JP3858760B2 - Electronic control device for automobile and its assembling method - Google Patents

Electronic control device for automobile and its assembling method Download PDF

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Publication number
JP3858760B2
JP3858760B2 JP2002147715A JP2002147715A JP3858760B2 JP 3858760 B2 JP3858760 B2 JP 3858760B2 JP 2002147715 A JP2002147715 A JP 2002147715A JP 2002147715 A JP2002147715 A JP 2002147715A JP 3858760 B2 JP3858760 B2 JP 3858760B2
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circuit board
moisture
proof material
wiring member
case
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JP2003338591A (en
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隆通 神谷
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Denso Corp
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Denso Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、自動車用電子制御装置の耐振防湿構造に関するものである。
【０００２】
【従来の技術】
自動車用電子制御装置をエンジンに直接搭載する、いわゆるエンジン直載方式が採られるなど、装置の振動環境が厳しくなってきている。一方、自動車用電子制御装置のケース内部での電気的接続部の防湿方法として、一般にゲル塗布を行っている。つまり、電子制御装置における防湿方法として完全防水構造とすると、筐体や防水検査費用等のコストアップが考えられ、低コストで実現可能なゲル状防湿材塗布が一般的である。さらに、エンジン等への装置搭載面積は小さく、放熱性も向上させる方法として、ケース内に収納される回路基板とコネクタを可撓性配線部材にて電気的に接続する、いわゆるフレキ接続する手法がある。
【０００３】
このフレキ接続する手法を採用した放熱構造においてゲル防湿を適用すると、図６に示すようになる。図６において、電子制御装置のケースはベースプレート１００とカバー１０１にて構成されている。ケース内において回路基板１０２が固定され、この回路基板１０２にはワイヤーボンディングにて電子部品１０３が実装されている。また、カバー１０１にはコネクタ１０４が取り付けられ、回路基板１０２とコネクタ１０４とは可撓性配線部材１０５にて電気的に接続されている。回路基板１０２はゲル状防湿材（樹脂）１０６にて被覆されるとともにコネクタ１０４での可撓性配線部材１０５の接続部はゲル状防湿材（樹脂）１０７にて被覆されている。
【０００４】
ところが、図６の場合、エンジン等の振動により可撓性配線部材１０５の可動部が振動し、これによりゲル状防湿材１０６を振動させ、ゲル状防湿材１０６に包まれた電子部品接続部（ワイヤーボンディング部）が振動ストレスにより破断する可能性がある。
【０００５】
ゲル状防湿材１０６は一般にフレキ要因でなくともエンジン等の振動による揺れの影響を最小にするため、高針入度のものを用いるが、構造的に振幅が大きいフレキ振動に対応できるほどに高針入度のもの（柔らかいもの）では図６のように例えばエンジンブロックの側面に設置する場合等のエンジン上の装置組付け方向によってはケース内でのゲル保持が困難になり防湿性を損なう可能性がある。
【０００６】
また逆に、図７のように、熱硬化性樹脂等の固体状防湿材（低針入度の樹脂）１１０，１１１を用いて可撓性配線部材１０５の振動（フレキ振動）を吸収してしまう方法が考えられる。この場合、その防湿材１１０，１１１と可撓性配線部材１０５及び基板側電子部品のボンディング材１１２の線膨張係数が全て同じということは通常あり得ないため、やはりいずれかの接続部に破断を生ずる可能性があるという問題がある。つまり、接続寿命等を考慮すると防湿材選定が極めて困難である。
【０００７】
【発明が解決しようとする課題】
本発明はこのような背景の下になされたものであり、その目的は、可撓性配線部材の振動によるワイヤーボンディング部の破損を容易に防止することができる自動車用電子制御装置およびその組立方法を提供することにある。
【０００８】
【課題を解決するための手段】
請求項１に記載の自動車用電子制御装置は、可撓性配線部材における回路基板への接合箇所を固体状防湿材によって被覆するとともに、ケース内の部品収納空間において回路基板での部品実装面にワイヤーボンディング部を含めて電子部品を被覆するようにゲル状防湿材を配置する構成を採っている。
【０００９】
この構成により、可撓性配線部材の可動部での振動が、部品実装面に配したゲル状防湿材に伝わりにくくなる。その結果、可撓性配線部材の振動によるワイヤーボンディング部の破損を容易に防止することができる。
【００１０】
請求項２に記載のごとく、固体状防湿材は可撓性配線部材と線膨張係数が適合しているものとするとよい。
請求項３に記載のように、固体状防湿材によって、部品実装面に配したゲル状防湿材の表面から突出するまで可撓性配線部材を被覆すると、振動がゲル状防湿材に、より伝わりにくくなる。
【００１１】
特に、請求項４に記載のように、車載エンジンに直接搭載される場合に好ましいものとなる。
