JP5696441B2 - Light emitting device, method for manufacturing light emitting device, and package array for light emitting device - Google Patents

Description

  The present invention relates to a light emitting device including a light emitting element, a method for manufacturing the light emitting device, and a package array for the light emitting device.

2. Description of the Related Art Conventionally, as a light source such as a backlight for a liquid crystal television, a lighting fixture, or an optical communication device, a light emitting device including a light emitting element (for example, a light emitting diode or a laser diode) and a package on which the light emitting element is mounted has been widely used. It is used. The package includes a molded body made of resin, and leads having a plate-like connecting portion embedded in the molded body and made of metal.
Here, a technique is known in which a molded body is formed by a transfer molding method in which a resin material poured around a connection portion set in a mold is heated and cured (see, for example, Patent Document 1).

JP 2010-106243 A

However, according to the method of Patent Document 1, when the poured resin material wraps around the end of the plate-like connection portion, the connection portion slightly vibrates due to the pressure from the resin material. For this reason, the resin material cannot be uniformly distributed around the connection part, and the adhesion between the molded body and the lead may be reduced.
The present invention has been made in view of the above-described situation, and an object thereof is to provide a light emitting device capable of improving the adhesion between a molded body and a lead, a method for manufacturing the light emitting device, and a package array for the light emitting device. To do.

  A light-emitting device according to the present invention includes a package having a molded body made of a resin, leads embedded in the molded body, and a light-emitting element mounted on the package. The lead is formed in a plate shape, a connection portion that is electrically connected to the light emitting element, a connection portion having a back surface facing the connection surface, an outer surface of the molded body, a back surface of the connection portion, And the leg part connected to

  ADVANTAGE OF THE INVENTION According to this invention, the light-emitting device which can improve the adhesive force of a molded object and a lead, the manufacturing method of a light-emitting device, and the package array for light-emitting devices can be provided.

It is the perspective view which looked at the light-emitting device 100 concerning 1st Embodiment from the front. It is the perspective view which looked at the light-emitting device 100 concerning 1st Embodiment from back. FIG. 2 is a perspective view of FIG. 1. FIG. 3 is a perspective view of FIG. 2. It is a perspective view of back 20D of the light-emitting device 100 which concerns on 1st Embodiment. It is sectional drawing in the AA of FIG. It is a perspective view of 1st side 20E1 of the light-emitting device 100 which concerns on _1st Embodiment. It is a perspective view of a second side face 20E ₂ of the light emitting device 100 according to the first embodiment. It is a figure for demonstrating the manufacturing method of the light-emitting device 100 which concerns on 1st Embodiment. It is a figure for demonstrating the manufacturing method of the light-emitting device 100 which concerns on 1st Embodiment. 3 is an enlarged view of a lead frame 45 according to the first embodiment. FIG. It is a cut surface in the BB line of FIG. It is a figure for demonstrating the manufacturing method of the light-emitting device 100 which concerns on 1st Embodiment. It is a figure for demonstrating the manufacturing method of the light-emitting device 100 which concerns on 1st Embodiment. It is the perspective perspective view which looked at 100 A of light-emitting devices which concern on 2nd Embodiment from the front. It is the perspective perspective view which looked at 100 A of light-emitting devices which concern on 2nd Embodiment from back. It is the see-through | perspective perspective view which looked at the light-emitting device 100 which concerns on 3rd Embodiment from back. It is a figure for demonstrating the manufacturing method of the light-emitting device 100 which concerns on 3rd Embodiment. It is the see-through | perspective perspective view which looked at the light-emitting device 100 which concerns on 4th Embodiment from back. It is a figure for demonstrating the manufacturing method of the light-emitting device 100 which concerns on 4th Embodiment. It is an enlarged view of lead frame 45B concerning a 4th embodiment. It is a figure for demonstrating the manufacturing method of the light-emitting device 100 which concerns on 4th Embodiment.

  Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Accordingly, specific dimensions and the like should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

[First Embodiment]
(Outline of the first embodiment)
1st Embodiment demonstrates the light-emitting device which can improve the adhesive force of a molded object and a lead, and its manufacturing method. Specifically, the lead of the light emitting device includes a molded body, a plate-like connection portion, and a leg portion standing on the main surface of the connection portion. The leg is exposed on the outer surface of the molded body.
Hereinafter, the structure of the light emitting device and the manufacturing method thereof will be sequentially described.

(Configuration of light emitting device)
The configuration of the light emitting device according to the first embodiment will be described with reference to the drawings. FIG. 1 is a perspective view of the light emitting device 100 according to the first embodiment as viewed from the front. FIG. 2 is a perspective view of the light emitting device 100 according to the first embodiment as viewed from the rear.

  The light emitting device 100 includes a light emitting element 10 and a package 20. The light emitting device 100 according to the present embodiment is a so-called side view type light emitting device, and light emitted from the light emitting element 10 is extracted in a direction parallel to the bottom surface 20A.

  In the present embodiment, the outer shape of the light emitting device 100 is a substantially rectangular parallelepiped shape extending along a first direction parallel to the mounting surface 200A. In the present embodiment, the size of the light emitting device 100 is about 3 mm in the first direction, about 1 mm in the direction orthogonal to the first direction and parallel to the mounting surface 200A (hereinafter referred to as “second direction”). It is about 1 mm in a direction orthogonal to the first direction and the second direction (hereinafter referred to as “third direction”). However, the outer shape and size of the light emitting device 100 are not limited to this.

<Light emitting element 10>
The light emitting element 10 is placed on the package 20. The light emitting element 10 is electrically connected to the package 20 via the first wire 11 and the second wire 12.

  The light emitting element 10 is formed in a plate shape and is disposed perpendicular to the second direction. The light emitted from the light emitting element 10 is extracted in a direction parallel to the second direction from a front opening 20F described later.

  The light emitting element 10 is, for example, a semiconductor light emitting element called a so-called light emitting diode. As the light-emitting element 10, a device having a semiconductor such as GaAlN, ZnS, SnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, and AlInGaN on a substrate as a light-emitting layer is preferably used. It is not limited.

  The light emitting element 10 can employ a face-up structure or a face-down structure. The size of the light-emitting element 10 is not particularly limited, but is 350 μm square, 500 μm square, 1 mm square, or the like.

<Package 20>
In the present embodiment, the outer shape of the package 20 has a substantially rectangular parallelepiped shape extending along the first direction. Package 20 includes a bottom surface 20A, a top surface 20B, and the front 20C, and a rear 20D, the first side surface 20E _1, and a second side face 20E _2.

