JP2008190989A - Sensor device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sensor device capable of easily attaching the case to a measuring object while isolating the vibration of the case storing the sensor. <P>SOLUTION: The case 10 is integrated with a cover 40 by arranging an adhesive 30 for vibration isolation for absorbing the vibration that is received by the cover 40 from the measuring object between an opening end 16 of the case 10 storing the sensor and the cover 40 for covering a recessed part 13 of the case 10. Thus, the vibration is absorbed by the adhesive 30 for vibration isolation to prevent the vibration from transferring to a gyro sensor 21 in the case 10. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a sensor device in which a circuit board on which a sensor for detecting a physical quantity is mounted is housed in a case, and a manufacturing method thereof.

  In general, the angular velocity detected by the in-vehicle angular velocity sensor is a very low frequency vibration of, for example, 100 Hz or less, which is buried in vibrations of various frequencies of the vehicle. Therefore, in order to accurately detect the angular velocity, unnecessary vibrations of, for example, 100 Hz or more among vibrations input to the angular velocity sensor are absorbed by the vibration isolation member so that unnecessary vibrations are not transmitted to the sensing portion of the angular velocity sensor. There is a need to.

  Therefore, in an angular velocity sensor having a vibrator, a structure that absorbs unnecessary vibrations in all directions of vibration directions related to vibration characteristics of the vibrator is proposed in, for example, Patent Document 1. Specifically, in Patent Document 1, the base on which the vibrator is mounted has a curved portion that is curved so as to be convex in all directions orthogonal to the direction from the base toward the housing as the fixing member, and The housing is connected and fixed to the housing by an anti-vibration rubber having a hollow portion penetrating the whole in a direction from the base toward the housing.

When the base is fixed to the housing using the vibration isolating rubber, first, a base on which a vibrator is mounted, a vibration isolating rubber, and a housing are prepared. At this time, holes are provided in the four corners of the base, and holes are similarly provided in the housing. Then, both ends of the anti-vibration rubber are elastically deformed so as to be press-fitted into the holes of the base and the housing, and the edges of the holes are sandwiched. In this way, the base is fixed to the housing, and vibrations of the housing can be absorbed by the vibration isolating rubber.
JP 2000-55667 A

  However, the above-described conventional techniques require a step of preparing a vibration isolating rubber, a step of providing holes in the base and the housing in advance, a step of inserting the vibration isolating rubber into each hole provided in the base and the housing, and the like. For this reason, the mounting process for attaching the vibration-proof rubber between the base and the housing has become complicated.

  In recent years, all-in-one type small gyro units have been put into practical use due to the development of silicon micromachining technology. Although this gyro unit has an anti-vibration structure inside, it will be difficult to establish an anti-vibration structure in the gyro unit as the gyro unit becomes smaller in the future.

  Therefore, it is expected that further vibration isolation on the case side incorporating the gyro sensor is required. For this reason, the structure which can be easily attached to a measurement object is desired, isolating the case provided with the sensor.

  An object of this invention is to provide the sensor apparatus which can attach the said case to a measurement object easily, and its manufacturing method, anti-vibrating the case which accommodated the sensor in view of the said point.

  In order to achieve the above object, according to a first feature of the present invention, a circuit board (20) including a mounting component (21), a case (10) including an opening (11) for storing the circuit board, A mounting part is electrically connected to the outside, and is composed of a plurality of connector pins (12) fixed to the circuit board and a rod shape, and one end side of the rod shape is integrated with the case and the other. By arranging the terminal (14) whose end side is fixed to the circuit board, the cover (40, 44) fixed to the measurement object (50), and the open end (16) of the case and the cover. The case and the cover are integrated, and an anti-vibration adhesive (30) that absorbs vibration received from the measurement object by the cover is provided.

  Thereby, the vibration applied from the measurement object can be absorbed by the vibration-proofing adhesive, and the vibration of the measurement object can be prevented from being transmitted to the mounting component mounted on the circuit board in the case. In addition, since the vibration can be absorbed by the vibration-proof adhesive while the cover is fixed to the measurement object, the sensor device can be easily attached.