自動車用電子制御装置の組立方法としては、請求項５に記載のように、ワイヤーボンディングにて電子部品を実装した回路基板に対し可撓性配線部材の一端を接合する工程と、前記可撓性配線部材における前記回路基板への接合箇所を固体状防湿材にて被覆する工程と、ケース内の部品収納空間において前記回路基板を固定する工程と、前記ケース内の部品収納空間において前記回路基板での部品実装面に、ワイヤーボンディング部を含めて電子部品を被覆するようにゲル状防湿材を配置する工程と、前記可撓性配線部材の他端に嵌合ピンを有するコネクタを接合する工程と、前記可撓性配線部材における前記コネクタへの接合箇所を防湿材にて被覆する工程と、前記コネクタを前記ケースに取り付ける工程と、を具備するものとする。あるいは、請求項６に記載のように、ワイヤーボンディングにて電子部品を実装した回路基板に対し可撓性配線部材の一端を接合する工程と、前記可撓性配線部材における前記回路基板への接合箇所を固体状防湿材にて被覆する工程と、ケース内の部品収納空間において前記回路基板を固定する工程と、前記可撓性配線部材の他端に嵌合ピンを有するコネクタを接合する工程と、前記ケース内の部品収納空間において前記回路基板での部品実装面に、ワイヤーボンディング部を含めて電子部品を被覆するようにゲル状防湿材を配置する工程と、前記可撓性配線部材における前記コネクタへの接合箇所を防湿材にて被覆する工程と、前記コネクタを前記ケースに取り付ける工程と、を具備するものとする。あるいは、請求項７に記載のように、ワイヤーボンディングにて電子部品を実装した回路基板に対し可撓性配線部材の一端を接合する工程と、前記可撓性配線部材における前記回路基板への接合箇所を固体状防湿材にて被覆する工程と、ケース内の部品収納空間において前記回路基板を固定する工程と、前記可撓性配線部材の他端に嵌合ピンを有するコネクタを接合する工程と、前記可撓性配線部材における前記コネクタへの接合箇所を防湿材にて被覆する工程と、前記ケース内の部品収納空間において前記回路基板での部品実装面に、ワイヤーボンディング部を含めて電子部品を被覆するようにゲル状防湿材を配置する工程と、前記コネクタを前記ケースに取り付ける工程と、を具備するものとする。
【００１２】
このような組立方法により請求項１に記載の自動車用電子制御装置を得ることができる。
【００１３】
【発明の実施の形態】
以下、この発明を具体化した一実施の形態を図面に従って説明する。
図１には、本実施形態における自動車用電子制御装置１をエンジンブロック６０の側面に取り付けた状態での断面図を示す。つまり、自動車用電子制御装置１がエンジンルームにおいて車載エンジンに直接搭載された状態を想定している。図２は、電子制御装置１の単体での断面図である。
【００１４】
図２において、電子制御装置１のケース１０は、ベースプレート１１とカバー１２にて構成され、ケース１０の内部が部品収納空間Ｒ１となっている。ケース１０内の部品収納空間Ｒ１において、ベースプレート１１の上面には回路基板（例えば、セラミック基板）２０が固定されている。回路基板２０の上面には各種の電子部品が搭載されており、図２においては半導体チップ２１がワイヤーボンディングにて実装されている状態を示す。即ち、ワイヤー２２にて半導体チップ２１と回路基板２０での配線（導体パターン）が電気的に接続されている。半導体チップ２１を含めた回路基板２０に実装した各種の電子部品により電子制御回路が形成されている。また、実装した各種の電子部品は発熱素子を含み、発生する熱は回路基板２０、ベースプレート１１を介してエンジンブロック６０（図１参照）に逃がされると共にケース１０を介してエンジンルーム空間に逃がされる。
【００１５】
また、ケース１０のカバー１２にはコネクタ３０が取り付けられている。コネクタ３０は嵌合ピン３１を有し、嵌合ピン３１の固定端が接続部３２となっている。ケース１０内の部品収納空間Ｒ１において、可撓性配線部材としてのフレキシブルプリント配線板４０にて回路基板２０とコネクタ３０の嵌合ピン３１の接続部３２とが電気的に接続されている。つまり、フレキシブルプリント配線板４０の一端が回路基板２０と接合されるとともにフレキシブルプリント配線板４０の他端がコネクタ３０の接続部３２と接合されている。
【００１６】
フレキシブルプリント配線板４０における回路基板２０への接合箇所は固体状防湿材５０にて被覆されている。固体状防湿材５０は熱硬化性エポキシ樹脂等よりなる。また、固体状防湿材５０はフレキシブルプリント配線板４０と線膨張係数が適合、即ち、ほぼ一致している。一方、フレキシブルプリント配線板４０におけるコネクタ３０への接合箇所はゲル状防湿材５１にて被覆されている。さらに、ケース１０内の部品収納空間Ｒ１において回路基板２０での部品実装面にゲル状防湿材５２が配置され、このゲル状防湿材５２によってワイヤーボンディング部を含めて電子部品２１が被覆されている。ゲル状防湿材５１，５２には高針入度のシリコン樹脂を用いている。ここで、前述の固体状防湿材５０は、部品実装面に配したゲル状防湿材５２の表面５２ａから突出するまでフレキシブルプリント配線板４０を被覆している。
【００１７】
図２のように構成した自動車用電子制御装置１が、図１に示すように、エンジンブロック６０に取り付けられる。コネクタ３０には相手方のコネクタが接続され、このコネクタから延びるケーブルを介してセンサ・スイッチ類やアクチュエータが接続される。電子制御装置１はエンジンを制御する機器であって、マイコンを内蔵しており、エンジン運転状態を検出する信号（各種センサ信号やスイッチ信号等）を入力して最適なエンジン運転を行わせるための演算を行い、アクチュエータ（点火装置や燃料噴射装置）に駆動信号を出力する。
【００１８】
図１において、エンジンが駆動すると、振動が電子制御装置１に伝わる。この振動によりフレキシブルプリント配線板４０の可動部が振動する。
ここで、本実施形態においてはゲル状防湿材５２の内部のフレキシブルプリント配線板４０は熱硬化性樹脂等の固体状防湿材５０で覆われている。よって、エンジン振動によるフレキシブルプリント配線板４０の可動部での振動は固体状防湿材５０で吸収され、振動がゲル状防湿材５２に伝わりにくい。このようにしてゲル状防湿材５２への振動伝達は生じにくく、ゲル状防湿材５２に包まれた電子部品２１でのボンディング部（回路基板２０に実装した電子部品２１でのワイヤー接続部）がその振動ストレスにより破断することを抑制することができる。
【００１９】
なお、固体状防湿材５０の線膨張係数は、フレキシブルプリント配線板４０の接続部との相性のみ考慮すればよく選定は容易である。固体状防湿材５０は、線膨張係数や振動吸収性（硬度）等の必要機能を満足すれば具体的材質は問わない。
【００２０】
以上のごとく、ゲル状防湿材５２のみの防湿では、エンジン等の振動がフレキシブルプリント配線板４０→ゲル状防湿材５２→基板実装部品２１の接続部へと伝わり、そのストレスで接続部が破断しやすいが、本実施形態ではこれを回避でき、完全防水設計に比べ安価な防湿材塗布による防湿構造となる。即ち、エンジン等の駆動に伴なうフレキシブルプリント配線板４０の振動によるワイヤーボンディング部の破損を容易に防止することができ、ひいては製品コストを低減できる。
【００２１】
特に、固体状防湿材５０はフレキシブルプリント配線板４０のみと線膨張係数を適合させればよく、３つ（防湿材とフレキ材とボンディングワイヤーの３つ）以上の線膨張係数を考慮する必要がなく、固体状防湿材の選定が容易である。
【００２２】
