distributed (arrow M in FIG. 2), and tends to fall to the arrow M side.

Therefore, by bending the end portion 12f of the terminal 12e of the plate-like lead 12 on the side where the center of the weight is unevenly distributed, the contact area with the mounting board or the solder 13 is increased and the plate 12 is fixed more strongly. be able to.
Further, in the bent portion (12h in FIG. 2) for bending the end portion 12f of the plate-like lead 12, the solder fillet at the time of mounting increases more remarkably due to the size of the surface area. . The fillet exerts a pulling force in the direction opposite to the direction in which the end 12f of the terminal 12e is bent (arrow N in FIG. 2), canceling the forces in both directions M and N, and mounting the light emitting device more stably. It becomes possible to do.

  Further, in this embodiment, since the side from which the wall 12d protrudes and the side from which the end 12f of the terminal 12e bends are in the same direction, only the depth in these one direction needs to be considered, and the bottom 12c In other words, since the thickness of the package on the side of the back surface 12b of the plate-like lead 12 can be minimized, the thickness of the light emitting device can be further reduced and the size can be reduced.

Further, the plate-like lead 12 will be described in the form of the plate-like lead 12 before bending processing other than the bending processing of the wall portion.
As shown in FIGS. 2A and 2B, the plate-like lead 12 is partially embedded in the molded body 11.
The plate-like lead 12 has a placement surface 12aa exposed from the molded body 11 at a position corresponding to the bottom surface of the recess 11a in the molded body 11. A wall portion 12d is provided on a side corresponding to a portion adjacent to the placement surface 12aa, for example, a lower surface 11c of the molded body 11 and an upper surface 11d facing the lower surface. It is preferable that this wall part 12d is exposed from the molded object 11 similarly to mounting surface 12aa. The wall portion 12d has a slight inclination so that light emitted from the light emitting element in the lateral direction (that is, the side surface direction of the concave portion of the molded body 11) can be efficiently reflected on the light emitting surface. Preferably (see FIG. 2C). Thereby, light extraction efficiency can be exhibited more due to the wall 12d. Moreover, it can prevent that the light radiate | emitted from the light emitting element in the horizontal direction is directly irradiated to a molded object, and can suppress degradation by the emitted light of a molded object.

  As described above, the terminal portion 12e extends from the bottom portion 12c, but usually there is a connection portion as shown by the terminal connection portion 12g in the molded body 11. That is, the terminal portion 12e has a terminal connecting portion 12g adjacent to the placement surface 12aa (bottom portion 12c) and an end portion 12f extending from the terminal connecting portion 12g. The terminal connecting portion 12g is a portion that functions to connect the bottom portion 12c and the end portion 12f protruding from the molded body 11 inside the molded body 11, and this terminal connecting portion 12g is a power applied from the outside. Can be efficiently supplied to the light-emitting element. The terminal connecting portion 12g is preferably arranged so as to form the same plane as the terminal portion 12e, and the shape and the like of the terminal connecting portion 12g can be appropriately set as long as the function described above is achieved.

  Further, it is preferable that a connecting portion 12g ′ is disposed adjacent to the placement surface 12aa (bottom portion 12c) and separated / separated from the terminal portion 12e. Moreover, it is preferable that this connection part 12g 'is further extended and connected with the base part 12i which protrudes outside the molded object 11. FIG. In addition, when the base part 12i protrudes the outer side of the molded object 11, as mentioned above, it is preferable to bend in the same direction as the edge part 12f of the terminal part 12e of the plate-shaped lead 12. FIG. Thereby, not only the end portion 12f of the terminal portion 12e but also the base portion 12i can support / fix the mounting substrate more reliably or firmly.