When the light emitting device 100 is mounted, the bottom surface 20A is in contact with a mounting substrate (not shown). The upper surface 20B is provided to face the bottom surface 20A. The front surface 20C is continuous with the bottom surface 20A and the top surface 20B. The front surface 20C has a front surface opening 20F. The front opening 20 </ b> F guides light emitted from the light emitting element 10 to the outside of the package 20. The light emitting element 10 is mounted on the first connection surface 41A (see FIG. 3) exposed inside the front opening 20F. The back surface 20D is connected to the bottom surface 20A and the top surface 20B, and is provided to face the front surface 20C. The back surface 20D is perpendicular to the second direction. The boundary between the back surface 20D and the bottom surface 20A is parallel to the first direction. The first side surface 20E ₁ is continuous with the back surface 20D and the front surface 20C. The second side surface 20E ₂ is provided to face the first side surface 20E ₁ . The first side surface 20E ₁ and the second side surface 20E ₂ are perpendicular to the first direction.

In the present embodiment, the front surface 20C is a light emitting surface from which light from the light emitting element 10 is emitted. On the other hand, the front 20C different surfaces (the bottom surface 20A, the upper surface 20B, rear 20D, first side 20E ₁ and a second side face 20E ₂₎ is a non-light emitting surface from which light is not emitted.

  The package 20 includes a molded body 30, a first lead 40, a second lead 50, and a sealing resin 60.

(1) Molded body 30
The molded body 30 forms the outer shape of the package 20. Thus, the outer surface of the molded body 30, the bottom surface 20A of the package 20, the upper surface 20B, the front 20C, rear 20D, to form a large portion of the first side 20E ₁ and the second side surface 20E _2. As shown in FIGS. 1 and 2, a part of each of the first lead 40 and the second lead 50 is exposed on the outer surface of the molded body 30.

  The molded body 30 is made of an insulating resin material that has heat resistance and appropriate strength, and that hardly emits light emitted from the light emitting element 10 or external light. As such a material, a triazine derivative epoxy resin which is a thermosetting resin is suitable. Such a thermosetting resin may contain an acid anhydride, an antioxidant, a release material, a light reflecting member, an inorganic filler, a curing catalyst, a light stabilizer, and a lubricant. As the light reflecting member, titanium dioxide filled with 0 to 90 wt%, preferably 10 to 60 wt% can be used. However, the material of the molded body 30 is not limited to this. For example, among thermosetting resins, at least selected from epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, and urethane resins. One kind of resin can be used. In particular, an epoxy resin, a modified epoxy resin, a silicone resin, and a modified silicone resin are suitable as the material of the molded body 30. Further, a thermoplastic resin such as a liquid crystal polymer, a polyphthalamide resin, or polybutylene terephthalate (PBT) may be used.

(2) First lead 40 and second lead 50
The first lead 40 and the second lead 50 are preferably made of a material having a relatively large thermal conductivity (for example, about 200 W / (m · K) or more). As such a material, for example, a single layer or a plurality of metals such as Ni, Au, Cu, Ag, Mo, W, aluminum, gold, iron, or an alloy such as iron-nickel alloy, phosphor bronze, iron-containing copper, etc. Layers can be used. The surfaces of the first lead 40 and the second lead 50 may be plated.

  Most of the first lead 40 and the second lead 50 are embedded in the molded body 30, and only a part of the first lead 40 and the second lead 50 is exposed from the molded body 30. That is, only a part of the first lead 40 and the second lead 50 is observed from the outside of the package 20. The configuration of the first lead 40 and the second lead 50 will be described later.

(3) Sealing resin 60
The sealing resin 60 is filled in the front opening 20F and seals the light emitting element 10. As such a sealing resin 60, a resin having translucency, for example, polyolefin resin, polycarbonate resin, polystyrene resin, epoxy resin, acrylic resin, acrylate resin, methacrylic resin (PMMA, etc.), urethane resin, polyimide resin. At least one resin selected from polynorbornene resin, fluororesin, silicone resin, modified silicone resin, modified epoxy resin, and the like can be used. In addition, such a material may contain, for example, a phosphor or a pigment, a filler, a diffusing material, or the like described in WO2006 / 038502 and JP2006-229055.

(Lead structure)
Next, the configuration of the lead according to the first embodiment will be described with reference to the drawings. FIG. 3 is a perspective view of FIG. FIG. 4 is a perspective view of FIG. FIG. 5 is a perspective view of the back surface 20D of the light emitting device 100 according to the first embodiment. 3 and 4, the contour of the molded body 30 is shown.

<Configuration of first lead 40>
The first lead 40 includes a first connection portion 41 (an example of a “connection portion”), a first terminal portion 42, an exposed portion 43, and a first leg portion 101. In the present embodiment, the first terminal portion 42, the exposed portion 43, and the first leg portion 101 are integrally connected to the first connection portion 41.

(1) 1st connection part 41
The 1st connection part 41 is formed in plate shape, and is arrange | positioned along the back surface 20D. The first connection portion 41 includes a first connection surface 41A and a first back surface 41B (an example of “back surface”).

  The first connection surface 41A is exposed from the molded body 30 inside the front opening 20F. The light emitting element 10 is mounted on the first connection surface 41A, and the first wire 11 is connected thereto. Thereby, 41 A of 1st connection surfaces and the light emitting element 10 are electrically connected. The first connection surface 41A is sealed with a sealing resin 60 (see FIG. 1).

The first back surface 41B is provided to face the first connection surface 41A. The first back surface 41 </ b> B is embedded in the molded body 30. As shown in FIG. 5, the first back surface 41B has a corner portion 41B _CORN and an edge 41B _EDGE (an example of a “back surface edge”). The corner portion 41B _CORN is a region of a predetermined distance S from the corner T in the first back surface 41B. The predetermined distance S can be appropriately set according to the width of the first back surface 41B. The edge 41B _EDGE is the outline (edge) of the first back surface 41B.

(2) First terminal portion 42
The first terminal portion 42 is formed in a cubic shape, and is coupled to the lower end portion (an example of “one end portion of the connection portion”) of the first connection portion 41 on the first side surface 20E ₁ side. The first terminal portion 42, the bottom surface 20A, is exposed from the molded body 30 in the rear 20D and the first boundary of the side 20E _1, functions as an external electrode of the light emitting device 100.