また、固体状防湿材５０はゲル状防湿材５２の表面５２ａよりも突出してフレキシブルプリント配線板４０を覆っていることが望ましい。つまり、フレキシブルプリント配線板４０の振動をゲル状防湿材５２に伝えにくいという機能をより発揮させるべく、固体状防湿材５０の塗布量はゲル状防湿材５２の表面５２ａから突出させるに必要な最少量でよい。
【００２３】
なお、図１ではエンジン直載の自動車用電子制御装置を想定したが、エンジン直載でない自動車用電子制御装置に本構造を適用することができる。
次に、自動車用電子制御装置の組立方法を、図３〜図５を用いて説明する。
【００２４】
図３（ａ）に示すように、回路基板２０にワイヤーボンディングにて電子部品２１を実装する。そして、この回路基板２０に対しフレキシブルプリント配線板４０の一端を接合する。
【００２５】
引き続き、図３（ｂ）に示すように、フレキシブルプリント配線板４０を保持した状態で、フレキシブルプリント配線板４０における回路基板２０への接合箇所を固体状防湿材５０で被覆する。詳しくは、樹脂を塗布した後に硬化処理する。
【００２６】
その後、図３（ｃ）に示すように、ベースプレート１１の上面に回路基板２０を接着する。そして、図４（ａ）に示すように、ベースプレート１１にカバー１２を装着するとともにフレキシブルプリント配線板４０の端部をカバー穴１２ａから取り出す。このようにして、ケース１０内の部品収納空間Ｒ１において回路基板２０を固定する。
【００２７】
引き続き、図４（ｂ）に示すように、ケース１０内の部品収納空間Ｒ１において回路基板２０での部品実装面に、ワイヤーボンディング部を含めて電子部品２１を被覆するようにゲル状防湿材５２を配置する（注入する）。
【００２８】
さらに、図５（ａ）に示すように、フレキシブルプリント配線板４０の他端にコネクタ３０を接合する。
そして、図５（ｂ）に示すように、フレキシブルプリント配線板４０におけるコネクタ３０への接合箇所をゲル状防湿材５１にて被覆する。
【００２９】
さらに、図２に示すように、コネクタ３０をケース１０のカバー１２に接着し取り付ける。
なお、図３〜図５では、回路基板２０をケース１０内に固定した後において、（１）ゲル状防湿材５２を配置し、（２）フレキシブルプリント配線板４０の他端にコネクタ３０を接合し、（３）フレキシブルプリント配線板４０におけるコネクタ３０への接合箇所をゲル状防湿材５１にて被覆し、（４）コネクタ３０をケース１０に取り付けた。これに代わりゲル状防湿材５２の配置順序を次のようにしてもよい。
【００３０】
回路基板２０をケース１０内に固定した後、（１）フレキシブルプリント配線板４０の他端にコネクタ３０を接合し、（２）ゲル状防湿材５２を配置し、（３）フレキシブルプリント配線板４０におけるコネクタ３０への接合箇所をゲル状防湿材５１にて被覆し、（４）コネクタ３０をケース１０に取り付けるようにしてもよい。
【００３１】
あるいは、回路基板２０をケース１０内に固定した後、（１）フレキシブルプリント配線板４０の他端にコネクタ３０を接合し、（２）フレキシブルプリント配線板４０におけるコネクタ３０への接合箇所をゲル状防湿材５１にて被覆し、（３）ゲル状防湿材５２を配置し、（４）コネクタ３０をケース１０に取り付けるようにしてもよい。
【００３２】
また、フレキシブルプリント配線板４０におけるコネクタ３０への接合箇所はゲル状防湿材５１によって被覆したが、固体状防湿材にて被覆してもよい。
【図面の簡単な説明】
【図１】実施の形態における自動車用電子制御装置をエンジンに搭載した状態での断面図。
【図２】自動車用電子制御装置の断面図。
【図３】（ａ）〜（ｃ）は自動車用電子制御装置の組立方法を説明するための図。
【図４】（ａ），（ｂ）は自動車用電子制御装置の組立方法を説明するための図。
【図５】（ａ），（ｂ）は自動車用電子制御装置の組立方法を説明するための図。
【図６】従来技術を説明するための自動車用電子制御装置の断面図。
【図７】従来技術を説明するための自動車用電子制御装置の断面図。
【符号の説明】
１…自動車用電子制御装置、１０…ケース、１１…ベースプレート、１２…カバー、２０…回路基板、２１…電子部品、２２…ワイヤー、３０…コネクタ、３１…嵌合ピン、４０…フレキシブルプリント配線板、５０…固体状防湿材、５１…ゲル状防湿材、５２…ゲル状防湿材、６０…エンジンブロック、Ｒ１…部品収納空間。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a vibration-proof and moisture-proof structure for an electronic control device for automobiles.
[0002]
[Prior art]
The vibration environment of the apparatus has become severe, such as a so-called engine direct mounting system in which an automobile electronic control apparatus is directly mounted on an engine. On the other hand, gel application is generally performed as a moisture-proof method for the electrical connection part inside the case of the electronic control unit for automobiles. That is, if a completely waterproof structure is used as a moisture-proof method in an electronic control device, cost increases such as housing and waterproof inspection costs can be considered, and gel-type moisture-proof material application that can be realized at low cost is common. Furthermore, as a method of improving the heat dissipation by reducing the device mounting area to the engine or the like, there is a so-called flexible connection method in which the circuit board housed in the case and the connector are electrically connected by a flexible wiring member. is there.
[0003]