  In the second feature of the present invention, a circuit board (20) having a mounting component (21), a case (10) having an opening (11) for accommodating the circuit board, and the mounting component to be electrically connected to the outside. A plurality of connector pins (12) fixed to the circuit board and configured in a bar shape, one end side of the bar shape being integrated with the case and the other end side fixed to the circuit board The terminal (14) and the plate-shaped measurement object (50) having a step (51) are fixed so that the mounted components are arranged horizontally when the case is mounted. A cover (40, 44) fixed to the measurement object in a state where the plate is bent according to the level difference and the plate is bent, an open end (16) of the case, and a cover Be placed between the case and cover Are integrated, characterized in that the cover is provided with a vibration-proof adhesive that absorbs vibrations received from the measurement object (30).

  Thereby, without preparing a bracket separately, a sensor apparatus can be fixed to the place where a measurement object has a level | step difference, keeping the surface of the cover which installs a case horizontal. Even in such a case, the vibration of the cover can be absorbed by the vibration-proofing adhesive disposed between the opening end of the case and the cover.

  In this case, a groove (45) is provided at a position of the cover facing the opening end of the case, and the groove is filled with a vibration-proofing adhesive, and the opening end of the case is inserted into the vibration-proofing adhesive. Then, the case and the cover can be integrated by being wrapped in the vibration-proofing adhesive. Thereby, the opening end of a case can be reliably fixed with the vibration-proof adhesive.

  Also, the portion of the cover that faces the opening end of the case is a bumpy surface (46), and the vibration-proofing adhesive is sandwiched between the opening end of the case and the bumpy surface of the cover. The case and the cover may be integrated. Thereby, while increasing the area of a cover, the adhesion area of the vibration-proofing adhesive adhere | attached on a cover can be increased, and by extension, the adhesiveness of the vibration-proofing adhesive can be improved.

  Further, the vibration-proofing adhesive may be arranged so as to be sandwiched between the opening end of the case and the cover, and may be configured to wrap around the opening end of the case. Thereby, a cover can be reliably fixed to a case.

  And it is preferable that the anti-vibration adhesive exposed to the exterior of the case at least from between the case and the cover is covered with the coating agent (60).

  In the third feature of the present invention, a circuit board (20) is prepared by being fixedly accommodated in the opening (11) of the case (10) with a connector pin (12) and a terminal (14), and a cover ( 40, 44). And the opening end of a case and a cover are affixed using the vibration-proof adhesive (30), a case and a cover are integrated, and a cover is fixed to a measuring object, It is characterized by the above-mentioned.

  Thereby, the sensor apparatus provided with the vibration isolating function can be configured. Therefore, it is possible to easily attach the sensor device to the object to be measured while taking anti-vibration measures.

  According to a fourth aspect of the present invention, a circuit board (20) is prepared by being fixed and accommodated in an opening (11) of a case (10) with a connector pin (12) and a terminal (14). Also, a cover (40, 44) is prepared in which the plate is bent according to the step so that the mounting component (21) is horizontally arranged when the case is integrated. And the opening end of a case and a cover are affixed using the vibration-proof adhesive (30), a case and a cover are integrated, and a cover is fixed to a measuring object, It is characterized by the above-mentioned.

  Thereby, what can fix a sensor apparatus in the place where a measurement object has a level | step difference can be manufactured, keeping the surface which installs a case horizontal. Further, since the cover is only fixed to the measurement object having a step, it can be easily attached without using a bracket or the like.

  In this case, when preparing the cover, prepare a cover provided with a groove (45) at a location facing the open end of the case, and when integrating the case and the cover, the cover is protected in the groove of the cover. The case and the cover can be integrated by filling the vibration-proofing adhesive, inserting the opening end of the case into the vibration-proofing adhesive, and wrapping it with the vibration-proofing adhesive. Thereby, the opening end of a case can be reliably fixed with the vibration-proof adhesive.

  Also, when preparing the cover, prepare a cover with a bumpy surface (46) facing the opening end of the case, and when integrating the case and the cover, an anti-vibration adhesive Is sandwiched between the open end of the case and the rough surface of the cover, so that the case and the cover can be integrated. Thereby, the adhesion area of the vibration-proof adhesive with respect to a cover can be increased, and the adhesiveness of the vibration-proof adhesive can be improved.

  Furthermore, when the case and the cover are integrated, the vibration-proofing adhesive can be disposed between the opening end of the case and the cover, and can be disposed so as to wrap around the opening end of the case. Thereby, a cover can be reliably fixed to a case.

