JP2013036810A - Sensor module and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor module capable of increasing mounting area of electronic components compared with a conventional one, without increase in volume.SOLUTION: The sensor module includes: a mounting member 16 having legs 18, 19 and a ceiling 21 connected to one end of each of the legs 18, 19; and electronic components including sensor elements 32, 33. The mounting member 16 includes multiple fixing surfaces having perpendicular vectors not parallel to each other. On at least two of the fixing surfaces 35, 36, the sensor elements 32, 33 are provided, and in a cavity 25 partitioned by the legs 18, 19 and the ceiling 21, at least one of the electronic components is arranged.

Description

  The present invention relates to an inertial sensor module including an angular velocity sensor, for example.

  For example, sensor modules such as multi-axis angular velocity sensors are widely known. As disclosed in Patent Document 1, the sensor module includes a cubic support member. Uniaxial angular velocity sensors are individually mounted on three orthogonal surfaces. In mounting, a flexible substrate is attached to the surface of the support member.

JP-A-5-340960 Japanese Patent Laid-Open No. 7-306047

  For example, the above-described sensor module is mounted on a board unique to the electronic apparatus (hereinafter referred to as “electronic apparatus board”) when incorporated into the electronic apparatus. In mounting, one surface of the cube is used as a mounting surface to the electronic device substrate. As a result, the mounting area of the electronic component is reduced on the cubic support member.

  According to at least one aspect of the present invention, it is possible to provide a sensor module that can increase the mounting area of an electronic component as compared with the conventional case without increasing the volume.

  (1) One aspect of the present invention includes a mount member including a leg body and a ceiling body connected to one end of the leg body, and an electronic component including a sensor element, and the mount members are not parallel to each other. A plurality of fixing surfaces each having a perpendicular vector, at least two of the fixing surfaces are provided with the sensor elements, and at least the electronic component is disposed in a cavity defined by the legs and the ceiling body. It is related with the sensor module characterized by one being arrange | positioned.

  According to such a sensor module, at least two sensor elements are fixed to a pair of fixed surfaces, so that axial alignment of the sensor elements can be easily realized. In addition, since at least one of the electronic components is arranged in the cavity, the mounting area of the electronic component can be increased without increasing the volume as compared with the conventional cubic mounting member.

  (2) The sensor module may include a mounting substrate having a plurality of mounting surfaces, and the electronic component may be mounted on each of the plurality of mounting surfaces. Thus, the electronic component can be easily mounted on the mount member via the mounting board.

  (3) A first interface board may be connected to the mounting board, and the first interface board may be connected to the leg. In this way, input / output of electric signals of the sensor module can be collectively managed by the first interface board.

  (4) The leg may include an elastic member at the other end opposite to the one end. Thus, the sensor module can be attached to the object via the elastic member. Vibration transmitted from the object to the sensor element can be absorbed by the elastic member. If the vibration of the band including the natural frequency of the sensor element is removed by such an elastic member, unnecessary resonance of the sensor element can be avoided. A malfunction of the sensor element can be prevented.

  (5) The sensor module may include a second interface substrate that is superimposed on the first interface substrate in a plan view, and may include an elastic member between the first interface substrate and the second interface substrate.

  According to such a sensor module, the elastic member is sandwiched between the first interface board and the second interface board when absorbing vibration. A leg can be directly mounted on the surface of the first interface board. A wiring pattern can be formed directly on the surface of the leg.

  (6) The sensor module may include at least one pair of the legs. Thus, if the two legs are connected by the ceiling, the support of the legs is stabilized. A jig for supporting the legs is not required for the mounting and fixing work of the legs. Leg mounting and fixing operations can be simplified.

  (7) A central processing unit (CPU) may be disposed on the ceiling body in the cavity. Even when a heat dissipation member such as a heat sink is stacked on the CPU, the heat dissipation member can be accommodated in the cavity. Therefore, an increase in the size of the entire sensor module can be avoided. Moreover, if the ceiling body is made of a conductive material, the ceiling body can function as an electromagnetic shield for the CPU.

  (8) The sensor module can be used in various electronic devices. Examples of the electronic apparatus include a digital still camera, a video camera, a navigation device, a vehicle body posture detection device, a pointing device, a game controller, a head mounting display, a mobile phone, a self-propelled cleaning robot, and a radio control helicopter.