The first terminal portion 42 includes a first end surface 42A, a second end surface 42B, and a first terminal recess 42S. The first end surface 42A is exposed from the molded body 30 on the back surface 20D of the package 20. The first end surface 42A forms part of the back surface 20D. The second end face 42 </ b> B is exposed from the molded body 30 on the first side face 20 </ b> E ₁ of the package 20. The second end face 42B forms a first part of the side surface 20E _1. The first terminal recess 42S is a notch formed in the bottom surface 20A, the rear 20D and the first boundary of the side 20E _1. The first terminal recess 42 </ b> S is open to the three surfaces of the bottom surface 20 </ b> A, the back surface 20 </ b> D, and the first side surface 20 </ b> E ₁ . When the light emitting device 100 is mounted, the first terminal recess 42S is filled with solder.

(3) Exposed portion 43
The exposed portion 43 is formed in an L shape and is connected to the bottom surface 20 </ b> A side and the back surface 20 </ b> D side of the first connecting portion 41. The exposed portion 43 is exposed from the molded body 30 on the bottom surface 20A and the back surface 20D of the package 20. As a result, the exposed portion 43 functions as a heat sink that releases heat generated from the light emitting element 10.

  Further, the exposed portion 43 has a concave portion 43S that opens to the bottom surface 20A and the back surface 20D. The recess 43S is a notch formed at a part of the boundary between the bottom surface 20A and the back surface 20D. When the light emitting device 100 is mounted, solder is accommodated in the recess 43S.

  Here, FIG. 6 is a cross-sectional view taken along the line AA of FIG. As shown in FIG. 6, the exposed portion 43 includes a base portion 431 and a support plate portion 432.

  The base portion 431 is disposed on the bottom surface 20 </ b> A side of the first connection portion 41. The base portion 431 is a base of the light emitting device 100, and functions as a weight that makes the light emitting device 100 having a tall and easy to fall shape difficult to fall. The base portion 431 is exposed on the bottom surface 20A. Moreover, the base part 431 has the recessed part 43S.

  The support plate portion 432 is formed in a plate shape and is disposed on the back surface 20D side of the first connection portion 41. That is, the support plate portion 432 is provided on the first back surface 41 </ b> B of the first connection portion 41. The support plate portion 432 is exposed on the back surface 20D. Such a support plate part 432 supports the 1st connection part 41 in the formation process of the molded object 30, so that it may mention later.

(4) First leg 101
As shown in FIG. 4, the first leg portion 101 is formed in a rod shape. The first leg portion 101 is connected to the outer surface of the molded body 30 (in this embodiment, the back surface 20D of the package 20) and the first back surface 41B of the first connecting portion 41.

In the present embodiment, the first leg portion 101 is continuous with the end portion of the first back surface 41B. Specifically, as shown in FIG. 5, the first leg 101 is adjacent to the edge 41B _EDGE of the first back surface 41B. However, the first leg 101 is separated from the edge 41B _EDGE . Further, the first leg portion 101 is continuous with the corner portion 41B _CORN of the first back surface 41B.

Here, FIG. 7 is a perspective view of the first side surface 20E ₁ of the light emitting device 100 according to the first embodiment. As shown in FIG. 7, the first leg 101 has a first end 101m and a second end 101n.

  The first end 101m is exposed from the molded body 30 on the back surface 20D. The first end portion 101 m has a first end surface 101 </ b> S exposed from the molded body 30. The first end surface 101S forms part of the back surface 20D.

The second end portion 101n is connected to the first connection portion 41 on the first back surface 41B. As described above, the second end portion 101n is connected to the corner portion 41B _CORN of the first back surface 41B and is separated from the edge 41B _EDGE .

<Configuration of Second Lead 50>
The second lead 50 includes a second connection part 51 (an example of “connection part”), a second terminal part 52, and a second leg part 102. In this embodiment, the 2nd connection part 51, the 2nd terminal part 52, and the 2nd leg part 102 are integrally formed.

(1) Second connection part 51
The 2nd connection part 51 is formed in plate shape, and is arrange | positioned along the back surface 20D. The second connection portion 51 includes a second connection surface 51A and a second back surface 51B (an example of “back surface”).

  The second connection surface 51A is exposed from the molded body 30 inside the front opening 20F. The second wire 12 is connected to the second connection surface 51A. Accordingly, the second connection surface 51A and the light emitting element 10 are electrically connected. The second connection surface 51A is sealed with a sealing resin 60 (see FIG. 1).

The second back surface 51B is provided to face the second connection surface 51A. The second back surface 51 </ b> B is embedded in the molded body 30. As shown in FIG. 5, the second back surface 51B has an edge 51B _EDGE . The edge 51B _EDGE (an example of “an edge on the back surface”) is an outline (edge) of the placement second back surface 51B.

(2) Second terminal portion 52
The second terminal portion 52 is formed in a cubic shape and is coupled to a lower end portion (an example of “one end portion of the connection portion”) of the second connection portion 51 on the second side surface 20E ₂ side. The second terminal portion 52, the bottom surface 20A, is exposed from the molded body 30 in the rear 20D and the second boundary side 20E _2, functions as an external electrode of the light emitting device 100.

The second terminal portion 52 has a first end surface 52A, a second end surface 52B, and a second terminal recess 52S. The first end surface 52A is exposed from the molded body 30 on the back surface 20D of the package 20. The first end surface 52A forms part of the back surface 20D. The second end surface 52B is exposed from the molded body 30 on the second side surface 20E ₂ of the package 20. The second end face 52B forms a second part of the side surface 20E _2. The second terminal recess 52S is a notch formed in the bottom surface 20A, the rear 20D and the second boundary side 20E _2. The second terminal recess 52S is open continuous with three sides each of the bottom 20A, the back 20D and the second side surface 20E _2. When the light emitting device 100 is mounted, the second terminal recess 52S is filled with solder.

(3) Second leg 102
As shown in FIG. 4, the second leg portion 102 is formed in a rod shape. The second leg portion 102 is continuous with the outer surface of the molded body 30 (in this embodiment, the back surface 20D of the package 20) and the second back surface 51B of the second connection portion 51.

In the present embodiment, the second leg portion 102 is continuous with the end portion of the second back surface 51B. Specifically, the second leg 102 is adjacent to the edge 51B _EDGE of the second back surface 51B, as shown in FIG. However, the second leg 102 is separated from the edge 51B _EDGE .