  And when integrating a case and a cover, a coating agent (60) can be covered with the vibration-proof adhesive exposed to the exterior of a case at least from between a case and a cover. Thereby, the characteristic fluctuation | variation of the vibration-proof adhesive by external environment can be prevented, and durability of the vibration-proof adhesive can be improved.

  In addition, the code | symbol in the bracket | parenthesis of each said means shows the correspondence with the specific means as described in embodiment mentioned later.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals in the drawings.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. The sensor device shown in the present embodiment is applied to, for example, a device that is mounted under the seat of a vehicle and detects a side slip or the like of the vehicle.

  1A and 1B are views showing a state in which a sensor device according to a first embodiment of the present invention is attached to a vehicle. FIG. 1A is a schematic sectional view of the sensor device, and FIG. It is A arrow directional view of (a) when attached. In addition, in FIG.1 (b), the partial cross section figure of the sensor apparatus corresponding to the direction of A arrow is shown.

  As shown in FIG. 1, the outer shape of the sensor device is configured by a case 10. The case 10 is formed by molding a resin such as PBT (polybutylene terephthalate). In this embodiment, as shown in FIG. 1, it is comprised as a substantially rectangular parallelepiped box.

  The case 10 is provided with an opening 11 whose bottom surface is open. A plurality of connector pins 12, which are L-shaped metal rod members, are arranged on one side surface of the case 10.

  One end side of the connector pin 12 protrudes into the opening 11 of the case 10 and is arranged in the direction in which the case 10 is opened. On the other hand, the other end side of the connector pin 12 is exposed inside a recess 13 provided on one side surface of the case 10.

  That is, the recess 13 serves as a connector portion for electrically connecting the other end of the connector pin 12 to an external circuit (for example, an external ECU) via a wiring member (not shown) such as a wire harness. Yes.

  In this embodiment, the connector pin 12 is made of brass plated with Sn (tin), and is held in the case 10 by being integrally formed with the case 10 by insert molding. In this connector pin 12, for example, four connector pins 12 for power supply, high signal output, low signal output, and ground are held in the case 10.

  On the other hand, as shown in FIG. 1A, a metal terminal 14 is installed on the side of the case 10 that faces the surface on which the connector pins 12 are insert-molded. In the terminal 14, one end side of the terminal 14 is insert-molded in the case 10, and the other end side faces the direction in which the case 10 is opened and is exposed from the case 10.

  As shown in FIG. 1, the circuit board 20 is disposed in the case 10 so as to close the opening 11 in the opening 11 of the case 10. Specifically, a plurality of holes (not shown) penetrating from the front surface to the back surface of the circuit board 20 are formed in the circuit board 20, and the respective tip portions of the terminal 14 and the connector pin 12 are inserted into the holes and soldered. As a result, the circuit board 20 is held in the case 10. Thus, the terminal 14 and the connector pin 12 serve as a fixing member that fixes the circuit board 20 in the case 10.

  At least the hole into which the terminal 14 is inserted is provided with an electrode (not shown) that is electrically connected to the circuit of the circuit board 20, and this electrode is not shown via a wiring provided on the circuit board 20. The computer and the circuit mounted on the circuit board 20 are electrically connected.

  A circuit board 20 has a gyro sensor 21 mounted on one surface thereof, and a circuit having a function of processing an electric signal of the gyro sensor 21 and outputting the electric signal to an external ECU is disposed. The gyro sensor 21 is accommodated in the room 15 of the case 10 that is formed by installing the circuit board 20 in the opening 11 of the case 10.

  The gyro sensor 21 detects the angular velocity of the vehicle. In the present embodiment, a vibration type that detects the angular velocity received by the gyro sensor 21 by detecting the vibration of the weight is employed. In such a vibration type gyro sensor 21, when an angular velocity is applied to a weight that vibrates in one direction (primary vibration), a so-called Coriolis force is generated in the weight, but the Coriolis force causes the weight to be orthogonal to the weight. Also uses the occurrence of vibration (secondary vibration). In the present embodiment, the secondary vibration is detected by the piezoelectric element and converted into an electric signal, and this electric signal is output to the circuit of the circuit board 20 as an angular velocity signal. The gyro sensor 21 corresponds to a part of the mounted component of the present invention.

  In this embodiment, the vibration-proof adhesive 30 is applied to the opening end 16 of the case 10, and the case 10 is attached to the plate-like cover 40 via the vibration-proof adhesive 30. As shown in FIG. 1, the vibration isolating adhesive 30 is sandwiched between the opening end 16 of the case 10 and the installation surface of the cover 40.