It is a perspective view showing roughly the appearance of the sensor module concerning a 1st embodiment of the present invention. It is a perspective view showing roughly the composition of the sensor module concerning a 1st embodiment observed from the viewpoint of the front side. It is a perspective view showing roughly the composition of the sensor module concerning a 1st embodiment observed from the viewpoint on the back side. It is a perspective view which shows roughly the structure of the sensor module which concerns on 1st Embodiment observed from the viewpoint of a bottom face side. It is a perspective view which shows roughly the structure of the sensor module which concerns on 2nd Embodiment observed from the viewpoint of a front side. It is a perspective view which shows roughly the structure of the sensor module which concerns on 2nd Embodiment observed from the viewpoint of a back side. It is a perspective view which shows roughly the structure of the sensor module which concerns on 2nd Embodiment observed from the viewpoint of a bottom face side. It is a perspective view which shows roughly the structure of the sensor module which concerns on 3rd Embodiment observed from the viewpoint of a front side. It is a perspective view which shows roughly the structure of the sensor module which concerns on 3rd Embodiment observed from the viewpoint of a back side. It is a perspective view which shows roughly the structure of the sensor module which concerns on 3rd Embodiment observed from the viewpoint of a bottom face side. It is a perspective view which shows roughly the structure of the sensor module which concerns on 4th Embodiment observed from the viewpoint of a front side. It is a perspective view which shows roughly the external appearance of the sensor module which concerns on 5th Embodiment of this invention. It is a perspective view which shows roughly the structure of the sensor module which concerns on 5th Embodiment observed from the viewpoint of a front side. It is a perspective view which shows roughly the external appearance of the sensor module which concerns on 6th Embodiment of this invention. It is a perspective view which shows roughly the structure of the sensor module which concerns on 6th Embodiment observed from the viewpoint of a front side. It is a perspective view which shows roughly the structure of the sensor module which concerns on 7th Embodiment of this invention. It is a perspective view which shows roughly the structure of the sensor module which concerns on 8th Embodiment of this invention. It is a perspective view showing roughly the composition of the sensor module concerning a 9th embodiment of the present invention. It is a block diagram which shows roughly a specific example of an electronic device.

  Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. The present embodiment described below does not unduly limit the contents of the present invention described in the claims, and all the configurations described in the present embodiment are essential as means for solving the present invention. Not necessarily.

(1) Sensor Module According to First Embodiment FIG. 1 schematically shows a sensor module 11 according to the first embodiment of the present invention. The sensor module 11 includes an interface board 12. A box-shaped exterior body 13 is fixed to the surface of the interface substrate 12. The exterior body 13 may be bonded to the interface substrate 12. The exterior body 13 partitions a rectangular parallelepiped space between the surface of the interface board 12. For example, solder bumps 14 can be attached to the back surface of the interface substrate 12 in a matrix. With such solder bumps 14, the sensor module 11 can be mounted on a board unique to the electronic equipment (hereinafter referred to as "electronic equipment board") when incorporated into the electronic equipment. The input / output of electric signals of the sensor module 11 can be collectively managed by the interface board 12, and therefore the mounting of the sensor module 11 can be simplified. The shape of the exterior body 13, the contour of the interface board 12, and the shape of the space can be arbitrarily set.

  As shown in FIGS. 2 to 4, the mount member unit 15 is fixed to the surface of the interface substrate 12 in the space inside the exterior body 13. The mount member unit 15 includes a mount member 16 and a vibration isolating material (elastic member) 17. The vibration isolator 17 is sandwiched between the surface of the interface substrate 12 and the mount member 16. The mount member 16 is connected to the interface board 12 only through the vibration isolator 17. That is, direct contact between the mount member 16 and the interface board 12 is avoided. The vibration isolator 17 may be made of an elastic material such as silicone. The elastic material is desired to have heat resistance capable of maintaining elasticity even when exposed to a high temperature in the reflow process of the solder bumps 14, for example.

  The mount member 16 includes at least a pair of legs 18 and 19 (hereinafter referred to as “first leg” and “second leg”) and a ceiling body 21. The first leg 18 partitions the first wall surface of the cavity 25 with a wall surface 23 that intersects the virtual plane 22 while in contact with the virtual plane 22. Here, the wall surface 23 of the first leg 18 is orthogonal to the virtual plane 22. The second leg 19 contacts the virtual plane 22 at a position away from the first leg 18 by a predetermined distance. A wall surface 24 that faces the wall surface 23 of the first leg 18 while intersecting the virtual plane 22 is formed on the second leg 19. The wall surface 24 of the second leg 19 defines the second wall surface of the cavity 25. Here, the wall surface 24 of the second leg 19 is orthogonal to the virtual plane 22. Thus, the cavity 25 is sandwiched between the wall surfaces 23 and 24 facing each other. However, the wall surfaces 23 and 24 are not necessarily orthogonal to the virtual plane 22 when forming the cavity 25. The wall surfaces 23 and 24 may intersect the virtual plane 22 at a predetermined inclination angle.

  The ceiling body 21 connects the first leg 18 and the second leg 19 to each other. The ceiling body 21 is formed with a ceiling surface 26 connected at one end to the upper end of the wall surface 23 of the first leg 18 and connected to the upper end of the wall surface 24 of the second leg 19 at the other end. The ceiling surface 26 defines the ceiling surface of the cavity 25. The first and second legs 18 and 19 and the ceiling body 21 may be molded from, for example, a resin material or a metal material. The mount member 16 may be formed of an insulator or a conductor, and the surface of the insulator may be covered with the conductor. The first and second legs 18 and 19 may be integrally molded, or may be individually molded and then bonded to each other with an adhesive. In any case, the first and second legs 18, 19 and the ceiling body 21 have a predetermined rigidity. Since the two legs 18 and 19 are connected by the ceiling body 21, the support of the legs 18 and 19 on the interface board 12 is stabilized. A jig for supporting the legs 18 and 19 is not required for fixing the legs 18 and 19. The fixing work of the legs 18 and 19 can be simplified.