Here, FIG. 8 is a perspective view of the second side surface 20E ₂ of the light emitting device 100 according to the first embodiment. As shown in FIG. 8, the second leg portion 102 has a first end portion 102m and a second end portion 102n.

  The first end portion 102m is exposed from the molded body 30 on the back surface 20D. The first end portion 102 m has an end surface 102 </ b> S exposed from the molded body 30. The first end surface 102S forms part of the back surface 20D.

The second end portion 102n is connected to the second connection portion 51 on the second back surface 51B. As described above, the second end portion 102n is continuous with the end portion of the second back surface 51B and is separated from the edge 51B _EDGE of the second back surface 51B.

(Method for manufacturing light emitting device)
Next, a method for collectively manufacturing a plurality of light emitting devices 100 according to the first embodiment will be described with reference to the drawings. FIG. 9A is a cross-sectional view of the metal thin plate 451, and FIG. 9B is a plan view of the metal thin plate 451. FIG. 10A is a cross-sectional view of the lead frame 45, and FIG. 10B is a plan view of the lead frame 45. FIG. 11 is an enlarged view of the lead frame 45. 12 is a cross-sectional view taken along line BB in FIG. FIG. 13 is a plan view of the light emitting device package array PA according to the present embodiment.

First, a metal thin plate 451 having a first main surface S1 and a second main surface S2 provided opposite to the first main surface S1 is prepared. In the present embodiment, the metal thin plate 451 has a thickness t ₁ (for example, about 0.5 mm).

  Next, as shown in FIG. 9A, a first mask M1 having a predetermined pattern is formed on the first main surface S1, and a first pattern having a pattern symmetrical to the first mask M1 is formed on the second main surface S2. Two masks M2 are formed, and the first main surface S1 and the second main surface S2 are etched simultaneously. As a result, an etching hole G is formed in the metal thin plate 451 as shown in FIG. Note that dry etching and wet etching can be used as the etching method. Further, as the etchant, an appropriate one corresponding to the material of the metal thin plate 451 may be selected.

Next, as shown in FIG. 10A, a third mask M3 having a predetermined pattern is formed on the first main surface S1, and the second main surface S2 is entirely covered on the second main surface S2. 4 mask M4 is formed and only 1st main surface S1 is etched. As a result, as shown in FIG. 10B, a lead frame 45 having an etching recess H formed in the first main surface S1 is completed. The depth of the etching recess H is, for example, about 0.3 mm. Therefore, the portion of the metal thin plate 451 where the etching recess H is formed has a thickness t ₂ (for example, about 0.2 mm) smaller than the thickness t ₁ .

  A detailed configuration of the lead frame 45 formed in this way will be described with reference to the drawings. As shown in FIG. 11, the lead frame 45 includes a first frame part F1, a second frame part F2, a third frame part F3, and a fourth frame part F4.

  The first frame part F1 and the second frame part F2 are adjacent to each other in a predetermined direction, and are connected by the first connection frame R1. The third frame portion F3 and the fourth frame portion F4 are adjacent to each other in a predetermined direction, and are connected by the second connection frame R2. The first frame part F1 and the third frame part F3 are adjacent to each other in the orthogonal direction (an example of the orthogonal direction) orthogonal to the predetermined direction, and are connected by the third connection frame R3 and the fourth connection frame R4. The second frame portion F2 and the fourth frame portion F4 are adjacent to each other in the orthogonal direction, and are connected by the fifth connection frame R5 and the sixth connection frame R6.

  The first to fourth frame portions F1 to F4 have the same configuration, and the first thick portion P1, the second thick portion P2, the first thin portion Q1, and the second thin portion Q2. The first leg base part 101A and the second leg base part 102A are included.

The first thick portion P1 has a first thickness t ₁ (that is, the thickness of the metal thin plate 451). In the subsequent process, the exposed portion 43 is formed by cutting the first thick portion P1 with a dicing saw. The second thick part P2 has a first thickness t ₁ . The second thick part P2 is separated from the first thick part P1 in a predetermined direction. In the subsequent process, the second thick part P2 is cut by a dicing saw, whereby the first terminal part 42 and the second terminal part 52 are formed.

The first thin portion Q1 has a second thickness t ₂ (that is, the thickness of the portion of the metal thin plate 451 where the etching recess H is formed). The first thin part Q1 is connected to the first thick part P1 and the second thick part P2. The first thin portion Q1 corresponds to the outer peripheral portion of the first connection portion 41 of the light emitting device 100. The second thin portion Q2 has a second thickness t _2. The second thin portion Q2 is connected to the second thick portion P1, and is separated from the first thin portion Q1 via the etching hole G (see FIG. 9) in a predetermined direction. The second thin part Q <b> 2 corresponds to the second connection part 51 of the light emitting device 100.

The first leg base portion 101A has a first thickness t ₁ . 101 A of 1st leg parts are spaced apart from the 1st thick part P1 and the 2nd thick part P2, and are enclosed by the 1st thin part Q1 in planar view. Similarly, the second leg base portion 102A has a first thickness t ₁ . The second leg base part 102A is separated from the first thick part P1, the second thick part P2 and the first leg base part 101A, and is surrounded by the second thin part Q2 in plan view.

Here, in the present embodiment, a single-sided etching recess X that is a part of the etching recess H is formed inside the first thick portion P1 of each frame portion F in the plan view of the lead frame 45. As shown in FIG. 12, the portion on one side etch recess X is formed of the first thickness portion P1 has a second thickness t _2. In the post-process, the single-sided etching recess X is cut by a dicing saw, thereby forming a recess 43S (see FIG. 4).

Similarly, in the present embodiment, in the plan view of the lead frame 45D, a single-sided etching recess Y (“etching recess”) that is a part of the etching recess H is formed inside the second thick portion P2 of each frame portion F. An example) is formed. As shown in FIG. 12, the portion on one side etch recess Y is formed of the second thick portion P2 has a second thickness t _2. In the subsequent process, the single-sided etching recess Y is cut by a dicing saw, thereby forming the first terminal recess 42S and the second terminal recess 52S (see FIG. 4).

  In the present embodiment, the first thin portion Q1 of the third frame portion F3 is connected to the first thick portion P1 of the first frame portion F1 via the third connection frame R3. The second thin part Q2 of the third frame part F3 is connected to the second thick part P2 of the first frame part F1 via the fourth connection frame R4. Similarly, the first thin portion Q1 of the fourth frame portion F4 is connected to the first thick portion P1 of the second frame portion F2 via the fifth connection frame R5. The second thin part Q2 of the fourth frame part F4 is connected to the second thick part P2 of the second frame part F2 via the sixth connection frame R6.