For example, the connecting portion 12g ′ preferably has a width β on the lower surface 11c side of the molded body 11 wider than a width α on the bottom portion 12c (mounting surface 12aa) side. The width β is, for example, about 2 to 20 times, preferably about 3 to 10 times the width α. As a result, the wide portion is arranged closer to the outside of the molded body 11, so that heat generated by the light emitting element can be efficiently released to the outside.
In addition, when a portion having a different width such as width α <width β is arranged in the connecting portion 12g ′, a wider portion such as the width β is more than a narrow portion such as the width α. It is preferable that the width is long in the orthogonal direction, that is, in the direction in which the terminal portion extends. By setting such a length, the heat capacity of the connecting portion 12g ′ can be increased. In addition, since the narrow part or the wide part of the connecting portion 12g ′ has a length adjacent to the width orthogonal direction, the position of the light emitting element in the light emitting device can be freely adjusted. The degree of freedom in design can be improved while the size can be adjusted to a high level and downsizing that leads to high-density mounting can be achieved.

The wide portion of the connecting portion 12g ′ is preferably directly connected to the base portion 12i while being wide, and the base portion 12i is preferably formed with a width corresponding to the width β. As a result, the wall portion 12d is disposed so as to face the base portion 12i, and both the wall portion 12d and the base portion 12i can be enlarged in the width direction. In addition, since the wall portion becomes wider, the light extraction efficiency can be further improved.
Further, when the base portion 12i is formed wide as described above, the support / fixation to the mounting substrate can be performed more reliably or firmly. In addition, heat dissipation in a wider area can be ensured.

  Also in the terminal connection part 12g mentioned above, it is preferable that the width | variety by the side of the lower surface 11c of the molded object 11 is wider than the width | variety by the side of the bottom part 12c (mounting surface 12aa). Thereby, the support / fixation to the mounting substrate at the end portion of the terminal portion can be performed more reliably or firmly.

  Typically, a light emitting device has at least a pair of electrically separated leads to supply power to a pair of electrodes of the element. Therefore, in addition to the plate-like lead 12 described above, as shown in FIGS. 1A and 2A, the second lead 14 functioning as a pair of the plate-like lead 12 A part embedded in the molded body 11, having a surface on the light emitting surface 11 c side and a back surface on the opposite side, and a connection portion 14 a exposed from the molded body 11 within the bottom surface of the recess 11 a of the molded body 11; It is preferable to have a terminal portion 14e protruding from the lower surface of the molded body 11. The terminal portion 14e has an end portion 12f bent to the side where the mounting surface 12aa of the plate-like lead 12 is disposed, and an end portion 14f bent to the same side.

  The plate-like lead 12 is usually preferably made of a material having a relatively large thermal conductivity (for example, about 200 W / (m · K) or more). Thereby, the heat generated from the light emitting element 20 can be efficiently transmitted. As such a material, for example, a single layer or a plurality of metals such as Ni, Au, Cu, Ag, Mo, W, aluminum, gold, iron, or an alloy such as iron-nickel alloy, phosphor bronze, iron-containing copper, etc. Layers can be used.

  The surface of the plate-like lead 12 is preferably covered with a metal film containing Ag or Au. Thereby, in the wall part 12d, the light radiate | emitted from the light emitting element can be efficiently reflected on a light-projection surface. Such coating can be performed by plating. Usually, a plated metal plate is used to process the plate-like lead, and then the plate-like lead is bent. Therefore, as shown in FIG. 1B, the end surface of the end portion 12f of the terminal portion 12e is not plated, and generally, a material having lower solder wettability than the coating by plating or the like is exposed. Since the solder can be surely rolled up at the bent portion 12h, it becomes more prominently effective for stable mounting of the light emitting device.

[Light emitting element 20]
The light emitting element 20 is arrange | positioned in the recessed part 11a of a molded object. Since the plate-like lead 12 is exposed on the bottom surface as described above, one electrode of the light emitting element 20 is electrically connected to the bottom surface 12aa on the surface 12a side of the plate-like lead 12. Has been placed. The other electrode of the light emitting element 20 is electrically connected to the other plate-like lead disposed in a pair with the plate-like lead 12. The light emitted from the light emitting element 20 is emitted from the light emitting surface 11 c toward the outside of the package 10.
As such a light emitting element 20, a light emitting diode having a light emitting layer of a semiconductor such as GaAlN, ZnS, SnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, and AlInGaN on a substrate is preferably used. .