  The virtual plane 22 partitions the joint surface 27 into the first leg 18 and the second leg 19. The vibration isolator 17 is individually coupled to each joint surface 27. The vibration isolator 17 covers the joint surface 27. Similarly, a joint surface 28 is formed on the vibration isolator 17. The joint surface 28 of the vibration isolator 17 can be partitioned by a second virtual plane parallel to the virtual plane 22. The vibration isolator 17 is bonded to the surface of the interface substrate 12 at the second bonding surface. An adhesive made of, for example, a thermosetting resin can be used for joining the first and second legs 18 and 19, the vibration isolator 17, and the interface substrate 12.

  The ceiling surface 26 faces the surface of the interface board 12 with the cavity 25 interposed therebetween. In this way, the cavity 25 is partitioned by the wall surface 23 of the first leg 18, the wall surface 24 of the second leg 19, the wall surface of the vibration isolator 17, the ceiling surface 26 of the ceiling body 21, and the surface of the interface substrate 12. In the cavity 25, the wall surfaces other than the first wall surface and the second wall surface, that is, the third wall surface and the fourth wall surface may be opened.

  The interface board 12 is a so-called rigid board. A mounting substrate, that is, a flexible substrate 31 is coupled to the interface substrate 12. Thus, the interface board 12 and the flexible board 31 constitute a so-called rigid flexible board. The flexible substrate 31 is bonded to the outer surface of the mount member 16. In joining, the flexible substrate 31 is superposed on the outer surface of the mount member 16. An electronic component group can be mounted on the outward mounting surface of the flexible substrate 31. The individual electronic components 32, 33, 34 of the electronic component group can be electrically connected to the solder bumps 14 through wiring patterns on the interface substrate 12 and the flexible substrate 31 and vias in the interface substrate 12.

  The electronic component group includes at least two uniaxial angular velocity sensors (sensor elements) 32 and 33. The uniaxial angular velocity sensors 32 and 33 are mounted on the mounting surface of the flexible substrate 31 on at least one pair of fixed surfaces 35 and 36. The fixing surfaces 35 and 36 can be formed on any of the first leg body 18, the second leg body 19, and the ceiling body 21. The individual fixing surfaces 35 and 36 can be constituted by flat surfaces, for example. These fixed surfaces 35, 36 establish perpendicular vectors that are non-parallel to each other. If the two perpendicular vectors defining the two fixed surfaces 35 and 36 are orthogonal to each other, the biaxial angular velocity sensors 32 and 33 supported by the two fixed surfaces 35 and 36 respectively provide a biaxial angular velocity sensor. Can do. The rotational axes of the uniaxial angular velocity sensors 32 and 33 may be set perpendicular to the fixed surfaces 35 and 36, for example. Instead of these uniaxial angular velocity sensors 32, 33, or in addition to such uniaxial angular velocity sensors 32, 33, uniaxial acceleration sensors may be fixed to the fixed surfaces 35, 36. The detection axis of the uniaxial acceleration sensor may be set parallel to the fixed surfaces 35 and 36, for example. The uniaxial angular velocity sensors 32 and 33 and the uniaxial acceleration sensor can be made of, for example, silicon (MEMS), crystal, or ceramic.

  According to such a sensor module 11, at least two uniaxial angular velocity sensors 32, 33 are fixed to the plurality of fixing surfaces 35, 36 of the mount member 16, so that the uniaxial angular velocity sensors 32, 33 can be easily aligned with each other. Can be done. Moreover, the electronic component 34 is disposed in the cavity 25. Since the mounting area of the electronic component 34 is secured by the ceiling surface 26 facing the interface substrate 12, the mounting area of the electronic component can be increased without increasing the volume as compared with the conventional cubic mount member. .

  In addition, since the vibration isolator 17 is sandwiched between the mount member 16 and the interface board 12 in the sensor module 11, vibration transmitted from the solder bumps 14 through the interface board 12 is absorbed by the vibration isolator 17. Can do. If vibrations in a band including the natural frequency of the uniaxial angular velocity sensors (or uniaxial acceleration sensors) 32 and 33 are removed with such a vibration isolating material, unnecessary resonance of the uniaxial angular velocity sensors (uniaxial acceleration sensors) 32 and 33 is avoided. Can. The malfunction of the uniaxial angular velocity sensors (uniaxial acceleration sensors) 32 and 33 can be prevented. In addition, the use of the sensor module 11 may be considered in setting the frequency of vibration absorbed by the vibration isolator 17. For example, if the sensor module 11 is used for motion sensing that detects the movement of the human body, the movement of the interface board 12 may be transmitted to the uniaxial angular velocity sensors (uniaxial acceleration sensors) 32 and 33 in a band of several hundred Hz or less. .