  The first to sixth connection frames R1 to R6 are cut out by a dicing saw in a later process (see FIG. 14). That is, the first to sixth connection frames R1 to R6 constitute a cutting allowance for dicing. Further, as shown in FIG. 11, the portion connected to the third connecting frame R3 in the first thick portion P1 and the portion connected to the fourth connecting frame R4 in the second thick portion P2 are: It arrange | positions along the predetermined direction and comprises the cutting allowance with 1st thru | or 6th connection frame R1-R6.

  Next, as shown in FIG. 13, the lead frame 45 is set between the lower mold 201 and the upper mold 202. At this time, the first main surface S1 of the lead frame 45 is brought into contact with the inner surface 201S of the lower mold 201. Thereby, the first thick part P1 (corresponding to “connecting part”), the second thick part P2 (not shown in FIG. 13), the first leg base part 101A (corresponding to “leg part”), The second leg base part 102 </ b> A (corresponding to “leg part”) is brought into contact with the inner surface 201 </ b> S of the lower mold 201. That is, the end portion 101a of the first leg base portion 101A (corresponding to the “second end portion of the leg portion”) and the end portion 102a of the second leg base portion 102A (corresponding to the “second end portion of the leg portion”). The lower mold 201 is brought into contact with the inner surface 201S.

  Next, the resin material is injected into the mold (between the lower mold 201 and the upper mold 202) from the inlet 202A of the upper mold 202. Thereby, the resin material wraps around from the second main surface S2 (corresponding to “connection surface”) side to the first main surface S1 side. Specifically, the resin material fills the etching recess H through the etching hole G while spreading on the second main surface S2.

  Next, the resin material is transfer molded by heating at a predetermined temperature. As a result, as shown in FIG. 14, a package array PA for a light emitting device constituted by the lead frame 45 and the mold plate 46 in which the lead frame 45 is embedded is completed. In the light emitting device package array PA, the first thick part P1 and the first leg base part 101A, and the second thick part P2 and the second leg base part 102A are exposed from the mold plate 46. Should be noted.

  Next, as shown in FIG. 14, the light emitting device package array PA is cut along a cutting line G1 and a cutting line G2 having a predetermined width using a dicing saw. As a result, the plurality of light emitting devices 100 are manufactured together.

(Function and effect)
(1) In the light emitting device 100 according to the first embodiment, the first lead 40 includes the first leg portion 101. The first leg portion 101 is continuous with the outer surface of the molded body 30 (the back surface 20D of the package 20) and the first back surface 41B of the first connection portion 41.

  As described above, the first leg portion 101 is exposed on the outer surface of the molded body 30. That is, in the manufacturing process of the molded body 30, the first end portion 101 m of the first leg portion 101 abuts on the inner surface 201 </ b> S of the lower mold 201. Thereby, since the 1st connection part 41 is supported by the 1st leg part 101, it can suppress that the 1st connection part 41 vibrates minutely by the resin material inject | poured. Therefore, the resin material can be uniformly distributed around the first connection portion 41. Further, by providing the first leg portion 101, the contact area between the molded body 30 and the first lead 40 can be increased. As a result, the adhesion between the molded body 30 and the first lead 40 can be improved.

  The same effect can be obtained in the second lead 50 by the second leg portion 102 connected to the second connection portion 51.

(2) In the light emitting device 100 according to the first embodiment, the first leg 101 is adjacent to the edge 41B _EDGE of the first back surface 41B.

  Therefore, it is possible to suppress the occurrence of minute vibrations at the end portion of the first connection portion 41 that is particularly susceptible to vibration. Therefore, the resin material can be spread more uniformly around the first connection portion 41.

Since the second leg portion 102 is adjacent to the edge 51B _EDGE of the second back surface 51B, the same effect can be obtained in the second lead 50.

(3) In the light emitting device 100 according to the first embodiment, the first leg portion 101 continues to the corner portion 41B _CORN of the first back surface 41B.

Therefore, it is possible to suppress the occurrence of minute vibrations at the corner portion 41B _CORN that is particularly susceptible to vibration among the end portions of the first connection portion 41. Therefore, the resin material can be spread more uniformly around the first connection portion 41.

(4) In the light emitting device 100 according to the first embodiment, the first leg 101 is separated from the edge 41B _EDGE of the first back surface 41B.

  Therefore, when the resin material goes around the end of the first connection portion 41, it is possible to suppress the resin material from being blocked by the first leg portion 101. Therefore, since the resin material can be filled smoothly, the resin material can be spread more uniformly around the first connection portion 41.

Since the second leg portion 102 is separated from the edge 51B _EDGE of the second back surface 51B, the same effect can be obtained also in the second lead 50.

  (5) In the light emitting device 100 according to the first embodiment, the back surface 20D from which the first leg portion 101 is exposed is a non-light emitting surface different from the front surface 20C that is a light emitting surface.

  Therefore, the area of the light emitting surface can be increased as compared with the case where the first leg portion 101 is exposed from the front surface 20C that is the light emitting surface. Therefore, the light quantity of the light emitting device 100 can be increased.

  (6) In the light emitting device 100 according to the first embodiment, the first lead 40 has the first terminal portion 42 provided at the lower end portion of the first connection portion 41. The first terminal portion 42 is exposed on the outer surface of the molded body 30 (the back surface 20D of the package 20).

  Therefore, in the manufacturing process of the molded body 30, the first terminal portion 42 contacts the inner surface 201 </ b> S of the lower mold 201. Thereby, since the 1st connection part 41 is supported by the 1st terminal part 42, it can suppress more that the 1st connection part 41 vibrates minutely with the resin material inject | poured. Therefore, since the resin material can be uniformly distributed around the first connecting portion 41, the adhesion between the molded body 30 and the first lead 40 can be further improved.

  (7) In the light emitting device 100 according to the first embodiment, the first lead 40 has the support plate portion 432 provided on the first back surface 41B of the first connection portion 41. The support plate portion 432 is exposed on the outer surface of the molded body 30 (the back surface 20D of the package 20).