  As the vibration-proofing adhesive 30, a silicon-based adhesive having a damping characteristic against high-frequency vibration is employed. It is desirable that the vibration-proof adhesive 30 has vibration characteristics that are soft with respect to vertical vibration and hard with respect to the rotational direction in which the angular velocity is detected.

  The cover 40 is molded by resin, for example, and is provided with a flange portion 41 as shown in FIG. Further, a metal collar 42 is insert-molded on the flange portion 41, and the cover 40 is fixed to the measurement object 50 with bolts 43 through the metal collar 42.

  As described above, the case 10 is integrated with the cover 40 via the vibration-proofing adhesive 30 to constitute a sensor device. The sensor device is fixed to a measurement object 50 such as a vehicle by inserting a bolt 43 into the flange portion 41 of the cover 40. The above is the sensor device and its mounting structure according to the present embodiment.

  Next, a method for manufacturing the sensor device and a method for attaching the sensor device will be described. First, the case 10 in which the terminal 14 and the connector pin 12 are insert-molded is prepared. A circuit board 20 on which a gyro sensor 21, a microcomputer, and the like are mounted is prepared.

  Thereafter, the surface side of the circuit board 20 is inserted into the case 10 with the surface side toward the room 15 side of the case 10. At this time, the terminal 14 and the connector pin 12 pass through the holes provided in the circuit board 20, respectively. Then, the circuit board 20 is fixed by the terminal 14 and the connector pin 12 by soldering the terminal 14 and the connector pin 12.

  In addition, a plate-like cover 40 in which a metal collar 42 is insert-molded on the flange portion 41 is prepared. Then, the vibration-proof adhesive 30 is applied to the opening end 16 of the case 10, and the opening end 16 of the case 10 is attached to the cover 40.

  At this time, the vibration isolating adhesive 30 is sandwiched between the opening end 16 of the case 10 and the installation surface of the cover 40. In other words, the case 10 is attached to the cover 40 via the vibration-proofing adhesive 30 so that the open end 16 of the case 10 does not contact the installation surface of the cover 40. In this way, the sensor device shown in FIG. 1A is completed.

  Subsequently, a bolt 43 is inserted into the flange portion 41 of the cover 40 of the sensor device, and the sensor device is fixed to the measurement object 50 with the bolt 43. In this way, the sensor device is fixed to the measuring object 50 as shown in FIG.

  As described above, the present embodiment is characterized in that the case 10 constituting the sensor device and the cover 40 that closes the opening 11 of the case 10 are assembled using the vibration-proofing adhesive 30. Thereby, the vibration applied from the vehicle side that is the measurement object 50 is absorbed by the vibration isolating adhesive 30, and the vibration can be prevented from being transmitted to the case 10, that is, the gyro sensor 21.

  Further, since the vibration isolating adhesive 30 is sandwiched between the case 10 and the cover 40, the sensor device itself is configured to have a vibration isolating function. Thus, when attaching the sensor device to the measurement object 50, it is not necessary to prepare other parts for vibration isolation and to assemble this part. The sensor device can be easily attached to the measuring object 50 while taking measures.

(Second Embodiment)
In the present embodiment, only different parts from the first embodiment will be described. In the first embodiment, the anti-vibration adhesive 30 is simply disposed between the opening end 16 of the case 10 and the cover 40. For this reason, depending on the material of the vibration-proofing adhesive 30, there is a possibility that characteristic fluctuations may occur due to moisture absorption or the like, and it is preferable that the vibration-proofing adhesive 30 is not exposed. Therefore, the present embodiment is characterized in that the vibration-proofing adhesive 30 is protected from the external environment.

  FIG. 2 is an enlarged cross-sectional view of the vicinity of the open end 16 of the case 10 in the sensor device according to the second embodiment of the present invention. 2 corresponds to, for example, the cross-sectional view shown in FIG.

  As shown in FIG. 2, the vibration isolating adhesive 30 is disposed between the opening end 16 of the case 10 and the cover 40, and the coating agent 60 is provided so as to cover the outer periphery of the vibration isolating adhesive 30. Is provided. In the present embodiment, an insulating and adhesive resin is employed as the coating agent 60, and a material that hardens upon drying is employed.