[Sealing resin]
In the light emitting device of the present invention, the sealing resin is usually filled in the concave portion 11 a of the molded body 11 to seal the light emitting element 20. As the sealing resin, a light-transmitting resin, for example, polyolefin resin, polycarbonate resin, polystyrene resin, epoxy resin, acrylic resin, acrylate resin, methacrylic resin (PMMA, etc.), urethane resin, polyimide resin, polynorbornene resin Fluorine resin, silicone resin, modified silicone resin, modified epoxy resin, etc. are preferably used. Such materials may contain, for example, known phosphors, pigments, fillers, diffusing materials, and the like described in WO2006 / 038502, JP-A-2006-229055, and the like.

In the light emitting device of this embodiment, for example, a copper plate (Ag plated) having a predetermined thickness (about 0.2 mm) is prepared and punched into a desired shape. As a result, a plurality of metal plates in which a desired unit shape is continuous in a predetermined direction as shown in FIG. 2A are formed.
Next, a part corresponding to the wall portion 12d is bent using a mold.

Thereafter, the metal plate is molded with a resin material (material of the molded body 11) by injection molding or the like. As a result, a package array in which the plate-like leads 12 are embedded in the resin material is formed. In such a package array, the wall portion 12d and the mounting surface 12aa of the unitary plate-like lead 12 are exposed at the bottom of the concave portion 11a formed on the light emitting surface 11b of the molded body 11 and the side surface thereof. .
Next, the terminal portion 12e and the base portion 12i are cut out from the package array, and the cut-out terminal portion 12e and the base portion 12i are bent to complete the light emitting device. In the terminal part 12e and the base part 12i, the cut end face is in a state where copper is exposed.
Here, the portions to be the terminal portion 12e and the base portion 12i are cut, but the terminal portion 12e and the base portion 12i are formed in advance by the above-described punching process and cut other portions of the metal plate. Thus, one unit of light emitting device can be obtained.

Embodiment 2
In the light emitting device of this embodiment, as shown in FIG. 3, the terminal portion 22e has an end portion 22f bent to the side on which the mounting surface 22aa is arranged with reference to the back surface 22b of the plate-like lead 22. .
That is, the bottom portion 22c of the plate-like lead 22 has a recess in a concave shape from the plane of the plate-like lead 22 formed by the terminal portion 12e. Along with this depression, the wall 12d bent from the bottom to the light exit surface also protrudes from the back surface 12b of the plate-like lead 12 to the side opposite to the light exit surface.
Therefore, when the plate-like lead 22 is recessed from the plane constituting the terminal portion 22e to the side opposite to the light emitting side to form the placement surface 22aa, the plate-like lead 22 is formed on the side where the placement surface 22aa is arranged. The center of the weight in the lead 22 is unevenly distributed.

  By bending the end 22f of the terminal 22e of the plate-like lead 22 on the side where the center of the weight is unevenly distributed, the contact area with the mounting board or the solder 13 can be increased and fixed more strongly. it can. Furthermore, in the bent portion (22h in FIG. 3) for bending the end portion 22f of the plate-like lead 22, a solder fillet at the time of mounting is more prominently formed due to the size of the surface area. The tensile force acts in the direction opposite to the direction in which the end portion 22f of the terminal 22e is bent by the fillet, and the tensile force and the tensile force due to the weight in the plate-like lead 22 are canceled out to make the light emitting device It becomes possible to mount more stably.

  In this embodiment, the terminal portion 22e is extended from the bottom portion 22c through the wall portion 22d and the terminal connecting portion 22g adjacent to the wall portion 22d. The terminal connecting portion 22g is preferably arranged so as to form the same plane as the terminal portion 22e. The shape and the like of the terminal connecting portion 22g can be appropriately set as long as the above-described function is achieved.

In the second embodiment, the position of the mounting surface 22aa is different, and accordingly, the direction in which the end portion 22f of the terminal 22e is bent is different, and the shape of the terminal connecting portion 22g is different. The basic configuration is the same as that of the light emitting device. Therefore, in the second embodiment, it is possible to improve the light extraction efficiency by the wall portion 22d.
Also in the second embodiment, since the side from which the wall portion 22d protrudes and the side from which the end portion 22f of the terminal portion 22e bends are in the same direction, only the depth in one direction needs to be considered. Since the thickness of the light-emitting device can be minimized, the light-emitting device can be further reduced in thickness and reduced in size.