When gel moisture-proofing is applied to the heat dissipation structure employing this flexible connection technique, the result is as shown in FIG. In FIG. 6, the case of the electronic control unit is composed of a base plate 100 and a cover 101. A circuit board 102 is fixed in the case, and an electronic component 103 is mounted on the circuit board 102 by wire bonding. A connector 104 is attached to the cover 101, and the circuit board 102 and the connector 104 are electrically connected by a flexible wiring member 105. The circuit board 102 is covered with a gel moisture-proof material (resin) 106, and the connection portion of the flexible wiring member 105 at the connector 104 is covered with a gel-like moistureproof material (resin) 107.
[0004]
However, in the case of FIG. 6, the movable part of the flexible wiring member 105 vibrates due to vibration of the engine or the like, thereby vibrating the gel moisture-proof material 106, and the electronic component connecting portion ( There is a possibility that the wire bonding part) is broken by vibration stress.
[0005]
In general, the gel moisture-proof material 106 has a high penetration so as to minimize the influence of vibration caused by engine vibrations, even if it is not a flexible factor. In the case of a softer one, it may be difficult to hold the gel in the case depending on the assembly direction of the device on the engine, for example, when it is installed on the side of the engine block as shown in FIG. is there.
[0006]
On the contrary, as shown in FIG. 7, the vibration (flexible vibration) of the flexible wiring member 105 is absorbed using solid moisture-proof materials (low penetration resin) 110 and 111 such as thermosetting resin. It is possible to think In this case, since the coefficient of linear expansion of the moisture-proof material 110, 111, the flexible wiring member 105, and the bonding material 112 of the board-side electronic component cannot be all the same, any one of the connecting portions is broken. There is a problem that may occur. That is, considering the connection life and the like, it is extremely difficult to select a moisture-proof material.
[0007]
[Problems to be solved by the invention]
The present invention has been made under such a background, and an object of the present invention is to provide an electronic control device for an automobile and an assembling method thereof that can easily prevent damage to a wire bonding portion due to vibration of a flexible wiring member. Is to provide.
[0008]
[Means for Solving the Problems]
The electronic control device for an automobile according to claim 1 covers the joint portion of the flexible wiring member to the circuit board with a solid moisture-proof material, and on the component mounting surface of the circuit board in the component storage space in the case. The structure which arrange | positions a gel-like moistureproof material so that an electronic component is coat | covered including a wire bonding part is taken.