  The electronic component group can include at least one central processing unit (CPU) 34. The CPU 34 can be fixed to the ceiling surface 26 of the ceiling body 21, for example. Thus, if the CPU 34 is arranged close to the interface board 12, a large number of wires connected to the CPU 34 can be shortened. The wiring pattern on the flexible substrate 31 can be simplified. In addition, even when a heat radiating member such as a heat sink is stacked on the CPU 34, the heat radiating member can be accommodated in the cavity 25. Therefore, an increase in the size of the entire sensor module 11 can be avoided. Moreover, if the mount member 16 is formed of a conductive material, the mount member 16 can function as an electromagnetic shield for the CPU 34. In addition, even if the CPU 34 is mounted on the surface of the interface board 12 in the cavity 25, the sensor module 11 can enjoy such technical effects.

(2) Sensor Module According to Second Embodiment FIGS. 5 to 7 schematically show a sensor module 11a according to the second embodiment of the present invention. In the second embodiment, the uniaxial angular velocity sensors 32 and 33 are directly fixed to the fixing surfaces 35 and 36 of the mount member 16. Other than that, it is comprised similarly to the above-mentioned 1st Embodiment. The uniaxial angular velocity sensors 32 and 33 are directly superimposed on the fixed surfaces 35 and 36. For fixing, for example, an adhesive made of a thermosetting resin may be used. Thus, the uniaxial angular velocity sensors 32 and 33 are sandwiched between the mount member 16 and the flexible substrate 31. In the second embodiment, since the uniaxial angular velocity sensors 32, 33 are directly supported by the fixing surfaces 35, 36 of the mount member 16, the uniaxial angular velocity sensors 32, 33 are aligned with each other compared to the first embodiment. The accuracy can be easily increased. In addition, the same reference numerals are given to the configurations and structures equivalent to those of the first embodiment, and the detailed description is omitted. The sensor module 11a according to the second embodiment can provide the same technical effect as that of the sensor module 11 according to the first embodiment.

(3) Sensor Module According to Third Embodiment FIGS. 8 to 10 schematically show a sensor module 11b according to the third embodiment of the present invention. In the third embodiment, three perpendicular vectors defining the three fixed surfaces 35, 36, 41 constitute an orthogonal three axis. Other than that, it is comprised similarly to the above-mentioned 1st Embodiment. If the perpendicular vectors of the fixed surfaces 35, 36, and 41 constitute an orthogonal three axis, the three-axis angular velocity sensors 32, 33, and 42 supported on the three fixed surfaces 35, 36, and 41 respectively provide a triaxial angular velocity sensor. Can. In addition, the same reference numerals are given to the configurations and structures equivalent to those of the first embodiment, and the detailed description is omitted. The sensor module 11b according to the third embodiment can obtain the same technical effect as that of the sensor module 11 according to the first embodiment described above. In the third embodiment, the uniaxial angular velocity sensors 32, 33, and 42 may be directly superimposed on the fixed surfaces 35, 36, and 41 as in the second embodiment.

(4) Sensor Module According to Fourth Embodiment FIG. 11 schematically shows a sensor module 11c according to the fourth embodiment of the present invention. In the fourth embodiment, the vibration isolators 43 and 44 are directly fixed to the respective fixed surfaces 35 and 36. Other than that, it is comprised similarly to the above-mentioned 1st Embodiment. The uniaxial angular velocity sensors 32 and 33 are received on the vibration isolators 43 and 44, respectively. As a result, the vibration band transmitted to the individual uniaxial angular velocity sensors 32 and 33 can be further finely adjusted. The technical idea of the fourth embodiment can be applied to any of the sensor modules 11, 11a, 11b according to the first to third embodiments described above.

(5) Sensor Module According to Fifth Embodiment FIG. 12 schematically shows a sensor module 11d according to the fifth embodiment of the present invention. The sensor module 11 d includes a first interface board 45, a vibration isolating material (elastic member) 46, and a second interface board 47. A box-shaped exterior body 13 is fixed to the surface of the first interface board 45 as in the first embodiment. The vibration isolator 46 is overlaid on the back side of the first interface board 45. The second interface board 47 is overlaid on the back side of the first interface board 45 with the vibration isolator 46 interposed therebetween. Thus, the plate-shaped vibration isolator 46 is sandwiched between the first interface board 45 and the second interface board 47. A flexible substrate 48 is connected to the first interface substrate 45 and the second interface substrate 47. The flexible board 48 establishes an electrical connection between the first interface board 45 and the second interface board 47. The first interface board 45, the second interface board 47, and the flexible board 48 may constitute a so-called rigid flexible board. The solder bumps 14 can be attached to the back surface of the second interface substrate 47 in a matrix, for example. With such solder bumps 14, the sensor module 11 d can be mounted on an electronic device board for incorporation into the electronic device. The shape of the exterior body 13, the contours of the first and second interface boards 45 and 47, the contour and thickness of the vibration isolator 46, and the shape of the space can be arbitrarily set. Hereinafter, the same reference numerals are given to the configurations and structures equivalent to those of the first to fourth embodiments described above, and the detailed description is omitted.