  Such a coating agent 60 is applied on the vibration-proofing adhesive 30 so as to cover at least the outer periphery of the vibration-proofing adhesive 30 after the case 10 is attached to the cover 40 via the vibration-proofing adhesive 30. Is done.

  As described above, by applying the coating agent 60 to the vibration isolating adhesive 30, it is possible to prevent the characteristics of the vibration isolating adhesive 30 from fluctuating due to the external environment. Further, the durability of the vibration isolating adhesive 30 can be improved by the coating agent 60.

(Third embodiment)
In the present embodiment, only different portions from the above embodiments will be described. In each of the above embodiments, resin is used as the material of the cover 40. However, the present embodiment is characterized in that a metal is used as the material of the cover 40.

  FIG. 3 is a diagram showing a state in which the sensor device is fixed to a measurement object 50 having a step in the third embodiment of the present invention. FIG. 3 corresponds to, for example, the arrow view shown in FIG.

  As shown in FIG. 3, since the measurement object 50 has a step 51, it is difficult to install a sensor device on the measurement object 50 with the plate-shaped cover 40 shown in FIG. 1. Therefore, a plate-shaped metal cover 44 is employed. The cover 44 has a shape in which the plate is bent in accordance with the step 51 so that the gyro sensor 21 is horizontally disposed when the case 10 is mounted, and the cover 44 is in a state in which the plate is bent. It is fixed to the measurement object 50. That is, the metal cover 44 also has a function as a bracket.

  Thereby, a sensor apparatus can be fixed to the place where the measurement object 50 has the level | step difference 51, keeping the surface which installs the case 10 horizontal. In this case, since the cover 44 is made of metal, it is preferable to use an anti-vibration adhesive 30 that can be bonded to metal.

  As described above, when there is a step 51 in the measurement object 50 and it is difficult to attach the sensor device horizontally, the metal cover 44 is prepared and the cover 44 is deformed and used as a bracket. The sensor device can be fixed to the measuring object 50 while the gyro sensor 21 is disposed horizontally.

  Even in such a case, since the vibration isolating adhesive 30 is disposed between the opening end 16 of the case 10 and the cover 44, the vibration of the cover 44 is absorbed by the vibration isolating adhesive 30. be able to.

(Fourth embodiment)
In the present embodiment, only different parts from the first embodiment will be described. The present embodiment is characterized in that a groove portion is provided in the resin cover 40 and the opening end 16 of the case 10 is fixed in the groove portion.

  FIG. 4 is an enlarged cross-sectional view of the vicinity of the open end 16 of the case 10 in the sensor device according to the fourth embodiment of the present invention. As shown in this figure, a groove 45 is provided in the cover 40 at a position facing the open end 16 of the case 10. The groove 45 is provided when the cover 40 is molded or is processed after the cover 40 is molded.

  Then, the vibration isolating adhesive 30 is filled in the groove 45 and the opening end 16 of the case 10 is inserted into the groove 45. In this case, the wall surface of the groove 45 and the open end 16 of the case 10 are prevented from contacting each other. In this way, the cover 40 is attached to the case 10.

  As described above, the groove portion 45 is provided in the cover 40, and the opening end 16 of the case 10 is fixed in the groove portion 45 with the vibration-proofing adhesive 30, so that the opening end 16 of the case 10 can be easily positioned. The open end 16 of the case 10 can be securely fixed with the vibration isolating adhesive 30.

(Fifth embodiment)
In the present embodiment, only different parts from the first embodiment will be described. The present embodiment is characterized in that the surface of the covers 40 and 44 on which the case 10 is installed is roughened to increase the bonding area of the vibration-proofing adhesive 30.

  FIG. 5 is an enlarged cross-sectional view of the vicinity of the open end 16 of the case 10 in the sensor device according to the fifth embodiment of the present invention. As shown in this figure, the covers 40, 44 are provided with a rough surface 46 having a rough surface. The vibration isolating adhesive 30 is disposed so as to be sandwiched between the open end 16 of the case 10 and the rough surface 46 of the cover 40.

  As a result, the bonding area of the vibration-proofing adhesive 30 to the covers 40 and 44 is greater when the rough surfaces 46 are provided on the covers 40 and 44 than when the rough surfaces 46 are not provided on the covers 40 and 44. And the adhesive strength of the vibration-proofing adhesive 30 can be improved.

  As described above, the rough surface 46 can be provided on the covers 40 and 44 to increase the degree of adhesion of the vibration-proofing adhesive 30 to the covers 40 and 44.