[0009]
With this configuration, vibrations at the movable portion of the flexible wiring member are not easily transmitted to the gel moistureproof material disposed on the component mounting surface. As a result, breakage of the wire bonding portion due to vibration of the flexible wiring member can be easily prevented.
[0010]
As described in claim 2, it is preferable that the solid moisture-proof material has a linear expansion coefficient compatible with that of the flexible wiring member.
As described in claim 3, when the flexible wiring member is covered with the solid moisture-proof material until it protrudes from the surface of the gel-like moisture-proof material arranged on the component mounting surface, the vibration is further transmitted to the gel-like moisture-proof material. It becomes difficult.
[0011]
In particular, as described in claim 4, it is preferable when it is directly mounted on an in-vehicle engine.
As an assembly method of an electronic control device for automobiles, as described in claim 5, a step of joining one end of a flexible wiring member to a circuit board on which electronic components are mounted by wire bonding, and the flexibility A step of covering a wiring member with a solid moistureproof material, a step of fixing the circuit board in a component housing space in the case, and a step of covering the circuit board in the component housing space in the case. A step of disposing a gel moisture-proof material so as to cover the electronic component including the wire bonding portion on the component mounting surface, and a step of joining a connector having a fitting pin to the other end of the flexible wiring member; And a step of covering the joint portion of the flexible wiring member to the connector with a moisture-proof material, and a step of attaching the connector to the case. Alternatively, as described in claim 6, the step of joining one end of the flexible wiring member to the circuit board on which the electronic component is mounted by wire bonding, and the joining of the flexible wiring member to the circuit board A step of covering the portion with a solid moistureproof material, a step of fixing the circuit board in a component housing space in the case, and a step of joining a connector having a fitting pin to the other end of the flexible wiring member, A step of disposing a gel moisture-proof material on the component mounting surface of the circuit board in the component storage space in the case so as to cover the electronic component including the wire bonding portion, and the flexible wiring member It is assumed that the method includes a step of covering a joint portion to the connector with a moisture-proof material and a step of attaching the connector to the case. Alternatively, as described in claim 7, a step of joining one end of a flexible wiring member to a circuit board on which an electronic component is mounted by wire bonding, and joining of the flexible wiring member to the circuit board A step of covering the portion with a solid moistureproof material, a step of fixing the circuit board in a component housing space in the case, and a step of joining a connector having a fitting pin to the other end of the flexible wiring member, An electronic component including a wire bonding portion on the component mounting surface of the circuit board in the component housing space in the component housing space in the step of covering the joint portion of the flexible wiring member to the connector with a moisture-proof material A step of disposing a gel moisture-proof material so as to cover the substrate, and a step of attaching the connector to the case.
[0012]
According to such an assembling method, the automobile electronic control device according to claim 1 can be obtained.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 shows a cross-sectional view of the vehicle electronic control device 1 according to the present embodiment attached to the side of an engine block 60. That is, it is assumed that the vehicle electronic control device 1 is directly mounted on the vehicle-mounted engine in the engine room. FIG. 2 is a sectional view of the electronic control device 1 as a single unit.
[0014]
In FIG. 2, the case 10 of the electronic control unit 1 is composed of a base plate 11 and a cover 12, and the inside of the case 10 is a component storage space R1. In the component storage space R <b> 1 in the case 10, a circuit board (for example, a ceramic board) 20 is fixed to the upper surface of the base plate 11. Various electronic components are mounted on the upper surface of the circuit board 20, and FIG. 2 shows a state in which the semiconductor chip 21 is mounted by wire bonding. That is, the wiring (conductor pattern) between the semiconductor chip 21 and the circuit board 20 is electrically connected by the wire 22. An electronic control circuit is formed by various electronic components mounted on the circuit board 20 including the semiconductor chip 21. Various mounted electronic components include heating elements, and the generated heat is released to the engine block 60 (see FIG. 1) via the circuit board 20 and the base plate 11 and to the engine room space via the case 10. .
[0015]
A connector 30 is attached to the cover 12 of the case 10. The connector 30 has a fitting pin 31, and a fixed end of the fitting pin 31 is a connection portion 32. In the component storage space R <b> 1 in the case 10, the circuit board 20 and the connection portion 32 of the fitting pin 31 of the connector 30 are electrically connected by a flexible printed wiring board 40 as a flexible wiring member. That is, one end of the flexible printed wiring board 40 is joined to the circuit board 20 and the other end of the flexible printed wiring board 40 is joined to the connection portion 32 of the connector 30.
[0016]
A joint portion of the flexible printed wiring board 40 to the circuit board 20 is covered with a solid moistureproof material 50. The solid moistureproof material 50 is made of a thermosetting epoxy resin or the like. In addition, the solid moisture-proof material 50 has a linear expansion coefficient compatible with that of the flexible printed wiring board 40, that is, substantially matches. On the other hand, the joint portion of the flexible printed wiring board 40 to the connector 30 is covered with a gel moistureproof material 51. Further, a gel moisture-proof material 52 is arranged on the component mounting surface of the circuit board 20 in the component storage space R1 in the case 10, and the electronic component 21 including the wire bonding portion is covered with the gel moisture-proof material 52. . The gel moisture-proof materials 51 and 52 are made of high penetration silicon resin. Here, the solid moistureproof material 50 described above covers the flexible printed wiring board 40 until it protrudes from the surface 52a of the gel moistureproof material 52 disposed on the component mounting surface.