  Therefore, in the manufacturing process of the molded body 30, the support plate portion 432 contacts the inner surface 201 </ b> S of the lower mold 201. Thereby, since the 1st connection part 41 is supported by the support plate part 432, it can suppress more that the 1st connection part 41 vibrates minutely with the resin material inject | poured. Therefore, since the resin material can be uniformly distributed around the first connecting portion 41, the adhesion between the molded body 30 and the first lead 40 can be further improved.

  (8) In the method of manufacturing the light emitting device 100 according to the first embodiment, when the lead frame 45 is set between the lower mold 201 and the upper mold 202, the first leg base portion 101A is attached to the lower mold 201. It abuts on the inner surface 201S.

  Therefore, it is possible to suppress the first thin portion Q1 from being vibrated minutely by the injected resin material injected between the lower mold 201 and the upper mold 202. Therefore, the resin material can be uniformly distributed around the first thin portion Q1. As a result, the adhesion between the molded body 30 and the first lead 40 can be improved.

  Since the second leg base portion 102A is brought into contact with the inner surface 201S of the lower mold 201, the same effect can be obtained in the second lead 50.

[Second Embodiment]
Next, a second embodiment will be described with reference to the drawings. The difference between the first embodiment and the second embodiment is that the light emitting device 100 includes three terminal portions. In the following, this difference will be mainly described.

(Configuration of light emitting device)
FIG. 13 is a transparent perspective view of the light emitting device 100 according to the second embodiment as viewed from the front. FIG. 14 is a transparent perspective view of the light emitting device 100 according to the second embodiment as viewed from the rear.

  As shown in FIGS. 13 and 14, the light emitting device 100 includes a first lead 140, a second lead 150, a third lead 160, a blue light emitting element 10B, a green light emitting element 10G, and a red light emitting element 10R.

  The first lead 140 includes a first connection part 141, a first terminal part 142, and a first leg part 111. The second lead 150 includes a second connection part 151, a second terminal part 152, and a second leg part 112. The third lead 160 has a placement portion 161 and an exposed portion 162.

  Each of the first terminal portion 142, the second terminal portion 152, and the exposed portion 162 functions as an external terminal by being electrically connected to a mounting substrate (not shown).

  The blue light emitting element 10B, the green light emitting element 10G, and the red light emitting element 10R are placed on the placement surface 161A of the placement portion 161. Each of the blue light emitting element 10 </ b> B and the green light emitting element 10 </ b> G is electrically connected to the first connection surface 141 </ b> A of the first connection portion 141 and the second connection surface 151 </ b> A of the second connection portion 151. The red light emitting element 10R is electrically connected to the placement surface 161A and the second connection surface 151A.

  Here, the 1st leg part 111 has the structure similar to the 1st leg part 101 which concerns on 1st Embodiment, The outer surface of the molded object 30 and the 1st back surface 141B of the 1st connection part 141 are used. It is lined up.

  The second leg portion 112 has the same configuration as the second leg portion 102 according to the first embodiment, and is continuous with the outer surface of the molded body 30 and the second back surface 151B of the second connection portion 151. ing.

(Function and effect)
The light emitting device 100 </ b> A according to the second embodiment includes a first leg portion 111 that supports the first connection portion 141. Therefore, it can suppress that the 1st connection part 141 vibrates minutely with the resin material inject | poured. In addition, the light emitting device 100 </ b> A according to the second embodiment includes a second leg portion 112 that supports the second connection portion 151. Therefore, it is possible to suppress the second connection portion 151 from being vibrated minutely by the injected resin material.

[Third Embodiment]
Next, a third embodiment will be described with reference to the drawings. The difference between 1st Embodiment and 3rd Embodiment is the point which made the terminal part tall. In the following, this difference will be mainly described.

(Configuration of light emitting device)
FIG. 17 is a perspective view of the light emitting device 100 according to the third embodiment as viewed from the rear. As shown in FIG. 17, in the light emitting device 100, the first terminal portion 42 and the second terminal portion 52 are increased in height in the third direction. Accordingly, the first terminal recess 42S and the second terminal recess 52S are formed higher than the recess 43S in the third direction.

  In addition, it is preferable that the height of each of the first terminal portion 42 and the second terminal portion 52 is not less than half the height of the light emitting device 100 in the third direction.

(Method for manufacturing light emitting device)
First, a lead frame 45A as shown in FIG. 18 is prepared. In the lead frame 45A, the second thick portion P2 is formed large in the orthogonal direction. In the lead frame 45A, the single-sided etching recess Y is set wide in the orthogonal direction.

  Next, the lead frame 45A is embedded in the mold plate 46 (see FIG. 14) by transfer molding.

Next, using a dicing saw, the lead frame 45A and the mold plate 46 are cut together along a cutting line having a predetermined width (see FIG. 14).
(Function and effect)

  In the lead frame 45A according to the third embodiment, the second thick portion P2 is formed to be large in the orthogonal direction. Therefore, it is possible to further suppress the first thin portion Q1 and the second thin portion Q2 from vibrating minutely by the cooperation of the second thick portion P2, the first leg base portion 101A, and the second leg base portion 102A.

  Further, in the light emitting device 100 according to the third embodiment, the heat dissipation path of “light emitting element 10 → first connecting portion 41 → first terminal portion 42 → mounting substrate” can be increased. In addition, the heat dissipation path of “light emitting element 10 → second connection portion 51 → second terminal portion 52 → mounting substrate” can be increased. Therefore, the heat generated from the light emitting element 10 can be released more efficiently.

[Fourth Embodiment]
Next, a fourth embodiment will be described with reference to the drawings. The difference between the first embodiment and the fourth embodiment is that the leg portion is connected to the terminal portion. In the following, this difference will be mainly described.

(Configuration of light emitting device)
FIG. 19 is a perspective view of the light emitting device 100 according to the fourth embodiment as viewed from the rear. As shown in FIG. 19, the first lead 40 has a first leg 121, and the second lead 50 has a second leg 122.

  The first leg 121 is connected to the outer surface of the molded body 30 (in this embodiment, the back surface 20D of the package 20) and the first back surface 41B of the first connecting portion 41. The first leg 121 has an end surface 121 </ b> S exposed from the molded body 30.

  Here, in the present embodiment, the first leg 121 is connected to the first terminal portion 42, and the first end surface 121 </ b> S forms a part of the back surface 20 </ b> D together with the first end surface 42 </ b> A of the first terminal portion 42. doing. Note that the first end surface 121S of the first leg 121 is wider than the first end surface 101S of the first leg 101 according to the first embodiment.