(Sixth embodiment)
In the present embodiment, only different parts from the first embodiment will be described. The present embodiment is characterized in that the opening end 16 of the case 10 is wrapped and fixed with an anti-vibration adhesive 30.

  FIG. 6 is an enlarged cross-sectional view of the vicinity of the open end 16 of the case 10 in the sensor device according to the sixth embodiment of the present invention. As shown in this figure, the vibration isolating adhesive 30 is disposed so as to be sandwiched between the opening end 16 of the case 10 and the covers 40 and 44, and the vibration isolating adhesive 30 is disposed in the opening of the case 10. It is arranged to wrap around the end 16. Such a method is particularly effective for the metal covers 40 and 44 that are difficult to process.

  By doing in this way, the adhesion area of the vibration-proofing adhesive 30 to the opening end 16 of the case 10 can be increased, and the covers 40 and 44 can be securely fixed to the case 10.

(Other embodiments)
In the third embodiment, the coating agent 60 shown in the second embodiment may be applied to the vibration-proofing adhesive 30. In the third embodiment, the metal cover 44 is used, but a resin cover 40 may be used.

  In the fourth embodiment, the groove portion 45 is provided in the resin cover 40, but the groove portion 45 may be provided in the metal cover 44.

  In the fifth embodiment, the rough surfaces 46 are provided on the covers 40, 44 to increase the bonding area of the vibration-proofing adhesive 30. However, the rough surfaces 46 are provided on the opening ends 16 of the case 10 to adhere to the case 10. The area can be expanded. Also in the fifth embodiment, the coating agent 60 shown in the second embodiment may be applied to the outer periphery of the vibration-proofing adhesive 30.

  In the sixth embodiment, the vibration-proofing adhesive 30 is provided so as to wrap the opening end 16 of the case 10, but the rough surface 46 shown in the fifth embodiment may be provided in the covers 40 and 44. Of course, also in the sixth embodiment, the coating agent 60 shown in the second embodiment can be applied to the outer periphery of the vibration-proofing adhesive 30.

It is the figure which showed a mode that the sensor apparatus which concerns on 1st Embodiment of this invention was attached to the vehicle, (a) is a schematic sectional drawing of a sensor apparatus, (b) is when a sensor apparatus is attached to a measuring object. It is A arrow directional view of (a). It is sectional drawing which expanded the vicinity of the opening end of a case among the sensor apparatuses which concern on 2nd Embodiment of this invention. In 3rd Embodiment of this invention, it is the figure which showed a mode that the sensor apparatus was fixed to the measuring object with a level | step difference. It is sectional drawing which expanded the vicinity of the opening end of a case among the sensor apparatuses which concern on 4th Embodiment of this invention. It is sectional drawing which expanded the vicinity of the opening end of a case among the sensor apparatuses which concern on 5th Embodiment of this invention. It is sectional drawing to which the vicinity of the opening end of a case was expanded among the sensor apparatuses which concern on 6th Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Case, 11 ... Opening part, 12 ... Connector pin, 14 ... Terminal, 16 ... Opening end, 20 ... Circuit board, 21 ... Gyro sensor, 30 ... Anti-vibration adhesive, 40, 44 ... Cover, 45 ... Groove part 46 ... rough surface, 50 ... measurement object, 51 ... step, 60 ... coating agent.

Claims (12)