  As shown in FIG. 13, the mount member 51 is fixed to the surface of the first interface substrate 45 in the space inside the exterior body 13. As described above, the mount member 51 includes a pair of leg bodies 52 and 53 (hereinafter referred to as “first leg body” and “second leg body”) and a ceiling body 54. In the fifth embodiment, the mount member 51 is directly bonded to the surface of the first interface board 45 at the bonding surface 55 of the first leg body 52 and the second leg body 53. The mount member 51 can be mounted on the first interface board 45. Thus, the cavity 59 is partitioned by the wall surface 56 of the first leg 52, the wall surface 57 of the second leg 53, the ceiling surface 58 of the ceiling body 54, and the surface of the first interface board 45.

  A wiring pattern 61 is formed on the outer surface of the mount member 51. Solder bumps (not shown) can be attached to the joint surfaces 55 of the first leg body 52 and the second leg body 53. The solder bump realizes mounting of the mount member 51 on the first interface board 45. The solder bump establishes conduction between the wiring on the first interface substrate 45 and the wiring pattern 61 on the mount member 51. Except for the wiring pattern 61, the mount member 51 can be configured in the same manner as the mount member 16 described above.

  An electronic component group can be mounted on the outer surface of the mount member 51. The electronic components 62, 63, 64 are electrically connected to each other by a wiring pattern 61 on the mount member 51, for example. The electrical signals of the electronic components 62, 63, 64 pass through the wiring pattern 61 on the mount member 51, the solder bumps, the wiring on the first interface board 45, the wiring pattern on the flexible board 48, and the second interface board 47. The solder bumps 14 can be taken out. On the other hand, from the solder bump 14, the wiring pattern on the second interface board 47, the flexible board 48, the wiring on the first interface board 45, the solder bump, and the wiring pattern 61 on the mount member 51 are used to obtain the individual electronic components 62. 63, 64 can be supplied with electrical signals.

  The electronic component group includes at least two uniaxial angular velocity sensors (sensor elements) 62 and 63. Uniaxial angular velocity sensors 62 and 63 are mounted on the fixed surfaces 65 and 66 of the mount member 51. In the fifth embodiment, since the uniaxial angular velocity sensors 62 and 63 are directly supported by the fixed surfaces 65 and 66 of the mount member 51, the uniaxial angular velocity sensors 62 and 63 are aligned with each other as compared with the first embodiment. The accuracy can be easily increased. In addition, since the flexible substrate is omitted in wiring the electronic component group, the sensor module 11d can be reduced in weight. In addition, the same reference numerals are assigned to configurations and structures equivalent to those of the first to fourth embodiments. The sensor module 11d according to the fifth embodiment can obtain the same technical effect as that of the sensor module according to the first to third embodiments.

  In addition, since the vibration isolator 46 is sandwiched between the first interface board 45 and the second interface board 47 in the sensor module 11d, vibration transmitted from the solder bumps 14 through the second interface board 47 is the vibration isolator. 46 is absorbed. If the vibration of the band including the natural frequency of the uniaxial angular velocity sensor (or uniaxial acceleration sensor) 62, 63 is removed by the vibration isolator 46, the unnecessary uniaxial angular velocity sensor (uniaxial acceleration sensor) 62, 63 resonance can be avoided, and malfunction of the uniaxial angular velocity sensors (uniaxial acceleration sensors) 62 and 63 can be prevented.

(6) Sensor Module According to Sixth Embodiment FIGS. 14 and 15 schematically show a sensor module 11e according to the sixth embodiment of the present invention. The sensor module 11 e includes an interface board 68, a vibration isolating material (elastic member) 69, and an interface connector 71. Other than that, it is comprised similarly to the above-mentioned 5th Embodiment. The box-shaped exterior body 13 is fixed to the surface of the interface board 68 as in the fifth embodiment. The vibration isolator 69 is overlaid on the back side of the interface board 68. The vibration isolator 69 may be formed in a plate shape. A mounting surface 72 is formed on the back surface of the vibration isolator 69. The attachment surface 72 can be partitioned by a second virtual plane parallel to the virtual plane. The sensor module 11e can be attached to the electronic device board when the sensor module 11e is incorporated into the electronic device by the attachment surface 72 of the vibration isolator 69. For attachment, for example, the attachment surface 72 of the vibration isolator 69 may be bonded to the surface of the electronic device substrate.

  The interface connector 71 and the interface board 68 are connected to each other by a flexible board 73. The flexible board 73 establishes an electrical connection between the interface connector 71 and the interface board 68. The interface connector 71, the interface board 68, and the flexible board 73 may constitute a so-called rigid flexible board. The interface connector 71 is connected to a connector on the receiving side mounted on, for example, an electronic device board when incorporated into the electronic device. Components and structures equivalent to those of the fifth embodiment described above are denoted by the same reference numerals, and detailed description thereof is omitted.