  The second leg portion 122 is continuous with the outer surface of the molded body 30 (in this embodiment, the back surface 20D of the package 20) and the second back surface 51B of the second connection portion 51. The second leg portion 122 has an end surface 122 </ b> S exposed from the molded body 30.

  Here, in the present embodiment, the second leg portion 122 is connected to the second terminal portion 52, and the second end surface 122S forms part of the back surface 20D together with the first end surface 52A of the second terminal portion 52. doing. Note that the first end surface 122S of the second leg portion 122 is wider than the first end surface 102S of the second leg portion 102 according to the first embodiment.

(Method for manufacturing light emitting device)
First, a lead frame 45B as shown in FIG. 20 is prepared. The lead frame 45B includes a first leg base part 121A and a second leg base part 122A. Such a lead frame 45B can be formed by setting a region where single-sided etching is performed to form the first connection source portion 41A and the second connection source portion 51A as shown in FIG.

  In the lead frame 45B according to the present embodiment, the single-sided etched recess X and the single-sided etched recess Y are set larger than the lead frame 45 according to the first embodiment. Thereby, the processing limit on the dimension which can be etched on one side is increased.

  As described above, the lead frame 45B according to the present embodiment basically has a different configuration from the lead frame 45 according to the first embodiment. Hereinafter, the detailed configuration of the lead frame 45B will be described with reference to the drawings. FIG. 21 is an enlarged view of the lead frame 45B. As shown in FIG. 21, the lead frame 45B has first to fourth frame portions F1 to F4. The first frame part F1 and the second frame part F2 are adjacent to each other in a predetermined direction, but are not connected. Similarly, the third frame portion F3 and the fourth frame portion F4 are adjacent to each other in the predetermined direction, but are not connected.

  Here, in the present embodiment, the first leg base part 121A is disposed between the first thick part P1 and the second leg base part 122A in a predetermined direction. The first leg base part 121A is connected to the second thick part P2. In addition, the second leg base part 122A is disposed between the first thick part P1 and the first leg base part 121A in a predetermined direction. The second leg base portion 122A is connected to the second thick portion P2.

  In the present embodiment, the third frame portion F3 and the fourth frame portion F4 are centered on an axis T parallel to the thickness direction (a direction orthogonal to the predetermined direction and the orthogonal direction, that is, a direction orthogonal to the paper surface). The first frame part F1 and the second frame part F2 are arranged rotationally symmetrically. The first thick part P1 of the third frame part F3 is directly connected to the first thick part P1 of the first frame part F1. The second thick part P2 of the third frame part F3 is directly connected to the second thick part P2 of the second frame part F2. The second thick part P2 of the fourth frame part F4 is directly connected to the second thick part P2 of the first frame part F1.

  In the present embodiment, a part of the etching recess H is formed inside the first thick part P1 of each frame part F in the plan view of the lead frame 45B. Thereby, the 1st thickness part P1 of the 3rd frame part F3 and the 1st thickness part P1 of the 1st frame part F1 are connected, and the single-sided etching recessed part X is formed.

  In the present embodiment, a part of the etching recess H is formed inside the second thick part P2 of each frame part F in the plan view of the lead frame 45D. As a result, the second thick part P2 of the first frame part F1 and the second thick part P2 of the fourth frame part F4 are connected to form the single-sided etching recess Y. Similarly, the single-sided etching recess Y is formed by connecting the second thick part P2 of the second frame part F2 and the second thick part P2 of the third frame part F3.

  A portion where the first thick part P1 of the third frame part F3 and the first thick part P1 of the first frame part F1 are connected constitutes a cutting allowance for dicing (see FIG. 22). . Similarly, the part where the second thick part P2 of the third frame part F3 and the second thick part P2 of the second frame part F2 are connected constitutes a cutting allowance for dicing. A portion where the second thick part P2 of the fourth frame part F4 and the second thick part P2 of the first frame part F1 are connected constitutes a cutting allowance for dicing.

  Next, as shown in FIG. 22, the lead frame 45B is embedded in the mold plate 46 by the transfer molding method, thereby completing the light emitting device package array PA. In the light emitting device package array PA, the first thick part P1 and the first leg base part 121A, and the second thick part P2 and the second leg base part 122A are exposed from the mold plate 46. Should be noted.

  Next, using the dicing saw, as shown in FIG. 22, the light emitting device package array PA is cut along the cutting lines H1 and H2 having a predetermined width.

(Function and effect)
In the light emitting device 100 according to the fourth embodiment, the first lead 40 has a first leg 121 connected to the first terminal portion 42, and the second lead 50 is connected to the second terminal portion 52. A second leg 122 is provided.

  As described above, since the first leg 121 is connected to the first terminal portion 42, the heat radiation of “light emitting element 10 → first connection portion 41 → first leg portion 121 → first terminal portion 42 → mounting substrate”. A path can be formed. Therefore, the heat generated from the light emitting element 10 can be released more efficiently.

  Similarly, since the second leg portion 122 is connected to the second terminal portion 52, “light emitting element 10 → molded body 30 and second wire 12 → second connection portion 51 → second leg portion 122 → second terminal”. A heat dissipation path of “part 52 → mounting substrate” can be formed. Therefore, the heat generated from the light emitting element 10 can be released more efficiently.

  As described in the first embodiment, the first leg 121 and the second leg 122 can suppress minute vibrations in the first connection part 41 and the second terminal part 52.

(Other embodiments)
Although the present invention has been described according to the above-described embodiments, it should not be understood that the descriptions and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  (A) In the above embodiment, the first lead 40 has the first leg portion 101 and the second lead 50 has the second leg portion 102. However, the present invention is not limited to this. Each of the first lead 40 and the second lead 50 may have two or more legs.

  In particular, since the first connection portion 41 on which the light emitting element 10 is placed is larger than the second connection portion 51, the first connection portion 41 is likely to vibrate slightly due to the pressure from the resin material. Therefore, it is preferable to provide the third leg portion on the opposite side of the first leg portion 101 with respect to the exposed portion 43 in the first back surface 41B. Thereby, the resin material can be spread more uniformly around the first connection portion 41.

  (B) Although the first lead 40 has the exposed portion 43 in the above embodiment, the present invention is not limited to this. The first lead 40 may not have the exposed portion 43.

  (C) In the above embodiment, the light emitting device 100 is a so-called side view type light emitting device, but the light emitting device 100 may be a so-called top view type light emitting device.