[0017]
The automotive electronic control device 1 configured as shown in FIG. 2 is attached to the engine block 60 as shown in FIG. The connector 30 is connected to a counterpart connector, and sensors / switches and actuators are connected via a cable extending from the connector. The electronic control device 1 is a device for controlling the engine, and has a built-in microcomputer for inputting the signals (various sensor signals, switch signals, etc.) for detecting the engine operating state to perform the optimum engine operation. The calculation is performed and a drive signal is output to the actuator (ignition device or fuel injection device).
[0018]
In FIG. 1, when the engine is driven, vibration is transmitted to the electronic control device 1. This vibration causes the movable part of the flexible printed wiring board 40 to vibrate.
Here, in this embodiment, the flexible printed wiring board 40 inside the gel moistureproof material 52 is covered with a solid moistureproof material 50 such as a thermosetting resin. Therefore, the vibration at the movable portion of the flexible printed wiring board 40 due to engine vibration is absorbed by the solid moistureproof material 50, and the vibration is not easily transmitted to the gel moistureproof material 52. In this way, vibration transmission to the gel moisture-proof material 52 is unlikely to occur, and a bonding portion (wire connection portion in the electronic component 21 mounted on the circuit board 20) in the electronic component 21 wrapped in the gel moisture-proof material 52 is provided. Breaking due to the vibration stress can be suppressed.
[0019]
The linear expansion coefficient of the solid moisture-proof material 50 needs to be considered only with respect to the compatibility with the connection portion of the flexible printed wiring board 40 and can be easily selected. The solid moisture-proof material 50 is not particularly limited as long as it satisfies the necessary functions such as the coefficient of linear expansion and vibration absorption (hardness).
[0020]
As described above, when only the gel moisture-proof material 52 is moisture-proof, the vibration of the engine or the like is transmitted from the flexible printed wiring board 40 to the gel moisture-proof material 52 → the connection part of the board mounting component 21, and the connection part is broken by the stress. Although it is easy, this embodiment can avoid this, and a moisture-proof structure is formed by applying a moisture-proof material that is cheaper than a completely waterproof design. That is, it is possible to easily prevent the wire bonding portion from being damaged by the vibration of the flexible printed wiring board 40 accompanying the driving of the engine or the like, thereby reducing the product cost.
[0021]
In particular, the solid moisture-proof material 50 only needs to match the linear expansion coefficient with only the flexible printed wiring board 40, and it is necessary to consider three or more linear expansion coefficients (the moisture-proof material, the flexible material, and the bonding wire). It is easy to select a solid moisture-proof material.
[0022]
Moreover, it is desirable that the solid moistureproof material 50 protrudes from the surface 52a of the gel moistureproof material 52 and covers the flexible printed wiring board 40. In other words, the amount of application of the solid moisture-proof material 50 is the most necessary for projecting from the surface 52 a of the gel-like moisture-proof material 52 in order to exert the function of hardly transmitting the vibration of the flexible printed wiring board 40 to the gel-like moisture-proof material 52. A small amount is sufficient.
[0023]
In FIG. 1, an automotive electronic control device mounted directly on the engine is assumed, but the present structure can be applied to an automotive electronic control device not mounted directly on the engine.
Next, an assembling method of the automobile electronic control device will be described with reference to FIGS.
[0024]
As shown in FIG. 3A, the electronic component 21 is mounted on the circuit board 20 by wire bonding. Then, one end of the flexible printed wiring board 40 is bonded to the circuit board 20.
[0025]
Subsequently, as illustrated in FIG. 3B, the joint portion of the flexible printed wiring board 40 to the circuit board 20 is covered with a solid moisture-proof material 50 while the flexible printed wiring board 40 is held. In detail, it hardens after apply | coating resin.
[0026]
Thereafter, as shown in FIG. 3C, the circuit board 20 is bonded to the upper surface of the base plate 11. Then, as shown in FIG. 4A, the cover 12 is mounted on the base plate 11 and the end of the flexible printed wiring board 40 is taken out from the cover hole 12a. In this way, the circuit board 20 is fixed in the component storage space R1 in the case 10.
[0027]
Subsequently, as shown in FIG. 4B, the gel moisture-proof material 52 so as to cover the electronic component 21 including the wire bonding portion on the component mounting surface of the circuit board 20 in the component storage space R <b> 1 in the case 10. Place (inject).
[0028]
Furthermore, the connector 30 is joined to the other end of the flexible printed wiring board 40 as shown in FIG.
And as shown in FIG.5 (b), the joining location to the connector 30 in the flexible printed wiring board 40 is coat | covered with the gel-like moisture-proof material 51. FIG.
[0029]
Further, as shown in FIG. 2, the connector 30 is attached to the cover 12 of the case 10 by bonding.
3 to 5, after fixing the circuit board 20 in the case 10, (1) the gel moisture-proof material 52 is disposed, and (2) the connector 30 is joined to the other end of the flexible printed wiring board 40. (3) The joint portion of the flexible printed wiring board 40 to the connector 30 was covered with the gel moisture-proof material 51, and (4) the connector 30 was attached to the case 10. Instead of this, the arrangement order of the gel moistureproof material 52 may be as follows.