A circuit board (20) provided with a mounting component (21);
A case (10) having an opening (11) for accommodating the circuit board;
A plurality of connector pins (12) for electrically connecting the mounting component to the outside and fixed to the circuit board;
A terminal (14) configured in a rod shape, one end side of the rod shape being integrated with the case and the other end side being fixed to the circuit board;
Covers (40, 44) fixed to the measurement object (50);
An anti-vibration adhesive (1) that is disposed between the opening end (16) of the case and the cover so that the case and the cover are integrated, and the cover absorbs vibration received from the measurement object. 30), and a sensor device. A circuit board (20) provided with a mounting component (21);
A case (10) having an opening (11) for accommodating the circuit board;
A plurality of connector pins (12) for electrically connecting the mounting component to the outside and fixed to the circuit board;
A terminal (14) configured in a rod shape, one end side of the rod shape being integrated with the case and the other end side being fixed to the circuit board;
The plate is fixed to a measurement object (50) having a step (51), and the plate is arranged so that the mounting component is arranged horizontally when the case is integrated. Covers (40, 44) that are bent according to a step and are fixed to the measurement object in a state where the plate is bent;
An anti-vibration adhesive (1) that is disposed between the opening end (16) of the case and the cover so that the case and the cover are integrated, and the cover absorbs vibration received from the measurement object. 30), and a sensor device. A groove (45) is provided in the cover at a location facing the open end of the case, and the anti-vibration adhesive is filled in the groove, and the open end of the case is filled with the anti-vibration adhesive. 3. The sensor device according to claim 1, wherein the case and the cover are integrated by being inserted and wrapped in the vibration-proofing adhesive. A portion of the cover that faces the opening end of the case is a bumpy surface (46), and the anti-vibration adhesive is sandwiched between the opening end of the case and the bumpy surface of the cover. The sensor device according to claim 1, wherein the case and the cover are integrated. 2. The vibration isolating adhesive is disposed so as to be sandwiched between an opening end of the case and the cover, and is disposed so as to wrap around the opening end of the case. Or the sensor apparatus of 2. 6. The anti-vibration adhesive exposed to the outside of the case from at least between the case and the cover is covered with a coating agent (60). Sensor device. A circuit board (20) provided with a mounting component (21);
A case (10) having an opening (11) for accommodating the circuit board;
A plurality of connector pins (12) for electrically connecting the mounting component to the outside and fixed to the circuit board;
A terminal (14) configured in a rod shape, one end side of the rod shape being integrated with the case and the other end side being fixed to the circuit board;
Covers (40, 44) fixed to the measurement object (50);
An anti-vibration adhesive (1) that is disposed between the opening end (16) of the case and the cover so that the case and the cover are integrated, and the cover absorbs vibration received from the measurement object. 30) and a method of attaching the sensor device to the measurement object,
Preparing the circuit board fixed and stored by the connector pin and the terminal in the opening of the case;
Preparing the cover;
A method for manufacturing a sensor device, comprising: attaching the open end of the case and the cover using the vibration-proofing adhesive, and integrating the case and the cover. A circuit board (20) provided with a mounting component (21);
A case (10) having an opening (11) for accommodating the circuit board;
A plurality of connector pins (12) for electrically connecting the mounting component to the outside and fixed to the circuit board;
A terminal (14) configured in a rod shape, one end side of the rod shape being integrated with the case and the other end side being fixed to the circuit board;
The plate is shaped to be fixed to a measurement object (50) having a step (51), and when the case is mounted, the plate is placed on the step so that the mounting component is disposed horizontally. And a cover (40, 44) fixed to the measurement object in a state where the plate is bent,
An anti-vibration adhesive (1) that is disposed between the opening end (16) of the case and the cover so that the case and the cover are integrated, and the cover absorbs vibration received from the measurement object. 30) and a method of attaching the sensor device to the measurement object,
Preparing the circuit board fixed and stored by the connector pin and the terminal in the opening of the case;
Providing the cover having a shape in which the plate is bent according to the step so that the mounting component is horizontally disposed when the case is integrated;
A method for manufacturing a sensor device, comprising: attaching the open end of the case and the cover using the vibration-proofing adhesive, and integrating the case and the cover. In the step of preparing the cover, a cover provided with a groove (45) at a location facing the opening end of the case is prepared.
In the step of integrating the case and the cover, the anti-vibration adhesive is filled in the groove portion of the cover, and the opening end of the case is inserted into the anti-vibration adhesive so as to bond the anti-vibration The method for manufacturing a sensor device according to claim 7 or 8, wherein the case and the cover are integrated by wrapping with an agent. In the step of preparing the cover, a portion of the cover facing the open end of the case is a bumpy surface (46),
In the step of integrating the case and the cover, the case and the cover are integrated by sandwiching the vibration-proofing adhesive between the opening end of the case and the bumpy surface of the cover. The method of manufacturing a sensor device according to claim 7 or 8, wherein: In the step of integrating the case and the cover, the vibration-proofing adhesive is disposed between the opening end of the case and the cover, and is disposed so as to wrap around the opening end of the case. A method for manufacturing a sensor device according to claim 7 or 8. The step of integrating the case and the cover includes a step of covering the anti-vibration adhesive exposed to the outside of the case from at least between the case and the cover with a coating agent (60). The method for manufacturing a sensor device according to claim 7, wherein:

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