(D) In the above embodiment, the first leg portion 101 is set to be away from the edge 41B _EDGE, it may be in close contact with the edge 41B _EDGE. Similarly, second leg 102 is set to be away from the edge 51B _EDGE, it may be in close contact with the edge 51B _EDGE.

  (E) Although the first lead 40 has the first leg portion 101 and the second lead 50 has the second leg portion 102 in the above embodiment, the present invention is not limited to this. One of the first lead 40 and the second lead 50 only needs to have a leg portion. This is effective particularly when minute vibration is likely to occur in one of the first lead 40 and the second lead 50.

  (F) In the embodiment described above, the light emitting device 100 includes only one light emitting element 10, but is not limited thereto. The light emitting device 100 may include a plurality of light emitting elements 10 connected to each other. In this case, the plurality of light emitting elements 10 may all be of the same type, or may be a combination of different types of red, green, and blue emission colors that are the three primary colors of light.

  (G) In the above embodiment, the exposed portion 43 is formed in an L shape, but is not limited thereto. The exposed portion 43 may be plate-shaped, rod-shaped, columnar, or the like.

  (H) In the above embodiment, each of the first terminal portion 42 and the second terminal portion 43 is formed in a cubic shape, but is not limited thereto. Each shape of the 1st terminal part 42 and the 2nd terminal part 43 can be changed suitably.

  (I) In the above embodiment, the lead frame 45 is formed by etching a metal thin plate, but the present invention is not limited to this. For example, the lead frame 45 can also be formed by punching a plurality of thin metal thin plates into a predetermined shape and then pressing the plurality of thin metal thin plates together.

  As described above, the present invention naturally includes various embodiments not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

100 ... light-emitting device 10 ... light-emitting element 11 ... first wire 12 ... second wire 20 ... package 20A ... bottom 20B ... top 20C ... Front 20D ... rear 20E ₁ ... first side 20E ₂ ... second side 20F ... front opening 30 ... molding 40 ... first lead 41 ... first connection part 41A ... first connection surface 41B ... first back face 42 ... first terminal part 43 ... exposed part 431 ... base part 432 ... support plate part 43S ... recess 45 ... lead Frame 451 ... Metal thin plate 46 ... Mold plate 50 ... Second lead 51 ... Second connection portion 51A ... Second connection surface 51B ... Second back surface 52 ... Second terminal portion 60 ... Sealing resin 101, 111, 121 ... First Legs 101A, 121A ... First leg bases 102, 112, 122 ... Second leg parts 102A, 122A ... Second leg base 201 ... Lower mold 202 ... Upper mold 203 ... Injection port S ... Main surface M ... Mask F ... Arm portion G ... etching holes H ... etch recess P ... thick portion Q ... thin portion R ... connecting frames PA ... light emitting device package array X, Y ... sided etch recess

Claims (10)

A package made of resin and having a light emitting surface, a back surface and a bottom surface, and a lead embedded in the molded body;
A light emitting device mounted on the package;
With
The lead is
A plate-like connecting portion that is electrically connected to the light emitting element and has a connecting surface that exposes at least a part of the light emitting surface of the molded body and a back surface that faces the connecting surface;
A leg portion that is connected to the back surface of the connection portion and is exposed from the back surface facing the light emitting surface, of the outer surface of the molded body ,
A terminal portion that is connected to one end of the connection portion and is exposed from the molded body at the bottom surface connected to the back surface and the back surface;
A plate-like support plate portion connected to the back surface of the connection portion and exposed from the back surface;
Only including,
The leg portion, the terminal portion, and the support plate portion are spaced apart from each other.
Light emitting device. The leg portion is adjacent to an edge of the back surface of the connection portion .
The light emitting device according to claim 1. The back surface of the connection portion has a corner,
The leg is connected to the corner;
The light emitting device according to claim 2. The leg portion is separated from the edge of the back surface of the connection portion .
The light emitting device according to claim 2. The leg portion is connected to the terminal portion.
The light emitting device according to claim 1 . A lead frame including a plate-like connection portion having a connection surface and a back surface facing the connection surface , and a leg portion , a terminal portion, and a support plate portion that are respectively connected to the back surface and spaced apart from each other. Setting the terminal portion and the support plate portion in the mold in contact with the inner surface ;
Injecting a resin material into the mold toward the connection surface of the connection portion;
Forming the molded body in which the lead frame is embedded by curing the resin material;
Electrically connecting a light emitting element to the connection surface;
A method for manufacturing a light emitting device. The leg portion is spaced apart from the terminal portion;
A method for manufacturing a light emitting device according to claim 6 . A mold plate made of resin;
A thin lead frame having a first frame part and a second frame part adjacent to the first frame part in a predetermined direction and embedded in the mold plate;
With
Each of the first frame part and the second frame part is
A first thick portion having a first thickness and exposed from the mold plate;
A second thick portion having the first thickness, exposed from the mold plate, and spaced from the first thick portion in the predetermined direction;
A first thin portion having a second thickness smaller than the first thickness and connected to the first thick portion and the second thick portion;
A second thin portion having the second thickness, connected to the second thick portion, and spaced apart from the first thin portion in the predetermined direction;
A leg portion having the first thickness and surrounded by the first thin portion or the second thin portion;
including,
Package array for light emitting devices. The lead frame has a third frame portion and a fourth frame portion having the same configuration as the first frame portion and the second frame portion,
The third frame portion and the fourth frame portion are arranged rotationally symmetrically with respect to the first frame portion and the second frame portion, with an axis parallel to the thickness direction as a center.
The first thick part of the third frame part is connected to the first thick part of the first frame part,
The second thick part of the third frame part is connected to the second thick part of the second frame part,
The second thick part of the fourth frame part is connected to the second thick part of the first frame part,
The package array for light-emitting devices of Claim 8 . The lead frame has a third frame portion and a fourth frame portion having the same configuration as the first frame portion and the second frame portion,
The third frame portion is adjacent to the first frame portion in an orthogonal direction orthogonal to the predetermined direction,
The fourth frame part is adjacent to the second frame part in the orthogonal direction,
The first thin part of the third frame part is connected to the first thick part of the first frame part,
The second thin part of the third frame part is connected to the second thick part of the first frame part,
The first thin part of the fourth frame part is connected to the first thick part of the second frame part,
The second thin portion of the fourth frame portion is connected to the second thick portion of the second frame portion;
The package array for light-emitting devices of Claim 9 .

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