[0030]
After fixing the circuit board 20 in the case 10, (1) the connector 30 is joined to the other end of the flexible printed wiring board 40, (2) the gel moisture-proof material 52 is disposed, and (3) the flexible printed wiring board 40. The connector 30 may be covered with the gel moisture-proof material 51 and (4) the connector 30 may be attached to the case 10.
[0031]
Alternatively, after fixing the circuit board 20 in the case 10, (1) the connector 30 is joined to the other end of the flexible printed wiring board 40, and (2) the joint location of the flexible printed wiring board 40 to the connector 30 is gel-like. You may make it coat | cover with the moisture-proof material 51, (3) arrange | position the gel-like moisture-proof material 52, and (4) attach the connector 30 to the case 10. FIG.
[0032]
Moreover, although the joint location to the connector 30 in the flexible printed wiring board 40 was coat | covered with the gel-like moisture-proof material 51, you may coat | cover with a solid moisture-proof material.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view in a state in which an automotive electronic control device according to an embodiment is mounted on an engine.
FIG. 2 is a cross-sectional view of an automotive electronic control device.
FIGS. 3A to 3C are views for explaining an assembling method of an automotive electronic control device.
FIGS. 4A and 4B are diagrams for explaining an assembly method for an electronic control device for an automobile.
FIGS. 5A and 5B are views for explaining an assembly method for an electronic control device for an automobile.
FIG. 6 is a cross-sectional view of an automotive electronic control device for explaining the prior art.
FIG. 7 is a cross-sectional view of an automotive electronic control device for explaining the prior art.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Automotive electronic control device, 10 ... Case, 11 ... Base plate, 12 ... Cover, 20 ... Circuit board, 21 ... Electronic component, 22 ... Wire, 30 ... Connector, 31 ... Fitting pin, 40 ... Flexible printed wiring board 50 ... Solid moistureproof material, 51 ... Gel moistureproof material, 52 ... Gel moistureproof material, 60 ... Engine block, R1 ... Parts storage space.

Claims (7)

ケース（１０）内の部品収納空間（Ｒ１）において固定され、ワイヤーボンディングにて電子部品（２１）を実装した回路基板（２０）と、
前記ケース（１０）に取り付けられ、嵌合ピン（３１）を有するコネクタ（３０）と、
前記ケース（１０）内の部品収納空間（Ｒ１）において前記回路基板（２０）とコネクタ（３０）の嵌合ピン（３１）を電気的に接続する可撓性配線部材（４０）と、
前記可撓性配線部材（４０）における回路基板（２０）への接合箇所を被覆する固体状防湿材（５０）と、
前記ケース（１０）内の部品収納空間（Ｒ１）において前記回路基板（２０）での部品実装面にワイヤーボンディング部を含めて電子部品（２１）を被覆するように配置されたゲル状防湿材（５２）と、
を具備することを特徴とする自動車用電子制御装置。A circuit board (20) fixed in a component storage space (R1) in the case (10) and mounted with electronic components (21) by wire bonding;
A connector (30) attached to the case (10) and having a fitting pin (31);
A flexible wiring member (40) for electrically connecting the circuit board (20) and the fitting pin (31) of the connector (30) in the component storage space (R1) in the case (10);
A solid moisture-proof material (50) covering a joint portion of the flexible wiring member (40) to the circuit board (20);
A gel moisture-proof material (in the component storage space (R1) in the case (10)) disposed so as to cover the electronic component (21) including the wire bonding portion on the component mounting surface of the circuit board (20). 52),
An automobile electronic control device comprising: 前記固体状防湿材（５０）は可撓性配線部材（４０）と線膨張係数が適合していることを特徴とする請求項１に記載の自動車用電子制御装置。The electronic control device for an automobile according to claim 1, wherein the solid moisture-proof material (50) has a linear expansion coefficient that is compatible with that of the flexible wiring member (40). 前記固体状防湿材（５０）によって、前記部品実装面に配したゲル状防湿材（５２）の表面（５２ａ）から突出するまで前記可撓性配線部材（４０）を被覆したことを特徴とする請求項１に記載の自動車用電子制御装置。The flexible wiring member (40) is covered with the solid moisture-proof material (50) until it protrudes from the surface (52a) of the gel-like moisture-proof material (52) disposed on the component mounting surface. The automobile electronic control device according to claim 1. 車載エンジンに直接搭載されることを特徴とする請求項１〜３のいずれか１項に記載の自動車用電子制御装置。The vehicle electronic control device according to claim 1, wherein the vehicle electronic control device is directly mounted on an in-vehicle engine. ワイヤーボンディングにて電子部品（２１）を実装した回路基板（２０）に対し可撓性配線部材（４０）の一端を接合する工程と、