(7) Sensor Module According to Seventh Embodiment FIG. 16 schematically shows a sensor module 11f according to the seventh embodiment of the present invention. The sensor module 1 f includes an interface board 12. An angle member unit 75 is fixed to the surface of the interface board 12. Except for the angle member unit 75, the configuration is the same as in the first embodiment. The angle member unit 75 includes an angle member 76 and a vibration isolating material (elastic member) 77. The vibration isolator 77 is sandwiched between the surface of the interface board 12 and the angle member 76. For example, solder bumps 14 can be attached to the back surface of the interface substrate 12 in a matrix. With such solder bumps 14, the sensor module 11f can be mounted on an electronic device board for incorporation into the electronic device.

  The angle member 76 includes a first plate member 78 and a second plate member 79. The first plate member 78 and the second plate member 79 are fixed to the interface substrate 12 in a posture that stands up from the surface of the interface substrate 12. The first plate member 78 partitions the first wall surface of the angle space 82 with a first fixed surface 81 that intersects the virtual plane 22 while in contact with the virtual plane 22. The first fixed surface 81 can be configured as a flat surface, for example. Here, the first fixed surface 81 of the first plate member 78 is orthogonal to the virtual plane 22. A second fixing surface 83 that intersects the first fixing surface 81 of the first plate 78 while intersecting the virtual plane 22 is formed on the second plate 79. The second fixing surface 83 of the second plate member 79 defines the second wall surface of the angle space 82. The second fixed surface 83 can be configured as a flat surface, for example. Here, the second fixing surface 83 of the second plate member 79 is orthogonal to the virtual plane 22 and the first fixing surface 81 of the first plate member 78. The first plate member 78 and the second plate member 79 are connected to each other along one ridge line of the angle space 82. In this way, a rectangular parallelepiped angle space 82 is defined by the adjacent fixing surfaces 81 and 83. In forming the angle space 82, the fixed surfaces 81 and 83 are not necessarily orthogonal to the virtual plane 22. The angle space 82 is not necessarily formed in a rectangular parallelepiped shape, and may be formed in other shapes.

  A flexible substrate 86 is overlaid on the first fixing surface 81 and the back side flat surface 84 of the first plate member 78 and the second fixing surface 83 and the back side flat surface 85 of the second plate material 79. The flexible substrate 86 is bonded to the first plate member 78 and the second plate member 79. An electronic component group can be mounted on the outward surface of the flexible substrate 86. The flexible substrate 86 and the interface substrate 12 may constitute a so-called rigid flexible substrate. The individual electronic components 87 and 88 of the electronic component group can be electrically connected to the solder bumps 14 through wiring patterns on the interface substrate 12 and the flexible substrate 86 and vias in the interface substrate 12.

  The electronic component group includes at least two uniaxial angular velocity sensors (sensor elements) 87 and 88. The uniaxial angular velocity sensors 87 and 88 are mounted on the outward surface of the flexible substrate 86 at least on the first fixed surface 81 and the second fixed surface 83. These fixed surfaces 81 and 83 establish perpendicular vectors that are non-parallel to each other. If the two perpendicular vectors defining the two fixed surfaces 81 and 83 are orthogonal to each other, a biaxial angular velocity sensor can be provided by a uniaxial angular velocity sensor group supported by the two fixed surfaces 81 and 83, respectively. . The rotational axes of the uniaxial angular velocity sensors 87 and 88 may be set to be perpendicular to the individual fixed surfaces 81 and 83, for example. Instead of the uniaxial angular velocity sensors 87 and 88, or in addition to the uniaxial angular velocity sensors 87 and 88, a uniaxial acceleration sensor may be fixed to the fixed surfaces 81 and 83. The detection axis of the uniaxial acceleration sensor may be set parallel to the fixed surfaces 81 and 83. The uniaxial angular velocity sensors 87 and 88 and the uniaxial acceleration sensor can be formed of, for example, silicon (MEMS), crystal, or ceramic.

  According to such a sensor module 11f, at least two uniaxial angular velocity sensors 87, 88 are fixed to the plurality of fixing surfaces 81, 83 of the angle member 76, so that the uniaxial angular velocity sensors 87, 88 can be easily aligned with each other. Can be done. In addition, since the mounting area of the electronic component is secured by the first fixed surface 81 of the first plate member 78 and the second fixed surface 83 of the second plate member 79 in the angle space 82, it looks like a conventional cubic mount member. Compared to the case where all the electronic components are mounted outside the cubic space, the volume of the entire sensor module 11f can be reduced. In addition, since the vibration isolator 77 is sandwiched between the angle member 76 and the interface board 12 in the sensor module 11f, the vibration is absorbed by the vibration isolator 77. Similar to the above, unnecessary resonance of the uniaxial angular velocity sensors (uniaxial acceleration sensors) 87 and 88 can be avoided.