Embodiment 3
In the light emitting device of this embodiment, as shown in FIG. 4, the terminal portion 32 e has an end portion 32 f that is bent toward the side on which the mounting surface 32 aa is disposed with reference to the back surface 32 b of the plate-like lead 32. .
In this embodiment, the bottom portion 32c of the plate-like lead 32 is configured to have a recess so that it slightly protrudes from the flat surface of the plate-like lead 32 constituting the terminal portion 22e toward the back surface 23b, and the wall portion 32d is A part of the plate-like lead 32 protrudes from the outer side of the back surface 32 b to the surface 32 a side of the plate-like lead 32. That is, the placement surface 32aa is disposed outside the back surface 32b by a distance S from the back surface 32b of the plate-like lead 32.
Even in such a shape, as described above, since the weight of the bottom portion 32c of the plate-like lead is substantially larger than the weight of the wall portion 32d, the plate-like lead, that is, the plate-like lead side. Is placed on the back surface 32b side of the plate-like lead, and the center of weight in the plate-like lead 22 is unevenly distributed on the back surface 31b side.

  Accordingly, even when the center of weight is unevenly distributed in this way, as in the first and second embodiments, by bending the end portion 32f of the terminal 32e of the plate-like lead 32 to the side where the center of weight is unevenly distributed, It is possible to increase the contact area with the mounting substrate or the solder 13 and fix it more strongly. Furthermore, in the bent portion (32h in FIG. 3) for bending the end portion 32f of the plate-like lead 32, a solder fillet at the time of mounting is more prominently formed due to the size of the surface area. The tensile force acts in the direction opposite to the direction in which the end portion 32f of the terminal 32e is bent by the fillet, and the tensile force and the tensile force due to the weight in the plate-like lead 32 are canceled out, and the light emitting device It becomes possible to mount more stably.

  In the third embodiment, the basic configuration is substantially the same as that of the light emitting device of the second embodiment except that the position of the placement surface 32aa is different. Therefore, also in the third embodiment, the light extraction efficiency by the wall 32d can be improved.

  Although not shown, the placement surface may constitute the same surface as the lead back surface. In such a case, since the back surface of the lead is used as a reference for uneven distribution of the weight, as described above, the weight of the bottom portion of the plate-like lead is substantially larger than the weight of the wall portion. Therefore, the center of the weight in the plate-like lead is unevenly distributed on the outer side of the back surface of the plate-like lead, which is the side where the bottom portion having a larger thickness is disposed with respect to the back surface of the plate-like lead. Therefore, in such a case, as in the second embodiment, the end portion of the terminal portion of the plate-like lead is bent toward the back side of the plate-like lead.

In other words, in the present invention, when the placement surface constitutes the same surface as the back surface of the lead, the “side on which the placement surface is arranged with reference to the back surface of the plate-like lead” is the originally intended “bottom portion of the plate-like lead. Means the side where the weight of the bottom of the plate-like lead is unevenly distributed, and the end of the terminal portion of the plate-like lead is on the back side of the plate-like lead corresponding to this side. It means being bent, and such a form is also included.
Thereby, the substantially same effect as Embodiment 3 can be acquired.

Embodiment 4
In the light emitting device of this embodiment, as shown in FIG. 5, the plate-like lead 42 is adjacent to the mounting surface 42aa (bottom portion 42c), separated from / separated from the terminal portion 42e, and connected to the connecting portion 42g ′. Is arranged.
The connecting portion 42g ′ is formed with a narrow width α on the side of the bottom portion 42c (mounting surface 42aa) at a portion arranged in the molded body 11 (that is, there is no change in the width of the connecting portion). ) In the portion protruding from the molded body 11, the width γ on the lower surface 11c side of the molded body 11 is wider than the width α (that is, the base γ protruding from the molded body is wider). .
The width γ is, for example, about 2 to 20 times, preferably about 3 to 10 times the width α. As a result, the wider portion is arranged on the outer side of the molded body 11, so that heat generated by the light emitting element can be efficiently released to the outside.