前記可撓性配線部材（４０）における前記回路基板（２０）への接合箇所を固体状防湿材（５０）にて被覆する工程と、
ケース（１０）内の部品収納空間（Ｒ１）において前記回路基板（２０）を固定する工程と、
前記ケース（１０）内の部品収納空間（Ｒ１）において前記回路基板（２０）での部品実装面に、ワイヤーボンディング部を含めて電子部品（２１）を被覆するようにゲル状防湿材（５２）を配置する工程と、
前記可撓性配線部材（４０）の他端に嵌合ピン（３１）を有するコネクタ（３０）を接合する工程と、
前記可撓性配線部材（４０）における前記コネクタ（３０）への接合箇所を防湿材（５１）にて被覆する工程と、
前記コネクタ（３０）を前記ケース（１０）に取り付ける工程と、
を具備することを特徴とする自動車用電子制御装置の組立方法。Bonding one end of the flexible wiring member (40) to the circuit board (20) on which the electronic component (21) is mounted by wire bonding;
A step of covering the flexible wiring member (40) with the solid moisture-proof material (50) at the junction to the circuit board (20);
Fixing the circuit board (20) in the component storage space (R1) in the case (10);
The gel moisture-proof material (52) so as to cover the electronic component (21) including the wire bonding portion on the component mounting surface of the circuit board (20) in the component storage space (R1) in the case (10). A step of arranging
Joining a connector (30) having a fitting pin (31) to the other end of the flexible wiring member (40);
A step of covering the joint portion to the connector (30) in the flexible wiring member (40) with a moisture-proof material (51);
Attaching the connector (30) to the case (10);
A method for assembling an electronic control unit for automobiles. ワイヤーボンディングにて電子部品（２１）を実装した回路基板（２０）に対し可撓性配線部材（４０）の一端を接合する工程と、
前記可撓性配線部材（４０）における前記回路基板（２０）への接合箇所を固体状防湿材（５０）にて被覆する工程と、
ケース（１０）内の部品収納空間（Ｒ１）において前記回路基板（２０）を固定する工程と、
前記可撓性配線部材（４０）の他端に嵌合ピン（３１）を有するコネクタ（３０）を接合する工程と、
前記ケース（１０）内の部品収納空間（Ｒ１）において前記回路基板（２０）での部品実装面に、ワイヤーボンディング部を含めて電子部品（２１）を被覆するようにゲル状防湿材（５２）を配置する工程と、
前記可撓性配線部材（４０）における前記コネクタ（３０）への接合箇所を防湿材（５１）にて被覆する工程と、
前記コネクタ（３０）を前記ケース（１０）に取り付ける工程と、
を具備することを特徴とする自動車用電子制御装置の組立方法。Bonding one end of the flexible wiring member (40) to the circuit board (20) on which the electronic component (21) is mounted by wire bonding;
A step of covering the flexible wiring member (40) with the solid moisture-proof material (50) at the junction to the circuit board (20);
Fixing the circuit board (20) in the component storage space (R1) in the case (10);
Joining a connector (30) having a fitting pin (31) to the other end of the flexible wiring member (40);
The gel moisture-proof material (52) so as to cover the electronic component (21) including the wire bonding portion on the component mounting surface of the circuit board (20) in the component storage space (R1) in the case (10). A step of arranging
A step of covering the joint portion to the connector (30) in the flexible wiring member (40) with a moisture-proof material (51);
Attaching the connector (30) to the case (10);
A method for assembling an electronic control unit for automobiles. ワイヤーボンディングにて電子部品（２１）を実装した回路基板（２０）に対し可撓性配線部材（４０）の一端を接合する工程と、
前記可撓性配線部材（４０）における前記回路基板（２０）への接合箇所を固体状防湿材（５０）にて被覆する工程と、
ケース（１０）内の部品収納空間（Ｒ１）において前記回路基板（２０）を固定する工程と、
前記可撓性配線部材（４０）の他端に嵌合ピン（３１）を有するコネクタ（３０）を接合する工程と、
前記可撓性配線部材（４０）における前記コネクタ（３０）への接合箇所を防湿材（５１）にて被覆する工程と、
前記ケース（１０）内の部品収納空間（Ｒ１）において前記回路基板（２０）での部品実装面に、ワイヤーボンディング部を含めて電子部品（２１）を被覆するようにゲル状防湿材（５２）を配置する工程と、
前記コネクタ（３０）を前記ケース（１０）に取り付ける工程と、
を具備することを特徴とする自動車用電子制御装置の組立方法。Bonding one end of the flexible wiring member (40) to the circuit board (20) on which the electronic component (21) is mounted by wire bonding;
A step of covering the flexible wiring member (40) with the solid moisture-proof material (50) at the junction to the circuit board (20);
Fixing the circuit board (20) in the component storage space (R1) in the case (10);
Joining a connector (30) having a fitting pin (31) to the other end of the flexible wiring member (40);
A step of covering the joint portion to the connector (30) in the flexible wiring member (40) with a moisture-proof material (51);
The gel moisture-proof material (52) so as to cover the electronic component (21) including the wire bonding portion on the component mounting surface of the circuit board (20) in the component storage space (R1) in the case (10). A step of arranging
Attaching the connector (30) to the case (10);
A method for assembling an electronic control unit for automobiles.
JP2002147715A 2002-05-22 2002-05-22 Electronic control device for automobile and its assembling method Expired - Lifetime JP3858760B2 (en)

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