  In such a sensor module 11 f, the third fixing surface 89 may be secured on the surface of the interface substrate 12. Thus, the perpendicular vectors of the first fixed surface 81, the second fixed surface 83, and the third fixed surface 89 can constitute three orthogonal axes. Triaxial angular velocity sensors can be provided by the uniaxial angular velocity sensor groups 87, 88, 91 supported on the three fixed surfaces 81, 83, 89, respectively. In this case, the vibration isolating material may be superimposed on the back side of the interface board 12 as in the fifth and sixth embodiments. An additional interface board 47 or an interface connector 71 may be connected to the interface board 12. The anti-vibration material may be sandwiched between the interface board 12 and the additional interface board 47 as in the fifth embodiment, and between the interface board 12 and the electronic device board as in the sixth embodiment. It may be sandwiched between. In such a case, the angle member 76 may be directly fixed to the interface board 12. In addition, the same reference numerals are assigned to the configurations and structures equivalent to those in the first to sixth embodiments. The technical idea of the fourth embodiment can be applied to the sensor module 11f according to the sixth embodiment.

(8) Sensor Module According to Eighth Embodiment FIG. 17 schematically shows a sensor module 11g according to the eighth embodiment of the present invention. In the eighth embodiment, a third plate member 92 is further added to the angle member 76 described above. Except for the 3rd board | plate material 92, what is necessary is just to be comprised similarly to the above-mentioned 7th Embodiment. The third plate member 92 is fixed to the interface board 12 in a posture that stands up from the surface of the interface board 12. The third plate member 92 divides the first wall surface of the second angle space 94 by the first plane 93 intersecting the virtual plane 22 while being in contact with the virtual plane 22. A plane 85 (the back side of the second fixed surface 83) of the second plate member 79 intersects the virtual plane 22 and defines a second wall surface of the second angle space 94. Here, the first plane 93 of the third plate 92 is orthogonal to the virtual plane 22 and the plane 85 of the second plate 79. The third plate member 92 and the second plate member 79 are connected to each other along one ridge line of the second angle space 94. In this way, a rectangular parallelepiped second angle space 94 is defined by the adjacent planes 93 and 85. The 1st board | plate material 78 and the 3rd board | plate material 92 should just be formed from one flat plate.

  In the eighth embodiment, the first fixing surface 81 and the back side plane 84 of the first plate member 78, the second fixing surface 83 and the back side plane 85 of the second plate member 79, and the first plane 93 of the third plate member 92. The flexible substrate 86 is overlaid on the second flat surface 95 on the back side. The flexible substrate 86 is bonded to the first plate member 78, the second plate member 79 and the third plate member 92. In this way, the electronic component 96 can be mounted on the first plane 93 and the second plane 95 of the third plate member 92. The mounting area of the electronic component is enlarged on the front and back of the third plate member 92. Like reference numerals are attached to the structure or components equivalent to those of the aforementioned first to seventh embodiments. The technical idea of the fourth embodiment can be applied to the sensor module 11g according to the eighth embodiment.

(9) Sensor Module According to Ninth Embodiment FIG. 18 schematically shows a sensor module 11h according to the ninth embodiment of the present invention. In the ninth embodiment, a fourth plate member 97 is further added to the angle member 76 described above. Except for the fourth plate member 97, it may be configured in the same manner as in the above-described eighth embodiment. The fourth plate member 97 is fixed to the interface board 12 so as to stand up from the surface of the interface board 12. The fourth plate member 97 divides the first wall surface of the third angle space 99 by the first plane 98 intersecting the virtual plane 22 while being in contact with the virtual plane 22. The second plane 95 (the back side of the first plane 93) of the third plate member 92 intersects the virtual plane 22 and defines the second wall surface of the third angle space 99. Here, the first plane 98 of the fourth plate member 97 is orthogonal to the virtual plane 22 and the second plane 95 of the third plate member 92. The fourth plate member 97 and the third plate member 92 are connected to each other along one ridge line of the third angle space 99. In this way, a rectangular parallelepiped third angle space 99 is defined by the adjacent planes 98 and 95. The 2nd board | plate material 79 and the 4th board | plate material 97 should just be formed from one flat plate.

  At the same time, the second plane 101 (the back side of the first plane 98) of the fourth plate member 97 intersects the virtual plane 22 and defines the first wall surface of the fourth angle space 102. A plane 84 (the back side of the first fixed surface 81) of the first plate member 78 intersects the virtual plane 22 and defines the second wall surface of the fourth angle space 102. Here, the second plane 101 of the fourth plate 97 is orthogonal to the virtual plane 22 and the plane 84 of the first plate 78. A rectangular parallelepiped fourth angle space 102 is thus partitioned by the adjacent planes 101 and 84.