Further, since the end of the terminal portion is supported / fixed to the mounting substrate by the wide base portion, it can be performed more reliably or firmly.
In the fourth embodiment, except for the above, the basic configuration is substantially the same as that of the light emitting device of the first embodiment. Therefore, also in the fourth embodiment, it is possible to improve the light extraction efficiency by the wall portion 42d.

Embodiment 5
In the light emitting device of this embodiment, as shown in FIG. 6, in the plate-like lead 52, a terminal connecting portion 52g is disposed adjacent to the placement surface 52aa (bottom portion 52c).
The terminal connecting portion 52g has a width ε on the lower surface 11c side of the molded body 11 wider than a width δ on the bottom 52c (mounting surface 52aa) side. Accordingly, the terminal 52e protruding from the wide terminal coupling portion 52g to the outside of the molded body 11 becomes relatively wide along with this, and wraps around below the wall portion 52d. As a result, the terminal portion 52e and the wall portion 62d faces.

  In the fifth embodiment, except for the above, the basic configuration is substantially the same as that of the light emitting device of the first embodiment. Therefore, also in the fifth embodiment, the light extraction efficiency by the wall 52d can be improved.

DESCRIPTION OF SYMBOLS 10 Package 20 Light emitting element 11 Molded object 11a Recessed part 11b Light emission surface 11c Lower surface 12, 22, 32, 42, 52 Plate-like lead 12a, 22a, 32a Surface 12aa, 22aa, 32aa, 42aa, 52aa Mounting surface 12b, 22b, 32b Back surface 12c, 22c, 32c, 42c, 52c Bottom portion 12d, 22d, 32d, 42d, 52d Wall portion 12e, 22e, 32e, 42e, 52e Terminal portion 12f, 22f, 32f, 42f, 52f End portion 12g, 22g, 32g 42g, 52g Terminal connecting part 12g ', 42g' Connecting part 12h, 22h, 32h Bent part 12i, 22i, 32i, 42i Base part 13 Solder 14 Second lead 14a Connecting part 14e Terminal part 14f End part

Claims (9)

A molded body having a light emitting surface having a recess and a lower surface continuous with the light emitting surface, a part of which is embedded in the molded body, and has a surface on the light emitting surface side and a back surface opposite to the surface. With a package made up of leads and
The plate-like lead is
A bottom portion that is exposed from the molded body in the recess and has a mounting surface on which the light emitting element is mounted;
A wall bent from the bottom to the light exit surface side;
A terminal portion extending from the bottom and protruding from the lower surface of the molded body,
The terminal portion has an end portion bent toward the mounting surface side with respect to the back surface of the plate-like lead.   Terminal portions are arranged on the same plane from the bottom of the plate-like lead, the wall portion protrudes from the plate-like lead surface to the light emitting surface side, and the terminal portion has an end bent to the light emitting surface side. The light emitting device according to claim 1.   The light emitting device according to claim 1, wherein the wall portion is exposed in a concave portion of the molded body.   The light emission according to any one of claims 1 to 3, wherein the wall portion is exposed in a concave portion of the molded body corresponding to the lower surface of the molded body and an upper surface facing the lower surface. apparatus.   The light emitting device according to claim 1, wherein the plate-like lead further includes a base portion that is spaced apart from the terminal portion, extends from the bottom portion, and protrudes from a lower surface of the molded body. .   The said base part is extended from the said bottom part through the connection part adjacent to this bottom part inside the said molded object, The said connection part has a width | variety larger on the said base part side than the said bottom part side. 5. The light emitting device according to 5.   The light emitting device according to claim 6, wherein the base portion faces the wall portion. The connecting portion includes a wide portion that is continuous with the base portion, and a narrow portion that is continuous with the bottom portion and narrower than the wide portion,
The light emitting device according to any one of claims 5 to 7, wherein the wide portion is longer in a direction orthogonal to the width than the narrow portion. The terminal portion is extended from the bottom portion through the terminal connecting portion adjacent to the bottom portion in the molded body.
The light emitting device according to any one of claims 1 to 8, wherein the terminal connecting portion is wider on a lower surface side of the molded body than the bottom portion side, and the terminal portion faces the wall portion.

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