  In the ninth embodiment, the first fixing surface 81 and the back side plane 84 of the first plate member 78, the second fixing surface 83 and the back side plane 85 of the second plate member 79, the first plane 93 and the back side of the third plate member 92. The flexible substrate 86 is overlaid on the second plane 95, the first plane 98 of the fourth plate member 97, and the second plane 101 on the back side. The flexible substrate 86 is bonded to the first plate member 78, the second plate member 79, the third plate member 92, and the fourth plate member 97. In this way, the electronic component 103 can be mounted on the first plane 98 and the second plane 101 of the fourth plate member 97. The mounting area of the electronic component is further expanded on the front and back of the fourth plate member 97. In addition, the same reference numerals are assigned to configurations and structures equivalent to those in the first to eighth embodiments. The technical idea of the fourth embodiment can be applied to the sensor module 11h according to the sixth embodiment.

(10) Electronic device The sensor modules 11, 11a, 11b, 11c, 11d, 11e, 11f, 11g, and 11h as described above can be incorporated into, for example, a digital still camera or a video camera. FIG. 19 shows a specific example of the digital still camera 111. The digital still camera 111 includes a lens set 112. The lens set 112 projects an image of the subject on the image sensor 113. For example, a CCD or CMOS sensor may be used for the image sensor 113. A camera shake correction mechanism 114 is connected to the lens set 112. The camera shake correction mechanism 114 moves a specific lens within the lens set 112 in accordance with the size of the camera shake. As a result, camera shake is corrected and an image is formed on the image sensor 113. An image signal is output from the image sensor 113. A controller 115 is connected to the camera shake correction mechanism 114 for realizing camera shake correction. A sensor module 11 (11a, 11b, 11c, 11d, 11e, 11f, 11g, 11h) as a camera shake detection device is connected to the controller 115. The controller 115 calculates the amount of lens movement according to the amount of camera shake detected by the sensor module 11 (11a, 11b, 11c, 11d, 11e, 11f, 11g, 11h). In addition, the sensor module 11 (11a, 11b, 11c, 11d, 11e, 11f, 11g, and 11h) according to the above-described embodiments includes a navigation device, a vehicle body posture detection device, a pointing device, a game controller, a head mounting display, and a mobile phone. It can be used by being incorporated in electronic devices such as a self-propelled cleaning robot and a radio control helicopter.

  Although the present embodiment has been described in detail as described above, it will be easily understood by those skilled in the art that many modifications can be made without departing from the novel matters and effects of the present invention. Therefore, all such modifications are included in the scope of the present invention. For example, a term described with a different term having a broader meaning or the same meaning at least once in the specification or the drawings can be replaced with the different term in any part of the specification or the drawings. Further, the configuration and operation of the sensor module, the electronic device, and the like are not limited to those described in the present embodiment, and various modifications can be made.

  11 (11a, 11b, 11c, 11d, 11e, 11f, 11g, 11h) Sensor module, 12 First interface board, 16 Mount member, 17 Elastic member (vibration isolator), 18 Leg (first leg), DESCRIPTION OF SYMBOLS 19 Leg (2nd leg), 21 Ceiling, 25 Cavity, 31 Mounting board (flexible board), 32 Sensor element (uniaxial angular velocity sensor), 33 Sensor element (uniaxial angular velocity sensor), 34 Central processing unit, 35 Fixed surface (first fixed surface), 36 Fixed surface (second fixed surface), 41 Fixed surface, 42 Sensor element (uniaxial angular velocity sensor), 45 First interface board, 46 Elastic member (vibration isolator), 47 Second Interface board, 52 legs (first leg), 53 legs (second leg), 54 ceiling, 59 cavity, 62 Nsa element (uniaxial angular velocity sensor), 63 sensor elements (uniaxial angular velocity sensor), 68 first interface substrate, 111 an electronic device (digital still camera).

Claims (8)

A mounting member including a leg and a ceiling connected to one end of the leg;
An electronic component including a sensor element,
The mount member is provided with a plurality of fixed surfaces having perpendicular vectors that are not parallel to each other, and at least two of the fixed surfaces are provided with the sensor element,
And at least 1 of the said electronic component is arrange | positioned in the cavity divided by the said leg and the said ceiling body, The sensor module characterized by the above-mentioned. The sensor module according to claim 1,
A mounting board having a plurality of mounting surfaces;
The sensor module, wherein the electronic component is mounted on each of the plurality of mounting surfaces. The sensor module according to claim 2,
A first interface board is coupled to the mounting board;
The sensor module, wherein the first interface board is connected to the leg. In the sensor module according to any one of claims 1 to 3,
The leg module includes an elastic member at the other end opposite to the one end. The sensor module according to claim 3, wherein
A second interface board superposed on the first interface board in plan view;
A sensor module comprising an elastic member between the first interface board and the second interface board. In the sensor module according to any one of claims 1 to 5,
A sensor module comprising at least one pair of the legs. In the sensor module according to any one of claims 1 to 6,
A sensor module, wherein a central processing unit is disposed on the ceiling in the cavity.   An electronic device comprising the sensor module according to claim 1.

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